ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 ADC10DL065 Dual 10-Bit, 65 MSPS, 3.3V, 370mW A/D Converter Check for Samples: ADC10DL065 FEATURES DESCRIPTION • • • • • • • The ADC10DL065 is a dual, low power monolithic CMOS analog-to-digital converter capable of converting analog input signals into 10-bit digital words at 65 Megasamples per second (MSPS). This converter uses a differential, pipeline architecture with digital error correction and an on-chip sample-andhold circuit to minimize power consumption while providing excellent dynamic performance and a 250 MHz Full Power Bandwidth. Operating on a single +3.3V power supply, the ADC10DL065 achieves 9.8 effective bits at nyquist and consumes just 370 mW at 65 MSPS, including the reference current. The Power Down feature reduces power consumption to 36 mW. 1 2 Single +3.3V Supply Operation Internal Sample-and-Hold Internal Reference Outputs 2.4V to 3.6V Compatible Power Down Mode Duty Cycle Stabilizer Multiplexed Output Mode KEY SPECIFICATIONS • • • • • • Resolution 10 Bits DNL ±0.16 LSB (typ) SNR (fIN = 10 MHz) 61 dB (typ) SFDR (fIN = 10 MHz) 85 dB (typ) Data Latency 7 Clock Cycles Power Consumption – Operating 370 mW (typ) – Power Down Mode 36 mW (typ) APPLICATIONS • • • • • • Ultrasound and Imaging Instrumentation Communications Receivers Sonar/Radar xDSL DSP Front Ends The differential inputs provide a full scale differential input swing equal to 2 times VREF with the possibility of a single-ended input. Full use of the differential input is recommended for optimum performance. The digital outputs from the two ADC's are available on a single multiplexed 10-bit bus or on separate buses. Duty cycle stabilization and output data format are selectable using a quad state function pin. The output data can be set for offset binary or two's complement. To ease interfacing to lower voltage systems, the digital output driver power pins of the ADC10DL065 can be connected to a separate supply voltage in the range of 2.4V to the analog supply voltage. This device is available in the 64-lead TQFP package and will operate over the industrial temperature range of −40°C to +85°C. An evaluation board is available to ease the evaluation process. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2013, Texas Instruments Incorporated ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com 50 51 49 DGND DR GND 53 52 DB4 VDR 55 56 57 58 59 60 61 54 DB6 DB5 DB7 DB8 DB9 DR GND PD CLK 62 63 1 VINB- 2 VINB+ 3 AGND DB3 DB2 VRMB DB1 45 VRPB DB0 44 VRNB NC 43 VREF ABb 42 AGND VA OEB 41 DR GND 40 4 5 6 7 8 9 VD 48 47 ADC10DL065 46 10 AGND DA9 39 11 MULTIPLEX DA8 38 VRNA DA7 37 VRPA DA6 36 VRMA DA5 35 VINA+ DA4 VD Submit Documentation Feedback DGND 33 32 DR GND 31 30 DA3 VDR 29 DA2 28 DA1 27 26 NC DA0 25 NC 24 DR GND 23 22 19 18 17 OEA 34 VINAAGND VA VA 16 DF/DCS 15 21 14 AGND 13 20 12 2 AGND VA AGND VA 64 Connection Diagram Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 Block Diagram VINA+ S/H Stage 1 Stage 2 Stage 3 Stage 8 Stage 9 Stage 10 VINA3 2 2 2 2 2 2 2 2 Timing Control 2 2 2 10-Stage Pipeline Converter MULTIPLEX 21 10 12 Digital Correction CLK Duty Cycle Stabilizer MUX DA0-DA9 or D0-D9 (MUX) Output Buffers OEA 2 VRPA VRMA VRNA Reference Select VREF VRPB VRMB VRNB Internal Reference 10 Digital Correction 2 12 DB0-DB9 Output Buffers OEB 21 10-Stage Pipeline Converter Timing Control 2 2 2 3 2 2 2 2 2 2 2 2 VINB+ S/H Stage 1 Stage 2 Stage 3 Stage 8 Stage 9 Stage 10 VINB- Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 3 ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com Pin Descriptions and Equivalent Circuits Pin No. Symbol Equivalent Circuit Description ANALOG I/O 15 2 16 1 VINA+ VINB+ VA Differential analog input pins. With a 1.0V reference voltage the differential full-scale input signal level is 2.0 VP-P with each input pin voltage centered on a common mode voltage, VCM. The negative input pins may be connected to VCM for single-ended operation, but a differential input signal is required for best performance. VINA− VINB− AGND VA 7 This pin is the reference select pin and the external reference input. If (VA - 0.3V) < VREF < VA, the internal 1.0V reference is selected. If AGND < VREF < (AGND + 0.3V), the internal 0.5V reference is selected. If a voltage in the range of 0.8V to 1.2V is applied to this pin, that voltage is used as the reference. VREF should be bypassed to AGND with a 0.1 µF capacitor when an external reference is used. VREF AGND VA 21 VFloat This is a four-state pin. DF/DCS = VA, output data format is offset binary with duty cycle stabilization applied to the input clock DF/DCS = AGND, output data format is 2's complement, with duty cycle stabilization applied to the input clock. DF/DCS = VRMA or VRMB , output data is 2's complement without duty cycle stabilization applied to the input clock DF/DCS = "float", output data is offset binary without duty cycle stabilization applied to the input clock. DF/DCS AGND 13 5 VRPA VRPB 14 4 VRMA VRMB VA VA VA 12 6 VRNA VRNB VA These pins are high impedance reference bypass pins. All these pins should each be bypassed to ground with a 0.1 µF capacitor. A 10 µF capacitor should be placed between the VRPA and VRNA pins and between the VRPB and VRNB pins. VRMA and VRMB may be loaded to 1mA for use as a temperature stable 1.5V reference. The remaining pins should not be loaded. AGND AGND 4 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 Pin Descriptions and Equivalent Circuits (continued) Pin No. Symbol Equivalent Circuit Description DIGITAL I/O 60 CLK 22 41 OEA OEB VD VA Digital clock input. The range of frequencies for this input is as specified in the electrical tables with specified performance at 65 MHz. The input is sampled on the rising edge. OEA and OEB are the output enable pins that, when low, holds their respective data output pins in the active state. When either of these pins is high, the corresponding outputs are in a high impedance state. AGND DGND 59 11 PD VD VA PD is the Power Down input pin. When high, this input puts the converter into the power down mode. When this pin is low, the converter is in the active mode. When low, "A" & "B" data is present on it's respective data output lines (Parallel Mode). When high, both "A" and "B" channel data is present on the "DA0:DA9" digital outputs (Multiplex Mode). The ABb pin is used to synchronize the data. MULTIPLEX AGND DGND 26–29 34–39 DA0–DA9 44–47 52–57 DB0–DB9 42 Digital data output pins that make up the 10-bit conversion results of their respective converters. DA0 and DB0 are the LSBs, while DA9 and DB9 are the MSBs of the output word. Output levels are TTL/CMOS compatible. Optimum loading is < 10pF. VDR VA ABb AGND DR GND 24, 25, 43 When MULTIPLEX is low, this pin is not used. When MULTIPLEX is high this is the ABb signal, which is used to synchronize the multiplexed data. ABb changes synchronously with the Multiplexed "A" and "B" channels. ABb is "high" when "A" channel data is valid and is "low" when "B" channel data is valid. NC No Connect 9, 18, 19, 62, 63 VA Positive analog supply pins. These pins should be connected to a quiet +3.3V source and bypassed to AGND with 0.1 µF capacitors located within 1 cm of these power pins, and with a 10 µF capacitor. 