Material Content Data Sheet Sales Product Name IDW100E60 Issued MA# MA000905914 Package PG-TO247-3-41 29. August 2013 Weight* 6048.53 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal non noble metal noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel antimony silver tin phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7440-36-0 7440-22-4 7440-31-5 7723-14-0 7439-89-6 7440-50-8 3.976 0.07 0.530 0.01 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.07 657 657 88 0.159 0.00 529.068 8.75 8.76 87471 26 87585 14.249 0.24 0.24 2356 2356 19.937 0.33 3296 378.807 6.26 1594.979 26.37 32.96 263697 329621 31.874 0.53 0.53 5270 5270 29.065 0.48 0.48 4805 4805 0.341 0.01 0.852 0.01 2.215 0.04 1.033 0.02 3.442 0.06 3438.006 56.82 62628 56 141 0.06 366 569 56.90 568403 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 563 171 569143 1000000