ON ACT138ALYW 1−of−8 decoder/demultiplexer Datasheet

MC74AC138, MC74ACT138
1−of−8
Decoder/Demultiplexer
T h e M C 7 4 A C 1 3 8 / 7 4 A C T 1 3 8 i s a h i g h−s p e e d 1 −o f −8
decoder/demultiplexer. This device is ideally suited for high−speed
bipolar memory chip select address decoding.
The multiple input enables allow parallel expansion to a 1−of−24
decoder using just three MC74AC138/74ACT138 devices or a
1−of−32 decoder using four MC74AC138/74ACT138 devices and one
inverter.
•
•
•
•
•
w
Demultiplexing Capability
Multiple Input Enable for Easy Expansion
Active LOW Mutually Exclusive Outputs
Outputs Source/Sink 24 mA
′ACT138 Has TTL Compatible Inputs
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DIP−16
N SUFFIX
CASE 648
16
1
These devices are available in Pb−free package(s). Specifications herein
apply to both standard and Pb−free devices. Please see our website at
www.onsemi.com for specific Pb−free orderable part numbers, or
contact your local ON Semiconductor sales office or representative.
VCC
O0
O1
O2
O3
O4
O5
O6
16
15
14
13
12
11
10
9
16
16
16
1
A0
2
A1
3
A2
4
E1
5
E2
6
E3
7
O7
E1 E2 E3
Figure 2. Logic Symbol
A0−A2
Address Inputs
E1−E2
Enable Inputs
E3
Enable Input
O0−O7
Outputs
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 6
EIAJ−16
M SUFFIX
CASE 966
Package
Shipping
MC74AC138N
PDIP−16
25 Units/Rail
MC74ACT138N
PDIP−16
25 Units/Rail
MC74AC138D
SOIC−16
48 Units/Rail
MC74ACT138D
SOIC−16
48 Units/Rail
MC74AC138DR2
SOIC−16
2500 Tape & Reel
MC74ACT138DR2
SOIC−16
2500 Tape & Reel
MC74AC138DT
TSSOP−16
96 Units/Rail
MC74ACT138DT
TSSOP−16
96 Units/Rail
MC74AC138DTR2
TSSOP−16 2500 Tape & Reel
MC74ACT138DTR2 TSSOP−16 2500 Tape & Reel
PIN ASSIGNMENT
FUNCTION
1
Device
O0 O1 O2 O3 O4 O5 O6 O7
PIN
1
TSSOP−16
DT SUFFIX
CASE 948F
ORDERING INFORMATION
8
GND
Figure 1. Pinout: 16−Lead Packages Conductors
(Top View)
A0 A1 A2
1
SO−16
D SUFFIX
CASE 751B
MC74AC138M
EIAJ−16
50 Units/Rail
MC74ACT138M
EIAJ−16
50 Units/Rail
MC74AC138MEL
EIAJ−16
2000 Tape & Reel
MC74ACT138MEL
EIAJ−16
2000 Tape & Reel
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 6 of this data sheet.
1
Publication Order Number:
MC74AC138/D
MC74AC138, MC74ACT138
FUNCTIONAL DESCRIPTION
HIGH. This multiple enabled function allows easy parallel
expansion of the device to a 1−of−32 (5 lines to 32 lines)
decoder with just four MC74AC138/74ACT138 devices
and
one
inverter
(See
Figure
4).
The
MC74AC138/74ACT138 can be used as an 8−output
demultiplexer by using one of the active LOW Enable inputs
as the data input and the other Enable inputs as strobes. The
Enable inputs which are not used must be permanently tied
to their appropriate active−HIGH or active−LOW state.
The MC74AC138/74ACT138 high−speed 1−of−8
decoder/demultiplexer accepts three binary weighted inputs
(A0, A1, A2) and, when enabled, provides eight mutually
exclusive
active−LOW
outputs
(O0−O7).
The
MC74AC138/74ACT138 features three Enable inputs, two
active−LOW (E1, E2) and one active−HIGH (E3). All
outputs will be HIGH unless E1 and E2 are LOW and E3 is
TRUTH TABLE
Inputs
Outputs
E1
E2
E3
A0
A1
A2
O0
O1
O2
O3
O4
O5
O6
O7
H
X
X
X
H
X
X
X
L
X
X
X
X
X
X
X
X
X
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
H
H
H
H
L
H
L
H
L
L
H
H
L
L
L
L
L
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
L
L
H
H
H
H
L
H
L
H
L
L
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H
H
H
H
L
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
A2
07
NOTE:
A1
E1 E2 E3
A0
06
05
04
03
02
01
00
This diagram is provided only for the understanding of logic
operations and should not be used to estimate propagation
delays.
