EPC EPC700-CSP6 24v/50ma general-purpose output-driver Datasheet

epc700/epc702
24V/50mA General-Purpose Output-Driver
General Description
Features
The epc70x family is a general purpose low-side power switch for
24V interfaces. A high-side switch is also available, please refer to
the separate data sheet of epc701/703. The device is very easy to
use and capable to drive a load of 50mA at 30VDC. If a higher
driving current is necessary or if the output voltage shall be higher
than 30VDC, these chips can be used to drive an external power
transistor. In this mode of operation, the external transistor is fully
protected against over-current by the epc chip.






Low-side power switch
Driving capability without external transistor 50 mA/30VDC
Programmable short-circuit detection delay-time and recovery time
Static (epc700) or flashing (epc702) indication of the over-current
status
Self-healing output mode
Available in CSP6 package with very small footprint and standard
QFN16 package
If the current through the external load exceeds a specified
threshold during a longer time period than a predefined time, the Applications
output is turned off to protect the output switch. The switch is
turned on again after a predefined off-time, thus enabling the load
 PLC
again in a self-healing mechanism. The over-current information is
 Sensors
indicated on the STATUS pin.
 Controllers
epc700 and epc702 are easy to use and reduce the need of external components to the minimum, thus saving pcb space and
money.
Functional Block Diagram
VDD
Configuration
registers
ISource
Control logic
IN
OUT
Isink
GND
Over-current
delay / release
STATUS
SENSE
+
Over current
sense
–
GND
+
ref
GND
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
GND
1
RSENSE
GND
Datasheet epc700_702 - V2.2
www.espros.ch
epc700/epc702
Absolute Maximum Ratings (Note 1)
Recommended Operating Conditions
Min.
Max.
Units
Power Supply Voltage V DD
-0.3 to +36.0 V (Note 2)
Power Supply Voltage (V DD)
9.6
30
V
Maximum Power Dissipation
100mW
Storage Temperature Range (T S)
-40°C to +85°C
Operating Temperature (T O)
-40°
+85°
C
Lead Temperature solder, 4 sec. (T L)
+260°C
Humidity (non-condensing)
+5
+95
%
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended operating conditions indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. For guaranteed specifica tions and test conditions, see Electrical Characteristics.
Note 2: Supply voltages up to 36 Volts may be present for 10 seconds only.
Note 3: This device is a highly sensitive CMOS amplifier with an ESD rating of JEDEC HBM class 1C (>1kV). Handling and assembly of this
device should only be done at ESD protected workstations.
Electrical Characteristics
VDD = 9.6V < V DD < 30V, -40°C < T A < +85°C
Symbol
Parameter
Conditions/Comments
Values
Min.
VDD
ΔVDD
Supply Voltage
Typ.
9.6
Ripple on Supply Voltage
Peak-Peak
no load
Max.
