Secondary LDO Regulator Series for Local Power Supplies 500mA Secondary LDO Regulators for Local Power Supplies BD□□KA5,BD□□KA5W Series,BD00KA5W Series No.09024EAT01 ●General Description The BD□□KA5 series are low-saturation regulators that are available for output currents up to 500mA. The output voltage precision is ±1%. These secondary LDO regulators are offered in several output voltages and package lineups with or without ON/OFF switches (that set the circuit current to 0μA at shutdown). This series can be used for a broad spectrum of applications ranging from TVs and car audio systems to HDDs, PCs, and DVDs. There regulators have a built-in overcurrent protection circuit that prevents the destruction of the IC, due to output short circuits and a thermal shutdown circuit. ●Features 1) Maximum output current : 500ｍA 2) Output voltage precision : ±1% 3) Low-saturation voltage with PMOS output : 0.12V Typ.(Io=200mA) 4) Built-in over-current protection circuit 5) Built-in thermal shutdown circuit 6) Shutdown switch(BD□□KA5WFP and BD□□KA5WF series) 7) TO252-3,TO252-5 and SOP8 package lineup 8) Operating temperature range : -40℃ to +105℃ 9) Ceramic capacitor compatible(recommended capacitance : 1μF or greater) ●Applications Microcontrollers and all electronic devices that use logic circuits ●Product line up Part Number BD□□KA5WFP BD□□KA5WF BD□□KA5FP 1.0 ○ ○ ○ Part Number：BD□□KA5□ □ a b c Symbol a □□ 10 12 15 18 Switch b c 1.2 ○ ○ ○ 1.5 ○ ○ ○ 1.8 ○ ○ ○ 2.5 ○ ○ ○ 3.0 ○ ○ ○ Details Output Voltage Designation Output Voltage(V) □□ 1.0V(Typ.) 25 1.2V(Typ.) 30 1.5V(Typ.) 33 1.8V(Typ.) 00 3.3 ○ ○ ○ Variable ○ ○ - Package TO252-5 SOP8 TO252-3 Output Voltage(V) 2.5V(Typ.) 3.0V(Typ.) 3.3V(Typ.) Variable Output Typ “W” included：Built-in shutdown switch “W” not included：No shutdown switch Package FP：TO252-5 / TO252-3 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. F：SOP8 1/9 2009.04 - Rev.A Technical Note BD□□KA5,BD□□KA5W Series,BD00KA5W Series ●Absolute Maximum Ratings(Ta=25℃) Parameter Power Supply Voltage Output Control Terminal Voltage TO252-3 Power Dissipation TO252-5 SOP8 Operating Temperature Range Ambient Storage Temperature Maximum Junction Temperature *1 *2 *3 *4 Symbol Limits Unit. Vcc VCTL -0.3～+7.0*1 -0.3～Vcc*1 1200*2 1300*3 687.6*4 -40～+105 -55～+150 150 V V Pd Topr Tstg Tjmax ℃ ℃ ℃ Must not exceed Pd When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 9.6 mW/℃ over 25℃. When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 10.4mW/℃ over 25℃. When a 70mm×70mm×1.6mm glass epoxy board is used. Reduce by 5.5 mW/℃ over 25℃. ●Recommended Operating Range (Ta=25℃) Parameter Symbol Input Power Supply Voltage Vcc Output Current Io *5 Output Voltage Configuration Range Vo Output Control Terminal Voltage VCTL *5 mW Min. 2.3 0 1.0 0 Max. 5.5 500 4.0 Vcc Unit. V mA V V Only BD00KA5WFP and BD00KA5WF ●Electrical Characteristics (abridged) BD□□KA5WFP / WF / FP (Unless specified otherwise,Ta=25℃,VCTL=2V,Vcc=2.5V(Vo=1.0V,1.2V,1.5V,1.8V),Vcc=3.3V(Vo=2.5V),Vcc=5.0V(Vo=3.0V,3.3V)) Parameter Symbol Min. Typ. Max. Unit. Conditions Output Voltage Vo Vo(T)-0.015 Vo(T)×0.99 Vo(T) Vo(T) Vo(T)+0.015 Vo(T)×1.01 V V Circuit Current at Shutdown Isd - 0 1 μA ΔVd - 0.12 0.20 V Io Reg.I Reg.L 500 - 10 25 35 75 mA mV mV Tcvo - ±100 - ppm/℃ Io=5mA,Tj=0～125℃ Unit. Minimum I/O Voltage Difference*6 Output Current Capacity Input Stability*7 Load Stability Output Voltage *8 Temperature Coefficient Io＝200mA (Vo=1.0V,1.2V) Io＝200mA (Vo≧1.5V) VCTL =0V,Io=0mA (during OFF mode) Io=200mA,Vcc=0.95×Vo Vcc=Vo+0.5V→5.5V,Io=200mA Io=0mA→500mA Vo(T)：Preset output voltage value *6 When Vo≧2.5V *7 When 1.0≦Vo≦1.8V, Vcc=2.3V→5.5V *8 Design guarantee(100% shipping inspection not performed) BD00KA5WFP / WF *9 (Unless specified otherwise, Ta=25℃, Vcc=2.5V,VL＝2V,R1=30kΩ,R2=30kΩ ) Parameter Symbol Min. Typ. Max. Circuit Current at Shutdown Isd - 0 1 μA Reference Voltage Minimum I/O Voltage Difference*10 Output Current Capacity Input Stability Load Stability Output Voltage Temperature Coefficient*11 VADJ 0.742 0.750 0.758 V Conditions VCTL =0V, Io=0mA (during OFF mode) Io=50mA ΔVd - 0.12 0.20 V Io=200mA,Vcc=0.95×Vo Io Reg.I Reg.L 500 - 10 25 35 75 mA mV mV Tcvo - ±100 - ppm/℃ *9 *10 *11 Vcc=Vo+0.5V→5.5V,Io=200mA Io=0mA→500mA Io=5mA,Tj=0～125℃ VOUT=VADJ×(R1+R2)÷R1(V) VADJ×0.75V(Typ.) When Vo≧2.5V Design guarantee(100% shipping inspection not performed) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2/9 2009.04 - Rev.A Technical Note BD□□KA5,BD□□KA5W Series,BD00KA5W Series ●Reference Data (Unless specified otherwise, Vcc=25V,VCTL =2V,and Io=0mA) 2.0 0.5 [BD15KA5WFP] [BD15KA5WFP] 1.8 0.3 0.2 0.1 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0.5 1.0 1.5 SUPPLY VOLTAGE:VCC[V] Fig.1 Circuit current 300 3.0 3.5 4.0 4.5 5.0 1.4 1.2 1.0 0.8 0.6 0.4 1.0 0.8 0.6 0.4 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 SUPPLY VOLTAGE:VCC[V] SUPPLY VOLTAGE:VCC[V] Fig.2 Input Stability （Io=0mA） Fig.3 Input Stability （Io=500mA） 60 5.0 5.5 [BD15KA5WFP] 55 50 RIPPLE REJECTION:R.R[dB] 1.6 1.2 5.5 250 200 150 100 45 40 35 30 25 20 15 10 50 5 0.0 0 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 0 50 100 150 200 250 300 350 400 10 15 20 25 100 30 35 40 451000 50 55 60 6510000 70 75 80 100000 85 90 450 500 OUTPUT CURRENT:IOUT[mA] OUTPUT CURRENT:IOUT[A] Fig.4 Load Stability FREQUENCY:f[Hz] Fig.5 Input/Output Voltage Difference （Vcc=3.135V） 0.9 [BD15KA5WFP] CIRCUIT CURRENT:Icc[mA] 1.6 1.5 1.5 1.5 1.5 1.5 1.4 [BD15KA5WFP] [BD15KA5WFP] 0.8 CIRCUIT CURRENT:Icc[mA] 1.6 Fig.6 Ripple Rejection （ein=10dBV,Io=100mA） 10 1.0 1.6 OUTPUT VOLTAGE:VOUT[V] 2.5 [BD33KA5WFP] 0.2 0.7 0.6 0.5 0.4 0.3 0.2 8 6 4 2 0.1 1.4 0.0 1.4 -40 -20 0 20 40 60 80 0 -40 100 -20 TEMPERATURE:Ta[℃] 20 40 60 80 100 CONTROL CURRENT:ICTL[μA] [BD15KA5WFP] 160 140 120 100 80 60 40 0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 CONTROL VOLTAGE:VCTL[V] Fig.10 CTL Voltage vs. Output Voltage www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 CONTROL VOLTAGE:VCTL[V] Fig.11 CTL Voltage vs. Output Current 3/9 0.3 0.4 0.5 Fig.9 Circuit Current by load Level 200 180 0.2 OUTPUT CURRENT:IOUT[A] 20 0.5 0.1 Fig.8 Circuit Current Temperature Characteristics [BD15KA5WFP] 0.0 0.0 OUTPUT VOLTAGE:VOUT[V] 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 TEMPERATURE:Ta[℃] Fig.7 Output Voltage （Io=5mA） OUTPUT VOLTAGE:VOUT[V]] 2.0 [BD15KA5WFP] DROPOUT VOLTAGE:ΔVd[mV] OUTPUT VOLTAGE:VOUT[V] 1.8 1.4 0.0 0.0 2.0 1.6 0.2 0.0 0.0 [BD15KA5WFP] 1.8 1.6 OUTPUT VOLTAGE:VOUT[V]] OUTPUT VOLTAGE:VOUT[V]] 0.4 