GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Wideband Transmit-Receive Digital Signal Processors Check for Samples: GC6016 FEATURES APPLICATIONS • • • • • • • • 1 • • • • • • • • • • • • • Integrated Transmit and Receive Digital IF Solution Up to 4 TX, 8 RX TX-Transmit Includes DUC, CFR, TX Equalizer, and Bulk Upconverter CFR: 6-dB PAR for WCDMA, 7-db LTE Signals With EVM Meeting 3GPP Specs; Configurable for All Major Wireless Infrastructure Standards RX-Receive Includes DC-Offset Cancellation, Front-End and Back-End AGC, Bulk Downconverter, RX Equalizer, I/Q Imbalance Correction, DDC 4 DDUCs, 1–12 Channels per DDUC, Each DDUC Can Be Programmed to TX or RX, at a Common Resampler Rate – Multimode Support Seamless Interface to TI High-Speed Data Converters 4 TX Aggregate Output to DACs up to 930 MSPS Complex 8 RX Aggregate Input From ADCs up to 1.24 GSPS Real 16-Tap (Complex) RX Equalizers Two 4K Complex Word Capture Buffers for Signal Analysis, and Adaptive Filtering 1.1-V Core, 3.3-V I/O CMOS, 1.8-V I/O LVDS Power Consumption, 3.5 W Typical 484-Ball TE-PBGA Package, 23 mm × 23 mm Multi-Standard Base Stations 3GPP (LTE, W-CDMA, TDS-CDMA) MC-GSM WiMAX and WiBro (OFDMA) Multi-Carrier Power Amplifiers (MCPAs) Wireless Infrastructure Repeaters Digital Radio Instrumentation and Test Equipment DESCRIPTION The GC6016 is a wideband transmit and receive signal processor that includes digital downconverter / upconverter (DDUC), transmit, receive, and capture buffer blocks. The transmit path includes crest factor reduction (CFR), complex equalization, and bulk upconversion. The GC6016 is a related product to the GC5330, with the DPD block not functional. The GC6016 has an identical package and footprint with the GC5330.The receive path includes wideband and narrowband automatic gain control (AGC), bulk downconversion, complex equalization, and I/Q imbalance correction. The DDUC section consists of four identical DDUC blocks, each supporting up to 12 channels. Each channel has independent fractional resamplers and NCOs to enable flexible carrier configurations. Multi-mode/multi-standard operation can be supported by configuring the individual DDUC blocks to different filtering and oversampling scenarios. DAC3484 C6748 DSP TRF3703/3720 Complex TX I/Q Mod PA I/Q Mod PA I/Q Mod PA I/Q Mod PA DAC I/Q DAC I/Q ADS61B49 FB Baseband Data GC6016 DUC-CFR DDC Subsampled Feedback SW ADC Mixer/BPF ADS62P49 RX RX ADC Mixer/BPF LNA ADC Mixer/BPF LNA ADC Mixer/BPF LNA ADC Mixer/BPF LNA Real RX ADS62P49 RX RX Real RX B0441-02 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2011, Texas Instruments Incorporated GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION (Continued) The CFR block reduces the peak-to-average ratio (PAR) of the digital transmit signals, such as those used in third-generation (3G) code division multiple access (CDMA) and orthogonal frequency-division multiple-access (OFDMA) applications. By reducing the PAR of the digital signal and the PA nonlinearity, the operational efficiency of follow-on power amplifiers can be substantially improved. In Table 1, feedback is normally associated with a DPD system. The GC6016 can use the feedback input as a calibration antenna input to the capture buffer. Several architectures that provide performance and cost optimization are listed in Table 1 Table 1. Sample Configurations for GC6016 Figure TX Antenna RX Antenna Other Lower-cost 2-antenna solution Figure 1 2-62 MHz 2 typical at 250 Msps, up to 4 at 250 Msps Figure 2 2-62 MHz 2 at 250Msps, 4 with lower-rate RX ADC 2-antenna solution with full-rate real feedback Figure 3 2-62 MHz 2 at 250Msps, 4 with lower-rate RX ADC 2-antenna solution with complex feedback, lower subsampling ratio Figure 4 4-31 MHz 4 at 250Msps, 8 with lower-rate RX ADC Lower-cost 4 antenna solution ANTENNA MODE EXAMPLE DIAGRAMS C6748 DSP DAC3283/3482 I/Q I/Q Baseband Data TRF3703/3720 Complex TX DAC I/Q Mod PA DAC I/Q Mod PA ADS41B49 GC6016 DUC-CFR DDC FB ADC Mixer/BPF Subsampled Feedback SW ADS62P49 RX RX ADC Mixer/BPF LNA Real RX ADC Mixer/BPF LNA B0442-02 Figure 1. Two-Antenna-Mode Subsampled-Feedback Diagram 2 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com C6748 DSP DAC3283/3482 I/Q I/Q Baseband Data TRF3703/3720 Complex TX DAC I/Q Mod PA DAC I/Q Mod PA ADS5474 GC6016 DUC-CFR DDC RX ADC Mixer/BPF Real Feedback SW ADS62P49 RX RX ADC LNA Mixer/BPF Real RX ADC LNA Mixer/BPF B0443-02 Figure 2. Two-Antenna-Mode Full-Rate Real-Feedback Diagram C6748 DSP DAC3283/3482 I/Q I/Q TRF3703/3720 Complex TX DAC I/Q Mod PA DAC I/Q Mod PA ADS62P49 RX Baseband Data GC6016 DUC-CFR DDC ADC I/Q Demod RX Complex Feedback SW ADC ADS62P49 RX RX ADC Mixer/BPF LNA Real RX ADC Mixer/BPF LNA B0435-02 Figure 3. Two-Antenna-Mode Complex-Feedback Diagram Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 3 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com DAC3484 C6748 DSP TRF3703/3720 Complex TX I/Q Mod PA I/Q Mod PA I/Q Mod PA I/Q Mod PA DAC I/Q DAC I/Q ADS61B49 FB Baseband Data GC6016 DUC-CFR DDC Subsampled Feedback SW ADC Mixer/BPF ADS62P49 RX RX ADC Mixer/BPF LNA Real RX ADC Mixer/BPF LNA Mixer/BPF LNA ADS62P49 RX RX ADC Real RX ADC Mixer/BPF LNA B0441-02 Figure 4. Four-Antenna-Mode Subsampled Real-Feedback Example Diagram GENERAL DESCRIPTION The GC6016 is a wideband transmit and receive signal processor that includes digital downconverter/upconverter (DDUC), transmit, receive, and capture buffer blocks. The transmit path includes crest factor reduction (CFR), complex equalization, and bulk upconversion. The receive path includes wideband and narrowband automatic gain control (AGC), bulk downconversion, complex equalization, and I/Q imbalance correction. The architecture supports different RX, TX, and feedback modes of operation. This provides for many configurations to optimize performance and cost. • RX – real or complex input • TX – real, complex, complex with envelope tracking The RX path can be configured for one or two multichannel ADC input ports. The RX block provides each ADC channel with a front-end AGC, IQ demodulation correction, real-to-complex conversion, complex mixing, decimation, and complex equalization. The RX block output is input to the DDUC block. The output of the DDUC block goes through gain and back-end AGC and is formatted for the baseband output. 4 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com There are four DDUC blocks. Each can be used for the RX DDC downconversion or TX DUC upconversion, one at a time. The DDUC has a complex mixer, cascade integrator comb filter, resampler, and a programmable FIR filter. Each DDUC can support 1 to 12 channels. The TX path can be configured for one, two, or four antenna streams. In addition, with one or two antenna streams, an envelope modulator output is available. The DAC and envelope modulator share the same output ports. The TX input is from the baseband input, through the DDUC to create complex antenna streams. The CFR block provides for gain adjustment, peak reduction, and peak limiting. Additional interpolation stages after CFR expand the antenna stream bandwidth. Specialized capture logic collects the RX input, feedback input, RX output, CFR output, and DPD output for the DSP processor to support built-in test. The capture logic can also be used for performance monitoring and power measurement. AVAILABLE OPTIONS PART NUMBER TC PACKAGE THERMAL PROPERTIES GC6016IZEV –40°C to 85°C 484 ball 23-mm × 23-mm PBGA Heat transfer through package top GC6016 24 LVDS (1.8V) Power Meter, per Channel beAGC (RX Only) per Channel Farrow 1–1024´ ET NCO 24 LVDS (1.8V) Baseband Interface FIR 1´, 2´ 40 LVDS (1.8V) TX 1–2 Streams 1–12 Channel DDUC Block (config as TX or RX, showing TX) CIC 1–3´ Mux and Sum (TX) or Dist (RX) X Capture Buffer A UC 1/2´ CFR TX IF Mux and Sum X TX Eq BUC IF NCO 2´ Includes 40% BW, interp before or 90 dB stop after CFR, 80% BW, 90 dB stop 1/2/3/4´ 80% BW, 90 dB stop; 90% BW, 80 dB stop 40 LVDS (1.8V) 1–4 TX Streams Up to 8 DACs (2 40-Pin Ports) DVGA Format/ GPIO 16 CMOS (3.3V) Capture Buffer B TX Complex Gain per Channel ADC interface (port AB) Interval Based Power Meter Running Avg Power Meter RX 1/2/4 Streams I/Q Imbal Correction Eq (16 Taps) BDC IF NCO Switch R2C feAGC DC Offset Cancel ADC interface (port C) 1/2/4/8/16´ When I/Q correction enabled, IF NCO is disabled Control and Sync CMOS (3.3 V) 16 TX Format and DAC Interface 8 uP data uP addr 4 uP ctrl 2 INT TESTMOD, RESET HighSpeed Sync, Clocks JTAG CMOS (3.3 V) 2 Up to 8 ADCs (2 30-Pin Ports) 16 LVDS (1.8V) 1 ADC (1 16-Pin Port) DPD clk 2 LVDS Sync A, B in 4 LVDS Sync out 2 LVDS LVDS showing the number of pins; each signal is a diff. pair 4 SPI en, SPIDIO SPIDO SPI clk (SPARE) 60 LVDS (1.8V) JTAG B0445-02 NOTE: UC1 and UC2 are for CFR interpolation; UC2 can only be used if UC1 is also used. Figure 5. GC6016 Block Diagram GC6016 Introduction The GC6016 is a flexible transmit and receive digital signal processor that includes receiver and transmitter blocks, digital downconverter / upconverter (DDUC) blocks, crest factor reduction (CFR) engine, flexible LVDS data converter and baseband interfaces, and capture buffers for adaptive filtering algorithms. Each of the four DDUC blocks can be configured as either a digital downconverter (DDC) or a digital upconverter (DUC). Typically, a system can be implemented as both TX and RX, with both DDC and DUC functions. The DDUC blocks provide programmable FIR filters with flexible numbers of taps, depending on signal bandwidth and number of channels, as well as fractional resamplers, CIC filters, and complex mixers. The DDUC complex mixers support static or hopping tuning functions. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 5 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com beAGC after the DDC is part of the baseband interface. Static gain is applied in the BB block for both the DDC output and DUC input. The receiver block provides dc offset correction, front-end AGC, real-to-complex conversion, complex mixing, decimating filters, a complex equalizer, and a blind RX IQ imbalance correction function. The CFR block reduces the peak-to-average ratio (PAR) of complex, arbitrary TX signals. Reducing the PAR of the TX signal allows wireless-infrastructure (WI) base stations and repeaters to use smaller and lower-cost multi-carrier power amplifiers (MCPAs). In WI applications, the GC6016 meets multi-carrier 3G and 4G performance standards (PCDE, composite EVM, and ACLR) at PAR levels down to 6 dB for WCDMA and 7 dB for LTE. The GC6016 integrates easily into the transmit/receive signal chain between Texas Instruments’ high-performance data converters and baseband processors such as the TI TMS320C64xx family. In wireless repeater applications, the GC6016 can provide seamless interfaces to TI data converters, along with receive and transmit filtering, DDC, and DUC functions. The GC6016 is extremely flexible and can be used in system architectures with different signal types and TX-by-RX antenna configurations such as 2×2, 2×4, 4×4, and 4×8. The GC6016 EVM system provides an example sector transmit-receive signal chain solution, from the multi-carrier baseband to the RF antenna. ABSOLUTE MAXIMUM RATINGS over recommended operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD Core supply voltage –0.3 1.32 V VDDA PLL analog voltage –0.3 2 V VDDS Digital supply voltage for TX –0.3 2 V VDDSHV Digital supply voltage –0.3 3.6 V VIN Input voltage (under/overshoot) –0.5 VDDSHV + 0.5 Clamp current for an input/output –20 20 mA Storage temperature –65 140 °C Tstg (1) 6 ESD classification Class 2 (2.5 kV HBM, 500 V CDM, 150 V MM) Moisture