STMicroelectronics M27C1001-45XBTR 1 mbit (128 kbit x 8) uv eprom and otp eprom Datasheet

M27C1001
1 Mbit (128 Kbit x 8) UV EPROM and OTP EPROM
Features
■
5v ± 10% Supply Voltage in Read Operation
■
Access Time: 35ns
■
Low Power Consumption:
– Active Current: 30 mA at 5 MHz
– Standby Current: 100 µA
32
32
■
Programming Voltage: 12.75V ± 0.25V
■
Programming Time: 100 µs/word
■
Electronic Signature
– Manufacturer Code: 20h
– Device Code: 05h
■
ECOPACK® packages available
April 2006
1
1
FDIP32W (F)
PLCC32 (C)
Rev 5
PDIP32 (B)
TSOP32 (N)
8 x 20 mm
1/24
www.st.com
1
Contents
M27C1001
Contents
1
Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Device description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2
Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3
Two-line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4
System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.5
Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6
Presto II programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.7
Program Inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.8
Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.9
Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.10
Erasure operation (applies to UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11
3
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4
DC and AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5.1
32-pin Ceramic Frit-seal DIP, with round window (FDIP32WA) . . . . . . . . 18
5.2
32-pin Plastic DIP, 600 mils width (PDIP32) . . . . . . . . . . . . . . . . . . . . . . . 19
5.3
32-lead Rectangular Plastic Leaded Chip Carrier (PLCC32) . . . . . . . . . . 20
5.4
32-lead Plastic Thin Small Outline, 8x20 mm (TSOP32) . . . . . . . . . . . . . 21
6
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/24
M27C1001
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Electronic Signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Read Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Programming Mode DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
AC Measurement Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Read Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Programming Mode AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
FDIP32WA package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
PDIP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
PLCC32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
TSOP32 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3/24
List of figures
M27C1001
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
4/24
Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
DIP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
FDIP32WA package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
PDIP32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
PLCC32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
TSOP32 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
M27C1001
1
Summary description
Summary description
The M27C1001 is a 1 Mbit EPROM offered in the two ranges: UV (ultra violet erase) and
OTP (one time programmable). It is ideally suited for microprocessor systems requiring
large programs and is organized as 131,072 words of 8 bits.
The FDIP32W (window ceramic frit-seal package) has a transparent lid that enables the
user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only one time and erasure is not
required, the M27C1001 is offered in PDIP32, PLCC32 and TSOP32 (8 x 20 mm) packages.
In order to meet environmental requirements, ST offers the M27C1001 in ECOPACK®
packages. ECOPACK packages are Lead-free. The category of second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK® specifications are available at: www.st.com.
See Figure 1: Logic Diagram and Table 1: Signal Descriptions for a brief overview of the
signals connected to this device.
Figure 1.
Logic Diagram
VCC
VPP
17
8
A0-A16
P
Q0-Q7
M27C1001
E
G
VSS
AI00710B
5/24
Summary description
Table 1.
M27C1001
Signal Descriptions
Signal
Description
A0-A16
Address Inputs
Q0-Q7
Data Outputs
E
Chip Enable
G
Output Enable
P
Program
VPP
Program Supply
VCC
Supply Voltage
VSS
Ground
NC
Not Connected Internally
Figure 2.
DIP Connections
VPP
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
VSS
1
32
2
31
3
30
4
29
5
28
6
27
7
26
8
25
M27C1001
9
24
10
23
11
22
12
21
13
20
14
19
15
18
16
17
AI00711
6/24
VCC
P
NC
A14
A13
A8
A9
A11
G
A10
E
Q7
Q6
Q5
Q4
Q3
M27C1001
Summary description
LCC Connections
A12
A15
A16
VPP
VCC
P
NC
Figure 3.
1 32
A7
A6
A5
A4
A3
A2
A1
A0
Q0
M27C1001
9
25
A14
A13
A8
A9
A11
G
A10
E
Q7
VSS
Q3
Q4
Q5
Q6
Q1
Q2
17
AI00712
Figure 4.
