AVAGO ALMD-LB36 Well-defined spatial radiation pattern Datasheet

ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36
High Brightness SMT Oval LED Lamps
Amber, Red, Green, and Blue
Data Sheet
Description
Features
The Avago ALMD-Lx36 oval LED series has the same or just
slightly less luminous intensity than conventional high
brightness, through-hole LEDs.



The new oval LED lamps can be assembled using common SMT
assembly processes and are compatible with industrial reflow
soldering processes.
The LEDs are made with an advanced optical grade epoxy for
superior performance in outdoor sign applications. The surface
mount Oval LEDs are specifically designed for full color/video
signs and indoor or outdoor passenger information sign
applications.
For easy pick-and-place assembly, the LEDs are shipped in
EIA-compliant tape and reel. Every reel is shipped from a single
intensity and color bin— except the red color—for better
uniformity.
CAUTION
InGaN devices are Class 1C HBM ESD sensitive,
AlInGaP devices are Class 1B ESD sensitive per
JEDEC Standard. Please observe appropriate
precautions during handling and processing.
Refer to Application Note AN-1142 for additional
details.
CAUTION
Customer is advised to keep the LED in the MBB
when not in use as prolonged exposure to
environment might cause the silver plated leads
to tarnish, which might cause difficulties in
soldering.




Well-defined spatial radiation pattern
High brightness material
Available in Red, Amber, Green and Blue color:
— Red AlInGaP 626 nm
— Amber AlInGaP 590 nm
— Green InGaN 525 nm
— Blue InGaN 470 nm
JEDEC MSL 2A
Compatible with reflow soldering process
Tinted and diffused lens
Wide viewing angle: 40° × 100°
Applications


