NTB0102 Dual supply translating transceiver; auto direction sensing; 3-state Rev. 2 — 28 April 2011 Product data sheet 1. General description The NTB0102 is a 2-bit, dual supply translating transceiver with auto direction sensing, that enables bidirectional voltage level translation. It features two 2-bit input-output ports (An and Bn), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)). VCC(A) can be supplied at any voltage between 1.2 V and 3.6 V and VCC(B) can be supplied at any voltage between 1.65 V and 5.5 V, making the device suitable for translating between any of the low voltage nodes (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins An and OE are referenced to VCC(A) and pins Bn are referenced to VCC(B). A LOW level at pin OE causes the outputs to assume a high-impedance OFF-state. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down. 2. Features and benefits Wide supply voltage range: VCC(A): 1.2 V to 3.6 V and VCC(B): 1.65 V to 5.5 V IOFF circuitry provides partial Power-down mode operation Inputs accept voltages up to 5.5 V ESD protection: HBM JESD22-A114E Class 2 exceeds 2500 V for A port HBM JESD22-A114E Class 3B exceeds 15000 V for B port MM JESD22-A115-A exceeds 200 V CDM JESD22-C101E exceeds 1500 V Latch-up performance exceeds 100 mA per JESD 78B Class II Multiple package options Specified from −40 °C to +85 °C and −40 °C to +125 °C NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state 3. Ordering information Table 1. Ordering information Type number Package Temperature range Name Description Version NTB0102DP −40 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 NTB0102GT −40 °C to +125 °C XSON8 plastic extremely thin small outline package; no leads; SOT833-1 8 terminals; body 1 × 1.95 × 0.5 mm NTB0102GD −40 °C to +125 °C XSON8U plastic extremely thin small outline package; no leads; SOT996-2 8 terminals; UTLP based; body 3 × 2 × 0.5 mm NTB0102GF −40 °C to +125 °C XSON8 extremely thin small outline package; no leads; 8 terminals; body 1.35 × 1 × 0.5 mm SOT1089 NTB0102GU −40 °C to +125 °C XQFN10 plastic, extremely thin quad flat package; no leads; 10 terminals; body 1.40 × 1.80 × 0.50 mm SOT1160-1 4. Marking Table 2. Marking Type number Marking code[1] NTB0102DP t02 NTB0102GT t02 NTB0102GD t02 NTB0102GF t2 NTB0102GU t2 [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram OE A2 6 4 1 A1 B2 5 8 VCC(A) B1 VCC(B) 001aal914 Fig 1. Logic symbol NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 2 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state 6. Pinning information 6.1 Pinning NTB0102 B2 1 8 B1 GND 2 7 VCC(B) VCC(A) 3 6 OE A2 4 5 A1 NTB0102 B2 1 8 B1 GND 2 7 VCC(B) VCC(A) 3 6 OE A2 4 5 A1 001aam485 Transparent top view 001aam484 Fig 2. Pin configuration SOT505-2 (TSSOP8) Fig 3. Pin configuration SOT833-1 (XSON8) and SOT1089 (XSON8) B2 1 8 B1 GND 2 7 VCC(B) VCC(A) 3 6 OE A2 4 5 A1 8 B1 terminal 1 index area NTB0102 9 GND 10 A1 NTB0102 A2 1 7 n.c. Transparent top view B2 5 OE 4 001aam486 Fig 4. 6 VCC(B) n.c. 3 VCC(A) 2 001aam560 Transparent top view Pin configuration SOT996-2 (XSON8U) Fig 5. Pin configuration SOT1160-1 (XQFN10) 6.2 Pin description Table 3. Pin description Symbol Pin SOT505-2, SOT833-1, SOT1089 and SOT996-2 SOT1160-1 B2, B1 1, 8 5, 8 data input or output (referenced to VCC(B)) GND 2 9 ground (0 V) VCC(A) 3 2 supply voltage A A2, A1 4, 5 1, 10 data input or output (referenced to VCC(A)) NTB0102 Product data sheet Description All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 3 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state Table 3. Symbol OE Pin description …continued Pin Description SOT505-2, SOT833-1, SOT1089 and SOT996-2 SOT1160-1 6 4 output enable input (active HIGH; referenced to VCC(A)) VCC(B) 7 6 supply voltage B n.c. - 3, 7 not connected 7. Functional description Table 4. Function table[1] Supply voltage Input Input/output VCC(A) VCC(B) OE An Bn 1.2 V to VCC(B) 1.65 V to 5.5 V L Z Z 1.2 V to VCC(B) 1.65 V to 5.5 V H input or output output or input GND[2] GND[2] X Z Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. [2] When either VCC(A) or VCC(B) is at GND level, the device goes into Power-down mode. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC(A) supply voltage A VCC(B) supply voltage B Conditions output voltage VO Active mode input clamping current VI < 0 V IOK output clamping current VO < 0 V IO output current VO = 0 V to VCCO ICC supply current ICC(A) or ICC(B) IGND ground current Tstg storage temperature total power dissipation Ptot Unit +6.5 V −0.5 +6.5 V −0.5 +6.5 V [1][2][3] −0.5 VCCO + 0.5 V [1] −0.5 +6.5 V −50 - mA −50 - mA - ±50 mA - 100 mA −100 - mA −65 +150 °C - 250 mW Power-down or 3-state mode IIK Max −0.5 [1] input voltage VI Min Tamb = −40 °C to +125 °C [2] [4] [1] The minimum input and minimum output voltage ratings may be exceeded if the input and output current ratings are observed. [2] VCCO is the supply voltage associated with the output. [3] VCCO + 0.5 V should not exceed 6.5 V. [4] For TSSOP8 package: above 55 °C the value of Ptot derates linearly with 2.5 mW/K. For XSON8 and XSON8U packages: above 118 °C the value of Ptot derates linearly with 7.8 mW/K. For XQFN10 package: above 128 °C the value of Ptot derates linearly with 11.5 mW/K. NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 4 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state 9. Recommended operating conditions Table 6. Recommended operating conditions[1][2] Symbol Parameter VCC(A) Conditions Min Max Unit supply voltage A 1.2 3.6 V VCC(B) supply voltage B 1.65 5.5 V VI input voltage 0 5.5 V VO output voltage A port 0 3.6 V B port 0 5.5 V −40 +125 °C - 40 ns/V Power-down or 3-state mode; VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V Tamb ambient temperature Δt/ΔV input transition rise and fall rate VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V [1] The A and B sides of an unused I/O pair must be held in the same state, both at VCCI or both at GND. [2] VCC(A) must be less than or equal to VCC(B). 10. Static characteristics Table 7. Typical static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C. Symbol Parameter Conditions Min Typ Max Unit VOH HIGH-level output voltage A port; VCC(A) = 1.2 V; IO = −20 μA - 1.1 - V VOL LOW-level output voltage A port; VCC(A) = 1.2 V; IO = 20 μA - 0.09 - V II input leakage current OE input; VI = 0 V to 3.6 V; VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V - - ±1 μA IOZ OFF-state output A or B port; VO = 0 V to VCCO; VCC(A) = 1.2 V to 3.6 V; current VCC(B) = 1.65 V to 5.5 V - - ±1 μA IOFF power-off leakage current A port; VI or VO = 0 V to 3.6 V; VCC(A) = 0 V; VCC(B) = 0 V to 5.5 V - - ±1 μA B port; VI or VO = 0 V to 5.5 V; VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V - - ±1 μA ICC(A); VCC(A) = 1.2 V; VCC(B) = 1.65 V to 5.5 V - 0.05 - μA ICC(B); VCC(A) = 1.2 V; VCC(B) = 1.65 V to 5.5 V - 3.3 - μA ICC(A) + ICC(B); VCC(A) = 1.2 V; VCC(B) = 1.65 V to 5.5 V - 3.5 - μA supply current ICC VI = 0 V or VCCI; IO = 0 A [1] [2] CI input capacitance OE input; VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V - 1.0 - pF CI/O input/output capacitance A port; VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V - 4.0 - pF B port; VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V - 7.5 - pF [1] VCCO is the supply voltage associated with the output. [2] VCCI is the supply voltage associated with the input. NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 5 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state Table 8. Typical supply current At recommended operating conditions; voltages are referenced to GND (ground = 0 V); Tamb = 25 °C. VCC(A) VCC(B) 1.8 V Unit 2.5 V 3.3 V 5.0 V ICC(A) ICC(B) ICC(A) ICC(B) ICC(A) ICC(B) ICC(A) ICC(B) 1.2 V 10 10 10 10 10 20 10 1050 nA 1.5 V 10 10 10 10 10 10 10 650 nA 1.8 V 10 10 10 10 10 10 10 350 nA 2.5 V - - 10 10 10 10 10 40 nA 3.3 V - - - - 10 10 10 10 nA Table 9. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter VIH VIL VOH −40 °C to +85 °C Conditions Min Max Min Max 0.65VCCI - 0.65VCCI - V - 0.35VCCI - 0.35VCCI V VCCO − 0.4 - VCCO − 0.4 - V VCCO − 0.4 - VCCO − 0.4 - V A port; VCC(A) = 1.4 V to 3.6 V - 0.4 - 0.4 V B port; VCC(B) = 1.65 V to 5.5 V - 0.4 - 0.4 V - ±2 - ±5 μA - ±2 - ±10 μA HIGH-level input voltage A or B port and OE input LOW-level input voltage A or B port and OE input HIGH-level output voltage IO = −20 μA LOW-level output voltage Unit [1] VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V [1] VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V [2] A port; VCC(A) = 1.4 V to 3.6 V B port; VCC(B) = 1.65 V to 5.5 V VOL −40 °C to +125 °C IO = 20 μA [2] II input leakage current OE input; VI = 0 V to 3.6 V; VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V IOZ OFF-state output current A or B port; VO = 0 V or VCCO; VCC(A) = 1.2 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V IOFF power-off leakage current A port; VI or VO = 0 V to 3.6 V; VCC(A) = 0 V; VCC(B) = 0 V to 5.5 V - ±2 - ±10 μA B port; VI or VO = 0 V to 5.5 V; VCC(B) = 0 V; VCC(A) = 0 V to 3.6 V - ±2 - ±10 μA NTB0102 Product data sheet [2] All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 6 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state Table 9. Static characteristics …continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter ICC supply current −40 °C to +85 °C Conditions −40 °C to +125 °C Unit Min Max Min Max OE = LOW; VCC(A) = 1.4 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V - 3 - 15 μA OE = HIGH; VCC(A) = 1.4 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V - 3 - 20 μA VCC(A) = 3.6 V; VCC(B) = 0 V - 2 - 15 μA VCC(A) = 0 V; VCC(B) = 5.5 V - −2 - −15 μA OE = LOW; VCC(A) = 1.4 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V - 5 - 15 μA OE = HIGH; VCC(A) = 1.4 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V - 5 - 20 μA VCC(A) = 3.6 V; VCC(B) = 0 V - −2 - −15 μA VCC(A) = 0 V; VCC(B) = 5.5 V - 2 - 15 μA - 8 - 40 μA VI = 0 V or VCCI; IO = 0 A [1] ICC(A) ICC(B) ICC(A) + ICC(B) VCC(A) = 1.4 V to 3.6 V; VCC(B) = 1.65 V to 5.5 V [1] VCCI is the supply voltage associated with the input. [2] VCCO is the supply voltage associated with the output. 11. Dynamic characteristics Table 10. Typical dynamic characteristics for temperature 25 °C[1] Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for waveforms see Figure 6 and Figure 7. Symbol Parameter Conditions VCC(B) Unit 1.8 V 2.5 V 3.3 V 5.0 V A to B 5.9 4.8 4.4 4.2 ns B to A 5.6 4.8 4.5 4.4 ns VCC(A) = 1.2 V; Tamb = 25 °C tpd propagation delay ten enable time OE to A, B 0.5 0.5 0.5 0.5 μs tdis disable time OE to A; no external load [2] 6.9 6.9 6.9 6.9 ns OE to B; no external load [2] 9.5 8.6 8.5 8.0 ns 81 69 83 68 ns OE to A tt transition time NTB0102 Product data sheet OE to B 81 69 83 68 ns A port 4.0 4.0 4.1 4.1 ns B port 2.6 2.0 1.7 1.4 ns All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 7 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state Table 10. Typical dynamic characteristics for temperature 25 °C[1] …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for waveforms see Figure 6 and Figure 7. Symbol Parameter Conditions tsk(o) output skew time between channels tW pulse width data inputs fdata data rate [1] VCC(B) Unit 1.8 V 2.5 V 3.3 V 5.0 V 0.2 0.2 0.2 0.2 [3] ns 15 13 13 13 ns 70 80 80 80 Mbps tpd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. tt is the same as tTHL and tTLH [2] Delay between OE going LOW and when the outputs are actually disabled. [3] Skew between any two outputs of the same package switching in the same direction. Table 11. Dynamic