CIRCUIT CURRENT:ICC[mA] 2.0 2.0 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 [BD15KA5WFP] 100 120 140 160 180 200 TEMPERATURE:[℃] Fig.12 Thermal Shutdown Circuit Characteristics (Io=5mA) 2009.04 - Rev.A Technical Note BD□□KA5,BD□□KA5W Series,BD00KA5W Series ●Block diagrams, Standard circuit examples [BD00KA5WFP] [BD00KA5WF] ＊Output voltage configuration GND(FIN) Vref 1μF VOUT=VADJ×（R1+R2）÷R1(V) ：VADJ=0.75V(Typ.) ：A value of approximately 30kΩ is recommended for R1. Driver GND(7PIN) Vcc(8PIN) Vref OCP TSD Vcc (2PIN) CTL (1PIN) TOP VIEW OUT (4PIN) N.C.(3PIN) 1μF R2 1μF R1 ADJ(2PIN) R2 1μF Pin No. PinName Function 1 CTL Output voltage ON/OFF control 2 Vcc Power supply voltage input 3 N.C. Unconnected terminal 4 OUT Voltage output 5 ADJ Output voltage configuration terminal FIN GND GND R1 OCP N.C.(3PIN) N.C.(4IN) 12 TOP VIEW 8 3 4 5 TO252-5 Pin No. Pin Name Function 1 OUT Voltage output 2 3 5 6 7 8 Driver R2 5 SOP8(BD00KA5WF) GND(FIN) Vref VOUT=VADJ×（R1+R2）÷R1(V) ：VADJ=0.75V(Typ.) ：A value of approximately 30kΩ is recommended for R1. Fig.16 4 [BD□□KA5WFP] ＊Output voltage configuration Driver TSD Fig.13 TO252-5(BD00KA5WFP) CTL (5PIN) OUT(1PIN) FIN ADJ(5PIN) GND(6PIN) ADJ Output voltage configuration terminal N.C. Unconnected terminal CTL Output voltage ON/OFF control GND GND Vcc Power supply voltage input 1 4 SOP8 [BD□□KA5WF] R1 1μF TSD Vcc (2PIN) CTL (1PIN) OCP OUT (4PIN) 1μF TOP VIEW N.C.(5PIN) N.C.(3PIN) Vcc(8PIN) GND(7PIN) GND(6PIN) CTL (5PIN) FIN 1μF Vref Fig.14 Driver TO252-5(BD□□KA5WFP) Pin No. Pin Name Function 1 CTL Output voltage ON/OFF control 2 Vcc Power supply voltage input 3 N.C. Unconnected terminal 4 OUT Voltage output 5 N.C. Unconnected terminal FIN GND GND TSD 4 5 N.C.(3PIN) TO252-5 R2 R1 OUT(1PIN) 3 12 OCP N.C.(3PIN) N.C.(4IN) 1μF TOP VIEW Fig.17 8 5 SOP8(BD□□KA5WF) Pin Name Function 1 OUT Voltage output N.C. Unconnected terminal 1 2 Vref Driver 3 R2 TSD 5 6 OCP 7 8 N.C.(2PIN) (1PIN) 1μF OUT (3PIN) 4 SOP8 4 R1 Vcc Pin No. CTL Output voltage ON/OFF control GND GND Vcc Power supply voltage input TOP VIEW 1μF FIN N.C. pins are electrically open to the inside of the IC chip. Fig.15 TO252-5(BD□□KA5FP) Pin No. Pin Name Function 1 Vcc Power supply voltage input 2 N.C. Unconnected terminal 3 OUT Voltage output FIN GND GND www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 2 1 3 TO252-3 4/9 2009.04 - Rev.A Technical Note BD□□KA5,BD□□KA5W Series,BD00KA5W Series ●Input / Output Equivalent Circuit Diagrams Vcc Vcc Vcc Vcc ※ 31.25kΩ 2kΩ outside the IC between ADJ and GND and OUT CTL With BD00KA5WFP/WF,R1and R2 are connected between OUT and ADJ. 25kΩ R2 ADJ (BD00KA5WFP/WF) R1 Fig.18 Fig.19 ●Thermal Design Power Dissipation：Pd(W) 許容損失：Pd(W) Power ：Pd(W) PowerDissipation Dissipation：Pd(W) 1.30 Rohm standard board mounting Board size：70×70×1.6ｍｍ 2 Copper foil area：7×7ｍｍ θja=104.2(℃/W) 1.6 1.2 0.8 0.4 800 1.20 1.2 0.8 0.4 0.0 0.0 0 25 50 75 100 125 150 687.6mW (1)When using a standard board: θj-c=181.8(℃/W) (2) When using an IC alone θj-a=222.2(℃/W) 600 (1) 562.6mW 400 (2) 200 0 0 25 50 75 100 125 150 周囲温度：Ta(℃) Ambient temperature：Ta(℃) Ambient temperature：Ta(℃) Fig.20 Power Dissipation heat reducing characteristics SOP8 1000 許容損失：Pd(W) Rohm standard board mounting Board size：70×70×1.6ｍｍ 2 Copper