TI1 LM1894 Dynamic noise reduction system dnr Datasheet

LM1894
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SNAS551C – DECEMBER 1994 – REVISED APRIL 2013
LM1894 Dynamic Noise Reduction System DNR
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FEATURES
DESCRIPTION
•
The LM1894 is a stereo noise reduction circuit for use
with audio playback systems. The DNR system is
non-complementary, meaning it does not require
encoded source material. The system is compatible
with virtually all prerecorded tapes and FM
broadcasts. Psychoacoustic masking, and an
adaptive bandwidth scheme allow the DNR to
achieve 10 dB of noise reduction. DNR can save
circuit board space and cost because of the few
additional components required.
1
2
•
•
•
•
•
Non-Complementary Noise Reduction, “Single
Ended”
Low Cost External Components, No Critical
Matching
Compatible with All Prerecorded Tapes and
FM
10 dB Effective Tape Noise Reduction
CCIR/ARM Weighted
Wide Supply Range, 4.5V to 18V
1 Vrms Input Overload
APPLICATIONS
•
•
•
•
•
Automotive Radio/Tape Players
Compact Portable Tape Players
Quality HI-FI Tape Systems
VCR Playback Noise Reduction
Video Disc Playback Noise Reduction
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1994–2013, Texas Instruments Incorporated
LM1894
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Typical Application
*R1 + R2 = 1 kΩ total.
See Application Hints.
Figure 1. Component Hook-Up for Stereo DNR System
14-Pin SOIC or PDIP or TSSOP
See D or NFF0014A or PW Package
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
Supply Voltage
20V
Input Voltage Range, Vpk
VS/2
Operating Temperature (3)
0°C to +70°C
−65°C to +150°C
Storage Temperature
PDIP Package
Soldering Information
(1)
(2)
(3)
2
SOIC Package
Soldering (10 seconds)
260°C
Vapor Phase (60 seconds)
215°C
Infrared (15 seconds)
220°C
“Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
For operation in ambient temperature above 25°C, the device must be derated based on a 150°C maximum junction temperature and a
thermal resistance of:
(a) 80°C/W junction to ambient for the PDIP package,
(b) 105°C/W junction to ambient for the SOIC package, and
(c) 150°C/W junction to ambient for the TSSOP package.
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Electrical Characteristics
VS = 8V, TA = 25°C, VIN = 300 mV at 1 kHz, circuit shown in Figure 1 unless otherwise specified
Parameter
Conditions
Min
Operating Supply Range
Supply Current
4.5
VS = 8V
Typ
Max
Units
8
18
V
17
30
mA
V/V
MAIN SIGNAL PATH
DC Ground Pin 9 (1)
−0.9
−1
−1.1
3.7
4.0
4.3
V
Channel Balance
DC Ground Pin 9
−1.0
1.0
dB
Minimum Balance
AC Ground Pin 9 with 0.1
μFCapacitor (1)
675
1400
Hz
Maximum Bandwidth
DC Ground Pin 9 (1)
27
34
46
kHz
Effective Noise Reduction
CCIR/ARM Weighted (2)
−10
−14
dB
Total Harmonic Distortion
DC Ground Pin 9
0.05
0.1
%
Input Headroom
Maximum VIN for 3% THD
1.0
Vrms
VS − 1.5
Vp-p
AC Ground Pin 9
79
dB
DC Ground Pin 9
77
dB
Voltage Gain
DC Output Voltage
965
AC Ground Pin 9
Output Headroom
Maximum VOUT for 3% THD
DC Ground Pin 9
Signal to Noise
BW = 20 Hz–20 kHz, re 300 mV
CCIR/ARM Weighted re 300 mV (3)
AC Ground Pin 9
82
88
dB
DC Ground Pin 9
70
76
dB
AC Ground Pin 9
77
dB
DC Ground Pin 9
64
dB
CCIR Peak, re 300 mV
(4)
Input Impedance
Pin 2 and Pin 13
14
20
Channel Separation
DC Ground Pin 9
−50
−70
dB
Power Supply Rejection
C14 = 100 μF,
−40
−56
dB
VRIPPLE = 500 mVrms,
26
kΩ
f = 1 kHz
Output DC Shift
Reference DVM to Pin 14 and
Measuree Output DC Shift from
Minimum to Maximum Band-width
(1)
(2)
(3)
(4)
(5)
4.0
20
mV
(5)
To force the DNR system into maximum bandwidth, DC ground the input to the peak detector, pin 9. A negative temperature coefficient
of −0.5%/°C on the bandwidth, reduces the maximum bandwidth at increased ambient temperature or higher package dissipation. AC
ground pin 9 or pin 6 to select minimum bandwidth. To change minimum and maximum bandwidth, see Application Hints.