Figure 3. Logic Diagram
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2
MC74AC138, MC74ACT138
A0
A1
A2
′04
A3
A4
H
123
A0 A1 A2
123
E
00 01 02 03 04 05 06 07
A0 A1 A2
123
E
A0 A1 A2
00 01 02 03 04 05 06 07
123
E
00 01 02 03 04 05 06 07
A0 A1 A2
E
00 01 02 03 04 05 06 07
00
031
Figure 4. Expansion to 1−of−32 Decoding
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
−0.5 to +7.0
V
VIN
DC Input Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
VOUT
DC Output Voltage (Referenced to GND)
−0.5 to VCC +0.5
V
IIN
DC Input Current, per Pin
±20
mA
IOUT
DC Output Sink/Source Current, per Pin
±50
mA
ICC
DC VCC or GND Current per Output Pin
±50
mA
Tstg
Storage Temperature
−65 to +150
°C
*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC
Supply Voltage
VIN, VOUT
DC Input Voltage, Output Voltage (Ref. to GND)
tr, tf
Input Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
tr, tf
Input Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs
TJ
Junction Temperature (PDIP)
TA
Operating Ambient Temperature Range
IOH
IOL
Min
Typ
Max
′AC
2.0
5.0
6.0
′ACT
4.5
5.0
5.5
0
−
VCC
VCC @ 3.0 V
−
150
−
VCC @ 4.5 V
−
40
−
VCC @ 5.5 V
−
25
−
VCC @ 4.5 V
−
10
−
VCC @ 5.5 V
−
8.0
−
Unit
V
V
ns/V
ns/V
−
−
140
°C
−40
25
85
°C
Output Current − High
−
−
−24
mA
Output Current − Low
−
−
24
mA
1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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3
MC74AC138, MC74ACT138
DC CHARACTERISTICS
Symbol
Parameter
VCC
(V)
74AC
74AC
TA = +25°C
TA =
−40°C to
+85°C
Typ
Unit
Conditions
Guaranteed Limits
VIH
Minimum High Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
V
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
5.5
−
±0.1
5.5
−
5.5
5.5
VOL
Maximum Low Level
Output Voltage
IIN
Maximum Input
Leakage Current
IOLD
†Minimum Dynamic
Output Current
IOHD
ICC
Maximum Quiescent
Supply Current
V
*VIN = VIL or VIH
−12 mA
IOH
−24 mA
−24 mA
IOUT = 50 μA
V
*VIN = VIL or VIH
12 mA
IOL
24 mA
24 mA
±1.0
μA
VI = VCC, GND
−
75
mA
VOLD = 1.65 V Max
−
−
−75
mA
VOHD = 3.85 V Min
−
8.0
80
μA
VIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
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4
V
IOUT = −50 μA
MC74AC138, MC74ACT138
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol
VCC*
(V)
Parameter
74AC
74AC
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Min
Typ
Max
Min
Max
Unit
Fig.
No.
tPLH
Propagation Delay
An to On
3.3
5.0
1.5
1.5
8.5
6.5
13.0
9.5
1.5
1.5
15.0
10.5
ns
3−6
tPHL
Propagation Delay
An to On
3.3
5.0
1.5
1.5
8.0
6.0
12.5
9.0
1.5
1.5
14.0
10.5
ns
3−6
tPLH
Propagation Delay
E1 or E2 to On
3.3
5.0
1.5
1.5
11.0
8.0
15.0
11.0
1.5
1.5
16.0
12.0
ns
3−6
tPHL
Propagation Delay
E1 or E2 to On
3.3
5.0
1.5
1.5
9.5
7.0
13.5
9.5
1.5
1.5
15.0
10.5
ns
3−6
tPLH
Propagation Delay
E3 to On
3.3
5.0
1.5
1.5
11.0
8.0
15.5
11.0
1.5
1.5
16.5
12.5
ns
3−6
tPHL
Propagation Delay
E3 to On
3.3
5.0
1.5
1.5
8.5
6.0
13.0
8.0
1.5
1.0
14.0
9.5
ns
3−6
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
DC CHARACTERISTICS
Symbol
Parameter
VCC
(V)
74ACT
74ACT
TA = +25°C
TA =
−40°C to
+85°C
Typ
Guaranteed Limits
Unit
Conditions
VIH
Minimum High Level
Input Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
V
VOUT = 0.1 V
or VCC − 0.1 V
VIL
Maximum Low Level
Input Voltage
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
V
VOUT = 0.1 V
or VCC − 0.1 V
VOH
Minimum High Level
Output Voltage
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
V
4.5
5.5
−
−
3.86
4.86
3.76
4.76
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
