LINER LTC2855HDETRPBF 3.3v 20mbps rs485/rs422 transceivers with integrated switchable termination Datasheet

LTC2854/LTC2855
3.3V 20Mbps RS485/RS422
Transceivers with Integrated
Switchable Termination
DESCRIPTION
FEATURES
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The LTC®2854 and LTC2855 are low power, 20Mbps
RS485/RS422 transceivers operating on 3.3V supplies.
The receiver includes a logic-selectable 120Ω termination, one-eighth unit load supporting up to 256 nodes per
bus (C, I-Grade), and a failsafe feature that guarantees a
high output state under conditions of floating or shorted
inputs.
Integrated, Logic-Selectable 120Ω Termination
Resistor
3.3V Supply Voltage
20Mbps Maximum Data Rate
No Damage or Latchup Up to ±25kV HBM
High Input Impedance Supports 256 Nodes
(C, I-Grade)
Operation Up to 125°C (H-Grade)
Guaranteed Failsafe Receiver Operation Over the
Entire Common Mode Range
Current Limited Drivers and Thermal Shutdown
Delayed Micropower Shutdown: 5μA Maximum
(C, I-Grade)
Power Up/Down Glitch-Free Driver Outputs
Low Operating Current: 370μA Typical in
Receive Mode
Compatible with TIA/EIA-485-A Specifications
Available in 10-Pin 3mm × 3mm DFN, 12-Pin
4mm × 3mm DFN and 16-Pin SSOP Packages
The driver maintains a high output impedance over the
entire common mode range when disabled or when the
supply is removed. Excessive power dissipation caused by
bus contention or a fault is prevented by current limiting
all outputs and by a thermal shutdown.
Enhanced ESD protection allows the LTC2854 to withstand
±25kV (human body model) and the LTC2855 to withstand
±15kV on the transceiver interface pins without latchup
or damage.
PRODUCT SELECTION GUIDE
APPLICATIONS
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Low Power RS485/RS422 Transceiver
Level Translator
Backplane Transceiver
PART NUMBER
DUPLEX
PACKAGE
LTC2854
HALF
DFN-10
LTC2855
FULL
SSOP-16, DFN-12
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
TYPICAL APPLICATION
LTC2854
R
RO
RE
TE
DE
DI
LTC2854 at 20Mbps into 54Ω
LTC2854
R
RO
RE
TE
120Ω
120Ω
D
DI
DE
D
A
DI
B
2V/DIV
LTC2854
A-B
285455 TA01
120Ω
R
20ns/DIV
285455 TA01b
D
RO RE TE DE
DI
285455fa
1
LTC2854/LTC2855
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Supply Voltage (VCC) ................................... –0.3V to 7V
⎯ E⎯ , DE, DI, TE)............ –0.3V to 7V
Logic Input Voltages (R
Interface I/O:
A, B, Y, Z ...................................... (VCC –15V) to +15V
(A-B) or (B-A) with Terminator Enabled ..................6V
Receiver Output Voltage (RO) ........ –0.3V to (VCC +0.3V)
Operating Temperature (Note 4)
LTC2854C, LTC2855C .............................. 0°C to 70°C
LTC2854I, LTC2855I ............................ –40°C to 85°C
LTC2854H, LTC2855H........................ –40°C to 125°C
Storage Temperature Range................... –65°C to 150°C
Lead Temperature (Soldering, 10 sec)
GN Package ...................................................... 300°C
PIN CONFIGURATION
TOP VIEW
TOP VIEW
TOP VIEW
RO
RO
1
10 VCC
RE
2
9 B
DE
3
DI
4
9
Z
TE
5
8
Y
GND
6
7
NC
RE
2
DE
3
DI
4
7 NC
TE
5
6 GND
11
12 V CC
1
8 A
DD PACKAGE
10-LEAD (3mm × 3mm) PLASTIC DFN
EXPOSED PAD (PIN 11) PCB GND CONNECTION
TJMAX = 125°C, θJA = 43°C/W
θJC = 2.96°C/W
11 A
13
10 B
DE PACKAGE
12-LEAD (4mm × 3mm) PLASTIC DFN
EXPOSED PAD (PIN 13) PCB GND CONNECTION
TJMAX = 125°C, θJA = 44°C/W
θJC = 4.3°C/W
RO