TSOP Connections
A11
A9
A8
A13
A14
NC
P
VCC
VPP
A16
A15
A12
A7
A6
A5
A4
1
8
9
16
32
M27C1001
(Normal)
25
24
17
G
A10
E
Q7
Q6
Q5
Q4
Q3
VSS
Q2
Q1
Q0
A0
A1
A2
A3
AI01151B
7/24
Device description
2
M27C1001
Device description
Table 2 lists the operating modes of the M27C1001. A single power supply is required in
Read mode. All inputs are TTL levels except for VPP and 12V on A9 for Electronic Signature.
Table 2.
Operating Modes
Mode
E
G
P
A9
VPP
Q7-Q0
Read
VIL
VIL
X
X
VCC or VSS
Data Out
Output Disable
VIL
VIH
X
X
VCC or VSS
Hi-Z
Program
VIL
VIH
VIL Pulse
X
VPP
Data In
Verify
VIL
VIL
VIH
X
VPP
Data Out
Program Inhibit
VIH
X
X
X
VPP
Hi-Z
Standby
VIH
X
X
X
VCC or VSS
Hi-Z
Electronic Signature
VIL
VIL
VIH
VID
VCC
Codes
Note:
X = VIH or VIL, VID = 12V ± 0.5V.
2.1
Read mode
The M27C1001 has two control functions, both of which must be logically active in order to
obtain data at the outputs. Chip Enable (E) is the power control and should be used for
device selection. Output Enable (G) is the output control and should be used to gate data to
the output pins, independent of device selection. Assuming that the addresses are stable,
the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is
available at the output after a delay of tGLQV from the falling edge of G, assuming that E has
been low and the addresses have been stable for at least tAVQV-tGLQV.
2.2
Standby mode
The M27C1001 has a standby mode which reduces the supply current from 30mA to 100µA.
The M27C1001 is placed in the standby mode by applying a CMOS high signal to the E
input. When in the standby mode, the outputs are in a high impedance state, independent of
the G input.
2.3
Two-line output control
Because EPROMs are usually used in larger memory arrays, this product features a 2-line
control function which accommodates the use of multiple memory connection. The two line
control function allows:
●
the lowest possible memory power dissipation,
●
complete assurance that output bus contention will not occur.
For the most efficient use of these two control lines, E should be decoded and used as the
primary device selecting function, while G should be made a common connection to all
devices in the array and connected to the READ line from the system control bus. This
8/24
M27C1001
Device description
ensures that all deselected memory devices are in their low power standby mode and that
the output pins are only active when data is required from a particular memory device.
2.4
System considerations
The power switching characteristics of Advanced CMOS EPROMs require careful
decoupling of the devices. The supply current, ICC, has three segments that are of interest to
the system designer: the standby current level, the active current level, and transient current
peaks that are produced by the falling and rising edges of E. The magnitude of the transient
current peaks is dependent on the capacitive and inductive loading of the device at the
output. The associated transient voltage peaks can be suppressed by complying with the
two line output control and by properly selected decoupling capacitors. It is recommended
that a 0.1µF ceramic capacitor be used on every device between VCC and VSS. This should
be a high frequency capacitor of low inherent inductance and should be placed as close to
the device as possible. In addition, a 4.7µF bulk electrolytic capacitor should be used
between VCC and VSS for every eight devices. The bulk capacitor should be located near the
power supply connection point. The purpose of the bulk capacitor is to overcome the voltage
drop caused by the inductive effects of PCB traces.
2.5
Programming
When delivered (and after each erasure for UV EPROM), all bits of the M27C1001 are in the
'1' state. Data is introduced by selectively programming '0's into the desired bit locations.
Although only '0's will be programmed, both '1's and '0's can be present in the data word.
The only way to change a '0' to a '1' is by die exposition to ultraviolet light (UV EPROM). The
M27C1001 is in the programming mode when VPP input is at 12.75V, E is at VIL and P is
pulsed to VIL. The data to be programmed is applied to 8 bits in parallel to the data output
pins. The levels required for the address and data inputs are TTL. VCC is specified to be
6.25V ± 0.25V.
2.6
Presto II programming algorithm
Presto II Programming Algorithm allows the whole array to be programmed, with a
guaranteed margin, in a typical time of 13 seconds. Programming with Presto II involves in
applying a sequence of 100µs program pulses to each byte until a correct verify occurs (see
Figure 5). During programming and verify operation, a Margin mode circuit is automatically
activated in order to guarantee that each cell is programmed with enough margin. No
overprogram pulse is applied since the verify in Margin mode provides necessary margin to
each programmed cell.