3, 8, 10, 17, 20, 61, 64 AGND ANALOG POWER The ground return for the analog supply. DIGITAL POWER 33, 48 VD 32, 49 DGND 30, 51 23, 31, 40, 50, 58 Positive digital supply pin. This pin should be connected to the same quiet +3.3V source as is VA and be bypassed to DGND with a 0.1 µF capacitor located within 1 cm of the power pin and with a 10 µF capacitor. The ground return for the digital supply. VDR Positive driver supply pin for the ADC10DL065's output drivers. This pin should be connected to a voltage source of +2.4V to VD and be bypassed to DR GND with a 0.1 µF capacitor. If the supply for this pin is different from the supply used for VA and VD, it should also be bypassed with a 10 µF capacitor. VDR should never exceed the voltage on VD. All 0.1 µF bypass capacitors should be located within 1 cm of the supply pin. DR GND The ground return for the digital supply for the ADC10DL065's output drivers. These pins should be connected to the system digital ground, but not be connected in close proximity to the ADC10DL065's DGND or AGND pins. See Layout and Grounding for more details. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 5 ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) VA, VD, VDR 4.2V ≤ 100 mV |VA–VD| −0.3V to (VA or VD +0.3V) Voltage on Any Input or Output Pin Input Current at Any Pin (3) ±25 mA Package Input Current (3) ±50 mA Package Dissipation at TA = 25°C ESD Susceptibility See Human Body Model (5) (4) 2500V Machine Model (5) 250V Soldering Temperature, Infrared, 10 sec. (6) 235°C −65°C to +150°C Storage Temperature Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to www.ti.com/packaging. (6) (1) (2) (3) (4) (5) (6) All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Range is not recommended. When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two. The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature, (TA), and can be calculated using the formula PDMAX = (TJmax - TA )/θJA. In the 64-pin TQFP, θJA is 50°C/W, so PDMAX = 2 Watts at 25°C and 800 mW at the maximum operating ambient temperature of 85°C. Note that the power consumption of this device under normal operation will typically be about 400 mW (360 typical power consumption + 30 mW TTL output loading). The values for maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided. Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω. Reflow Reflow temperature profiles are different for lead-free and non-lead-free packages. Operating Ratings (1) (2) Operating Temperature −40°C ≤ TA ≤ +85°C Supply Voltage (VA, VD) +3.0V to +3.6V Output Driver Supply (VDR) +2.4V to VD −0.05V to (VD + 0.05V) CLK, PD, OEA, OEB Analog Input Pins 0V to 2.6V VCM 0.5V to 2.0V ≤100mV |AGND–DGND| Clock Duty Cycle (DCS On) 20% to 80% Clock Duty Cycle (DCS Off) 40% to 60% (1) (2) 6 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Range is not recommended. All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 Converter Electrical Characteristics (1) (2) (3) Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR = +2.5V, PD = 0V, External VREF = +1.0V, fCLK = 65 MHz, fIN = 10 MHz, CL = 15 pF/pin, Duty Cycle Stabilizer On, parallel output mode. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C Symbol Parameter Typical Conditions (4) Limits (4) Units (Limits) STATIC CONVERTER CHARACTERISTICS 10 Bits (min) INL Resolution with No Missing Codes Integral Non Linearity (5) ±0.25 ±1 LSB (max) DNL Differential Non Linearity ±0.16 ±0.65 LSB (max) PGE Positive Gain Error ±0.1 ±3.3 %FS (max) NGE Negative Gain Error ±0.2 ±3.5 %FS (max) TC GE Gain Error Tempco VOFF Offset Error (VIN+ = VIN−) ±0.85 %FS (max) TC VOFF Offset Error Tempco −40°C ≤ TA ≤ +85°C 10 0.1 −40°C ≤ TA ≤ +85°C ppm/°C 6 ppm/°C Under Range Output Code 0 0 Over Range Output Code 1023 1023 REFERENCE AND ANALOG INPUT CHARACTERISTICS VCM Common Mode Input Voltage 1.5 VRMA, VRMB Reference Output Voltage Output load = 1 mA CIN VIN Input Capacitance (each pin to GND) VIN = 2.5 Vdc + 0.7 Vrms VREF External Reference Voltage (6) V (min) 2.0 V (max) 1.5 V (CLK LOW) 8 pF (CLK HIGH) 7 pF 1.00 Reference Input Resistance (1) 0.5 1 0.8 V (min) 1.2 V (max) MΩ (min) The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided current is limited per Note 3 under the Absolute Maximum Ratings. However, errors in the A/D conversion can occur if the input goes above VA or below GND by more than 100 mV. As an example, if VA is +3.3V, the full-scale input voltage must be ≤+3.4V to ensure accurate conversions. VA I/O To Internal Circuitry AGND (2) (3) (4) (5) (6) To ensure accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin. With the test condition for VREF = +1.0V (2VP-P differential input), the 10-bit LSB is 1.95 mV. Typical figures are at TA = 25°C, and represent most likely parametric norms at the time of characterization. The typical specifications are not ensured. Integral Non Linearity is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through positive and negative full-scale. Optimum performance will be obtained by keeping the reference input in the 0.8V to 1.2V range. The LM4051CIM3-ADJ (SOT-23 package) is recommended for external reference applications. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 7 ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com Converter Electrical Characteristics (continued) (1) (2) (3) Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR = +2.5V, PD = 0V, External VREF = +1.0V, fCLK = 65 MHz, fIN = 10 MHz, CL = 15 pF/pin, Duty Cycle Stabilizer On, parallel output mode. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C Symbol Parameter Typical Conditions (4) Limits (4) Units (Limits) DYNAMIC CONVERTER CHARACTERISTICS FPBW SNR SINAD ENOB THD H2 0 dBFS Input, Output at −3 dB 250 fIN = 1 MHz, VIN = −0.5 dBFS 61 fIN = 10 MHz, VIN = −0.5 dBFS 61 60 dBc (min) fIN = 32.5 MHz, VIN = −0.5 dBFS 60.9 59.5 dBc (min) fIN = 1 MHz, VIN = −0.5 dBFS 60.9 fIN = 10 MHz, VIN = −0.5 dBFS 60.9 59.8 dBc (min) fIN = 32.5 MHz, VIN = −0.5 dBFS 60.8 59 dBc (min) fIN = 1 MHz, VIN = −0.5 dBFS 9.8 fIN = 10 MHz, VIN = −0.5 dBFS 9.8 9.64 Bits (min) fIN = 32.5 MHz, VIN = −0.5 dBFS 9.8 9.5 Bits (min) fIN = 1 MHz, VIN = −0.5 dBFS −84 fIN = 10 MHz, VIN = −0.5 dBFS −83 -75 dBc (min) fIN = 32.5 MHz, VIN = −0.5 dBFS −81 -73.5 dBc (min) fIN = 1 MHz, VIN = −0.5 dBFS −93 fIN = 10 MHz, VIN = −0.5 dBFS −92 -79 dBc (min) fIN = 32.5 MHz, VIN = −0.5 dBFS −92 -77.6 dBc (min) fIN = 1 MHz, VIN = −0.5 dBFS −89 fIN = 10 MHz, VIN = −0.5 dBFS −89 -77 dBc (min) fIN = 32.5 MHz, VIN = −0.5 dBFS −82 -74 dBc (min) fIN = 1 MHz, VIN = −0.5 dBFS 86 fIN = 10 MHz, VIN = −0.5 dBFS 85 77 dBc (min) fIN = 32.5 MHz, VIN = −0.5 dBFS 82 74 dBc (min) fIN = 9.6 MHz and 10.2 MHz, each = −7.0 dBFS −66 dBFS Channel—Channel Offset Match ±0.3 %FS Channel—Channel Gain Match ±4 %FS 90 dB Full Power Bandwidth Signal-to-Noise Ratio Signal-to-Noise and Distortion Effective Number of Bits Total Harmonic Distortion Second Harmonic Distortion H3 Third Harmonic Distortion SFDR IMD Spurious Free Dynamic Range Intermodulation Distortion MHz dBc dBc Bits dBc dBc dBc dBc INTER-CHANNEL CHARACTERISTICS Crosstalk (1) 10 MHz Tested, Channel; 32.5 MHz Other Channel The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided current is limited per Note 3 under the Absolute Maximum Ratings. However, errors in the A/D conversion can occur if the input goes above VA or below GND by more than 100 mV. As an example, if VA is +3.3V, the full-scale input voltage must be ≤+3.4V to ensure accurate conversions. VA I/O To Internal Circuitry AGND (2) (3) (4) 8 To ensure accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin. With the test condition for VREF = +1.0V (2VP-P differential input), the 10-bit LSB is 1.95 mV. Typical figures are at TA = 25°C, and represent most likely parametric norms at the time of characterization. The typical specifications are not ensured. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 DC and Logic Electrical Characteristics (1) (2) (3) Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR = +2.5V, PD = 0V, External VREF = +1.0V, fCLK = 65 MHz, fIN = 10 MHz, CL = 15 pF/pin, Duty Cycle Stabilizer On, parallel output mode. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C Symbol Parameter Typical Conditions (4) Limits (4) Units (Limits) CLK, PD, OEA, OEB DIGITAL INPUT CHARACTERISTICS VIN(1) Logical “1” Input Voltage VD = 3.6V 2.0 V (min) VIN(0) Logical “0” Input Voltage VD = 3.0V 1.0 V (max) IIN(1) Logical “1” Input Current VIN = 3.3V 10 µA IIN(0) Logical “0” Input Current VIN = 0V −10 µA CIN Digital Input Capacitance 5 pF DA0–DA11, DB0-DB11 DIGITAL OUTPUT CHARACTERISTICS VOUT(1) Logical “1” Output Voltage IOUT = −0.5 mA VOUT(0) Logical “0” Output Voltage IOUT = 1.6 mA, VDR = 3V IOZ TRI-STATE Output Current +ISC Output Short Circuit Source Current −ISC Output Short Circuit Sink Current COUT Digital Output Capacitance VDR = 2.5V 2.3 V (min) VDR = 3V 2.7 V (min) 0.4 V (max) VOUT = 2.5V or 3.3V 100 nA VOUT = 0V −100 nA VOUT = 0V −20 mA VOUT = VDR 20 mA 5 pF POWER SUPPLY CHARACTERISTICS IA Analog Supply Current PD Pin = DGND, VREF = VA PD Pin = VD 93.7 12 111 mA (max) mA ID Digital Supply Current PD Pin = DGND PD Pin = VD , fCLK = 0 18.5 0 20.5 mA (max) mA Digital Output Supply Current PD Pin = DGND, CL = 10 pF PD Pin = VD, fCLK = 0 (5) IDR 15 0 PD Pin = DGND, CL = 10 pF PD Pin = VD (6) Total Power Consumption 370 36 Power Supply Rejection Ratio Rejection of Full-Scale Error with VA =3.0V vs. 3.6V PSRR1 (1) 58 mA mA 434 mW (max) mW dB The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided current is limited per Note 3 under the Absolute Maximum Ratings. However, errors in the A/D conversion can occur if the input goes above VA or below GND by more than 100 mV. As an example, if VA is +3.3V, the full-scale input voltage must be ≤+3.4V to ensure accurate conversions. VA I/O To Internal Circuitry AGND (2) (3) (4) (5) (6) To ensure accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin. With the test condition for VREF = +1.0V (2VP-P differential input), the 10-bit LSB is 1.95 mV. Typical figures are at TA = 25°C, and represent most likely parametric norms at the time of characterization. The typical specifications are not ensured. IDR is the current consumed by the switching of the output drivers and is primarily determined by load capacitance on the output pins, the supply voltage, VDR, and the rate at which the outputs are switching (which is signal dependent). IDR=VDR(C0 x f0 + C1 x f1 +....C9 x f9) where VDR is the output driver power supply voltage, Cn is total capacitance on the output pin, and fn is the average frequency at which that pin is toggling. Excludes IDR. See Note 5. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 9 ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com AC Electrical Characteristics (1) (2) (3) (4) Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR = +2.5V, PD = 0V, External VREF = +1.0V, fCLK = 65 MHz, fIN = 10 MHz, CL = 15 pF/pin, Duty Cycle Stabilizer On, parallel output mode. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C Symbol Parameter Typical Conditions (5) Limits (5) Units (Limits) 65 MHz (min) ns (min) fCLK1 Maximum Clock Frequency fCLK Minimum Clock Frequency tCH Clock High Time Duty Cycle Stabilizer On 7.7 3 tCL Clock Low Time Duty Cycle Stabilizer On 7.7 3 ns (min) tr, tf Clock Rise and Fall Times Duty Cycle Stabilizer On 2 4 ns (max) tCH Clock High Time Duty Cycle Stabilizer Off 7.7 6.2 ns (min) tCL Clock Low Time Duty Cycle Stabilizer Off 7.7 6.2 tr, tf Clock Rise and Fall Times Duty Cycle Stabilizer Off 2 tCONV Conversion Latency Parallel mode tOD Data Output Delay after Rising Clock Edge Parallel mode tCONV Conversion Latency tCONV Conversion Latency 2 15 MHz ns (min) ns (max) 7 Clock Cycles 3.5 ns (max) 8 ns (max) Multiplex mode, Channel A 7.5 Clock Cycles Multiplex mode, Channel B 8 Clock Cycles 5.42 ns (min) ns (max) Data Output Delay after Clock Edge tSKEW ABb to Data Skew tAD Aperture Delay 2 ns tAJ Aperture Jitter 1.2 ps rms tDIS Data outputs into Hi-Z Mode 10 ns tEN Data Outputs Active after Hi-Z Mode 10 ns 1 µs (1) Power Down Mode Exit Cycle 5.54 8 tOD tPD Multiplex mode 3.5 ±0.5 1.0 µF on pins 4, 14; 0.1 µF on pins 5,6,12,13; 10 µF between pins 5, 6 and between pins 12, 13 ns (max) The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided current is limited per Note 3 under the Absolute Maximum Ratings. However, errors in the A/D conversion can occur if the input goes above VA or below GND by more than 100 mV. As an example, if VA is +3.3V, the full-scale input voltage must be ≤+3.4V to ensure accurate conversions. VA I/O To Internal Circuitry AGND (2) (3) (4) (5) 10 To ensure accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin. With the test condition for VREF = +1.0V (2VP-P differential input), the 10-bit LSB is 1.95 mV. Timing specifications are tested at TTL logic levels, VIL = 0.4V for a falling edge and VIH = 2.4V for a rising edge. Typical figures are at TA = 25°C, and represent most likely parametric norms at the time of characterization. The typical specifications are not ensured. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 Specification Definitions APERTURE DELAY is the time after the rising edge of the clock to when the input signal is acquired or held for conversion. APERTURE JITTER (APERTURE UNCERTAINTY) is the variation in aperture delay from sample to sample. Aperture jitter manifests itself as noise in the output. CLOCK DUTY CYCLE is the ratio of the time during one cycle that a repetitive digital waveform is high to the total time of one period. The specification here refers to the ADC clock input signal. COMMON MODE VOLTAGE (VCM) is the common d.c. voltage applied to both input terminals of the ADC. CONVERSION LATENCY is the number of clock cycles between initiation of conversion and when that data is presented to the output driver stage. Data for any given sample is available at the output pins the Pipeline Delay plus the Output Delay after the sample is taken. New data is available at every clock cycle, but the data lags the conversion by the pipeline delay. CROSSTALK is coupling of energy from one channel into the other channel. DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1 LSB. EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise and Distortion or SINAD. ENOB is defined as (SINAD - 1.76) / 6.02 and says that the converter is equivalent to a perfect ADC of this (ENOB) number of bits. FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental drops 3 dB below its low frequency value for a full scale input. GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated as: Gain Error = Positive Full Scale Error − Negative Full Scale Error (1) Gain Error can also be separated into Positive Gain Error and Negative Gain Error, which are: PGE = Positive Full Scale Error − Offset Error NGE = Offset Error − Negative Full Scale Error (2) (3) GAIN ERROR MATCHING is the difference in gain errors between the two converters divided by the average gain of the converters. INTEGRAL NON LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from negative full scale (½ LSB below the first code transition) through positive full scale (½ LSB above the last code transition). The deviation of any given code from this straight line is measured from the center of that code value. INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two sinusoidal frequencies being applied to the ADC input at the same time. It is defined as the ratio of the power in the intermodulation products to the total power in the original frequencies. IMD is usually expressed in dBFS. LSB (LEAST SIGNIFICANT BIT) is the bit that has the smallest value or weight of all bits. This value is VFS/2n, where “VFS” is the full scale input voltage and “n” is the ADC resolution in bits. MISSING CODES are those output codes that will never appear at the ADC outputs. The ADC10DL065 is ensured not to have any missing codes. MSB (MOST SIGNIFICANT BIT) is the bit that has the largest value or weight. Its value is one half of full scale. NEGATIVE FULL SCALE ERROR is the difference between the actual first code transition and its ideal value of ½ LSB above negative full scale. OFFSET ERROR is the difference between the two input voltages [(VIN+) – (VIN−)] required to cause a transition from code 2047 to 2048. OUTPUT DELAY is the time delay after the rising edge of the clock before the data update is presented at the output pins. OVER RANGE RECOVERY TIME is the time required after VIN goes from a specified voltage out of the normal input range to a specified voltage within the normal input range and the converter makes a conversion with its rated accuracy. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 11 ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com PIPELINE DELAY (LATENCY) See CONVERSION LATENCY. POSITIVE FULL SCALE ERROR is the difference between the actual last code transition and its ideal value of 1½ LSB below positive full scale. POWER SUPPLY REJECTION RATIO (PSRR) is a measure of how well the ADC rejects a change in the power supply voltage. For the ADC10DL065, PSRR is the ratio of the change in Full-Scale Error that results from a change in the d.c. power supply voltage, expressed in dB. SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal to the rms value of the sum of all other spectral components below one-half the sampling frequency, not including harmonics or d.c. SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of the input signal to the rms value of all of the other spectral components below half the clock frequency, including harmonics but excluding d.c. SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the input signal and the peak spurious signal, where a spurious signal is any signal present in the output spectrum that is not present at the input. TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dB, of the rms total of the first nine harmonic levels at the output to the level of the fundamental at the output. THD is calculated as (4) where f1 is the RMS power of the fundamental (output) frequency and f2 through f10 are the RMS power of the first 9 harmonic frequencies in the output spectrum. SECOND HARMONIC DISTORTION (2ND HARM) is the difference expressed in dB, between the RMS power in the input frequency at the output and the power in its 2nd harmonic level at the output. THIRD HARMONIC DISTORTION (3RD HARM) is the difference, expressed in dB, between the RMS power in the input frequency at the output and the power in its 3rd harmonic level at the output. 12 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 Timing Diagram Sample N + 8 Sample N + 7 Sample N + 9 Sample N + 10 | Sample N + 6 Sample N VIN tAD Clock N 1 fCLK Clock N + 7 90% 90% CLK | 10% tCH 10% tCL tf tr | OE (A or B) tOD tDIS tEN Parallel Output Mode | | D0 - D9 (A or B) Data N - 1 Data N + 2 Data N Latency Multiplex Output Mode | ABb tSKEW tOD | | D0 - D9 DataA N-1 DataB N-1 tOD DataA N DataB N DataA N+1 DataB N+1 DataA N+2 DataB N+2 Channel A Latency Channel B Latency Figure 1. Output Timing Transfer Characteristic Figure 2. Transfer Characteristic Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 13 ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics DNL, INL Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR = +2.5V, PD = 0V, VREF = +1.0V, fCLK = 65 MHz, fIN = 0, CL = 15 pF/pin, Duty Cycle Stabilizer On, parallel output mode. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C 14 DNL INL Figure 3. Figure 4. DNL vs. fCLK INL vs. fCLK Figure 5. Figure 6. DNL vs. Clock Duty Cycle INL vs. Clock Duty Cycle Figure 7. Figure 8. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 Typical Performance Characteristics DNL, INL (continued) Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR = +2.5V, PD = 0V, VREF = +1.0V, fCLK = 65 MHz, fIN = 0, CL = 15 pF/pin, Duty Cycle Stabilizer On, parallel output mode. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C DNL vs. Temperature INL vs. Temperature Figure 9. Figure 10. DNL vs. VDR, VA = VD = 3.6V INL vs. VDR, VA = VD = 3.6V Figure 11. Figure 12. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 15 ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR = +2.5V, PD = 0V, VREF = +1.0V, fCLK = 65 MHz, fIN = 32 MHz, CL = 15 pF/pin, Duty Cycle Stabilizer On, parallel output mode. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C 16 SNR, SINAD, SFDR vs. VA Distortion vs. VA Figure 13. Figure 14. SNR, SINAD, SFDR vs. VDR, VA = VD = 3.6V Distortion vs. VDR, VA = VD = 3.6V Figure 15. Figure 16. SNR, SINAD, SFDR vs. VCM Distortion vs. VCM Figure 17. Figure 18. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR = +2.5V, PD = 0V, VREF = +1.0V, fCLK = 65 MHz, fIN = 32 MHz, CL = 15 pF/pin, Duty Cycle Stabilizer On, parallel output mode. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C SNR, SINAD, SFDR vs. fCLK Distortion vs. fCLK Figure 19. Figure 20. SNR, SINAD, SFDR vs. Clock Duty Cycle Distortion vs. Clock Duty Cycle Figure 21. Figure 22. SNR, SINAD, SFDR vs. VREF Distortion vs. VREF Figure 23. Figure 24. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 17 ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR = +2.5V, PD = 0V, VREF = +1.0V, fCLK = 65 MHz, fIN = 32 MHz, CL = 15 pF/pin, Duty Cycle Stabilizer On, parallel output mode. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C 18 SNR, SINAD, SFDR vs. fIN Distortion vs. fIN Figure 25. Figure 26. SNR, SINAD, SFDR vs. Temperature Distortion vs. Temperature Figure 27. Figure 28. tOD vs. VDR, VA = VD = 3.6V Parallel Output Mode tOD vs. VDR, VA = VD = 3.6V Multiplex Output Mode Figure 29. Figure 30. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V, VDR = +2.5V, PD = 0V, VREF = +1.0V, fCLK = 65 MHz, fIN = 32 MHz, CL = 15 pF/pin, Duty Cycle Stabilizer On, parallel output mode. Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25°C Spectral Response @ 10 MHz Input Spectral Response @ 32 MHz Input Figure 31. Figure 32. Intermodulation Distortion, fIN1= 9.6 MHz, fIN2 = 10.2 MHz Figure 33. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 19 ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com FUNCTIONAL DESCRIPTION Operating on a single +3.3V supply, the ADC10DL065 uses a pipeline architecture and has error correction circuitry to help ensure maximum performance. The differential analog input signal is digitized to 10 bits. The user has the choice of using an internal 1.0 Volt or 0.5 Volt stable reference, or using an external reference. Any external reference is buffered on-chip to ease the task of driving that pin. The output word rate is the same as the clock frequency, which can be between 15 MSPS and 65 MSPS (typical) with fully specified performance at 65 MSPS. The analog input for both channels is acquired at the rising edge of the clock and the digital data for a given sample is delayed by the pipeline for 7 clock cycles. Duty cycle stabilization and output data format are selectable using the quad state function DF/DCS pin. The output data can be set for offset binary or two's complement. A logic high on the power down (PD) pin reduces the converter power consumption to 36 mW. APPLICATIONS INFORMATION OPERATING CONDITIONS We recommend that the following conditions be observed for operation of the ADC10DL065: 3.0V ≤ VA ≤ 3.6V VD = VA 2.4V ≤ VDR ≤ VA 15 MHz ≤ fCLK ≤ 65 MHz 