1
16 VCC
RE
2
15 A
DE
3
14 B
DI
4
13 Z
TE
5
12 Y
GND
6
11 NC
NC
7
10 NC
NC
8
9
NC
GN PACKAGE
16-LEAD (NARROW 0.150) PLASTIC SSOP
TJMAX = 125°C, θJA = 110°C/W
θJC = 40°C/W
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC2854CDD#PBF
LTC2854CDD#TRPBF
LCQG
10-Lead (3mm × 3mm) Plastic DFN
0°C to 70°C
LTC2854IDD#PBF
LTC2854IDD#TRPBF
LCQG
10-Lead (3mm × 3mm) Plastic DFN
–40°C to 85°C
LTC2854HDD#PBF
LTC2854HDD#TRPBF
LCQG
10-Lead (3mm × 3mm) Plastic DFN
–40°C to 125°C
LTC2855CDE#PBF
LTC2855CDE#TRPBF
2855
12-Lead (4mm × 3mm) Plastic DFN
0°C to 70°C
LTC2855IDE#PBF
LTC2855IDE#TRPBF
2855
12-Lead (4mm × 3mm) Plastic DFN
–40°C to 85°C
LTC2855HDE#PBF
LTC2855HDE#TRPBF
2855
12-Lead (4mm × 3mm) Plastic DFN
–40°C to 125°C
LTC2855CGN#PBF
LTC2855CGN#TRPBF
2855
16-Lead (Narrow 0.150) Plastic SSOP
0°C to 70°C
LTC2855IGN#PBF
LTC2855IGN#TRPBF
2855I
16-Lead (Narrow 0.150) Plastic SSOP
–40°C to 85°C
LTC2855HGN#PBF
LTC2855HGN#TRPBF
2855H
16-Lead (Narrow 0.150) Plastic SSOP
–40°C to 125°C
LEAD BASED FINISH
TAPE AND REEL
PART MARKING*
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC2854CDD
LTC2854CDD#TR
LCQG
10-Lead (3mm × 3mm) Plastic DFN
0°C to 70°C
LTC2854IDD
LTC2854IDD#TR
LCQG
10-Lead (3mm × 3mm) Plastic DFN
–40°C to 85°C
LTC2854HDD
LTC2854HDD#TR
LCQG
10-Lead (3mm × 3mm) Plastic DFN
–40°C to 125°C
LTC2855CDE
LTC2855CDE#TR
2855
12-Lead (4mm × 3mm) Plastic DFN
0°C to 70°C
LTC2855IDE
LTC2855IDE#TR
2855
12-Lead (4mm × 3mm) Plastic DFN
–40°C to 85°C
LTC2855HDE
LTC2855HDE#TR
2855
12-Lead (4mm × 3mm) Plastic DFN
–40°C to 125°C
LTC2855CGN
LTC2855CGN#TR
2855
16-Lead (Narrow 0.150) Plastic SSOP
0°C to 70°C
LTC2855IGN
LTC2855IGN#TR
2855I
16-Lead (Narrow 0.150) Plastic SSOP
–40°C to 85°C
LTC2855HGN
LTC2855HGN#TR
2855H
16-Lead (Narrow 0.150) Plastic SSOP
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
285455fa
2
LTC2854/LTC2855
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C, VCC = 3.3V unless otherwise noted (Note 2).
SYMBOL
PARAMETER
CONDITIONS
MIN
Differential Driver Output Voltage
R = ∞, VCC = 3V (Figure 1)
R = 27Ω, VCC = 3V (Figure 1)
R = 50Ω, VCC = 3.13V (Figure 1)
●
●
●
R = 27Ω or R = 50Ω (Figure 1)
●
TYP
MAX
UNITS
VCC
VCC
VCC
V
V
V
0.2
V
Driver
|VOD|
Δ|VOD|
Change in Magnitude of Driver
Differential Output Voltage for
Complementary Output States
1.5
2
VOC
Driver Common Mode Output Voltage
R = 27Ω or R = 50Ω (Figure 1)
●
3
V
Δ|VOC|
Change in Magnitude of Driver
Common Mode Output Voltage for
Complementary Output States
R = 27Ω or R = 50Ω (Figure 1)
●
0.2
V
IOZD
Driver Three-State (High Impedance)
Output Current on Y and Z
DE = OV, (Y or Z) = –7V, 12V (LTC2855)
●
±10
μA
IOSD
Maximum Driver Short-Circuit Current
–7V ≤ (Y or Z) ≤ 12V (Figure 2)
±250
300
mA
mA
125
μA
180
●
–250
Receiver
IIN
RIN
Receiver Input Current (A, B)
Receiver Input Resistance
DE = TE = 0V, VCC = 0V or 3.3V, VIN = 12V
(Figure 3) (C, I-Grade)
DE = TE = 0V, VCC = 0V or 3.3V, VIN = –7V,
(Figure 3) (C, I-Grade)
●
DE = TE = 0V, VCC = 0V or 3.3V, VIN = 12V
(Figure 3) (H-Grade)
DE = TE = 0V, VCC = 0V or 3.3V, VIN = –7V,
(Figure 3) (H-Grade)
⎯ E⎯ = VCC or 0V, DE = TE = 0V,
R
VIN = –7V, –3V, 3V, 7V, 12V (Figure 3)
(C, I-Grade)
⎯ E⎯ = VCC or 0V, DE = TE = 0V,
R
VIN = –7V, –3V, 3V, 7V, 12V (Figure 3)
(H-Grade)
●
●
●
–100
μA
250
μA
●
–145
●
96
125
kΩ
●
48
125
kΩ
μA
VTH
Receiver Differential Input Threshold
Voltage
–7V ≤ B ≤ 12V
ΔVTH
Receiver Input Hysteresis