sensitivity Moisture sensitivity Class 3 (1 week floor life at 30°C / 60% H) V Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com RECOMMENDED OPERATING CONDITIONS MIN VDD Core supply voltage 310 MHz, 5.7 A max. VDDA Analog supply for PLLs VDDS (1) (2) (3) TYP MAX UNIT 1.05 1.1 1.15 V 60 mA max. (each) (1) 1.71 1.8 1.89 V Digital supply voltage for LVDS I/O 700 mA max. (1) 1.71 1.8 1.89 V VDDSHV Digital supply voltage CMOS I/O PC board design dependent 3.15 3.3 3.45 V TC Case temperature –40 30 90 °C TJ Junction temperature 105 °C (1) (2) (3) (4) See (4) Chip specifications are production tested to 90°C case temperature. QA tests are performed at 85°C. Production tested hot using checksum at 310 MHz and maximum supplies. Power scales linearly with frequency with a dc consumption around 350 mA typical, 700 mA worst case. Power consumption is a strong function of the configuration. A calculator is available to estimate power for a specific configuration. Reliability calculations presume junction temperature 105°C or below. Operation above 105°C junction temperature reduces product lifetime. THERMAL INFORMATION GC6016 THERMAL METRIC ZEV UNIT 484 PINS Junction-to-ambient thermal resistance (1) θJA (2) 15.4 °C/W θJCtop Junction-to-case (top) thermal resistance 2.1 °C/W θJB Junction-to-board thermal resistance (3) 7.6 °C/W ψJT Junction-to-top characterization parameter (4) 0.5 °C/W ψJB Junction-to-board characterization parameter (5) 7.5 °C/W (6) N/A °C/W θJCbot (1) (2) (3) (4) (5) (6) Junction-to-case (bottom) thermal resistance The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 7 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Pin Assignment and Descriptions (Top View) 1 A NC 2 3 4 5 7 6 BBIN5P BBIN4P BBIN3P BBIN1P SPIDENB SPICLK 8 9 10 11 12 13 14 15 CEB UPA5 UPA2 UPD15 UPD12 UPD8 UPD5 UPD1 VSSA2 SYNCBN UPD0 16 18 19 20 21 22 SYNC OUTN SYNC OUTP TXA1N TXA2P NC A VDDA2 SYNCBP TXA0N TXA1P TXA2N TXA5N B 17 B BBIN7N BBIN7P BBIN5N BBIN4N BBIN3N BBIN1N SPIDIO INTERRPT UPA6 UPA3 WEB UPD13 UPD9 UPD6 UPD2 C BBIN8N BBIN8P BBIN6P BBIN6N VSSA1 BBIN2P BBIN0P EMIFENA UPA7 UPA4 UPA0 UPD14 UPD10 UPD7 UPD3 SYNCAPDPDCLKP TXA0P TXA3P TXA4P TXA4N TXA5P C VDDA1 BBIN2N BBIN0N VSS OEB VSS UPA1 VSS UPD11 VSS UPD4 SYNCAN DPDCLKN TXA3N TXA6N TXA7N TXA8N TXA9P D VDD VDD VDD VDD VDD VDD VDD VDD VDD NC NC TXA6P TXA7P TXA8P TXA9N E VDD VDDSHV1 VDD VDDSHV1 VDD VDDSHV1 VDD VDDS1 NC VDD TXA11N TXA11P TXA10N TXA10P F VDD TXA13P TXA13N TXA12P TXA12N G VDDS1 TXA15P TXA15N TXA14N TXA14P H TXA17P TXA17N TXA16N TXA16P J VDDS1 TXA19N TXA19P TXA18N TXA18P K D NC BBIN9N BBIN9P NC E BBOUT0P BBIN10P BBIN10N BBIN11P BBIN11N VDD F BBOUT0N BBOUT2N BBOUT2P BBOUT1N BBOUT1P NC G BBOUT4N BBOUT4P BBOUT3N BBOUT3P VDDS2 VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDD VDDS2 VDDSHV1 H BBOUT6N BBOUT6P BBOUT5N BBOUT5P VDD VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS J VDD VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDD TXB1P TXB1N TXB0P TXB0N L M RXA13N RXA12P RXA11N RXA11P VDDS2 VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDS1 TXB3P TXB3N TXB2P TXB2N M N RXA12N RXA10P RXA9N BBOUT8N BBOUT8P BBOUT7N BBOUT7P K BBOUT10NBBOUT10P BBOUT9N BBOUT9P VDDS2 L RXA13P RXA14N RXA14P BBOUT11P BBOUT11N VDD RXA9P VDD VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDD TXB5P TXB5N TXB4P TXB4N N P RXA10N RXA8N RXA8P RXA7N RXA7P VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDD TXB7P TXB7N TXB6P TXB6N P R RXA6N RXA6P RXA5N RXA5P VDD VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDS1 TXB9P TXB9N TXB8P TXB8N R T RXA4N RXA3N RXA3P RXA2N RXA2P VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDD TXB11P TXB11N TXB10P TXB10N T U RXA4P RXA1P RXA0N RXA0P VDD NC VDDS2 VDD VDDSHV2 VDD VDDSHV2 VDD VDDSHV2 VDD VDD VDDS1 NC VDD TXB13P TXB13N TXB12P TXB12N U V RXA1N RXB14N RXB10N RXB10P NC NC VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD NC NC TXB15P TXB15N TXB14N TXB14P V RXB6P RXB6N RXB4P RXB2P VPP VSS VPP VSS DVGA6 VSS TDO TMS RXC6N RXC4N NC TXB17P TXB17N TXB16P TXB16N W RXB13N RXB12N RXB8N RXB8P RXB5P RXB4N RXB2N VDDMON RESETB DVGA13 DVGA10 DVGA7 DVGA3 DVGA0 TDI RXC6P RXC5N RXC4P TXB19N TXB19P TXB18N TXB18P AA RXB12P RXB11P RXB9P RXB7N RXB5N RXB3P SPIDO RXB1N VSSMON (SPARE) DVGA14 DVGA11 DVGA8 DVGA4 DVGA1 TRSTB RXC7N RXC5P RXC3P RXC2N RXC2P RXC0N NC AA RXB11N RXB9N RXB7P NC RXB3N RXB1P RXB0P RXB0N TESTMOD DVGA15 DVGA12 DVGA9 DVGA5 DVGA2 TCK RXC7P RXC3N RXC1N RXC1P RXC0P NC AB 4 5 6 7 8 14 15 16 17 18 19 20 21 22 W RXB14P RXB13P Y AB NC 1 2 NC 3 = 1.1 V 9 = 1.8 V, 3.3 V 10 11 12 13 Y = GND P0131-01 Figure 6. GC6016 Pinout (Top View) 8 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Pin Functions NAME NUMBER TYPE DESCRIPTION POWER AND BIASING VDD E6, E7, E8, E9, E10, E11, E12, E13, E14, E15, E16, F9, F11, F13, F15, F18, G18, H5, J5, J18, L18, N5, N18, P18, R5, T18, U5, U8, U10, U12, U14, U15, U18, V7, V8, V9, V10, V11, V12, V13, V14, V15, V16 PWR 1.1-V power supply VDDSHV2 U9, U11, U13 PWR 3.3-V power supply for CMOS I/O VDDSHV1 F8, F10, F12, F14 PWR 3.3-V power supply for CMOS I/O VDDS1 F16, H18, K18, M18, R18, U16, PWR 1.8-V power supply for LVDS I/O VDDS2 F7, G5, K5, M5, U7 PWR 1.8-V power supply for LVDS I/O VPP W8, W10 PWR 1.1-V E-fuse supply, connect to VDD VDDMON Y8 NC Do not connect, internal monitor point VSSMON AA8 NC Do not connect, internal monitor point VDDA2 B17 PWR 1.8-V power for PLL (requires filtering) VDDA1 D5 PWR 1.8-V power for PLL (requires filtering) VSSA2 A16 PWR Ground for PLL (requires filtering) VSSA1 C5 PWR Ground for PLL (requires filtering) VSS D8, D10, D12, D14, G6, G7. G8, G9, G10, G11, G12, G13, G14, G15, G16, G17, H6, H7, H8, H9, H10, H11, H12, H13, H14, H15, H16, H17, J6, J7, J8, J9,J10, J11, J12, J13, J14, J15, J16, J17, K6, K7, K8, K9, K10, K11, K12, K13, K14, K15, K16, K17, L6, L7, L8, L9, L10, L11, L12, L13, L14, L15, L16, L17, M6, M7, M8, M9, M10, M11, M12, M13, M14, M15, M16, M17, N6, N7, N8, N9, N10, N11, N12, N13, N14, N15, N16, N17, P6, P7, P8, P9, P10, P11, P12, P13, P14, P15, P16, P17, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, R16, R17, T6, T7, T8, T9, T10, T11, T12, T13, T14, T15, T16, T17,W9, W11, W13 PWR Ground NC E17, E18, F6, F17, U6, U17, V5, V6, V17, V18 NC No connection. Recommend connecting to ground NC A1, A22, D1, D4, W3, W18, AA22, AB1, AB5, AB22, NC No connection BASEBAND INPUT/OUTPUT BBIN[11:0]P E4, E2, D3, C2, B2, C3, A2, A3, A4, C6, A5, C7 I Baseband input – LVDS positive BBIN[11:0]N E5, E3, D2, C1, B1, C4, B3, B4, B5, D6, B6, D7 I Baseband input – LVDS negative BBOUT[11:0]P L4, K2, K4, J2, J4, H2, H4, G2, G4, F3, F5, E1 O Baseband output – LVDS positive BBOUT[11:0]N L5, K1, K3, J1, J3, H1, H3, G1, G3, F2, F4, F1 O Baseband output – LVDS negative TX DAC INTERFACE TXA[19:0]P K20, K22, J19, J22, H19, H22, G19, G21, F20, F22, D22, E21, E20, E19, C22, C20, C19, A21, B20, C18 O DAC TX port A – LVDS positive TXA[19:0]N K19, K21, J20, J21, H20, H21, G20, G22, F19, F21, E22, D21, D20, D19, B22, C21, D18, B21, A20, B19 O DAC TX port A – LVDS negative TXB[19:0]P Y20, Y22, W19, W21, V19, V22, U19, U21, T19, T21, R19, R21, P19, P21, N19, N21, M19, M21, L19, L21 O DAC TX port B – LVDS positive TXB[19:0]N Y19, Y21, W20, W22, V20, V21, U20, U22, T20, T22, R20, R22, P20, P22, N20, N22, M20, M22, L20, L22 O DAC TX port B – LVDS negative RX and FB ADC INTERFACE RXA[14:0]P L3, L1, M2, M4, N2, N4, P3, P5, R2, R4, U1, T3, T5, U2, U4 I ADC receive port A – LVDS positive RXA[14:0]N L2, M1, N1, M3, P1, N3, P2, P4, R1, R3, T1, T2, T4, V1, U3 I ADC receive port A – LVDS negative RXB[14:0]P W1, W2, AA1, AA2, V4, AA3, Y4, AB4, W4, Y5, W6, AA6, W7, AB7, AB8 I ADC receive port B – LVDS positive RXB[14:0]N V2, Y1, Y2, AB2, V3, AB3, Y3, AA4, W5, AA5, Y6, AB6, Y7, AA7, AB9 I ADC receive port B – LVDS negative RXC[7:0]P AB17, Y16, AA17, Y18, AA18, AA20, AB20, AB21 I ADC receive port C – LVDS positive RXC[7:0]N AA16, W16, Y17, W17, AB18, AA19, AB19, AA21 I ADC receive port C – LVDS negative Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 9 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Pin Functions (continued) NAME NUMBER TYPE DESCRIPTION DVGA INTERFACE DVGA[15:0] AB11, AA10, Y10, AB12, AA11, Y11, AB13, AA12, Y12, W12, AB14, AA13, Y13, AB15, AA14, Y14 O MPU INTERFACE UPD[15:0] A11, C12, B12, A12, D13, C13, B13, A13, C14, B14, A14, D15, C15, B15, A15, B16 I/O UPA[7:0] C9, B9, A9, C10, B10, A10, D11, C11 I WEB B11 I Write enable, active-low EMIFENA C8 I EMIFENA switches between address/data µP access and SPI access. Its value may be changed at any time, but both address/data access and SPI access must be idle during the change. Logic 1 = EMIF, logic 0 = SPI pin has internal pullup. OEB D9 I Read and output enable, active-low CEB A8 I Chip enable, active-low I JTAG reset (active-low); pull down if JTAG is not used. JTAG INTERFACE TRSTB AA15 TMS W15 I JTAG mode select TDO W14 O JTAG data out TDI Y15 I JTAG data in TCK AB16 I JTAG clock SPIDENB A6 I Serial interface enable SPICLK A7 I Serial interface clock SPIDIO B7 I/O Serial interface data SPIDO(SPARE) AA9 O Serial interface data out in four-wire SPI mode SPI INTERFACE MISCELLANEOUS TESTMOD AB10 I Test mode for GC6016, typically grounded RESETB Y9 I Chip reset – required – active-low INTERRPT B8 O Output interrupt DPDCLKP C17 I DPD CLK input – LVDS positive DPDCLKN D17 I DPD CLK input – LVDS negative SYNCOUTP A19 O Sync output – LVDS positive SYNCOUTN A18 O Sync output – LVDS negative SYNCAP C16 I Sync input A – LVDS positive SYNCAN D16 I Sync input A – LVDS negative SYNCBP B18 I Sync input B – LVDS positive SYNCBN A17 I Sync input B – LVDS negative Ferrite Bead R=0Ω 1.8V VDDA1 or VDDA2 50 Ω C = 0.1 μF C = 0.01 μF R=0Ω GND VSSA1 or VSSA2 50 Ω Ferrite Bead S0510-01 NOTE: 0-Ω R0603 resistor is used to accommodate series resistor if needed. Figure 7. GC6016 PLL Filtering 10 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com The two GC6016 PLLs require a filtered power supply. The supply can be generated by filtering the digital supply (VDDS1, VSSA1, VDDS2, and VSSA2). A representative filter is shown in Figure 7. The two PLLs should have separate filters that are located as close as is reasonable to their respective pins (especially the bypass capacitors). The ferrite beads should be series 50R (similar to Murata P/N: BLM31P500SPT, Description: IND FB BLM31P500SPT 50R 1206). Sub-Chip Descriptions Figure 8 shows the TX functional block diagram, and Figure 9 shows the RX functional block diagram. Note that each figure shows up to four DUC or DDC blocks in the TX or RX paths, and there are a total of four DDUC blocks that may be configured as either DUC or DDC each. TX BB TX BB Input Formatter NCO FIR 1´, 2´ Farrow 1–1024´ CIC 1–3´ X 1–2 Streams Mux and Sum UC 1/2´ CFR 80% BW, 90 dBstop UC 1/2/4´ TxEQ IF NCO BUC IF Sum 40% BW, Includes 90 dBstop 16-tap Eq DAC Output Formatter TX Block 1–12 Channel DUC Block 1 to 4 TX Streams 1/2/3/4´ 80% BW, 90 dBstop; 90% BW, 80% dB stop B0446-02 Figure 8. TX Functional Block Diagram 1/2/4 Streams RX BB RX BB Output Formatter NCO FIR 1´, 2x Farrow 1–1024´ CIC 1–3´ I/Q Imbalance Correction X RX Equalizer 16 Taps Mux X BDC 1/2/4/8/16´ When I/Q correction enabled, IF NCO is disabled IF Mux IF NCO X R2C; Format; feAGC; DC Offset Correction ADC Input Formatter RX Block 1–12 Channel DDC Block 1 to 9 ADC Inputs DVGA Outputs IF NCO B0447-01 Figure 9. RX Functional Block Diagram TX Baseband Input Formatter The TX baseband (BB) input-formatter block accepts TX baseband inputs from the FPGA or baseband processor and formats them for the DUC blocks. There are 12 unidirectional LVDS pairs for the TX input formatter, and their function depends on the operational mode. There are three operational modes for the TX BB input formatter: byte mode (B, 8 or 9 bits), nibble mode (N, 4 bits), and serial mode (S, 2 bits) to allow multiple BB input rates. The GC6016 can accept up to three different BB input data rates. Table 2 and Table 3 summarize each mode and the pin assignments. In Table 3, BBIN[X] is the BBIN differential pair (assumed positive and negative connections), and BB0, BB1, and BB2 represent three different TX baseband ports at arbitrary rates. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 11 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Table 2. TX BB Formatter Modes MODE DESCRIPTION Total Number of Interface Pins Maximum Complex Interface Rate per Channel N is the number of channels. 1B Byte mode, 1 interface rate 10 or 11 = 8 or 9 data + 1 clk + 1 sync (Clk × 4/4)/N; maximum 192.31 MSPS total (for all channels) 1N Nibble mode, 1 interface rate 6 = 4 data + 1 clk + 1 sync (Clk × 4/8)/N; maximum 125 (Nibble 0), 96.15 (Nibble 1) MSPS total 1S Serial mode, 1 interface rate 4 = 2 data + 1 clk + 1 sync (Clk × 4/16)/N; maximum 48.07 MSPS total 2N Nibble mode, 2 interface rates 12 = 4 data + 1 clk + 1 sync + 4 data + 1 clk + 1 sync (Clk × 4/8)/N × 2; maximum 221.15 MSPS total 2N’ (1) Nibble + byte mode, 2 interface rates, RX-ADC input pins used for byte-mode port. 16 = 4 data + 1 clk + 1 sync + 8 data + 1 clk + 1 sync Nibble port: (Clk × 4/8)/N; maximum 125 MSPS total Byte port: (Clk × 2/4)/N; maximum 125, 250 MSPS total 2S Serial mode, 2 interface rates 8 = 2 data + 1 clk + 1 sync + 2 data + 1 clk + 1 sync (Clk × 4/16)/N; maximum 96.15 MSPS total 3S Serial mode, 3 interface rates 12 = 2 data + 1 clk+1 sync + 2 data (Clk × 4/16)/N; maximum 144.23 MSPS total + 1 clk + 1 sync + 2 data + 1 clk + 1 sync (1) 2N’ is the only configuration that allows a special mode to re-use RX input port A as baseband TX inputs Table 3. TX BB Pin Assignments LVDS PAIR BBI[11:0] BYTE MODE NIBBLE MODE SERIAL MODE BBIN[0] pos. and neg. BB0_DATA_0 BB0_DATA_0 BB0_DATA_0 BBIN[1] pos. and neg. BB0_DATA_1 BB0_DATA_1 BB0_DATA_1 BBIN[2] pos. and neg. BB0_DATA_2 BB0_SYNC BB0_SYNC BBIN[3] pos. and neg. Spare BB0_CLOCK BB0_CLOCK BBIN[4] pos. and neg. BB0_DATA_3 BB0_DATA_2 BB1_DATA_0 BBIN[5] pos. and neg. BB0_DATA_4 BB0_DATA_3 BB1_DATA_1 BBIN[6] pos. and neg. BB0_SYNC BB1_SYNC BB1_SYNC BBIN[7] pos. and neg. BB0_CLOCK BB1_CLOCK BB1_CLOCK BBIN[8] pos. and neg. BB0_DATA_5 BB1_DATA_0 BB2_DATA_0 BBIN[9] pos. and neg. BB0_DATA_6 BB1_DATA_1 BB2_DATA_1 BBIN[10] pos. and neg. BB0_DATA_7 BB1_DATA_2 BB2_SYNC BBIN[11] pos. and neg. BB0_DATA_8 BB1_DATA_3 BB2_CLOCK Number of BBdata streams 1 2 3 Number of DDR clocks to transfer 1 complex sample 2 4 8 The actual data transfer rate in nibble mode is 2 times higher than the byte mode for the same total throughput. If two ports are required (e.g., to support two different sample rates), and a lower speed on the interface is desired, the GC6016 can re-use the RX ADC input port A as a baseband TX input bus. RX ADC port A has 15 pairs of LVDS input pins and supports one set of baseband input data in byte mode. When RX port A is used as a baseband TX input, it cannot be also used as an RX input port. The baseband interface supports a full-clock or gated-clock format. These formats are shown in Figure 10 The mapping for the RX port A pins when in BB TX input mode is: • RXA14: clock • RXA13: sync • RXA12–5: BB0_DATA7–0 12 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com BBIN Clk 0 BBIN Sync 0 I0-O I0-E Q0-O Q0-E I1-O I1-E Q1-O Q1-E In-O In-E Qn-O Qn-E 00 I0-O I0-E Q0-O Q0-E Mode 1B BBIN Data 0 ‘n’ can be up to 47, ‘O’ is odd numbered bits (1, 3, 5, ...), ‘E’ is even numbered bits (0, 2, 4, ...) BBIN Clk 0 BBIN Sync 0 I0-A I0-B I0-C I0-D Q0-A Q0-B Q0-C Q0-D In-A In-B In-C In-D Qn-A Qn-B Qn-C Qn-D 00 I0-A BBIN Data 0 Mode 1N (1 Rate) Mode 2N (2 Rates) BBIN Clk 1 BBIN Sync 1 I0-A I0-B I0-C I0-D Q0-A Q0-B Q0-C Q0-D In-A In-B In-C In-D Qn-A Qn-B Qn-C Qn-D 00 I0-A BBIN Data 1 ‘n’ can be up to 47, ‘A’ is 4 MSBs, ‘B’ is next 4 bits, ‘C’ is next 4 bits and ‘D’ is 4 LSBs BBIN Clk 0 BBIN Sync 0 I0-A I0-B I0-C I0-D I0-E I0-F I0-G I0-H Qn-A Qn-B Qn-C Qn-D Qn-E Qn-F Qn-G Qn-H 00 I0-A BBIN Data 0 BBIN Clk 1 BBIN Sync 1 I0-A I0-B I0-C I0-D I0-E I0-F I0-G I0-H Qn-A Qn-B Qn-C Qn-D Qn-E Qn-F Qn-G Qn-H 00 I0-A Mode 1S (1 Rate) Mode 2S (2 Rates) Mode 3S (3 Rates) BBIN Data 1 BBIN Clk 2 BBIN Sync 2 I0-A I0-B I0-C I0-D I0-E I0-F I0-G I0-H Qn-A Qn-B Qn-C Qn-D Qn-E Qn-F Qn-G Qn-H 00 I0-A BBIN Data 2 ‘n’ can be up to 47, ‘A’ is 2 MSBs, ‘B’ is next 2 bits, ‘C’ is next 2 bits, ... and ‘H’ is 2 LSBs T0504-01 Figure 10. TX BB Formats The TX formatter block includes a per-channel TX gain adjust via a 16-bit complex digital word which can be set to have gain between –∞ and 9 dB. Digital Down- and Upconverters (DDUCs) The GC6016 has four identical and independent DDUC blocks that can be configured as either DDC or DUC. Each DDUC can support up to 12 channels with scalable bandwidth. The only difference between the DUC and DDC configurations is the interpolate (DUC) versus decimate (DDC) functions and the data path direction as shown in Figure 11. Both DDC and DUC are described in this section. Note that each DDUC block must be configured statically as a DUC or DDC and cannot switch modes dynamically in TDD applications. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 13 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com 1–12 Channel DUC Block NCO From BB Interface Block FIR 1´, 2´ Farrow 1–1024´ CIC 1–3´ X To Mux and Sum Block Mixer All 3 Blocks Interpolate DUC Configuration 1–12 Channel DDC Block NCO To BB Interface Block FIR 1´, 2´ Farrow 1–1024´ CIC 1–3´ X From Distributor Block Mixer All 3 Blocks Decimate DDC Configuration B0448-01 Figure 11. DUC and DDC Functional Block Diagram In combination with the follow-on mux and sum block, the DUC block interpolates, filters, mixes each carrier, and combines multiple channels into one to four wideband, composite TX signal streams. Any input channel can be mapped to any TX stream in the mux and sum block. The DDC configuration accepts an RX stream from the distributor block and provides mixing, decimation filtering, fractional resampling, and filtering to RX channels. The RX block outputs are mapped to the mixer CIC stream via the distributor block. Each DDUC block contains a finite impulse response (FIR) filter, a fractional resampler (Farrow filter), a cascaded integrator-comb (CIC) filter, a complex mixer and NCO for channel placement in the composite stream, and a programmable frequency hopper (see Figure 11). The number of taps available in the FIR filter depends on various parameters such as the BBclk rate (derived from DPDCLK) , input sample rate, interpolate and decimate settings, and number of channels. Different tap values may be used for each channel (however, that reduces the number of filter taps available). Note that the input sample rate is the input from the TX BB input formatter for the DUC configuration and the input from the distributor block for DDC configuration. The number of taps for various wireless standards and configurations is shown in Table 4. The Farrow filter supports one real channel or 1–12 complex channels and can be configured for any resampling ratio from 1 to 1024 with 32-bit resolution. A different delay value for each channel is supported. The Farrow filter is used to resample different TX BB input sample rates to a common CFR rate, and it provides 95-dB rejection at ±0.25 output fS (sample rate), 83-dB rejection at ±0.375 output fS, and 56-dB rejection at ±0.4 output fS. The CIC interpolates or decimates by a factor of 1, 2, or 3. If each DDUC must support more than eight carriers, the CIC must interpolate/decimate by 3. If each DDUC must support between four and eight carriers, the CIC can interpolate/decimate by 2 or 3. If each DDUC must support fewer than four carriers, the CIC can interpolate by 1, 2, or 3. 14 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com The NCO contains a 48-bit frequency word and 48-bit accumulator, and operates at the DUC output sample rate. The minimum resolution is the DUC output sample rate or DDC input sample rate divided by 248, or about 0.2 μHz for a 61.44-MSPS DUC output rate. The mixer and NCO can be used for frequency planning or fine frequency control. Per-channel phase can be adjusted in the mixer/NCO block with a 16-bit phase word, while per channel fractional delay can be adjusted in the Farrow block. Table 4. Number of FIR Filter Taps for Example Signal Types Input Sample Rate Filter Type MHz lte20_1 DUC Mode Interp. DDC Mode Decim. MSPS Sym or Un-Sym 1 or 2 1 or 2 245.76 30.72 S 1 lte20_2 245.76 30.72 S lte10_2 245.76 15.36 S lte10_3 245.76 15.36 lte10_4 245.76 15.36 lte5_4 245.76 lte5_8 245.76 wimax20_r3 BBclk No. of Channels Max. Taps 1 1 159 1 1 2 79 1 1 2 159 S 1 1 3 99 S 1 1 4 79 7.68 S 1 1 4 159 7.68 S 1 1 8 79 246.4 44.8 S 1 2 3 59 wimax20_t3 246.4 22.4 S 2 1 3 39 wimax20_r2 246.4 44.8 S 1 2 2 99 wimax20_t2 246.4 22.4 S 2 1 2 79 wimax20_r1 246.4 44.8 S 1 2 1 219 wimax20_t1 246.4 22.4 S 2 1 1 199 wimax10_r2 246.4 22.4 S 1 2 2 219 wimax10_t2 246.4 11.2 S 2 1 2 199 wimax10_r3 246.4 22.4 S 1 2 3 139 wimax10_t3 246.4 11.2 S 2 1 3 119 wimax10_r4 246.4 22.4 S 1 2 4 99 wimax10_t4 246.4 11.2 S 2 1 4 79 wimax5_r4 246.4 11.2 S 1 2 4 219 wimax5_t4 246.4 5.6 S 2 1 4 199 wimax5_r8 246.4 11.2 S 1 2 8 99 wimax5_t8 246.4 5.6 S 2 1 8 79 wbcdma_r4 245.76 7.68 S 1 1 4 159 wbcdma_t4 245.76 3.84 S 2 1 4 319 wbcdma_r8 245.76 7.68 S 1 1 8 79 wbcdma_t8 245.76 3.84 S 2 1 8 159 cdma_r12 245.76 2.4576 S 1 1 12 99 cdma_t12 245.76 1.2288 U 2 1 12 100 tdscdma_r12 245.76 2.56 S 1 1 12 99 tdscdma_t12 245.76 1.28 S 2 1 12 199 gsm_12 243.8 0.5417 S 1 1 12 99 eedge_12 243.8 1.625 S 1 1 12 99 wideband_60MHz_r 250 75 S 1 1 1 59 wideband_60MHz_t 250 75 S 2 1 1 39 Name Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 15 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com MUX and SUM (TX Direction) The MUX and SUM block maps any channel from the DUC to any TX stream for subsequent per-stream processing. Crest Factor Reduction (CFR) The CFR blocks include the CFR function and two interpolate-by-2 filters (referred to here as UC1 and UC2). The two CFR blocks together can support 1, 2, or 4 TX streams. The CFR function selectively reduces the peak-to-average ratio (PAR) of wideband digital signals provided in quadrature (I and Q) format, such as those used in 3G and 4G wireless applications. For example, the CFR function can reduce the PAR of WCDMA Test Model 1 signals to 5.7 dB, while still meeting all 3GPP requirements for ACLR, composite EVM, and peak code domain error (PCDE). The CFR blocks can be configured in eleven different modes, depending on the number of TX streams, and the signal sample rates. Relative to previous TI CFR products, the GC6016 CFR has enhanced features such as: • Constant PAR mode • Constant input-to-output power mode • Dynamic PAR target levels for different portions of the time-domain signal • Up to 25% less latency for certain configurations • Enhanced CFR performance for narrowband signals • Automatic (i.e., no host interaction required) CFR coefficient generation for frequency-hopping signals The UC1 and UC2 blocks can be set to 1× or 2× interpolation and may be used to provide optimum selection of signal oversampling ratio at CFR. UC1 may be positioned before or after the CFR function, while UC2 is always at the output of CFR. Since UC2 has only a 40% bandwidth image rejection (90 dB) filter, it is only used if preceded by UC1, which has an 80% bandwidth image-rejection (90 dB) filter. TX IF Sub-Chip The TX IF sub-chip includes a bulk upconverter (BUC), four IF mixer/NCO blocks, and TX stream MUX and SUM. The BUC block has interpolations of 1×, 1.5×, 2×, 3×, and 4×. NOTE BUC 1.5× is a combination of the BUC 3× interpolation and output-format decimation of 2. There are four parallel NCO/MIX blocks to allow frequency translation of each composite TX stream. The NCO is 48 bits and is referenced to the TX output rate. The NCO/MIX block (change) can be used to modify the stream IF frequency. The TX stream MUX and SUM block allows summing of TX streams to create composite TX streams. TX DAC Formatter The DAC output consists of two 20-pair LVDS blocks that can be configured by the DAC formatter block for several TI DACs and system configurations. The formatter can support up to 8 DACs for 4 TX streams in complex mode. The DAC formatter block supports the TI DAC5682, DAC328x, and DAC348x families. Table 5 illustrates the pin connections the different DAC and envelope [ET] modulator types. 