Material Content Data Sheet Sales Product Name BSP742RI MA# MA000975712 Package PG-DSO-8-24 Issued 29. August 2013 Weight* 83.20 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 1.539 1.85 0.009 0.01 0.036 0.04 431 0.717 0.86 8620 29.121 35.00 35.91 350012 359171 0.478 0.57 0.57 5749 5749 0.099 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.85 18493 18493 108 1185 4.536 5.45 44.673 53.71 59.28 536930 592637 0.814 0.98 0.98 9782 9782 0.650 0.78 0.78 7815 7815 0.092 0.11 0.436 0.52 54523 1112 0.63 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 5240 6352 1000000