B = 0V
VOH
Receiver Output HIGH Voltage
I(RO) = –4mA, A-B = 200mV, VCC = 3V
●
VOL
Receiver Output LOW Voltage
●
0.4
V
IOZR
Receiver Three-State (High Impedance)
Output Current on RO
I(RO) = 4mA, A-B = –200mV, VCC = 3V
⎯R⎯E = VCC, 0V ≤ RO ≤ VCC
●
±1
μA
IOSR
Receiver Short-Circuit Current
0V ≤ RO ≤ VCC
●
±85
mA
RTERM
Receiver Input Terminating Resistor
TE = VCC, VAB = 2V, VB = –7V, 0V, 10V
(Figure 8)
●
108
156
Ω
VIH
Logic Input High Voltage
VCC = 3.6V
●
2
VIL
Logic Input Low Voltage
VCC = 3V
●
IINL
Logic Input Current
±0.2
25
V
mV
2.4
V
120
Logic
V
0.8
V
●
0
±10
μA
●
●
0
0
5
15
μA
μA
●
370
900
μA
Supplies
ICCS
ICCR
Supply Current in Shutdown Mode
Supply Current in Receive Mode
DE = 0V, ⎯R⎯E = VCC, TE = 0V
(LTC2854C/LTC2854I, LTC2855C/LTC2855I)
(LTC2854H, LTC2855H)
⎯ E⎯ = 0V, TE = 0V
DE = 0V, R
285455fa
3
LTC2854/LTC2855
ELECTRICAL CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C, VCC = 3.3V, TE = 0V unless otherwise noted (Note 2).
SYMBOL
PARAMETER
CONDITIONS
TYP
MAX
UNITS
ICCT
Supply Current in Transmit Mode
●
450
1000
μA
ICCTR
Supply Current with Both Driver and
Receiver Enabled
No Load, DE = VCC, ⎯R⎯E = VCC, TE = 0V
⎯ E⎯ = 0V, TE = 0V
No Load, DE = VCC, R
MIN
●
450
1000
μA
ICCTERM
Supply Current in Termination Mode
DE = 0V, ⎯R⎯E = VCC, TE = VCC
●
110
180
μA
ICCTERMR
Supply Current in Receive and
Termination Mode
DE = 0V, ⎯R⎯E = 0V, TE = VCC
●
450
950
μA
ICCTERMT
Supply Current in Transmit and
Termination Mode
DE = VCC, ⎯R⎯E = VCC, TE = VCC
●
470
1000
μA
ICCTERMTR
Supply Current with Driver, Receiver
and Termination Enabled
DE = VCC, ⎯R⎯E = 0V, TE = VCC
●
470
1000
μA
ESD Protection
ESD Protection for RS485/RS422 Pins
A, B on LTC2854, Human Body Model
±25
kV
Y, Z, A, B on LTC2855, Human Body Model
±15
kV
SWITCHING CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C, VCC = 3.3V, TE = 0V unless otherwise noted (Note 2).
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
fMAX
Maximum Data Rate
Note 3
●
tPLHD, tPHLD
Driver Input to Output
RDIFF = 54Ω, CL = 100pF (Figure 4)
●
10
50
ns
ΔtPD
Driver Input to Output Difference
|tPLHD-tPHLD|
RDIFF = 54Ω, CL = 100pF (Figure 4)
●
1
6
ns
tSKEWD
Driver Output Y to Output Z
RDIFF = 54Ω, CL = 100pF (Figure 4)
●
1
±6
ns
tRD, tFD
Driver Rise or Fall Time
4
12.5
ns
Driver Enable or Disable Time
RDIFF = 54Ω, CL = 100pF (Figure 4)
⎯ E⎯ = 0 (Figure 5)
RL = 500Ω, CL = 50pF, R
●
tZLD, tZHD, tLZD,
tHZD
●
70
ns
tZHSD, tZLSD
Driver Enable from Shutdown
●
8
μs
tSHDN
Time to Shutdown
⎯ E⎯ = VCC (Figure 5)
RL = 500Ω, CL = 50pF, R
⎯ E⎯ = VCC) or (DE = 0, ⎯R⎯E ↑)
(DE = ↓, R
(Figure 5)
●
100
ns
Driver
20
Mbps
Receiver
tPLHR, tPHLR
Receiver Input to Output
CL = 15pF, VCM = 1.5V, |VAB| = 1.5V, tR and
tF < 4ns (Figure 6)
●
50
70
ns
tSKEWR
Differential Receiver Skew
|tPLHR-tPHLR|
CL = 15pF (Figure 6)
●
1
6
ns
tRR, tFR
Receiver Output Rise or Fall Time
CL = 15pF (Figure 6)
●
3
12.5
ns
tZLR, tZHR, tLZR,
tHZR
Receiver Enable/Disable
RL = 1k, CL =15pF, DE = VCC (Figure 7)
●
50
ns
tZHSR, tZLSR
Receiver Enable from Shutdown
8
μs
Termination Enable or Disable Time
RL = 1k, CL = 15pF, DE = 0V (Figure 7)
⎯ E⎯ = VCC, DE = 0V
VB = 0V, VAB = 2V, R
(Figure 8)
●
tRTEN, tRTZ
●
100
μs
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: All currents into device pins are positive; all currents out of device
pins are negative. All voltages are referenced to device ground unless
otherwise specified.
