EDI MPI4010W 40/50 amperes bridge rectifiers wire leads for pc board Datasheet

FPI-W MPI-W
MINIBRIDGE
40/50 AMPERES BRIDGE RECTIFIERS
WIRE LEADS FOR PC BOARDS
Y MOLDED
INTEGRALL
S
HEAT SINK RY LOW
VE
E
PROVID
ESISTANCE
R
L
THERMA
This mark indicates recognition under the component
program of Underwriters Laboratories, inc.
ELECTRICAL CHARACTERISTICS PER LEG
(at TA =25 OC Unless Otherwise Specified)
SERIES DESIGNATIONS (See
MPI40-W
MPI50-W
UNITS
40
40
50
Amps
300
400
400
Amps
20
35
45
Amps
10
10
10
A
100
100
100
A
FPI40-W
o
Average Forward Current, I F(Av.) TC 55 C See Figure 3
Max. Peak Surge Current, I FSM (8.3 ms)
See Figure 2
Max. Instantaneous Forward Voltage Drop,
V F =1.2V @ IF = Pulse T est:
Pulse Width <300 S. Duty cycle < 2.0%
O
Max. D.C. Reverse Current @ PRV and 25 C, I R
O
Max. D.C. Reverse Current @ PRV and 100 C, I R
Thermal Resistance, Total Bridge R0- j-c
Storage Temperature Range, TSTG
Figure 1)
1.2typ.
-55 to +175
EDI reserves the right to change these specifications at any time without notice.
o
C/ W
o
C
FPI-W MPI-W
AVERAGE FORWARD
CURRENT RATING (AMPERES)
Figure 1
PART NUMBER NOMENCLATURE
PEAK REVERSE VOLTAGE(PRV/LEG)
50 VOLTS
100 VOLTS
200 VOLTS
400 VOLTS
600 VOLTS
800 VOLTS
1000 VOLTS
40AMPS
FPI4005W
FPI4010W
FPI4020W
FPI4040W
FPI4060W
FPI4080W
FPI40100W
40AMPS
MPI4005W
MPI4010W
MPI4020W
MPI4040W
MPI4060W
MPI4080W
MPI401000W
50AMPS
MPI5005W
MPI5010W
MPI5020W
MPI5040W
MPI5060W
MPI5080W
MPI50100W
Figure 2
NON-REPETITIVE SURGE
L
l F(AV) . AVERAGE FORWARD CURRENT( AMP)
MAX. PEAK SURGE CURRENT IFSM
1000
800
600
400
MPI-W
200
FPI-W
100
80
60
40
1
3
2
4
6
8 10
Figure 3
CURRENT DERATING
CURRENT
20
40
60
50
40
30
FP
M P I4 0W
I40
W
20
10
0
60 80 100
40
60
80
100
MP
120
I5
0W
140
160
Tc CASE TEMPERATURE ( C)
O
NUMBER OF CYCLES AT 60 CPS
NOTE: For large capacitive load derate by up to 20%
PI SERIES MECHANICAL OUTLINE
Dielectric test voltage 2500 volts rms, max. 50-60Hz
.193 DIA
THRU HOLE
1.125
.712
AC
AC
.450
NOTE:
EPOXY
CASE
+
1.125
.712
.040
DIA.
1.2 MIN.
+
. 405 MAX
METAL HEAT SINK
A thin film of silicone thermal compound is recommended between the Minibridge
case and mounting surface for improved thermal conduction.
Higher dielectric strengths available. Consult factory.
R
ELECTRONIC DEVICES, INC. DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951.
21 GRAY OAKS AVENUE
* YONKERS. NEW YORK 10710 914-965-4400
Ee-mail:[email protected] * Wwebsite: http://www.edidiodes.com
* FAX 914-965-5531
* 1-800-678-0828
180
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