® GF2045MC thru GF20200MC Pb GF2045MC thru GF20200MC Pb Free Plating Product 20.0 Ampere Surface Mount PhotoVoltaic Bypass Schottky Barrier Rectifier Features D 2PAK For surface mounted application Plastic material used carries Underwriters Laboratory Classifications 94V-0 Metal silicon junction, majority carrier conduction Low power loss, high efficiency High current capability, low forward voltage drop High surge capability For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications Guardring for overvoltage protection Highotemperature soldering guaranteed: 260 C/10 seconds at terminals Mechanical Data 2 Cases: JEDEC D PAK /TO-263-2L molded plastic Terminals: Pure tin plated, lead free. solderable per MIL-STD-750, Method 2026 Polarity: As marked Mounting position: Any Mounting torque: 5 in. - lbs. max Weight: 0.06 ounce, 1.70 grams Dimensions in inches and (millimeters) Maximum Ratings and Electrical Characteristics Rating at 25 oC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Type Number Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current o at TC=135 C Peak Repetitive Forward Current (Rated VR, Square Wave, o 20KHz) at Tc=135 C Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) Peak Repetitive Reverse Surge Current (Note 1) Symbol GF2045MC GF2060MC GF20100MC GF20200MC Units VRRM VRMS VDC I(AV) 45 31 45 IFSM IRRM Maximum Instantaneous Reverse Current @ Tc=25℃ at Rated DC Blocking Voltage @ Tc=125℃ IR 0.1 15 dV/dt Typical Junction Capacitance Cj RθJC TJ TSTG Storage Temperature Range Notes: V V V A 20 A 150 0.57 0.84 0.72 Voltage Rate of Change, (Rated VR) 200 140 200 20 A 1.0 VF Operating Junction Temperature Range 100 70 100 IFRM Maximum Instantaneous Forward Voltage at (Note 2) O IF=10A, TC=25 C IF=10A, TC=125OC IF=20A, TC=25OC IF=20A, TC=125OC Typical Thermal Resistance Per Leg (Note 3) 60 42 60 0.5 A 0.99 0.87 1.23 1.10 0.85 0.75 0.95 0.85 0.80 0.70 0.95 0.85 0.1 10 10,000 400 5.0 320 1.0 2.0 -65 to +150 -65 to +175 V mA mA V/uS pF o C/W o C o C 1. 2.0us Pulse Width, f=1.0 KHz 2. Pulse Test: 300us Pulse Width, 1% Duty Cycle 3. Thermal Resistance from Junction to Case Per Leg, with Heatsink Size (4”x6”x0.25”) Al-Plate. Page 1/2 © 2006 Thinki Semiconductor Co.,Ltd. http://www.thinkisemi.com/ ® GF2045MC thru GF20200MC FIG.1- FORWARD CURRENT DERATIN CURVE FIG.2- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT PER LEG 20 PEAK FORWARD SURGE CURRENT. (A) 150 AVERAGE FORWARD CURRENT. (A) RESISTIVE OR INDUCTIVE LOAD 16 12 8 4 0 0 50 100 Tj=Tj max. 8.3ms Single Half Sine Wave JEDEC Method 125 100 75 50 25 0 150 1 10 o CASE TEMPERATURE. ( C) FIG.3- TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS PER LEG 50 40 Tj=150 0C FIG.4- TYPICAL REVERSE CHARACTERISTICS PER LEG 10 INSTANTANEOUS REVERSE CURRENT. (mA) INSTANTANEOUS FORWARD CURRENT. (A) 10 1 Tj=25 0C 0.1 GF2045MC GF2060MC GF20100MC GF20200MC Tj=1250C 1 Tj=75 0C 0.1 0.01 Tj=250C Pulse Width=300 s 1% Duty Cycle 0.01 0 0.1 0.2 0.3 0.4 0.5 0.001 0.6 0.7 0.8 0.9 1.0 1.1 1.2 TRANSIENT THERMAL IMPEDANCE. ( OC/W) JUNCTION CAPACITANCE.(pF) 20 40 60 140 FIG.6- TYPICAL TRANSIENT THERMAL IMPEDANCE PER LEG FIG.5- TYPICAL JUNCTION CAPACITANCE PER LEG 5,000 Tj=25 0C f=1.0MHz Vsig=50mVp-p 2,000 1,000 500 200 GF2045MC GF2060MC-GF20200MC 100 1.0 0 GF2045MC GF2060MC-GF20100MC GF20200MC 80 100 120 PERCENT OF RATED PEAK REVERSE VOLTAGE. (%) FORWARD VOLTAGE. (V) 0.1 100 NUMBER OF CYCLES AT 60Hz 10 REVERSE VOLTAGE. (V) 100 100 10.0 1 0.1 0.01 0.1 1 10 100 T, PULSE DURATION. (sec) Page 2/2 © 2006 Thinki Semiconductor Co.,Ltd. http://www.thinkisemi.com/