Note 3: Maximum data rate is guaranteed by other measured parameters
and is not tested directly.
Note 4: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions.
Overtemperature protection activates at a junction temperature exceeding
150°C. Continuous operation above the specified maximum operating
junction temperature may result in device degradation or failure.
285455fa
4
LTC2854/LTC2855
TEST CIRCUITS
Y
GND
DI
OR
VCC
DRIVER
Z
Y
R
+
VOD
–
R
IOSD
GND
OR
DI
VCC
+
VOC
–
DRIVER
Z
+
–
–7V to +12V
285455 F01-2
Figure 1. Driver DC Characteristics
Figure 2. Driver Output Short-Circuit Current
IIN
VIN
+
–
A OR B
RECEIVER
B OR A
285455 F03
V
RIN = IN
IIN
Figure 3. Receiver Input Current and Input Resistance
VCC
DI
tPLHD
DI
Y
tPHLD
0V
CL
DRIVER
tSKEWD
RDIFF
VO
Y, Z
1/2 VO
CL
Z
90%
285455 F04a
Y-Z
10%
90%
0
0
10%
tRD
tFD
285455 F04b
Figure 4. Driver Timing Measurement
VCC
RL
Y
VCC
OR
GND
DI
CL
GND
OR
VCC
DE
1/2 VCC
0V
VO
Y OR Z
DRIVER
tZLD,
tZLSD
VCC
tLZD
1/2 VCC
0.5V
VOL
RL
DE
Z
CL
VCC
OR
GND
VOH
0.5V
1/2 VCC
Z OR Y
0V
285455 F05a
tZHD,
tZHSD
tHZD,
tSHDN
285455 F05b
Figure 5. Driver Enable and Disable Timing Measurements
285455fa
5
LTC2854/LTC2855
TEST CIRCUITS
tR
VAB
A
±VAB/2
VCM
RECEIVER
B
±VAB/2
A-B
–VAB
RO
CL
90%
10%
tPLHR
VCC
90%
1/2 VCC
10%
VO
RO
285455 F06a
tF
90%
0
10%
0
tPHLR
1/2 VCC
90%
10%
tRR
tFR
tSKEWR = tPLHR – tPHLR
285455 F06b
Figure 6. Receiver Propagation Delay Measurements
VCC
RE
1/2 VCC
0V
0V OR VCC
A
RECEIVER
VCC OR 0V
tZLR,
tZLSR
RL
RO
B
CL
RE
VCC
VCC
OR
GND
VO
RO
tLZR
1/2 VCC
0.5V
VOL
VOH
DI = 0V OR VCC
0.5V
1/2 VCC
RO
0V
285455 F07a
tZHR,
tZHSR
285455 F05b
tHZR
Figure 7. Receiver Enable and Disable Timing Measurements
RTERM = VAB
IA
IA
A
RO
+
–
RECEIVER
TE
VCC
TE
VAB
IA
B
+
–
1/2 VCC
0V
tRTEN
tRTZ
90%
10%
VB
285455F07
Figure 8. Termination Resistance and Timing Measurements
285455fa
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LTC2854/LTC2855
TYPICAL PERFORMANCE CHARACTERISTICS
Receiver Skew
vs Temperature
TA = 25°C, VCC = 3.3V, unless otherwise noted.
