NXP LPC64 32-bit arm cortex-m3 microcontroller; up to 512 kb flash and 64 kb sram with ethernet, usb 2.0 host/device/otg, can Datasheet

LPC1768/67/66/65/64
32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and
64 kB SRAM with Ethernet, USB 2.0 Host/Device/OTG, CAN
Rev. 03 — 19 November 2009
Product data sheet
1. General description
The LPC1768/67/66/65/64 are ARM Cortex-M3 based microcontrollers for embedded
applications featuring a high level of integration and low power consumption. The ARM
Cortex-M3 is a next generation core that offers system enhancements such as enhanced
debug features and a higher level of support block integration.
The LPC1768/67/66/65/64 operate at CPU frequencies of up to 100 MHz. The ARM
Cortex-M3 CPU incorporates a 3-stage pipeline and uses a Harvard architecture with
separate local instruction and data buses as well as a third bus for peripherals. The ARM
Cortex-M3 CPU also includes an internal prefetch unit that supports speculative
branching.
The peripheral complement of the LPC1768/67/66/65/64 includes up to 512 kB of flash
memory, up to 64 kB of data memory, Ethernet MAC, USB Device/Host/OTG interface,
8-channel general purpose DMA controller, 4 UARTs, 2 CAN channels, 2 SSP controllers,
SPI interface, 3 I2C-bus interfaces, 2-input plus 2-output I2S-bus interface, 8-channel
12-bit ADC, 10-bit DAC, motor control PWM, Quadrature Encoder interface, four general
purpose timers, 6-output general purpose PWM, ultra-low power Real-Time Clock (RTC)
with separate battery supply, and up to 70 general purpose I/O pins.
The LPC1768/67/66/65/64 are pin-compatible to the 100-pin LPC236x ARM7-based
microcontroller series.
2. Features
„ ARM Cortex-M3 processor, running at frequencies of up to 100 MHz. A Memory
Protection Unit (MPU) supporting eight regions is included.
„ ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).
„ Up to 512 kB on-chip flash programming memory. Enhanced flash memory accelerator
enables high-speed 100 MHz operation with zero wait states.
„ In-System Programming (ISP) and In-Application Programming (IAP) via on-chip
bootloader software.
„ On-chip SRAM includes:
‹ 32/16 kB of SRAM on the CPU with local code/data bus for high-performance CPU
access.
‹ Two/one 16 kB SRAM blocks with separate access paths for higher throughput.
These SRAM blocks may be used for Ethernet, USB, and DMA memory, as well as
for general purpose CPU instruction and data storage.
NXP Semiconductors
LPC1768/67/66/65/64
32-bit ARM Cortex-M3 microcontroller
„ Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer
matrix that can be used with SSP, I2S-bus, UART, Analog-to-Digital and
Digital-to-Analog converter peripherals, timer match signals, and for
memory-to-memory transfers.
„ Multilayer AHB matrix interconnect provides a separate bus for each AHB master.
AHB masters include the CPU, General Purpose DMA controller, Ethernet MAC, and
the USB interface. This interconnect provides communication with no arbitration
delays.
„ Split APB bus allows high throughput with few stalls between the CPU and DMA.
„ Serial interfaces:
‹ Ethernet MAC with RMII interface and dedicated DMA controller
(LPC1768/67/66/64 only).
‹ USB 2.0 full-speed device/Host/OTG controller with dedicated DMA controller and
on-chip PHY for device, Host, and OTG functions (LPC1768/66/65 only). The
LPC1764 includes a device controller only.
‹ Four UARTs with fractional baud rate generation, internal FIFO, and DMA support.
One UART has modem control I/O and RS-485/EIA-485 support, and one UART
has IrDA support.
‹ CAN 2.0B controller with two channels.
‹ SPI controller with synchronous, serial, full duplex communication and
programmable data length.
‹ Two SSP controllers with FIFO and multi-protocol capabilities. The SSP interfaces
can be used with the GPDMA controller.
‹ Three enhanced I2C bus interfaces, one with an open-drain output supporting full
I2C specification and Fast mode plus with data rates of 1 Mbit/s, two with standard
port pins. Enhancements include multiple address recognition and monitor mode.
‹ On the LPC1768/67/66/65 only, I2S (Inter-IC Sound) interface for digital audio input
or output, with fractional rate control. The I2S-bus interface can be used with the
GPDMA. The I2S-bus interface supports 3-wire and 4-wire data transmit and
receive as well as master clock input/output.
„ Other peripherals:
‹ 70 (100 pin package) General Purpose I/O (GPIO) pins with configurable
pull-up/down resistors. All GPIOs support a new, configurable open-drain operating
mode. The GPIO block is accessed through the AHB mulitlayer bus for fast access
and located in memory such that it supports Cortex-M3 bit banding and use by the
General Purpose DMA Controller.
‹ 12-bit Analog-to-Digital Converter (ADC) with input multiplexing among eight pins,
conversion rates up to 200 kHz, and multiple result registers. The 12-bit ADC can
be used with the GPDMA controller.
‹ 10-bit Digital-to-Analog Converter (DAC) with dedicated conversion timer and DMA
support (LPC1768/67/66/65 only).
‹ Four general purpose timers/counters, with a total of eight capture inputs and ten
compare outputs. Each timer block has an external count input. Specific timer
events can be selected to generate DMA requests.
‹ One motor control PWM with support for three-phase motor control.
‹ Quadrature encoder interface that can monitor one external quadrature encoder.
‹ One standard PWM/timer block with external count input.
LPC1768_67_66_65_64_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 19 November 2009
2 of 65
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
„
„
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„
„
„
„
„
„
„
„
„
„
„
„
„
„
„
‹ RTC with a separate power domain and dedicated RTC oscillator. The RTC block
includes 20 bytes of battery-powered backup registers.
‹ Watchdog Timer (WDT). The WDT can be clocked from the internal RC oscillator,
the RTC oscillator, or the APB clock.
‹ ARM Cortex-M3 system tick timer, including an external clock input option.
‹ Repetitive interrupt timer provides programmable and repeating timed interrupts.
‹ Each peripheral has its own clock divider for further power savings.
Standard JTAG test/debug interface for compatibility with existing tools. Serial Wire
Debug and Serial Wire Trace Port options.
Emulation trace module enables non-intrusive, high-speed real-time tracing of
instruction execution.
Integrated PMU (Power Management Unit) automatically adjusts internal regulators to
minimize power consumption during Sleep, Deep sleep, Power-down, and Deep
power-down modes.
Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep power-down.
Single 3.3 V power supply (2.4 V to 3.6 V).
Four external interrupt inputs configurable as edge/level sensitive. All pins on Port 0
and Port 2 can be used as edge sensitive interrupt sources.
Non-maskable Interrupt (NMI) input.
Clock output function that can reflect the main oscillator clock, IRC clock, RTC clock,
CPU clock, and the USB clock.
The Wakeup Interrupt Controller (WIC) allows the CPU to automatically wake up from
any priority interrupt that can occur while the clocks are stopped in deep sleep,
Power-down, and Deep power-down modes.
Processor wake-up from Power-down mode via any interrupt able to operate during
Power-down mode (includes external interrupts, RTC interrupt, USB activity, Ethernet
wake-up interrupt, CAN bus activity, Port 0/2 pin interrupt, and NMI).
Brownout detect with separate threshold for interrupt and forced reset.
Power-On Reset (POR).
Crystal oscillator with an operating range of 1 MHz to 25 MHz.
4 MHz internal RC oscillator trimmed to 1 % accuracy that can optionally be used as a
system clock.
PLL allows CPU operation up to the maximum CPU rate without the need for a
high-frequency crystal. May be run from the main oscillator, the internal RC oscillator,
or the RTC oscillator.
USB PLL for added flexibility.
Code Read Protection (CRP) with different security levels.
Available as 100-pin LQFP package (14 × 14 × 1.4 mm).
3. Applications
„ eMetering
„ Lighting
„ Industrial networking
„ Alarm systems
„ White goods
„ Motor control
LPC1768_67_66_65_64_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 19 November 2009
3 of 65
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC1768FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
SOT407-1
LPC1767FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
SOT407-1
LPC1766FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
SOT407-1
LPC1765FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
SOT407-1
LPC1764FBD100
LQFP100
plastic low profile quad flat package; 100 leads; body 14 × 14 × 1.4 mm
SOT407-1
4.1 Ordering options
Table 2.
Ordering options
Type number
Flash
Total
SRAM
Ethernet
USB
CAN
I2S
DAC Package
LPC1768FBD100
512 kB
64 kB
yes
Device/Host/OTG
2
yes
yes
100 pins
LPC1767FBD100
512 kB
64 kB
yes
no
no
yes
yes
100 pins
LPC1766FBD100
256 kB
64 kB
yes
Device/Host/OTG
2
yes
yes
100 pins
LPC1765FBD100
256 kB
64 kB
no
Device/Host/OTG
2
yes
yes
100 pins
LPC1764FBD100
128 kB
32 kB
yes
Device only
2
no
no
100 pins
LPC1768_67_66_65_64_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 19 November 2009
4 of 65
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
5. Block diagram
JTAG
interface
EMULATION
TRACE MODULE
debug
port
RMII pins
LPC1768/67/66/65/64
TEST/DEBUG
INTERFACE
I-code
bus
MPU
ARM
CORTEX-M3
D-code
bus
DMA
CONTROLLER
system
bus
USB PHY
CLOCK
GENERATION,
POWER CONTROL,
SYSTEM
FUNCTIONS
USB HOST/
DEVICE/OTG
CONTROLLER
WITH DMA(3)(4)
ETHERNET
CONTROLLER
WITH DMA(2)
master
XTAL1
XTAL2
RESET
USB pins
master
CLKOUT
clocks and
controls
master
slave
ROM
slave
MULTILAYER AHB MATRIX
SRAM 32/64 kB
P0 to
P4
slave
HIGH-SPEED
GPIO
SCK1
SSEL1
MISO1
MOSI1
RXD0/TXD0
8 × UART1
APB slave group 0
FLASH
ACCELERATOR
FLASH
512/256/128 kB
APB slave group 1
SCK0
SSEL0
MISO0
MOSI0
RXD2/3
TXD2/3
UART2/3
I2S(1)
3 × I2SRX
3 × I2STX
TX_MCLK
RX_MCLK
SPI0
I2C2
SCL2
SDA2
TIMER 0/1
RI TIMER
WDT
TIMER2/3
PWM1
EXTERNAL INTERRUPTS
12-bit ADC
SYSTEM CONTROL
PIN CONNECT
MOTOR CONTROL PWM
I2C0/1
PWM1[7:0]
PCAP1[1:0]
AD0[7:0]
VBAT
slave
SSP0
CAN1/2(4)
2 × CAP0/1
RTCX2
AHB TO
APB
BRIDGE 1
UART0/1
SCK/SSEL
MOSI/MISO
2 × MAT0/1
RTCX1
AHB TO
APB
BRIDGE 0
slave
SSP1
RD1/2
TD1/2
SCL0/1
SDA0/1
P0, P2
slave
GPIO INTERRUPT CONTROL
32 kHz
OSCILLATOR
4 × MAT2
2 × MAT3
2 × CAP2
2 × CAP3
EINT[3:0]
MCOA[2:0]
MCOB[2:0]
MCI[2:0]
MCABORT
DAC(1)
RTC
AOUT
PHA, PHB
INDEX
QUADRATURE ENCODER
BACKUP REGISTERS
(1)LPC1768/67/66/65 only
(2)LPC1768/67/66/64 only
(3)LPC1764 USB device only
(4)LPC1768/66/65/64 only
RTC POWER DOMAIN
002aad944
Grey-shaded blocks represent peripherals with connection to the GPDMA.
Fig 1.
Block diagram
LPC1768_67_66_65_64_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 19 November 2009
5 of 65
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
6. Pinning information
76
100
6.1 Pinning
1
75
LPC176xFBD100
Fig 2.
50
51
26
25
002aad945
Pin configuration LQFP100 package
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
P0[0] to P0[31]
P0[0]/RD1/TXD3/
SDA1
P0[1]/TD1/RXD3/
SCL1
P0[2]/TXD0/AD0[7]
46[1]
47[1]
98[2]
P0[3]/RXD0/AD0[6] 99[2]
P0[4]/
I2SRX_CLK/
RD2/CAP2[0]
81[1]
Type
Description
I/O
Port 0: Port 0 is a 32-bit I/O port with individual direction controls for each bit. The
operation of port 0 pins depends upon the pin function selected via the pin connect
block. Pins 12, 13, 14, and 31 of this port are not available.
I/O
P0[0] — General purpose digital input/output pin.
I
RD1 — CAN1 receiver input. (LPC1768/66/65/64 only).
O
TXD3 — Transmitter output for UART3.
I/O
SDA1 — I2C1 data input/output. (This is not an I2C-bus compliant open-drain pin).
I/O
P0[1] — General purpose digital input/output pin.
O
TD1 — CAN1 transmitter output. (LPC1768/66/65/64 only).
I
RXD3 — Receiver input for UART3.
I/O
SCL1 — I2C1 clock input/output. (This is not an I2C-bus compliant open-drain pin).
I/O
P0[2] — General purpose digital input/output pin.
O
TXD0 — Transmitter output for UART0.
I
AD0[7] — A/D converter 0, input 7.
I/O
P0[3] — General purpose digital input/output pin.
I
RXD0 — Receiver input for UART0.
I
AD0[6] — A/D converter 0, input 6.
I/O
P0[4] — General purpose digital input/output pin.
I/O
I2SRX_CLK — Receive Clock. It is driven by the master and received by the
slave. Corresponds to the signal SCK in the I2S-bus specification.
(LPC1768/67/66/65 only).
I
RD2 — CAN2 receiver input. (LPC1768/66/65/64 only).
I
CAP2[0] — Capture input for Timer 2, channel 0.
LPC1768_67_66_65_64_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 19 November 2009
6 of 65
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P0[5]/
I2SRX_WS/
TD2/CAP2[1]
80[1]
I/O
P0[5] — General purpose digital input/output pin.
I/O
I2SRX_WS — Receive Word Select. It is driven by the master and received by the
slave. Corresponds to the signal WS in the I2S-bus specification.
(LPC1768/67/66/65 only).
O
TD2 — CAN2 transmitter output. (LPC1768/66/65/64 only).
I
CAP2[1] — Capture input for Timer 2, channel 1.
I/O
P0[6] — General purpose digital input/output pin.
I/O
I2SRX_SDA — Receive data. It is driven by the transmitter and read by the
receiver. Corresponds to the signal SD in the I2S-bus specification.
(LPC1768/67/66/65 only).
I/O
SSEL1 — Slave Select for SSP1.
O
MAT2[0] — Match output for Timer 2, channel 0.
I/O
P0[7] — General purpose digital input/output pin.
I/O
I2STX_CLK — Transmit Clock. It is driven by the master and received by the
slave. Corresponds to the signal SCK in the I2S-bus specification.
(LPC1768/67/66/65 only).
I/O
SCK1 — Serial Clock for SSP1.
O
MAT2[1] — Match output for Timer 2, channel 1.