Units
30
V
10
%VDD
400
μA
30
V
1
2
V
IDD
Supply Current
VOUT
Output Voltage
VSat
Output Saturation Voltage
@50mA output current
ISENS
Sens Current
Current trigger threshold
-50
-60
-70
mA
VSENS
Current Sens Voltage
Over-current trigger threshold voltage (by using an external
power switch)
0.18
0.2
0.25
V
Short Circuit Peak Current
Initial current during a short circuit (<1ms, 50Ω series resistor)
-0.5
A
Status Output
Logical high
2
5.5
Logical low
-0.3
0.8
IPeak
VStatus
fStatus
VIN
300
0
V
Sink driving capability
-8
-10
-12
mA
Status Output Frequency
epc702 only, duty cycle 50%
1.5
1.7
1.9
Hz
Input
Logical high
2.0
5.5
Logical low
-0.3
0.8
V
Hysteresis
0.25
Pull-down resistance
100
200
kΩ
100
mW
150
PDIS
Power Dissipation
On-chip power dissipation
tON
Response Time
On
1.0
1.2
μs
tOFF
Response Time
Off
0.7
1.0
μs
tdel
Off-delay Time
Time between over-current detection and STATUS/OUT
change (default value), refer to section Programming
50.0
60.0
Programmable off-delay values
tminOFF
Recovery Time
Minimum down time of the OUT pin to protect the external
transistor (default value), refer to section Programming
tSTARTUP
Start-up time
CL_max
External Load Capacitance Load capacitance that can be driven through OUT without
triggering over-current @2kOhm load and 5μs delay time
Characteristics subject to change without notice
400
500
600
ms
10/20/50/100/200/500/1,000/
1,500
Short circuit recovery delay tminoff/tdelay = frt (when used without external driver transistor,
time factor
refer to section “Over-current Reset Sequence”)
© 2011 ESPROS Photonics Corporation
μs
5/10/20/50/100/200/500/1,000
Programmable values
frt
40.0
1,000
VDD ramp > 100 V/ms
200
2
30
μs
nF
Datasheet epc700_702 - V2.2
www.espros.ch
epc700/epc702
Connection Diagrams
GND
IN
IN
Top View
3
6
2
GND
15
1
SENS
8
Top View
OUT
7
12
4
11
5
10
6
9
VDD
14
SENS
13
OUT
5
VDD
16
STATUS
1
6-Pin Chip Scale Package (CSP)
6-Pin
CSP
16-Pin
QFN
Pin Name
1
8
GND
2
7
IN
3
5
STATUS
4
16
VDD
5
14
SENS
6
13
OUT
n/a
1-4, 6,
9-12, 15
NC
2
3
STATUS
4
16-Pin QFN Package
Description
Negative power supply pin
Input from the controller
Output status signal to the controller
Positive power supply pin
Input either to switch internal/external mode or to measure the voltage drop on an external
shunt resistor to detect over-current
Output
Not connected. Connect these pins to GND.
PIN Connections QFN16-VEED1VN4
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03.08.2010
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Pin Connection CSP6 epc70x
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
03.08.2010
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3
confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written permission .
Datasheet epc700_702 - V2.2
www.espros.ch
epc700/epc702
Functional Description
Normal Operation
During typical operation the OUT follows the IN as shown in Figure 1. As long as the output current does not exceed the current threshold,
OUT is stable ON and STATUS is stable HIGH-Z. The delay from IN to OUT is defined as t ON and tOFF for the rising and the falling edge
respectively.
IN
0
OUT (without HIGH-Z
external Transistor)
V
OUT (with V
external Transistor) Sat
Sat
VDD
toff
ton
SHORT 0
Vth sens
SENS
0
STATUS HIGH-Z
epc700
STATUS HIGH-Z
epc702
Figure 1: Normal operation
Please note that the status of the pin OUT is dependent whether the chip is operated with or without external driver transistor. In the
subsequent diagrams, the version with external driver transistor is shown only.
Over-current Sequence
A short on the load side will lead to an over-current through OUT. If an over-current stays longer than the time t del and text, OUT is turned off as
shown in the figure below. At the same time STATUS changes its state to indicate an over-current situation to an external controller. STATUS
can also be used to drive directly an indicator LED due to its 10mA driving capability. epc700 delivers a constant on-signal, whereas epc702
has a flashing output.
IN
0
OUT 0
SHORT
0
Vth sens
SENS 0
text
STATUS
epc700
tdel
tLED
HIGH-Z
tLED
STATUS HIGH-Z
epc702
tLED
Figure 2: Short circuit detection
Note: The parameter t ext used in this paper is described in Figure 7.
LST
Timing diagram operation mode
epc700
05.01.2011
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© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
4
Datasheet epc700_702 - V2.2
www.espros.ch
epc700/epc702
Current Peak at OUT
A short current peak when OUT is turned on, typically generated by a capacitive load, could trigger the short-circuit protection logic. However,
if the current peak is shorter than t ext plus tdel, the over-current peak will be ignored.
Make sure that the energy drawn by such a current peak does not destroy the internal/external output transistor.