Driver Propagation Delay
vs Temperature
Driver Skew vs Temperature
2
18
RDIFF = 54Ω
CL = 100pF
1
0
16
PROP DELAY (ns)
1
DRIVER SKEW (ns)
RECEIVER SKEW (ns)
VAB = 1.5V
CL = 15pF
0
0
20
40
60
80
100 120
14
12
10
9
–1
–1
–40 –20
RDIFF = 54Ω
CL = 100pF
6
–40 –20
0
TEMPERATURE (˚C)
20
40
60
80
4
–40 –20
100 120
0
20
40
60
80
285455 G01
285455 G03
285455 G02
Driver Output Low/High Voltage
vs Output Current
RTERM vs Temperature
100 120
TEMPERATURE (˚C)
TEMPERATURE (˚C)
Driver Differential Output Voltage
vs Temperature
135
OUTPUT VOLTAGE (V)
3
RESISTANCE (Ω)
125
120
115
110
2
VOL
1
RDIFF = ∞
3
VOH
OUTPUT VOLTAGE (V)
130
RDIFF = 100Ω
RDIFF = 54Ω
2
1
105
100
–40 –20
20
40
60
80
100 120
0
10
TEMPERATURE (˚C)
20
30
40
50
60
70
SOURCE
65
PROP DELAY (ns)
3
VAB = 1.5V
CL = 15pF
60
55
50
RDIFF = 54Ω
40
30
RDIFF = 100Ω
20
10
40
2
3
4
5
6
35
–40 –20
RDIFF = ∞
0
20
40
60
80
100 120
TEMPERATURE (˚C)
OUTPUT CURRENT (mA)
285455 G07
100 120
CL = 100pF
SINK
1
80
50
45
0
60
Supply Current vs Data Rate
60
SUPPLY CURRENT (mA)
70
1
40
285455 G06
Receiver Propagation Delay
vs Temperature
2
20
TEMPERATURE (˚C)
285455 G05
Receiver Output Voltage vs
Output Current (Source and Sink)
0
0
OUTPUT CURRENT (mA)
285455 G04
OUTPUT VOLTAGE (V)
0
–40 –20
0
0
285455 G08
0
0.1
1
10
DATA RATE (Mbps)
100
285455 G09
285455fa
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LTC2854/LTC2855
PIN FUNCTIONS
(DD/DE/GN)
RO (Pin 1): Receiver Output. If the receiver output is enabled
(⎯R⎯E low) and A > B by 200mV, then RO will be high. If A
< B by 200mV, then RO will be low. If the receiver inputs
are open, shorted, or terminated without a signal, RO will
be high.
⎯R⎯E (Pin 2): Receiver Enable. A low enables the receiver.
A high input forces the receiver output into a high impedance state.
DE (Pin 3): Driver Enable. A high on DE enables the driver.
A low input will force the driver outputs into a high impedance. If ⎯R⎯E is high with DE and TE low, the part will enter
a low power shutdown state.
DI (Pin 4): Driver Input. If the driver outputs are enabled
(DE high), then a low on DI forces the driver positive output low and negative output high. A high on DI, with the
driver outputs enabled, forces the driver positive output
high and negative output low.
TE (Pin 5): Internal Termination Resistance Enable. A high
input will connect a termination resistor (120Ω typical)
between pins A and B.
GND (Pins 6,11/6,13/6): Ground. Pins 11 and 13 are
backside thermal pad, connected to Ground.
Y (Pins NA/8/12): Positive Driver Output for LTC2855.
Z (Pins NA/9/13): Negative Driver Output for LTC2855.
B (Pins 9/10/14): Negative Receiver Input (and Negative
Driver Output for LTC2854).
A (Pins 8/11/15): Positive Receiver Input (and Positive
Driver Output for LTC2854).
VCC (Pins 10/12/16): Positive Supply. VCC = 3.0V < VCC <
3.6V. Bypass with 0.1μF ceramic capacitor.