16 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Table 5. GC6016 DAC Interface Pin Map GC6016 328x (ET) 3482 Byte 5682 3484 3482 Word TXA0 P1-d7 P1-d7 P1-sync P1-sync P1-sync TXA1 P1-d6 P1-d6 P1-d15 P1-d15 P1-d15 TXA2 P1-d5 P1-d5 P1-d14 P1-d14 P1-d14 TXA3 P1-d4 P1-d4 P1-d13 P1-d13 P1-d13 TXA4 P1-dataclk P1-dataclk P1-d12 P1-d12 P1-d12 TXA5 P1-frame P1-frame P1-d11 P1-d11 P1-d11 TXA6 P1-d3 P1-d3 P1-d10 P1-d10 P1-d10 TXA7 P1-d2 P1-d2 P1-d9 P1-d9 P1-d9 TXA8 P1-d1 P1-d1 P1-d8 P1-d8 P1-d8 TXA9 P1-d0 P1-d0 P1-dataclk P1-dataclk P1-dataclk TXA10 P2-d7 P2-d7 NA P1-frame NA TXA11 P2-d6 P2-d6 P1-d7 P1-d7 P1-d7 TXA12 P2-d5 P2-d5 P1-d6 P1-d6 P1-d6 TXA13 P2-d4 P2-d4 P1-d5 P1-d5 P1-d5 TXA14 P2-dataclk P2-dataclk P1-d4 P1-d4 P1-d4 TXA15 P2-frame P2-frame P1-d3 P1-d3 P1-d3 TXA16 P2-d3 P2-d3 P1-d2 P1-d2 P1-d2 TXA17 P2-d2 P2-d2 P1-d1 P1-d1 P1-d1 TXA18 P2-d1 P2-d1 P1-d0 P1-d0 P1-d0 TXA19 P2-d0 P2-d0 NA P1-parity P1-parity TXB0 P3-d7 P3-d7 P2- sync P2-sync P2-sync TXB1 P3-d6 P3-d6 P2-d15 P2-d15 P2-d15 TXB2 P3-d5 P3-d5 P2-d14 P2-d14 P2-d14 TXB3 P3-d4 P3-d4 P2-d13 P2-d13 P2-d13 TXB4 P3-dataclk P3-dataclk P2-d12 P2-d12 P2-d12 TXB5 P3-frame P3-frame P2-d11 P2-d11 P2-d11 TXB6 P3-d3 P3-d3 P2-d10 P2-d10 P2-d10 TXB7 P3-d2 P3-d2 P2-d9 P2-d9 P2-d9 TXB8 P3-d1 P3-d1 P2-d8 P2-d8 P2-d8 TXB9 P3-d0 P3-d0 P2-dataclk P2-dataclk P2-dataclk TXB10 P4-d7 P4-d7 NA P2-frame NA TXB11 P4-d6 P4-d6 P2-d7 P2-d7 P2-d7 TXB12 P4-d5 P4-d5 P2-d6 P2-d6 P2-d6 TXB13 P4-d4 P4-d4 P2-d5 P2-d5 P2-d5 TXB14 P4-dataclk P4-dataclk P2-d4 P2-d4 P2-d4 TXB15 P4-frame P4-frame P2-d3 P2-d3 P2-d3 TXB16 P4-d3 P4-d3 P2-d2 P2-d2 P2-d2 TXB17 P4-d2 P4-d2 P2-d1 P2-d1 P2-d1 TXB18 P4-d1 P4-d1 P2-d0 P2-d0 P2-d0 TXB19 P4-d0 P4-d0 NA P2-parity P2-parity Note: P1, P2, P3, and P4 are used to identify a specific DAC port. Different ports have different timing. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 17 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com RX ADC Formatter There are three ADC input ports: two 15-pair LVDS ports (referred to as ports A and B) and one 8-pair LVDS port (referred to as port C and typically used for the DPD feedback path). Depending on the ADCs selected, these three ports can accommodate up to 17 ADCs (e.g., using two octals and a single). The formatter block can route any port to either the capture buffer block or the RX signal processing blocks. The pin connections for the ADCs are shown in Table 6. The GC6016 works seamlessly with the following TI ADCs. Single: 5400, 12-bit, 1 GSPS, may need special routing on the PCB. 5463, 12-bit, 500 MSPS, may need clock-to-data-skew special routing on the PCB. 54RF63, 12-bit, 550 MSPS, may need clock-to-data-skew special routing on the PCB. 5474, 14-bit, 400 MSPS, may need clock clock-to-data-skew special routing on the PCB. 5493, 16-bit, 130 MSPS 548x, 16-bit, 80-200 MSPS 612x, 12-bit, 65–250 MSPS 614x, 14-bit, 65-250 MSPS 58B18, 11-bit, 200 MSPS 414x, 14-bit, 160–250 MSPS 412x, 12-bit, 160–250 MSPS 552x, 12-bit, 170–210 MSPS 554x, 14-bit, 170–210 MSPS 5517, 11-bit, 200 MSPS Dual: 62c15, 11-bit, 125 MSPS 62c17, 11-bit, 200 MSPS 58c28, 11-bit, 200 MSPS 62p4x, 14-bit, 65-250 MSPS 62p2x, 12-bit, 65-250 MSPS 624x, 14-bit, 65-125 MSPS 622x, 12-bit, 65-125 MSPS Quad: 642x, 12-bit, 65–125 MSPS 644x, 14-bit, 65–125 MSPS Octal: 527x, 12-bit, 65 MSPS 528x, 12-bit, 65 MSPS 18 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Table 6. GC6016 ADC Interface Pin Map 58c48 42x9 64p4x 62p4x 62c15 5463 5444 5474 5400L 5400R 642x 644x 0 0 0 [12] (1) syncout [istrobe] RXA1 2 2 1 11 0 RXA2 4 4 2 10 1 d1 b1 RXA3 6 0 6 3 9 2 d0 b0 RXA4 8 2 8 4 8 3 c1 RXA5 10 4 10 5 7 4 c0 GC6016 Pin Name 58b18 5517 4149 61B49 5547 RXA0 (1) 548x 6145 527x 528x Two 624x f c0 a1 RXA6 12 6 12 6 6 5 frame c1 a0 RXA7 clk clk clk 7 clk clk clk clk clk RXA8 [14] 8 0 8 5 6 b1 c2 RXA9 10 2 9 4 7 b0 c3 b1 RXA10 12 4 10 3 8 a1 c4 b0 RXA11 14 6 11 2 9 a0 c5 f RXA12 8 12 1 10 c6 a1 RXA13 10 13 0 11 c7 a0 12 clk syncout [12] fr clk RXA14 [istrobe] [istrobe] RXB0 0 0 0 [12] syncout RXB1 2 2 1 11 0 RXB2 4 4 2 10 1 RXB3 6 0 6 3 9 2 RXB4 8 2 8 4 8 3 RXB5 10 4 10 5 7 4 RXB6 12 6 12 6 6 5 RXB7 clk clk clk 7 clk clk RXB8 [14] 8 0 8 5 6 RXB9 10 2 9 4 7 RXB10 12 4 10 3 8 RXB11 14 6 11 2 9 RXB12 8 12 1 10 RXB13 10 13 0 11 12 clk syncout [12] RXB14 [istrobe] RXC0 0 RXC1 2 RXC2 4 RXC3 6 RXC4 8 RXC5 10 RXC6 12 RXC7 clk [istrobe] [ ] indicates assignment if pins available Feedback Processing The feedback path is input to RXC as a real ADC. This is captured in the capture buffer and sent to the DSP. In cases where a higher-rate real ADC (>250 Msps) or a complex feedback path is desired, for better feedback performance, one of the RX ADC inputs can be used for the feedback path, and one RX ADC input is used for the RX path. Note: both RX downconverters can still be used for the RX path, or one can be used for feedback. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 19 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com The widest-band feedback is seen directly from the ADC interface to the capture buffer. RX Sub-Chips Each of two RX sub-chips consists of the following blocks (each block may be optionally bypassed), which operate on a per-stream basis: • DC offset cancellation • Front-end automatic gain control (feAGC) • Real-to-Complex (R2C) conversion • Switch for replicating or moving streams across the four paths (per sub-chip) • IF NCO for complex mixing (frequency translation) • Bulk downconverter (BDC) • Equalizer • IQ imbalance correction DC offset cancellation The dc offset canceller can be programmed to integrate a number of input samples automatically, divide by a power of 2, and subtract the mean offset or a programmed offset from the input. The input can be real or complex. Each input ADC has a separate cancellation for each RX block channel. Front-end AGC The feAGC block is used to control the RX ADC input level by controlling an external DVGA. The feAGC has multiple channels in each RX block: • 1 real stream up to 4 × DPD clock rate (only use one block) • 2 real (using both blocks) or 1 complex stream (only use one block) up to 2 × DPD clock rate each • 4 real or 2 complex streams up to DPD clock rate each (uses both blocks) • 8 real or 4 complex streams up to 1/2 DPD clock rate each (uses both blocks) The feAGC has both threshold comparison and an integrated power measurement. The feAGC has an error accumulation. The error accumulation can be mapped to a specific ADC desired operating point. The integral controller outputs the DVGA value to control the ADC input. DVGA controls are mapped to the specific DVGA outputs, supporting multiple DVGA types. Multipliers in the data path can be used to compensate for external DVGA gain changes (from the feAGC output control word). A delay block aligns the gain value applied to the internal multiplier with the point in time on the data samples where the external gain change was applied. Use of this multiplier minimizes gain steps that would cause transients in the downstream digital filters and allows relative power measurements on the digital signals. The AGC operation may be suspended during certain conditions. The internal controlled-delay AGC update and special clock gating can be used to suspend the AGC operation. The control word outputs from the feAGC blocks are applied to external DVGA parts via the DVGA pins. There are 16 DVGA pins (3.3-V CMOS) which may be individually configured as DVGA output signals or GPIO (input or output) signals. When used as DVGA control signals, there are two modes: • Transparent mode – parallel output words are connected directly to DVGAs that are being used in a mode without a clock or latch signal to clock-in the gain word. This is the minimum latency mode. There can be two ports of 8 bits each, three ports of 5 bits each, four ports of 4 bits each, or five ports of 3 bits each. • Clocked mode – eight latch enable (LE) signals and one 8-bit output word. This mode allows up to eight control signals, up to 8 bits each, but with increased latency. The LE signal may be a positive or negative pulse, with programmable width. R2C In the real-to-complex conversion block, real signal inputs are up- or downconverted by fS/4, filtered to isolate the selected sideband, and decimated by a factor of 2. Real-to-complex conversion is bypassed for complex inputs. The rejection of the R2C decimation filter is: • For 90% bandwidth signal, –68 dB, stop band • For 80% bandwidth signal, –106 dB, stop band Switch 20 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Any of the up to eight complex RX antenna/signal inputs across both sub-chips may be switched to one or more of the up to 4 output streams of each sub-chip. IF NCO The NCO/mixer block generates in-phase and quadrature sinusoidal signals (cos/sin) and mixes them with the switched antenna streams to frequency-translate the RX signals. The NCO contains a 48-bit frequency word and 48-bit accumulator. BDC The BDC supports the following modes and sample rates at its input (across both sub-chips): • Single – 4 × DPD clock rate real, 2× DPD clock rate complex • Dual – 2 × DPD clock rate real, DPD clock rate complex • Quad – DPD clock rate real, 1/2 DPD clock rate complex • Octal – 1/2 DPD clock rate real Total decimation factors may be 1, 2, 4, 8, or 16. The decimation filtering is achieved with the cascade of the real-to-complex filter (R2C), a fixed filter F1, and a fixed filter F2. The rejection of the F1 and F2 filters is: • Filter F1 (decimate by 1 or 2) – If used, always followed by filter F2, so relaxed requirements – 45% bandwidth, –107 dB stopband • Filter F2 – Recirculated 1–3 times to provide 2, 4, or 8× decimation factor – 90% bandwidth, –75 dB, stop band – 80% bandwidth, –106 dB, stop band Equalizer The receive equalizer is full-complex 16-tap filter that performs the following signal-processing functions: • Programmable spectral inversion at the input • Equalization of analog signal paths • Channel equalization for repeater applications • Gain/phase/fractional delay adjust (MIMO/smart antenna support) • Fixed dc offset compensation at the output Independent complex coefficients for real and imaginary signal data allow full flexibility for independent equalization of the direct- and cross-IQ signal components, as well as frequency-dependent IQ gain and phase imbalance compensation. The programmable 16-bit coefficient sets (i.e., Cii, Cqq, Ciq and Cqi, for each tap) can be updated on the fly. IQ imbalance correction Automatic correction of IQ imbalance is provided with a 1-tap blind adaptive algorithm. The correction coefficients also may be programmed to fixed values. This block supports programmable integration intervals and flexible gating of loop operation. RX Distributor The outputs from the RX sub-chips are routed to the RX distributor block, which enables arbitrary assignment of RX streams to DDC channels and blocks. RX Baseband Output Formatter The RX baseband (BB) output formatter block accepts data from the DDC and formats the data for output on the BB LVDS pins. A back-end AGC (beAGC) function is included that optionally adjusts the gain of each channel and provides multiple format options. There are 12 unidirectional LVDS pairs for the RX BB interface. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 21 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Back-end AGC The beAGC function is available for receive channels from DDUC3 and DDUC2 (DDUC1 and DDUC0 may also be used for receive—with the formats as described following—but without the beAGC function). When the floating-point format is selected (described following), the beAGC is not used. For the fixed-point formats, the beAGC may be on or off. There are separate beAGC blocks associated with DDUC3 and DDUC2, and each block can process up to 12 channels. Within a block, there are two sets of control parameters. This provides support for two different signal types sharing the same DDUC block. Each channel may have a programmable-gain starting point or a fixed gain, and there is a per-channel flexible gating signal to control freeze/operate intervals for TDD signal types. The beAGC has approximately a 100 dB dynamic range. The beAGC algorithm adjusts the gain to drive the median magnitude of gain-loop output data to a target threshold value. There are four step-sizes used (two for above and two for below the threshold), depending on distance from the threshold value. Output formatter There are three operational modes for the RX BB output formatter: byte mode (B, 9 bits), nibble mode (N, 4 bits), and serial mode (S, 2 bits). The nibble and serial modes allow multiple BB output rates and the use of fewer pins on the interface. The GC6016 can provide up to three different BB output data rates. Table 7 and Table 8 summarize the different modes and pin assignments for the byte, nibble, and serial modes. As can be seen in Table 8, there are two data formats supported: • Floating point (indicated with an F in the mode label; 14- or 16-bit mantissa, 4-bit exponent) • Fixed point without gain word (16- or 18-bit options) In Table 8, BBOUT[X] is the BBOUT differential pair (assumed positive and negative connections), and BB0, BB1, and BB2 represent three different RX differential baseband input signals that can be at arbitrary rates. Figure 12 shows the BB output formats. The maximum-data-rate configurations have the DDR clock out transitioning synchronously with the data (referred to as DDR Mode 0 in the table). At half the maximum possible data rate (referred to as DDR Mode 1 in the table) and a quarter of the maximum possible data rate (referred to as DDR Mode 2 in the table), the DDR clock out transitions in the middle of the data-steady time . Table 7. RX BB Formatter Modes MODE Description Total Number of Interface Pins Maximum Complex Interface Rate per Channel N is the number of channels 1B 1 interface rate (up to 18 bits) 11 = 9 data + 1 clk + 1 sync (Clk4/4)/N/2; maximum 125 MSPS total (for all channels) 1BF 1 interface rate (up to 16 bits) + exponent (4 bits) 10 = 8 data + 1 clk + 1 sync (Clk4/4)/N/2; maximum 125 MSPS total (for all channels) 1N 1 interface rate (16 bits) 6 = 4 data + 1 clk + 1 sync (Clk4/8)/N; maximum 96.15 (Nibble0), 125 (Nibble1) MSPS total 1NF 1 interface rate (14 bits) + exponent (4 bits) 6 = 4 data + 1 clk + 1 sync (Clk4/8)/N; maximum 96.15 (Nibble0), 125 (Nibble1) MSPS total 1S 1 interface rate (16 bits) 4 = 2 data + 1 clk + 1 sync (Clk4/16)/N; maximum 48.07 MSPS total 1SF 1 interface rate (14 bits) + exponent (4 bits) 4 = 2 data + 1 clk + 1 sync (Clk4/16)/N; maximum 48.07 MSPS total 2N 2 interface rates (16 bits) 12 = 4 data + 1 clk + 1 sync + 4 data + 1 clk + 1 sync (Clk4/8)/N; maximum 221.15 MSPS total 2NF 2 interface rates (14 bits) + exponent (4 bits) 12 = 4 data + 1 clk + 1 sync + 4 data + 1 clk + 1 sync (Clk4/8)/N; maximum 221.15 MSPS total 2S 2 interface rates (16 bits) 8 = 2 data + 1 clk + 1 sync + 2 data + 1 clk + 1 sync (Clk4/16)/N; maximum 96.15 MSPS total 2SF 2 interface rates (14 bits)+ exponent (4 bits) 8 = 2 data + 1 clk + 1 sync + 2 data + 1 clk + 1 sync (Clk4/16)/N; maximum 96.15 MSPS total 3S 3 interface rates (16 bits) 12 = 2 data + 1 clk + 1 sync + 2 data + 1 clk + 1 sync + 2 data + 1 clk + 1 sync (Clk4/16)/N; maximum 144.23 MSPS total 3SF 3 interface rates (14 bits)+ exponent (4 bits) 12 = 2 data + 1 clk + 1 sync + 2 data + 1 clk + 1 sync + 2 data + 1 clk + 1sync (Clk4/16)/N; maximum 144.23 MSPS total 22 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Table 8. RX BB Pin Assignments LVDS Pair BBI[11:0] Byte Mode Nibble Mode Serial Mode BBOUT[0] pos. and neg. BB0_DATA_0 BB0_DATA_0 BB0_DATA_0 BBOUT[1] pos. and neg. BB0_DATA_1 BB0_DATA_1 BB0_DATA_1 BBOUT[2] pos. and neg. BB0_DATA_2 BB0_SYNC BB0_SYNC BBOUT[3] pos. and neg. Spare BB0_CLOCK BB0_CLOCK BBOUT[4] pos. and neg. BB0_DATA_3 BB0_DATA_2 BB1_DATA_0 BBOUT[5] pos. and neg. BB0_DATA_4 BB0_DATA_3 BB1_DATA_1 BBOUT[6] pos. and neg. BB0_SYNC BB1_SYNC BB1_SYNC BBOUT[7] pos. and neg. BB0_CLOCK BB1_CLOCK BB1_CLOCK BBOUT[8] pos. and neg. BB0_DATA_5 BB1_DATA_0 BB2_DATA_0 BBOUT[9] pos. and neg. BB0_DATA_6 BB1_DATA_1 BB2_DATA_1 BBOUT[10] pos. and neg. BB0_DATA_7 BB1_DATA_2 BB2_SYNC BBOUT[11] pos. and neg. BB0_DATA_8 BB1_DATA_3 BB2_CLOCK Number of BBdata streams 1 2 3 Number of DDR clocks to transfer 1 complex sample 2 4 8 BBOUT Clk 0 (if DDR Mode 0) BBOUT Clk 0 (if DDR Mode 1 or 2) BBOUT Sync 0 I0-O I0-E Q0-O Q0-E I1-O I1-E Q1-O Q1-E In-O In-E Qn-O Qn-E I0-O I0-E Q0-O Q0-E BBOUT Data 0 Mode 1B 18 bit I/Q Data 9I, 9I, 9Q, 9Q Mode 1BF 16 bit I/Q Data + 4 bits gain 8I +1G, 8I + 1G, 8Q + 1G, 8Q + 1G ‘n’ can be up to 47, ‘O’ is 8 (or 9) odd numbered bits (1, 3, 5, ...), ‘E’ is 8 (or 9) even numbered bits (0, 2, 4, ...), with 0 being the LSB BBOUT Clk 0 (if DDR Mode 0) BBOUT Clk 0 (if DDR Mode 1 or 2) BBOUT Sync 0 I0-A I0-B I0-C I0-D Q0-A Q0-B Q0-C Q0-D In-A In-B In-C In-D Qn-A Qn-B Qn-C Qn-D BBOUT Data 0 BBOUT Clk 1 (if DDR Mode 0) BBOUT Clk 1 (if DDR Mode 1 or 2) Modes 1N, 2N 16 bit I/Q Data 4I, 4I, 4I, 4I, 4Q, 4Q, 4Q, 4Q Modes 1NF, 2NF 14 bit I/Q Data + 4 bits gain 4I, 4I, 4I, 2I +2Q, 4Q, 4Q, 4Q, 4G BBOUT Sync 1 I0-A I0-B I0-C I0-D Q0-A Q0-B Q0-C Q0-D In-A In-B In-C In-D Qn-A Qn-B Qn-C Qn-D BBOUT Data 1 ‘n’ can be up to 47, ‘A’ is 4 MSBs, ‘B’ is next 4 bits, ‘C’ is next 4 bits and ‘D’ is 4 LSBs BBOUT ClkOUT 0 (if DDR Mode 0) BBOUT Clk 0 (if DDR Mode 1 or 2) BBOUT Sync 0 I0-A I0-B I0-C I0-D I0-E I0-F I0-G I0-H Qn-A Qn-B Qn-C Qn-D Qn-E Qn-F Qn-G Qn-H BBOUT Data 0 BBOUT Clk 1 (if DDR Mode 0) BBOUT Clk 1 (if DDR Mode 1 or 2) BBOUT Sync 1 I0-A I0-B I0-C I0-D I0-E I0-F I0-G I0-H Qn-A Qn-B Qn-C Qn-D Qn-E Qn-F Qn-G Qn-H BBOUT Data 1 Modes 1S, 2S, 3S 16 bit I/Q Data 4I, 4I, 4I, 4I, 4Q, 4Q, 4Q, 4Q Modes 1SF, 2SF, 3SF 14 bit I/Q Data + 4 bits gain 4I, 4I, 4I, 2I +2Q, 4Q, 4Q, 4Q, 4G BBOUT Clk 2 (if DDR Mode 0) BBOUT Clk 2 (if DDR Mode 1 or 2) BBOUT Sync 2 I0-A I0-B I0-C I0-D I0-E I0-F I0-G I0-H Qn-A Qn-B Qn-C Qn-D Qn-E Qn-F Qn-G Qn-H BBOUT Data 2 ‘n’ can be up to 47, ‘A’ is 2 MSBs, ‘B’ is next 2 bits, ‘C’ is next 2 bits, ... and ‘H’ is 2 LSBs T0505-01 Figure 12. RX BB Formats Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 23 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Capture Buffers The GC6016 has two capture buffers, each 4096 complex words (18-bits I, 18-bits Q) deep, which are periodically read by the external coefficient update controller (DSP). The capture buffers can be configured to sample data signals at the following points in the GC6016: ● CFR output (Referred to as node A) ● TX equalizer output (Node B) ● Not used for GC6016 (Node C) ● Not used for GC6016 (Node D) ● RX AB input (Node E) ● RX path 0/1 output (Node F) ● RX C (feedback) input (Node G) ● Testbus The capture buffers can be triggered via an external sync signal, through a software trigger, or when the monitored signal exceeds the user-configurable thresholds. The capture buffers can be programmed to monitor the signal statistics continuously and only capture data when certain requirements are met, as well as to generate an interrupt when a qualified buffer is captured. The capture buffers can be read by the DSP via the MPU interface. The capture buffers also allow synchronized multi-chip data capture. In systems with multiple GC5330s and GC6016s, the sync input can be used to capture the selected input node; the capture is the pre-trigger event. The SYNCOUT signal can be used to daisy-chain (e.g., connecting to SYNCA on the next chip) across the GC6016 devices in the system. The SYNCOUT signal indicates the end of the data capture and can be used as a capture trigger in all chips. Microprocessor (MPU) Interface The MPU interface is designed to interface with external memory interface (EMIF) ports on TI DSPs operating in asynchronous mode. It consists of a 16-bit bidirectional data bus, an 8-bit address bus, and WEB, OEB, CEB, and EMIFENA control signals. The interface supports the TI ‘C6748 as an EMIF asynchronous interface. The MPU interface has two address spaces: a paged address space and an auto-increment address space. To enable the EMIF interface, pin EMIFENA must be set to logic high. In an MPU write cycle, a GC6016 internal MPUCLK signal is generated by NORing CEB and WEB. The MPUCLK signal goes high when both CEB and WEB are asserted and goes low as soon as either CEB or WEB is de-asserted. The MPU data is latched on the rising edge of the MPUCLK signal. For the auto-increment address spaces, the auto-increment address increments on the falling edge of the MPUCLK signal. In an MPU read cycle, a GC6016 internal MPUCLK signal is generated by NORing CEB and OEB. The MPUCLK signal goes high when both CEB and OEB are asserted and goes low as soon as either CEB or OEB is de-asserted. The MPU readback data is available soon after the rising edge of the MPUCLK signal. For the auto-increment address spaces, the auto-increment address increments on the failing edge of the MPUCLK signal. Figure 13 shows the MPU interface timing diagram. The timing specifications are provided in Table 26 and Table 27. 24 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Write Cycle Read Cycle CEB Addr OEB WEB Data T0506-01 Figure 13. MPU Interface Format Serial Peripheral Interface (SPI) The MPU and SPI interfaces can be only enabled one at a time. EMIFENA must be set to logic low to enable the SPI interface. A three- or four-wire SPI interface is supported in the GC6016. It consists of SPIDENB, SPICLK , SPIDIO, and SPIDO-(SPARE) (output in four-wire mode) signals. See Table 25 and Figure 24. JTAG Interface The GC6016 includes a five-pin JTAG interface that supports boundary scan for all CMOS pads in the chip, aside from the TESTMOD pin. The BBIN, BBOUT, RX, TX, and SYNC pins are all LVDS and do not get JTAG boundary scan. IMPORTANT NOTE: if not using JTAG, the TRSTB signal should be grounded (or pulled to ground through R ≤ 1 kΩ); otherwise, the JTAG port may take control of the pins. See Table 24 and Figure 23. A BSDL file is available on the GC6016 Web page. Input and Output Syncs The GC6016 features two LVDS input syncs (SYNCA and SYNCB) and one LVDS output (SYNCOUT) user-programmable sync. These are typically used as trigger/synchronization mechanisms to activate features within the device. The input syncs can be used to trigger events such as: • Power measurements • DUC channel delay, mixer phase and dither • Initializing/loading filter coefficients • Capturing and sourcing of data in the capture buffers • Controlling gating intervals for AGC and other adaptive loops • Frequency NCO changes, or hopping synchronization The SYNCA signal is used for device startup. The SYNCB signal can be used for shared feedback synchronization between multiple GC6016 devices. The sync signal is active-high. The width (number of positive edges of the DPD clock) of the sync signal depends on the configuration. See the GC6016 sync and MPU application note to determine the proper sync duration. A typical sync-pulse duration is four DPD clocks. The sync must be periodic, and usually starts at the beginning of the TX frame. The output sync can be programmed to reflect triggering of specific events within the GC6016, and is primarily used to output the capture-buffer sync out signal. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 25 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Programmable Power Meters Interval-Based Power Meter There are three interval-based power meters which compute magnitude-squared sample values during programmable time intervals and provide the following results: • Integrated magnitude-squared power • Peak power • Number of magnitude-squared values above a first threshold • Number of magnitude-squared values above a second threshold An interrupt bit is set when new measurement results are available. For its input, each power meter can independently select from the same set of internal node sources as the capture buffers. Running-Average Power Meter for PA Protection The running-average power meter monitors up to four signal streams on a single node, which is selectable from the same set of internal sources as the capture buffers. For each signal stream, it measures running-average power and counts instantaneous power values above a threshold (referred to as peaks). It can be used in conjunction with hardware alarms for monitoring power levels for PA protection. The running-average power meter has the following features: • Running average mode, with programmable forgetting factor exponent, u (0 < u < 15) AAA y(k+1) = (1 – 2-u) × y(k) + 2-u × |x(k)|2, AAA where x(k) is the signal sample and y(k) is the power meter output. AAA Typically, one must set u = 11 to get 0.5-dB accuracy, u = 14 to get 0.1-dB accuracy. • Peak count mode: counts the number of power values, |x(k)|2, above a threshold in a specified number of samples (window). The number of power values, threshold, and window are all programmable. • Flexible gating of the operation interval Alarms The output, y(k), from the running-average power meter can be compared on an ongoing basis to programmable high and low thresholds (always positive). There are two alarms, alarm0 and alarm1. Each alarm is triggered (if it is enabled) based on the programmed mode: (0) Disabled (1) Average power alarm. The alarm is triggered based on the following conditions: If alarm polarity = 0 (see the alm_polarity register), y(k) > high_threshold If alarm polarity = 1, y(k) < low_threshold If alarm polarity = 2, y(k) > high_threshold or y(k) < low_threshold (2) Peak power alarm. The alarm is triggered based on the following conditions: If the count of power values |x(k)|2 > peak_threshold exceeds the programmed number of samples, peak_samples, in a programmed window, peak_window (3) The alarm is triggered if either (1) or (2) occurs. Alarm checks are computed on a per-antenna-stream basis. Each antenna stream y(k) result is compared to per-stream programmable thresholds. Once an alarm has been triggered, the output INTERRPT pin is asserted and the appropriate (alarm0 or alarm1) alarm interrupt bit is set and, for alarm1, a programmable action takes place. The programmable action is the same for all antenna streams, but the alarm triggering is independent for each antenna stream. 26 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Programmable trigger actions for alarm1: (0) No action (1) Reduce gain of CFR output by programmable scale factor (programmed with stream[n].gain_reduce), only if alarm caused by y(k) > high_threshold and alm_polarit = 0 or 2. The gain reduction is applied at the CFR input. A control signal from the capture buffer block is used to select the programmed gain value for the multiplier at the CFR input. When the host resets this alarm by writing to the appropriate register, the control signal returns to 0 (state that is not selecting the programmed gain value). GENERAL SPECIFICATIONS General Electrical Characteristics This section describes the electrical characteristics for the CMOS interfaces (DVGA, MPU, JTAG, SPI, TESTMOD, RESETB and INTERRPT) and LVDS interfaces (BBIN, BBOUT, TXA, TXB, RXA, RXB, RXC, SYNC, DPDCLK) over recommended operating conditions (unless otherwise noted). Table 9. General Electrical Characteristics, CMOS Interface PARAMETER TEST CONDITIONS VIL Voltage input low See (1) VIH Voltage input high See (1) MIN NOM MAX UNIT 0.8 V 2 VDDSHV V 0.5 V VDDSHV V (1) VOL Voltage output low IOL = 2 mA VOH Voltage output high IOH = –2 mA (1) 2.4 |IPU| Pullup current VIN = 0 V (1) 30 100 250 µA |IPD| Pulldown current VIN = VDDSHV (1) 30 100 250 µA |IIN| Leakage current VIN = 0 or VDDSHV (1) (2) 20 µA (1) (2) Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. For inputs with no pullup or pulldown, inputs with pullup and VIN = VDDSHV, inputs with pulldown and VIN = 0, and bidirectionals in input mode in either state. Table 10. General Electrical Characteristics, LVDS Interfaces PARAMETER VICM Input common mode voltage (VP – VN)/2 TEST CONDITIONS MIN See (1) 700 150 NOM MAX UNIT 1500 mV 700 mV |VP – VN| Input differential voltage See (1) RIN Input differential impedance See (1) 80 92 120 Ω VCOM Output common-mode voltage See (2) 1125 1200 1275 mV VOD Ouput differential voltage See (1) 250 500 mV (1) (2) Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Characteristics are determined by design. General Switching Characteristics The baseband interface TX has a single DDR interface input mode. The customer logic and trace routing must meet the listed tsu and th input timing. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 27 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Table 11. General Switching Characteristics, TX BB LVDS Input PARAMETER TEST CONDITIONS MIN NOM MAX UNIT BASEBAND INTERFACE DDR LVDS fCLK(BB-Serial) fCLK(BB-Nibble) 384 Baseband input clock frequency See (1) 500(Nibble0) 384(Nibble1) fCLK(BB-Byte) MHz 384 fCLK(RXA) Baseband input clock frequency, using RXA See (1) tsu(BBS0) BBIN3 Clk, BBIN1:0 Data, BBIN2 Sync See (1) (2) 250 ps thi(BBS0) BBIN3 Clk, BBIN1:0 Data, BBIN2 Sync See (1) (2) 200 ps 250 MHz tsu(BBS1) BBIN7 Clk, BBIN5:4 Data, BBIN6 Sync See (1) (2) 210 ps thi(BBS1) BBIN7 Clk, BBIN5:4 Data, BBIN6 Sync See (1) (2) 250 ps tsu(BBS2) BBIN11 Clk, BBIN9:8 Data, BBIN10 Sync See (1) (2) 240 ps thi(BBS2) BBIN11 Clk, BBIN9:8 Data, BBIN10 Sync See (1) (2) 190 ps tsu(BBN0) BBIN3 Clk, BBIN5,4,1,0 Data, BBIN2 Sync See (1) (2) 250 ps th(BBN0) BBIN3 Clk, BBIN5,4,1,0 Data, BBIN2 Sync See (1) (2) 220 ps tsu(BBN1) BBIN7 Clk, BBIN11:8 Data, BBIN6 Sync See (1) (2) 250 ps th(BBN1) BBIN7 Clk, BBIN11:8 Data, BBIN6 Sync See (1) (2) 220 ps tsu(BB) BBIN7 Clk, BBIN11:8,5:4,2:0 Data, BBIN6 Sync See (1) (2) 280 ps th(BB) BBIN7 Clk, BBIN11:8,5:4,2:0 Data, BBIN6 Sync See (1) (2) 250 ps (1) (2) Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Setup and hold times are measured from differential data crossing zero to differential clock crossing zero. BBIN Clk BBIN Data, BBIN Sync tsu th th tsu T0507-01 Figure 14. TX Baseband LVDS Input Timing Specifications The BB LVDS RX outputs have three different output timing modes, DDR0, DDR1 and DDR2. DDR1 and DDR2 modes output data, and the BBclk output is centered over the data. In DDR0 mode, the data and clock are edge-aligned. Different BBOUT pins are used for clock, frame, and data pins depending on the byte, nibble, and serial modes. The DDR1 and DDR2 modes are shown in Table 12 and Figure 15. The DDR0 mode is shown in Table 13 and Figure 16. Table 12 and Figure 15. DDR1 mode is used upto a BBclk frequency of 310 MHz. DDR2 mode is used upto a BBclk frequency of 155 MHz. When the data rate is higher than 500 MHz, BBclk above 250 MHz, the operating mode is DDR0. In this mode, the clock is aligned with the output data transition. In DDR0 mode, the customer must delay the clock to meet the tsu and thi target for the baseband input. The tskw time is measured as the relative skew for the data and frame to the clock output. This is shown in Figure 12 and Table 17. In receive (uplink) mode, the GC6016 outputs data using the LVDS pins BBOUT. The BBOUT port may be operated in three modes, DDR0, DDR1, and DDR2. 28 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com The lowest-rate outputs use DDR2 mode, where the output clock changes on one rising edge of the internal clock and the output data changes on the subsequent rising edge. In DDR2 mode, the output bit rate (per LVDS pair) is half of the internal clock. Middle-rate outputs use DDR1 mode, where the output clock changes on the falling edge of the internal clock and the output data changes on the rising edge of the internal clock, which results in an output bit rate equal to the internal clock rate. Both DDR1 and DDR2 result in the output clock edge occurring in the middle of output data-stable time. The DDR1 and DDR2 modes are shown in Table 12 and Figure 15. The highest-rate outputs use DDR0 mode, where both the output clock and output data change with both the rising and falling edges of the internal clock. The DDR0 output bit rate is twice the internal clock rate. DDR0 results in the clock and data changing at the same time, and typically requires extra trace length on the PC board for the clockout signal to provide the required setup time for the receiving chip. The DDR0 mode is shown in Table 13 and Figure 16. Table 12. General Switching Characteristics, RX BB LVDS Output – DDR1, DDR2 PARAMETER TEST CONDITIONS MIN NOM MAX UNIT BASEBAND INTERFACE DDR LVDS fCLK(BB-DDR2) fCLK(BB-DDR1) tskmin(BB)Serial0 Baseband output clock frequency See (1). Applies to BBOUT byte, nibble, or serial BBOUT3 Clk, BBOUT1:0 Data, BBOUT2 Sync See (2) (3) –20 ps 350 ps 155 310 MHz tskmax (BB)Serial0 BBOUT3 Clk, BBOUT1:0 Data, BBOUT2 Sync See (2) (3) tskmin(BB)Serial1 BBOUT7 Clk, BBOUT5:4 Data, BBOUT6 Sync See (2) (3) 15 ps tskmax (BB)Serial1 BBOUT7 Clk, BBOUT5:4 Data, BBOUT6 Sync See (2) (3) 310 ps tskmin(BB)Serial2 BBOUT11 Clk, BBOUT9:8 Data, BBOUT10 Sync See (2) (3) 60 ps tskmin(BB)Serial2 BBOUT11 Clk, BBOUT9:8 Data, BBOUT10 Sync See (2) (3) 300 ps tskmax(BB)Nibble0 BBOUT3 Clk, BBOUT5,4,1,0 Data, BBOUT2 Sync See (2) (3) 170 ps tskmax(BB)Nibble0 BBOUT3 Clk, BBOUT5,4,1,0 Data, BBOUT2 Sync See (2) (3) 340 ps tskmin(BB)Nibble1 BBOUT7 Clk, BBOUT11:8 Data, BBOUT6 Sync See (2) (3) 55 ps tskmax(BB)Nibble1 BBOUT7 Clk, BBOUT11:8 Data, BBOUT6 Sync See (2) (3) 305 ps tskmin(BB)Byte BBOUT7 Clk, BBOUT11:8,5:4,2:0 Data, BBOUT6 Sync See (2) (3) 250 ps tskmax(BB)Byte BBOUT7 Clk, BBOUT11:8,5:4,2:0 Data, BBOUT6 Sync See (2) (3) 255 ps (1) (2) (3) Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Skew measured for RX BBOUT data and frame signals, relative to the BBclk signal at zero crossing. BBclk is measured at threshold crossing. Lab measurement +signal → 50 Ω → Vcommon → 50 Ω → –signal. Vcommon has a 0.01-µF filter capacitor to GND. Differential probe used for measurement. tsu calculation: 1/4 BBclk period – tskmin; th calculation: 1/4 BBclk period – tskmax BBOUT Clk BBOUT Sync BBOUT Data tsu th T0508-01 Figure 15. RX Baseband