AVAGO HLMP-0504 Rectangular light emitting surface Datasheet

HLMP-R100, HLMP-0301, HLMP-0401, HLMP-0504
2.5 mm x 7.6 mm Rectangular LED Lamps
Data Sheet
Description
Features
The HLMP-R100, -0301, -0401, ‑0504 are solid state
lamps encapsulated in a radial lead rectangular epoxy
package. They utilize a tinted, diffused epoxy to
provide high on-off contrast and a flat high inten­sity
emitting surface. Borderless package design allows
creation of uninterrupted light emitting areas.
• Rectangular light emitting surface
The HLMP-R100 uses a double heterojunction (DH)
absorbing substrate (AS) aluminum gallium arsenide
(AlGaAs) red LED chip in a light red epoxy package. This
combination produces outstanding light output over a
wide range of drive currents.
• Long life: solid state reliability
The HLMP-0301 has a high efficiency red GaAsP on
GaP LED chip in a light red epoxy package.
The HLMP-0401 provides a yellow GaAsP on GaP LED chip
in a yellow epoxy package.
• Flat high sterance emitting surface
• Stackable on 2.54 mm (0.100 inch) centers
• Ideal as flush mounted panel indicators
• Ideal for backlighting legends
• Choice of 4 bright colors
– DH AS AlGaAs Red
– High Efficiency Red
– Yellow
– High Performance Green
• IC compatible/low current requirements
The HLMP-0504 provides a green GaP LED chip in a green
epoxy package.
Package Dimensions
7.62 (0.300)
7.11 (0.280)
7.62 (0.300)
6.99 (0.275)
0.46 (0.018)
SQ. NOMINAL
2.54 (0.100)
NOMINAL
CATHODE LEAD
29.21 (1.15) MIN.
8.00 (0.315)
7.37 (0.290)
2.54 (0.100)
2.16 (0.085)
1.27 (0.50)
NOMINAL
2.54 (0.100)
2.29 (0.090)
SIDE VIEW
BOTTOM VIEW
NOTES:
1. ALL DIMENSIONS ARE IN
MILLIMETERS (INCHES).
2. AN EPOXY MENISCUS MAY EXTEND
ABOUT 1 mm (0.040") DOWN THE LEADS.
3. THERE IS A MXIMUM 1 TAPER FROM
BASE TO THE TOP OF LAMP.
Selection Guide
Luminous Intensity
Iv (mcd) at 20 mA
Color
Part Number
Min.
Typ.
DH AlGaAs Red
HLMP-R100
2.1
–
Red
HLMP-0301
2.1
–
HLMP-0301-C00xx
1.3
–
HLMP-0401
3.6
–
HLMP-0401-B00xx
1.4
–
HLMP-0401-D00xx
3.6
–
HLMP-0504
2.6
–
HLMP-0504-B00xx
1.6
–
HLMP-0504-C00xx
2.6
–
Yellow
Green
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk
02: Tape & Reel, Straight Leads
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (No Maximum Limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Color Options
1. As AlGaAs Red
3. High Efficiency Red
4. Yellow
5. Green
Package Options
R,0: Rectangular 2.5 mm x 7.6 mm
2
Absolute Maximum Ratings at TA = 25°C
Parameter
HLMP-R100
HLMP-0301
HLMP-0401
HLMP-0504
Units
Peak Forward Current
300
90
60
90
mA
Average Forward Current[1]
20
25
20
25
mA
DC Current[2]
30
30
20
30
mA
Power Dissipation
87
135
85
135
mW
Reverse Voltage (IR = 100 μA)
5
5
5
5
V
Transient Forward Current[3] (10 μs Pulse)
500
500
500
500
mA
Operating Temperature Range
-20 to +100
-40 to +100
-40 to +100
-20 to +100
°C
Storage Temperature Range
-40 to +100
-40 to +100
-40 to +100
-40 to +100
Notes:
1. See Figure 5 to establish pulsed operating conditions.
2. For AlGaAs Red, Red, and Green Series derate linearly from 50°C at 0.5 mA/°C. For Yellow Series derate linearly from 50°C at 0.2 mA/°C.
3. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that the device be operated at peak current beyond the peak forward current listed in the Absolute Maximum
Ratings.
3
Electrical/Optical Characteristics at TA = 25°C
HLMP-R100
HLMP-0301
HLMP-0401
HLMP-0504
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Units
Test
Conditions
Sym.
Description
2q1/2
Included Angle
Between Half
Luminous
Intensity Points
100
100
100
100
Deg.
Note 1.
Fig. 6
lP
Peak Wavelength
645
635
583
565
nm
Measurement at
Peak
ld
Dominant
Wavelength
637
626
585
569
nm
Note 2.
Dl1/2
Spectral Line
Halfwidth
20
40
36
28
nm
ts
Speed of Response
30
90
90
500
ns
C
Capacitance
30
16
18
18
pF
VF = 0;
f = 1 MHz
RqJ-PIN
Thermal Resistance
260
260
260
260
°C/W
Junction
to Cathode
Lead
VF
Forward Voltage
1.8
V
IF = 20 mA
Figure 2.
VR
Reverse Breakdown
Voltage
V
IR = 100 μA
hv
Luminous Efficacy
lm/W
Note 3.
2.2
1.9
5.0
2.6
5.0
80
2.1
2.6
5.0
145
2.2
3.0
5.0
500
595
Notes:
1. q1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the
device.
3. Radiant intensity, Ie, in watts/steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv is the
luminous efficacy in lumens/watt.