285455fa
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LTC2854/LTC2855
FUNCTION TABLES
LTC2854
DE
LOGIC INPUTS
⎯ ⎯E
R
TE
MODE
A, B
RO
TERMINATOR
0
0
0
RECEIVE
RIN
DRIVEN
OFF
0
0
1
RECEIVE WITH TERM
RTERM
DRIVEN
ON
0
1
0
SHUTDOWN
RIN
HIGH-Z
OFF
0
1
1
TERM ONLY
RTERM
HIGH-Z
ON
1
0
0
TRANSMIT WITH RECEIVE
DRIVEN
DRIVEN
OFF
1
0
1
TRANSMIT WITH RECEIVE
AND TERM
DRIVEN
DRIVEN
ON
1
1
0
TRANSMIT
DRIVEN
HIGH-Z
OFF
1
1
1
TRANSMIT WITH TERM
DRIVEN
HIGH-Z
ON
DE
LOGIC INPUTS
⎯ ⎯E
R
TE
MODE
A, B
Y, Z
RO
TERMINATOR
0
0
0
RECEIVE
RIN
HIGH-Z
DRIVEN
OFF
0
0
1
RECEIVE WITH TERM
RTERM
HIGH-Z
DRIVEN
ON
0
1
0
SHUTDOWN
RIN
HIGH-Z
HIGH-Z
OFF
0
1
1
TERM ONLY
RTERM
HIGH-Z
HIGH-Z
ON
1
0
0
TRANSMIT WITH RECEIVE
RIN
DRIVEN
DRIVEN
OFF
1
0
1
TRANSMIT WITH RECEIVE
AND TERM
RTERM
DRIVEN
DRIVEN
ON
1
1
0
TRANSMIT
RIN
DRIVEN
HIGH-Z
OFF
1
1
1
TRANSMIT WITH TERM
RTERM
DRIVEN
HIGH-Z
ON
LTC2855
BLOCK DIAGRAMS
RE
DE
LTC2854
LTC2855
VCC
VCC
A
25kV
SLEEP/SHUTDOWN
LOGIC AND DELAY
120Ω
RTERM
125k
RIN
RO
DE
120Ω
RTERM
TE
125k
RIN
RO
RECEIVER
B
25kV
B
(15kV)
125k
RIN
DI
DRIVER
A
(15kV)
SLEEP/SHUTDOWN
LOGIC AND DELAY
TE
RECEIVER
125k
RIN
DI
RE
Z
(15kV)
DRIVER
Y
(15kV)
GND
GND
285455 BD
285455fa
9
LTC2854/LTC2855
APPLICATIONS INFORMATION
Driver
The driver provides full RS485/RS422 compatibility. When
enabled, if DI is high, Y-Z is positive for the full-duplex
device (LTC2855) and A-B is positive for the half-duplex
device (LTC2854).
When the driver is disabled, both outputs are highimpedance. For the full-duplex LTC2855, the leakage on
the driver output pins is guaranteed to be less than 10μA
over the entire common mode range of –7V to +12V. On
the half-duplex LTC2854, the impedance is dominated by
the receiver input resistance, RIN.
Driver Overvoltage and Overcurrent Protection
The driver outputs are protected from short-circuits to
any voltage within the Absolute Maximum range of (VCC
–15V) to +15V. The typical peak current in this condition
does not exceed 180mA.
If a high driver output is shorted to a voltage just above
VCC , a reverse current will flow into the supply. When this
voltage exceeds VCC by about 1.4V, the reverse current
turns off. Preventing the driver from turning off with outputs
shorted to output voltages just above VCC keeps the driver
active even for receiver loads that have a positive common
mode with respect to the driver — a valid condition.
The worst-case peak reverse short-circuit current can be as
high as 300mA in extreme cold conditions. If this current
cannot be absorbed by the supply, a 3.6V Zener diode can
be added in parallel with the supply to sink this current.
the inputs are either shorted, left open, or terminated
(externally or internally), but not driven. This failsafe feature is guaranteed to work for inputs spanning the entire
common mode range of –7V to +12V.
The receiver output is internally driven high (to VCC) or
low (to ground) with no external pull-up needed. When
the receiver is disabled the RO pin becomes high-Z with
leakage of less than ±1μA for voltages within the supply
range.
Receiver Input Resistance
The receiver input resistance from A or B to ground is guaranteed to be greater than 96k (C, I-Grade) when the termination is disabled. This is 8X higher than the requirements
for the RS485 standard and thus this receiver represents a
one-eighth unit load. This, in turn, means that 8X the
standard number of receivers, or 256 total, can be connected to a line without loading it beyond what is called
out in the RS485 standard. The receiver input resistance
from A or B to ground on high temperature H-Grade parts
is greater than 48k providing a one-quarter unit load. The
input resistance of the receivers is unaffected by enabling/
disabling the receiver and by powering/unpowering the
part. The equivalent input resistance looking into A and B
is shown in Figure 9. The termination resistor cannot be
enabled by TE if the device is unpowered or in thermal
shutdown mode.
>96kΩ
A
All devices also feature thermal shutdown protection that
disables the driver and receiver in case of excessive power
dissipation (see Note 4).
60Ω
TE
Receiver and Failsafe
With the receiver enabled, when the absolute value of the
differential voltage between the A and B pins is greater than
200mV, the state of RO will reflect the polarity of (A-B).
The LTC2854/LTC2855 have a failsafe feature that guarantees the receiver output to be in a logic-high state when
60Ω
>96kΩ
285455 F09
B
Figure 9. Equivalent Input Resistance into A and B
(on the LTC2854, Valid if Driver is Disabled)
285455fa
10
LTC2854/LTC2855
APPLICATIONS INFORMATION
Proper cable termination is very important for good
signal fidelity. If the cable is not terminated with its characteristic impedance, reflections will result in distorted
waveforms.