foil area：7×7ｍｍ θja=96.2(℃/W) 1.6 TO252-3 2.0 Power Dissipation：Pd(W) TO252-5 2.0 Fig.21 Power Dissipation heat reducing characteristics 0 25 50 75 100 125 150 Ambient temperature：Ta(℃) 周囲温度：Ta(℃) Fig.22 Power Dissipation heat reducing characteristics When using at temperatures over Ta=25℃, please refer to the power dissipation shown in Fig.20 through 22. The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the maximum junction temperature TjMAX, the device may malfunction or be destroyed. The heat of the IC requires sufficient consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal damage, it is necessary to operate it at temperatures less than the maximum junction temperature TjMAX. Even when the ambient temperature Ta is a normal temperature(25℃), the chip(junction) temperature Tj may be quite high, so please operate the IC at temperatures less than the acceptable loss Pd. The calculation method for power consumption Pc(W) is as follows : Pc = (Vcc-Vo)×Io+Vcc×Icca Acceptable loss Pd≧Pc Solving for the load current IO in order to operate within the acceptable loss, Io≦ Vcc：Input voltage Vo：Output voltage Io：Load current Icca：Circuit current Pd – Vcc×Icca Vcc－Vo It is then possible to find the maximum load current IoMAX with respect to the applied voltage Vcc at the time of thermal design. Calculation Example Example 1) When Ta=85℃, Vcc=2.5V, Vo=1.0V 0.676－2.5×Icca Io≦ 2.5-1.0 Io≦440mA (Icca : 2mA) BA10KA5WFP（TO252-5 packaging） θja=96.2℃/W → -10.4mW/℃ 25℃=1300mW → 85℃=676mW Please refer to the above information and keep thermal designs within the scope of acceptable loss for all operating temperature ranges. The power consumption PC of the IC when there is a short circuit (short between Vo and GND) is : Pc=Vcc×(Icca+Ishort) *Ishort : Short circuit current www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 5/9 2009.04 - Rev.A Technical Note BD□□KA5,BD□□KA5W Series,BD00KA5W Series ●Terminal Vicinity Settings and Cautions ・Vcc Terminal Please attach a capacitor (greater than 1μF) between Vcc and GND. The capacitance values differ depending on the application, so chose a capacitor with sufficient margin and verify the operation on actual board. ・GND Terminal Please be sure to keep the set ground and IC ground at the same potential level so that a potential difference does not arise between them. If a potential difference arises between the set ground and the IC ground, the preset voltage will not be output properly, causing the system to become unstable. Please reduce the impedance by making the ground patterns as wide as possible and reducing the distance between the set ground and the IC ground as much as possible. ・CTL Terminal 31.25kΩ The CTL terminal is turned ON at 2.0V and higher, and OFF at 0.8V and lower, within the operating power supply voltage CTL range.The power supply and the CTL terminal may be started up and shut down in any order without problems. 