LX5251 ® TM 9-Line Multimode SCSI Terminator P RODUCTION DATA SHEET KEY FEATURES DESCRIPTION Compliant with SCSI SPI-2 (Ultra2), SPI-3 (Ultra160), and SPI-4 (Ultra320) Auto-Selectable LVD or SingleEnded Termination Fast Response, No Output Capacitors Required Compatible with Active Negation Drivers 15µA Supply Current in Disconnect Mode Logic Command Disconnects All Termination Lines Diffsense Line Driver Ground Driver Integrated for Single-Ended Operation Current Limit and Thermal Protection Hot-Swap Compatible (SingleEnded) Available in 24-pin TSSOP Package application, this pin is tied to the DIFFSENSE input of the corresponding LVD transceivers. This action enables the LVD transceiver function. DIFFSENSE is capable of supplying a maximum of 15mA. Tying the DIFFSENSE pin high places the LX5251 in a HI-Z state indicating the presence of an HVD device. Tying the pin low places the part in a single-ended mode while also signaling the multimode transceiver to operate in a single-ended mode. Recognizing the needs of portable and configurable peripherals, the LX5251 has a TTL compatible sleep/disable mode. During this sleep/disable mode, power dissipation is reduced to a meager 15uA while also placing all outputs in a HI-Z state. Also during sleep/disable mode, the DIFFSENSE function is disabled and is placed in a HI-Z state. The LX5251 also provides a master / slave function. Driving this pin high or floating the pin enables the 1.3V DIFFSENSE reference. Driving the pin low disables the on board DIFFSENSE reference and enables use of an external master reference device. WWW . Microsemi .C OM The LX5251 is a multimode SCSI terminator that is compatible with the SCSI SPI-2 (Ultra2), SCSI SPI-3 (Ultra3 or Ultra160), and SCSI SPI-4 (Ultra320) specifications developed by the T10 standards committee for low voltage differential (LVD) termination, while providing backwards compatibility to the SCSI, SCSI-2, and SPI single-ended specifications. Multimode compatibility permits the use of legacy devices on the bus without hardware alterations. Automatic mode selection is achieved through voltage detection on the Diffsense line. The LX5251 utilizes an industry standard LVD architecture. The individual high bandwidth drivers maximize channel separation, reduce channel-to-channel noise and cross talk to insure Ultra320 performance. When the LX5251 is enabled, the differential sense (DIFFSENSE) pin supplies a voltage between 1.2V and 1.4V. In IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com PRODUCT HIGHLIGHT - L X 5251 - + + L X 5251 LX5251 PACKAGE ORDER INFO Plastic TSSOP PW 24-Pin TA (°C) RoHS Compliant / Pb-free Transition DC: 0442 0 to 70 LX5251CPW Note: Available in Tape & Reel.Append the letters “TR” to the part number. (i.e. LX5251CPW-TR) Copyright © 2002 Rev. 1.1, 2006-02-27 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 LX5251 ® TM 9-Line Multimode SCSI Terminator P RODUCTION DATA SHEET ABSOLUTE MAXIMUM RATINGS PACKAGE PIN OUT Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents are positive into, negative out of specified terminal. 1+ 12+ 23+ 34+ 45+ 5DISC GND THERMAL DATA PW 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 VTERM NC 99+ 88+ 77+ 66+ DIFFSENSE M/Sb PW PACKAGE WWW . Microsemi .C OM Term Power (VTERM) ................................................................................................-0.3V to 7V Operating Junction Temperature .......................................................................................150°C Storage Temperature Range ............................................................................... -65°C to 150°C Peak Package Solder Reflow Temperature (40 second maximum exposure)...... 