9/24
Device description
Figure 5.
M27C1001
Programming Flowchart
VCC = 6.25V, VPP = 12.75V
n=0
P = 100µs Pulse
NO
++n
= 25
YES
FAIL
NO
++ Addr
VERIFY
YES
Last
Addr
NO
YES
CHECK ALL BYTES
1st: VCC = 6V
2nd: VCC = 4.2V
AI00715C
2.7
Program Inhibit
Programming of multiple M27C1001s in parallel with different data is also easily
accomplished. Except for E, all like inputs including G of the parallel M27C1001 may be
common. A TTL low level pulse applied to a M27C1001's P input, with E low and VPP at
12.75V, will program that M27C1001. A high level E input inhibits the other M27C1001s from
being programmed.
2.8
Program Verify
A verify (read) should be performed on the programmed bits to determine that they were
correctly programmed. The verify is accomplished with E and G at VIL, P at VIH, VPP at
12.75V and VCC at 6.25V.
2.9
Electronic Signature
The Electronic Signature (ES) mode enables the reading out of a binary code from an
EPROM that will identify its manufacturer and type. This mode is intended for use by
programming equipment to automatically match the device to be programmed with its
corresponding programming algorithm. The ES mode is functional in the 25°C ± 5°C
ambient temperature range that is required when programming the M27C1001. To activate
the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of
the M27C1001, with VPP = VCC = 5V. Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to VIH. All other address lines must be
held at VIL during Electronic Signature mode.
10/24
M27C1001
Device description
Byte 0 (A0 = VIL) represents the manufacturer code and byte 1 (A0 = VIH) the device
identifier code. For the STMicroelectronics M27C1001, these two identifier bytes are given
in Table 3 and can be read-out on outputs Q7 to Q0.
Table 3.
2.10
Electronic Signature
Identifier
A0
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
Hex Data
Manufacturer’s Code
VIL
0
0
1
0
0
0
0
0
20h
Device Code
VIH
0
0
0
0
0
1
0
1
05h
Erasure operation (applies to UV EPROM)
The erasure characteristics of the M27C1001 is such that erasure begins when the cells are
exposed to light with wavelengths shorter than approximately 4000 Å. It should be noted
that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 Å
range. Research shows that constant exposure to room level fluorescent lighting could
erase a typical M27C1001 in about 3 years, while it would take approximately 1 week to
cause erasure when exposed to direct sunlight. If the M27C1001 is to be exposed to these
types of lighting conditions for extended periods of time, it is suggested that opaque labels
be put over the M27C1001 window to prevent unintentional erasure. The recommended
erasure procedure for the M27C1001 is exposure to short wave ultraviolet light which has a
wavelength of 2537 Å. The integrated dose (i.e. UV intensity x exposure time) for erasure
should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately
15 to 20 minutes using an ultraviolet lamp with 12000 µW/cm2 power rating. The M27C1001
should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps
have a filter on their tubes which should be removed before erasure.
11/24
Maximum ratings
3
M27C1001
Maximum ratings
Table 4.
Absolute Maximum Ratings(1)
Symbol
Value
Unit
Ambient Operating Temperature (2)
–40 to 125
°C
TBIAS
Temperature Under Bias
–50 to 125
°C
TSTG
Storage Temperature
–65 to 150
°C
VIO (3)
Input or Output Voltage (except A9)
–2 to 7
V
Supply Voltage
–2 to 7
V
–2 to 13.5
V
–2 to 14
V
TA
VCC
VA9
(3)
VPP
Parameter
A9 Voltage
Program Supply Voltage
1. Except for the rating "Operating Temperature Range", stresses above those listed in the Table "Absolute
Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods
may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality
documents.
2. Depends on range.
3. Minimum DC voltage on Input or Output is –0.5V with possible undershoot to –2.0V for a period less than
20ns.
Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than
20ns.
12/24
M27C1001
4
DC and AC characteristics
DC and AC characteristics
TA = 0 to 70°C, –40 to 85°C or –40 to 125°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC
Table 5.
Symbol
Read Mode DC Characteristics (1)
Parameter
Test Condition
Min.
Max.
