ON MBRS410LT3 Surface mount schottky power rectifier Datasheet

MBRS410LT3
Preferred Device
Surface Mount
Schottky Power Rectifier
. . . employing the Schottky Barrier principle in a large area
metal–to–silicon power diode. State–of–the–art geometry features
epitaxial construction with oxide passivation and metal overlay
contact. Ideally suited for low voltage, high frequency rectification, or
as free wheeling and polarity protection diodes, in surface mount
applications where compact size and weight are critical to the system.
Typical applications are ac/dc and dc–dc converters, reverse battery
protection, and “Oring” of multiple supply voltages and any other
application where performance and size are critical.
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Ultra Low VF
1st in the Market Place with a 10 VR Schottky Rectifier
Small Compact Surface Mountable Package with J–Bend Leads
Rectangular Package for Automated Handling
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
Excellent Ability to Withstand Reverse Avalanche Energy Transients
Guarding for Stress Protection
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SCHOTTKY BARRIER
RECTIFIERS
4.0 AMPERES
10 VOLTS
SMC
CASE 403
PLASTIC
Mechanical Characteristics:
• Case: Epoxy, Molded
• Weight: 217 mg (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
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Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Shipped in 16 mm Tape and Reel, 2500 units per reel
Polarity: Notch in Plastic Body Indicates Cathode Lead
ESD Ratings: Machine Model = C
Human Body Model = 3B
Marking: B4L1
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
10
V
Average Rectified Forward Current
(@ TL = 110°C)
IO
4.0
A
IFSM
150
A
TJ
–65 to
+125
°C
Non–Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
Operating Junction Temperature
 Semiconductor Components Industries, LLC, 2001
September, 2001 – Rev. 1
1
MARKING DIAGRAM
YWW
B4L1
Y
= Year
WW = Work Week
B4L1 = Device Code
ORDERING INFORMATION
Device
Package
Shipping
MBRS410LT3
SMC
2500/Tape & Reel
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
MBRS410LT3/D
MBRS410LT3
THERMAL CHARACTERISTICS
Characteristic
Symbol
Min Pad
(Note 2)
1 Inch Pad
Unit
RθJL
RθJA
12
109
7.0
59
°C/W
VF
TJ = 25°C
TJ = 100°C
V
0.31
0.33
0.35
0.200
0.225
0.250
TJ = 25°C
TJ = 100°C
2.0
5.0
100
200
Thermal Resistance – Junction–to–Lead
Thermal Resistance – Junction–to–Ambient
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 1)
(IF = 2.0 A)
(IF = 4.0 A)
(IF = 8.0 A)
Maximum Instantaneous Reverse Current (Note 1)
IR
(Rated dc Voltage, VR = 5.0 V)
(Rated dc Voltage, VR = 10 V)
mA
1. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
2. Mounted with Minimum Recommended Pad Size, PC Board FR4.
100
IF, FORWARD CURRENT (AMPS)
IF, FORWARD CURRENT (AMPS)
100
VF @ 125°C
10
100°C
1
75°C
25°C
–40°C
10
VF @ 125°C
100°C
1
75°C
0.1
25°C
0.1
0
0.1
0.2
0.3
0.4
0.5
0
VF, INSTANTANEOUS VOLTAGE (VOLTS)
0.1
0.2
0.3
0.4
0.5
VF, INSTANTANEOUS VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
10000
1.00E+00
IR, REVERSE CURRENT (AMPS)
f = 1 Mhz
C, CAPACITANCE (pF)
IR @ 125°C
1.00E–01
100°C
75°C
1.00E–02
1.00E–03
25°C
25°C
1000
1.00E–04
0
2
4
6
8
10
0
2
4
6
8
VR, REVERSE VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Typical Capacitance
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2
10
PFO, AVERAGE POWER DISSIPATION (WATTS)
MBRS410LT3
9
IF, AVERAGE FORWARD
CURRENT (AMPS)
8
7
dc
6
5
4
SQUARE WAVE
3
2
1
0
100
105
110
115
120
125
130
TL, LEAD TEMPERATURE (°C)
2
1.8
dc
1.6
1.4
1.2
1
0.8
SQUARE WAVE
0.6
0.4
0.2
0
0
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
Figure 5. Current Derating (Junction–to–Lead)
1
2
3
4
5
6
7
8
9
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 6. Forward Power Dissipation
100
D = 0.5
0.2
0.1
10
0.05
0.02
0.01
1
SINGLE PULSE
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
100
1000
t, TIME (S)
R(t), TRANSIENT THERMAL RESISTANCE (°C/W)
Figure 7. Thermal Response, Junction to Ambient (min pad)
100
D = 0.5
0.2
10
0.1
0.05
0.02
1
0.01
SINGLE PULSE
0.1
0.00001
0.0001
0.001
0.01
0.1
1
10
t, TIME (S)
Figure 8. Thermal Response, Junction to Ambient (1 inch pad)
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MBRS410LT3
PACKAGE DIMENSIONS
SMC
PLASTIC PACKAGE
CASE 403–03
ISSUE B
S
A
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN
DIMENSION P.
B
C
K
P
J
INCHES
DIM MIN
MAX
A
0.260
0.280
B
0.220
0.240
C
0.075
0.095
D
0.115
0.121
H 0.0020 0.0060
J
0.006
0.012
K
0.030
0.050
P
0.020 REF
S
0.305
0.320
MILLIMETERS
MIN
MAX
6.60
7.11
5.59
6.10
1.90
2.41
2.92
3.07
0.051
0.152
0.15
0.30
0.76
1.27
0.51 REF
7.75
8.13
H
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are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
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including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
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4
MBRS410LT3/D
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