I/O
P0[8] — General purpose digital input/output pin.
I/O
I2STX_WS — Transmit Word Select. It is driven by the master and received by the
slave. Corresponds to the signal WS in the I2S-bus specification.
(LPC1768/67/66/65 only).
I/O
MISO1 — Master In Slave Out for SSP1.
O
MAT2[2] — Match output for Timer 2, channel 2.
I/O
P0[9] — General purpose digital input/output pin.
I/O
I2STX_SDA — Transmit data. It is driven by the transmitter and read by the
receiver. Corresponds to the signal SD in the I2S-bus specification.
(LPC1768/67/66/65 only).
I/O
MOSI1 — Master Out Slave In for SSP1.
O
MAT2[3] — Match output for Timer 2, channel 3.
I/O
P0[10] — General purpose digital input/output pin.
O
TXD2 — Transmitter output for UART2.
I/O
SDA2 — I2C2 data input/output (this is not an open-drain pin).
O
MAT3[0] — Match output for Timer 3, channel 0.
I/O
P0[11] — General purpose digital input/output pin.
I
RXD2 — Receiver input for UART2.
I/O
SCL2 — I2C2 clock input/output (this is not an open-drain pin).
O
MAT3[1] — Match output for Timer 3, channel 1.
I/O
P0[15] — General purpose digital input/output pin.
O
TXD1 — Transmitter output for UART1.
I/O
SCK0 — Serial clock for SSP0.
I/O
SCK — Serial clock for SPI.
P0[6]/
I2SRX_SDA/
SSEL1/MAT2[0]
P0[7]/
I2STX_CLK/
SCK1/MAT2[1]
P0[8]/
I2STX_WS/
MISO1/MAT2[2]
P0[9]/
I2STX_SDA/
MOSI1/MAT2[3]
P0[10]/TXD2/
SDA2/MAT3[0]
P0[11]/RXD2/
SCL2/MAT3[1]
P0[15]/TXD1/
SCK0/SCK
79[1]
78[1]
77[1]
76[1]
48[1]
49[1]
62[1]
LPC1768_67_66_65_64_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 19 November 2009
7 of 65
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P0[16]/RXD1/
SSEL0/SSEL
63[1]
I/O
P0[16] — General purpose digital input/output pin.
I
RXD1 — Receiver input for UART1.
I/O
SSEL0 — Slave Select for SSP0.
I/O
SSEL — Slave Select for SPI.
I/O
P0[17] — General purpose digital input/output pin.
I
CTS1 — Clear to Send input for UART1.
I/O
MISO0 — Master In Slave Out for SSP0.
I/O
MISO — Master In Slave Out for SPI.
I/O
P0[18] — General purpose digital input/output pin.
I
DCD1 — Data Carrier Detect input for UART1.
I/O
MOSI0 — Master Out Slave In for SSP0.
I/O
MOSI — Master Out Slave In for SPI.
I/O
P0[19] — General purpose digital input/output pin.
I
DSR1 — Data Set Ready input for UART1.
I/O
SDA1 — I2C1 data input/output (this is not an I2C-bus compliant open-drain pin).
I/O
P0[20] — General purpose digital input/output pin.
O
DTR1 — Data Terminal Ready output for UART1. Can also be configured to be an
RS-485/EIA-485 output enable signal.
I/O
SCL1 — I2C1 clock input/output (this is not an I2C-bus compliant open-drain pin).
I/O
P0[21] — General purpose digital input/output pin.
I
RI1 — Ring Indicator input for UART1.
I
RD1 — CAN1 receiver input. (LPC1768/66/65/64 only).
I/O
P0[22] — General purpose digital input/output pin.
O
RTS1 — Request to Send output for UART1. Can also be configured to be an
RS-485/EIA-485 output enable signal.
O
TD1 — CAN1 transmitter output. (LPC1768/66/65/64 only).
I/O
P0[23] — General purpose digital input/output pin.
I
AD0[0] — A/D converter 0, input 0.
I/O
I2SRX_CLK — Receive Clock. It is driven by the master and received by the
slave. Corresponds to the signal SCK in the I2S-bus specification.
(LPC1768/67/66/65 only).
I
CAP3[0] — Capture input for Timer 3, channel 0.
I/O
P0[24] — General purpose digital input/output pin.
I
AD0[1] — A/D converter 0, input 1.
I/O
I2SRX_WS — Receive Word Select. It is driven by the master and received by the
slave. Corresponds to the signal WS in the I2S-bus specification.
(LPC1768/67/66/65 only).
I
CAP3[1] — Capture input for Timer 3, channel 1.
P0[17]/CTS1/
MISO0/MISO
P0[18]/DCD1/
MOSI0/MOSI
P0[19]/DSR1/
SDA1
61[1]
60[1]
59[1]
P0[20]/DTR1/SCL1 58[1]
P0[21]/RI1/RD1
P0[22]/RTS1/TD1
P0[23]/AD0[0]/
I2SRX_CLK/
CAP3[0]
P0[24]/AD0[1]/
I2SRX_WS/
CAP3[1]
57[1]
56[1]
9[2]
8[2]
LPC1768_67_66_65_64_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 19 November 2009
8 of 65
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P0[25]/AD0[2]/
I2SRX_SDA/
TXD3
7[2]
I/O
P0[25] — General purpose digital input/output pin.
I
AD0[2] — A/D converter 0, input 2.
I/O
I2SRX_SDA — Receive data. It is driven by the transmitter and read by the
receiver. Corresponds to the signal SD in the I2S-bus specification.
(LPC1768/67/66/65 only).
O
TXD3 — Transmitter output for UART3.
P0[26]/AD0[3]/
AOUT/RXD3
6[3]
I/O
P0[26] — General purpose digital input/output pin.
I
AD0[3] — A/D converter 0, input 3.
O
AOUT — DAC output (LPC1768/67/66/65 only).
I
RXD3 — Receiver input for UART3.
I/O
P0[27] — General purpose digital input/output pin. Output is open-drain.
I/O
SDA0 — I2C0 data input/output. Open-drain output (for I2C-bus compliance).
I/O
USB_SDA — USB port I2C serial data (OTG transceiver, LPC1768/66/65 only).
I/O
P0[28] — General purpose digital input/output pin. Output is open-drain.
I/O
SCL0 — I2C0 clock input/output. Open-drain output (for I2C-bus compliance).
I/O
USB_SCL — USB port I2C serial clock (OTG transceiver, LPC1768/66/65 only).
I/O
P0[29] — General purpose digital input/output pin.
I/O
USB_D+ — USB bidirectional D+ line. (LPC1768/66/65/64 only).
I/O
P0[30] — General purpose digital input/output pin.
I/O
USB_D− — USB bidirectional D− line. (LPC1768/66/65/64 only).
I/O
Port 1: Port 1 is a 32-bit I/O port with individual direction controls for each bit. The
operation of port 1 pins depends upon the pin function selected via the pin connect
block. Pins 2, 3, 5, 6, 7, 11, 12, and 13 of this port are not available.
I/O
P1[0] — General purpose digital input/output pin.
O
ENET_TXD0 — Ethernet transmit data 0. (LPC1768/67/66/64 only).
I/O
P1[1] — General purpose digital input/output pin.
O
ENET_TXD1 — Ethernet transmit data 1. (LPC1768/67/66/64 only).
I/O
P1[4] — General purpose digital input/output pin.
O
ENET_TX_EN — Ethernet transmit data enable. (LPC1768/67/66/64 only).
I/O
P1[8] — General purpose digital input/output pin.
I
ENET_CRS — Ethernet carrier sense. (LPC1768/67/66/64 only).
I/O
P1[9] — General purpose digital input/output pin.
I
ENET_RXD0 — Ethernet receive data. (LPC1768/67/66/64 only).
I/O
P1[10] — General purpose digital input/output pin.
I
ENET_RXD1 — Ethernet receive data. (LPC1768/67/66/64 only).
I/O
P1[14] — General purpose digital input/output pin.
I
ENET_RX_ER — Ethernet receive error. (LPC1768/67/66/64 only).
I/O
P1[15] — General purpose digital input/output pin.
I
ENET_REF_CLK — Ethernet reference clock. (LPC1768/67/66/64 only).
I/O
P1[16] — General purpose digital input/output pin.
O
ENET_MDC — Ethernet MIIM clock (LPC1768/67/66/64 only).
P0[27]/SDA0/
USB_SDA
25[4]
P0[28]/SCL0/
USB_SCL
24[4]
P0[29]/USB_D+
29[5]
P0[30]/USB_D−
30[5]
P1[0] to P1[31]
P1[0]/
ENET_TXD0
95[1]
P1[1]/
ENET_TXD1
94[1]
P1[4]/
ENET_TX_EN
93[1]
P1[8]/
ENET_CRS
92[1]
P1[9]/
ENET_RXD0
91[1]
P1[10]/
ENET_RXD1
90[1]
P1[14]/
ENET_RX_ER
89[1]
P1[15]/
ENET_REF_CLK
88[1]
P1[16]/
ENET_MDC
87[1]
LPC1768_67_66_65_64_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 19 November 2009
9 of 65
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P1[17]/
ENET_MDIO
86[1]
I/O
P1[17] — General purpose digital input/output pin.
I/O
ENET_MDIO — Ethernet MIIM data input and output. (LPC1768/67/66/64 only).
P1[18]/
USB_UP_LED/
PWM1[1]/
CAP1[0]
32[1]
I/O
P1[18] — General purpose digital input/output pin.
O
USB_UP_LED — USB GoodLink LED indicator. It is LOW when device is
configured (non-control endpoints enabled). It is HIGH when the device is not
configured or during global suspend. (LPC1768/66/65/64 only).
O
PWM1[1] — Pulse Width Modulator 1, channel 1 output.
I
CAP1[0] — Capture input for Timer 1, channel 0.
I/O
P1[19] — General purpose digital input/output pin.
O
MCOA0 — Motor control PWM channel 0, output A.
O
USB_PPWR — Port Power enable signal for USB port. (LPC1768/66/65 only).
I
CAP1[1] — Capture input for Timer 1, channel 1.
I/O
P1[20] — General purpose digital input/output pin.
I
MCI0 — Motor control PWM channel 0, input. Also Quadrature Encoder Interface
PHA input.
O
PWM1[2] — Pulse Width Modulator 1, channel 2 output.
I/O
SCK0 — Serial clock for SSP0.
I/O
P1[21] — General purpose digital input/output pin.
O
MCABORT — Motor control PWM, LOW-active fast abort.
O
PWM1[3] — Pulse Width Modulator 1, channel 3 output.
I/O
SSEL0 — Slave Select for SSP0.
I/O
P1[22] — General purpose digital input/output pin.
O
MCOB0 — Motor control PWM channel 0, output B.
I
USB_PWRD — Power Status for USB port (host power switch, LPC1768/66/65
only).
O
MAT1[0] — Match output for Timer 1, channel 0.
I/O
P1[23] — General purpose digital input/output pin.
I
MCI1 — Motor control PWM channel 1, input. Also Quadrature Encoder Interface
PHB input.
O
PWM1[4] — Pulse Width Modulator 1, channel 4 output.
I/O
MISO0 — Master In Slave Out for SSP0.
I/O
P1[24] — General purpose digital input/output pin.
I
MCI2 — Motor control PWM channel 2, input. Also Quadrature Encoder Interface
INDEX input.
O
PWM1[5] — Pulse Width Modulator 1, channel 5 output.
I/O
MOSI0 — Master Out Slave in for SSP0.
I/O
P1[25] — General purpose digital input/output pin.
O
MCOA1 — Motor control PWM channel 1, output A.
O
MAT1[1] — Match output for Timer 1, channel 1.
P1[19]/MCOA0/
USB_PPWR
CAP1[1]
P1[20]/MCI0/
PWM1[2]/SCK0
33[1]
34[1]
P1[21]/MCABORT/
PWM1[3]/
SSEL0
35[1]
P1[22]/MCOB0/
USB_PWRD/
MAT1[0]
36[1]
P1[23]/MCI1/
PWM1[4]/MISO0
37[1]
P1[24]/MCI2/
PWM1[5]/MOSI0
P1[25]/MCOA1/
MAT1[1]
38[1]
39[1]
LPC1768_67_66_65_64_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 19 November 2009
10 of 65
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P1[26]/MCOB1/
PWM1[6]/CAP0[0]
40[1]
I/O
P1[26] — General purpose digital input/output pin.
O
MCOB1 — Motor control PWM channel 1, output B.
O
PWM1[6] — Pulse Width Modulator 1, channel 6 output.
I
CAP0[0] — Capture input for Timer 0, channel 0.
I/O
P1[27] — General purpose digital input/output pin.
O
CLKOUT — Clock output pin.
I
USB_OVRCR — USB port Over-Current status. (LPC1768/66/65 only).
I
CAP0[1] — Capture input for Timer 0, channel 1.
I/O
P1[28] — General purpose digital input/output pin.
O
MCOA2 — Motor control PWM channel 2, output A.
I
PCAP1[0] — Capture input for PWM1, channel 0.
O
MAT0[0] — Match output for Timer 0, channel 0.
I/O
P1[29] — General purpose digital input/output pin.
O
MCOB2 — Motor control PWM channel 2, output B.
I
PCAP1[1] — Capture input for PWM1, channel 1.
O
MAT0[1] — Match output for Timer 0, channel 1.
I/O
P1[30] — General purpose digital input/output pin.
I
VBUS — Monitors the presence of USB bus power. (LPC1768/66/65/64 only).
P1[27]/CLKOUT
/USB_OVRCR/
CAP0[1]
P1[28]/MCOA2/
PCAP1[0]/
MAT0[0]
P1[29]/MCOB2/
PCAP1[1]/
MAT0[1]
P1[30]/VBUS/
AD0[4]
43[1]
44[1]
45[1]
21[2]
Note: This signal must be HIGH for USB reset to occur.
P1[31]/SCK1/
AD0[5]
20[2]
P2[0] to P2[31]
P2[0]/PWM1[1]/
TXD1
75[1]
P2[1]/PWM1[2]/
RXD1
74[1]
P2[2]/PWM1[3]/
CTS1/
TRACEDATA[3]
73[1]
P2[3]/PWM1[4]/
DCD1/
TRACEDATA[2]
70[1]
I
AD0[4] — A/D converter 0, input 4.
I/O
P1[31] — General purpose digital input/output pin.
I/O
SCK1 — Serial Clock for SSP1.
I
AD0[5] — A/D converter 0, input 5.
I/O
Port 2: Port 2 is a 32-bit I/O port with individual direction controls for each bit. The
operation of port 2 pins depends upon the pin function selected via the pin connect
block. Pins 14 through 31 of this port are not available.
I/O
P2[0] — General purpose digital input/output pin.
O
PWM1[1] — Pulse Width Modulator 1, channel 1 output.
O
TXD1 — Transmitter output for UART1.
I/O
P2[1] — General purpose digital input/output pin.
O
PWM1[2] — Pulse Width Modulator 1, channel 2 output.
I
RXD1 — Receiver input for UART1.
I/O
P2[2] — General purpose digital input/output pin.
