Microsemi MSMLJ11A Surface mount 3000 watt transient voltage suppressor Datasheet

TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
SURFACE MOUNT 3000 Watt
Transient Voltage Suppressor
DEVICES
- High Reliability controlled devices
- Unidirectional (A) and Bidirectional (CA) construction
- Available in both J-bend and Gull-wing terminations
- Selections for 5.0 to 170 V standoff voltages (VWM)
MSMLJ5.0A thru MSMLJ170CA, e3
and MSMLG5.0A thru MSMLG170CA, e3
LEVELS
M, MA, MX, MXL
FEATURES



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
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High reliability controlled devices with wafer fabrication and assembly lot traceability
100 % surge tested devices
Optional upscreening available by replacing the M prefix with MA, MX or MXL. These prefixes specify
various screening and conformance inspection options based on MIL-PRF-19500. Refer to MicroNote 129
for more details on the screening options.
Axial-lead equivalent packages for thru-hole mounting available as M5KP5.0A to M5KP110CA with 5000 W
rating, (consult factory for other surface mount options)
Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B
RoHS compliant devices available by adding an “e3” suffix
3σ lot norm screening performed on Standby Current ID
APPLICATIONS / BENEFITS






Suppresses transients up to 3000 watts @ 10/1000 µs
Protection from switching transients and induced RF
Protection from ESD, and EFT per IEC 61000-4-2 and IEC 61000-4-4
Secondary lightning protection per IEC61000-4-5 with 42 Ohms source impedance:
o
Class 1 & 2: MSML5.0A to MSML 170ACA
o
Class 3: MSML5.0A to MSML150CA
o
Class 4: MSML5.0A to MSML75CA
Secondary lightning protection per IEC61000-4-5 with 12 Ohms source impedance:
o
Class 1: MSML5.0A to MSML170CA
o
Class 2: MSML5.0A to MSML90CA
o
Class 3: MSML5.0A to MSML48CA
o
Class 4: MSML5.0A to MSML24CA
Secondary lightning protection per IEC61000-4-5 with 2 Ohms source impedance:
o
Class 2: MSML5.0A to MSML43CA
o
Class 3: MSML5.0A to MSML22CA
o
Class 4: MSML5.0A to MSML10CA
MAXIMUM RATINGS

Peak Pulse Power dissipation at 25 ºC: 3000 watts at 10/1000 μs (also see Figures 1,2, and 3) with
impulse repetition rate (duty factor) of 0.01 % or less



tclamping (0 V to VBR min.): < 100 ps theoretical for unidirectional and < 5 ns for bidirectional
Operating and Storage temperature: -65 ºC to +150 ºC
Thermal resistance: 17.5 ºC/W junction to lead, or 77.5 ºC/W junction to ambient when mounted on FR4
PC board (1 oz Cu) with recommended footprint Steady-State Power dissipation: 6 watts at TL = 45 ºC, or
1.61 watts at TA = 25 ºC when mounted on FR4 PC board with recommended footprint (see page 2)
Forward Surge at 25 ºC: 200 Amps peak impulse of 8.3 ms half-sine wave (unidirectional only)
Solder temperatures: 260 ºC for 10 s (maximum)


RF01003 Rev A, June 2010
High Reliability Product Group
Page 1 of 4
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
___________________________________________________________________________________________________________________________________
MECHANICAL AND PACKAGING