25kΩ Fig.23 Input equivalent circuit ESR (Ω) ●Vo Terminal Please be sure to attach an anti-oscillation capacitor between Vo and GND. 100 Oscillation region 発振領域 OUT 10 Stable region 安定領域 IC 1μF ESR Cin 1 Vcc Vcc 1μF VCTL 2V 0.1 OUT 1μF CTL GND ADJ R2 Io(ROUT) R1 R1=30kΩ,R2=2kΩ 0.01 0 100 200 300 400 Iout(mA) Fig.24 Output Equivalent Circuit 500 Io(mA) Fig.25 ESR-Io Characteristics Be sure to place an anti-oscillation capacitor between the output terminal and the GND. Oscillations may arise if the capacitance value changes, due to factors such as temperature changes. A 1μF capacitor with small internal series resistance (ESR) such as a ceramic capacitor is recommended as an anti-oscillation capacitor. Ceramic capacitors generally have favorable temperature characteristics and DC bypass characteristics. When selecting a ceramic capacitor, a high voltage capacitor (good DC bypass characteristics) with temperature characteristics that are superior to those of X5R or X7R, is recommended. In applications where input voltage and load fluctuations are rapid, please decide on a capacitor after sufficiently confirming its properties according to its specifications in the actual application. 静電容量変化率(%) 50V Max.Input 80 60 16V Max.Input 40 10V Max.Input 20 0 50V Max.Input 100 静電容量変化率(%) 100 120 Rate of change in electrostatic capacitance (%) 120 Rate of change in electrostatic capacitance (%) 静電容量変化率(%) Rate of change in electrostatic capacitance (%) 120 80 16V Max.Input 60 10V Max.Input 40 20 0 0 1 2 3 4 DC bypass Vdc(V) 直流バイアスVdc（V) (a) Capacitance-bypass characteristics (Y5V) 100 80 X7R X5R Y5V 60 40 Vdc=0 20 0 0 1 2 3 4 -25 DC bypass Vdc(V) 直流バイアスVdc（V) （b）Capacitance-bypass characteristics（X5R,X7R） 0 25 50 75 Temp(℃) Temp(℃) （C）Capacitance-temperature characteristics（X5R,X7R,Y5V） Fig.26 :General characteristics of ceramic capacitors www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 6/9 2009.04 - Rev.A Technical Note BD□□KA5,BD□□KA5W Series,BD00KA5W Series ●Other Caution ○Protection Circuits Over-current Protection Circuit A built-in over-current protection circuit corresponding to the current capacity prevents the destruction of the IC when there are load shorts. This protection circuit is a “7”-shaped current control circuit that is designed such that the current is restricted and does not latch even when a large current momentarily flows through the system with a high-capacitance capacitor. However, while this protection circuit is effective for the prevention of destruction due to unexpected accidents, it is not suitable for continuous operation or transient use. Please be aware when creating thermal designs that the over-current protection circuit has negative current capacity characteristics with regard to temperature. ○Thermal Shutdown Circuit (Thermal Protection) This system has a built-in temperature protection circuit for the purpose of protecting the IC from thermal damage. As shown in Fig. 20-22, this must be used within the range of acceptable loss, but if the acceptable loss is continuously exceeded, the chip temperature Tj increases, causing the thermal shutdown circuit to operate. When the thermal shutdown circuit operates, the operation of the circuit is suspended. The circuit resumes operation immediately after the chip temperature Tj decreases, so the output repeats the ON and OFF states (Please refer to Figs.12 for the temperatures at which the temperature protection circuit operates). There are cases in which the IC is destroyed due to thermal runaway when it is left in the overloaded state. Be sure to avoid leaving