O
PWM1[3] — Pulse Width Modulator 1, channel 3 output.
I
CTS1 — Clear to Send input for UART1.
O
TRACEDATA[3] — Trace data, bit 3.
I/O
P2[3] — General purpose digital input/output pin.
O
PWM1[4] — Pulse Width Modulator 1, channel 4 output.
I
DCD1 — Data Carrier Detect input for UART1.
O
TRACEDATA[2] — Trace data, bit 2.
LPC1768_67_66_65_64_3
Product data sheet
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Rev. 03 — 19 November 2009
11 of 65
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P2[4]/PWM1[5]/
DSR1/
TRACEDATA[1]
69[1]
I/O
P2[4] — General purpose digital input/output pin.
O
PWM1[5] — Pulse Width Modulator 1, channel 5 output.
I
DSR1 — Data Set Ready input for UART1.
O
TRACEDATA[1] — Trace data, bit 1.
I/O
P2[5] — General purpose digital input/output pin.
O
PWM1[6] — Pulse Width Modulator 1, channel 6 output.
O
DTR1 — Data Terminal Ready output for UART1. Can also be configured to be an
RS-485/EIA-485 output enable signal.
O
TRACEDATA[0] — Trace data, bit 0.
I/O
P2[6] — General purpose digital input/output pin.
I
PCAP1[0] — Capture input for PWM1, channel 0.
I
RI1 — Ring Indicator input for UART1.
O
TRACECLK — Trace Clock.
I/O
P2[7] — General purpose digital input/output pin.
I
RD2 — CAN2 receiver input. (LPC1768/66/65/64 only).
O
RTS1 — Request to Send output for UART1. Can also be configured to be an
RS-485/EIA-485 output enable signal.
I/O
P2[8] — General purpose digital input/output pin.
O
TD2 — CAN2 transmitter output. (LPC1768/66/65/64 only).
O
TXD2 — Transmitter output for UART2.
I/O
P2[9] — General purpose digital input/output pin.
O
USB_CONNECT — Signal used to switch an external 1.5 kΩ resistor under
software control. Used with the SoftConnect USB feature. (LPC1768/66/65/64
only).
I
RXD2 — Receiver input for UART2.
I/O
P2[10] — General purpose digital input/output pin.
P2[5]/PWM1[6]/
DTR1/
TRACEDATA[0]
68[1]
P2[6]/PCAP1[0]/
RI1/TRACECLK
67[1]
P2[7]/RD2/
RTS1
P2[8]/TD2/
TXD2
66[1]
65[1]
P2[9]/
USB_CONNECT/
RXD2
64[1]
P2[10]/EINT0/NMI
53[6]
Note: LOW on this pin while RESET is LOW forces on-chip bootloader to take
over control of the part after a reset.
P2[11]/EINT1/
I2STX_CLK
P2[12]/EINT2/
I2STX_WS
52[6]
51[6]
I
EINT0 — External interrupt 0 input.
I
NMI — Non-maskable interrupt input.
I/O
P2[11] — General purpose digital input/output pin.
I
EINT1 — External interrupt 1 input.
I/O
I2STX_CLK — Transmit Clock. It is driven by the master and received by the
slave. Corresponds to the signal SCK in the I2S-bus specification.
(LPC1768/67/66/65 only).
I/O
P2[12] — General purpose digital input/output pin.
I
EINT2 — External interrupt 2 input.
I/O
I2STX_WS — Transmit Word Select. It is driven by the master and received by the
slave. Corresponds to the signal WS in the I2S-bus specification.
(LPC1768/67/66/65 only).
LPC1768_67_66_65_64_3
Product data sheet
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Rev. 03 — 19 November 2009
12 of 65
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
P2[13]/EINT3/
I2STX_SDA
50[6]
I/O
P2[13] — General purpose digital input/output pin.
I
EINT3 — External interrupt 3 input.
I/O
I2STX_SDA — Transmit data. It is driven by the transmitter and read by the
receiver. Corresponds to the signal SD in the I2S-bus specification.
(LPC1768/67/66/65 only).
I/O
Port 3: Port 3 is a 32-bit I/O port with individual direction controls for each bit. The
operation of port 3 pins depends upon the pin function selected via the pin connect
block. Pins 0 through 24, and 27 through 31 of this port are not available.
I/O
P3[25] — General purpose digital input/output pin.
O
MAT0[0] — Match output for Timer 0, channel 0.
O
PWM1[2] — Pulse Width Modulator 1, output 2.
I/O
P3[26] — General purpose digital input/output pin.
I
STCLK — System tick timer clock input.
O
MAT0[1] — Match output for Timer 0, channel 1.
O
PWM1[3] — Pulse Width Modulator 1, output 3.
I/O
Port 4: Port 4 is a 32-bit I/O port with individual direction controls for each bit. The
operation of port 4 pins depends upon the pin function selected via the pin connect
block. Pins 0 through 27, 30, and 31 of this port are not available.
I/O
P4[28] — General purpose digital input/output pin.
I
RX_MCLK — I2S receive master clock. (LPC1768/67/66/65 only).
O
MAT2[0] — Match output for Timer 2, channel 0.
O
TXD3 — Transmitter output for UART3.
I/O
P4[29] — General purpose digital input/output pin.
I
TX_MCLK — I2S transmit master clock. (LPC1768/67/66/65 only).
O
MAT2[1] — Match output for Timer 2, channel 1.
I
RXD3 — Receiver input for UART3.
O
TDO — Test Data out for JTAG interface.
O
SWO — Serial wire trace output.
P3[0] to P3[31]
P3[25]/MAT0[0]/
PWM1[2]
27[1]
P3[26]/STCLK/
MAT0[1]/PWM1[3]
26[1]
P4[0] to P4[31]
P4[28]/RX_MCLK/
MAT2[0]/TXD3
P4[29]/TX_MCLK/
MAT2[1]/RXD3
TDO/SWO
82[1]
85[1]
1[1]
TDI
2[1]
I
TDI — Test Data in for JTAG interface.
TMS/SWDIO
3[1]
I
TMS — Test Mode Select for JTAG interface.
I/O
SWDIO — Serial wire debug data input/output.
TRST
4[1]
I
TRST — Test Reset for JTAG interface.
TCK/SWDCLK
5[1]
I
TCK — Test Clock for JTAG interface.
I
SWDCLK — Serial wire clock.
RTCK
100[1]
I/O
RTCK — JTAG interface control signal.
RSTOUT
14
O
RSTOUT — This is a 3.3 V pin. LOW on this pin indicates the microcontroller
being in Reset state.
RESET
17[7]
I
External reset input: A LOW on this pin resets the device, causing I/O ports and
peripherals to take on their default states, and processor execution to begin at
address 0. TTL with hysteresis, 5 V tolerant.
XTAL1
22[8]
I
Input to the oscillator circuit and internal clock generator circuits.
XTAL2
23[8]
O
Output from the oscillator amplifier.
RTCX1
16[8]
I
Input to the RTC oscillator circuit.
LPC1768_67_66_65_64_3
Product data sheet
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Rev. 03 — 19 November 2009
13 of 65
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
Table 3.
Pin description …continued
Symbol
Pin
Type
Description
RTCX2
18[8]
O
Output from the RTC oscillator circuit.
VSS
31, 41,
55, 72,
97, 83[8]
I
ground: 0 V reference.
VSSA
11[8]
I
analog ground: 0 V reference. This should nominally be the same voltage as VSS,
but should be isolated to minimize noise and error.
VDD(3V3)
28, 54,
71, 96[8]
I
3.3 V supply voltage: This is the power supply voltage for the I/O ports.
VDD(REG)(3V3)
42, 84[8]
I
3.3 V voltage regulator supply voltage: This is the supply voltage for the on-chip
voltage regulator only.
VDDA
10[8]
I
analog 3.3 V pad supply voltage: This should be nominally the same voltage as
VDD(3V3) but should be isolated to minimize noise and error. This voltage is used to
power the ADC and DAC. This pin should be tied to 3.3 V if the ADC and DAC are
not used.
VREFP
12[8]
I
ADC positive reference voltage: This should be nominally the same voltage as
VDDA but should be isolated to minimize noise and error. Level on this pin is used
as a reference for ADC and DAC. This pin should be tied to 3.3 V if the ADC and
DAC are not used.
VREFN
15
I
ADC negative reference voltage: This should be nominally the same voltage as
VSS but should be isolated to minimize noise and error. Level on this pin is used as
a reference for ADC and DAC.
VBAT
19[8]
I
RTC pin power supply: 3.3 V on this pin supplies the power to the RTC
peripheral.
n.c.
13
-
not connected.
[1]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
[2]
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input,
digital section of the pad is disabled and the pin is not 5 V tolerant.
[3]
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
[4]
Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. This pad requires an external pull-up to provide
output functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines.
Open-drain configuration applies to all functions on this pin.
[5]
Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only).
[6]
5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
[7]
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
[8]
Pad provides special analog functionality.
LPC1768_67_66_65_64_3
Product data sheet
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Rev. 03 — 19 November 2009
14 of 65
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
7. Functional description
7.1 Architectural overview
Remark: In the following, the notation LPC17xx refers to all parts: LPC1768/67/66/65/64.
The ARM Cortex-M3 includes three AHB-Lite buses: the system bus, the I-code bus, and
the D-code bus (see Figure 1). The I-code and D-code core buses are faster than the
system bus and are used similarly to TCM interfaces: one bus dedicated for instruction
fetch (I-code) and one bus for data access (D-code). The use of two core buses allows for
simultaneous operations if concurrent operations target different devices.
The LPC17xx use a multi-layer AHB matrix to connect the ARM Cortex-M3 buses and
other bus masters to peripherals in a flexible manner that optimizes performance by
allowing peripherals that are on different slaves ports of the matrix to be accessed
simultaneously by different bus masters.
7.2 ARM Cortex-M3 processor
The ARM Cortex-M3 is a general purpose, 32-bit microprocessor, which offers high
performance and very low power consumption. The ARM Cortex-M3 offers many new
features, including a Thumb-2 instruction set, low interrupt latency, hardware divide,
interruptable/continuable multiple load and store instructions, automatic state save and
restore for interrupts, tightly integrated interrupt controller with wakeup interrupt controller,
and multiple core buses capable of simultaneous accesses.
Pipeline techniques are employed so that all parts of the processing and memory systems
can operate continuously. Typically, while one instruction is being executed, its successor
is being decoded, and a third instruction is being fetched from memory.
The ARM Cortex-M3 processor is described in detail in the Cortex-M3 Technical
Reference Manual that can be found on official ARM website.
7.3 On-chip flash program memory
The LPC17xx contain up to 512 kB of on-chip flash memory. A new two-port flash
accelerator maximizes performance for use with the two fast AHB-Lite buses.
7.4 On-chip SRAM
The LPC17xx contain a total of 64 kB on-chip static RAM memory. This includes the main
32 kB SRAM, accessible by the CPU and DMA controller on a higher-speed bus, and two
additional 16 kB each SRAM blocks situated on a separate slave port on the AHB
multilayer matrix.
This architecture allows CPU and DMA accesses to be spread over three separate RAMs
that can be accessed simultaneously.
7.5 Memory Protection Unit (MPU)
The LPC17xx have a Memory Protection Unit (MPU) which can be used to improve the
reliability of an embedded system by protecting critical data within the user application.
LPC1768_67_66_65_64_3
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15 of 65
NXP Semiconductors
LPC1768/67/66/65/64
32-bit ARM Cortex-M3 microcontroller
The MPU allows separating processing tasks by disallowing access to each other's data,
disabling access to memory regions, allowing memory regions to be defined as read-only
and detecting unexpected memory accesses that could potentially break the system.
The MPU separates the memory into distinct regions and implements protection by
preventing disallowed accesses. The MPU supports up to 8 regions each of which can be
divided into 8 subregions. Accesses to memory locations that are not defined in the MPU
regions, or not permitted by the region setting, will cause the Memory Management Fault
exception to take place.
7.6 Memory map
The LPC17xx incorporates several distinct memory regions, shown in the following
figures. Figure 3 shows the overall map of the entire address space from the user
program viewpoint following reset. The interrupt vector area supports address remapping.
The AHB peripheral area is 2 MB in size and is divided to allow for up to 128 peripherals.
The APB peripheral area is 1 MB in size and is divided to allow for up to 64 peripherals.
Each peripheral of either type is allocated 16 kB of space. This allows simplifying the
address decoding for each peripheral.
LPC1768_67_66_65_64_3
Product data sheet
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Rev. 03 — 19 November 2009
16 of 65
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xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
0x400F C000
31
4 GB
LPC1768/67/66/65/64 memory space
0xFFFF FFFF
system control
reserved
30 - 16 reserved
0x400C 0000
QEI
0x400B 8000
14
motor control PWM
0x400B 4000
13
reserved
0x400B 0000
12 repetitive interrupt timer
0x400A C000
11
reserved
AHB peripherals
0x400A 8000
10
I2S(1)
reserved
0x400A 4000
9
reserved
0x400A 0000
8
I2C2
0x4009 C000
7
UART3
0x4009 8000
6
UART2
0x4009 4000
5
timer 3
0x4009 0000
4
timer 2
0x4008 C000
3
DAC(1)
0x4008 8000
2
SSP0
private peripheral bus
127- 4 reserved
0xE000 0000
reserved
0x5020 0000
0x5000 0000
reserved
APB1 peripherals
APB0 peripherals
0x4008 0000
1
GPDMA controller
0
Ethernet controller(2)
32 kB local SRAM (LPC1768/7/6/5)
I-code/D-code
memory space
16 kB local SRAM (LPC1764)
17 of 65
© NXP B.V. 2009. All rights reserved.
+ 256 bytes
256 kB on-chip flash (LPC1766/65)
0 GB
128 kB on-chip flash (LPC1764)
0x4006 0000
0x4005 C000
0x4004 C000
0x4004 4000
16
CAN common(3)
0x4004 0000
0x200A 0000
15
CAN AF registers(3)
0x4003 C000
0x2009 C000
14
CAN AF RAM(3)
0x4003 8000
0x2008 4000
13
ADC
0x4003 4000
0x2008 0000
12
SSP1
0x4003 0000
0x2007 C000
11
pin connect
0x4002 C000
10
GPIO interrupts
0x4002 8000
9
RTC + backup registers
0x4002 4000
0x1FFF 2000
8
SPI
0x4002 0000
0x1FFF 0000
7
reserved
0x4001 C000
0x1000 8000
6
PWM1
0x4001 8000
0x1000 4000
5
reserved
0x4001 4000
4
UART1
0x4001 0000
3
UART0
0x4000 C000
2
timer 1
0x4000 8000
1
0
timer 0
0x4000 4000
WDT
0x4000 0000
0x1000 0000
0x0008 0000
active interrupt vectors
0x4008 0000
0x4004 8000
reserved
512 kB on-chip flash (LPC1768/67)
0x5000 0000
0x0004 0000
0x0002 0000
0x0000 0000
002aad946
32-bit ARM Cortex-M3 microcontroller
reserved
22 - 19 reserved
0x5000 4000
CAN1(3)
reserved
8 kB boot ROM
I2C1
0x5000 8000
17
0x2200 0000
16 kB AHB SRAM0
23
0x5000 C000
CAN2(3)
reserved
16 kB AHB SRAM1 (LPC1768/7/6/5)
31 - 24 reserved
0x5001 0000
18
AHB SRAM bit-band alias addressing
reserved
APB0 peripherals
0x4000 0000
0x2400 0000
0.5 GB
LPC17xx memory map
reserved
0x4010 0000
reserved
(1)LPC1768/67/66/65 only
(2)LPC1768/67/66/64 only
(3)LPC1768/66/65/64 only
Fig 3.