Avago Technologies
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Full color signs
Mono color signs
ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36
Data Sheet
Package Dimensions
Package Dimensions
C
C
4.20±0.20
A
A
4.20±0.20
Orientation
(Anode Mark)
4.75±0.50
A - Anode
C - Cathode
5.20±0.50
3.40±0.50
2.50±0.20
1.4 (4X)
1.0
NOTE
1.
2.
3.
All dimensions in millimeters (inches).
Tolerance is ± 0.20 mm unless other specified.
Copper lead frame.
Device Selection Guide
Color and Dominant
Wavelength d (nm) Typa
Luminous Intensity Iv (mcd)b,c,d
Min
Max
Red 626
1380
2900
ALMD-LL36-WZ002
Amber 590
1380
2900
40° × 100°
ALMD-LM36-14002
Green 525
2900
6050
40° × 100°
ALMD-LB36-SV002
Blue 470
660
1380
40° × 100°
Part Number
ALMD-LG36-WZ002
a.
Dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
b.
The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
c.
The optical axis is closely aligned with the package mechanical axis.
d.
Tolerance for each bin limit is ± 15%.
e.
½ is the off-axis angle where the luminous intensity is half the on-axis intensity.
Avago Technologies
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Viewing Angle Typ - ° e
40° × 100°
ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36
Data Sheet
Part Numbering System
Part Numbering System
A
L
M
D
-
Code
x1
x2
x3
x4
-
x5
x6
x7
x8
x9
Description
Option
x1
Package type
L
Oval AlInGaP/InGaN
x2
Color
B
G
L
M
Blue
Red
Amber
Green
x3x4
Viewing angle
36
40 × 100°
x5
Minimum intensity bin
Refer to device selection guide
x6
Maximum intensity bin
Refer to device selection guide
x7
Color bin selection
0
Full distribution
x8x9
Packaging option
02
Tested 20mA, 13inch carrier tape
Absolute Maximum Rating, TJ = 25 °C
Parameter
Red and Amber
Blue and Green
Unit
DC Forward Current a
50
30
mA
Peak Forward Current
100b
100c
mA
Power Dissipation
120
114
mW
Reverse Voltage
5 (IR
= 100 μA)d
LED Junction Temperature
5 (IR
= 10 μA)d
V
110
°C
Operating Temperature Range
–40 to +85
°C
Storage Temperature Range
–40 to +100
°C
a.
Derate linearly as shown in Figure 4 and Figure 9.
b.
Duty Factor 30%, frequency 1 kHz.
c.
Duty Factor 10%, frequency 1 kHz.
d.
Indicates product final testing; long-term reverse bias is not recommended.
Avago Technologies
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ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36
Data Sheet
Electrical/Optical Characteristics, TJ = 25 °C
Electrical/Optical Characteristics, TJ = 25 °C
Parameter
Symbol
Forward Voltage
Red
Amber
Green
Blue
VF
Reverse Voltage
Red and Amber
Green and Blue
VR
Dominant Wavelengtha
Red
Amber
Green
Blue
d
Peak Wavelength
Red
Amber
Green
Blue
PEAK
Thermal Resistance
RJ-PIN
Luminous Efficacyb
Red
Amber
Green
Blue
V
Thermal coefficient of d
Red
Amber
Green
Blue
Min.
Typ.
Max.
Units
V
1.8
1.8
2.8
2.8
2.1
2.1
3.2
3.2
2.4
2.4
3.8
3.8
Test Conditions
IF = 20 mA
V
5
5
618.0
584.5
519.0
460.0
IR = 100 μA
IR = 10 μA
626.0
590.0
525.0
470.0
IF = 20 mA
630.0
594.5
539.0
480.0
nm
Peak of Wavelength of Spectral Distribution at
IF = 20 mA
°C/W
LED Junction-to-Pin
lm/W
Emitted Luminous Power/Emitted Radiant
Power
nm/°C
IF = 20 mA; +25 °C ≤ TJ ≤ +100 °C
634
594
516
464
130
200
520
530
65
0.059
0.103
0.028
0.024
a.
The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.
b.
The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/V where IV is the luminous intensity in candelas and V is the luminous
efficacy in lumens/watt.
Avago Technologies
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ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36
Data Sheet
AlInGaP
AlInGaP
Figure 2 Forward Current vs. Forward Voltage
Figure 1 Relative Intensity vs. Wavelength
100
RELATIVE INTENSITY
0.8
Amber
80
FORWARD CURRENT - mA
1
Red
0.6
0.4
0.2
60
40
20
0
0
500
550
600
WAVELENGTH - nm
650
Amber
Red
2.5
3
50
40
30
20
10
0
0
20
40
60
FORWARD CURRENT - mA
80
100
0
NOTE
Figure 5 Relative Dominant Wavelength Shift vs. Forward Current
RELATIVE DOMINANT WAVELENGTH
SHIFT(NORMALIZED AT 20mA) - nm
1
1.5
2
FORWARD VOLTAGE - V
60
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-0.2
-0.4
-0.6
0.5
Figure 4 Maximum Forward Current vs. Ambient Temperature
MAXIMUM FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