Unit
ILI
Input Leakage Current
0V ≤ VIN ≤ VCC
±10
µA
ILO
Output Leakage Current
0V ≤ VOUT ≤ VCC
±10
µA
ICC
Supply Current
E = VIL, G = VIL,
IOUT = 0mA, f = 5MHz
30
mA
ICC1
Supply Current (Standby) TTL
E = VIH
1
mA
ICC2
Supply Current (Standby) CMOS E > VCC – 0.2V
100
µA
IPP
Program Current
10
µA
VIL
Input Low Voltage
–0.3
0.8
V
Input High Voltage
2
VCC + 1
V
0.4
V
VIH
(2)
VOL
VOH
VPP = VCC
Output Low Voltage
IOL = 2.1mA
Output High Voltage TTL
IOH = –400µA
2.4
V
Output High Voltage CMOS
IOH = –100µA
VCC – 0.7V
V
1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Maximum DC voltage on Output is VCC +0.5V.
TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V
Table 6.
Symbol
Programming Mode DC Characteristics (1)
Parameter
Test Condition
Min.
VIL ≤ VIN ≤ VIH
Max.
Unit
±10
µA
50
mA
50
mA
ILI
Input Leakage Current
ICC
Supply Current
IPP
Program Current
VIL
Input Low Voltage
–0.3
0.8
V
VIH
Input High Voltage
2
VCC + 0.5
V
VOL
Output Low Voltage
IOL = 2.1mA
0.4
V
VOH
Output High Voltage TTL
IOH = –400µA
VID
A9 Voltage
E = VIL
2.4
11.5
V
12.5
V
1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
13/24
DC and AC characteristics
M27C1001
TA = 25 °C, f = 1 MHz
Table 7.
Capacitance (1)
Symbol
CIN
COUT
Parameter
Test Condition
Max
Unit
VIN = 0V
6
pF
VOUT = 0V
12
pF
Input Capacitance
Output Capacitance
Min
1. Sampled only, not 100% tested.
Table 8.
AC Measurement Conditions
Parameter
High Speed
Standard
Input Rise and Fall Times
≤ 10ns
≤ 20ns
Input Pulse Voltages
0 to 3V
0.4V to 2.4V
1.5V
0.8V and 2V
Input and Output Timing Ref. Voltages
Figure 6.
AC Testing Input Output Waveform
High Speed
3V
1.5V
0V
Standard
2.4V
2.0V
0.8V
0.4V
AI01822
Figure 7.
AC Testing Load Circuit
1.3V
1N914
3.3kΩ
DEVICE
UNDER
TEST
OUT
CL
CL = 30pF for High Speed
CL = 100pF for Standard
CL includes JIG capacitance
14/24
AI01823B
M27C1001
DC and AC characteristics
TA = 0 to 70°C, –40 to 85°C or –40 to 125°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC
Read Mode AC Characteristics (1)
Table 9.
M27C1001
Symbol
Alt
Parameter
Test
Condition
-35 (2)
-45
-60
-70
Unit
Min. Max. Min. Max. Min. Max. Min. Max.
tAVQV
tACC
Address Valid to
Output Valid
E = VIL,
G = VIL
35
45
60
70
ns
tELQV
tCE
Chip Enable Low
to Output Valid
G = VIL
35
45
60
70
ns
tGLQV
Output Enable
tOE Low to Output
Valid
E = VIL
25
25
30
35
ns
Chip Enable High
G = VIL
to Output Hi-Z
0
25
0
25
0
30
0
30
ns
(3)
Output Enable
tDF High to Output Hi- E = VIL
Z
0
25
0
25
0
30
0
30
ns
tAXQX
Address Transition
E = VIL,
tOH to Output
G = VIL
Transition
0
tEHQZ (3) tDF
tGHQZ
0
0
0
ns
1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Speed obtained with High Speed AC measurement conditions.
3. Sampled only, not 100% tested.
15/24
DC and AC characteristics
M27C1001
TA = 0 to 70°C, –40 to 85°C or –40 to 125°C; VCC = 5V ± 5% or 5V ± 10%; VPP = VCC
Table 10.
