TI CD74ACT139M96 Dual 2-line to 4-line decoders/demultiplexer Datasheet

CD54ACT139, CD74ACT139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCHS337 – MARCH 2003
D
D
D
D
D
D
D
D
CD54ACT139 . . . F PACKAGE
CD74ACT139 . . . E OR M PACKAGE
(TOP VIEW)
AC Types Feature 1.5-V to 5.5-V Operation
and Balanced Noise Immunity at 30% of the
Supply Voltage
Buffered Inputs
Incorporate Two Enable Inputs to Simplify
Cascading and/or Data Reception
Speed of Bipolar F, AS, and S, With
Significantly Reduced Power Consumption
Balanced Propagation Delays
±24-mA Output Drive Current
– Fanout to 15 F Devices
SCR-Latchup-Resistant CMOS Process and
Circuit Design
Exceeds 2-kV ESD Protection Per
MIL-STD-883, Method 3015
1G
1A
1B
1Y0
1Y1
1Y2
1Y3
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
2G
2A
2B
2Y0
2Y1
2Y2
2Y3
description/ordering information
The ’ACT139 devices are dual 2-line to 4-line decoders/demultiplexers designed for 4.5-V to 5.5-V VCC
operation. These devices are designed to be used in high-performance memory-decoding or data-routing
applications requiring very short propagation delay times. In high-performance memory systems, these
decoders can be used to minimize the effects of system decoding. When used with high-speed memories
utilizing a fast enable circuit, the delay times of these decoders and the enable time of the memory usually are
less than the typical access time of the memory. This means that the effective system delay introduced by the
decoders is negligible.
The active-low enable (G) input can be used as a data line in demultiplexing applications. These
decoders/demultiplexers feature fully buffered inputs, each of which represents only one normalized load to its
driving circuit.
ORDERING INFORMATION
PDIP – E
55°C to 125°C
–55°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SOIC – M
Tube
CD74ACT139E
Tube
CD74ACT139M
Tape and reel
CD74ACT139M96
TOP-SIDE
MARKING
CD74ACT139E
ACT139M
CDIP – F
Tube
CD54ACT139F3A
CD54ACT139F3A
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
CD54ACT139, CD74ACT139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCHS337 – MARCH 2003
FUNCTION TABLE
(each decoder/demultiplexer)
INPUTS
OUTPUTS
SELECT
G
B
A
Y0
Y1
Y2
Y3
H
X
X
H
H
H
H
L
L
L
L
H
H
H
L
L
H
H
L
H
H
L
H
L
H
H
L
H
L
H
H
H
H
H
L
logic diagram (positive logic)
4
1Y0
1
1G
5
6
1A
Select
Inputs
1Y1
1Y2
2
7
3
1B
1Y3
Data
Outputs
12
2Y0
2G
15
11
2Y1
10
2A
Select
Inputs
2B
2Y2
14
9
13
2Y3
absolute maximum ratings over operating free-air temperature range†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 2): E package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
M package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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• DALLAS, TEXAS 75265
CD54ACT139, CD74ACT139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCHS337 – MARCH 2003
recommended operating conditions (see Note 3)
–55°C to
125°C
TA = 25°C
–40°C to
85°C
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
4.5
5.5
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
Input voltage
0
VO
IOH
Output voltage
0
High-level output current
–24
IOL
∆t/∆v
Low-level output current
Input transition rise or fall rate
High-level input voltage
2
2
0.8
2
V
0.8
V
VCC
VCC
V
–24
–24
mA
24
24
24
mA
10
10
10
ns/V
VCC
VCC
0.8
V
0
0
VCC
VCC
0
0
V
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
VOH
VOL
VI = VIH or VIL
VI = VIH or VIL
II
ICC
VI = VCC or GND
VI = VCC or GND,
DICC‡
VI = VCC – 2.1 V
–55°C to
125°C
TA = 25°C
VCC
MAX
MIN
–40°C to
85°C
MAX
MIN
UNIT
MAX
IOH = –50 µA
IOH = –24 mA
4.5 V
4.4
4.5 V
3.94
IOH = –50 mA†
IOH = –75 mA†
5.5 V
IOL = 50 µA
IOL = 24 mA
IOL = 50 mA†
4.5 V
0.1
0.1
0.1
4.5 V
0.36
0.5
0.44
IOL = 75 mA†
5.5 V
4.4
4.4
3.7
3.8
5.5 V
3.85
5.5 V
1.65
V
1.65
5.5 V
IO = 0
V
3.85
5.5 V
4.5 V to 5.5 V
±0.1
±1
±1
µA
8
160
80
µA
2.4
3
2.8
mA
Ci
10
10
10
pF
† Test one output at a time, not exceeding 1-second duration. Measurement is made by forcing indicated current and measuring voltage to minimize
power dissipation. Test verifies a minimum 50-Ω transmission-line drive capability at 85°C and 75-Ω transmission-line drive capability at 125°C.