IN
OUT
HIGH-Z
STATUS
Vth sens
SENS
text <tdel
Figure 3: Short over-current pulse, i.e., by switching a capacitive load
Over-current Reset Sequence
If there is a permanent short circuit at OUT, such short circuit will be detected and OUT is turned off. After a waiting time t minOFF, the device tries
to turn on OUT again. If the short circuit is still present, OUT is immediately turned off again. This sequence continues until the short circuit is
removed or IN goes to LOW or power is turned off. This mode is called self-healing since the device tries to self-heal the short circuit end to
switch back into normal operation.
As a consequence in the case of a permanent over-current , short current peaks are issued into the load, respectively short.
The time t minOFF has to be set to a value that the internal/external switch cannot be damaged by a too high power dissipation. Without an exter nal switch, the time t minOFF has to be 1,000 times longer than the time t del.
IN
0
OUT
0
SHORT
0
SENS
0
Vth sens
text
tdel
tminOFF
STATUS HIGH-Z
epc700
STATUS HIGH-Z
epc702
tLED
Figure 4: Over-current reset sequence
If one wants to reduce the waiting time in case of a short circuit situation, it can be done by simply taking IN to a low state and then to high
again. Please refer to the timing diagram in Figure 5. However, make sure that the maximum power dissipation of the chip or the external
switching transistor will never be exceeded above the allowed maximum.
IN
OUT
SHORT
Vth sens
SENS
text
Timing diagram not enough
HIGH-Z epc700
overcurrent
File:
tdel
LST
<tminOFF
01.08.2010
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STATUS
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Figure 5: Over-current status reset
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
5
Datasheet epc700_702 - V2.2
www.espros.ch
epc700/epc702
Application Information
epc700 and epc702 have two modes of operation, where the SENS pin is used to define the mode. When SENS is tied to VDD, the chip
operates as a sink driver capable to sink max. 50mA at 30VDC (refer to Figure 6). The load is connected directly between V L and the OUT pin.
If the current through the internal switch exceeds I SENS, the switch is turned off.
If the SENS pin is at low level, the OUT pin is driven by a source driver also capable to drive 50mA into an external power transistor. This
mode is used if the required output current has to be higher than 50mA, e.g. 1A and the output voltage exceeds 30VDC (refer to Figure 7).
The load current is measured by monitoring the voltage drop over a resistor. If the internal switch is used, also the current measurement
resistor is located internally (Figure 6). In the case of using an external power transistor as shown in Figure 7, the current measurement
resistor RS has to be placed externally. If the voltage drop at RS exceeds the threshold of 200 mV, the output stage is deactivated. The timing
diagrams of the signals can be found in section “Functional Description”.
The IN signal must be low during power-up (tSTARTUP) for proper function of the chip. The epc70x has a built in pull down resistor, so not
external active driving is needed during startup.
epc700 or epc702 Using the Internal Switch
Figure 6 shows the epc700/702 in the mode using the internal switch. To enable this
mode, the SENS pin has to be connected to VDD. Note that the VDD of the chip and
VL at the load can have a different value. The values for both VDD and V L need to be
between 9.6 and 30V.
The factor frt between minimum off-time and delay-time must be maintained in order
not to damage the chip due to overheating. This factor has to be higher than 1,000. In
the worst case scenario a peak current of approx. 0.5A is flowing from VL at 30V into
the chip with a tDel set at 50μs if a short-circuit occurs. If the recovery time tminoff in this
case is smaller then 50ms, the average power dissipation would exceed the safe
operation condition and the device will get damaged.
The diode D1 is to protect the internal switch against voltage surges when inductive
loads are turned off.
DL
VDD
epc700
epc702
RL
R1≥50Ω
OUT
IN
STATUS
SENSE
GND
R1 is to protect the internal switch in case of a short circuit on the load when a very
low impedance power supply is used.
The voltage VL can be higher than VDD in this configuration. However, it must not be
above the maximum value of 'Supply Voltage' stated in the table Electrical Characteristics.