the IC in the overloaded state. ○Reverse Current In order to prevent the destruction of the IC when a reverse current flows through the IC, it is recommended that a diode be placed between the Vcc and Vo and a pathway be created so that the current can escape (Refer to Fig.27). Reverse current OUT Vcc CTL GND Fig.27 : Bypass diode ○This IC is BI-CMOS IC that has a P-board (substrate) and P+ isolation between each element, as shown in Fig.28. A P-N junction is formed between this P-layer and the N-layer of each element, and the P-N junction operates as : - a parasitic diode when the electric potential relationship is GND> Terminal A, GND> Terminal B, or - a parasitic transistor when the electric potential relationship is Terminal B > GND> Terminal A. Parasitic elements are structurally inevitable in the IC. The operation of parasitic elements induces mutual interference between circuits, causing malfunctions and eventually the destruction of the IC. Take precaution as not to use the IC in ways that would cause parasitic elements to operate. For example, applying a voltage that is lower than the GND (P-board) to the input terminal. Transistor (NPN) B E Resistor (Pin A) (Pin B) O (Pin B) B GND E N P+ N P+ P N P+ N N P P P+ P N GND Parasitic element or transistor N Parasitic element GND Parasitic element or transistor C GND (Pin A) Parasitic element GND Fig. 28 : Basic structure example www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 7/9 2009.04 - Rev.A Technical Note BD□□KA5,BD□□KA5W Series,BD00KA5W Series ●Ordering part number B D 1 Part number 8 K A 5 Current capacity 500mA Output voltage 00:Variable Other:Fixed W F P Shutdown switch パッケージ W : Include FP F ：TO252-3 TO252-5 ： SOP8 - E 2 Packaging and forming specification E2: Embossed tape and reel TO252-3 <Tape and Reel information> 6.5±0.2 C0.5 1.5±0.2 +0.2 5.1 -0.1 Tape Embossed carrier tape Quantity 2000pcs 2.3±0.2 0.5±0.1 E2 Direction of feed The direction is the 1pin of product is at the lower left when you hold ( reel on the left hand and you pull out the tape on the right hand 1.5 2 3 0.8 1 0.65 ) 2.5 9.5±0.5 5.5±0.2 FIN 0.65 0.5±0.1 0.75 2.3±0.2 1.0±0.2 2.3±0.2 1pin Reel (Unit : mm) Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. TO252-5 <Tape and Reel information> 2.3±0.2 6.5±0.2 C0.5 1.5±0.2 +0.2 5.1 -0.1 0.5±0.1 Tape Embossed carrier tape Quantity 2000pcs Direction of feed The direction is the 1pin of product is at the lower left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 1.5 4 5 0.8 1 2 3 2.5 9.5±0.5 5.5±0.2 FIN E2 0.5±0.1 0.5 1.27 1.0±0.2 1pin Reel (Unit : mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 8/9 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2009.04 - Rev.A Technical Note BD□□KA5,BD□□KA5W Series,BD00KA5W Series SOP8 <Tape and Reel information> 6 5 +6° 4° −4° 0.3MIN 7 4.4±0.2 6.2±0.3 8 1 2 3 0.9±0.15 5.0±0.2 (MAX 5.35 include BURR) Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand ) 4 0.595 1.5±0.1 +0.1 0.17 -0.05 0.11 S 1.27 0.42±0.1 1pin Reel (Unit : mm) www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 9/9 Direction of feed ∗ Order quantity needs to be multiple of the minimum quantity. 2009.04 - Rev.A Notice Notes No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. R0039A