Read Mode AC Characteristics (1)
M27C1001
Symbol
Alt
Test
Condition
Parameter
-80
-90
-10
-12/-15/
-20/-25
Unit
Min Max Min Max Min Max Min Max
tAVQV
tACC
Address Valid to
Output Valid
tELQV
tCE
tGLQV
tEHQZ (2)
E = VIL, G =
VIL
80
90
100
120
ns
Chip Enable Low
G = VIL
to Output Valid
80
90
100
120
ns
tOE
Output Enable
Low to Output
Valid
40
45
50
60
ns
tDF
Chip Enable High
G = VIL
to Output Hi-Z
0
30
0
30
0
30
0
40
ns
(2)
tDF
Output Enable
High to Output
Hi-Z
0
30
0
30
0
30
0
40
ns
tAXQX
tOH
Address
E = VIL, G =
Transition to
V
Output Transition IL
tGHQZ
E = VIL
E = VIL
0
0
0
0
ns
1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Sampled only, not 100% tested.
Figure 8.
A0-A16
Read Mode AC Waveforms
VALID
tAVQV
VALID
tAXQX
E
tGLQV
tEHQZ
G
tELQV
Q0-Q7
tGHQZ
Hi-Z
AI00713B
16/24
M27C1001
DC and AC characteristics
TA = 25 °C; VCC = 6.25V ± 0.25V; VPP = 12.75V ± 0.25V
Table 11.
Programming Mode AC Characteristics (1)
Symbol
Alt
Parameter
Test Condition
Min.
Max.
tAVPL
tAS
Address Valid to Program Low
2
µs
tQVPL
tDS
Input Valid to Program Low
2
µs
tVPHPL
tVPS
VPP High to Program Low
2
µs
tVCHPL
tVCS
VCC High to Program Low
2
µs
tELPL
tCES
Chip Enable Low to Program Low
2
µs
tPLPH
tPW
Program Pulse Width
95
tPHQX
tDH
Program High to Input Transition
2
µs
tQXGL
tOES
Input Transition to Output Enable Low
2
µs
tGLQV
tOE
Output Enable Low to Output Valid
tGHQZ (2)
tDFP
Output Enable High to Output Hi-Z
0
tGHAX
tAH
Output Enable High to Address
Transition
0
105
Unit
µs
100
ns
130
ns
ns
1. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
2. Sampled only, not 100% tested.
Figure 9.
Programming and Verify Modes AC Waveforms
VALID
A0-A16
tAVPL
Q0-Q7
DATA IN
tQVPL
DATA OUT
tPHQX
VPP
tVPHPL
tGLQV
tGHQZ
VCC
tVCHPL
tGHAX
E
tELPL
P
tPLPH
tQXGL
G
PROGRAM
VERIFY
AI00714
17/24
Package mechanical data
M27C1001
5
Package mechanical data
5.1
32-pin Ceramic Frit-seal DIP, with round window (FDIP32WA)
Figure 10. FDIP32WA package outline
A2
A3
A1
B1
B
A
L
α
e
eA
D2
C
eB
D
S
N
∅
E1
E
1
FDIPW-a
Table 12.
FDIP32WA package mechanical data
millimeters
inches
Symbol
Min
Typ
A
Min
Typ
5.72
Max
0.225
A1
0.51
1.40
0.020
0.055
A2
3.91
4.57
0.154
0.180
A3
3.89
4.50
0.153
0.177
B
0.41
0.56
0.016
0.022
B1
1.45
0.057
C
0.23
0.30
0.009
0.012
D
41.73
42.04
1.643
1.655
D2
38.10
1.500
e
2.54
0.100
E
15.24
0.600
E1
13.06
eA
13.36
0.514
14.99
0.526
0.590
eB
16.18
18.03
0.637
0.710
L
3.18
4.10
0.125
0.161
N
S
32
1.52
Ø
α
18/24
Max
32
2.49
0.060
7.11
4°
0.098
0.280
11°
4°
11°
M27C1001
5.2
Package mechanical data
32-pin Plastic DIP, 600 mils width (PDIP32)
Figure 11. PDIP32 package outline
A2
A1
b1
b
A
L
α
e
eA
c
D2
D
S
N
E1
E
1
PDIP-C
Table 13.
