ETC2 LEC-3200 2u fanless rackmount communication platform with intelâ® atomâ ¢ n270 Datasheet

LEC-3200
2U Fanless Rackmount Communication
Platform with Intel® Atom™ N270
Specifications
Processor Options
Chipset
BIOS
Sockets
System
Technology
Memory
Max. Capacity
NAND Flash
HDD Support
Intel® Atom™ N270 (1.6GHz)
Intel 945GSE+ICH7M
AMI Flash BIOS
1 x 200-pin DDR2 SO-DIMM socket
200-pin DDR2 SO-DIMM x1
Up to 2 GB
USB 2.0 compliant hosts x3, Type A connector, Internal
pin-connector x1
PCI-104
Window XP Embedded, Linux
None
2.5” HDD/SSD drive bay x1
Expansion
CF socket Type I/II x1, 2x22Pin IDE connector, SATAx1
LAN
Controller
Magnetic Isolation
Protection
4x10/100/1000Mbps, 1x10/100Mbps Autosensing
Intel 82574L x4
USB
Expansion Bus
OS Support
COMx4
AC/DC Input DIO COM x4
COMx4
COMx4
Features
COM x2
DVI
USB LAN GigaLAN
x2 x1 x4
Rich I/O interface
This product provides rich I/O
interface in rear wiring, includes
4 GbE LAN ports and 10 optically
isolated serial COM ports for
communication.
Wide voltage input range
This product supports a wider
range of voltage inputs, allows
for easier onsite implementation
by lessening the need for an
external power supply.
IEC-61850-3
This platform passed the IEC61850-3 test- the hardware
section of the IEC-61850
compliance. These tests include
electro-magnetic interference,
temperature range and shock/
vibration tests.
Clear LED indicators in Front
Panel
LED indicators makes it easy to
check working status.
Support AC and DC power
input
This product support both AC
and DC power input.
Storage
Networking
Serial Interface
Serial Standard
ESD Protection
Isolation Protection
RS-232
RS-422
Serial Signals
RS-485
Baudrate
Digital Input
Digital I/O
Display
Digital Output
Connector
Graphic Controller
Display Interface
LEDs
Last Updated: 20,Dec,2012
[email protected]
www.lannerinc.com
1.5 KV built-in
2xDB9, & 2x20pin terminal block for 10xRS232/422/485(LEC-3200)
2xDB9 & 4x20pin terminal block for 18xRS232/422/485(LEC-3200C)
15 KV for all signals
Digital Isolation Protection
Tx,Rx,DTR,DSR,RTS,CTS,DCD,GND
TxD+,TxD-,RxD-,RxD+,GND
Data+,Data-,GND
Support 50bps to 921.6Kbps
Logic level 0:0~+2Vdc
Logic level 1:+3~10Vdc
Logic level 0:0Vdc
Logic level 1:5Vdc
2x5 pin terminal block
Intel 910GMLE
DVI-I x1; DVI-D:1600x1200
Power, Storage, 4xPIO, 1xRun(User defined), 5xAct,
5xLink, 10xRx, 10xTx
Specifications are subject to change without notice
Last Updated: 20,Dec,2012
[email protected]
440
89
Housing
(SECC) Sheet Meal
Weight
3.2Kg
Physical Char440x89x351.5mm (17.32”x3.50”x13.84”)(without
Dimensions (WxHxD)
acteristics
rackmoun ears)
Mounting Options
Standard 19-inch rackmount
Operation Tempera-20~55°C
ture
Storage Temperature -40~80°C
Environment
Ambient Relative
Humidity (non-con- 5 to 95% (non-condensing)
densing)
Dual Power Input
Input Voltage
9~36Vdc,100~240Vac
Power
Power Consumption 28W
Connector
2-pin and 3-pin terminal block
Safety
Standard and
EMC
CE/FCC
Regulations
Green product
RoHS
Built-in buzzer and RTC (real-time clock) with battery
Alter tool
lithium backup
Automatic Reboot
Watchdog Timer 1~255 level
Reliability
Trigger
Warranty
2 Years
MTBF
275,952 hrs
351,5
Dimensions 440x89x351.5mm (17.32”x3.50”x13.84”)
Specifications
Ordering Information
LEC-3200
Fanless 2U rackmount communication platform with Intel® Atom™
N270 (1.6GHz), 4 x GbE LAN+1x10/100Mbps LAN, 18 x digital isolated Serial ports
LEC-3200C
Fanless 2U rackmount communication platform with Intel® Atom™
N270 (1.6GHz), 4 x GbE LAN+1x10/100Mbps LAN, 10 x digital isolated Serial ports, 2 x CAN ports
www.lannerinc.com
Specifications are subject to change without notice
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