‡ Additional quiescent supply current per input pin, TTL inputs high, 1 unit load
ACT INPUT LOAD TABLE
INPUT
UNIT LOAD
A or B
1
G
0.67
Unit Load is ∆ICC limit specified in
electrical characteristics table
(e.g., 2.4 mA at 25°C).
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
CD54ACT139, CD74ACT139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCHS337 – MARCH 2003
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V, CL = 50 pF (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A or B
Y
tPLH
tPHL
G
Y
PARAMETER
–55°C to
125°C
–40°C to
85°C
UNIT
MIN
MAX
MIN
MAX
2.9
11.5
3.1
10.5
2.9
11.5
3.1
10.5
3
12
3.2
10.9
3
12
3.2
10.9
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
4
TYP
Power dissipation capacitance
83
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
pF
CD54ACT139, CD74ACT139
DUAL 2-LINE TO 4-LINE DECODERS/DEMULTIPLEXERS
SCHS337 – MARCH 2003
PARAMETER MEASUREMENT INFORMATION
S1
R1 = 500 Ω
From Output
Under Test
2 × VCC
Open
GND
CL = 50 pF
(see Note A)
R2 = 500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
tw
3V
1.5 V
Input
LOAD CIRCUIT
1.5 V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
CLR
Input
3V
Reference
Input
3V
1.5 V
1.5 V
0V
0V
trec
Data
Input
3V
1.5 V
CLK
th
tsu
1.5 V
10%
90%
90%
tr
0V
VOLTAGE WAVEFORMS
RECOVERY TIME
3V
1.5 V
10% 0 V
tf
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
3V
Input
1.5 V
1.5 V
0V
tPLH
In-Phase
Output
50%
10%
90%
90%
tr
90%
1.5 V
1.5 V
0V
tPHL
tPHL
Out-of-Phase
Output
3V
Output
Control
VOH
50% VCC
10%
VOL
tf
tPLH
50% VCC
10%
tf
50%
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLZ
tPZL
20% VCC
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note B)
≈VCC
20% VCC
VOL
80% VCC
VOH
80% VCC
≈0 V
VOLTAGE WAVEFORMS
OUTPUT ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
Phase relationships between waveforms are arbitrary.
D. For clock inputs, fmax is measured with the input duty cycle at 50%.
E. The outputs are measured one at a time with one input transition per measurement.
F. tPLH and tPHL are the same as tpd.
G. tPZL and tPZH are the same as ten.
H. tPLZ and tPHZ are the same as tdis.
I. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
CD54ACT139F3A
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
-55 to 125
CD54ACT139F3A
CD74ACT139E
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD74ACT139E
CD74ACT139EE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
CD74ACT139E
CD74ACT139M
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
ACT139M
CD74ACT139M96
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
ACT139M
CD74ACT139M96E4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
ACT139M
CD74ACT139M96G4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
ACT139M
CD74ACT139ME4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
ACT139M
CD74ACT139MG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
ACT139M
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
23-Apr-2013
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD54ACT139, CD74ACT139 :
• Catalog: CD74ACT139
• Military: CD54ACT139
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Military - QML certified for Military and Defense Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CD74ACT139M96
Package Package Pins
Type Drawing
SOIC
D
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2500
330.0
16.4
Pack Materials-Page 1
6.5
B0
(mm)
K0
(mm)
P1
(mm)
10.3
2.1
8.0
W
Pin1
(mm) Quadrant
16.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CD74ACT139M96
SOIC
D
16
2500
333.2
345.9
28.6
Pack Materials-Page 2
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