0.8V ≤ VREF ≤ 1.2V (for an external reference) 0.5V ≤ VCM ≤ 2.0V Analog Inputs There is one reference input pin, VREF, which is used to select an internal reference, or to supply an external reference. The ADC10DL065 has two analog signal input pairs, VIN A+ and VIN A- for one converter and VIN B+ and VIN B- for the other converter. Each pair of pins forms a differential input pair. Reference Pins The ADC10DL065 is designed to operate with an internal 1.0V or 0.5V reference, or an external 1.0V reference, but performs well with extermal reference voltages in the range of 0.8V to 1.2V. Lower reference voltages will decrease the signal-to-noise ratio (SNR) of the ADC10DL065. Increasing the reference voltage (and the input signal swing) beyond 1.2V may degrade THD for a full-scale input, especially at higher input frequencies. It is important that all grounds associated with the reference voltage and the analog input signal make connection to the ground plane at a single, quiet point to minimize the effects of noise currents in the ground path. The six Reference Bypass Pins (VRPA, VRMA, VRNA, VRPB, VRMB and VRNB) are made available for bypass purposes. All these pins should each be bypassed to ground with a 0.1 µF capacitor. A 10 µF capacitor should be placed between the VRPA and VRNA pins and between the VRPB and VRNB pins, as shown in Figure 36. This configuration is necessary to avoid reference oscillation, which could result in reduced SFDR and/or SNR. Smaller capacitor values than those specified will allow faster recovery from the power down mode, but may result in degraded noise performance. Loading any of these pins other than VRMA and VRMB may result in performance degradation. The nominal voltages for the reference bypass pins are as follows: VRM = 1.5 V VRP = VRM + VREF / 2 VRN = VRM − VREF / 2 20 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 User choice of an on-chip or external reference voltage is provided. The internal 1.0 Volt reference is in use when the the VREF pin is connected to VA. When the VREF pin is connected to AGND, the internal 0.5 Volt reference is in use. If a voltage in the range of 0.8V to 1.2V is applied to the VREF pin, that is used for the voltage reference. When an external reference is used, the VREF pin should be bypassed to ground with a 0.1 µF capacitor close to the reference input pin. There is no need to bypass the VREF pin when the internal reference is used. Signal Inputs The signal inputs are VIN A+ and VINA− for one ADC and VINB+ and VINB− for the other ADC . The input signal, VIN, is defined as VIN A = (VINA+) – (VINA−) (5) for the "A" converter and VIN B = (VINB+) – (VINB−) (6) for the "B" converter. Figure 34 shows the expected input signal range. Note that the common mode input voltage, VCM, should be in the range of 0.5V to 2.0V. The peaks of the individual input signals should each never exceed 2.6V. The ADC10DL065 performs best with a differential input signal with each input centered around a common mode voltage, VCM. The peak-to-peak voltage swing at each analog input pin should not exceed the value of the reference voltage or the output data will be clipped. The two input signals should be exactly 180° out of phase from each other and of the same amplitude. For single frequency inputs, angular errors result in a reduction of the effective full scale input. For complex waveforms, however, angular errors will result in distortion. Figure 34. Expected Input Signal Range For single frequency sine waves the full scale error in LSB can be described as approximately EFS = 1024 ( 1 - sin (90° + dev)) (7) Where dev is the angular difference in degrees between the two signals having a 180° relative phase relationship to each other (see Figure 35). Drive the analog inputs with a source impedance less than 100Ω. Figure 35. Angular Errors Between the Two Input Signals Will Reduce the Output Level or Cause Distortion For differential operation, each analog input pin of the differential pair should have a peak-to-peak voltage equal to the reference voltage, VREF, be 180 degrees out of phase with each other and be centered around VCM. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 21 ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com Single-Ended Operation Performance with differential input signals is better than with single-ended signals. For this reason, single-ended operation is not recommended. However, if single ended-operation is required and the resulting performance degradation is acceptable, one of the analog inputs should be connected to the d.c. mid point voltage of the driven input. The peak-to-peak differential input signal at the driven input pin should be twice the reference voltage to maximize SNR and SINAD performance (Figure 34b). For example, set VREF to 0.5V, bias VIN− to 1.0V and drive VIN+ with a signal range of 0.5V to 1.5V. Because very large input signal swings can degrade distortion performance, better performance with a singleended input can be obtained by reducing the reference voltage when maintaining a full-range output. Table 1 and Table 2 indicate the input to output relationship of the ADC10DL065. Table 1. Input to Output Relationship – Differential Input VIN+ VIN− Binary Output 2’s Complement Output VCM − VREF/2 VCM + VREF/2 00 0000 0000 10 0000 0000 VCM − VREF/4 VCM + VREF/4 01 0000 0000 11 0000 0000 VCM VCM 10 0000 0000 00 0000 0000 VCM + VREF/4 VCM − VREF/4 11 0000 0000 01 0000 0000 VCM + VREF/2 VCM − VREF/2 11 1111 1111 01 1111 1111 Table 2. Input to Output Relationship – Single-Ended Input VIN VIN− Binary Output 2’s Complement Output VCM − VREF VCM 00 0000 0000 10 0000 0000 VCM − VREF/2 VCM 01 0000 0000 11 0000 0000 VCM VCM 10 0000 0000 00 0000 0000 VCM + VREF/2 VCM 11 0000 0000 01 0000 0000 VCM + VREF VCM 11 1111 1111 01 1111 1111 + Driving the Analog Inputs The VIN+ and the VIN− inputs of the ADC10DL065 consist of an analog switch followed by a switched-capacitor amplifier. As the internal sampling switch opens and closes, current pulses occur at the analog input pins, resulting in voltage spikes at the signal input pins. As the driving source attempts to counteract these voltage spikes, it may add noise to the signal at the ADC analog input. To help isolate the pulses at the ADC input from the amplifier output, use RCs at the inputs, as can be seen in Figure 36. These components should be placed close to the ADC inputs because the input pins of the ADC is the most sensitive part of the system and this is the last opportunity to filter that input. For Nyquist applications the RC pole should be at the ADC sample rate. The ADC input capacitance in the sample mode should be considered when setting the RC pole. For wideband undersampling applications, the RC pole should be set at about 1.5 to 2 times the maximum input frequency to maintain a linear delay response. The values of the RC shown in Figure 36 are suitable for applications with input frequencies up to approximately 70MHz. Input Common Mode Voltage The input common mode voltage, VCM, should be in the range of 0.5V to 2.0V and be a value such that the peak excursions of the analog signal does not go more negative than ground or more positive than 2.6V. See Reference Pins. DIGITAL INPUTS Digital TTL/CMOS compatible inputs consist of CLK, OEA, OEB, PD, DF/DCS, and MULTIPLEX. 