VL≤VDD max
VDD
GND
Figure 6: epc700 or epc702 using the internal switch
to drive a load of up to 50mA /30VDC
epc700 or epc702 Using an External Switching Transistor
Figure 7 shows the operation mode using an external switch T 1 in order to extend the
VL≤VDD amax
VDDcapability. In this example,
output current/voltage drive
bipolar transistor is used,
whereas the base current is limited by the resistor R B. The maximum base current is
50mA. In order not to damage the chip, the user has to select the resistor R B such that
chip does not need to drive more than 50mA. OtherD possible
switches are a NPN BJT
RL
VDD
L
or an n-channel MOSFET.
VL
VDD
epc700
epc702
The load is turned on and
off by setting the pin IN to high respectively to low level.
R1≥50Ω
When the load is turned on, the OUT
load current flows from V L through the resistor RS and
through the transistor T1 to GND. This current creates a voltage drop over R S. The
resulting voltage isINapplied to pin SENS, which measures the voltage drop. If it
exceeds the threshold of an internal comparator, set to 200mV, the output is turned off
STATUS
SENSE
after the given delay time t del.
DL
VDD
epc700
epc702
OUT
R1
RL
T1
IN
STATUS
GND
GND
RT
SENSE
CT
RSENSE
If the delay time should be extended to a value above the possible settings of t del (refer
to Table 3), an RC network can added, designated as RT and CT in Figure 7. The
additional time delay text GND
can be calculated approx. as RT x CT. However, the File:
timeUnbenannt
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by law and international trades. It must not be shown to any third party nor be copied in any
GND
varies according to the current through R S. This design concept is especially useful,
Figure 7: epc700 or epc702 operation mode
when a large capacitor in the load path needs to be charged. The additional delay in
using an external switching transistor.
the over-current detection helps in such a situation.
In case of a short-circuit in the load the turn-off delay
Note that the VDD of the chip and VL on the load are different in most of the applicacan be extended by an external RC network.
tions. The value of VDD must be between 9.6 and 30V. V L instead, can be on a level
This network adds text to the internal delay tdel.
which is appropriate to the external switching transistor.
The diode D 1 is to protect the transistor T 1 against voltage surges when inductive loads are turned off.
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
6
Datasheet epc700_702 - V2.2
www.espros.ch
Dieter Kägi
25.05.2011
Page 1
epc700/epc702
Programming
The time delay (tdel), until the output is turned off after the detection of an over-current condition can be programmed in order to adapt the timing to specific requirements, i.e., if a capacitive load has to be operated or an external transistor allows other values. The default value is
50μs which allows to charge a load capacitor of approx. 100 – 500nF without an external power transistor, dependent on the source impe dance, the load impedance and the voltage V L.
The time until the output is turned on again after a short circuit can be programmed as well (t minOFF). This “self-healing” mechanism is very useful because no operator interaction is necessary after a short circuit to enable normal function once the short circuit has been eliminated. The
default value is 500ms which means that the device tries to turn the output on after 0.5s waiting time in the short circuit mode. This waiting
time is recommended as long as t del is not changed. If t del has been changed, the parameter t minOFF shall be changed accordingly in order to
respect parameter f rt. The user has to ensure that the maximum operation conditions never exceed in order to avoid damage of the device.
It is to note that the parameters programmed are stored in a non-volatile random access memory. Thus, the parameters can be lost after a
power down for longer than 5ms (data retention time @ 25ºC: min. 100ms). The corresponding requirements for safety applications have to
take in consideration. Parameters can be changed as many times as necessary and even under operation to change the behavior of an
output. During power-on, the default values are restored automatically.
Programming Interface
The interface to store changed parameters are the pins IN and STATUS. IN is the chip select pin and STATUS, which is under normal opera tion an output, is used as an input pin. As long as the IN pin is at low state, parameters can be stored through the STATUS pin. Since IN is low
during the programming of new parameters, OUT is low as well.
The digital input high threshold is typically at 2.2V, thus a 5V compatible communication. Please note that the voltage at STATUS should not
exceed 5.5V.
Single Wire Communication Interface
The epc70x is based on a single wire communication interface by using the STATUS pin. Programming is done by a 21-Bit Manchester code
according to IEEE 802.4.
