MC100EP16F 3.3V / 5V ECL Differential Receiver/Driver With Reduced Output Swing Description The MC100EP16F is a differential receiver/driver. The device is functionally equivalent to the EP16 device with higher performance capabilities. With reduced output swings, rise/fall transition times are significantly faster than on the EP16. The EP16F is ideally suited for interfacing with high frequency sources. The VBB pin, an internally generated voltage supply, is available to this device only. For Single-Ended input conditions, the unused differential input is connected to VBB as a switching reference voltage. VBB may also rebias AC coupled inputs. When used, decouple VBB and VCC via a 0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB should be left open. www.onsemi.com • • • • 1 1 SOIC−8 NB D SUFFIX CASE 751−07 TSSOP−8 DT SUFFIX CASE 948R−02 MARKING DIAGRAMS* Features • • • • 8 8 100 ps Typical Rise and Fall Time Max Frequency > 4 GHz Typical The 100 Series Contains Temperature Compensation PECL Mode Operating Range: ♦ VCC = 3.0 V to 5.5 V with VEE = 0 V NECL Mode Operating Range: ♦ VCC = 0V with VEE = −3.0 V to −5.5 V Open Input Default State Safety Clamp on Inputs These Devices are Pb-Free, Halogen Free and are RoHS Compliant 8 8 1 KEP60 ALYW G 1 A L Y W M G KP60 ALYWG G = Assembly Location = Wafer Lot = Year = Work Week = Date Code = Pb-Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION Package Shipping† MC100EP16FDG SOIC−8 NB (Pb-Free) 98 Units/Tube MC100EP16FDR2G SOIC−8 NB (Pb-Free) 2500/Tape & Reel MC100EP16FDTG TSSOP−8 (Pb-Free) 100 Units/Tube MC100EP16FDTR2G TSSOP−8 (Pb-Free) 2500/Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2016 August, 2016 − Rev. 6 1 Publication Order Number: MC100EP16F/D MC100EP16F Table 1. PIN DESCRIPTION NC D 1 8 2 7 VCC Q D 3 6 Q VBB 4 5 VEE Figure 1. 8-Lead Pinout (Top View) and Logic Diagram PIN FUNCTION D*, D** ECL Data Inputs Q, Q ECL Data Outputs VBB Reference Voltage Output VCC Positive Supply VEE Negative Supply NC No Connect * Pins will default LOW when left open. ** Pins will default to VCC/2 when left open. Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 75 kW Internal Input Pullup Resistor 37.5 kW ESD Protection Human Body Model Machine Model Charged Device Model > 4 kV > 200 V > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) SOIC−8 NB TSSOP−8 Pb-Free Pkg Level 1 Level 3 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 139 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. www.onsemi.com 2 MC100EP16F Table 3. MAXIMUM RATINGS Symbol Rating Unit VCC PECL Mode Power Supply Parameter VEE = 0 V Condition 1 Condition 2 6 V VEE NECL Mode Power Supply VCC = 0 V −6 V VI PECL Mode Input Voltage NECL Mode Input Voltage VEE = 0 V VCC = 0 V 6 −6 V Iout Output Current Continuous Surge 50 100 mA IBB VBB Sink/Source ± 0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm SOIC−8 NB 190 130 °C/W qJC Thermal Resistance (Junction-to-Case) Standard Board SOIC−8 NB 41 to 44 ± 5% °C/W qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm 500 lfpm TSSOP−8 185 140 °C/W qJC Thermal Resistance (Junction-to-Case) Standard Board TSSOP−8 41 to 44 ± 5% °C/W Tsol Wave Solder (Pb-Free) <2 to 3 sec @ 260°C 265 °C VI ≤ VCC VI ≥ VEE Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power) www.onsemi.com 3 MC100EP16F Table 4. DC CHARACTERISTICS, PECL (VCC = 3.3 V, VEE = 0 V (Note 1)) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 23 28 40 25 33 45 26 33 45 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV VOL Output LOW Voltage (Note 2) 1525 1690 1775 1525 1690 1775 1525 1690 1775 mV VIH Input HIGH Voltage (Single-Ended) 2075 2420 2075 2420 2075 2420 mV VIL Input LOW Voltage (Single-Ended) (Note 3) 1355 1675 1355 1675 1355 1675 mV VBB Output Voltage Reference 1775 1975 1775 1975 1775 1975 mV 3.3 2.0 3.3 2.0 3.3 V 150 mA VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 4) IIH Input HIGH Current IIL Input LOW Current D D 1875 2.0 1875 150 0.5 −150 1875 150 0.5 −150 0.5 −150 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.3 V to −2.2 V. 2. All loading with 50 W to VCC − 2.0 V. 3. Not recommended for Single-Ended operation when using an EP16F to drive another EP16F. VOL has reduced output swing and may not meet the VIL specification over temperature. 