2
0x4200 0000
GPIO
0x0000 0000
USB controller(3)
0x4400 0000
peripheral bit-band alias addressing
1 - 0 reserved
0x0000 0100
3
0x5020 0000
LPC1768/67/66/65/64
Rev. 03 — 19 November 2009
15
0x4008 0000
AHB peripherals
0xE010 0000
0x400B C000
1 GB
NXP Semiconductors
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APB1 peripherals
0x4010 0000
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
7.7 Nested Vectored Interrupt Controller (NVIC)
The NVIC is an integral part of the Cortex-M3. The tight coupling to the CPU allows for low
interrupt latency and efficient processing of late arriving interrupts.
7.7.1 Features
•
•
•
•
•
•
Controls system exceptions and peripheral interrupts
In the LPC17xx, the NVIC supports 33 vectored interrupts
32 programmable interrupt priority levels, with hardware priority level masking
Relocatable vector table
Non-Maskable Interrupt (NMI)
Software interrupt generation
7.7.2 Interrupt sources
Each peripheral device has one interrupt line connected to the NVIC but may have several
interrupt flags. Individual interrupt flags may also represent more than one interrupt
source.
Any pin on Port 0 and Port 2 (total of 42 pins) regardless of the selected function, can be
programmed to generate an interrupt on a rising edge, a falling edge, or both.
7.8 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on-chip peripherals.
Peripherals should be connected to the appropriate pins prior to being activated and prior
to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is
not mapped to a related pin should be considered undefined.
Most pins can also be configured as open-drain outputs or to have a pull-up, pull-down, or
no resistor enabled.
7.9 General purpose DMA controller
The GPDMA is an AMBA AHB compliant peripheral allowing selected peripherals to have
DMA support.
The GPDMA enables peripheral-to-memory, memory-to-peripheral,
peripheral-to-peripheral, and memory-to-memory transactions. The source and
destination areas can each be either a memory region or a peripheral, and can be
accessed through the AHB master. The GPDMA controller allows data transfers between
the USB (LPC1768/66/65/64 only) and Ethernet controllers (LPC1768/67/66/64 only) and
the various on-chip SRAM areas. The supported APB peripherals are SSP0/1, all UARTs,
the I2S-bus interface, the ADC, and the DAC. Two match signals for each timer can be
used to trigger DMA transfers. Note that the I2S-bus interface and the DAC are not
available on the LPC1764.
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7.9.1 Features
• Eight DMA channels. Each channel can support an unidirectional transfer.
• 16 DMA request lines.
• Single DMA and burst DMA request signals. Each peripheral connected to the DMA
Controller can assert either a burst DMA request or a single DMA request. The DMA
burst size is set by programming the DMA Controller.
• Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and
peripheral-to-peripheral transfers are supported.
• Scatter or gather DMA is supported through the use of linked lists. This means that
the source and destination areas do not have to occupy contiguous areas of memory.
• Hardware DMA channel priority.
• AHB slave DMA programming interface. The DMA Controller is programmed by
writing to the DMA control registers over the AHB slave interface.
• One AHB bus master for transferring data. The interface transfers data when a DMA
request goes active.
• 32-bit AHB master bus width.
• Incrementing or non-incrementing addressing for source and destination.
• Programmable DMA burst size. The DMA burst size can be programmed to more
efficiently transfer data.
• Internal four-word FIFO per channel.
• Supports 8, 16, and 32-bit wide transactions.
• Big-endian and little-endian support. The DMA Controller defaults to little-endian
mode on reset.
• An interrupt to the processor can be generated on a DMA completion or when a DMA
error has occurred.
• Raw interrupt status. The DMA error and DMA count raw interrupt status can be read
prior to masking.
7.10 Fast general purpose parallel I/O
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back as well as the current state of the port pins.
LPC17xx use accelerated GPIO functions:
• GPIO registers are accessed through the AHB multilayer bus so that the fastest
possible I/O timing can be achieved.
• Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
•
•
•
•
All GPIO registers are byte and half-word addressable.
Entire port value can be written in one instruction.
Support for Cortex-M3 bit banding.
Support for use with the GPDMA controller.
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Additionally, any pin on Port 0 and Port 2 (total of 42 pins) providing a digital function can
be programmed to generate an interrupt on a rising edge, a falling edge, or both. The
edge detection is asynchronous, so it may operate when clocks are not present such as
during Power-down mode. Each enabled interrupt can be used to wake up the chip from
Power-down mode.
7.10.1 Features
• Bit level set and clear registers allow a single instruction to set or clear any number of
bits in one port.
• Direction control of individual bits.
• All I/O default to inputs after reset.
• Pull-up/pull-down resistor configuration and open-drain configuration can be
programmed through the pin connect block for each GPIO pin.
7.11 Ethernet (LPC1768/67/66/64 only)
Remark: The Ethernet controller is not available for part LPC1765.
The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC
designed to provide optimized performance through the use of DMA hardware
acceleration. Features include a generous suite of control registers, half or full duplex
operation, flow control, control frames, hardware acceleration for transmit retry, receive
packet filtering and wake-up on LAN activity. Automatic frame transmission and reception
with scatter-gather DMA off-loads many operations from the CPU.
The Ethernet block and the CPU share the ARM Cortex-M3 D-code and system bus
through the AHB-multilayer matrix to access the various on-chip SRAM blocks for
Ethernet data, control, and status information.
The Ethernet block interfaces between an off-chip Ethernet PHY using the Reduced MII
(RMII) protocol and the on-chip Media Independent Interface Management (MIIM) serial
bus.
The Ethernet block supports bus clock rates of up to 100 MHz.
7.11.1 Features
• Ethernet standards support:
– Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX,
100 Base-FX, and 100 Base-T4.
– Fully compliant with IEEE standard 802.3.
– Fully compliant with 802.3x full duplex flow control and half duplex back pressure.
– Flexible transmit and receive frame options.
– Virtual Local Area Network (VLAN) frame support.
• Memory management:
– Independent transmit and receive buffers memory mapped to shared SRAM.
– DMA managers with scatter/gather DMA and arrays of frame descriptors.
– Memory traffic optimized by buffering and pre-fetching.
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• Enhanced Ethernet features:
– Receive filtering.
– Multicast and broadcast frame support for both transmit and receive.
– Optional automatic Frame Check Sequence (FCS) insertion with Cyclic
Redundancy Check (CRC) for transmit.
– Selectable automatic transmit frame padding.
– Over-length frame support for both transmit and receive allows any length frames.
– Promiscuous receive mode.
– Automatic collision back-off and frame retransmission.
– Includes power management by clock switching.
– Wake-on-LAN power management support allows system wake-up: using the
receive filters or a magic frame detection filter.
• Physical interface:
– Attachment of external PHY chip through standard RMII interface.
– PHY register access is available via the MIIM interface.
7.12 USB interface (LPC1768/66/65/64 only)
The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a
host and one or more (up to 127) peripherals. The host controller allocates the USB
bandwidth to attached devices through a token-based protocol. The bus supports hot
plugging and dynamic configuration of the devices. All transactions are initiated by the
host controller.
The USB interface includes a device, Host, and OTG controller with on-chip PHY for
device and Host functions. The OTG switching protocol is supported through the use of an
external controller. Details on typical USB interfacing solutions can be found in
Section 14.1.
Remark: The LPC1764 includes a device controller only.
7.12.1 USB device controller
The device controller enables 12 Mbit/s data exchange with a USB Host controller. It
consists of a register interface, serial interface engine, endpoint buffer memory, and a
DMA controller. The serial interface engine decodes the USB data stream and writes data
to the appropriate endpoint buffer. The status of a completed USB transfer or error
condition is indicated via status registers. An interrupt is also generated if enabled. When
enabled, the DMA controller transfers data between the endpoint buffer and the on-chip
SRAM.
7.12.1.1
Features
•
•
•
•
Fully compliant with USB 2.0 specification (full speed).
Supports 32 physical (16 logical) endpoints with a 4 kB endpoint buffer RAM.
Supports Control, Bulk, Interrupt and Isochronous endpoints.
Scalable realization of endpoints at run time.
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• Endpoint Maximum packet size selection (up to USB maximum specification) by
software at run time.
• Supports SoftConnect and GoodLink features.
• While USB is in the Suspend mode, the LPC1768/66/65/64 can enter one of the
reduced power modes and wake up on USB activity.
• Supports DMA transfers with all on-chip SRAM blocks on all non-control endpoints.
• Allows dynamic switching between CPU-controlled slave and DMA modes.
• Double buffer implementation for Bulk and Isochronous endpoints.
7.12.2 USB host controller (LPC1768/66/65 only)
The host controller enables full- and low-speed data exchange with USB devices attached
to the bus. It consists of a register interface, a serial interface engine, and a DMA
controller. The register interface complies with the OHCI specification.
7.12.2.1
Features
• OHCI compliant.
• One downstream port.
• Supports port power switching.
7.12.3 USB OTG controller (LPC1768/66/65 only)
USB OTG is a supplement to the USB 2.0 specification that augments the capability of
existing mobile devices and USB peripherals by adding host functionality for connection to
USB peripherals.
The OTG Controller integrates the host controller, device controller, and a master-only
I2C-bus interface to implement OTG dual-role device functionality. The dedicated I2C-bus
interface controls an external OTG transceiver.
7.12.3.1
Features
• Fully compliant with On-The-Go supplement to the USB 2.0 Specification, Revision
1.0a.
• Hardware support for Host Negotiation Protocol (HNP).
• Includes a programmable timer required for HNP and Session Request Protocol
(SRP).
• Supports any OTG transceiver compliant with the OTG Transceiver Specification
(CEA-2011), Rev. 1.0.
7.13 CAN controller and acceptance filters (LPC1768/66/65/64 only)
The Controller Area Network (CAN) is a serial communications protocol which efficiently
supports distributed real-time control with a very high level of security. Its domain of
application ranges from high-speed networks to low cost multiplex wiring.
The CAN block is intended to support multiple CAN buses simultaneously, allowing the
device to be used as a gateway, switch, or router among a number of CAN buses in
industrial or automotive applications.
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7.13.1 Features
•
•
•
•
•
Two CAN controllers and buses.
Data rates to 1 Mbit/s on each bus.
32-bit register and RAM access.
Compatible with CAN specification 2.0B, ISO 11898-1.
Global Acceptance Filter recognizes standard (11-bit) and extended-frame (29-bit)
receive identifiers for all CAN buses.
• Acceptance Filter can provide FullCAN-style automatic reception for selected
Standard Identifiers.
• FullCAN messages can generate interrupts.
7.14 12-bit ADC
The LPC17xx contain a single 12-bit successive approximation ADC with eight channels
and DMA support.
7.14.1 Features
•
•
•
•
•
•
•
•
•
•
12-bit successive approximation ADC.
Input multiplexing among 8 pins.
Power-down mode.
Measurement range VREFN to VREFP.
12-bit conversion rate: 200 kHz.
Individual channels can be selected for conversion.
Burst conversion mode for single or multiple inputs.
Optional conversion on transition of input pin or Timer Match signal.
Individual result registers for each ADC channel to reduce interrupt overhead.
DMA support.
7.15 10-bit DAC (LPC1768/67/66/65 only)
The DAC allows to generate a variable analog output. The maximum output value of the
DAC is VREFP.
7.15.1 Features
•
•
•
•
•
•
•
10-bit DAC
Resistor string architecture
Buffered output
Power-down mode
Selectable output drive
Dedicated conversion timer
DMA support
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7.16 UARTs
The LPC17xx each contain four UARTs. In addition to standard transmit and receive data
lines, UART1 also provides a full modem control handshake interface and support for
RS-485/9-bit mode allowing both software address detection and automatic address
detection using 9-bit mode.
The UARTs include a fractional baud rate generator. Standard baud rates such as
115 200 Bd can be achieved with any crystal frequency above 2 MHz.
7.16.1 Features
•
•
•
•
•
Maximum UART data bit rate of 6.25 MBit/s.
16 B Receive and Transmit FIFOs.
Register locations conform to 16C550 industry standard.
Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Auto baud capabilities and FIFO control mechanism that enables software flow
control implementation.
• UART1 equipped with standard modem interface signals. This module also provides
full support for hardware flow control (auto-CTS/RTS).
• Support for RS-485/9-bit/EIA-485 mode (UART1).
• UART3 includes an IrDA mode to support infrared communication.
• All UARTs have DMA support.
7.17 SPI serial I/O controller
The LPC17xx contain one SPI controller. SPI is a full duplex serial interface designed to
handle multiple masters and slaves connected to a given bus. Only a single master and a
single slave can communicate on the interface during a given data transfer. During a data
transfer the master always sends 8 bits to 16 bits of data to the slave, and the slave
always sends 8 bits to 16 bits of data to the master.
7.17.1 Features
•
•
•
•
•
•
Maximum SPI data bit rate of 12.5 Mbit/s
Compliant with SPI specification
Synchronous, serial, full duplex communication
Combined SPI master and slave
Maximum data bit rate of one eighth of the input clock rate
8 bits to 16 bits per transfer
7.18 SSP serial I/O controller
The LPC17xx contain two SSP controllers. The SSP controller is capable of operation on
a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and slaves on the
bus. Only a single master and a single slave can communicate on the bus during a given
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data transfer. The SSP supports full duplex transfers, with frames of 4 bits to 16 bits of
data flowing from the master to the slave and from the slave to the master. In practice,
often only one of these data flows carries meaningful data.
7.18.1 Features
• Maximum SSP speed of 50 Mbit/s (master) or 8 Mbit/s (slave)
• Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National
Semiconductor Microwire buses
•
•
•
•
•
Synchronous serial communication
Master or slave operation
8-frame FIFOs for both transmit and receive
4-bit to 16-bit frame
DMA transfers supported by GPDMA
7.19 I2C-bus serial I/O controllers
The LPC17xx each contain three I2C-bus controllers.
The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial Clock line
(SCL) and a Serial Data line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the
capability to both receive and send information (such as memory). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be
controlled by more than one bus master connected to it.
7.19.1 Features
• I2C0 is a standard I2C compliant bus interface with open-drain pins. I2C0 also
supports Fast mode plus with bit rates up to 1 Mbit/s.
•
•
•
•
•
•
I2C1 and I2C2 use standard I/O pins with bit rates of up to 400 kbit/s (Fast I2C-bus).
Easy to configure as master, slave, or master/slave.
Programmable clocks allow versatile rate control.
Bidirectional data transfer between masters and slaves.
Multi-master bus (no central master).
Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
• All I2C-bus controllers support multiple address recognition and a bus monitor mode.
7.20 I2S-bus serial I/O controllers
Remark: The I2S-bus is not available on the LPC1764.
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The I2S-bus provides a standard communication interface for digital audio applications.
The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line,
and one word select signal. The basic I2S-bus connection has one master, which is
always the master, and one slave. The I2S-bus interface on the LPC1768/67/66/65
provides a separate transmit and receive channel, each of which can operate as either a
master or a slave.
7.20.1 Features
• The interface has separate input/output channels each of which can operate in master
or slave mode.
• Capable of handling 8-bit, 16-bit, and 32-bit word sizes.
• Mono and stereo audio data supported.
• The sampling frequency can range from 16 kHz to 96 kHz (16, 22.05, 32, 44.1, 48,
96) kHz.
• Support for an audio master clock.
• Configurable word select period in master mode (separately for I2S-bus input and
output).
• Two 8-word FIFO data buffers are provided, one for transmit and one for receive.
• Generates interrupt requests when buffer levels cross a programmable boundary.
• Two DMA requests, controlled by programmable buffer levels. These are connected
to the GPDMA block.
• Controls include reset, stop and mute options separately for I2S-bus input and I2S-bus
output.
7.21 General purpose 32-bit timers/external event counters
The LPC17xx include four 32-bit timer/counters. The timer/counter is designed to count
cycles of the system derived clock or an externally-supplied clock. It can optionally
generate interrupts, generate timed DMA requests, or perform other actions at specified
timer values, based on four match registers. Each timer/counter also includes two capture
inputs to trap the timer value when an input signal transitions, optionally generating an
interrupt.
7.21.1 Features
• A 32-bit timer/counter with a programmable 32-bit prescaler.
• Counter or timer operation.
• Two 32-bit capture channels per timer, that can take a snapshot of the timer value
when an input signal transitions. A capture event may also generate an interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Up to four external outputs corresponding to match registers, with the following
capabilities:
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– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
• Up to two match registers can be used to generate timed DMA requests.
7.22 Pulse width modulator
The PWM is based on the standard Timer block and inherits all of its features, although
only the PWM function is pinned out on the LPC17xx. The Timer is designed to count
cycles of the system derived clock and optionally switch pins, generate interrupts or
perform other actions when specified timer values occur, based on seven match registers.
The PWM function is in addition to these features, and is based on match register events.
The ability to separately control rising and falling edge locations allows the PWM to be
used for more applications. For instance, multi-phase motor control typically requires
three non-overlapping PWM outputs with individual control of all three pulse widths and
positions.
Two match registers can be used to provide a single edge controlled PWM output. One
match register (PWMMR0) controls the PWM cycle rate, by resetting the count upon
match. The other match register controls the PWM edge position. Additional single edge
controlled PWM outputs require only one match register each, since the repetition rate is
the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a
rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs.
Three match registers can be used to provide a PWM output with both edges controlled.
Again, the PWMMR0 match register controls the PWM cycle rate. The other match
registers control the two PWM edge positions. Additional double edge controlled PWM
outputs require only two match registers each, since the repetition rate is the same for all
PWM outputs.
With double edge controlled PWM outputs, specific match registers control the rising and
falling edge of the output. This allows both positive going PWM pulses (when the rising
edge occurs prior to the falling edge), and negative going PWM pulses (when the falling
edge occurs prior to the rising edge).
7.22.1 Features
• One PWM block with Counter or Timer operation (may use the peripheral clock or one
of the capture inputs as the clock source).
• Seven match registers allow up to 6 single edge controlled or 3 double edge
controlled PWM outputs, or a mix of both types. The match registers also allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
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• Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go high at the beginning of each cycle unless the
output is a constant low. Double edge controlled PWM outputs can have either edge
occur at any position within a cycle. This allows for both positive going and negative
going pulses.
• Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will
occur at the same repetition rate.
• Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
• Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must ‘release’ new match values before they can become
effective.
• May be used as a standard 32-bit timer/counter with a programmable 32-bit prescaler
if the PWM mode is not enabled.
7.23 Motor control PWM
The motor control PWM is a specialized PWM supporting 3-phase motors and other
combinations. Feedback inputs are provided to automatically sense rotor position and use
that information to ramp speed up or down. An abort input is also provided that causes the
PWM to immediately release all motor drive outputs. At the same time, the motor control
PWM is highly configurable for other generalized timing, counting, capture, and compare
applications.
7.24 Quadrature Encoder Interface (QEI)
A quadrature encoder, also known as a 2-channel incremental encoder, converts angular
displacement into two pulse signals. By monitoring both the number of pulses and the
relative phase of the two signals, the user can track the position, direction of rotation, and
velocity. In addition, a third channel, or index signal, can be used to reset the position
counter. The quadrature encoder interface decodes the digital pulses from a quadrature
encoder wheel to integrate position over time and determine direction of rotation. In
addition, the QEI can capture the velocity of the encoder wheel.
7.24.1 Features
•
•
•
•
•
•
•
•
•
•
Tracks encoder position.
Increments/decrements depending on direction.
Programmable for 2× or 4× position counting.
Velocity capture using built-in timer.
Velocity compare function with “less than” interrupt.
Uses 32-bit registers for position and velocity.
Three position compare registers with interrupts.
Index counter for revolution counting.
Index compare register with interrupts.
Can combine index and position interrupts to produce an interrupt for whole and
partial revolution displacement.
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• Digital filter with programmable delays for encoder input signals.
• Can accept decoded signal inputs (clk and direction).
• Connected to APB.
7.25 Repetitive Interrupt (RI) timer
The repetitive interrupt timer provides a free-running 32-bit counter which is compared to
a selectable value, generating an interrupt when a match occurs. Any bits of the
timer/compare can be masked such that they do not contribute to the match detection.
The repetitive interrupt timer can be used to create an interrupt that repeats at
predetermined intervals.
7.25.1 Features
• 32-bit counter running from PCLK. Counter can be free-running or be reset by a
generated interrupt.
• 32-bit compare value.
• 32-bit compare mask. An interrupt is generated when the counter value equals the
compare value, after masking. This allows for combinations not possible with a simple
compare.
7.26 ARM Cortex-M3 system tick timer
The ARM Cortex-M3 includes a system tick timer (SYSTICK) that is intended to generate
a dedicated SYSTICK exception at a 10 ms interval. In the LPC17xx, this timer can be
clocked from the internal AHB clock or from a device pin.
7.27 Watchdog timer
The purpose of the watchdog is to reset the microcontroller within a reasonable amount of
time if it enters an erroneous state. When enabled, the watchdog will generate a system
reset if the user program fails to ‘feed’ (or reload) the watchdog within a predetermined
amount of time.
7.27.1 Features
• Internally resets chip if not periodically reloaded.
• Debug mode.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
•
•
•
•
Incorrect/Incomplete feed sequence causes reset/interrupt if enabled.
Flag to indicate watchdog reset.
Programmable 32-bit timer with internal prescaler.
Selectable time period from (Tcy(WDCLK) × 256 × 4) to (Tcy(WDCLK) × 232 × 4) in
multiples of Tcy(WDCLK) × 4.
• The Watchdog Clock (WDCLK) source can be selected from the Internal RC (IRC)
oscillator, the RTC oscillator, or the APB peripheral clock. This gives a wide range of
potential timing choices of Watchdog operation under different power reduction
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conditions. It also provides the ability to run the WDT from an entirely internal source
that is not dependent on an external crystal and its associated components and wiring
for increased reliability.
• Includes lock/safe feature.
7.28 RTC and backup registers
The RTC is a set of counters for measuring time when system power is on, and optionally
when it is off. The RTC on the LPC17xx is designed to have extremely low power
consumption, i.e. less than 1 μA. The RTC will typically run from the main chip power
supply, conserving battery power while the rest of the device is powered up. When
operating from a battery, the RTC will continue working down to 2.1 V. Battery power can
be provided from a standard 3 V Lithium button cell.
An ultra-low power 32 kHz oscillator will provide a 1 Hz clock to the time counting portion
of the RTC, moving most of the power consumption out of the time counting function.
The RTC includes a calibration mechanism to allow fine-tuning the count rate in a way
that will provide less than 1 second per day error when operated at a constant voltage and
temperature. A clock output function (see Section 7.29.4) makes measuring the oscillator
rate easy and accurate.
The RTC contains a small set of backup registers (20 bytes) for holding data while the
main part of the LPC17xx is powered off.
The RTC includes an alarm function that can wake up the LPC17xx from all reduced
power modes with a time resolution of 1 s.
7.28.1 Features
• Measures the passage of time to maintain a calendar and clock.
• Ultra low power design to support battery powered systems.
• Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and
Day of Year.
•
•
•
•
Dedicated power supply pin can be connected to a battery or to the main 3.3 V.
Periodic interrupts can be generated from increments of any field of the time registers.
Backup registers (20 bytes) powered by VBAT.
RTC power supply is isolated from the rest of the chip.
7.29 Clocking and power control
7.29.1 Crystal oscillators
The LPC17xx include three independent oscillators. These are the main oscillator, the IRC
oscillator, and the RTC oscillator. Each oscillator can be used for more than one purpose
as required in a particular application. Any of the three clock sources can be chosen by
software to drive the main PLL and ultimately the CPU.
Following reset, the LPC17xx will operate from the Internal RC oscillator until switched by
software. This allows systems to operate without any external crystal and the bootloader
code to operate at a known frequency.
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See Figure 4 for an overview of the LPC17xx clock generation.
LPC17xx
usbclk
(48 MHz)
USB PLL
MAIN
OSCILLATOR
USB
CLOCK
DIVIDER
MAIN PLL
pllclk
system
clock
select
(CLKSRCSEL)
INTERNAL
RC
OSCILLATOR
USB BLOCK
USB clock config USB PLL enable
(USBCLKCFG)
cclk
CPU
CLOCK
DIVIDER
main PLL enable
CPU clock config
(CCLKCFG)
ARM
CORTEX-M3
ETHERNET
BLOCK
DMA
GPIO
NVIC
WATCHDOG
TIMER
CCLK/8
32 kHz
RTC
OSCILLATOR
PERIPHERAL
CLOCK
GENERATOR
pclkWDT
rtclk = 1Hz
REAL-TIME
CLOCK
CCLK/6
CCLK/4
CCLK/2
APB peripherals
CCLK
002aad947
Fig 4.
LPC17xx clocking generation block diagram
7.29.1.1
Internal RC oscillator
The IRC may be used as the clock source for the WDT, and/or as the clock that drives the
PLL and subsequently the CPU. The nominal IRC frequency is 4 MHz. The IRC is
trimmed to 1 % accuracy over the entire voltage and temperature range.
Upon power-up or any chip reset, the LPC17xx use the IRC as the clock source. Software
may later switch to one of the other available clock sources.
7.29.1.2
Main oscillator
The main oscillator can be used as the clock source for the CPU, with or without using the
PLL. The main oscillator also provides the clock source for the dedicated USB PLL.
The main oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be
boosted to a higher frequency, up to the maximum CPU operating frequency, by the main
PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock
frequency is referred to as CCLK elsewhere in this document. The frequencies of
PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The
clock frequency for each peripheral can be selected individually and is referred to as
PCLK. Refer to Section 7.29.2 for additional information.
7.29.1.3
RTC oscillator
The RTC oscillator can be used as the clock source for the RTC block, the main PLL,
and/or the CPU.
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7.29.2 Main PLL (PLL0)
The PLL0 accepts an input clock frequency in the range of 32 kHz to 25 MHz. The input
frequency is multiplied up to a high frequency, then divided down to provide the actual
clock used by the CPU and/or the USB block.
The PLL0 input, in the range of 32 kHz to 25 MHz, may initially be divided down by a
value ‘N’, which may be in the range of 1 to 256. This input division provides a wide range
of output frequencies from the same input frequency.
Following the PLL0 input divider is the PLL0 multiplier. This can multiply the input divider
output through the use of a Current Controlled Oscillator (CCO) by a value ‘M’, in the
range of 1 through 32768. The resulting frequency must be in the range of 275 MHz to
550 MHz. The multiplier works by dividing the CCO output by the value of M, then using a
phase-frequency detector to compare the divided CCO output to the multiplier input. The
error value is used to adjust the CCO frequency.
The PLL0 is turned off and bypassed following a chip Reset and by entering Power-down
mode. PLL0 is enabled by software only. The program must configure and activate the
PLL0, wait for the PLL0 to lock, and then connect to the PLL0 as a clock source.
7.29.3 USB PLL (PLL1)
The LPC17xx contain a second, dedicated USB PLL1 to provide clocking for the USB
interface.
The PLL1 receives its clock input from the main oscillator only and provides a fixed
48 MHz clock to the USB block only. The PLL1 is disabled and powered off on reset. If the
PLL1 is left disabled, the USB clock will be supplied by the 48 MHz clock from the main
PLL0.
The PLL1 accepts an input clock frequency in the range of 10 MHz to 25 MHz only. The
input frequency is multiplied up the range of 48 MHz for the USB clock using a Current
Controlled Oscillators (CCO). It is insured that the PLL1 output has a 50 % duty cycle.
7.29.4 RTC clock output
The LPC17xx feature a clock output function intended for synchronizing with external
devices and for use during system development to allow checking the internal clocks
CCLK, IRC clock, main crystal, RTC clock, and USB clock in the outside world. The RTC
clock output allows tuning the RTC frequency without probing the pin, which would distort
the results.
7.29.5 Wake-up timer
The LPC17xx begin operation at power-up and when awakened from Power-down mode
by using the 4 MHz IRC oscillator as the clock source. This allows chip operation to
resume quickly. If the main oscillator or the PLL is needed by the application, software will
need to enable these features and wait for them to stabilize before they are used as a
clock source.
When the main oscillator is initially activated, the wake-up timer allows software to ensure
that the main oscillator is fully functional before the processor uses it as a clock source
and starts to execute instructions. This is important at power on, all types of Reset, and
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whenever any of the aforementioned functions are turned off for any reason. Since the
oscillator and other functions are turned off during Power-down mode, any wake-up of the
processor from Power-down mode makes use of the wake-up Timer.
The Wake-up Timer monitors the crystal oscillator to check whether it is safe to begin
code execution. When power is applied to the chip, or when some event caused the chip
to exit Power-down mode, some time is required for the oscillator to produce a signal of
sufficient amplitude to drive the clock logic. The amount of time depends on many factors,
including the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its
electrical characteristics (if a quartz crystal is used), as well as any other external circuitry
(e.g., capacitors), and the characteristics of the oscillator itself under the existing ambient
conditions.
7.29.6 Power control
The LPC17xx support a variety of power control features. There are four special modes of
processor power reduction: Sleep mode, Deep-sleep mode, Power-down mode, and
Deep power-down mode. The CPU clock rate may also be controlled as needed by
changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider
value. This allows a trade-off of power versus processing speed based on application
requirements. In addition, Peripheral Power Control allows shutting down the clocks to
individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all
dynamic power use in any peripherals that are not required for the application. Each of the
peripherals has its own clock divider which provides even better power control.