characteristics for temperature range −40 °C to +85 °C[1] Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7. Symbol Parameter Conditions VCC(B) Unit 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5.0 V ± 0.5 V Min Max Min Max Min Max Min Max A to B 1.4 12.9 1.2 10.1 1.1 10.0 0.8 9.9 B to A 0.9 14.2 0.7 12.0 0.4 11.7 0.3 13.7 ns VCC(A) = 1.5 V ± 0.1 V tpd propagation delay ns ten enable time OE to A, B - 1.0 - 1.0 - 1.0 - 1.0 μs tdis disable time OE to A; no external load [2] 1.0 11.9 1.0 11.9 1.0 11.9 1.0 11.9 ns OE to B; no external load [2] 1.0 16.9 1.0 15.2 1.0 14.1 1.0 13.8 ns - 320 - 260 - 260 - 280 ns OE to A OE to B tt transition time A port B port tsk(o) output skew time between channels tW pulse width data inputs fdata data rate [3] - 200 - 200 - 200 - 200 ns 0.9 5.1 0.9 5.1 0.9 5.1 0.9 5.1 ns 0.9 4.7 0.6 3.2 0.5 2.5 0.4 2.7 ns - 0.5 - 0.5 - 0.5 - 0.5 ns 25 - 25 - 25 - 25 - ns - 40 - 40 - 40 - 40 Mbps VCC(A) = 1.8 V ± 0.15 V tpd ten tdis tt propagation delay A to B 1.6 11.0 1.4 7.7 1.3 6.8 1.2 6.5 ns B to A 1.5 12.0 1.3 8.4 1.0 7.6 0.9 7.1 ns enable time OE to A, B disable time transition time NTB0102 Product data sheet - 1.0 - 1.0 - 1.0 - 1.0 μs OE to A; no external load [2] 1.0 11.0 1.0 11.0 1.0 11.0 1.0 11.0 ns OE to B; no external load [2] 12.1 ns 1.0 15.4 1.0 13.5 1.0 12.4 1.0 OE to A - 260 - 230 - 230 - 230 ns OE to B - 200 - 200 - 200 - 200 ns A port 0.8 4.1 0.8 4.1 0.8 4.1 0.8 4.1 ns B port 0.9 4.7 0.6 3.2 0.5 2.5 0.4 2.7 ns All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 8 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state Table 11. Dynamic characteristics for temperature range −40 °C to +85 °C[1] …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7. Symbol Parameter Conditions VCC(B) Unit 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5.0 V ± 0.5 V tsk(o) output skew time between channels tW pulse width data inputs fdata data rate [3] Min Max Min Max Min Max Min Max - 0.5 - 0.5 - 0.5 - 0.5 ns 20 - 17 - 17 - 17 - ns - 49 - 60 - 60 - 60 Mbps VCC(A) = 2.5 V ± 0.2 V tpd ten propagation delay A to B - - 1.1 6.3 1.0 5.2 0.9 4.7 ns B to A - - 1.2 6.6 1.1 5.1 0.9 4.4 ns enable time OE to A, B 1.0 - 1.0 - 1.0 μs ns disable time tdis transition time tt - - - OE to A; no external load [2] - - 1.0 9.2 1.0 9.2 1.0 9.2 OE to B; no external load [2] - - 1.0 11.9 1.0 10.7 1.0 10.2 ns OE to A - - - 200 - 200 - 200 ns OE to B - - - 200 - 200 - 200 ns A port - - 0.7 3.0 0.7 3.0 0.7 3.0 ns B port - - 0.7 3.2 0.5 2.5 0.4 2.7 ns - - - 0.5 - 0.5 - 0.5 ns tsk(o) output skew time between channels tW pulse width data inputs fdata data rate [3] - - 12 - 10 - 10 - - - - 85 - 100 - 100 Mbps ns ns VCC(A) = 3.3 V ± 0.3 V tpd propagation delay A to B - - - - 0.9 4.7 0.8 4.0 B to A - - - - 1.0 4.9 0.9 3.8 ns ten enable time OE to A, B - - - - - 1.0 - 1.0 μs tdis disable time OE to A; no external load [2] - - - - 1.0 9.2 1.0 9.2 ns OE to B; no external load [2] - - - - 1.0 10.1 1.0 9.6 ns OE to A - - - - - 260 - 260 ns OE to B - - - - - 200 - 200 ns A port - - - - 0.7 2.5 0.7 2.5 ns - - - - 0.5 2.5 0.4 2.7 ns - - - - - 0.5 - 0.5 ns - - - - 10 - 10 - ns - - - - - 100 - 100 transition time tt B port tsk(o) output skew time between channels tW pulse width data inputs fdata data rate [1] [3] Mbps tpd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. tt is the same as tTHL and tTLH. [2] Delay between OE going LOW and when the outputs are actually disabled. [3] Skew between any two outputs of the same package switching in the same direction. NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 9 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state Table 12. Dynamic characteristics for temperature range −40 °C to +125 °C[1] Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7. Symbol Parameter Conditions VCC(B) Unit 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5.0 V ± 0.5 