Eccosorb®CR500 High Temperature, Two-Part Castable Load Absorber HIGH TEMPERATURE TWO PART CASTABLE LOAD ABSORBER Eccosorb CR500 is a castable resin series that, when fully cured, will duplicate the physical and electrical properties of its counterpart in the Eccosorb® MF500 series. For example, Eccosorb® CR500-117 is the equivalent to Eccosorb® MF500-117. Frequency range from 1 - 18 GHz. Low out-gassing properties for space applications. FEATURES AND BENEFITS MARKETS • High temperature • Low outgassing • Commercial Telecom • Security and Defense SPECIFICATIONS TYPICAL PROPERTIES ECCOSORB CR500 Service Temperature °C (°F)* Density (g/cc) <260 (<500) 1.6 to 4.6 Outgassing* (%TML) (cured CR500-124) (%CVCM) (cured CR500-124) .163 .074 Data for design engineer guidance only. Observed performance varies in application.Engineers are reminded to test the material in application. *Eccosorb CR500 can be used for short periods at 260°C ( 500°F) permitting use at high power levels. Exposure to high temperatures should be limited. Slow change in physical and electrical properties occurs at temperatures above about 177°C (350°F). * * Outgassing data per ASTM E595-07; criteria for acceptability is 1.00% TML and 0.10% CVCM. APPLICATIONS • Eccosorb CR500 can be used to mold waveguide terminations, attenuators, and loads to size. AVAILABILITY • Eccosorb CR500 is available in six castable versions, CR500-110, CR500-112, CR500-114, CR500-116, CR500-117 & CR500-124. • Eccosorb CR500 is supplied as a two-part system consisting of a Component X and Component Y in 2 pound (quart) and 5 pound (gallon) kits. • Shelf life is approximately 6 months when stored unmixed in a well sealed container at temperatures no higher than 25°C (77 °F). Americas: +1.866.928.8181 Europe: +49.(0)8031.2460.0 Asia: +86.755.2714.1166 www.lairdtech.com Eccosorb®CR500 INSTRUCTIONS FOR USE • • • • • • • • Prepare mold by applying a thin coat of butchers wax. Mix Part X in its shipping container to a uniform consistency before removing any material If crystals appear in Part Y, gently heat to 65°C (150 °F) until crystals go into solution Weigh out the desired amounts of both Part X and Part Y in accordance with the table below. Heat Part X to about 65°C (150 °F). This will reduce the viscosity substantially and improve pourability. Note: in an effort to drop viscosity do not dilute with any chemical as this would alter the electrical performance of the material. Thoroughly blend Part X and Part Y. Remove entrapped air, if necessary, by vacuum evacuation. Pour into mold (pot life at 65°C (150 °F) is about 1 hour) and cure per the below schedule. The mold is also preferably preheated to about 65°C (150 °F). Clean up can be done with a solvent such as MEK. • Unlike Eccosorb CR or CRS, Eccosorb CR500 requires a 4-step cure cycle to achieve its high temperature properties. Cure cycle is as follows: > 8 hours at 93°C (200°F) > then 12 hours at 121°C (250°F) > then 5 hours at 149°C (300°F) > then 3 hours at 177°C (350°F) If small volumes of materials are to be cured, the cycle can be accelerated, but the stepped temperatures should be retained. Recommended Frequency and Mixing Ra:os by Weight Series Range (GHz) Part X Part Y CR500-110 26+ 100 24.4 CR500-112 12 - 18 100 17.0 CR500-114 10 - 14 100 9.6 CR500-116 6 - 12 100 5.9 CR500-117 4-8 100 4.6 CR500-124 5 and below 100 3.6 RFP-DS-CR500 230316 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. 2