PDIP32 package mechanical data
millimeters
inches
Symbol
Min
Typ
A
A1
Max
Min
Typ
4.83
0.38
A2
Max
0.190
0.015
3.81
0.150
b
0.41
0.53
0.016
0.021
b1
1.14
1.65
0.045
0.065
c
0.23
0.38
0.009
0.015
D
41.78
42.29
1.645
1.665
D2
38.10
1.500
eA
15.24
0.600
e
2.54
0.100
E
15.24
15.88
0.600
0.625
E1
13.46
13.97
0.530
0.550
S
1.65
2.21
0.065
0.087
L
3.05
3.56
0.120
0.140
α
0°
15°
0°
15°
N
32
32
19/24
Package mechanical data
5.3
M27C1001
32-lead Rectangular Plastic Leaded Chip Carrier (PLCC32)
Figure 12. PLCC32 package outline
D
D1
A1
A2
1 N
B1
E2
e
E1 E
E3
F
B
0.51 (.020)
E2
1.14 (.045)
A
D3
R
D2
CP
D2
PLCC-A
Table 14.
PLCC32 package mechanical data
millimeters
inches
Symbol
Min
Typ
Min
Typ
Max
A
3.18
3.56
0.125
0.140
A1
1.53
2.41
0.060
0.095
A2
0.38
B
0.33
0.53
0.013
0.021
B1
0.66
0.81
0.026
0.032
0.015
CP
0.10
0.004
D
12.32
12.57
0.485
0.495
D1
11.35
11.51
0.447
0.453
D2
4.78
5.66
0.188
0.223
D3
7.62
0.300
E
14.86
15.11
0.585
0.595
E1
13.89
14.05
0.547
0.553
E2
6.05
6.93
0.238
0.273
E3
10.16
0.400
e
1.27
0.050
F
20/24
Max
0.00
0.13
0.000
0.005
R
0.89
0.035
N
32
32
M27C1001
5.4
Package mechanical data
32-lead Plastic Thin Small Outline, 8x20 mm (TSOP32)
Figure 13. TSOP32 package outline
A2
N
1
e
E
B
N/2
A
D1
CP
D
DIE
C
A1
TSOP-a
Table 15.
α
L
TSOP32 package mechanical data
millimeters
inches
Symbol
Min
Typ
A
Max
Min
Typ
1.200
Max
0.0472
A1
0.050
0.150
0.0020
0.0059
A2
0.950
1.050
0.0374
0.0413
B
0.170
0.250
0.0067
0.0098
C
0.100
0.210
0.0039
0.0083
CP
0.100
0.0039
D
19.800
20.200
0.7795
0.7953
D1
18.300
18.500
0.7205
0.7283
e
0.500
0.0197
E
7.900
8.100
0.3110
0.3189
L
0.500
0.700
0.0197
0.0276
N
α
32
0°
32
5°
0°
5°
21/24
Part numbering
6
M27C1001
Part numbering
Table 16.
Ordering information scheme
Example:
M27C1001
-35 X
C
1 TR
Device Type
M27
Supply Voltage
C = 5V
Device Function
1001 = 1 Mbit (128Kb x 8)
Speed
-35 (1) = 35 ns
-10 = 100 ns
-45 = 45 ns
-12 = 120 ns
-60 = 60 ns
-15 = 150 ns
-70 = 70 ns
-20 = 200 ns
-80 = 80 ns
-25 = 250 ns
-90 = 90 ns
VCC Tolerance
blank = ± 10%
X = ± 5%
Package
F = FDIP32W
C = PLCC32
B = PDIP32
N = TSOP32: 8 x 20 mm
Temperature Range
1 = 0 to 70 °C
3 = –40 to 125 °C
6 = –40 to 85 °C
Options
TR = ECOPACK® package, Tape & Reel Packing
1. High Speed, see AC Characteristics section for further information.
For a list of available options (Speed, Package, etc...) or for further information on any
aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.
22/24
M27C1001
7
Revision history
Revision history
Table 17.
Document revision history
Date
Revision
Changes
September 1998
1
First Issue
24-Jan-2000
2
35ns speed class addes (Table 8A, Table 16)
20-Sep-2000
3
AN620 Reference removed
04-Jun-2002
4
PLCC32 Package mechanical data and drawing clarified
(Table 14 and Figure 12)
TSOP32 Package mechanical data clarified (Table 15)
12-Apr-2006
5
Removed LCC32W package and Additional Burn-in option.
Converted to new template. Added ECOPACK® information.
23/24
M27C1001
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