Diodes DMN66D0LDW Dual n-channel enhancement mode mosfet Datasheet

DMN66D0LDW
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
V(BR)DSS
RDS(ON)
60V
6Ω @ VGS = 5V
5Ω @ VGS = 10V
Features and Benefits
ID
TA = +25°C
90mA
115mA
Package
SOT363
Description
This new generation MOSFET has been designed to minimize the
on-state resistance (RDS(ON)) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
•
•
Dual N-Channel MOSFET
•
Low On-Resistance
•
Low Gate Threshold Voltage
•
Low Input Capacitance
•
Fast Switching Speed
•
Small Surface Mount Package
•
ESD Protected Gate, 1KV (HBM)
•
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
•
Halogen and Antimony Free. “Green” Device (Note 3)
•
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Applications
•
Load Switch
•
Case: SOT363
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020
•
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208 e3
•
Terminal Connections: See Diagram
•
Weight: 0.006 grams (approximate)
SOT363
ESD PROTECTED TO 1kV
D2
G1
S1
S2
G2
D1
Top View
Internal Schematic
Top View
Ordering Information (Note 4)
Part Number
DMN66D0LDW-7
Notes:
Case
SOT363
Packaging
3,000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
YM
Month
Code
Jan
1
MN1
Date Code Key
Year
2007
Code
U
YM
2008
V
Feb
2
DMN66D0LDW
Document number: DS31232 Rev. 6 - 2
2009
W
Mar
3
MN1= Product Type Marking Code
YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)
YM = Date Code Marking for CAT (Chengdu Assembly/ Test site)
Y or Y = Year (ex: A = 2013)
M = Month (ex: 9 = September)
YM
MN1
YM
MN1
MN1
NEW PRODUCT
Product Summary
2010
X
Apr
4
2011
Y
May
5
2012
Z
Jun
6
1 of 5
www.diodes.com
2013
A
Jul
7
Aug
8
2014
B
Sep
9
2015
C
Oct
O
2016
D
Nov
N
2017
E
Dec
D
February 2014
© Diodes Incorporated
DMN66D0LDW
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
VDSS
60
V
VGSS
±20
V
ID
115
73
800
mA
Drain-Source Voltage
NEW PRODUCT
Gate-Source Voltage (Note 5)
Continuous
Drain Current (Note 5)
Continuous
Continuous @ +100°C
Pulsed
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Total Power Dissipation
Derating above TA = +25°C (Note 5)
Symbol
Value
Units
PD
250
1.6
mW
mW/°C
Thermal Resistance, Junction to Ambient
RθJA
500
°C/W
TJ, TSTG
-55 to +150
°C
Operating and Storage Temperature Range
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
BVDSS
60
Test Condition
70
⎯
V
VGS = 0V, ID = 10µA
µA
VDS = 60V, VGS = 0V
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
IDSS
⎯
⎯
1.0
500
IGSS
⎯
⎯
±5
μA
VGS = ±20V, VDS = 0V
VGS(th)
1.2
⎯
2.0
V
VDS = VGS, ID = 250μA
RDS (ON)
⎯
3.5
3.0
6
5
Ω
Forward Transconductance
gFS
80
VSD
⎯
mS
VDS = 10V, ID = 0.115
Diode Forward Voltage
VSD
⎯
0.8
1.2
V
VGS = 0V, IS = 115mA
Input Capacitance
Ciss
⎯
23
⎯
pF
Output Capacitance
Coss
⎯
3.4
⎯
pF
Reverse Transfer Capacitance
Crss
⎯
1.4
⎯
pF
Turn-On Delay Time
tD(ON)
⎯
10
⎯
ns
Turn-Off Delay Time
tD(OFF)
⎯
33
⎯
ns
Zero Gate Voltage Drain Current
@ TC = +25°C
@ TC = +125°C
Gate-Body Leakage
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
@ TJ = +25°C
@ TJ = +125°C
VGS = 5.0V, ID = 0.115A
VGS = 10V, ID = 0.115A
DYNAMIC CHARACTERISTICS
VDS = 25V, VGS = 0V, f = 1.0MHz
SWITCHING CHARACTERISTICS
Notes:
VDD = 30V, ID = 0.115A, RL = 150Ω,
VGEN = 10V, RGEN = 25Ω
5. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
DMN66D0LDW
Document number: DS31232 Rev. 6 - 2
2 of 5
www.diodes.com
February 2014
© Diodes Incorporated
DMN66D0LDW
0.6
1
VDS = 5V
Pulsed
ID, DRAIN CURRENT (A)
0.5
NEW PRODUCT
0.4
0.3
0.2
0.1
TA = 150°C
0.1
T A = 85°C
TA = 25°C
T A = -55°C
0
0.01
1
9
2.5
2
3
4
VGS, GATE SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristics
5
RDS(ON), STATIC DRAIN-SOURCE
ON-RESISTANCE (Ω)
8
2.0
7
6
1.5
5
1.0
VGS = 5V
4
3
VGS = 10V
0.5
2
1
0
0
0.1
0.2
0.3
0.4
0.5
0.6
ID, DRAIN-SOURCE CURRENT (A)
Fig. 3 On-Resistance vs. Drain Current & Gate Voltage
100
1.9
1.8
ID = 250µA
CT, CAPACITANCE (pF)
VGS(TH), GATE THRESHOLD VOLTAGE (V)
2.0
1.7
1.6
1.5
1.4
1.3
Ciss
10
Coss
1.2
1.1
1.0
-50
-25
0
25
50
75 100 125 150
TA, AMBIENT TEMPERATURE (°C)
Fig. 5 Gate Threshold Variation vs. Ambient Temperature
DMN66D0LDW
Document number: DS31232 Rev. 6 - 2
3 of 5
www.diodes.com
1
Crss
0
5
10
15
20
25
30
35
VDS, DRAIN-SOURCE VOLTAGE (V)
Fig. 6 Typical Total Capacitance
40
February 2014
© Diodes Incorporated
DMN66D0LDW
IS, SOURCE CURRENT (A)
NEW PRODUCT
1
0.1
TA = 150°C
T A = 125°C
0.01
TA = 85°C
0.001
TA = 25°C
TA = -55°C
0.0001
0.1
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1
VSD, SOURCE-DRAIN VOLTAGE (V)
Fig. 7 Reverse Drain Current vs. Source-Drain Voltage
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
A
B C
H
K
M
J
D
F
L
SOT363
Dim
Min
Max
A
0.10
0.30
B
1.15
1.35
C
2.00
2.20
D
0.65 Typ
F
0.40
0.45
H
1.80
2.20
J
0
0.10
K
0.90
1.00
L
0.25
0.40
M
0.10
0.22
0°
8°
α
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
C2
Z
C2
Dimensions Value (in mm)
Z
2.5
G
1.3
X
0.42
Y
0.6
C1
1.9
C2
0.65
C1
G
Y
X
DMN66D0LDW
Document number: DS31232 Rev. 6 - 2
4 of 5
www.diodes.com
February 2014
© Diodes Incorporated
DMN66D0LDW
IMPORTANT NOTICE
NEW PRODUCT
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
DMN66D0LDW
Document number: DS31232 Rev. 6 - 2
5 of 5
www.diodes.com
February 2014
© Diodes Incorporated
Similar pages