The maximum noise reduction CCIR/ARM weighted is about 14 dB. This is accomplished by changing the bandwidth from maximum to
minimum. In actual operation, minimum bandwidth is not selected, a nominal minimum bandwidth of about 2 kHz gives −10 dB of noise
reduction. See Application Hints.
The CCIR/ARM weighted noise is measured with a 40 dB gain amplifier between the DNR system and the CCIR weighting filter; it is
then input referred.
Measured using the Rhode-Schwartz psophometer.
Pin 10 is DC forced half way between the maximum bandwidth DC level and minimum bandwidth DC level. An AC 1 kHz signal is then
applied to pin 10. Its peak-to-peak amplitude is VDC (max BW) − VDC (min BW).
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Electrical Characteristics (continued)
VS = 8V, TA = 25°C, VIN = 300 mV at 1 kHz, circuit shown in Figure 1 unless otherwise specified
Parameter
Conditions
Min
Typ
Max
Units
V/V
CONTROL SIGNAL PATH
Summing Amplifier Voltage Gain
Both Channels Driven
0.9
1
1.1
Gain Amplifier Input Impedance
Pin 6
24
30
39
kΩ
Pin 6 to Pin 8
21.5
24
26.5
V/V
Peak Detector Input Impedance
Pin 9
560
700
840
Ω
Voltage Gain
Pin 9 to Pin 10
30
33
36
V/V
Attack Time
Measured to 90% of Final Value with
10 kHz Tone Burst
300
500
700
μs
Decay Time
Measured to 90% of Final Value with
10 kHz Tone Burst
45
75
ms
DC Voltage Range
Minimum Bandwidth to Maximum
Bandwidth
1.1
3.8
V
Voltage Gain
4
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Typical Performance Characteristics
Supply Current vs Supply Voltage
Channel Separation (Referred to the Output) vs Frequency
Figure 2.
Figure 3.
Power Supply Rejection Ratio
(Referred to the Output) vs Frequency
THD vs Frequency
Figure 4.
Figure 5.
−3 dB Bandwidth vs Frequency and Control Signal
Gain of Control Path vs Frequency
(with 10 kHz FM Pilot Filter)
Figure 6.
Figure 7.
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Typical Performance Characteristics (continued)
Main Signal Path Bandwidth vs Voltage Control
Peak Detector Response
Figure 8.
Figure 9.
Output Response
Figure 10.
6
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External Component Guide
(Figure 1)
Component
Value
Purpose
C1
0.1 μF–100 μF
May be part of power supply, or may be added to suppress power supply
oscillation.
C2, C13
1 μF
Blocks DC, pin 2 and pin 13 are at DC potential of VS/2. C2, C13 form a low
frequency pole with 20k RIN.
C14
25 μF–100 μF
Improves power supply rejection.
C3, C12
0.0033 μF
Forms integrator with internal gm block and op amp. Sets bandwidth
conversion gain of 33 Hz/μA of gm current.
C4, C11
1 μF
Output coupling capacitor. Output is at DC potential of VS/2.
C5
0.1 μF
Works with R1 and R2 to attenuate low frequency transients which could
disturb control path operation.
C6
0.001 μF
Works with input resistance of pin 6 to form part of control path frequency
weighting.
C8
0.1 μF
Combined with L8 and CL forms 19 kHz filter for FM pilot. This is only
required in FM applications (1).
L8, CL
4.7 mH, 0.015 μF
Forms 19 kHz filter for FM pilot. L8 is Toko coil CAN-1A185HM (1) (2).
C9
0.047 μF
Works with input resistance of pin 9 to form part of control path frequency
weighting.
C10
1 μF
Set attack and decay time of peak detector.
R1, R2
1 kΩ
Sensitivity resistors set the noise threshold. Reducing attenuation causes
larger signals to be peak detected and larger bandwidth in main signal path.
