ON NL27WZ02 Dual 2-input nor gate Datasheet

NL27WZ02
Dual 2−Input NOR Gate
The NL27WZ02 is a high performance dual 2−input NOR Gate
operating from a 1.65 V to 5.5 V supply.
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Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5.0 V
Designed for 1.65 V to 5.5 V VCC Operation
Over Voltage Tolerant Inputs
LVTTL Compatible − Interface Capability With 5.0 V TTL Logic
with VCC = 3.0 V
LVCMOS Compatible
24 mA Balanced Output Sink and Source Capability
Near Zero Static Supply Current Substantially Reduces System
Power Requirements
Replacement for NC7WZ02
Chip Complexity: FET = 112
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MARKING
DIAGRAM
8
8
L3 D
1
US8
US SUFFIX
CASE 493
1
D = Date Code
A1
8
1
VCC
ORDERING INFORMATION
B1
2
7
Y1
Y2
3
6
B2
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
A1
1
B1
GND
5
4
A2
Y1
A2
Y2
B2
Figure 1. Pinout
Figure 2. Logic Symbol
PIN ASSIGNMENT
FUNCTION TABLE
Pin
Function
Input
1
A1
2
B1
A
B
Y
3
Y2
L
L
H
4
GND
L
H
L
5
A2
H
L
L
6
B2
H
H
L
7
Y1
8
VCC
 Semiconductor Components Industries, LLC, 2004
March, 2004 − Rev. 6
Output
Y=A+B
1
Publication Order Number:
NL27WZ02/D
NL27WZ02
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage
0.5 to 7.0
V
VI
DC Input Voltage
0.5 to 7.0
V
VO
DC Output Voltage
0.5 to 7.0
V
IIK
DC Input Diode Current
VI < GND
50
mA
IOK
DC Output Diode Current
VO < GND
50
mA
IO
DC Output Sink Current
50
mA
ICC
DC Supply Current per Supply Pin
100
mA
IGND
DC Ground Current per Ground Pin
100
mA
TSTG
Storage Temperature Range
65 to 150
°C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
260
°C
TJ
Junction Temperature under Bias
150
°C
JA
Thermal Resistance
250
°C/W
PD
Power Dissipation in Still Air at 85°C
250
mW
MSL
Moisture Sensitivity
FR
Flammability Rating
VESD
ESD Withstand Voltage
(Note 1)
Level 1
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
N/A
V
Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute maximum−rated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Supply Voltage
VI
Input Voltage
VO
Output Voltage
TA
Operating Free−Air Temperature
t/V
Input Transition Rise or Fall Rate
Operating
Data Retention Only
Min
Max
Unit
1.65
1.5
5.5
5.5
V
(Note 5)
0
5.5
V
(HIGH or LOW State)
0
VCC
V
40
85
°C
0
0
0
0
20
20
10
5
ns/V
VCC = 1.8 V 0.15 V
VCC = 2.5 V 0.2 V
VCC = 3.0 V 0.3 V
VCC = 5.0 V 0.5 V
5. Unused inputs may not be left open. All inputs must be tied to a high−logic voltage level or a low−logic input voltage level.
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2
NL27WZ02
DC ELECTRICAL CHARACTERISTICS
Symbol
Parameter
Condition
40C TA 85C
TA = 25C
VCC
(V)
Min
0.75 VCC
0.7 VCC
VIH
High−Level Input Voltage
1.65
2.3 to 5.5
VIL
Low−Level Input Voltage
1.65
2.3 to 5.5
VOH
High−Level Output Voltage
VIN = VIL or VIH
IOH = −100 A
IOH = −4 mA
IOH = −8 mA
IOH = −12 mA
IOH = −16 mA
IOH = −24 mA
IOH = −32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
VOL
Low−Level Output Voltage
VIN = VIH or VOH
IOL = 100 A
IOL = 4 mA
IOL = 8 mA
IOL = 12 mA
IOL = 16 mA
IOL = 24 mA
IOL = 32 mA
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
IIN
Input Leakage Current
VIN = VCC or
GND
ICC
Quiescent Supply Current
VIN = VCC or
GND
Typ
Max
Min
0.75 VCC
0.7 VCC
0.25 VCC
0.3 VCC
VCC − 0.1
1.29
1.9
2.2
2.4
2.3
3.8
Max
VCC
1.5
2.1
2.4
2.7
2.5
4.0
0.0
0.08
0.20
0.22
0.28
0.38
0.42
Unit
V
0.25 VCC
0.3 VCC
VCC − 0.1
1.29
1.90
2.20
2.40
2.30
3.80
V
V
0.1
0.24
0.3
0.4
0.4
0.55
0.55
0.1
0.24
0.3
0.4
0.4
0.55
0.55
V
0 to 5.5
0.1
1.0
A
5.5
1.0
10
A
AC ELECTRICAL CHARACTERISTICS tR = tF = 3.0 ns
Symbol
tPLH
tPHL
Condition
(V)
Min
Typ
Max
Min
Max
Unit
RL = 1 M CL = 15 pF
1.8 0.15
2.0
7.4
9.5
2.0
9.7
ns
2.5 0.20
1.2
3.3
5.4
1.2
5.8
RL = 1 M CL = 15 pF
F
RL = 500 CL = 50 pF
3.3 0.30
0.8
1.2
2.6
3.2
3.9
4.8
0.8
1.2
4.3
5.2
RL = 1 M CL = 15 pF
F
RL = 500 CL = 50 pF
5.0 0.50
0.5
0.8
1.9
2.5
3.1
3.7
0.5
0.8
3.3
4.0
Parameter
Propagation Delay
(Figure 3 and 4)
40C TA 85C
TA = 25C
VCC
CAPACITIVE CHARACTERISTICS
Symbol
Parameter
Condition
Typical
Unit
CIN
Input Capacitance
VCC = 5.5 V, VI = 0 V or VCC
2.5
pF
CPD
Power Dissipation Capacitance
(Note 6)
10 MHz, VCC = 3.3 V, VI = 0 V or VCC
10 MHz, VCC = 5.5 V, VI = 0 V or VCC
9.0
11.0
pF
6. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption; PD = CPD VCC2 fin + ICC VCC.
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3
NL27WZ02
tf = 3 ns
tf = 3 ns
90%
INPUT
A and B
VCC
90%
50%
50%
INPUT
10%
10%
tPHL
OUTPUT
GND
RL
tPLH
CL
VOH
OUTPUT Y
50%
50%
A 1−MHz square input wave is recommended for
propagation delay tests.
VOL
Figure 3. Switching Waveform
Figure 4. Test Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature
Device Order
Number
NL27WZ02US
Logic
Circuit
Indicator
No. of
Gates per
Package
Temp
Range
Identifier
Technology
Device
Function
Package
Suffix
Package
Type
Tape and
Reel Size
NL
2
7
WZ
02
US
US8
178 mm, 3000 Unit
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4
NL27WZ02
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 493−02
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
−X−
A
8
J
−Y−
5
DETAIL E
B
L
1
4
R
S
G
P
U
C
−T−
SEATING
PLANE
K
D
H
0.10 (0.004) T
N
R 0.10 TYP
0.10 (0.004)
M
T X Y
V
M
F
DETAIL E
SOLDERING FOOTPRINT*
3.8
0.5 TYP
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
1.8 TYP
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
1.0
0.3 TYP
(mm)
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0
6
5
10 0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.126
0
6
5
10 0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
NL27WZ02
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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NL27WZ02/D
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