22 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 CLK The CLK signal controls the timing of the sampling process. Drive the clock input with a stable, low jitter clock signal in the range of 15 MHz to 65 MHz. The higher the input frequency, the more critical it is to have a low jitter clock.The trace carrying the clock signal should be as short as possible and should not cross any other signal line, analog or digital, not even at 90°. The CLK signal also drives an internal state machine. If the CLK is interrupted, or its frequency too low, the charge on internal capacitors can dissipate to the point where the accuracy of the output data will degrade. This is what limits the lowest sample rate. The clock line should be terminated at its source in the characteristic impedance of that line. Take care to maintain a constant clock line impedance throughout the length of the line. Refer to Application Note AN-905 (SNLA035) for information on setting characteristic impedance. It is highly desirable that the the source driving the ADC CLK pin only drive that pin. However, if that source is used to drive other things, each driven pin should be a.c. terminated with a series RC to ground, as shown in Figure 36, such that the resistor value is equal to the characteristic impedance of the clock line and the capacitor value is (8) where tPD is the signal propagation rate down the clock line, "L" is the line length and ZO is the characteristic impedance of the clock line. This termination should be as close as possible to the ADC clock pin but beyond it as seen from the clock source. Typical tPD is about 150 ps/inch (60 ps/cm) on FR-4 board material. The units of "L" and tPD should be the same (inches or centimeters). The duty cycle of the clock signal can affect the performance of the A/D Converter. Because achieving a precise duty cycle is difficult, the ADC10DL065 has a Duty Cycle Stabilizer which can be enabled using the DF/DCS pin. It is designed to maintain performance over a clock duty cycle range of 20% to 80% at 65 MSPS. The Duty Cycle Stabilizer circuit requires a fast clock edge to produce the internal clock, which is the reason for the rise and fall time requirement listed in the specifications table. OEA, OEB The OEA and OEB pins, when high, put the output pins of their respective converters into a high impedance state. When either of these pin is low, the corresponding outputs are in the active state. The ADC10DL065 will continue to convert whether these pins are high or low, but the output can not be read while the pin is high. Since ADC noise increases with increased output capacitance at the digital output pins, do not use the TRISTATE outputs of the ADC10DL065 to drive a bus. Rather, each output pin should be located close to and drive a single digital input pin. To further reduce ADC noise, a 100 Ω resistor in series with each ADC digital output pin, located close to their respective pins, should be added to the circuit. PD The PD pin, when high, holds the ADC10DL065 in a power-down mode to conserve power when the converter is not being used. The power consumption in this state is 36 mW with a 65MHz clock and 40mW if the clock is stopped when PD is high. The output data pins are undefined and the data in the pipeline is corrupted while in the power down mode. The Power Down Mode Exit Cycle time is determined by the value of the components on pins 4, 5, 6, 12, 13 and 14 and is about 500 µs with the recommended components on the VRP, VRM and VRN reference bypass pins. These capacitors loose their charge in the Power Down mode and must be recharged by on-chip circuitry before conversions can be accurate. Smaller capacitor values allow slightly faster recovery from the power down mode, but can result in a reduction in SNR, SINAD and ENOB performance. DF/DCS Duty cycle stabilization and output data format are selectable using this quad state function pin. When enabled, duty cycle stabilization can compensate for clock inputs with duty cycles ranging from 20% to 80% and generate a stable internal clock, improving the performance of the part. The Duty Cycle Stabilizer circuit requires a fast clock edge to produce the internal clock, which is the reason for the rise and fall time requirement listed in the specifications table. With DF/DCS = VA the output data format is offset binary and duty cycle stabilization is Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 23 ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com applied to the clock. With DF/DCS = 0 the output data format is 2's complement and duty cycle stabilization is applied to the clock. With DF/DCS = VRMA or VRMB the output data format is 2's complement and duty cycle stabilization is not used. If DF/DCS is floating, the output data format is offset binary and duty cycle stabilization is not used. While the sense of this pin may be changed "on the fly," doing this is not recommended as the output data could be erroneous for a few clock cycles after this change is made. MULTIPLEX With the MULTIPLEX pin at a logic low, the digital output words from channels A and B are available on separate digital output buses (Parallel mode). When MULTIPLEX is high, the digital output words are multiplexed on pins DA0:DA9 (Multiplex Mode). The ABb pin changes synchronously with the multiplexed outputs, and is high when channel A data is present on the outputs, and low when channel B data is present. OUTPUTS The ADC10DL065 has 10 TTL/CMOS compatible Data Output pins for each output. Valid data is present at these outputs while the OE and PD pins are low. In the parallel mode, the data should be captured with the CLK signal. Depending on the setup and hold time requirements of the receiving circuit (ASIC), either the rising edge or the falling edge of the CLK signal can be used to latch the data. Generally, rising-edge- -capture would maximize setup time with minimal hold time; while falling-edge-capture would maximize hold time with minimal setup time. However, actual timing for the falling-edge case depends greatly on the CLK frequency and both cases also depend on the delays inside the ASIC. Refer to the Tod spec in the AC Electrical Characteristics table. In Multiplex mode, both channel outputs are available on DA0:DA9. The ABb signal is available to de-multiplex the output bus. The ABb signal may also be used to latch the data in the ASIC thus avoiding the use of the CLK signal altogether. However, since the ABb signal edges are provided in-phase with the data transitions, generally the ASIC circuitry would have to delay the ABb signal with respect to the data in order to use it as the clock for the capturing latches. It is also possible to use the CLK signal to latch the data in the multiplexed mode as well as described in the previous paragraph. Be very careful when driving a high capacitance bus. The more capacitance the output drivers must charge for each conversion, the more instantaneous digital current flows through VDR and DR GND. These large charging current spikes can cause on-chip ground noise and couple into the analog circuitry, degrading dynamic performance. Adequate bypassing, limiting output capacitance and careful attention to the ground plane will reduce this problem. Additionally, bus capacitance beyond the specified 15 pF/pin will cause tOD to increase, making it difficult to properly latch the ADC output data. The result could be an apparent reduction in dynamic performance. To minimize noise due to output switching, minimize the load currents at the digital outputs. This can be done by connecting buffers (74ACQ541, for example) between the ADC outputs and any other circuitry. Only one driven input should be connected to each output pin. Additionally, inserting series resistors of about 100Ω at the digital outputs, close to the ADC pins, will isolate the outputs from trace and other circuit capacitances and limit the output currents, which could otherwise result in performance degradation. See Figure 36. 