V Min Max Min Max Min Max Min Max VCC(A) = 1.5 V ± 0.1 V tpd propagation delay A to B 1.4 15.9 1.2 13.1 1.1 13.0 0.8 12.9 ns B to A 0.9 17.2 0.7 15.0 0.4 14.7 0.3 16.7 ns ten enable time OE to A, B - 1.0 - 1.0 - 1.0 - OE to A; no external load [2] 1.0 12.5 1.0 12.5 1.0 12.5 1.0 12.5 ns OE to B; no external load [2] 1.0 18.1 1.0 16.2 1.0 14.9 1.0 14.6 ns OE to A - 340 - 280 - 280 - 300 ns OE to B - 220 - 220 - 220 - 220 ns 0.9 7.1 0.9 7.1 0.9 7.1 0.9 7.1 ns 0.9 6.5 0.6 5.2 0.5 4.8 0.4 4.7 ns - 0.5 - 0.5 - 0.5 - 0.5 ns 25 - 25 - 25 - 25 - ns - 40 - 40 - 40 - 40 Mbps ns tdis tt disable time transition time A port B port tsk(o) output skew time between channels tW pulse width data inputs fdata data rate [3] 1.0 μs VCC(A) = 1.8 V ± 0.15 V tpd ten tdis tt propagation delay A to B 1.6 14.0 1.4 10.7 1.3 9.8 1.2 9.5 B to A 1.5 15.0 1.3 11.4 1.0 10.6 0.9 10.1 ns enable time OE to A, B - 1.0 - 1.0 - 1.0 - disable time transition time 1.0 μs 1.0 11.5 ns 1.0 12.7 ns OE to A; no external load [2] 1.0 11.5 1.0 11.5 1.0 11.5 OE to B; no external load [2] 1.0 16.5 1.0 14.5 1.0 13.3 OE to A - 280 - 250 - 250 - 250 ns OE to B - 220 - 220 - 220 - 220 ns A port 0.8 6.2 0.8 6.1 0.8 6.1 0.8 6.1 ns B port 0.9 5.8 0.6 5.2 0.5 4.8 0.4 4.7 ns - 0.5 - 0.5 - 0.5 - 0.5 ns 22 - 19 - 19 - 19 - ns - 45 - 55 - 55 - 55 Mbps ns tsk(o) output skew time between channels tW pulse width data inputs fdata data rate [3] VCC(A) = 2.5 V ± 0.2 V tpd propagation delay A to B - - 1.1 9.3 1.0 8.2 0.9 7.7 B to A - - 1.2 9.6 1.1 8.1 0.9 7.4 ns ten enable time OE to A, B - - - 1.0 - 1.0 - 1.0 μs tdis disable time OE to A; no external load [2] - - 1.0 9.6 1.0 9.6 1.0 9.6 ns OE to B; no external load [2] - - 1.0 12.6 1.0 11.4 1.0 10.8 ns OE to A - - - 220 - 220 - 220 ns OE to B - - - 220 - 220 - 220 ns A port - - 0.7 5.0 0.7 5.0 0.7 5.0 ns B port - - 0.7 4.6 0.5 4.8 0.4 4.7 ns tt transition time NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 10 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state Table 12. Dynamic characteristics for temperature range −40 °C to +125 °C[1] …continued Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 8; for wave forms see Figure 6 and Figure 7. Symbol Parameter Conditions VCC(B) Unit 1.8 V ± 0.15 V 2.5 V ± 0.2 V 3.3 V ± 0.3 V 5.0 V ± 0.5 V tsk(o) output skew time between channels tW pulse width data inputs; fdata data rate [3] Min Max Min Max Min Max Min Max - - - 0.5 - 0.5 - 0.5 ns - - 14 - 13 - 10 - ns - - - 75 - 80 - 100 Mbps VCC(A) = 3.3 V ± 0.3 V tpd ten propagation delay A to B - - - - 0.9 7.7 0.8 7.0 ns B to A - - - - 1.0 7.9 0.9 6.8 ns enable time OE to A, B 1.0 - 1.0 μs disable time tdis transition time tt - - - - - OE to A; no external load [2] - - - - 1.0 9.5 1.0 9.5 ns OE to B; no external load [2] - - - - 1.0 10.7 1.0 9.6 ns OE to A - - - - - 280 - 280 ns OE to B - - - - - 220 - 220 ns A port - - - - 0.7 4.5 0.7 4.5 ns B port - - - - 0.5 4.1 0.4 4.7 ns - - - - - 0.5 - 0.5 ns - - - - 10 - 10 - ns - - - - - 100 - 100 tsk(o) output skew time between channels tW pulse width data inputs fdata data rate [1] [3] Mbps tpd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. tt is the same as tTHL and tTLH. [2] Delay between OE going LOW and when the outputs are actually disabled. [3] Skew between any two outputs of the same package switching in the same direction. NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 11 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state Table 13. Typical power dissipation capacitance Voltages are referenced to GND (ground = 0 V).