SAMTEC ASP-142781-03 Rugged ground plane socket Datasheet

F-217
QFS–026–04.25–L–D–A
QFS–032–04.25–L–D–DP–A
QFS–026–04.25–L–D–A–GP
(0.635 mm) .025"
QFS SERIES
RUGGED GROUND PLANE SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QFS
Insulator Material:
Liquid Crystal Polymer
Contact & Ground
Plane Material:
Phosphor Bronze
Plating:
Au over 50 µ" (1.27 µm) Ni
(Tin on Ground Plane Tail)
Current Rating:
Contact:
2.6 A per pin
(1 pin powered per row)
Ground Plane:
15.7 A per ground plane
(1 ground plane powered)
Voltage Rating:
300 VAC mated with QMS
Operating Temp:
-55 °C to +125 °C
RoHS Compliant:
Yes
Increased insertion
depth for rugged applications
Board Mates:
QMS
Cable Mates:
6QCD
Standoffs:
SO, JSOM
Integral metal plane
for power or ground
(1.60 mm)
.063"
NOMINAL
WIPE
ALSO
AVAILABLE
(MOQ Required)
• Other platings
• Without PCB
Alignment Pins
• Hot Pluggable
• 4 banks
(104 -SE, 64 -DP)
Contact Samtec.
HIGH-SPEED CHANNEL PERFORMANCE
QMS-DP/QFS-DP @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact [email protected]
25
G b p s
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (026-078)
Board Stacking:
For applications requiring more
than two connectors per board
contact [email protected]
PINS PER ROW
NO. OF PAIRS
QFS
–026, –052, –078
RECOGNITIONS
(52 total pins per bank = –D)
–016, –032, –048
For complete scope of
recognitions see
www.samtec.com/quality
LEAD
STYLE
PLATING
OPTION
Specify
LEAD
STYLE
from
chart
–L
(16 pairs per bank = –D–DP)
STANDARDS
• SUMIT™
• PCI/104-Express™
QMS LEAD STYLE
LEAD
STYLE
A
–04.25
(7.44) .293
10 mm
11 mm
14 mm
–06.25
(9.42) .371
12 mm
13 mm
16 mm
–05.75 –06.75 –09.75
(–04.25 lead style only)
= 10 µ" (0.25 µm) Gold on Signal
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
PROTOCOLS
• 100 GbE
• FIbre Channel
• XAUI
• PCI Express®
• SATA
A
No. of Banks x (21.34) .840 + (1.02) .040
(0.635)
(21.34) .840
.025
02
(8.13)
.320
(0.89)
.035
(1.02) .040 DIA
–D–DP
= Guide
Holes
( –04.25
lead style
only)
APPLICATION
STACK
HEIGHT
GP = No. of Banks x (21.34) .840 + (12.45) .490
–D
–D–DP
= Differential Pair
(–04.25 lead style only)
(0.10)
.004
01
Note: Some lengths,
styles and options are
non-standard, non-returnable.
= Single-Ended
(–06.25 lead style only)
= 10 µ" (0.25 µm) Gold on Signal
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
*Processing conditions will affect mated height.
See SO Series for board space tolerances.
–GP
–D
–SL
MATED HEIGHT*
FILE NO. E111594
OTHER
OPTION
A
TYPE
(0.44)
.017
Requires Standoff
SO-1524-03-01-01-L or
JSOM-1524-02 for 15.24 mm
or SO-2215-02-01-01-L for 22 mm
board spacing. Connectors designed
to not fully seat when mated.
(8.13)
.320
INTERCONNECTS
INDUSTRY
STANDARD
TERMINAL
SOCKET
SUMIT™
PCI/104-Express™
PCI/104-Express™
PCI/104-Express™
PCI/104-Express™
ASP-129637-01
ASP-129637-03
ASP-129637-13
ASP-142781-02
ASP-142781-03
ASP-129646-01
ASP-129646-03
ASP-129646-22
ASP-129646-02
ASP-129646-03
WWW.SAMTEC.COM
Due to technical progress, all designs, specifications and components are subject to change without notice.
STACK
BANKS HEIGHT
1
3
1
2
3
15.24 mm
15.24 mm
15.24 mm
22 mm
22 mm
Similar pages