4.5
5.5
−
−
0.36
0.36
0.44
0.44
V
*VIN = VIL or VIH
24 mA
IOL
24 mA
VOL
Maximum Low Level
Output Voltage
V
V
IOUT = −50 μA
*VIN = VIL or VIH
−24 mA
IOH
−24 mA
IOUT = 50 μA
IIN
Maximum Input
Leakage Current
5.5
−
±0.1
±1.0
μA
VI = VCC, GND
ΔICCT
Additional Max. ICC/Input
5.5
0.6
−
1.5
mA
VI = VCC − 2.1 V
IOLD
†Minimum Dynamic
Output Current
5.5
−
−
75
mA
VOLD = 1.65 V Max
5.5
−
−
−75
mA
VOHD = 3.85 V Min
5.5
−
8.0
80
μA
VIN = VCC or GND
IOHD
ICC
Maximum Quiescent
Supply Current
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
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5
MC74AC138, MC74ACT138
AC CHARACTERISTICS (For Figures and Waveforms − See Section 3 of the ON Semiconductor FACT Data Book, DL138/D)
Symbol
VCC*
(V)
Parameter
74ACT
74ACT
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Min
Typ
Max
Min
Max
Unit
Fig.
No.
tPLH
Propagation Delay
An to On
5.0
1.5
7.0
10.5
1.5
11.5
ns
3−6
tPHL
Propagation Delay
An to On
5.0
1.5
6.5
10.5
1.5
11.5
ns
3−6
tPLH
Propagation Delay
E1 or E2 to On
5.0
2.5
8.0
11.5
2.0
12.5
ns
3−6
tPHL
Propagation Delay
E1 or E2 to On
5.0
2.0
7.5
11.5
2.0
12.5
ns
3−6
tPLH
Propagation Delay
E3 to On
5.0
2.5
8.0
12.0
2.0
13.0
ns
3−6
tPHL
Propagation Delay
E3 to On
5.0
2.0
6.5
10.5
1.5
11.5
ns
3−6
*Voltage Range 5.0 V is 5.0 V ± 0.5 V
CAPACITANCE
Symbol
Parameter
Value
Typ
Unit
Test Conditions
CIN
Input Capacitance
4.5
pF
VCC = 5.0 V
CPD
Power Dissipation Capacitance
60
pF
VCC = 5.0 V
MARKING DIAGRAMS
DIP−16
SO−16
MC74AC138N
AWLYYWW
AC138
AWLYWW
MC74ACT138N
AWLYYWW
ACT138
AWLYWW
A
WL, L
YY, Y
WW, W
= Assembly Location
= Wafer Lot
= Year
= Work Week
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6
TSSOP−16
EIAJ−16
AC
138
ALYW
74AC138
ALYW
ACT
138
ALYW
74ACT138
ALYW
MC74AC138, MC74ACT138
PACKAGE DIMENSIONS
PDIP−16
N SUFFIX
16 PIN PLASTIC DIP PACKAGE
CASE 648−08
ISSUE R
−A−
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
SEATING
PLANE
−T−
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SO−16
D SUFFIX
16 PIN PLASTIC SOIC PACKAGE
CASE 751B−05
ISSUE J
−A−
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
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7
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC74AC138, MC74ACT138
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
16 PIN PLASTIC TSSOP PACKAGE
CASE948F−01
ISSUE O
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
K
ÉÉÉ
ÇÇÇ
ÇÇÇ
ÉÉÉ
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
8
1
N
0.15 (0.006) T U
S
0.25 (0.010)
A
−V−
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE −W−.
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
D
DETAIL E
H
G
EIAJ−16
M SUFFIX
16 PIN PLASTIC EIAJ PACKAGE
CASE966−01
ISSUE O
16
LE
9
Q1
E HE
1
M_
L
8
Z
DETAIL P
D
e
VIEW P
A
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
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8
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
−−−
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.007
0.011
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0_
8_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−−
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−−
0.031
MC74AC138, MC74ACT138
Notes
http://onsemi.com
9
MC74AC138, MC74ACT138
Notes
http://onsemi.com
10
MC74AC138, MC74ACT138
Notes
ON Semiconductor and
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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MC74AC138/D
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