[1][2] Symbol Parameter Conditions VCC(A) 1.2 V 1.2 V 1.5 V 1.8 V Unit 2.5 V 2.5 V 3.3 V VCC(B) 1.8 V 5.0 V 1.8 V 1.8 V 2.5 V 5.0 V 3.3 V to 5.0 V 5 5 5 5 5 5 5 Tamb = 25 °C power dissipation capacitance CPD outputs enabled; OE = VCC(A) A port: (direction A to B) pF A port: (direction B to A) 8 8 8 8 8 8 8 pF B port: (direction A to B) 18 18 18 18 18 18 18 pF B port: (direction B to A) 13 16 12 12 12 12 13 pF A port: (direction A to B) 0.12 0.12 0.04 0.05 0.08 0.08 0.07 pF A port: (direction B to A) 0.01 0.01 0.01 0.01 0.01 0.01 0.01 pF B port: (direction A to B) 0.01 0.01 0.01 0.01 0.01 0.01 0.01 pF B port: (direction B to A) 0.07 0.09 0.07 0.07 0.05 0.09 0.09 pF outputs disabled; OE = GND [1] CPD is used to determine the dynamic power dissipation (PD in μW). PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; Σ(CL × VCC2 × fo) = sum of the outputs. [2] fi = 10 MHz; VI = GND to VCC; tr = tf = 1 ns; CL = 0 pF; RL = ∞ Ω. 12. Waveforms VI An, Bn input VM GND tPHL VOH Bn, An output tPLH 90 % VM VOL 10 % tTHL tTLH 001aal918 Measurement points are given in Table 14. VOL and VOH are typical output voltage levels that occur with the output load. Fig 6. Data input (An, Bn) to data output (Bn, An) propagation delay times NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 12 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state VI OE input VM GND tPLZ output LOW-to-OFF OFF-to-LOW tPZL VCCO VM VX VOL tPHZ VOH tPZH VY output HIGH-to-OFF OFF-to-HIGH VM GND outputs enabled outputs disabled outputs enabled 001aal919 Measurement points are given in Table 14. VOL and VOH are typical output voltage levels that occur with the output load. Fig 7. Enable and disable times Table 14. Measurement points[1] Supply voltage Input Output VCCO VM VM VX VY 1.2 V 0.5VCCI 0.5VCCO VOL + 0.1 V VOH − 0.1 V 1.5 V ± 0.1 V 0.5VCCI 0.5VCCO VOL + 0.1 V VOH − 0.1 V 1.8 V ± 0.15 V 0.5VCCI 0.5VCCO VOL + 0.15 V VOH − 0.15 V 2.5 V ± 0.2 V 0.5VCCI 0.5VCCO VOL + 0.15 V VOH − 0.15 V 3.3 V ± 0.3 V 0.5VCCI 0.5VCCO VOL + 0.3 V VOH − 0.3 V 5.0 V ± 0.5 V 0.5VCCI 0.5VCCO VOL + 0.3 V VOH − 0.3 V [1] VCCI is the supply voltage associated with the input and VCCO is the supply voltage associated with the output. NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 13 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VEXT VCC VI RL VO G DUT CL RL 001aal920 Test data is given in Table 15. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz; ZO = 50 Ω; dV/dt ≥ 1.0 V/ns. RL = Load resistance. CL = Load capacitance including jig and probe capacitance. VEXT = External voltage for measuring switching times. Fig 8. Table 15. Test circuit for measuring switching times Test data Supply voltage Input VCC(A) VI[1] VCC(B) 1.2 V to 3.6 V 1.65 V to 5.5 V VCCI Load VEXT Δt/ΔV CL RL[2] ≤ 1.0 ns/V 15 pF 50 kΩ, 1 MΩ open tPLH, tPHL tPZH, tPHZ tPZL, tPLZ[3] open 2VCCO [1] VCCI is the supply voltage associated with the input. [2] For measuring data rate, pulse width, propagation delay and output rise and fall measurements, RL = 1 MΩ; for measuring enable and disable times, RL = 50 kΩ. [3] VCCO is the supply voltage associated with the output. NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 14 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state 13. Application information 13.1 Applications Voltage level-translation applications. The NTB0102 can be used to interface between devices or systems operating at different supply voltages. See Figure 9 for a typical operating circuit using the NTB0102. 1.8 V 3.3 V 0.1 μF 1.8 V SYSTEM CONTROLLER VCC(A) VCC(B) 3.3 V SYSTEM 0.1 μF OE NTB0102 A1 B1 A2 B2 DATA DATA GND 001aam487 Fig 9. Typical operating circuit NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 15 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state 13.2 Architecture The architecture of the NTB0102 is shown in Figure 10. The device does not require an extra input signal to control the direction of data flow from A to B or from B to A. In a static state, the output drivers of the NTB0102 can maintain a defined output level, but the output architecture is designed to be weak, so that they can be overdriven by an external driver when data on the bus starts flowing in the