1.0
TA = 25 °C
AlGaAs RED
RELATIVE INTENSITY
GREEN
0.5
YELLOW
0
500
HIGH EFFICIENCY RED
550
600
650
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
4
700
750
80
70
60
HER
50
YELLOW
40
30
20
GREEN
10
0
1.0
2.0
1.3
2.0
HER, YELLOW, GREEN
1.5
1.0
AlGaAs RED
0.5
4.0
3.0
5.0
0.9
0.8
AlGaAs RED
0.7
0.6
0
5
30
25
0
Hz
2
z
100
300 H
10
1 KHz
z
1
tP – PULSE DURATION – s
HER, ORANGE, YELLOW, and GREEN
3 KHz
IPEAK MAX. RATIO OF MAXIMUM PEAK CURRENT
TO TEMPERATURE DERATED
IDC MAX.
MAXIMUM DC CURRENT
100
4
3
1
10,000
1000
10000
tp – PULSE DURATION – s
AlGaAs RED
Figure 5. Maximum tolerable peak current vs. peak duration (IPEAK MAX determined from temperature derated IDC MAX).
20
30
40
50
10
0
1.0
0.8
0.6
60
70
80
90
0.4
0.2
10
20
30
40
Figure 6. Relative luminous intensity vs. angular displacement.
5
50
60
70
80
90 100
20
30
40
50
60
70
80
90
Figure 4. Relative efficiency (luminous intensity
per unit current) vs. peak current. hv (300 mA) for
AlGaAs Red = 0.7.
ATE –
5
10 KH
1000
10
9
8
7
6
10
IPEAK – PEAK CURRENT PER LED – mA
SH R
1.5
100
20
EFRE
z
z
100 H
z
1 KHz
300 H
3 KHz
z
10 KH
Hz
30 KH
2.0
10
15
10
f–R
3.0
100 K
RATIO OF MAXIMUM TOLERABLE
PEAK CURRENT TO MAXIMUM
TOLERABLE DC CURRENT
GREEN
1.0
0.4
Figure 3. Relative luminous intensity vs. forward
current.
4.0
IPEAK MAX.
IDC MAX.
1.1
IDC – DC CURRENT PER LED – mA
Figure 2. Forward current vs. forward voltage.
VF (300 mA) for AlGaAs Red = 2.6 volts typical.
1
HER
0.5
0
VF – FORWARD VOLTAGE – V
1.0
YELLOW
1.2
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
IF – FORWARD CURRENT – mA
2.5
AlGaAs
RED
ηPEAK – RELATIVE EFFICIENCY
90
Intensity Bin Limits
Intensity Bin Limits, continued
Color
Bin
Intensity Range (mcd)
Min.
Max.
Red
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
X
Y
Z
1.5
2.4
3.8
6.1
9.7
15.5
24.8
39.6
63.4
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
Maximum tolerance for each bin limit is ±18%.
2.4
3.8
6.1
9.7
15.5
24.8
39.6
63.4
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
30900.0
Color
Bin
Intensity Range (mcd)
Min.
Max.
Yellow
B
C
D
E
1.6
2.5
4.0
6.5
2.5
4.0
6.5
10.3
F
10.3
16.6
G
16.6
26.5
H
26.5
42.3
I
42.3
67.7
J
67.7
108.2
K
108.2
173.2
L
173.2
250.0
M
250.0
360.0
N
360.0
510.0
O
510.0
800.0
P
800.0
1250.0
Q
1250.0
1800.0
R
1800.0
2900.0
S
2900.0
4700.0
T
4700.0
7200.0
U
7200.0
11700.0
V
11700.0
18000.0
W
18000.0
27000.0
B
C
D
E
F
G
H
I
J
K
L
M
N
O
P
Q
R
S
T
U
V
W
1.8
2.9
4.7
7.6
12.0
19.1
30.7
49.1
78.5
125.7
201.1
289.0
417.0
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
2.9
4.7
7.6
12.0
19.1
30.7
49.1
78.5
125.7
201.1
289.0
417.0
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
40000.0
Green
Maximum tolerance for each bin limit is ±18%.
6
Color Categories
Lambda (nm)
Color
Category#
Min.
Max.
Green
6
561.5
564.5
5
564.5
567.5
4
567.5
570.5
3
570.5
573.5
2
573.5
576.5
1
582.0
584.5
3
584.5
587.0
2
587.0
589.5
4
589.5
592.0
5
592.0
593.0
Yellow
Tolerance for each bin limit is ±0.5 nm.
Mechanical Option Matrix
Mechanical Option Code
Definition
00
Bulk Packaging, minimum increment 500 pcs/bag
02
Tape & Reel, straight leads, minimum increment 1300 pcs/reel
Note:
All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarification/information.
7
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of LED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED chip
die attach and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended PC board plated through hole sizes for
LED component leads:
• Recommended soldering conditions:
Diagonal
Plated Through
Hole Diameter
Wave Soldering
Manual Solder
Dipping
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
Pre-heat Temperature
105°C Max.
–
Pre-heat Time
30 sec Max.
–
0.508 x 0.508 mm
(0.020 x 0.020 inch)
0.718 mm
(0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Peak Temperature
250°C Max.
260°C Max.
Dwell Time
3 sec Max.
5 sec Max.
TURBULENT WAVE
250
TEMPERATURE – °C
LED Component
Lead Size
Note: Refer to application note AN1027 for more information on
soldering LED components.
LAMINAR WAVE
HOT AIR KNIFE
BOTTOM SIDE OF PC BOARD
TOP SIDE OF PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
200
150
FLUXING
100
50
30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
PREHEAT
0
10
20
30
60
40
50
TIME – SECONDS
70
80
90
100
Figure 7. Recommended wave soldering profile
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
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Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved.
AV02-1554EN - June 24, 2015
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