Void-free transfer molded thermosetting epoxy body meeting UL94V-0
Gull-wing or J-bend tin-lead (90 % Sn, 10 % Pb) or RoHS (100 % Sn) compliant annealed matte-tin plating
solderable per MIL-STD-750, method 2026
Cathode indicated by band. No cathode band on bi-directional devices.
Part number marked on package
Available in bulk or custom tape-and-reel packaging
TAPE-AND-REEL option available with up to 750 per 7 inch reel or up to 2500 per 13 inch reel EIA-481-B with 16
mm tape. Add “TR” suffix to part number.
Weight: 0.25 gram (approximately)
PACKAGE DIMENSIONS
(SMLJ)
(SMLG)
(DO-214AB)
MIN
MAX
A
.115
.121
MIN
MAX
2.92
3.07
DIMENSIONS IN INCHES
B
C
D
E
F
.260 .220 .305 .077 .380
.280 .245 .320 .104 .400
DIMENSIONS IN MILLIMETERS
6.60 5.59 7.75 1.95 9.65
7.11 6.22 8.13 2.65 10.16
K
.025
.040
L
.030
.060
0.635
1.016
.760
1.520
Typical Standoff Height: 0.004” – 0.008” (0.1mm – 0.2mm)
(DO-215AB)
PAD LAYOUT
SMLJ (DO-214AB)
A
B
C
INCHES
0.390
0.110
0.150
mm
9.90
2.79
3.81
SMLG (DO-215AB)
A
B
C
INCHES
0.510
0.110
0.150
mm
12.95
2.79
3.81
SYMBOLS & DEFINITIONS
Symbol
VWM
PPP
VBR
ID
Definition
Symbol
Working Peak (Standoff) Voltage
Peak Pulse Power
Breakdown Voltage
Standby Current
RF01003 Rev A, June 2010
IPP
VC
IBR
Definition
Peak Pulse Current
Clamping Voltage
Breakdown Current for VBR
High Reliability Product Group
Page 2 of 4
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
___________________________________________________________________________________________________________________________________
ELECTRICAL CHARACTERISTICS @ 25oC
MICROSEMI PART NUMBER
GULL-WING
MSMLG5.0A
MSMLG6.0A
MSMLG6.5A
MSMLG7.0A
MSMLG7.5A
MSMLG8.0A
MSMLG8.5A
MSMLG9.0A
MSMLG10A
MSMLG11A
MSMLG12A
MSMLG13A
MSMLG14A
MSMLG15A
MSMLG16A
MSMLG17A
MSMLG18A
MSMLG20A
MSMLG22A
MSMLG24A
MSMLG26A
MSMLG28A
MSMLG30A
MSMLG33A
MSMLG36A
MSMLG40A
MSMLG43A
MSMLG45A
MSMLG48A
MSMLG51A
MSMLG54A
MSMLG58A
MSMLG60A
MSMLG64A
MSMLG70A
MSMLG75A
MSMLG78A
MSMLG85A
MSMLG90A
MSMLG100A
MSMLG110A
MSMLG120A
MSMLG130A
MSMLG150A
MSMLG160A
MSMLG170A
NOTE 1:
NOTE 2:
J- BEND
MSMLJ5.0A
MSMLJ6.0A
MSMLJ6.5A
MSMLJ7.0A
MSMLJ7.5A
MSMLJ8.0A
MSMLJ8.5A
MSMLJ9.0A
MSMLJ10A
MSMLJ11A
MSMLJ12A
MSMLJ13A
MSMLJ14A
MSMLJ15A
MSMLJ16A
MSMLJ17A
MSMLJ18A
MSMLJ20A
MSMLJ22A
MSMLJ24A
MSMLJ26A
MSMLJ28A
MSMLJ30A
MSMLJ33A
MSMLJ36A
MSMLJ40A
MSMLJ43A
MSMLJ45A
MSMLJ48A
MSMLJ51A
MSMLJ54A
MSMLJ58A
MSMLJ60A
MSMLJ64A
MSMLJ70A
MSMLJ75A
MSMLJ78A
MSMLJ85A
MSMLJ90A
MSMLJ100A
MSMLJ110A
MSMLJ120A
MSMLJ130A
MSMLJ150A
MSMLJ160A
MSMLJ170A
REVERSE
STAND-OFF
VOLTAGE
VWM
V
5.0
6.0
6.5
7.0
7.5
8.0
8.5
9.0
10
11
12
13
14
15
16
17
18
20
22
24
26
28
30
33
36
40
43
45
48
51
54
58
60
64
70
75
78
85
90
100
110
120
130
150
160
170
BREAKDOWN VOLTAGE
VBR @ IBR
V
6.40 – 7.00
6.67 – 7.37
7.22 – 7.98
7.78 – 8.60
8.33 – 9.21
8.89 – 9.83
9.44 – 10.4
