TI CD4001BPW Cmos nor gate Datasheet

Data sheet acquired from Harris Semiconductor
SCHS015C – Revised August 2003
The CD4001B, CD4002B, and CD4025B
types are supplied in 14-lead hermetic
dual-in-line ceramic packages (F3A
suffix), 14-lead dual-in-line plastic
packages (E suffix), 14-lead small-outline
packages (M, MT, M96, and NSR suffixes),
and 14-lead thin shrink small-outline
packages (PW and PWR suffixes).
Copyright  2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
7704403CA
ACTIVE
CDIP
J
14
89263AKB3T
OBSOLETE
CFP
WR
16
1
CD4001BE
ACTIVE
PDIP
N
14
CD4001BF
ACTIVE
CDIP
J
14
CD4001BF3A
ACTIVE
CDIP
J
14
1
CD4001BM
ACTIVE
SOIC
D
14
50
CD4001BM96
ACTIVE
SOIC
D
14
2500
CD4001BMT
ACTIVE
SOIC
D
14
CD4001BNSR
ACTIVE
SO
NS
CD4001BPW
ACTIVE
TSSOP
CD4001BPWR
ACTIVE
CD4002BE
Lead/Ball Finish
MSL Peak Temp (3)
None
Call TI
Level-NC-NC-NC
None
Call TI
Call TI
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
1
None
Call TI
Level-NC-NC-NC
None
Call TI
Level-NC-NC-NC
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
250
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
PW
14
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
TSSOP
PW
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD4002BF
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
CD4002BF3A
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
CD4002BM
ACTIVE
SOIC
D
14
50
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4002BM96
ACTIVE
SOIC
D
14
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4002BMT
ACTIVE
SOIC
D
14
250
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4002BNSR
ACTIVE
SO
NS
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4002BPW
ACTIVE
TSSOP
PW
14
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD4002BPWR
ACTIVE
TSSOP
PW
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
CD4025BE
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD4025BF
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
CD4025BF3A
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
CD4025BM
ACTIVE
SOIC
D
14
50
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4025BM96
ACTIVE
SOIC
D
14
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4025BMT
ACTIVE
SOIC
D
14
250
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4025BNSR
ACTIVE
SO
NS
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
CD4025BPW
ACTIVE
TSSOP
PW
14
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
CD4025BPWR
ACTIVE
TSSOP
PW
14
2000
Pb-Free
(RoHS)
CU NIPDAU
JM38510/05252BCA
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
JM38510/05254BCA
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
Lead/Ball Finish
MSL Peak Temp (3)
Level-1-250C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright  2005, Texas Instruments Incorporated
Similar pages