Figure 3 Relative Intensity vs. Forward Current
0
Amber
Red
0
20
40
60
FORWARD CURRENT - mA
80
100
Avago Technologies
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20
40
60
TA - AMBIENT TEMPERATURE (°C)
RJ-A = 460 °C/W.
80
100
ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36
Data Sheet
InGaN
InGaN
Figure 7 Forward Current vs. Forward Voltage
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
BLUE
FORWARD CURRENT-mA
RELATIVE INTENSITY
Figure 6 Relative Intensity vs. Wavelength
GREEN
80
60
40
20
0
430
480
530
WAVELENGTH - nm
580
0
630
Figure 8 Relative Intensity vs. Forward Current
1
2
3
FORWARD VOLTAGE-V
4
5
Figure 9 Maximum Forward Current vs. Ambient Temperature
35
3.5
3.0
IFmax - MAXIMUM FORWARD
CURRENT - mA
RELATIVE LUMINOUS INTENSITY
(NORMALIZED AT 20mA)
Blue
2.5
Green
2.0
1.5
1.0
0.5
0
20
40
60
80
DC FORWARD CURRENT-mA
100
20
15
10
5
0
120
Figure 10 Dominant Wavelength Shift vs. Forward Current
10
RELATIVE DOMINANT
WAVELENGTH SHIFT -nm
25
0
0.0
5
Green
Blue
0
-5
-10
30
0
20
40
60
FORWARD CURRENT-mA
80
100
Avago Technologies
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20
40
60
80
TA - AMBIENT TEMPERATURE - °C
100
ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36
Data Sheet
InGaN
Figure 12 Radiation Pattern for Minor Axis
1.0
1.0
0.8
0.8
NORMALIZED INTENSITY
NORMALIZED INTENSITY
Figure 11 Radiation Pattern for Major Axis
0.6
0.4
0.2
Red
Green
Blue
Amber
-90
-60
-30
0
30
ANGULAR DISPLACEMENT-DEGREE
60
Red
Green
Blue
Amber
0.2
-90
90
Figure 13 Relative Intensity Shift vs. Junction Temperature
-60
-30
0
30
ANGULAR DISPLACEMENT-DEGREE
60
90
Figure 14 Forward Voltage Shift vs. Junction Temperature
10
0.3
Red
Amber
Blue
Green
FORWARD VOLTAGE SHIFT-V
NORMALZIED INTENSITY (PHOTO)
0.4
0.0
0.0
1
0.1
0.6
-40
-15
10
35
TJ - JUNCTION TEMPERATURE
60
0.7
4.0
Figure 15 Recommended Soldering Land Pattern
2.1
5.2
NOTE
Recommended stencil thickness is 0.1524 mm
(6 mils) minimum and above.
Avago Technologies
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Green
Blue
0.1
0
-0.1
-0.2
-0.3
85
Red
Amber
0.2
-40
-15
10
35
TJ - JUNCTION TEMPERATURE
60
85
ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36
Data Sheet
InGaN
Figure 16 Carrier Tape Dimension
0.50±0.10
4.00±0.20 2.00±0.20
O 1.55±0.20
1.75±0.20
1.80±0.20
7.50±0.20
5.20±0.20
2.20±0.20
4.50±0.20
8.00±0.20
16.00±0.30
O 1.60±0.20
4.10±0.20 5.90±0.20
Figure 17 Reel Dimension
O 100 ± 0.50
16.40 ± 0.20
O 330 MAX.
13.00 ± 0.20
Avago Technologies
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ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36
Data Sheet
Intensity Bin Limit Table (1.2:1 lv Bin Ratio)
Figure 18 Unit Orientation from Reel
2 anode leads lead unreeling direction
Intensity Bin Limit Table (1.2:1 lv Bin
Ratio)
Intensity (mcd) at 20 mA
Bin
VF Bin Table (V at 20 mA) for Red and
Amber
Bin ID
Min
Max
Min
Max
VD
1.8
2.0
S
660
800
VA
2.0
2.2
T
800
960
VB
2.2
2.4
U
960
1150
V
1150
1380
W
1380
1660
X
1660
1990
Y
1990
2400
Z
2400
2900
1
2900
3500
2
3500
4200
3
4200
5040
4
5040
6050
Tolerance for each bin limit is ± 0.05 V.
Tolerance for each bin limit is ± 15%.
Avago Technologies
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ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36
Data Sheet
Red Color Range
Red Color Range
Min Dom Max Dom
618.0
630.0
Green Color Range
X min
Y Min
X max
Y max
0.6872
0.3126
0.6890
0.2943
0.6690
0.3149
0.7080
0.2920
Tolerance for each bin limit is ± 0.5 nm.
Bin
1
2
584.5
587.0
Max
Dom
587.0
589.5
4
589.5
592.0
6
592.0
594.5
Xmin
1
523.0
3
Ymin
Xmax
Ymax
0.5420
0.4580
0.5530
0.4400
0.5370
0.4550
0.5570
0.4420
0.5570
0.4420
0.5670
0.4250
0.5530
0.4400
0.5720
0.4270
0.5720
0.4270
0.5820
0.4110
0.5670
0.4250
0.5870
0.4130
0.5870
0.4130
0.5950
0.3980
0.5820
0.4110
0.6000
0.3990
Tolerance for each bin limit is ± 0.5 nm.
Min
Dom
519.0
2
Amber Color Range
Min
Dom
Bin
527.0
4
531.0
5
535.0
Max
Dom
523.0
527.0
531.0
535.0
539.0
Xmin
Ymin
Xmax
Ymax
0.0667
0.8323
0.1450
0.7319
0.1200
0.7375
0.0979
0.8316
0.0979
0.8316
0.1711
0.7218
0.1450
0.7319
0.1305
0.8189
0.1305
0.8189
0.1967
0.7077
0.1711
0.7218
0.1625
0.8012
0.1625
0.8012
0.2210
0.6920
0.1967
0.7077
0.1929
0.7816
0.1929
0.7816
0.2445
0.6747
0.2210
0.6920
0.2233
0.7600
Xmax
Ymax
Tolerance for each bin limit is ± 0.5 nm.