260°C (+0, -5) (Top View) 24 Pin Plastic TSSOP N/C = Not internally connected THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA 100°C/W RoHS / Pb-free 100% Matte Tin Lead Finish Junction Temperature Calculation: TJ = TA + (PD x θJA). The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. θJA can vary significantly depending on mounting technique. MASTER/SLAVE FUNCTION TABLE Master/Slave DIFFSENSE Status L* HI Z 0mA H 1.3V 10mA Source Open (Pull-Up) 1.3V 10mA Source * When in Low state, terminator will sense state of DIFFSENS line. DIFFSENSE/POWER UP/POWER DOWN FUNCTION TABLE Copyright © 2002 Rev. 1.1, 2006-02-27 Outputs Status Type Quiescent Current L < 0.5V Enable SE 55mA L 0.7V – 1.9V Enable LVD 35mA L > 2.4V Disable HI-Z 8mA H or Open X Disable HI-Z 10µA Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 PACKAGE DATA DISCONNECT DIFFSENSE Page 2 LX5251 ® TM 9-Line Multimode SCSI Terminator P RODUCTION DATA SHEET RECOMMENDED MAX OPERATING CONDITIONS Symbol LVD SE Signal Line Voltage VTerm VTERM Min Units Max 2.9 3.5 0 5.25 5.25 5.0 0 VTERM V 0 125 °C Disconnect Input Voltage Operating Junction Temperature LX5251 Typ TJ V V ELECTRICAL CHARACTERISTICS Unless otherwise specified, the following specifications apply over the operating ambient temperature 0°C ≤ TA ≤ 70°C, VTerm = 4.75V, and DISC = L. LX5251 Parameter Symbol Test Conditions Units Min Typ Max ` ` LVD Terminator Section All term lines open DISC > 2.0V 1.125 35 15 1.25 45 35 1.375 mA µA V Open circuit between (-) and (+) terminals 100 112 125 mV VOUT Differential = -1V to +1V 100 105 110 Ω 110 150 195 Ω 3 pF VTerm Supply Current LVDICC Common Mode Voltage VCM Offset Voltage VOS Differential Terminator Impedance ZO Common Mode Impedance ZCM 0.5V to 2V Output Capacitance (Note 1) CO DISC > 2.0V Mode Change Delay tDF Diffsense = 1.4V to 0V 100 115 300 ms 1.2 1.3 1.4 V Diffsense Section Diffsense Output Voltage Diffsense Output Source Current Diffsense Sink Current ` WWW . Microsemi .C OM Parameter VDIFF IDIFF ISINK(DIFF) VDIFF = 0V 5 15 mA VDIFF = 2.75V 20 200 µA 2.5 55 250 15 2.7 75 290 35 3.1 mA mA µA V 18.5 22.5 24 40 65 Single Ended Section VTerm Supply Current Termination Output High Voltage Output Current SEICC All tem lines = Open, Master/Slave = 0V All tem lines = 0.2V, Master/Slave = 0V DISC > 2.0V; TA = 25° VO IO VOUT = 0.2V ISINK VOUT = 4V, All lines Output Capacitance (Note 1) CO IDDQ DISC > 2.0V DISC > 2.0V ; VLINE = 0 to 4V, TA = 25° DISC > 2.0V ;VTERM = Open, VLINE = 2.7V, TA = 25° I = 1mA Output Leakage IHP Ground Driver Impedance Copyright © 2002 Rev. 1.1, 2006-02-27 ZG Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 mA mA 3 2 1 pF µA µA 100 Ω Page 3 ELECTRICALS Sink Current LX5251 ® TM 9-Line Multimode SCSI Terminator P RODUCTION DATA SHEET ` DISCONNECT Section Disconnect Thresholds VTH Input Current ` 0.8 IIL IIH DISC = 0V DISC = 2.4V 2.0 V 10 nA µA 100 MASTER/SLAVE Section Master/Slave Thresholds VTH(MS) 0.8 IIL(MS) IIH(MS) Input Current Master/Slave = 0V Master/Slave = 2.4V 100 2.0 V 10 µA nA WWW . Microsemi .C OM ELECTRICAL CHARACTERISTICS (CONTINUED) Unless otherwise specified, the following specifications apply over the operating ambient temperature 0°C ≤ TA ≤ 125°C, VTerm = 4.75V, and DISCONNECT = L. LX5251 Parameter Symbol Test Conditions Units Min Typ Max Note 1: Guaranteed by design. BLOCK DIAGRAM VTERM 1 of 9 Terminator Pairs 24 22.4mA I-Limited 2.7V Source 1.07 mA SE LVD 2 HVD LVD(-) /SE 52.5 DISC 11 SE DISC LVD 150 52.5 1.25V M/S 10mA I-Limited 1.3V Source 13 HVD LVD POWER ON & MODE DELAY