When the TE pin is high, the termination resistor is enabled
and the differential resistance from A to B is 120Ω. Figure
10 shows the I/V characteristics between pins A and B
with the termination resistor enabled and disabled. The
resistance is maintained over the entire RS485 common
mode range of –7V to +12V as shown in Figure 11.
The LTC2854/LTC2855 are the first 3.3V RS485/RS422
transceivers to offer integrated switchable termination
resistors on the receiver input pins. This provides the
advantage of being able to easily change, through logic
control, the line termination for optimal performance when
configuring transceiver networks.
The integrated termination resistor has a high frequency
response which does not limit performance at the maximum
specified data rate. Figure 12 shows the magnitude and
phase of the termination impedance vs frequency.
Switchable Termination
150
VAB = 2V
RESISTANCE (Ω)
140
130
120
110
100
–10
–5
5
10
0
COMMON MODE VOLTAGE (V)
Figure 10. Curve Trace Between A and B
with Termination Enabled and Disabled
15
285455 F11
Figure 11. Typical Resistance of the
Enabled Terminator vs Voltage on B Pin
185
30
15
PHASE
155
0
140
–15
MAGNITUDE
125
–30
110
– 45
95
– 60
80
10 –1
10 0
FREQUENCY (MHz)
PHASE (°)
MAGNITUDE (Ω)
170
– 75
101
285455 F12
Figure 12. Termination Magnitude
and Phase vs Frequency
285455fa
11
LTC2854/LTC2855
APPLICATIONS INFORMATION
Supply Current
The unloaded static supply currents in the LTC2854/
LTC2855 are very low —typically under 500μA for all
modes of operation. In applications with resistively terminated cables, the supply current is dominated by the
driver load. For example, when using two 120Ω terminators with a differential driver output voltage of 2V, the DC
current is 33mA, which is sourced by the positive voltage
supply. This is true whether the terminators are external
or internal such as in the LTC2854/LTC2855. Power supply current increases with toggling rate due to capacitive
loading and this term can increase significantly at high
data rates. Figure 13 shows supply current vs data rate for
two different capacitive loads for the circuit configuration
of Figure 4.
80
The logic inputs of the LTC2854/LTC2855 have 150mV of
hysteresis to provide noise immunity. Fast edges on the
outputs can cause glitches in the ground and power supplies
which are exacerbated by capacitive loading. If a logic input
is held near its threshold (typically 1.5V), a noise glitch
from a driver transition may exceed the hysteresis levels
on the logic and data input pins causing an unintended
state change. This can be avoided by maintaining normal
logic levels on the pins and by slewing inputs through
their thresholds by faster than 1V/μs when transitioning.
Good supply decoupling and proper line termination also
reduces glitches caused by driver transitions.
Cable Length vs Data Rate
RDIFF = 54Ω
70
SUPPLY CURRENT (mA)
the full duplex LTC2855, DI and A/B should not be routed
near the driver or receiver outputs.
C L = 1000pF
60
50
40
C L = 100pF
30
20
0.1
1
10
DATA RATE (Mbps)
100
285455 F13
For a given data rate, the maximum transmission distance
is bounded by the cable properties. A typical curve of
cable length vs data rate compliant with the RS485/RS422
standards is shown in Figure 14. Three regions of this
curve reflect different performance limiting factors in data
transmission. In the flat region of the curve, maximum
distance is determined by resistive losses in the cable. The
downward sloping region represents limits in distance and
data rate due to AC losses in the cable. The solid vertical
line represents the specified maximum data rate in the
RS485/RS422 standards. The dashed lines at 20Mbps show
the maximum data rates of the LTC2854/LTC2855.
Figure 13. Supply Current vs Data Rate
10k
A ground plane layout is recommended for the LTC2854/
LTC2855. A 0.1μF bypass capacitor less than one-quarter
inch away from the VCC pin is also recommended. The PC
board traces connected to signals A/B and Z/Y (LTC2855)
should be symmetrical and as short as possible to maintain
good differential signal integrity. To minimize capacitive
effects, the differential signals should be separated by more
than the width of a trace and should not be routed on top
of each other if they are on different signal planes.