Total value of R1 + R2 should equal 1 kΩ.
R8
100Ω
Forms RC roll-off with C8. This is only required in FM applications.
(1)
When FM applications are not required, pin 8 and pin 9 hook-up as follows:
(2)
Toko America Inc., 1250 Feehanville Drive, Mt. Prospect IL 60056
Circuit Operation
The LM1894 has two signal paths, a main signal path and a bandwidth control path. The main path is an audio
low pass filter comprised of a gm block with a variable current, and an op amp configured as an integrator. As
seen in Figure 11, DC feedback constrains the low frequency gain to AV = −1. Above the cutoff frequency of the
filter, the output decreases at −6 dB/oct due to the action of the 0.0033 μF capacitor.
The purpose of the control paths is to generate a bandwidth control signal which replicates the ear's sensitivity to
noise in the presence of a tone. A single control path is used for both channels to keep the stereo image from
wandering. This is done by adding the right and left channels together in the summing amplifier of Figure 11. The
R1, R2 resistor divider adjusts the incoming noise level to open slightly the bandwidth of the low pass filter.
Control path gain is about 60 dB and is set by the gain amplifier and peak detector gain. This large gain is
needed to ensure the low pass filter bandwidth can be opened by very low noise floors. The capacitors between
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the summing amplifier output and the peak detector input determine the frequency weighting as shown in the
Typical Performance Characteristics. The 1 μF capacitor at pin 10, in conjunction with internal resistors, sets the
attack and decay times. The voltage is converted into a proportional current which is fed into the gm blocks. The
bandwidth sensitivity to gm current is 33 Hz/μA. In FM stereo applications at 19 kHz pilot filter is inserted
between pin 8 and pin 9 as shown in Figure 1.
Figure 12 is an interesting curve and deserves some discussion. Although the output of the DNR system is a
linear function of input signal, the −3 dB bandwidth is not. This is due to the non-linear nature of the control path.
The DNR system has a uniform frequency response, but looking at the −3 dB bandwidth on a steady state basis
with a single frequency input can be misleading. It must be remembered that a single input frequency can only
give a single −3 dB bandwidth and the roll-off from this point must be a smooth −6 dB/oct.
A more accurate evaluation of the frequency response can be seen in Figure 13. In this case the main signal
path is frequency swept, while the control path has a constant frequency applied. It can be seen that different
control path frequencies each give a distinctive gain roll-off.
PSYCHOACOUSTIC BASICS
The dynamic noise reduction system is a low pass filter that has a variable bandwidth of 1 kHz to 30 kHz,
dependent on music spectrum. The DNR system operates on three principles of psychoacoustics.
1. White noise can mask pure tones. The total noise energy required to mask a pure tone must equal the energy
of the tone itself. Within certain limits, the wider the band of masking noise about the tone, the lower the noise
amplitude need be. As long as the total energy of the noise is equal to or greater than the energy of the tone, the
tone will be inaudible. This principle may be turned around; when music is present, it is capable of masking noise
in the same bandwidth.
2. The ear cannot detect distortion for less than 1 ms. On a transient basis, if distortion occurs in less than 1 ms,
the ear acts as an integrator and is unable to detect it. Because of this, signals of sufficient energy to mask noise
open bandwidth to 90% of the maximum value in less than 1 ms. Reducing the bandwidth to within 10% of its
minimum value is done in about 60 ms: long enough to allow the ambience of the music to pass through, but not
so long as to allow the noise floor to become audible.
3. Reducing the audio bandwidth reduces the audibility of noise. Audibility of noise is dependent on noise
spectrum, or how the noise energy is distributed with frequency. Depending on the tape and the recorder
equalization, tape noise spectrum may be slightly rolled off with frequency on a per octave basis. The ear
sensitivity on the other hand greatly increases between 2 kHz and 10 kHz. Noise in this region is extremely
audible. The DNR system low pass filters this noise. Low frequency music will not appreciably open the DNR
bandwidth, thus 2 kHz to 20 kHz noise is not heard.
8
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Block Diagram
Figure 11.