Integrated PMU (Power Management Unit) automatically adjust internal regulators to
minimize power consumption during Sleep, Deep sleep, Power-down, and Deep
power-down modes.
The LPC17xx also implement a separate power domain to allow turning off power to the
bulk of the device while maintaining operation of the RTC and a small set of registers for
storing data during any of the power-down modes.
7.29.6.1
Sleep mode
When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep
mode does not need any special sequence but re-enabling the clock to the ARM core.
In Sleep mode, execution of instructions is suspended until either a Reset or interrupt
occurs. Peripheral functions continue operation during Sleep mode and may generate
interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic
power used by the processor itself, memory systems and related controllers, and internal
buses.
7.29.6.2
Deep-sleep mode
In Deep-sleep mode, the oscillator is shut down and the chip receives no internal clocks.
The processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Deep-sleep mode and the logic levels of chip pins remain static.
The output of the IRC is disabled but the IRC is not powered down for a fast wake-up later.
The RTC oscillator is not stopped because the RTC interrupts may be used as the
wake-up source. The PLL is automatically turned off and disconnected. The CCLK and
USB clock dividers automatically get reset to zero.
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The Deep-sleep mode can be terminated and normal operation resumed by either a
Reset or certain specific interrupts that are able to function without clocks. Since all
dynamic operation of the chip is suspended, Deep-sleep mode reduces chip power
consumption to a very low value. Power to the flash memory is left on in Deep-sleep
mode, allowing a very quick wake-up.
On wake-up from Deep-sleep mode, the code execution and peripherals activities will
resume after 4 cycles expire if the IRC was used before entering Deep-sleep mode. If the
main external oscillator was used, the code execution will resume when 4096 cycles
expire. PLL and clock dividers need to be reconfigured accordingly.
7.29.6.3
Power-down mode
Power-down mode does everything that Deep-sleep mode does, but also turns off the
power to the IRC oscillator and the flash memory. This saves more power but requires
waiting for resumption of flash operation before execution of code or data access in the
flash memory can be accomplished.
On the wake-up of Power-down mode, if the IRC was used before entering Power-down
mode, it will take IRC 60 μs to start-up. After this 4 IRC cycles will expire before the code
execution can then be resumed if the code was running from SRAM. In the meantime, the
flash wake-up timer then counts 4 MHz IRC clock cycles to make the 100 μs flash start-up
time. When it times out, access to the flash will be allowed. Users need to reconfigure the
PLL and clock dividers accordingly.
7.29.6.4
Deep power-down mode
The Deep power-down mode can only be entered from the RTC block. In Deep
power-down mode, power is shut off to the entire chip with the exception of the RTC
module and the RESET pin.
The LPC17xx can wake up from Deep power-down mode via the RESET pin or an alarm
match event of the RTC.
7.29.6.5
Wakeup interrupt controller
The Wakeup Interrupt Controller (WIC) allows the CPU to automatically wake up from any
enabled priority interrupt that can occur while the clocks are stopped in Deep sleep,
Power-down, and Deep power-down modes.
The WIC works in connection with the Nested Vectored Interrupt Controller (NVIC). When
the CPU enters Deep sleep, Power-down, or Deep power-down mode, the NVIC sends a
mask of the current interrupt situation to the WIC.This mask includes all of the interrupts
that are both enabled and of sufficient priority to be serviced immediately. With this
information, the WIC simply notices when one of the interrupts has occurred and then it
wakes up the CPU.
The WIC eliminates the need to periodically wake up the CPU and poll the interrupts
resulting in additional power savings.
7.29.7 Peripheral power control
A Power Control for Peripherals feature allows individual peripherals to be turned off if
they are not needed in the application, resulting in additional power savings.
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7.29.8 Power domains
The LPC17xx provide two independent power domains that allow the bulk of the device to
have power removed while maintaining operation of the RTC and the backup Registers.
On the LPC17xx, I/O pads are powered by the 3.3 V (VDD(3V3)) pins, while the
VDD(REG)(3V3) pin powers the on-chip voltage regulator which in turn provides power to the
CPU and most of the peripherals.
Depending on the LPC17xx application, a design can use two power options to manage
power consumption.
The first option assumes that power consumption is not a concern and the design ties the
VDD(3V3) and VDD(REG)(3V3) pins together. This approach requires only one 3.3 V power
supply for both pads, the CPU, and peripherals. While this solution is simple, it does not
support powering down the I/O pad ring “on the fly” while keeping the CPU and
peripherals alive.
The second option uses two power supplies; a 3.3 V supply for the I/O pads (VDD(3V3)) and
a dedicated 3.3 V supply for the CPU (VDD(REG)(3V3)). Having the on-chip voltage regulator
powered independently from the I/O pad ring enables shutting down of the I/O pad power
supply “on the fly”, while the CPU and peripherals stay active.
The VBAT pin supplies power only to the RTC domain. The RTC requires a minimum of
power to operate, which can be supplied by an external battery. The device core power
(VDD(REG)(3V3)) is used to operate the RTC whenever VDD(REG)(3V3) is present. Therefore,
there is no power drain from the RTC battery when VDD(REG)(3V3) is available.
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LPC17xx
VDD(3V3)
to I/O pads
to core
VSS
3.3 V REGULATOR
to memories,
peripherals,
oscillators,
PLLs
VDD(REG)(3V3)
MAIN POWER DOMAIN
VBAT
POWER
SELECTOR
ULTRA-LOW
POWER
REGULATOR
BACKUP REGISTERS
RTCX1
RTCX2
32 kHz
OSCILLATOR
REAL-TIME CLOCK
RTC POWER DOMAIN
DAC
VDDA
VREFP
ADC
VREFN
VSSA
ADC POWER DOMAIN
002aad978
Fig 5.
Power distribution
7.30 System control
7.30.1 Reset
Reset has four sources on the LPC17xx: the RESET pin, the Watchdog reset, power-on
reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a Schmitt
trigger input pin. Assertion of chip Reset by any source, once the operating voltage attains
a usable level, starts the Wake-up timer (see description in Section 7.29.5), causing reset
to remain asserted until the external Reset is de-asserted, the oscillator is running, a fixed
number of clocks have passed, and the flash controller has completed its initialization.
When the internal Reset is removed, the processor begins executing at address 0, which
is initially the Reset vector mapped from the Boot Block. At that point, all of the processor
and peripheral registers have been initialized to predetermined values.
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7.30.2 Brownout detection
The LPC17xx include 2-stage monitoring of the voltage on the VDD(REG)(3V3) pins. If this
voltage falls below 2.95 V, the BOD asserts an interrupt signal to the Vectored Interrupt
Controller. This signal can be enabled for interrupt in the Interrupt Enable Register in the
NVIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading
a dedicated status register.
The second stage of low-voltage detection asserts reset to inactivate the LPC17xx when
the voltage on the VDD(REG)(3V3) pins falls below 2.65 V. This reset prevents alteration of
the flash as operation of the various elements of the chip would otherwise become
unreliable due to low voltage. The BOD circuit maintains this reset down below 1 V, at
which point the power-on reset circuitry maintains the overall reset.
Both the 2.95 V and 2.65 V thresholds include some hysteresis. In normal operation, this
hysteresis allows the 2.95 V detection to reliably interrupt, or a regularly executed event
loop to sense the condition.
7.30.3 Code security (Code Read Protection - CRP)
This feature of the LPC17xx allows user to enable different levels of security in the system
so that access to the on-chip flash and use of the JTAG and ISP can be restricted. When
needed, CRP is invoked by programming a specific pattern into a dedicated flash location.
IAP commands are not affected by the CRP.
There are three levels of the Code Read Protection.
CRP1 disables access to chip via the JTAG and allows partial flash update (excluding
flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is
required and flash field updates are needed but all sectors can not be erased.
CRP2 disables access to chip via the JTAG and only allows full flash erase and update
using a reduced set of the ISP commands.
Running an application with level CRP3 selected fully disables any access to chip via the
JTAG pins and the ISP. This mode effectively disables ISP override using P2[10] pin, too.
It is up to the user’s application to provide (if needed) flash update mechanism using IAP
calls or call reinvoke ISP command to enable flash update via UART0.
CAUTION
If level three Code Read Protection (CRP3) is selected, no future factory testing can be
performed on the device.
7.30.4 APB interface
The APB peripherals are split into two separate APB buses in order to distribute the bus
bandwidth and thereby reducing stalls caused by contention between the CPU and the
GPDMA controller.
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7.30.5 AHB multilayer matrix
The LPC17xx use an AHB multilayer matrix. This matrix connects the instruction (I-code)
and data (D-code) CPU buses of the ARM Cortex-M3 to the flash memory, the main
(32 kB) static RAM, and the Boot ROM. The GPDMA can also access all of these
memories. The peripheral DMA controllers, Ethernet, and USB can access all SRAM
blocks. Additionally, the matrix connects the CPU system bus and all of the DMA
controllers to the various peripheral functions.
7.30.6 External interrupt inputs
The LPC17xx include up to 46 edge sensitive interrupt inputs combined with up to four
level sensitive external interrupt inputs as selectable pin functions. The external interrupt
inputs can optionally be used to wake up the processor from Power-down mode.
7.30.7 Memory mapping control
The Cortex-M3 incorporates a mechanism that allows remapping the interrupt vector table
to alternate locations in the memory map. This is controlled via the Vector Table Offset
Register contained in the NVIC.
The vector table may be located anywhere within the bottom 1 GB of Cortex-M3 address
space. The vector table must be located on a 128 word (512 byte) boundary because the
NVIC on the LPC17xx is configured for 128 total interrupts.
7.31 Emulation and debugging
Debug and trace functions are integrated into the ARM Cortex-M3. Serial wire debug and
trace functions are supported in addition to a standard JTAG debug and parallel trace
functions. The ARM Cortex-M3 is configured to support up to eight breakpoints and four
watch points.
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8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
VDD(3V3)
supply voltage (3.3 V)
core and external
rail
2.4
3.6
V
VDD(REG)(3V3)
regulator supply voltage (3.3 V)
2.4
3.6
V
VDDA
analog 3.3 V pad supply voltage
−0.5
+4.6
V
Vi(VBAT)
input voltage on pin VBAT
−0.5
+4.6
V
Vi(VREFP)
input voltage on pin VREFP
−0.5
+4.6
V
VIA
analog input voltage
on ADC related
pins
−0.5
+5.1
V
VI
input voltage
5 V tolerant I/O
pins; only valid
when the VDD(3V3)
supply voltage is
present
[2]
−0.5
+5.5
V
[2][3]
−0.5
VDD(3V3) +
0.5
V
for the RTC
other I/O pins
IDD
supply current
per supply pin
[4]
-
100
mA
[4]
-
100
mA
-
100
mA
−65
+150
°C
-
1.5
W
−4 000
+4 000
V
ISS
ground current
per ground pin
Ilatch
I/O latch-up current
−(0.5VDD(3V3)) < VI
< (1.5VDD(3V3));
Tstg
storage temperature
Ptot(pack)
total power dissipation (per package)
based on package
heat transfer, not
device power
consumption
VESD
electrostatic discharge voltage
human body
model; all pins
Tj < 125 °C
[1]
[5]
[6]
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Including voltage on outputs in 3-state mode.
[3]
Not to exceed 4.6 V.
[4]
The peak current is limited to 25 times the corresponding maximum current.
[5]
Dependent on package type.
[6]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
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9. Thermal characteristics
The average chip junction temperature, Tj (°C), can be calculated using the following
equation:
T j = T amb + ( P D × R th ( j – a ) )
(1)
• Tamb = ambient temperature (°C),
• Rth(j-a) = the package junction-to-ambient thermal resistance (°C/W)
• PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 5.
Thermal characteristics
VDD = 2.4 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified;
Symbol
Parameter
Tj(max)
maximum junction
temperature
Conditions
LPC1768_67_66_65_64_3
Product data sheet
Min
Typ
Max
Unit
-
-
125
°C
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10. Static characteristics
Table 6.
Static characteristics
Tamb = −40 °C to +85 °C, unless otherwise specified.
Parameter
Conditions
Min
Typ[1]
Max
Unit
VDD(3V3)
supply voltage (3.3 V)
core and external rail
2.4
3.3
3.6
V
VDD(REG)(3V3)
regulator supply voltage
(3.3 V)
2.4
3.3
3.6
V
VDDA
analog 3.3 V pad supply
voltage
2.7
3.3
3.6
V
Vi(VBAT)
input voltage on pin
VBAT
2.1
3.3
3.6
V
Vi(VREFP)
input voltage on pin
VREFP
2.7
3.3
VDDA
V
IDD(REG)(3V3)
regulator supply current active mode; code
(3.3 V)
while(1){}
Symbol
Supply pins
[2]
executed from flash; all
peripherals disabled;
PCLK = CCLK⁄8
CCLK = 12 MHz; PLL
disabled
[3]
-
7
-
mA
CCLK = 100 MHz; PLL
enabled
[3]
-
42
-
mA
sleep mode
[3][4]
-
2
-
mA
deep sleep mode
[3][5]
-
240
-
μA
power-down mode
[3][5]
-
31
-
μA
[3]
-
517
-
nA
VDD(REG)(3V3) present
[6]
-
134
-
nA
VDD(REG)(3V3) not
present
[7]
634
-
nA
deep power-down mode;
RTC not running
IBAT
IDD(IO)
IDD(ADC)
II(ADC)
battery supply current
I/O supply current
ADC supply current
ADC input current
deep power-down mode;
RTC running
deep sleep mode
[8]
-
40
-
nA
power-down mode
[8]
-
40
-
nA
deep power-down mode
[8]
-
10
-
nA
deep sleep mode
[9]
-
38
-
nA
power-down mode
[9]
-
38
-
nA
deep power-down mode
[9]
-
24
-
nA
deep sleep mode
[10]
-
100
-
nA
power-down mode
[10]
-
100
-
nA
deep power-down
mode
[10]
-
100
-
nA
on pin VREFP
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32-bit ARM Cortex-M3 microcontroller
Table 6.