Care should be taken to route outputs away from any
sensitive inputs to reduce feedback effects that might
cause noise, jitter, or even oscillations. For example, in
CABLE LENGTH (FT)
High Speed Considerations
1k
LTC2854/LTC2855
MAX DATA RATE
100
RS485/RS422
MAX DATA RATE
10
10k
100k
1M
10M
DATA RATE (bps)
100M
285455 F14
Figure 14. Cable Length vs Data Rate (RS485/
RS422 Standards Shown in Vertical Solid Line)
285455fa
12
LTC2854/LTC2855
TYPICAL APPLICATION
Failsafe “0” Application (Idle State = Logic “0”)
VCC
100kΩ
RO
LTC2854
R
I1
B
A
DI
D
I2
"A"
"B"
285455 TA03
PACKAGE DESCRIPTION
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
R = 0.115
TYP
6
0.38 ± 0.10
10
0.675 ±0.05
3.50 ±0.05
1.65 ±0.05
2.15 ±0.05 (2 SIDES)
3.00 ±0.10
(4 SIDES)
PACKAGE
OUTLINE
1.65 ± 0.10
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
(DD) DFN 1103
5
0.25 ± 0.05
0.200 REF
0.50
BSC
2.38 ±0.05
(2 SIDES)
1
0.75 ±0.05
0.00 – 0.05
0.25 ± 0.05
0.50 BSC
2.38 ±0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
285455fa
13
LTC2854/LTC2855
PACKAGE DESCRIPTION
DE/UE Package
12-Lead Plastic DFN (4mm × 3mm)
(Reference LTC DWG # 05-08-1695)
0.70 ±0.05
3.60 ±0.05
1.70 ±0.05
2.20 ±0.05 (2 SIDES)
PACKAGE OUTLINE
0.25 ± 0.05
3.30 ±0.05
(2 SIDES)
0.50
BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
4.00 ±0.10
(2 SIDES)
7
R = 0.115
TYP
0.40 ± 0.10
12
R = 0.05
TYP
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
3.00 ±0.10
(2 SIDES)
1.70 ± 0.05
(2 SIDES)
PIN 1 NOTCH
R = 0.20 OR
0.35 × 45°
CHAMFER
0.75 ±0.05
0.00 – 0.05
6
0.25 ± 0.05
3.30 ±0.05
(2 SIDES)
1
(UE12/DE12) DFN 0905 REV C
0.50
BSC
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
285455fa
14
LTC2854/LTC2855
PACKAGE DESCRIPTION
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
.189 – .196*
(4.801 – 4.978)
.045 ±.005
.009
(0.229)
REF
16 15 14 13 12 11 10 9
.254 MIN
.150 – .165
.229 – .244
(5.817 – 6.198)
.0165 ± .0015
.150 – .157**
(3.810 – 3.988)
.0250 BSC
RECOMMENDED SOLDER PAD LAYOUT
1
.015 ± .004
× 45°
(0.38 ± 0.10)
.007 – .0098
(0.178 – 0.249)
2 3
4
5 6
7
.0532 – .0688
(1.35 – 1.75)
8
.004 – .0098
(0.102 – 0.249)
0° – 8° TYP
.016 – .050
(0.406 – 1.270)
NOTE:
1. CONTROLLING DIMENSION: INCHES
INCHES
2. DIMENSIONS ARE IN
(MILLIMETERS)
.008 – .012
(0.203 – 0.305)
TYP
.0250
(0.635)
BSC
GN16 (SSOP) 0204
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
3. DRAWING NOT TO SCALE
285455fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
15
LTC2854/LTC2855
TYPICAL APPLICATION
Multi-Node Network with End Termination Using the LTC2854
TE = 0V
TE = 0V
D
R
D
R
LTC2854
LTC2854
LTC2854
LTC2854
R
R
TE = 3.3V
TE = 3.3V
D
D
285455 TA04
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LTC485
Low Power RS485 Interface Transceiver
ICC = 300μA (Typ)
LTC491
Differential Driver and Receiver Pair
ICC = 300μA
LTC1480
3.3V Ultralow Power RS485 Transceiver
3.3V Operation
LTC1483
Ultralow Power RS485 Low EMI Transceiver
Controlled Driver Slew Rate
LTC1485
Differential Bus Transceiver
10Mbps Operation
LTC1487
Ultralow Power RS485 with Low EMI, Shutdown and High
Input Impedance
Up to 256 Transceivers on the Bus
LTC1520
50Mbps Precision Quad Line Receiver
Channel-to-Channel Skew 400ps (Typ)
LTC1535
Isolated RS485 Full-Duplex Transceiver
2500VRMS Isolation in Surface Mount Package
LTC1685
52Mbps RS485 Transceiver with Precision Delay
Propagation Delay Skew 500ps (Typ)
LT1785
60V Fault Protected RS485 Transceiver
60V Tolerant, 15kV ESD
LTC2856/LTC2857/ 20Mbps and Slew Rate-Limited, 15kV RS485/RS422
LTC2858
Transceiver
Up to 256 Transceivers on the Bus
LTC2859/LTC2861
5V Integrated, Switchable, 120Ω Termination Resistor, 15kV ESD
20Mbps RS485 Transceiver with Integrated Switchable
Termination
285455fa
16 Linear Technology Corporation
LT 1107 REV A • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 ● FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2007