Blue Color Range
Bin
1
2
3
4
5
Min
Dom
460.0
464.0
468.0
472.0
476.0
Max
Dom
464.0
468.0
472.0
476.0
480.0
Xmin
Ymin
0.1440
0.0297
0.1766
0.0966
0.1818
0.0904
0.1374
0.0374
0.1374
0.0374
0.1699
0.1062
0.1766
0.0966
0.1291
0.0495
0.1291
0.0495
0.1616
0.1209
0.1699
0.1062
0.1187
0.0671
0.1187
0.0671
0.1517
0.1423
0.1616
0.1209
0.1063
0.0945
0.1063
0.0945
0.1397
0.1728
0.1517
0.1423
0.0913
0.1327
Tolerance for each bin limit is ± 0.5 nm.
Avago Technologies
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ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36
Data Sheet
Packing Label
Packing Label
(i) Mother Label (Available on MBB Bag)
(1T) Lot: Lot Number
STANDARD LABEL LS0002
RoHS Compliant
(Q) QTY: Quantity
e4 Max Temp 260C MSL 2a
LPN:
CAT: Intensity Bin
(9D)MFG Date: Manufacturing Date
BIN: Refer to below information
(1P) Item: Part Number
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
DeptID: OEAT01
Made In: Country of Origin
(ii) Baby Label (Available on Plastic Reel)
(1P) PART #: Part Number
(1T) Lot #: Lot Number
BABY LABEL COSBOO1B V0.0
(9D)MFG Date: Manufacturing Date
(Q) QTY: Quantity
C/0: Country of Origin
(9D) Date Code: Date Code
(1T) TAPE DATE: Taping Date
CAT Intensity Bin
BIN Refer to Below information
For acronyms and definitions, see the next page.
Avago Technologies
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ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36
Data Sheet
Soldering
Acronyms and Definitions
Example:
Color bin only or VF bin only
a.
BIN:
BIN: 4 (represent color bin 4 only)
(i) Color bin only or VF bin only
BIN: VA (represent VF bin “VA” only)
(Applicable for part numbers with color bins but without
VF bin or part numbers with VF bins and no color bin)
b.
Color bin incorporate with VF bin
BIN: 4 VA
(ii) Color bin incorporated with VF bin
Applicable for part numbers that have both color bin and
VF bin
VA: VF bin “VA”
4: Color bin 4 only
Soldering
Recommended reflow soldering condition:
(i) Leaded reflow soldering
(ii) Lead-free reflow soldering
20 SEC. MAX.
TEMPERATURE
TEMPERATURE
10 to 30 SEC.
240°C MAX.
3°C/SEC. MAX.
183°C
100-150°C
-6°C/SEC.
MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
217°C
200°C
2.
6°C/SEC. MAX.
150°C
3 °C/SEC. MAX.
100 SEC. MAX.
60 - 120 SEC.
60-150 SEC.
TIME
1.
255 - 260 °C
3°C/SEC. MAX.
TIME
Reflow soldering must not be done more than two times.
Make sure you take the necessary precautions for handling
a moisture-sensitive device, as stated in the following
section.
3.
Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
4.
It is preferred that you use reflow soldering to solder the
LED. Use hand soldering only for rework if unavoidable but
must be strictly controlled to the following conditions:
Recommended board reflow direction:
Soldering iron tip temperature = 320 °C max.
Soldering duration = 3 sec max.
— Number of cycles = 1 only
— Power of soldering iron = 50 W max.
—
—
5.
Do not touch the LED body with a hot soldering iron
except the soldering terminals as this may damage the
LED.
6.
For de-soldering, it is recommended that you use a double
flat tip.
7.
Please confirm beforehand whether the functionality and
performance of the LED is affected by hand soldering.
Reflow Soldering
Avago Technologies
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ALMD-LL36, ALMD-LG36, ALMD-LM36, ALMD-LB36
Data Sheet
Precautionary Notes
Precautionary Notes
d.
1. Handling precautions
For automated pick and place, Avago has tested nozzle
size below made with urethane material to be working fine
with this LED. However, due to the possibility of variations
in other parameters such as pick and place machine
maker/model and other settings of the machine, customer
is recommended to verify the nozzle selected.
e.
3.20
4.00
Pick & Place nozzle
>2.2mm
The recommended baking condition is: 60 °C ±5 ºC for
20 hrs. Baking should only be done once.
f.
LED flange
4.00
5.00
NOTE
a. Nozzle tip should touch the LED flange during pick
and place.
b. Outer dimensions of the nozzle should be able to fit
into the carrier tape pocket.
This product has a Moisture Sensitive Level 2a rating per
JEDEC J-STD-020. Refer to Avago Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
b.
c.
Storage

