Material Content Data Sheet Sales Product Name SAK-XE164FM-72F80L AA MA# MA001021912 Package PG-LQFP-100-8 Issued 29. August 2013 Weight* 755.66 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 38.601 5.11 0.069 0.01 0.275 0.04 364 5.501 0.73 7279 223.351 29.56 30.34 295569 303303 2.766 0.37 0.37 3660 3660 2.316 0.31 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 5.11 51082 51082 91 3065 62.527 8.27 398.319 52.69 61.27 527113 612922 9.288 1.23 1.23 12292 12292 2.495 0.33 0.33 3302 3302 2.539 0.34 7.616 1.01 82744 3360 1.35 10079 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 13439 1000000