24 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 +3.0V 3x 0.1 PF CHOKE 2x 0.1 PF 2 3 4 5 6 7 8 9 2x 0.1 PF + 7 4 1 PF 5 330 10 PF 6 30 51 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 VREF VR B M VRP B VR B N 0.1 PF 0.1 PF 14 1 PF ** VIN_B 1 0.1 PF 13 10 PF 12 51 6 0.1 PF T2 1 2 51 39 pF 3 1 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 19 18 17 16 15 14 13 12 CLK ChB Output Word OE 74ACT574 2 3 4 5 6 7 8 9 VRP A 11 VR A 1 N 2 2 M 57 56 55 54 53 52 47 46 45 44 10x100: 0.1 PF 39 pF 0.1 PF 4 VR A 11 R 1k VD R VD VA 9 VA 18 VA 19 VA 62 VA 63 VD 33 VD 48 10 PF D1 D2 D3 D4 D5 D6 D7 D8 D1 D2 D3 D4 D5 D6 D7 D8 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 19 18 17 16 15 14 13 12 CLK OE 74ACT574 VINBVINB+ T4-6T ADC10DL065 330 ** VIN_A 1 0.1 PF 51 6 T2 39 pF 0.1 PF 2 2 3 4 39 pF 51 16 15 VINA- DA9 DA8 DA7 DA6 DA5 DA4 DA3 DA2 DA1 DA0 VINA+ T4-6T 59 2 3 4 5 6 7 8 9 11 1 D1 D2 D3 D4 D5 D6 D7 D8 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 19 18 17 16 15 14 13 12 CLK ChA Output Word OE 74ACT574 OEB PD 3 8 10 17 20 61 64 See Text 10x100: OEA AGND AGND AGND AGND AGND AGND AGND PD MULTIPLEX DR GND DR GND DR GND DR GND DR GND 41 OEB DF/DCS 23 31 40 50 58 11 22 OEA CLK DGND DGND 60 21 DF/DCS 32 49 47 Crystal Oscillator 39 38 37 36 35 34 29 28 27 26 2 3 4 5 6 7 8 9 11 1 ** may be replaced by Ckt in next figure D1 D2 D3 D4 D5 D6 D7 D8 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 19 18 17 16 15 14 13 12 CLK OE 74ACT574 Figure 36. Application Circuit Using Transformer Drive Circuit, Parallel Mode Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 25 ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com 2 3 4 5 6 7 8 9 +3.0V 3x 0.1 PF CHOKE 2x 0.1 PF 2x 0.1 PF + 10 PF 7 4 5 0.1 PF 10 PF 0.1 PF 6 0.1 PF ** 1 0.1 PF 6 13 10 PF 12 T2 30 51 VR B VR A M VRP A 1 2 51 39 pF 3 Channel B Output Word CLK OE R ABb 57 56 55 54 53 52 47 46 45 44 2 3 4 5 6 7 8 9 11 *** 42 1 VR A D1 D2 D3 D4 D5 D6 D7 D8 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 19 18 17 16 15 14 13 12 CLK OE 74ACT574 N 2 2 M VRP B 19 18 17 16 15 14 13 12 0.1 PF 39 pF 0.1 PF 4 VR B Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 74ACT574 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 N 0.1 PF 51 VIN_B VREF 0.1 PF 14 1 VD R VD VA 9 VA 18 VA 19 VA 62 VA 63 1k 330 VD 33 VD 48 11 D1 D2 D3 D4 D5 D6 D7 D8 VINB- *** VINB+ T4-6T ADC10DL065 330 ** VIN_A 1 0.1 PF 51 6 T2 39 pF 0.1 PF 2 2 16 15 39 pF 51 3 4 DA9 DA8 DA7 DA6 DA5 DA4 DA3 DA2 DA1 DA0 VINAVINA+ T4-6T Multiplex 22 OEA 41 OEB 59 10x100: D1 D2 D3 D4 D5 D6 D7 D8 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 19 18 17 16 15 14 13 12 CLK Channel A Output Word OE 74ACT574 MULTIPLEX 2 3 4 5 6 7 8 9 OEA OEB PD AGND AGND AGND AGND AGND AGND AGND PD DF/DCS 1 3 8 10 17 20 61 64 See Text DR GND DR GND DR GND DR GND DR GND 11 11 23 31 40 50 58 21 DF/DCS CLK DGND DGND 60 32 49 47 Clock In 2 3 4 5 6 7 8 9 39 38 37 36 35 34 29 28 27 26 11 1 ** may be replaced by Ckt in next figure D1 D2 D3 D4 D5 D6 D7 D8 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8 19 18 17 16 15 14 13 12 CLK OE 74ACT574 *** The delay through the inverters should be adjusted to allow the correct set-up and hold time for the latches. Figure 37. Application Circuit Using Transformer Drive Circuit, Multiplex Mode 511, 1% VRM from ADC 51 255, 1% 50: SIGNAL INPUT 49.9, 1% 280, 1% To ADC VIN39 pF + VCM Amplifier: LMH6650 - 39 pF 511, 1% 51 To ADC VIN+ Figure 38. Optional Amplifier Differential Drive Circuit POWER SUPPLY CONSIDERATIONS The power supply pins should be bypassed with a 10 µF capacitor and with a 0.1 µF ceramic chip capacitor within a centimeter of each power pin. Leadless chip capacitors are preferred because they have low series inductance. As is the case with all high-speed converters, the ADC10DL065 is sensitive to power supply noise. Accordingly, the noise on the analog supply pin should be kept below 100 mVP-P. 26 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 No pin should ever have a voltage on it that is in excess of the supply voltages, not even on a transient basis. Be especially careful of this during power turn on and turn off. The VDR pin provides power for the output drivers and may be operated from a supply in the range of 2.4V to VD. This can simplify interfacing to lower voltage devices and systems. Note, however, that tOD increases with reduced VDR. DO NOT operate the VDR pin at a voltage higher than VD. LAYOUT AND GROUNDING Proper grounding and proper routing of all signals are essential to ensure accurate conversion. Maintaining separate analog and digital areas of the board, with the ADC10DL065 between these areas, is required to achieve specified performance. The ground return for the data outputs (DR GND) carries the ground current for the output drivers. The output current can exhibit high transients that could add noise to the conversion process. To prevent this from happening, the DR GND pins should NOT be connected to system ground in close proximity to any of the ADC10DL065's other ground pins. Capacitive coupling between the typically noisy digital circuitry and the sensitive analog circuitry can lead to poor performance. The solution is to keep the analog circuitry separated from the digital circuitry, and to keep the clock line as short as possible. Digital circuits create substantial supply and ground current transients. The logic noise thus generated could have significant impact upon system noise performance. The best logic family to use in systems with A/D converters is one which employs non-saturating transistor designs, or has low noise characteristics, such as the 74LS, 74HC(T) and 74AC(T)Q families. The worst noise generators are logic families that draw the largest supply current transients during clock or signal edges, like the 74F and the 74AC(T) families. The effects of the noise generated from the ADC output switching can be minimized through the use of 100Ω resistors in series with each data output line. Locate these resistors as close to the ADC output pins as possible. Since digital switching transients are composed largely of high frequency components, total ground plane copper weight will have little effect upon the logic-generated noise. This is because of the skin effect. Total surface area is more important than is total ground plane volume. Generally, analog and digital lines should cross each other at 90° to avoid crosstalk. To maximize accuracy in high speed, high resolution systems, however, avoid crossing analog and digital lines altogether. It is important to keep clock lines as short as possible and isolated from ALL other lines, including other digital lines. Even the generally accepted 90° crossing should be avoided with the clock line as even a little coupling can cause problems at high frequencies. This is because other lines can introduce jitter into the clock line, which can lead to degradation of SNR. Also, the high speed clock can introduce noise into the analog chain. Best performance at high frequencies and at high resolution is obtained with a straight signal path. That is, the signal path through all components should form a straight line wherever possible. Be especially careful with the layout of inductors. Mutual inductance can change the characteristics of the circuit in which they are used. Inductors should not be placed side by side, even with just a small part of their bodies beside each other. The analog input should be isolated from noisy signal traces to avoid coupling of spurious signals into the input. Any external component (e.g., a filter capacitor) connected between the converter's input pins and ground or to the reference input pin and ground should be connected to a very clean point in the ground plane. Figure 39 gives an example of a suitable layout. All analog circuitry (input amplifiers, filters, reference components, etc.) should be placed in the analog area of the board. All digital circuitry and I/O lines should be placed in the digital area of the board. The ADC10DL065 should be between these two areas. Furthermore, all components in the reference circuitry and the input signal chain that are connected to ground should be connected together with short traces and enter the ground plane at a single, quiet point. All ground connections should have a low inductance path to ground. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 27 ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com 6 x 100: COMMON GROUND PLANE Clock line should be short and cross no other lines. OSC LATCH All Analog Components mounted over Analog area of Ground Plane 2 3 4 5 Driving source located close to converter. 6 7 Single Ground entry for all Reference Components 8 9 10 DGND DR GND DB4 VDR DB6 DB5 DB7 DB9 DB8 VA VIN B- CLK P D DR GND 1 AGND AGND Xfmr/Amplifier VA 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 VD VIN B+ DB3 AGND DB2 VRM B DB1 VRP B DB0 VRN B NC VREF ABb AGND OEB ADC10DL065 VA DR GND DA9 INT/EXT REF DA8 VRN A DA7 VRP A DA6 VRM A DA5 VIN A+ DA4 VIN A- VD DR GND 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 DGND VDR DA3 DA2 DA1 DA0 NC NC DR GND OF Analog power line should be routed away from Digital power trace. 42 41 40 36 AGN D VA 16 LATCH 37 OEA 15 44 38 AGND 14 46 45 39 AGND VA 13 4 x 100: 47 43 11 12 48 All Digital Components mounted over Digital area of Ground Plane 35 34 33 Digital power line should be routed away from analog power trace. Ground entry points close to ground pins. Figure 39. Example of a Suitable Layout DYNAMIC PERFORMANCE To achieve the best dynamic performance, the clock source driving the CLK input must be free of jitter. Isolate the ADC clock from any digital circuitry with buffers, as with the clock tree shown in Figure 40. The gates used in the clock tree must be capable of operating at frequencies much higher than those used if added jitter is to be prevented. Best performance will be obtained with a differential input drive, compared with a single-ended drive, as discussed in Single-Ended Operation and Driving the Analog Inputs. As mentioned in LAYOUT AND GROUNDING, it is good practice to keep the ADC clock line as short as possible and to keep it well away from any other signals. Other signals can introduce jitter into the clock signal, which can lead to reduced SNR performance, and the clock can introduce noise into other lines. Even lines with 90° crossings have capacitive coupling, so try to avoid even these 90° crossings of the clock line. Figure 40. Isolating the ADC Clock from other Circuitry with a Clock Tree 28 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 ADC10DL065 www.ti.com SNAS314B – JUNE 2006 – REVISED APRIL 2013 COMMON APPLICATION PITFALLS Driving the inputs (analog or digital) beyond the power supply rails. For proper operation, all inputs should not go more than 100 mV beyond the supply rails (more than 100 mV below the ground pins or 100 mV above the supply pins). Exceeding these limits on even a transient basis may cause faulty or erratic operation. It is not uncommon for high speed digital components (e.g., 74F and 74AC devices) to exhibit overshoot or undershoot that goes above the power supply or below ground. A resistor of about 47Ω to 100Ω in series with any offending digital input, close to the signal source, will eliminate the problem. Do not allow input voltages to exceed the supply voltage, even on a transient basis. Not even during power up or power down. Be careful not to overdrive the inputs of the ADC10DL065 with a device that is powered from supplies outside the range of the ADC10DL065 supply. Such practice may lead to conversion inaccuracies and even to device damage. Attempting to drive a high capacitance digital data bus. The more capacitance the output drivers must charge for each conversion, the more instantaneous digital current flows through VDR and DR GND. These large charging current spikes can couple into the analog circuitry, degrading dynamic performance. Adequate bypassing and maintaining separate analog and digital areas on the pc board will reduce this problem. Additionally, bus capacitance beyond the specified 15 pF/pin will cause tOD to increase, making it difficult to properly latch the ADC output data. The result could, again, be an apparent reduction in dynamic performance. The digital data outputs should be buffered (with 74ACQ541, for example). Dynamic performance can also be improved by adding series resistors at each digital output, close to the ADC10DL065, which reduces the energy coupled back into the converter output pins by limiting the output current. A reasonable value for these resistors is 100Ω. Using an inadequate amplifier to drive the analog input. As explained in Signal Inputs, the capacitance seen at the input alternates between 8 pF and 7 pF, depending upon the phase of the clock. This dynamic load is more difficult to drive than is a fixed capacitance. If the amplifier exhibits overshoot, ringing, or any evidence of instability, even at a very low level, it will degrade performance. A small series resistor at each amplifier output and a capacitor at the analog inputs (as shown in Figure 37 and Figure 38) will improve performance. The LMH6702 and the LMH6628 have been successfully used to drive the analog inputs of the ADC10DL065. Also, it is important that the signals at the two inputs have exactly the same amplitude and be exactly 180º out of phase with each other. Board layout, especially equality of the length of the two traces to the input pins, will affect the effective phase between these two signals. Remember that an operational amplifier operated in the non-inverting configuration will exhibit more time delay than will the same device operating in the inverting configuration. Operating with the reference pins outside of the specified range. As mentioned in Reference Pins, VREF should be in the range of 0.8V ≤ VREF ≤ 1.2V (9) Operating outside of these limits could lead to performance degradation. Inadequate network on Reference Bypass pins (VRPA, VRNA, VRMA, VRPB, VRNB and VRMB). As mentioned in Reference Pins, these pins should be bypassed with 0.1 µF capacitors to ground at VRMA and VRMB and with a series RC of 1.5 Ω and 1.0 µF between pins VRPA and VRNA and between VRPB and VRNB for best performance. Using a clock source with excessive jitter, using excessively long clock signal trace, or having other signals coupled to the clock signal trace. This will cause the sampling interval to vary, causing excessive output noise and a reduction in SNR and SINAD performance. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 29 ADC10DL065 SNAS314B – JUNE 2006 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision A (April 2013) to Revision B • 30 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 29 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: ADC10DL065 PACKAGE OPTION ADDENDUM www.ti.com 7-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) ADC10DL065CIVS/NOPB ACTIVE Package Type Package Pins Package Drawing Qty TQFP PAG 64 160 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Device Marking (3) CU SN Level-3-260C-168 HR (4/5) -40 to 85 ADC10DL065 CIVS (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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