Static characteristics …continued
Tamb = −40 °C to +85 °C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
Standard port pins, RESET, RTCK
IIL
LOW-level input current VI = 0 V; on-chip pull-up
resistor disabled
-
-
3
μA
IIH
HIGH-level input
current
VI = VDD(3V3); on-chip
pull-down resistor
disabled
-
-
3
μA
IOZ
OFF-state output
current
VO = 0 V; VO = VDD(3V3);
on-chip pull-up/down
resistors disabled
-
-
3
μA
VI
input voltage
pin configured to provide
a digital function
0
-
5.0
V
0
-
VDD(3V3)
V
[11][12]
[13]
VO
output voltage
output active
VIH
HIGH-level input
voltage
2.0
-
-
V
VIL
LOW-level input voltage
-
-
0.8
V
Vhys
hysteresis voltage
-
0.4
-
V
VDD(3V3) −
0.4
-
-
V
VOH
HIGH-level output
voltage
IOH = −4 mA
[14]
VOL
LOW-level output
voltage
IOL = 4 mA
[14]
-
-
0.4
V
IOH
HIGH-level output
current
VOH = VDD(3V3) − 0.4 V
[14]
−4
-
-
mA
IOL
LOW-level output
current
VOL = 0.4 V
[14]
4
-
-
mA
IOHS
HIGH-level short-circuit VOH = 0 V
output current
[15]
-
-
−45
mA
IOLS
LOW-level short-circuit
output current
VOL = VDD(3V3)
[15]
-
-
50
mA
Ipd
pull-down current
VI = 5 V
10
50
150
μA
Ipu
pull-up current
VI = 0 V
−15
−50
−85
μA
VDD(3V3) < VI < 5 V
0
0
0
μA
V
I2C-bus pins (P0[27] and P0[28])
VIH
HIGH-level input
voltage
0.7VDD(3V3) -
-
VIL
LOW-level input voltage
-
-
0.3VDD(3V3) V
Vhys
hysteresis voltage
VOL
LOW-level output
voltage
IOLS = 3 mA
[14]
ILI
input leakage current
VI = VDD(3V3)
[16]
VI = 5 V
-
0.5VDD(3V3) -
V
-
-
0.4
V
-
2
4
μA
-
10
22
μA
Oscillator pins
Vi(XTAL1)
input voltage on pin
XTAL1
0
1.8
1.95
V
Vo(XTAL2)
output voltage on pin
XTAL2
0
1.8
1.95
V
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32-bit ARM Cortex-M3 microcontroller
Table 6.
Static characteristics …continued
Tamb = −40 °C to +85 °C, unless otherwise specified.
Min
Typ[1]
Max
Unit
input voltage on pin
RTCX1
0
1.8
1.95
V
output voltage on pin
RTCX2
0
1.8
1.95
V
-
-
±10
μA
-
-
5.25
V
Symbol
Parameter
Vi(RTCX1)
Vo(RTCX2)
Conditions
USB pins (LPC1768/66/65/64 only)
IOZ
OFF-state output
current
0 V < VI < 3.3 V
VBUS
bus supply voltage
VDI
differential input
sensitivity voltage
|(D+) − (D−)|
0.2
-
-
V
VCM
differential common
mode voltage range
includes VDI range
0.8
-
2.5
V
Vth(rs)se
single-ended receiver
switching threshold
voltage
0.8
-
2.0
V
VOL
LOW-level output
voltage for
low-/full-speed
RL of 1.5 kΩ to 3.6 V
-
-
0.18
V
VOH
HIGH-level output
voltage (driven) for
low-/full-speed
RL of 15 kΩ to GND
2.8
-
3.5
V
Ctrans
transceiver capacitance pin to GND
-
-
20
pF
ZDRV
driver output
with 33 Ω series resistor;
impedance for driver
steady state drive
which is not high-speed
capable
36
-
44.1
Ω
[17]
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
[2]
The RTC typically fails when Vi(VBAT) drops below 1.6 V.
[3]
VDD(REG)(3V3) = 3.3 V; Tamb = 25 °C for all power consumption measurements.
[4]
IRC running at 4 MHz; main oscillator and PLL disabled; PCLK = CCLK⁄8.
[5]
BOD disabled.
[6]
On pin VBAT; IDD(REG)(3V3) = 520 nA; VDD(REG)(3V3) = 3.3 V; VBAT = 3.3 V; Tamb = 25 °C.
[7]
On pin VBAT; VBAT = 3.3 V; Tamb = 25 °C.
[8]
All internal pull-ups disabled. All pins configured as output and driven LOW. VDD(3V3) = 3.3 V; Tamb = 25 °C.
[9]
VDDA = 3.3 V; Tamb = 25 °C.
[10] Vi(VREFP) = 3.3 V; Tamb = 25 °C.
[11] Including voltage on outputs in 3-state mode.
[12] VDD(3V3) supply voltages must be present.
[13] 3-state outputs go into 3-state mode when VDD(3V3) is grounded.
[14] Accounts for 100 mV voltage drop in all supply lines.
[15] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[16] To VSS.
[17] Includes external resistors of 33 Ω ± 1 % on D+ and D−.
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32-bit ARM Cortex-M3 microcontroller
10.1 Electrical pin characteristics
002aaf112
3.6
VOH
(V)
T = 85 °C
25 °C
−40 °C
3.2
2.8
2.4
2.0
0
8
16
24
IOH (mA)
Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins.
Fig 6.
Typical HIGH-level output voltage VOH versus HIGH-level output source current
IOH
002aaf111
15
IOL
(mA)
T = 85 °C
25 °C
−40 °C
10
5
0
0
0.2
0.4
0.6
VOL (V)
Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins.
Fig 7.
Typical LOW-level output current IOL versus LOW-level output voltage VOL
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32-bit ARM Cortex-M3 microcontroller
002aaf108
10
Ipu
(μA)
−10
−30
T = 85 °C
25 °C
−40 °C
−50
−70
0
1
2
3
4
5
VI (V)
Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins.
Fig 8.
Typical pull-up current Ipu versus input voltage VI
002aaf109
90
Ipd
(μA)
70
T = 85 °C
25 °C
−40 °C
50
30
10
−10
0
1
2
3
4
5
VI (V)
Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins.
Fig 9.
Typical pull-down current Ipd versus input voltage VI
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NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
11. Dynamic characteristics
11.1 Flash memory
Table 7.
Flash characteristics
Tamb = −40 °C to +85 °C, unless otherwise specified.
Symbol
Parameter
Nendu
endurance
tret
retention time
[1]
Conditions
Min
Typ
Max
Unit
10 000
-
-
cycles
powered
10
-
-
years
unpowered
20
-
-
years
[1]
Number of program/erase cycles.
11.2 External clock
Table 8.
Dynamic characteristic: external clock
Tamb = −40 °C to +85 °C; VDD(3V3) over specified ranges.[1]
Min
Typ[2]
Max
Unit
oscillator frequency
1
-
25
MHz
Tcy(clk)
clock cycle time
40
-
1000
ns
tCHCX
clock HIGH time
Tcy(clk) × 0.4
-
-
ns
tCLCX
clock LOW time
Tcy(clk) × 0.4
-
-
ns
tCLCH
clock rise time
-
-
5
ns
tCHCL
clock fall time
-
-
5
ns
Symbol
Parameter
fosc
Conditions
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
tCHCL
tCHCX
tCLCH
tCLCX
Tcy(clk)
002aaa907
Fig 10. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
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32-bit ARM Cortex-M3 microcontroller
11.3 Internal oscillators
Table 9.
Dynamic characteristic: internal oscillators
Tamb = −40 °C to +85 °C; 2.7 V ≤ VDD(3V3) ≤ 3.6 V.[1]
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
fosc(RC)
internal RC oscillator frequency
-
3.96
4.00
4.04
MHz
fi(RTC)
RTC input frequency
-
-
32.768
-
kHz
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
002aaf107
4.036
fosc(RC)
(MHz)
4.032
VDD(3V) = 3.6 V
3.3 V
3.0 V
2.7 V
2.4 V
4.028
4.024
4.020
4.016
−40
−15
10
35
60
85
temperature (°C)
Conditions: Frequency values are typical values. 4 MHz ± 1 % accuracy is guaranteed for
2.7 V ≤ VDD(3V3) ≤ 3.6 V and Tamb = −40 °C to +85 °C. Variations between parts may cause the
IRC to fall outside the 4 MHz 1 % accuracy specification for voltages below 2.7 V.
Fig 11. Internal RC oscillator frequency versus temperature
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32-bit ARM Cortex-M3 microcontroller
11.4 I2C-bus
Table 10. Dynamic characteristic: I2C-bus pins (Fast-mode Plus)
Tamb = −40 °C to +85 °C; VDD(3V3) over specified ranges.[1][2][3]
Symbol
Parameter
fSCL
tf
tSU;DAT
data set-up time
Conditions
Min
Typ
Max
Unit
SCL clock frequency
-
-
1
MHz
fall time
-
-
45
ns
50
-
-
ns
-
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
CCLK = PCLK = 20 MHz; I2C-bus interface configured in master mode.
[3]
Bus capacitance Cb in pF (50 pF), external pull-up resistance = 218 Ω.
SDA
tf
SCL
P
S
tSU;DAT
002aae860
Fig 12. I2C-bus pins clock timing
11.5 I2S-bus interface (LPC1768/67/66/65 only)
Table 11. Dynamic characteristics: I2S-bus interface pins
Tamb = −40 °C to +85 °C.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
common to input and output
rise time
[1]
-
-
35
ns
fall time
[1]
-
-
35
ns
tWH
pulse width HIGH
on pins I2STX_CLK and
I2SRX_CLK
[1]
0.495 × Tcy(clk)
-
-
-
tWL
pulse width LOW
on pins I2STX_CLK and
I2SRX_CLK
[1]
-
-
0.505 × Tcy(clk)
ns
data output valid time
on pin I2STX_SDA;
[1]
-
-
30
ns
on pin I2STX_WS
[1]
-
-
30
ns
tr
tf
output
tv(Q)
input
tsu(D)
data input set-up time
on pin I2SRX_SDA
[1]
3.5
-
-
ns
th(D)
data input hold time
on pin I2SRX_SDA
[1]
4.0
-
-
ns
[1]
CCLK = 20 MHz; peripheral clock to the I2S-bus interface PCLK = CCLK⁄4; I2S clock cycle time Tcy(clk) = 1600 ns, corresponds to the SCK
signal in the I2S-bus specification.
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32-bit ARM Cortex-M3 microcontroller
Tcy(clk)
tf
tr
I2STX_CLK
tWH
tWL
I2STX_SDA
tv(Q)
I2STX_WS
002aad992
tv(Q)
Fig 13. I2S-bus timing (output)
Tcy(clk)
tf
tr
I2SRX_CLK
tWH
tWL
I2SRX_SDA
tsu(D)
th(D)
I2SRX_WS
tsu(D)
tsu(D)
002aae159
Fig 14. I2S-bus timing (input)
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32-bit ARM Cortex-M3 microcontroller
11.6 SSP interface
Table 12. Dynamic characteristic: SSP interface
Tamb = 25 °C; VDD(3V3) over specified ranges.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
-
ns
SSP interface
tsu(SPI_MISO) SPI_MISO set-up time
[1]
measured in SPI Master mode;
see Figure 15
[1]
30
The peripheral clock for SSP is PCLK = CCLK = 20 MHz.
shifting edges
SCK
sampling edges
MOSI
MISO
tsu(SPI_MISO)
002aad326
Fig 15. MISO line set-up time in SSP Master mode
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11.7 USB interface (LPC1768/66/65/64 only)
Table 13. Dynamic characteristics: USB pins (full-speed)
CL = 50 pF; Rpu = 1.5 kΩ on D+ to VDD(3V3), unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tr
rise time
10 % to 90 %
8.5
-
13.8
ns
tf
fall time
10 % to 90 %
7.7
-
13.7
ns
tFRFM
differential rise and fall time
matching
tr / tf
-
-
109
%
VCRS
output signal crossover voltage
1.3
-
2.0
V
tFEOPT
source SE0 interval of EOP
see Figure 16
160
-
175
ns
tFDEOP
source jitter for differential transition
to SE0 transition
see Figure 16
−2
-
+5
ns
tJR1
receiver jitter to next transition
−18.5
-
+18.5
ns
tJR2
receiver jitter for paired transitions
10 % to 90 %
−9
-
+9
ns
tEOPR1
EOP width at receiver
must reject as
EOP; see
Figure 16
[1]
40
-
-
ns
tEOPR2
EOP width at receiver
must accept as
EOP; see
Figure 16
[1]
82
-
-
ns
[1]
Characterized but not implemented as production test. Guaranteed by design.
TPERIOD
crossover point
extended
crossover point
differential
data lines
source EOP width: tFEOPT
differential data to
SE0/EOP skew
n × TPERIOD + tFDEOP
receiver EOP width: tEOPR1, tEOPR2
002aab561
Fig 16. Differential data-to-EOP transition skew and EOP width
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32-bit ARM Cortex-M3 microcontroller
11.8 SPI
Table 14. Dynamic characteristics of SPI pins
Tamb = −40 °C to +85 °C.
Symbol
Parameter
Tcy(PCLK)
PCLK cycle time
TSPICYC
SPI cycle time
tSPICLKH
SPICLK HIGH time
tSPICLKL
SPICLK LOW time
[1]
Min
Typ
Max
Unit
10
-
-
ns
79.6
-
-
ns
0.485 × TSPICYC
-
-
ns
-
0.515 × TSPICYC
ns
SPI master
tSPIDSU
SPI data set-up time
[2]
0
-
-
ns
tSPIDH
SPI data hold time
[2]
2 × Tcy(PCLK) − 5
-
-
ns
SPI data output valid time
[2]
2 × Tcy(PCLK) + 30
-
-
ns
SPI output data hold time
[2]
2 × Tcy(PCLK) + 5
-
-
ns
SPI data set-up time
[2]
0
-
-
ns
SPI data hold time
[2]
2 × Tcy(PCLK) + 5
-
-
ns
tSPIQV
SPI data output valid time
[2]
2 × Tcy(PCLK) + 35
-
-
ns
tSPIOH
SPI output data hold time
[2]
2 × Tcy(PCLK) + 15
-
-
ns
tSPIQV
tSPIOH
SPI slave
tSPIDSU
tSPIDH
[1]
TSPICYC = (Tcy(PCLK) × n) ± 0.5 %, n is the SPI clock divider value (n ≥ 8); PCLK is derived from the
processor clock CCLK.
[2]
Timing parameters are measured with respect to the 50 % edge of the clock SCK and the 10 % (90 %)
edge of the data signal (MOSI or MISO).
TSPICYC
tSPICLKH
tSPICLKL
SCK (CPOL = 0)
SCK (CPOL = 1)
tSPIOH
tSPIQV
MOSI
DATA VALID
DATA VALID
tSPIDSU
MISO
DATA VALID
tSPIDH
DATA VALID
002aad986
Fig 17.
SPI master timing (CPHA = 1)
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TSPICYC
tSPICLKH
tSPICLKL
SCK (CPOL = 0)
SCK (CPOL = 1)
tSPIOH
tSPIQV
MOSI
DATA VALID
DATA VALID
tSPIDSU
MISO
DATA VALID
tSPIDH
DATA VALID
002aad987
Fig 18.
SPI master timing (CPHA = 0)
TSPICYC
tSPICLKH
tSPICLKL
tSPIDSU
tSPIDH
SCK (CPOL = 0)
SCK (CPOL = 1)
MOSI
DATA VALID
DATA VALID
tSPIOH
tSPIQV
MISO
DATA VALID
DATA VALID
002aad988
Fig 19.
SPI slave timing (CPHA = 1)
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TSPICYC
tSPICLKH
tSPICLKL
SCK (CPOL = 0)
SCK (CPOL = 1)
tSPIDSU
MOSI
DATA VALID
tSPIDH
DATA VALID
tSPIQV
MISO
tSPIOH
DATA VALID
DATA VALID
002aad989
Fig 20.
SPI slave timing (CPHA = 0)
12. ADC electrical characteristics
Table 15. ADC characteristics
VDDA = 2.7 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified; ADC frequency 13 MHz.