10.0 – 11.1
11.1 – 12.3
12.2 – 13.5
13.3 – 14.7
14.4 – 15.9
15.6 – 17.2
16.7 – 18.5
17.8 – 19.7
18.9 – 20.9
20.0 – 22.1
22.2 – 24.5
24.4 – 26.9
26.7 – 29.5
28.9 – 31.9
31.1 – 34.4
33.3 – 36.8
36.7 – 40.6
40.0 – 44.2
44.4 – 49.1
47.8 – 52.8
50.0 – 55.3
53.3 – 58.9
56.7 – 62.7
60.0 – 66.3
64.4 – 71.2
66.7 – 73.7
71.1 – 78.6
77.8 – 86.0
83.3 – 92.1
86.7 – 95.8
94.4 – 104.0
100 – 111
111 – 123
122 – 135
133 – 147
144 – 159
167 – 185
178 – 197
189 – 209
MAXIMUM
CLAMPING
VOLTAGE
VC @ IPP
PEAK PULSE
CURRENT
(see Fig. 2)
IPP
MAXIMUM
STANDBY
CURRENT
ID @ VWM
V
9.2
10.3
11.2
12.0
12.9
13.6
14.4
15.4
17.0
18.2
19.9
21.5
23.2
24.4
26.0
27.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
58.1
64.5
69.4
72.7
77.4
82.4
87.1
93.6
96.8
103.0
113
121
126
137
146
162
177
193
209
243
259
275
A
326.0
291.3
267.9
250.0
232.6
220.6
208.4
194.8
176.4
164.8
150.6
139.4
129.4
123.0
115.4
106.6
102.8
92.6
84.4
77.2
71.2
66.0
62.0
56.2
51.6
46.4
43.2
41.2
38.8
36.4
34.4
32.0
31.0
29.2
26.6
24.8
22.8
20.8
20.6
18.6
16.8
15.6
14.4
12.4
11.6
11.0
A
1000
1000
500
200
100
50
25
10
5
5
5
5
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
mA
10
10
10
10
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
For Bidirectional device types indicate a CA suffix after the part number (i.e. MSMLG170CA). Bidirectional
capacitance is half that shown in Figure 4 at zero volts.
Microsemi Corp’s SML series (3000W) surface mountable packages are designed specifically for transient voltage
suppression. The wide leads assure a large surface contact for good heat dissipation, and a low resistance path for
surge current flow to ground. These high-speed transient voltage suppressors can be used to effectively protect
sensitive components such as integrated circuits and MOS devices.
RF01003 Rev A, June 2010
High Reliability Product Group
Page 3 of 4
TECHNICAL DATA SHEET
Gort Road Business Park, Ennis, Co. Clare, Ireland.
Tel: +353 (0) 65 6840044, Fax: +353 (0) 65 6822298
6 Lake Street, Lawrence, MA 01841
Tel: 1-800-446-1158 / (978) 794-1666, Fax: (978) 6890803
Website: http://www.microsemi.com
___________________________________________________________________________________________________________________________________
GRAPHS
(Waveform – See Figure 2)
Non-repetitive
10
1.0
0
1s
10sec
100sec
1ms
10ms
FIGURE 2 – Pulse waveform
C: Capacitance in pico farads
tp – Pulse Time – sec
FIGURE 1 – Peak Pulse Power vs. Pulse Time
Peak Pulse Power (PPP) or continuous
Power in Percent of 25oC Rating
(PPP) – Peak Pulse Power - kW
100
BV: Breakdown Voltage in Volts
TL Lead Temperature oC
FIGURE 3 – Derating Curve
RF01003 Rev A, June 2010
FIGURE 4 Typical Capacitance vs. Breakdown
High Reliability Product Group
Page 4 of 4
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