Clock
(internal)
Data
1
0
0
1
1
0 0
Manchester
code
Figure 8: Manchester encoding sample
Figure 8 shows such a sample Manchester encoded data-stream. The clock and the corresponding data is used to generate the Manchester
data-stream. Each positive clock-edge in the Manchester encoded data (indicated with the up-arrow) corresponds to a 1 and each negative
clock-edge (indicated with the down-arrow) corresponds to a 0.
Data Clock Frequency Range
The communication frequency range has to be according to Table 1.
Data clock
minimal
typical
maximum
396kHz
450kHz
540kHz
Table 1: Frequency range for programming
Configuration Bit Stream for changing the delay time
In order to guarantee a reliable communication with the Manchester encoded bit stream on STATUS, some additional bits have been added to
the configuration bits. Table 2 shows the digital pattern for the delay time configuration and the recovery time configuration.
Bit #
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
tDel Value
1
0
1
1
0
0
0
0
0
1
1
1
1
0
D1
TminOFF Value
1
0
1
1
0
0
0
0
1
0
0
0
1
0
O1
15
16
17
18
19
20
D2
D3
1
d1
d2
d3
O2
O3
1
o1
o2
o3
Table 2: Configuration of the delay and the recovery time
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
7
Datasheet epc700_702 - V2.2
www.espros.ch
epc700/epc702
The delay time is set with d 1, d2, and d3. The bits D1, D2, and D3 are the inverted values of d 1, d2, and d3. Table 3 shows the value mapping
table for the 8 different delay times.
delay [µs]
D1
D2
D3
d1
d2
d3
50
1
1
1
0
0
0
5
1
1
0
0
0
1
10
1
0
1
0
1
0
20
1
0
0
0
1
1
100
0
1
1
1
0
0
200
0
1
0
1
0
1
500
0
0
1
1
1
0
1000
0
0
0
1
1
1
Comments
Default value
Table 3: Delay-time programming table
An un-configured chip is applying a default delay time of 50µs corresponding to [d 1, d2, d3] = 000 and [D 1, D2, D3] = 111.
The recovery time is set to o 1, o2, and o 3, resp. O1, O2, and O 3 which are the inverted values of o 1, o2, and o 3. Table 4 shows the value mapping
table for the 8 different recovery time delay values.
Recovery
time [ms]
O1
O2
O3
o1
o2
o3
Comments
500
1
1
1
0
0
0
Default value
10
1
1
0
0
0
1
20
1
0
1
0
1
0
50
1
0
0
0
1
1
100
0
1
1
1
0
0
200
0
1
0
1
0
1
1000
0
0
1
1
1
0
1500
0
0
0
1
1
1
Table 4: Recovery time programming table
An un-configured chip is applying the default recovery time of 500ms corresponding to [o 1, o2, o3] = 000 and [O 1, O2, O3] = 111.
Programming Example
An example for changing the delay time to 100µs is shown in the following diagram:
Clock
Data
1
0 1
1
0
0 0
0
0
4
5
7
8
1
1
1
1
0
0
1
1
1
1
0
0
Manchester
Code
Bit #
0
1
2
3
6
9 10 11 12 13 14 15 16 17 18 19 20
Figure 9: Programming example to set tdel to 100μs
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
8
Datasheet epc700_702 - V2.2
www.espros.ch
Layout Information (all measures in mm,
CSP-6 Package
)
Designed
Approved
Scale
Page
Part Name
<Name>
26.02.2009
<Name>
<Data>
M 1:1
DIN A4
1
Part No.