Figure 12. Output vs Frequency
Figure 13. −3 dB Bandwidth vs Frequency and
Control Signal
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APPLICATION HINTS
The DNR system should always be placed before tone and volume controls as shown in Figure 1. This is
because any adjustment of these controls would alter the noise floor seen by the DNR control path. The
sensitivity resistors R1 and R2 may need to be switched with the input selector, depending on the noise floors of
different sources, i.e., tape, FM, phono. To determine the value of R1 and R2 in a tape system for instance;
apply tape noise (no program material) and adjust the ratio of R1 and R2 to open slightly the bandwidth of the
main signal path. This can easily be done by viewing the capacitor voltage of pin 10 with an oscilloscope, or by
using the circuit of Figure 14. This circuit gives an LED display of the voltage on the peak detector capacitor.
Adjust the values of R1 and R2 (their sum is always 1 kΩ) to light the LEDs of pin 1 and pin 18. The LED bar
graph does not indicate signal level, but rather instantaneous bandwidth of the two filters; it should not be used
as a signal-level indicator. For greater flexibility in setting the bandwidth sensitivity, R1 and R2 could be replaced
by a 1 kΩ potentiometer.
To change the minimum and maximum value of bandwidth, the integrating capacitors, C3 and C12, can be
scaled up or down. Since the bandwidth is inversely proportional to the capacitance, changing this 0.0039 μF
capacitor to 0.0033 μF will change the typical bandwidth from 965 Hz–34 kHz to 1.1 kHz–40 kHz. With C3 and
C12 set at 0.0033 μF, the maximum bandwidth is typically 34 kHz. A double pole double throw switch can be
used to completely bypass DNR.
The capacitor on pin 10 in conjunction with internal resistors sets the attack and decay times. The attack time
can be altered by changing the size of C10. Decay times can be decreased by paralleling a resistor with C10,
and increased by increasing the value of C10.
When measuring the amount of noise reduction of the DNR system, the frequency response of the cassette
should be flat to 10 kHz. The CCIR weighting network has substantial gain to 8 kHz and any additional roll-off in
the cassette player will reduce the benefits of DNR noise reduction. A typical signal-to-noise measurement circuit
is shown in Figure 15. The DNR system should be switched from maximum bandwidth to nominal bandwidth with
tape noise as a signal source. The reduction in measured noise is the signal-to-noise ratio improvement.
Figure 14. Bar Graph Display of Peak Detector Voltage
10
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Figure 15. Technique for Measuring S/N Improvement of the DNR System
FOR FURTHER READING
Tape Noise Levels
1. “A Wide Range Dynamic Noise Reduction System”, Blackmer, “dB” Magazine,August-September 1972,
Volume 6, #8.
2. “Dolby B-Type Noise Reduction System”, Berkowitz and Gundry, Sert Journal,May-June 1974, Volume 8.
3. “Cassette vs Elcaset vs Open Reel”, Toole, Audioscene Canada, April 1978.
4. “CCIR/ARM: A Practical Noise Measurement Method”, Dolby, Robinson, Gundry, JAES,1978.
Noise Masking
1. “Masking and Discrimination”, Bos and De Boer, JAES, Volume 39, #4, 1966.
2. “The Masking of Pure Tones and Speech by White Noise”, Hawkins and Stevens, JAES, Volume 22, #1,
1950.
3. “Sound System Engineering”, Davis Howard W. Sams and Co.
4. “High Quality Sound Reproduction”, Moir, Chapman Hall, 1960.
5. “Speech and Hearing in Communication”, Fletcher, Van Nostrand, 1953.
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Printed Circuit Layout
Figure 16. DNR Component Diagram
12
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REVISION HISTORY
Changes from Revision B (April 2013) to Revision C
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 11
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PACKAGE OPTION ADDENDUM
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30-Jun-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
LM1894MX/NOPB
ACTIVE
Package Type Package Pins Package
Drawing
Qty
SOIC
D
14
2500
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
Op Temp (°C)
Device Marking
(4/5)
0 to 70
LM1894M
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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PACKAGE OPTION ADDENDUM
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Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Feb-2016
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
LM1894MX/NOPB
Package Package Pins
Type Drawing
SOIC
D
14
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
6.5
B0
(mm)
K0
(mm)
P1
(mm)
9.35
2.3
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Feb-2016
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM1894MX/NOPB
SOIC
D
14
2500
367.0
367.0
35.0
Pack Materials-Page 2
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