F-217 QFS–026–04.25–L–D–A QFS–032–04.25–L–D–DP–A QFS–026–04.25–L–D–A–GP (0.635 mm) .025" QFS SERIES RUGGED GROUND PLANE SOCKET SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QFS Insulator Material: Liquid Crystal Polymer Contact & Ground Plane Material: Phosphor Bronze Plating: Au over 50 µ" (1.27 µm) Ni (Tin on Ground Plane Tail) Current Rating: Contact: 2.6 A per pin (1 pin powered per row) Ground Plane: 15.7 A per ground plane (1 ground plane powered) Voltage Rating: 300 VAC mated with QMS Operating Temp: -55 °C to +125 °C RoHS Compliant: Yes Increased insertion depth for rugged applications Board Mates: QMS Cable Mates: 6QCD Standoffs: SO, JSOM Integral metal plane for power or ground (1.60 mm) .063" NOMINAL WIPE ALSO AVAILABLE (MOQ Required) • Other platings • Without PCB Alignment Pins • Hot Pluggable • 4 banks (104 -SE, 64 -DP) Contact Samtec. HIGH-SPEED CHANNEL PERFORMANCE QMS-DP/QFS-DP @ 10 mm Mated Stack Height Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact [email protected] 25 G b p s PROCESSING Lead–Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (026-078) Board Stacking: For applications requiring more than two connectors per board contact [email protected] PINS PER ROW NO. OF PAIRS QFS –026, –052, –078 RECOGNITIONS (52 total pins per bank = –D) –016, –032, –048 For complete scope of recognitions see www.samtec.com/quality LEAD STYLE PLATING OPTION Specify LEAD STYLE from chart –L (16 pairs per bank = –D–DP) STANDARDS • SUMIT™ • PCI/104-Express™ QMS LEAD STYLE LEAD STYLE A –04.25 (7.44) .293 10 mm 11 mm 14 mm –06.25 (9.42) .371 12 mm 13 mm 16 mm –05.75 –06.75 –09.75 (–04.25 lead style only) = 10 µ" (0.25 µm) Gold on Signal Pins and Ground Plane (Tin on Signal Pin tails, and Ground Plane tails) PROTOCOLS • 100 GbE • FIbre Channel • XAUI • PCI Express® • SATA A No. of Banks x (21.34) .840 + (1.02) .040 (0.635) (21.34) .840 .025 02 (8.13) .320 (0.89) .035 (1.02) .040 DIA –D–DP = Guide Holes ( –04.25 lead style only) APPLICATION STACK HEIGHT GP = No. of Banks x (21.34) .840 + (12.45) .490 –D –D–DP = Differential Pair (–04.25 lead style only) (0.10) .004 01 Note: Some lengths, styles and options are non-standard, non-returnable. = Single-Ended (–06.25 lead style only) = 10 µ" (0.25 µm) Gold on Signal Pins and Ground Plane (Tin on Signal Pin tails, and Ground Plane tails) *Processing conditions will affect mated height. See SO Series for board space tolerances. –GP –D –SL MATED HEIGHT* FILE NO. E111594 OTHER OPTION A TYPE (0.44) .017 Requires Standoff SO-1524-03-01-01-L or JSOM-1524-02 for 15.24 mm or SO-2215-02-01-01-L for 22 mm board spacing. Connectors designed to not fully seat when mated. (8.13) .320 INTERCONNECTS INDUSTRY STANDARD TERMINAL SOCKET SUMIT™ PCI/104-Express™ PCI/104-Express™ PCI/104-Express™ PCI/104-Express™ ASP-129637-01 ASP-129637-03 ASP-129637-13 ASP-142781-02 ASP-142781-03 ASP-129646-01 ASP-129646-03 ASP-129646-22 ASP-129646-02 ASP-129646-03 WWW.SAMTEC.COM Due to technical progress, all designs, specifications and components are subject to change without notice. STACK BANKS HEIGHT 1 3 1 2 3 15.24 mm 15.24 mm 15.24 mm 22 mm 22 mm