Spec. No. : C659M3 Issued Date : 2008.06.25 Revised Date : Page No. : 1/6 CYStech Electronics Corp. NPN Epitaxial Planar High Current (High Performance) Transistor BTD6055M3 Features • Low VCE(SAT) • Low RCE(SAT), RCE(SAT)=50 mΩ(typically) at IC=5A • Low operating collector voltage • Excellent current gain characteristics at very low VCE • Suitable for low dropout voltage application • Pb-free package Symbol Outline BTD6055M3 SOT-89 B：Base C：Collector E：Emitter B C B C E Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Collector Current Power Dissipation Operating and Storage Temperature Range Symbol VCBO VCEO VEBO IC ICP Pd Tj ; Tstg Limits 15 10 7 6 9 0.6 1 (Note 1) 2 (Note 2) -55 ~ +150 Unit V V V A A W °C Note : 1. When mounted on FR-4 PCB with area measuring 10×10×1 mm 2. When mounted on ceramic with area measuring 40×40×1 mm BTD6055M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C659M3 Issued Date : 2008.06.25 Revised Date : Page No. : 2/6 Characteristics (Ta=25°C, unless otherwise specified) Symbol BVCEO ICBO IEBO *VCE(sat) *VCE(sat) *VBE(sat) *VBE(on) *hFE *hFE *hFE fT Cob Min. 10 450 400 250 100 - Typ. - Max. 100 100 0.2 0.35 1.2 1.2 50 Unit V nA nA V V V V MHz pF Test Conditions IC=1mA, IB=0 VCB=12V, IE=0 VEB=7V, IC=0 IC=3A, IB=20mA IC=5A, IB=20mA IC=3A, IB=60mA VCE=0.3V, IC=3A VCE=0.3V, IC=500mA VCE=0.3V, IC=1A VCE=0.3V, IC=5A VCE=6V, IC=500mA, f=20MHz VCB=10V, f=1MHz *Pulse Test: Pulse Width ≤300μs, Duty Cycle≤2% Ordering Information Device BTD6055M3 BTD6055M3 Package SOT-89 (Pb-free) Shipping Marking 1000 pcs / Tape & Reel D6055 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C659M3 Issued Date : 2008.06.25 Revised Date : Page No. : 3/6 Characteristic Curves Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 1000 VCE=1V Saturation Voltage-(mV) Current Gain---HFE VCESAT VCE=0.5V VCE=0.3V HFE 100 IC=50IB 10 IC=20IB 100 1 10 100 1000 Collector Current ---IC(mA) 10000 10 Saturation Voltage vs Collector Current 100 1000 Collector Current ---IC(mA) 10000 Power Derating Curve 10000 2.5 Power Dissipation---PD(W) Saturation Voltage-(mV) VBESAT@IC=50IB 1000 See Note 2 on page 1 2 See Note 1 on page 1 1.5 1 0.5 0 100 10 100 1000 Collector Current--- IC(mA) BTD6055M3 10000 0 50 100 150 Ambient Temperature---TA(℃) 200 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C659M3 Issued Date : 2008.06.25 Revised Date : Page No. : 4/6 Reel Dimension Carrier Tape Dimension BTD6055M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C659M3 Issued Date : 2008.06.25 Revised Date : Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. BTD6055M3 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C659M3 Issued Date : 2008.06.25 Revised Date : Page No. : 6/6 SOT-89 Dimension Marking: A 2 1 Product Name 3 Month code: 1~9, A,B,C Year code : 6→2006, 7→2007,… H C D B E Style: Pin 1. Base 2. Collector 3. Emitter I F 3-Lead SOT-89 Plastic Surface Mounted Package CYStek Package Code: M3 G *: Typical Inches Min. Max. 0.1732 0.1811 0.1594 0.1673 0.0591 0.0663 0.0945 0.1024 0.01417 0.0201 DIM A B C D E Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51 DIM F G H I Inches Min. Max. 0.0583 0.0598 0.1165 0.1197 0.0551 0.0630 0.0138 0.0161 Millimeters Min. Max. 1.48 1.527 2.96 3.04 1.40 1.60 0.35 0.41 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: KFC ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BTD6055M3 CYStek Product Specification