The soldering terminals of these Avago LEDs are
silver plated. If the LEDs are being exposed in
ambient environment for too long, the silver
plating might be oxidized and thus affecting its
solderability performance. As such, unused LEDs
must be kept in sealed MBB with desiccant or in
desiccator at <5%RH.
3. Application precautions
a.
2. Handling of moisture-sensitive device
a.
Control of assembled boards

If the PCB soldered with the LEDs is to be
subjected to other high temperature processes,
the PCB must be stored in sealed MBB with
desiccant or desiccator at <5%RH to ensure that
all LEDs have not exceeded their floor life of
672 hours.
Baking is required if:

The HIC indicator is not BROWN at 10% and is
AZURE at 5%.

The LEDs are exposed to condition of >30 °C /
60% RH at any time.

The LED floor life exceeded 672 hrs.
Before use

An unopened moisture barrier bag (MBB) can be
stored at <40 °C / 90%RH for 12 months. If the
actual shelf life has exceeded 12 months and the
humidity indicator card (HIC) indicates that
baking is not required, then it is safe to reflow the
LEDs per the original MSL rating.

It is recommended that the MBB not be opened
prior to assembly (e.g., for IQC).
Control after opening the MBB

The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.

The LEDs must be kept at <30 °C / 60%RH at all
times and all high temperature related processes
including soldering, curing or rework need to be
completed within 672 hours.
Control for unfinished reel

Unused LEDs must be stored in a sealed MBB with
desiccant or desiccator at <5%RH.
Avago Technologies
- 13 -
b.
c.
d.
e.
Drive current of the LED must not exceed the
maximum allowable limit across temperature as
stated in the data sheet. Constant current driving is
recommended to ensure consistent performance.
LEDs do exhibit slightly different characteristics at
different drive currents that might result in larger
performance variations (i.e., intensity, wavelength,
and forward voltage). The user is recommended to set
the application current as close as possible to the test
current to minimize these variations.
The LED is not intended for reverse bias. Do use other
appropriate components for such purposes. When
driving the LED in matrix form, it is crucial to ensure
that the reverse bias voltage does not exceed the
allowable limit of the LED.
Avoid rapid change in ambient temperature,
especially in high humidity environments, because
this will cause condensation on the LED.
If the LED is intended to be used in outdoor or harsh
environments, the LED leads must be protected with
suitable potting material against damages caused by
rain water, oil, corrosive gases, etc. It is recommended
to have louver or shade to reduce direct sunlight on
the LEDs.
4. Eye safety precautions
LEDs may pose optical hazards when in operation. It is not
advisable to view directly at operating LEDs because it
may be harmful to the eyes. For safety reasons, use
appropriate shielding or personal protective equipment.
DISCLAIMER: Avago’s products and software are not specifically
designed, manufactured or authorized for sale as parts,
components or assemblies for the planning, construction,
maintenance or direct operation of a nuclear facility or for use in
medical devices or applications. Customer is solely responsible,
and waives all rights to make claims against Avago or its suppliers,
for all loss, damage, expense or liability in connection with such
use.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago Technologies and the A logo are trademarks of Avago Technologies in the United
States and other countries. All other brand and product names may be trademarks of their
respective companies.
Data subject to change. Copyright © 2014–2016 Avago Technologies. All Rights Reserved.
AV02-2377EN – April 15, 2016