4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 5. DC CHARACTERISTICS, PECL (VCC = 5.0 V, VEE = 0 V (Note 1)) −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 85°C Max Min Typ Max Unit IEE Power Supply Current 23 28 40 25 35 45 26 33 45 mA VOH Output HIGH Voltage (Note 2) 3855 3980 4105 3855 3980 4105 3855 3980 4105 mV VOL Output LOW Voltage (Note 2) 3225 3390 3475 3225 3390 3475 3225 3390 3475 mV VIH Input HIGH Voltage (Single-Ended) 3775 4120 3775 4120 3775 4120 mV VIL Input LOW Voltage (Single-Ended) (Note 3) 3055 3375 3055 3375 3055 3375 mV VBB Output Voltage Reference 3475 3675 3475 3675 3475 3675 mV 5.0 2.0 5.0 2.0 5.0 V 150 mA VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 4) IIH Input HIGH Current IIL Input LOW Current D D 3575 2.0 150 0.5 −150 3575 150 0.5 −150 0.5 −150 3575 mA NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +2.0 V to −0.5 V. 2. All loading with 50 W to VCC − 2.0 V. 3. Not recommended for Single-Ended operation when using an EP16F to drive another EP16F. VOL has reduced output swing and may not meet the VIL specification over temperature. 4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. www.onsemi.com 4 MC100EP16F Table 6. DC CHARACTERISTICS, NECL (VCC = 0 V; VEE = −5.5 V to −3.0 V (Note 1)) −40°C Symbol Characteristic 25°C 85°C Min Typ Max Min Typ Max Min Typ Max Unit 23 28 40 25 34 45 26 33 45 mA IEE Power Supply Current VOH Output HIGH Voltage (Note 2) −1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895 mV VOL Output LOW Voltage (Note 2) −1775 −1610 −1525 −1775 −1610 −1525 −1775 −1610 −1525 mV VIH Input HIGH Voltage (Single-Ended) −1225 −880 −1225 −880 −1225 −880 mV VIL Input LOW Voltage (Single-Ended) (Note 3) −1810 −1625 −1810 −1625 −1810 −1625 mV VBB Output Voltage Reference −1525 −1325 −1525 −1325 −1525 −1325 mV 0.0 V 150 mA VIHCMR Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 4) IIH Input HIGH Current IIL Input LOW Current D D −1425 VEE+2.0 0.0 −1425 VEE+2.0 150 0.5 −150 0.0 −1425 VEE+2.0 150 0.5 −150 mA 0.5 −150 NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. 2. All loading with 50 W to VCC − 2.0 V. 3. Not recommended for Single-Ended operation when using an EP16F to drive another EP16F. VOL has reduced output swing and may not meet the VIL specification over temperature. 4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential input signal. Table 7. AC CHARACTERISTICS (VCC = 0 V; VEE = −3.0 V to −5.5 V or VCC = 3.0 V to 5.5 V; VEE = 0 V (Note 1)) −40°C Symbol Characteristic fmax Maximum Toggle Frequency (See Figure 2. Fmax/JITTER) tPLH, tPHL Propagation Delay to Output Differential tSKEW tJITTER VPP tr tf Min Typ 25°C Max Min >4 170 Typ 85°C Max Min >4 210 250 Duty Cycle Skew 5.0 Cycle-to-Cycle Jitter (RMS) (See Figure 2. Fmax/JITTER) 180 Typ Max >4 220 260 20 5.0 0.2 <1 200 Unit GHz 250 300 ps 20 5.0 20 ps 0.2 <1 0.2 <1 ps Input Voltage Swing (Differential Configuration) 150 800 1200 150 800 1200 150 800 1200 mV Output Rise/Fall Times Q (20% − 80%) 70 85 110 80 100 120 90 110 130 ps NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC−2.0 V. www.onsemi.com 5 MC100EP16F 800 VOUTpp (mV) 700 Measured Simulated 600 7 6 500 5 400 4 300 3 200 2 ÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉ ÉÉÉÉÉÉÉÉ 100 0 0 1000 2000 1 (JITTER) 3000 4000 5000 JITTEROUT ps (RMS) 8 É É 6000 FREQUENCY (MHz) Figure 2. Fmax/JITTER Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 3. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices www.onsemi.com 6 MC100EP16F PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AK −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 0.25 (0.010) M Y M 1 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− 0.10 (0.004) H D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com 7 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC100EP16F PACKAGE DIMENSIONS TSSOP−8 CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF M T U V S 0.25 (0.010) B −U− 4 M A −V− S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. S F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ ECLinPS is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. 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