DIFFB GND ELECTRICALS 20K 20 12 Window Comp. 14 LVD(+) /SE (Pseudo-GND) 1.07 mA SE DIFSENSE 1 HVD DISC SE LATCH HVD LVD Figure 1 – LX5251 Block Diagram Copyright © 2002 Rev. 1.1, 2006-02-27 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 4 LX5251 ® TM 9-Line Multimode SCSI Terminator P RODUCTION DATA SHEET FUNCTIONAL PIN DESCRIPTION DESCRIPTION 1-, 2-, 3-, 4-, 5-, 6-, 7-, 8-, 9- Negative signal termination lines for LVD mode. Signal termination lines for SE mode. 1+, 2+, 3+, 4+, 5+, 6+, 7+, 8+, 9+ Positive signal termination lines for LVD mode. Psuedo-ground lines for SE mode. Power supply pin for terminator. Connect to SCSI bus VTERM. Musts be decoupled by one 4.7µF low-ESR capacitor for every three terminator devices. It is VTERM absolutely necessary to connect this pin to the decoupling capacitor through a very low impedance (big traces to PCB). Keeping distances very short from the decoupling capacitors is somewhat layout dependent and some applications may benefit from high frequency decoupling with 0.1µF capacitors at VTERM pin. DISCONNECT Enables/Disables terminator. See Power Down Function Table for logic levels. GND WWW . Microsemi .C OM PIN NAME Terminator ground pin. Connect to ground. MASTER/SLAVE DIFFSENSE Sometimes referred to as M/S pin in this datasheet. Used to select which terminator is the controlling device. M/S pin High or Open enables the DIFFSENSE output drive. Please see MASTER/SLAVE Function Table. This is a dual function pin. It drives the SCSI bus DIFFSENS line. It is also the sense pin to detect the SCSI bus mode (LVD, SE, or HVD). DIFFSENSE output drive can be disabled with low level on the M/S pin. Please see DIFFSENSE and MASTER/SLAVE Function Tables. Note: Must connect Diffsense signal to Diffsense pin of LX5251. PACKAGE DATA Copyright © 2002 Rev. 1.1, 2006-02-27 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 5 LX5251 ® TM 9-Line Multimode SCSI Terminator P RODUCTION DATA SHEET PERIPHERAL HOST TERMPOWER 11+ VTERM 11+ WWW . Microsemi .C OM APPLICATION SCHEMATIC TERMPOWER VTERM Data Lines (9) LX5251 DISCONNECT 99+ 99+ LX5251 GND GND DIFFSENS DIFFSENS 4.7uF DISCONNECT DISC DISC 11+ VTERM 1- VTERM 4.7uF 1+ Data Lines (9) LX5251 99+ 99+ LX5251 DISC DISC GND GND DIFFSENS DIFFSENS 1- VTERM 11+ 1+ VTERM Control Lines (9) LX5251 99+ 99+ LX5251 DISC DISC APPLICATIONS GND GND DIFFSENS DIFFSENS * DIFFB pin not present on the LX5251CPW. Must connect Diffsense signal to Diffsens pin of each terminator. Figure 2 – Microsemi Application Schematic Copyright © 2002 Rev. 1.1, 2006-02-27 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 6 LX5251 ® TM 9-Line Multimode SCSI Terminator P RODUCTION DATA SHEET PW WWW . Microsemi .C OM MECHANICAL DRAWINGS 24-Pin Thin Small Shrink Outline (TSSOP) 3 21 P E F D A H SEATING PLANE Dim G MILLIMETERS MIN MAX 0.85 0.95 0.19 0.30 0.09 0.20 7.70 7.90 4.30 4.50 0.65 BSC 0.05 0.15 – 1.10 0.50 0.75 0° 8° 6.25 6.55 – 0.10 L C M INCHES MIN MAX 0.033 0.037 0.007 0.012 0.0035 0.008 0.303 0.311 0.169 0.177 0.025 BSC 0.002 0.005 – .0433 0.020 0.030 0° 8° 0.246 0.256 – 0.004 MECHANICALS A B C D E F G H L M P *LC B * Lead Coplanarity Note: 1. Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006”) on any side. Lead dimension shall not include solder coverage. Copyright © 2002 Rev. 1.1, 2006-02-27 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 7 LX5251 TM ® 9-Line Multimode SCSI Terminator P RODUCTION DATA SHEET WWW . Microsemi .C OM NOTES NOTES PRODUCTION DATA – Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. Copyright © 2002 Rev. 1.1, 2006-02-27 Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 8