opposite direction. The output of one-shot circuits detect rising or falling edges on the A or B ports. During a rising edge, the one-shot circuits turn on the PMOS transistors (T1, T3) for a short duration, accelerating the LOW-to-HIGH transition. Similarly, during a falling edge, the one-shot circuits turn on the NMOS transistors (T2, T4) for a short duration, accelerating the HIGH-to-LOW transition. During output transitions the typical output impedance is 70 Ω at VCCO = 1.2 V to 1.8 V, 50 Ω at VCCO = 1.8 V to 3.3 V and 40 Ω at VCCO = 3.3 V to 5.0 V. VCC(B) VCC(A) ONE SHOT T1 4 kΩ ONE SHOT T2 B A T3 ONE SHOT 4 kΩ T4 ONE SHOT 001aal921 Fig 10. Architecture of NTB0102 I/O cell (one channel) NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 16 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state 13.3 Input driver requirements For correct operation, the device driving the data I/Os of the NTB0102 must have a minimum drive capability of ±2 mA See Figure 11 for a plot of typical input current versus input voltage. II VT/4 kΩ VI −(VD − VT)/4 kΩ 001aal922 VT: input threshold voltage of the NTB0102 (typically VCCI / 2). VD: supply voltage of the external driver. Fig 11. Typical input current versus input voltage graph 13.4 Power-up During operation VCC(A) must never be higher than VCC(B), however during power-up VCC(A) ≥ VCC(B) does not damage the device, so either power supply can be ramped up first. There is no special power-up sequencing required. The NTB0102 includes circuitry that disables all output ports when either VCC(A) or VCC(B) is switched off. 13.5 Enable and disable An output enable input (OE) is used to disable the device. Setting OE = LOW causes all I/Os to assume the high-impedance OFF-state. The disable time (tdis with no external load) indicates the delay between when OE goes LOW and when outputs actually become disabled. The enable time (ten) indicates the amount of time the user must allow for one one-shot circuitry to become operational after OE is taken HIGH. To ensure the high-impedance OFF-state during power-up or power-down, pin OE should be tied to GND through a pull-down resistor, the minimum value of the resistor is determined by the current-sourcing capability of the driver. 13.6 Pull-up or pull-down resistors on I/O lines As mentioned previously the NTB0102 is designed with low static drive strength to drive capacitive loads of up to 70 pF. To avoid output contention issues, any pull-up or pull-down resistors used must be above 50 kΩ. For this reason the NTB0102 is not recommended for use in open drain driver applications such as 1-Wire or I2C-bus. For these applications, the NTS0102 level translator is recommended. NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 17 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state 14. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm D E A SOT505-2 X c HE y v M A Z 5 8 A A2 (A3) A1 pin 1 index θ Lp L 1 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max. A1 A2 A3 bp c D(1) E(1) e HE L Lp v w y Z(1) θ mm 1.1 0.15 0.00 0.95 0.75 0.25 0.38 0.22 0.18 0.08 3.1 2.9 3.1 2.9 0.65 4.1 3.9 0.5 0.47 0.33 0.2 0.13 0.1 0.70 0.35 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16 --- Fig 12. Package outline SOT505-2 (TSSOP8) NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 18 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4× (2) L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A(1) max A1 max b D E e e1 L L1 mm 0.5 0.04 0.25 0.17 2.0 1.9 1.05 0.95 0.6 0.5 0.35 0.27 0.40 0.32 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT833-1 --- MO-252 --- EUROPEAN PROJECTION ISSUE DATE 07-11-14 07-12-07 Fig 13. Package outline SOT833-1 (XSON8) NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 19 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 3 x 2 x 0.5 mm B D SOT996-2 A A E A1 detail X terminal 1 