Symbol
Parameter
VIA
analog input voltage
Cia
analog input capacitance
Conditions
Min
Typ
Max
Unit
0
-
VDDA
V
-
-
15
pF
[1][2][3]
ED
differential linearity error
-
-
±1
LSB
EL(adj)
integral non-linearity
[1][4]
-
-
±3
LSB
offset error
[1][5]
-
±2
-
LSB
gain error
[1][6]
-
-
0.5
%
ET
absolute error
[1][7]
-
-
4
LSB
fclk(ADC)
ADC clock frequency
-
-
13
MHz
fc(ADC)
ADC conversion frequency
-
-
200
kHz
EO
EG
[1]
Conditions: VSSA = 0 V, VDDA = 3.3 V.
[2]
The ADC is monotonic, there are no missing codes.
[3]
The differential linearity error (ED) is the difference between the actual step width and the ideal step width. See Figure 21.
[4]
The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and the ideal transfer curve after
appropriate adjustment of gain and offset errors. See Figure 21.
[5]
The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the
ideal curve. See Figure 21.
[6]
The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset
error, and the straight line which fits the ideal transfer curve. See Figure 21.
[7]
The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated
ADC and the ideal transfer curve. See Figure 21.
LPC1768_67_66_65_64_3
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32-bit ARM Cortex-M3 microcontroller
offset
error
EO
gain
error
EG
4095
4094
4093
4092
4091
4090
(2)
7
code
out
(1)
6
5
(5)
4
(4)
3
(3)
2
1 LSB
(ideal)
1
0
1
2
3
4
5
6
7
4090
4091
4092
4093
4094
4095
4096
VIA (LSBideal)
offset error
EO
1 LSB =
VREFP − VREFN
4096
002aad948
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 21. 12-bit ADC characteristics
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13. DAC electrical characteristics (LPC1768/67/66/65 only)
Table 16. DAC electrical characteristics
VDDA = 2.7 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified
Symbol
Parameter
ED
EL(adj)
Conditions
Min
Typ
Max
Unit
differential linearity error
-
±1
-
LSB
integral non-linearity
-
±1.5
-
LSB
EO
offset error
-
0.6
-
%
EG
gain error
-
0.6
-
%
CL
load capacitance
-
200
-
pF
RL
load resistance
1
-
-
kΩ
LPC1768_67_66_65_64_3
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14. Application information
14.1 Suggested USB interface solutions
VDD(3V3)
USB_UP_LED
USB_CONNECT
LPC17xx
SoftConnect switch
R1
1.5 kΩ
VBUS
USB_D+ RS = 33 Ω
USB_D−
USB-B
connector
RS = 33 Ω
VSS
002aad939
Fig 22. LPC1768/66/65/64 USB interface on a self-powered device
VDD(3V3)
R2
LPC17xx
USB_UP_LED
R1
1.5 kΩ
VBUS
USB_D+ RS = 33 Ω
USB-B
connector
USB_D− RS = 33 Ω
VSS
002aad940
Fig 23. LPC1768/66/65/64 USB interface on a bus-powered device
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32-bit ARM Cortex-M3 microcontroller
VDD
RSTOUT
RESET_N
VBUS
ADR/PSW
ID
OE_N/INT_N
VDD
SPEED
SUSPEND
LPC17xx
DP
33 Ω
DM
33 Ω
ISP1302
VSS
SCL
USB_SCL
Mini-AB
connector
SDA
USB_SDA
INT_N
EINTn
USB_D+
USB_D−
USB_UP_LED
002aad941
VDD
Fig 24. LPC1768/66/65 USB OTG port configuration
VDD
USB_UP_LED
VSS
USB_D+
33 Ω
D+
USB_D−
33 Ω
D−
LPC17xx
15 kΩ
USB-A
connector
15 kΩ
VDD
VBUS
USB_PWRD
USB_OVRCR
USB_PPWR
FLAGA
ENA
5V
IN
LM3526-L
OUTA
002aad942
Fig 25. LPC1768/66/65 USB host port configuration
LPC1768_67_66_65_64_3
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VDD
USB_UP_LED
VDD
USB_CONNECT
LPC17xx
VSS
USB_D+
33 Ω
D+
USB_D−
33 Ω
D−
VBUS
USB-B
connector
VBUS
002aad943
Fig 26. LPC1768/66/65/64 USB device port configuration
14.2 XTAL1 input
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
Ci = 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave
mode, a minimum of 200 mV (RMS) is needed. For more details see the LPC17xx User
manual.
LPC1xxx
XTAL1
Ci
100 pF
Cg
002aae835
Fig 27. Slave mode operation of the on-chip oscillator
14.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
LPC1768_67_66_65_64_3
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32-bit ARM Cortex-M3 microcontroller
15. Package outline
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
c
y
X
A
51
75
50
76
ZE
e
E HE
A A2
(A 3)
A1
w M
θ
bp
Lp
pin 1 index
L
100
detail X
26
25
1
ZD
e
v M A
w M
bp
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
14.1
13.9
14.1
13.9
0.5
HD
HE
16.25 16.25
15.75 15.75
L
Lp
v
w
y
1
0.75
0.45
0.2
0.08
0.08
Z D (1) Z E (1)
1.15
0.85
1.15
0.85
θ
7o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT407-1
136E20
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-02-01
03-02-20
Fig 28. Package outline SOT407-1 (LQFP100)
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32-bit ARM Cortex-M3 microcontroller
16. Abbreviations
Table 17.
Abbreviations
Acronym
Description
ADC
Analog-to-Digital Converter
AHB
Advanced High-performance Bus
AMBA
Advanced Microcontroller Bus Architecture
APB
Advanced Peripheral Bus
BOD
BrownOut Detection
CAN
Controller Area Network
DAC
Digital-to-Analog Converter
DCC
Debug Communication Channel
DMA
Direct Memory Access
DSP
Digital Signal Processing
EOP
End Of Packet
ETM
Embedded Trace Macrocell
GPIO
General Purpose Input/Output
IRC
Internal RC
IrDA
Infrared Data Association
JTAG
Joint Test Action Group
MAC
Media Access Control
MIIM
Media Independent Interface Management
OHCI
Open Host Controller Interface
OTG
On-The-Go
PHY
Physical Layer
PLL
Phase-Locked Loop
PWM
Pulse Width Modulator
RIT
Repetitive Interrupt Timer
RMII
Reduced Media Independent Interface
SE0
Single Ended Zero
SPI
Serial Peripheral Interface
SSI
Serial Synchronous Interface
SSP
Synchronous Serial Port
TCM
Tightly Coupled Memory
TTL
Transistor-Transistor Logic
UART
Universal Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
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17. Revision history
Table 18.
Revision history
Document ID
Release date
Data sheet status
Change notice Supersedes
LPC1768_67_66_65_64_3
20091119
Product data sheet
-
Modifications:
•
•
•
•
•
•
•
•
Changed data sheet status to Product data sheet.
•
•
•
•
•
•
•
•
•
•
•
•
VDDA and VREFP pin descriptions updated (Table 3).
•
•
Removed symbols from timing diagram (Figure 12).
LPC1768_66_65_64_2
Added part LPC1767.
Maximum data bit rate for SPI, SSP, UART added.
RTC backup RAM size updated (20 bytes).
WDT clock source added: RTC oscillator.
Table 14 “Dynamic characteristics of SPI pins” updated.
ADC conversion rate changed to 200 kHz.
Updated motor control PWM pin names in Table 3 “Pin description” and Figure 1 “Block
diagram”.
VESD changed to ±4000 V (Table 4).
Power consumption data added to Table 6.
Flash characteristics table updated (Table 7).
I2C-bus timing characteristics updated (Table 10).
I2S-bus timing characteristics updated (Table 11).
Added Section 10.1 “Electrical pin characteristics”.
Changed VI to 5.5 V (max) in Table 4.
Changed VI to 5.0 V (max) in Table 6.
Table 15 “ADC characteristics” updated.
DAC electrical characteristics updated (Table 16).
Section 14.2 “XTAL1 input” and Section 14.3 “XTAL and RTCX Printed Circuit Board
(PCB) layout guidelines”) added.
Updated Figure 3 “LPC17xx memory map”.
LPC1768_66_65_64_2
20090211
Objective data sheet
-
LPC1768_66_65_64_1
LPC1768_66_65_64_1
20090115
Objective data sheet
-
-
LPC1768_67_66_65_64_3
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NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
18. Legal information
19. Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
19.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
19.2 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
19.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
20. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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21. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 4
4.1
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 4
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 6
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
7
Functional description . . . . . . . . . . . . . . . . . . 15
7.1
Architectural overview . . . . . . . . . . . . . . . . . . 15
7.2
ARM Cortex-M3 processor . . . . . . . . . . . . . . . 15
7.3
On-chip flash program memory . . . . . . . . . . . 15
7.4
On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 15
7.5
Memory Protection Unit (MPU). . . . . . . . . . . . 15
7.6
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.7
Nested Vectored Interrupt Controller (NVIC) . 18
7.7.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.7.2
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 18
7.8
Pin connect block . . . . . . . . . . . . . . . . . . . . . . 18
7.9
General purpose DMA controller . . . . . . . . . . 18
7.9.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.10
Fast general purpose parallel I/O . . . . . . . . . . 19
7.10.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.11
Ethernet (LPC1768/67/66/64 only) . . . . . . . . . 20
7.11.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.12
USB interface (LPC1768/66/65/64 only) . . . . 21
7.12.1
USB device controller . . . . . . . . . . . . . . . . . . . 21
7.12.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.12.2
USB host controller (LPC1768/66/65 only). . . 22
7.12.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.12.3
USB OTG controller (LPC1768/66/65 only) . . 22
7.12.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7.13
CAN controller and acceptance filters
(LPC1768/66/65/64 only) . . . . . . . . . . . . . . . . 22
7.13.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.14
12-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.14.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.15
10-bit DAC (LPC1768/67/66/65 only) . . . . . . . 23
7.15.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
7.16
UARTs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7.16.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7.17
SPI serial I/O controller. . . . . . . . . . . . . . . . . . 24
7.17.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
7.18
SSP serial I/O controller . . . . . . . . . . . . . . . . . 24
7.18.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.19
I2C-bus serial I/O controllers. . . . . . . . . . . . . . 25
7.19.1
7.20
7.20.1
7.21
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2S-bus serial I/O controllers . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General purpose 32-bit timers/external
event counters . . . . . . . . . . . . . . . . . . . . . . . .
7.21.1
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.22
Pulse width modulator . . . . . . . . . . . . . . . . . .
7.22.1
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.23
Motor control PWM . . . . . . . . . . . . . . . . . . . .
7.24
Quadrature Encoder Interface (QEI) . . . . . . .
7.24.1
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.25
Repetitive Interrupt (RI) timer. . . . . . . . . . . . .
7.25.1
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.26
ARM Cortex-M3 system tick timer . . . . . . . . .
7.27
Watchdog timer . . . . . . . . . . . . . . . . . . . . . . .
7.27.1
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.28
RTC and backup registers . . . . . . . . . . . . . . .
7.28.1
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.29
Clocking and power control . . . . . . . . . . . . . .
7.29.1
Crystal oscillators. . . . . . . . . . . . . . . . . . . . . .
7.29.1.1 Internal RC oscillator . . . . . . . . . . . . . . . . . . .
7.29.1.2 Main oscillator . . . . . . . . . . . . . . . . . . . . . . . .
7.29.1.3 RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . .
7.29.2
Main PLL (PLL0) . . . . . . . . . . . . . . . . . . . . . .
7.29.3
USB PLL (PLL1) . . . . . . . . . . . . . . . . . . . . . .
7.29.4
RTC clock output . . . . . . . . . . . . . . . . . . . . . .
7.29.5
Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . .
7.29.6
Power control . . . . . . . . . . . . . . . . . . . . . . . . .
7.29.6.1 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . .
7.29.6.2 Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . .
7.29.6.3 Power-down mode . . . . . . . . . . . . . . . . . . . . .
7.29.6.4 Deep power-down mode . . . . . . . . . . . . . . . .
7.29.6.5 Wakeup interrupt controller . . . . . . . . . . . . . .
7.29.7
Peripheral power control . . . . . . . . . . . . . . . .
7.29.8
Power domains . . . . . . . . . . . . . . . . . . . . . . .
7.30
System control . . . . . . . . . . . . . . . . . . . . . . . .
7.30.1
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.30.2
Brownout detection . . . . . . . . . . . . . . . . . . . .
7.30.3
Code security (Code Read Protection - CRP)
7.30.4
APB interface . . . . . . . . . . . . . . . . . . . . . . . . .
7.30.5
AHB multilayer matrix . . . . . . . . . . . . . . . . . .
7.30.6
External interrupt inputs . . . . . . . . . . . . . . . . .
7.30.7
Memory mapping control . . . . . . . . . . . . . . . .
7.31
Emulation and debugging . . . . . . . . . . . . . . .
8
Limiting values . . . . . . . . . . . . . . . . . . . . . . . .
9
Thermal characteristics . . . . . . . . . . . . . . . . .
10
Static characteristics . . . . . . . . . . . . . . . . . . .
25
25
26
26
26
27
27
28
28
28
29
29
29
29
29
30
30
30
30
31
31
31
32
32
32
32
33
33
33
34
34
34
34
35
36
36
37
37
37
38
38
38
38
39
40
41
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LPC1768_67_66_65_64_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 19 November 2009
64 of 65
LPC1768/67/66/65/64
NXP Semiconductors
32-bit ARM Cortex-M3 microcontroller
10.1
11
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
12
13
14
14.1
14.2
14.3
15
16
17
18
19
19.1
19.2
19.3
20
21
Electrical pin characteristics . . . . . . . . . . . . . .
Dynamic characteristics . . . . . . . . . . . . . . . . .
Flash memory . . . . . . . . . . . . . . . . . . . . . . . . .
External clock . . . . . . . . . . . . . . . . . . . . . . . . .
Internal oscillators. . . . . . . . . . . . . . . . . . . . . .
I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2S-bus interface (LPC1768/67/66/65 only) . .
SSP interface . . . . . . . . . . . . . . . . . . . . . . . . .
USB interface (LPC1768/66/65/64 only) . . . .
SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ADC electrical characteristics . . . . . . . . . . . .
DAC electrical characteristics
(LPC1768/67/66/65 only) . . . . . . . . . . . . . . . . .
Application information. . . . . . . . . . . . . . . . . .
Suggested USB interface solutions . . . . . . . .
XTAL1 input . . . . . . . . . . . . . . . . . . . . . . . . . .
XTAL and RTCX Printed Circuit Board
(PCB) layout guidelines . . . . . . . . . . . . . . . . .
Package outline . . . . . . . . . . . . . . . . . . . . . . . .
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .
Revision history . . . . . . . . . . . . . . . . . . . . . . . .
Legal information. . . . . . . . . . . . . . . . . . . . . . .
Data sheet status . . . . . . . . . . . . . . . . . . . . . .
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information. . . . . . . . . . . . . . . . . . . . .
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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64
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 19 November 2009
Document identifier: LPC1768_67_66_65_64_3