LVDS DDR1, DDR2 Output Timing Specifications Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 29 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Table 13. General Switching Characteristics, RX BB LVDS Output – DDR0 PARAMETER TEST CONDITIONS MIN NOM MAX UNIT BASEBAND INTERFACE DDR LVDS fCLK(Byte) See (1) Baseband output clock frequency 384 MHz fCLK(Nibble0) 384 MHz fCLK(Nibble1) 500 MHz fCLK(Serial) 384 MHz (2) (3) –60 ps 400 ps –130 ps See (2) (3) (4) 500 ps BBOUT7 Clk, BBOUT5:4 Data, BBOUT6 Sync See (5) (6) –45 ps tskmin(BB)Serial2 BBOUT7 Clk, BBOUT5:4 Data, BBOUT6 Sync See (5) (6) (7) 425 ps tskmax(BB)Nibble0 BBOUT3 Clk, BBOUT5,4,1,0 Data, BBOUT2 Sync See (5) (6) 0 ps tskmin(BB)Nibble0 BBOUT3 Clk, BBOUT5,4,1,0 Data, BBOUT2 Sync See (5) (6) (7) 400 ps tskmax(BB)Nibble1 BBOUT7 Clk, BBOUT11:8 Data, BBOUT6 Sync See (5) (6) 10 ps tskmin(BB)Nibble1 BBOUT7 Clk, BBOUT11:8 Data, BBOUT6 Sync See (5) (6) (7) 460 ps tskmax(BB)Byte BBOUT7 Clk, BBOUT11:8,5:4,2:0 Data, BBOUT6 Sync See (5) (6) 0 ps tskmin(BB)Byte BBOUT7 Clk, BBOUT11:8,5:4,2:0 Data, BBOUT6 Sync See (5) (6) (7) 480 ps tskmax(BB)Serial0 BBOUT3 Clk, BBOUT1:0 Data, BBOUT2 Sync See tskmin(BB)Serial0 BBOUT3 Clk, BBOUT1:0 Data, BBOUT2 Sync See (2) (3) (4) tskmax(BB)Serial1 BBOUT3 Ck, BBOUT1:0 Data, BBOUT2 Sync See (2) (3) tskmin(BB)Serial1 BBOUT3 Clk, BBOUT1:0 Data, BBOUT2 Sync tskmax(BB)Serial2 (1) (2) (3) (4) (5) (6) (7) 30 Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Skew measured for RX BBOUT data and frame signals, relative to the BBclk signal at zero crossing. BBclk is measured at threshold crossing. Lab measurement +signal → 50 Ω → Vcommon → 50 Ω → –signal. Vcommon has a 0.01-µF filter capacitor to GND. Differential probe used for measurement. The customer interface design modifies the trace lengths based on the desired receiver timing and clock delays. tsu = –tskmax; thold = 1/4 BBclk period – tskmin. Skew measured for RX BBOUT data and frame signals, relative to the BBclk signal at zero crossing. BBclk is measured at threshold crossing. Lab measurement +signal → 50 Ω → Vcommon → 50 Ω → –signal. Vcommon has a 0.01-µF filter capacitor to GND. Differential probe used for measurement. The customer interface design modifies the trace lengths based on the desired receiver timing and clock delays. tsu = –tskmax; thold = 1/4 BBclk period – tskmin. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com BBOUT Data, BBOUT Sync BBOUT Clk tskmax tskmin tskmin tskmax Ideal Data Placement Ideal Data Placement T0509-01 Figure 16. RX Baseband LVDS DDR0 Output Timing Specifications The DAC TX interface has a 40-signal output bus. The DAC TX bus can provide 4-byte-wide or 2-word-wide interfaces. Table 5 shows the different DAC devices that can be connected to the TX output ports. The DAC TX interface has two styles of clock output, one where the DDR clock is centered over the output data-stable time, and one where the clock transition is aligned with the data transition. If the output clock rate is greater than 500 MHz, the GC6016 must be configured for clock transition aligned with the data transition. Depending on the DAC type selected, the clock, frame, and data for the DAC may require a trace routing delay for proper alignment. See Table 14, Table 15, and Table 16. Table 14. TX DAC and Envelope Modulator Characteristics DAC or Envelope Modulator Type Timing Model DAC Data Rate Table Number Figure Number DAC3282, 3283 byte-envelope modulator Clock centered over data <1000 Mbyte/s Table 15 Figure 17 DAC3282, 3283 byte-envelope modulator Clock aligned with data at GC6016, routing provides timing skew for clock centered over data ≥1000 Mbyted/s Table 16 Figure 18 DAC3484, 3482 word Clock centered over data <1000 Mword/s Table 15 Figure 17 DAC3484, 3482 word Clock aligned with data at GC6016, routing provides timing skew for clock centered over data ≥1000 Mword/s Table 16 Figure 18 DAC5682 Clock aligned with data at GC6016. PC board routing may be required to provide some timing skew for optimum performance. All Table 16 Figure 18 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 31 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Table 15. TX DAC Clock Centered Over Data Switching Characteristics (See Table 5 for Connections) PARAMETER TEST CONDITIONS MIN MAX UNIT 620 MHz MIN SKEW MAX SKEW UNIT DDR LVDS fCLK(DAC) DAC output clock frequency CLOCK TXA4 See (1) DATA TXA9:5, 3:0 TEST CONDITIONS See (2) (3) –190 139 ps TXA14 TXA19:15, 13:10 See (2) (3) –241 205 ps TXA9 TXA19:10, 8:0 See (2) (3) –200 155 ps TXB4 TXB9:5, 3:0 See (2) (3) –169 238 ps –198 146 ps –145 235 ps TXB14 TXB19:15, 13:10 See (2) (3) TXB9 TXB19:10, 8:0 See (2) (3) (1) (2) (3) Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Skew measured from DAC DATA desired P/N crossing to DATA P/N crossing. A negative skew is when the data arrives prior to the clock. tsu = 1/4 DAC clock period – Max. Skew, th = 1/4 DAC clock period + Min. Skew Table 16. TX DAC Clock Aligned With Data Switching Characteristics (See Table 5 for Connections) PARAMETER TEST CONDITIONS MIN MAX UNIT 620 MHz MIN SKEW MAX SKEW UNIT DDR LVDS fCLK(DAC) DAC output clock frequency CLOCK See (1) DATA TEST CONDITIONS TXA4 TXA9:5, 3:0 See (2) –190 139 ps TXA14 TXA19:15, 13:10 See (2) –241 205 ps TXA9 TXA19:10, 8:0 See (2) –200 155 ps TXB4 TXB9:5, 3:0 See (2) –169 238 ps TXB14 TXB19:15, 13:10 See (2) –198 146 ps TXB9 TXB19:10, 8:0 See (2) –145 235 ps (1) (2) Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Skew measured from DAC DATA desired P/N crossing to DATA P/N crossing. A negative skew is when the data arrives prior to the clock. DAC Data, DAC Frame DAC Data Clock Min Skew Max Skew Max Skew Min Skew Ideal Data Placement T0510-01 Figure 17. TX LVDS Timing Specifications (TXA and TXB) (DACCLK Centered Over Data) 32 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com DAC Data, DAC Frame DAC Data Clock Min Skew Min Skew Max Skew Max Skew Ideal Data Placement Ideal Data Placement T0511-01 Figure 18. TX LVDS Timing Specifications (TXA and TXB) (DACCLK Aligned With Data) The ADC output interface has two types of timing, based on the clock centered over the data, or clock edge-aligned with the data. The GC6016 only processes clock centered over the data. Each ADC type is characterized by the data and clock alignment, in Table 17, from which the proper table and timing diagram can be determined as follows: ADC W7 in Table 18 and Figure 19; ADC W14 in Table 19 and Figure 20; and ADC B7 in Table 20 and Figure 19. Note: The general ADC routing is to align the clock and data traces with a common routing delay. For the ADS5463 and ADS5474 the clock trace must be adjusted in length to meet the system timing design. Note: when RXA is used as a baseband interface, the specification is shown in table Table 17. The table shows a sampling of ADCs released at publication time. If the clock is not centered, the pc board may require added routing delay to the clock out to satisfy the setup time requirements. See (*) in Table 17. W7 – word-wide ADC interface, clock on bit 7 W14 – word-wide ADC interface, clock on bit 14 B7 – byte-wide ADC interface, clock on bit 7 B14 – byte-wide ADC interface, clock on bit 14 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 33 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Table 17. General LVDS ADC Interface Table ADC Type Bits per Rail Clock Centered ADC Format ADC Input Timing Table ADC Figure ADS5400 1 Yes W7 Table 18 Figure 19 ADS54RF63 (*) 1 No W14 Table 19 Figure 19 ADS5463 (*) 1 No W14 Table 19 Figure 19 ADS5474 (*) 1 No W14 Table 19 Figure 19 RXA as baseband TX input 2 Yes Baseband format – W14 Table 21 Figure 19 ADS61xx, ADS41xx, 2 ADS62pxx Yes B7 Table 20 Figure 19 ADS55xx 2 Yes B7, W7 Table 20Table 18 Figure 19 ADS58B18 2 Yes B7, W7 Table 20Table 18 Figure 19 ADS58B28, ADS62c1x 2 Yes B7, W7 Table 20Table 18 Figure 19 ADS64xx 6 or 7 Yes W7 Table 18 Figure 20 ADS52xx 12 or 14 Yes W7 Table 18 Figure 20 Table 18. RX ADC-W7 Switching Characteristics PARAMETER TEST CONDITIONS MIN NOM MAX UNIT 620 MHz See (1) tsu(ADC,A) Input data setup time on port A before ADCA7 Clk transition See (1) (2) 260 ps th(ADC,A) Input data hold time on port A after ADCA7 Clk transition See (1) (2) 170 ps tsu(ADC,B) Input data setup time on port B before ADCB7 Clk transition See (1) (2) 260 ps th(ADC,B) Input data hold time on port B after ADCB7 Clk transition See (1) (2) 140 ps fCLK(ADC) RX input clock frequency, ADCA7 Clk (1) (2) Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Setup and hold times apply to data and appropriate ADC Clk, respectively. Timing is measured from ADC Clk threshold crossing. ADC Clock ADC Data tsu th th tsu T0512-01 Figure 19. RX ADC LVDS Timing Specifications (RXA and RXB) 34 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Table 19. RX ADC-W14 Switching Characteristics PARAMETER fCLK(ADC) RX input clock frequency ADCA14 Clk, ADCB14 Clk tsu(ADC,A) TEST CONDITIONS MIN NOM MAX UNIT 620 MHz See (1) Input data setup time on port A before ADCA14 Clk transition See (1) (2) 160 ps th(ADC,A) Input data hold time on port A after ADCA14 Clk transition See (1) (2) 200 ps tsu(ADC,B) Input data setup time on port B before ADCB14 Clk transition See (1) (2) 180 ps th(ADC,B) Input data hold time on port B after ADCB14 Clk transition See (1) (2) 220 ps (1) (2) Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Setup and hold times apply to data and appropriate ADC Clk, respectively. Timing is measured from ADC Clk threshold crossing. Table 20. RX ADC-B7, B14 Switching Characteristics MAX UNIT fCLK(ADC-AB) RX input clock frequency, ADCA7 Clk, ADCB7 Clk PARAMETER See (1) 620 MHz fCLK(ADC-C) RX input clock frequency, ADCC7 Clk See (1) 620 MHz tsu(ADC,A) Input data setup time on port A before ADCA7 Clk transition See (1) (2) 260 ps th(ADC,A) Input data hold time on port A after ADCA7 Clk transition See (1) (2) 160 ps tsu(ADC,B) Input data setup time on port B before ADCB7 Clk transition See (1) (2) 170 ps th(ADC,B) Input data hold time on port B after ADCB7 Clk transition See (1) (2) 140 ps tsu(ADC,C) Input data setup time on port C before ADCC7 Clk transition See (1) (2) 290 ps th(ADC,C) Input data hold time on port C after ADCC7 Clk transition See (1) (2) 150 ps tsu(ADC,A) Input data setup time on port A before ADCA14 Clk transition See (1) (2) 130 ps th(ADC,A) Input data hold time on port A after ADCA14 Clk transition See (1) (2) 200 ps tsu(ADC,B) Input data setup time on port B before ADCB14 Clk transition See (1) (2) 170 ps th(ADC,B) Input data hold time on port B after ADCB14 Clk transition See (1) (2) 240 ps (1) (2) TEST CONDITIONS MIN NOM Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Setup and hold times apply to data and appropriate ADC Clk, respectively. Timing is measured from ADC Clk threshold crossing. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 35 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com ADC Clock ADC Frame Clock ADC Data tsu th tsu th T0513-01 Figure 20. RX ADC LVDS Timing Specifications (RXA and RXB) Table 21. RXA-BB Switching Characteristics PARAMETER TEST CONDITIONS MIN NOM MAX UNIT 250 MHz fCLK(BB-A) RX input clock frequency See (1) tsu(BB-A) Input data setup time on port A before ADCA Clk transition See (1) (2) 160 ps th(BB-A) Input data hold time on port A after ADCA Clk transition See (1) (2) 200 ps (1) (2) Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Setup and hold times apply to data and appropriate ADC Clk, respectively. Timing is measured from ADC Clk threshold crossing. Table 22. DPD Clock and Sync A,B Switching Characteristics (1) PARAMETER TEST CONDITIONS MIN NOM MAX UNIT 310 MHz 250 MHz fCLK(DPD) DPD input clock frequency See (2) fCLK(BB) BB internal clock frequency See (1) tDUTY-CYCLE DPD input clock duty cycle See (3) fCLK DPD clock input jitter See (3) tsu(SYNCA) Input data setup time before fCLK↑ See (2) 0.25 ns th(SYNCA) Input data hold time after fCLK↑ See (2) 0.1 ns 0.35 ns 0.05 ns (JITTERRMS-DPD) tsu(SYNCB) Input data setup time before fCLK↑ See (2) th(SYNCB) Input data hold time after fCLK↑ See (2) (1) (2) (3) 36 40% 60% 2.5% The PLL output ranges are 400–1000 MHz. These are configuration dependent but related to the DPDCLK frequency. The cmd5330 software automatically checks these limits when compiling a configuration. Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Specification is from the PLL specification and is not production tested. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com DPD Clock SYNCA, SYNCB tsu th T0514-01 4 cycles, min. Figure 21. SYNCA, SYNCB Timing to DPD Clock Table 23. DPD Clock and Sync Out Switching Characteristics PARAMETER TEST CONDITIONS td(SYNCOut) Data valid after DPD clock See (1) tHO(SYNCOut) Data held valid after next DPD clock See (1) (1) MIN NOM MAX UNIT 0.95 ns 0.3 ns Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Sync Out DPD Clock td tHO T0515-01 Figure 22. Sync Out Timing to DPD Clock The JTAG test connections are used with the CMOS signals for board interconnection tests. The TRSTB pin must be toggled low, or low initially. If JTAG is not used, the TRSTB signal should be GROUNDed or tied to GND through < 1 kΩ resistance. TRSTB should be 0 for normal operation. Table 24. JTAG Switching Characteristics PARAMETER TEST CONDITIONS MIN MAX UNIT 50 MHz fTCK JTAG clock frequency tTCKL JTAG clock low period See (1) 10 ns tTCKH JTAG clock high period See (1) 10 ns tsu(TDI,TMS) Input data setup time before fTCK↑ See (1) tH(TDI,TMS) Input data hold time after fTCK↑ See (1) td Output data delay from fTCK↓ See tOHD(TDO) Previous data valid from fTCK↓ See (1) 7 ns (1) 10 ns (1) 2 ns 1.5 Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 37 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com t TCK TDI tSU tH TDO td tOH T0289-02 Figure 23. JTAG Timing Specifications The SPI programming interface is active only when EMIFENA is 0. There are both three-wire and four-wire SPI interfaces; the SPIDO(SPARE) is the fourth wire for SPI data output. Table 25. SPI Switching Characteristics PARAMETER TEST CONDITIONS MIN NOM MAX UNIT tsu(DENB) Enable setup time before SPI CLK↑ Valid for SPIDENB, see (1) 5 ns tsu(DI) Data setup time before SPI CLK↑ Valid for SPIDIO, see (1) 5 ns (1) 0.6 th(DI) Input data hold time after CLK↑ Valid for SPIDIO, see td(DO) Output data delay from fTCK↓ Valid for SPIDIO, see (2) 8 ns td(DO1) Output data delay from fTCK↓ Valid for SPIDO(SPARE), see (2) 8 ns 50 MHz fclk SPI (1) (2) SPI clock frequency See (1) ns Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. The SPI data output in three-wire mode comes from SPIDIO; in four-wire mode the output is from SPIDO(SPARE). SPI Clock tsu(DENB) th(DI) SPIENB tsu(DI) SPIDIO-In SPIDO(SPARE) td(DO1) th(DO) T0516-01 Figure 24. SPI Timing Specifications 38 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com Table 26. MPU Switching Characteristics (READ) PARAMETER tsu(RD) TEST CONDITIONS See (1) CEB and ADDR setup time to ↓OEB MIN MAX 1.5 (1) tdly(RD) Data valid time after ↓OEB See th(RD) CEB and ADDR hold time to ↑OEB See (1) 2.5 tHIGH(RD) Time OEB must remain HIGH between READs See (1) 6 tz(RD) Data goes to high-impedance state after ↑OEB or ↑CEB See (2) tcycle(RD) Time between READs See toh(RD) Time after OEB↑ that data is valid See (1) (2) ns 15 ns 21 (2) ns ns 5 (1) UNIT ns ns TBD ns Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Bench tested for output start changing after releasing strobe with a 50-Ω load on the output CEB tsu(RD) th(RD) tsu(RD) th(RD) Addr WEB OEB tdly(RD) toh(RD) tz(RD) Data T0517-01 Figure 25. MPU READ Timing Specifications Table 27. MPU Switching Characteristics (WRITE) PARAMETER tsu(WR) TEST CONDITIONS CEB, DATA, and ADDR setup time to ↓WEB MIN MAX UNIT See (1) 1.4 ns (1) th(WR) CEB, DATA, and ADDR hold time after ↑WEB See 3 ns tlow(WR) Time WEB and CEB must remain simultaneously LOW See (1) 4 ns thigh(WR) Time CEB or WRB must remain HIGH between WRITEs See (1) 7 ns (1) 11 ns tcycle(WR) (1) Time between WRITEs See Chip specifications are production tested at 90°C case temperature for the given specification. Early production lots are sample tested at –40°C. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 39 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com CEB tsu(WR) th(WR) tsu(WR) th(WR) Addr OEB tlow(WR) thigh(WR) WEB th(WR) tsu(WR) Data T0518-01 Figure 26. MPU WRITE Timing Specifications Power Sequencing Guideline TI ASIC I/O design allows either the core supply (VDD) or the I/O supply (VDDS) to be powered up (2) for an indefinite period of time while the other power supply is not powered up, if all of these constraints are met: • Chip is within all maximum ratings and recommended operating conditions. • Have followed all warnings about exposure to maximum rated and recommended conditions, particularly junction temperature. These apply to power transitions as well as normal operation. • Bus contention while VDDS is powered up must be limited to 100 hours over the projected lifetime of the device. • Bus contention while VDDS is powered down may violate the absolute maximum ratings. However, it is generally good practice to power up VDD, VDDSHV, and VDDS all within 1 second of each other. Application Information The GC5330/GC6016 evaluation module includes the following additional transmit/receive signal chain components: • TMS320C6748 digital signal processor (DSP) • DAC3283 16-bit 800-MSPS, dac348X, or DAC5682 16-bit, 1-GSPS DAC (transmit path) • CDCE72010 clock generator • TRF3720 300-MHz to 4.8-GHz quadrature modulator with integrated wideband PLL/VCO • TRF370317 0.4-GHz to 4-GHz quadrature modulator • ADS41B49 14-bit, 250-MSPS ADC (and other options; feedback path) • AMC7823 analog monitoring and control circuit with GPIO and SPI • PGA870 wideband programmable gain amplifier • ADS42b49 14-bit dual 250-MSPS receive or complex feedback ADC (and other options; RX path) (2) 40 A supply bus is powered up when the voltage is within the recommended operating range. It is powered down when it is below that range, either stable or in transition. Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com MPU Interface Guidelines The following section describes the hardware interface between the recommended microprocessor and the GC6016. The GC6016 interface is an EMIF asynchronous interface. The TMS320C674x/OMAP-L1x Processor Peripherals Overview referencde guide (SPRUFK9) illustrates the connections to the TMS320C6748 peripherals. The TMS320C674x/OMAP-L1x Processor External Memory Interface A (EMIFA) user's guide (SPRUFL6) illustrates the connections to the EMIF A interface, and DSP timing. It is recommended that if more than one EMIF-A load is connected to the DSP, buffering is used for the control bus WE, RD, address bus, and data bus. Related Material and Documents The following documents are available through your TI Field Application Engineer (FAE): • GC5330/GC6016 EVM schematic diagram • GC5330/GC6016 EVM layout diagram • GC5330/GC6016 Baseband Application Note • GC5330/GC6016 Baseband beAGC Application Note • GC5330/GC6016 DDUC Application Note • GC5330/GC6016 CFR Application Note • GC5330/GC6016 TX (BUC, DAC Interface) Application Note • GC5330/GC6016 RX Application Note • GC5330 feAGC Application Note • GC5330 Sync, MPU Application Note • GC5330/GC6016 Software Application Guide Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 41 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com APPENDIX Glossary of Terms 3G Third generation (refers to next-generation wideband cellular systems that use CDMA) 3GPP Third Generation Partnership Project (W-CDMA specification, www.3gpp.org) 3GPP2 Third Generation Partnership Project 2 (cdma2000 specification, www.3gpp2.org) ACLR Adjacent-channel leakage ratio (measure of out-of-band energy from one CDMA carrier) ACPR Adjacent-channel power ratio ADC Analog-to-digital converter BBclk Clock-to-baseband section of GC6016 BW Bandwidth CCDF Complementary cumulative distribution function CDMA Code division multiple access (spread spectrum) CEVM Composite error vector magnitude CFR Crest factor reduction DPD_CLK Clock-to-DPD section of GC6016 CIC Cascaded integrator comb (type of digital filter) CMOS Complementary metal-oxide semiconductor DAC Digital-to-analog converter dB Decibels dBm Decibels relative to 1 mW (30 dBm = 1 W) DDR Dual data rate (ADC output format) DPD Digital pre-distortion DSP Digital signal processing or digital signal processor DUC Digital upconverter (usually provides the GC6016 input) EVM Error vector magnitude FIR Finite impulse response (type of digital filter) HP-DPD High-performance DPD mode of the GC6016 HS-DPD High-speed DPD mode of the GC6016 I/Q In-phase and quadrature (signal representation) IF Intermediate frequency IIR Infinite impulse response (type of digital filter) JTAG Joint Test Action Group (chip debug and test standard 1149.1) LO Local oscillator LSB Least-significant bit MSB Most-significant bit MSPS Megasamples per second (1 × 106 samples/s) PA Power amplifier PAR Peak-to-average ratio PCDE Peak code domain error PDC Peak detection and cancellation (stage) PDF Probability density function RF Radio frequency RMS Root-mean-square (method to quantify error) SDR Single data rate (ADC output format) SEM Spectrum emission mask SNR Signal-to-noise ratio (usually measured in dB or dBm) UMTS Universal mobile telephone service W-CDMA Wideband code division multiple access (synonymous with 3GPP) 42 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 GC6016 SLWS227A – NOVEMBER 2010 – REVISED MARCH 2011 www.ti.com WiBro Wireless Broadband (Korean initiative IEEE 802.16e) WiMAX Worldwide Interoperability of Microwave Access (IEEE 802.16e) AA AA AA REVISION HISTORY Changes from Revision Original (November 2010) to Revision A Page • Added/deleted/modified items in FEATURES list ................................................................................................................. 1 • Added/deleted/modified items in APPLICATIONS list .......................................................................................................... 1 • Changed and expanded DESCRIPTION section ................................................................................................................. 1 • Inserted new front-page diagram .......................................................................................................................................... 1 • Added a table for several sample configurations; added several antenna mode diagrams; relocated Available Options table and GC6016 block diagram further back in the data sheet ............................................................................ 2 • Appended another 42 pages ................................................................................................................................................ 2 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): GC6016 43 PACKAGE OPTION ADDENDUM www.ti.com 4-Apr-2011 PACKAGING INFORMATION Orderable Device GC6016IZEV Status (1) ACTIVE Package Type Package Drawing BGA ZEV Pins Package Qty 484 60 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish SNAGCU MSL Peak Temp (3) Samples (Requires Login) Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 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