index area e1 v w b e L1 1 4 8 5 C C A B C M M y y1 C L2 L X 0 1 2 mm scale DIMENSIONS (mm are the original dimensions) UNIT A max A1 b D E e e1 L L1 L2 v w y y1 mm 0.5 0.05 0.00 0.35 0.15 2.1 1.9 3.1 2.9 0.5 1.5 0.5 0.3 0.15 0.05 0.6 0.4 0.1 0.05 0.05 0.1 REFERENCES OUTLINE VERSION IEC SOT996-2 --- JEDEC JEITA --- EUROPEAN PROJECTION ISSUE DATE 07-12-18 07-12-21 Fig 14. Package outline SOT996-2 (XSON8U) NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 20 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state XSON8: extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1 x 0.5 mm SOT1089 E terminal 1 index area A D A1 detail X (4×)(2) e L (8×)(2) b 4 5 e1 1 terminal 1 index area 8 L1 X 0 0.5 scale Dimensions Unit mm max nom min 1 mm A(1) 0.5 A1 b D E e e1 L L1 0.04 0.20 1.40 1.05 0.35 0.40 0.15 1.35 1.00 0.55 0.35 0.30 0.35 0.27 0.32 0.12 1.30 0.95 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. Outline version SOT1089 sot1089_po References IEC JEDEC JEITA European projection Issue date 10-04-09 10-04-12 MO-252 Fig 15. Package outline SOT1089 (XSON8) NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 21 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state XQFN10: plastic, extremely thin quad flat package; no leads; 10 terminals; body 1.40 x 1.80 x 0.50 mm SOT1160-1 X A B D terminal 1 index area A E A1 A3 detail X e1 e 3 5 C C A B C v w b y y1 C L 2 6 1 7 e2 terminal 1 index area 10 L1 8 0 1 scale Dimensions Unit(1) mm max nom min 2 mm A A1 0.5 0.05 A3 b 0.25 0.127 0.20 0.00 0.15 D E 1.5 1.4 1.3 1.9 1.8 1.7 e e1 0.4 0.8 e2 0.4 L L1 0.45 0.55 0.40 0.50 0.35 0.45 v 0.1 w y y1 0.05 0.05 0.05 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. References Outline version IEC JEDEC JEITA SOT1160-1 --- --- --- sot1160-1_po European projection Issue date 09-12-28 09-12-29 Fig 16. Package outline SOT1160-1 (XQFN10) NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 22 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state 15. Abbreviations Table 16. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model NMOS N-type Metal Oxide Semiconductor PMOS P-type Metal Oxide Semiconductor PRR Pulse Repetition Rate 16. Revision history Table 17. Revision history Document ID Release date Data sheet status Change notice Supersedes NTB0102 v.2 20110428 Product data sheet - NTB0102 v.1 - - Modifications: NTB0102 v.1 NTB0102 Product data sheet • Added Table 8: total supply current (typical). 20100922 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 23 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 17.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. The product is not designed, authorized or warranted to be NTB0102 Product data sheet suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 24 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] NTB0102 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 28 April 2011 © NXP B.V. 2011. All rights reserved. 25 of 26 NTB0102 NXP Semiconductors Dual supply translating transceiver; auto direction sensing; 3-state 19. Contents 1 2 3 4 5 6 6.1 6.2 7 8 9 10 11 12 13 13.1 13.2 13.3 13.4 13.5 13.6 14 15 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Application information. . . . . . . . . . . . . . . . . . 15 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Input driver requirements . . . . . . . . . . . . . . . . 17 Power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Enable and disable . . . . . . . . . . . . . . . . . . . . . 17 Pull-up or pull-down resistors on I/O lines . . . 17 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 23 Legal information. . . . . . . . . . . . . . . . . . . . . . . 24 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Contact information. . . . . . . . . . . . . . . . . . . . . 25 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 28 April 2011 Document identifier: NTB0102