<x000 000>
<Partname>
This document is confidential and protected by law and international trades. It must not be show n to any third party nor be copied in any form without our written perm
. ission
epc700/epc702
File: Unbenannt
Layout Recommendations
∅ 0.12
0.43
0.43
∅0.3
0.56
1.0 +0.0/-0.1
0.56
≤0.1524
1.56
Mechanical Dimensions
Pin 1
Solder balls Sn7.5Ag2.5
0.43
0.15 ±0.01
0.3
1.4 +0.0/-0.1
0.43
1.86
no solder mask inside this area
Bottom View
0.25
Top view
1.9
2.9 - 3.1
QFN-16 Package
File:
Mechanical dimension CSP6
0.02
0.9
Mechanical dimension QFN16 Package
0.1-0.2
0.5
2.9 - 3.1
File:
Characteristics subject to change without notice
0.3
1.9
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Datasheet epc700_702 - V2.2
www.espros.ch
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epc700/epc702
Reflow Solder Profile
For infrared or conventional soldering the solder profile has to follow the recommendations of IPC/JEDEC J-STD-020C (min. revision C) for
Pb-free assembly for both types of packages. The peak soldering t emperature (TL) should not exceed +260°C for a maximum of 4 sec.
Packaging Information (all measures in mm)
Tape & Reel Information
The devices are packaged into embossed tapes for automatic placement systems. The tape is wound on 178 mm (7 inch) or 330 mm (13
inch) reels and individually packaged for shipment. General tape-and-reel specification data are available in a separate data sheet and indicate the tape sizes for various package types. Further tape-and-reel specifications can be found in the Electronic Industries Association (EIA)
standard 481-1, 481-2, 481-3.
CSP6 Tape
QFN16 Tape
Pin 1
12
8
Pin 1
2
8
8
CSP6
Tapeare no empty cavities
QFN16
Tape
epc does not guarantee that
there
the pick-and-place
machine Pin
should
check the presence of a chip
Pin 1in the tape. Thus,
1
during picking.
12
Ordering Information
Part Number
Package
RoHS compliance
Packaging Method
epc700-CSP6
4 CSP6
Yes
Reel
epc700-QFN16
QFN16
Yes
Reel
CSP6
Yes
QFN16
Yes
Reel
CSP6
Yes
Reel
QFN16
Yes
Reel
CSP6
Yes
Reel
QFN16
Yes
Reel
epc701-CSP6
epc701-QFN16
epc702-CSP6
epc702-QFN16
epc703-CSP6
epc703-QFN16
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
10
8
Reel
Datasheet epc700_702 - V2.2
www.espros.ch
epc700/epc702
IMPORTANT NOTICE
ESPROS Photonics AG and its subsidiaries (epc) reserve the right to make corrections, modifications, enhancements, improvements, and
other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the
latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject
to epc’s terms and conditions of sale supplied at the time of order acknowledgment.
epc warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with epc’s standard war ranty. Testing and other quality control techniques are used to the extent epc deems necessary to support this warranty. Except where man dated by government requirements, testing of all parameters of each product is not necessarily performed.
epc assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications
using epc components. To minimize the risks associated with customer products and applications, customers should provide adequate design
and operating safeguards.
epc does not warrant or represent that any license, either express or implied, is granted under any epc patent right, copyright, mask work
right, or other epc intellectual property right relating to any combination, machine, or process in which epc products or services are used.
Information published by epc regarding third-party products or services does not constitute a license from epc to use such products or
services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other
intellectual property of the third party, or a license from epc under the patents or other intellectual property of epc.
Resale of epc products or services with statements different from or beyond the parameters stated by epc for that product or service voids all
express and any implied warranties for the associated epc product or service. epc is not responsible or liable for any such statements.
epc products are not authorized for use in safety-critical applications (such as life support) where a failure of the epc product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such
use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge
and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of
epc products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by epc.
Further, Buyers must fully indemnify epc and its representatives against any damages arising out of the use of epc products in such safetycritical applications.
epc products are neither designed nor intended for use in military/aerospace applications or environments unless the epc products are spe cifically designated by epc as military-grade or "enhanced plastic." Only products designated by epc as military-grade meet military specifications. Buyers acknowledge and agree that any such use of epc products which epc has not designated as military-grade is solely at the
Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
epc products are neither designed nor intended for use in automotive applications or environments unless the specific epc products are desig nated by epc as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in
automotive applications, epc will not be responsible for any failure to meet such requirements.
© 2011 ESPROS Photonics Corporation
Characteristics subject to change without notice
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Datasheet epc700_702 - V2.2
www.espros.ch