LM50, LM50-Q1 SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013 LM50/LM50-Q1 SOT-23 Single-Supply Centigrade Temperature Sensor Check for Samples: LM50, LM50-Q1 FEATURES DESCRIPTION • The LM50/LM50-Q1 is a precision integrated-circuit temperature sensor that can sense a −40°C to +125°C temperature range using a single positive supply. The LM50/LM50-Q1's output voltage is linearly proportional to Celsius (Centigrade) temperature (+10 mV/°C) and has a DC offset of +500 mV. The offset allows reading negative temperatures without the need for a negative supply. The ideal output voltage of the LM50/LM50-Q1 ranges from +100 mV to +1.75V for a −40°C to +125°C temperature range. The LM50/LM50-Q1 does not require any external calibration or trimming to provide accuracies of ±3°C at room temperature and ±4°C over the full −40°C to +125°C temperature range. Trimming and calibration of the LM50/LM50Q1 at the wafer level assure low cost and high accuracy. The LM50/LM50-Q1's linear output, +500 mV offset, and factory calibration simplify circuitry required in a single supply environment where reading negative temperatures is required. Because the LM50/LM50-Q1's quiescent current is less than 130 μA, self-heating is limited to a very low 0.2°C in still air. 1 2 • • • • • • • • • • • Calibrated Directly in Degree Celsius (Centigrade) Linear + 10.0 mV/°C Scale Factor ±2°C Accuracy Specified at +25°C Specified for Full −40° to +125°C range Suitable for Remote Applications Low Cost Due to Wafer-level Trimming Operates from 4.5V to 10V Less than 130 μA Current Drain Low Self-heating, Less than 0.2°C in Still Air Nonlinearity Less than 0.8°C Over Temp LM50Q is AEC-Q100 Grade 1 qualified and is manufactured on an Automotive Grade flow. UL Recognized Component APPLICATIONS • • • • • • • • • • Automotive Computers Disk Drives Battery Management Automotive FAX Machines Printers Portable Medical Instruments HVAC Power Supply Modules Figure 1. SOT-23 Pin Out Top View See Package Number DBZ0003A Figure 2. Full-Range Centigrade Temperature Sensor Application (−40°C to +125°C) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. LM50, LM50-Q1 SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. (1) ABSOLUTE MAXIMUM RATINGS Supply Voltage +12V to −0.2V Output Voltage (+VS + 0.6V) to −1.0V Output Current 10 mA −65°C to +150°C Storage Temperature TJMAX, Maximum Junction Temperature 150°C (2) ESD Susceptibility : Human Body Model Machine Model (Does not apply for LM50-Q1) Charged Device Model (1) (2) 2000V 250V 750V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin. OPERATING RATINGS (1) Specified Temperature Range: TMIN to TMAX LM50C/LM50-Q1 −40°C to +125°C LM50B −25°C to +100°C −40°C to +150°C Operating Temperature Range θJA (2) 450°C/W Supply Voltage Range (+VS) +4.5V to +10V Soldering process must comply with Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging. (3) (1) (2) (3) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. Thermal resistance of the SOT-23 package is specified without a heat sink, junction to ambient. Reflow temperature profiles are different for lead-free and non-lead-free packages. ELECTRICAL CHARACTERISTICS Unless otherwise noted, these specifications apply for VS = +5 VDC and ILOAD = +0.5 μA, in the circuit of Figure 2. Boldface limits apply for the specified TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C, unless otherwise noted. Parameter Conditions LM50B Typical Accuracy (2) Nonlinearity (3) (4) 2 Limit (1) Units (Limit) ±2.0 ±3.0 °C (max) ±3.0 ±4.0 °C (max) TA = TMIN +3.0, −3.5 ±4.0 °C (max) Output Resistance (1) (2) Typical TA = TMAX Sensor Gain(Average Slope) (4) (1) TA = +25°C (3) Line Regulation LM50C/LM50-Q1 Limit 2000 +4.5V ≤ VS ≤ +10V ±0.8 ±0.8 °C (max) +9.7 +9.7 mV/°C (min) +10.3 +10.3 mV/°C (max) 4000 Ω (max) ±0.8 ±0.8 mV/V (max) ±1.2 ±1.2 mV/V (max) 4000 2000 Limits are specified to TI's AOQL (Average Outgoing Quality Level). Accuracy is defined as the error between the output voltage and 10mv/°C times the device's case temperature plus 500 mV, at specified conditions of voltage, current, and temperature (expressed in °C). Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's rated temperature range. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 LM50, LM50-Q1 www.ti.com SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013 ELECTRICAL CHARACTERISTICS (continued) Unless otherwise noted, these specifications apply for VS = +5 VDC and ILOAD = +0.5 μA, in the circuit of Figure 2. Boldface limits apply for the specified TA = TJ = TMIN to TMAX; all other limits TA = TJ = +25°C, unless otherwise noted. Parameter Conditions LM50B Typical Quiescent Current (5) +4.5V ≤ VS ≤ +10V +4.5V ≤ VS ≤ +10V Change of Quiescent Current Temperature Coefficient of Quiescent Current Long Term Stability (5) (6) (6) TJ = 125°C, for 1000 hours LM50C/LM50-Q1 Limit (1) Typical Limit (1) Units (Limit) 130 130 μA (max) 180 180 μA (max) 2.0 2.0 μA (max) +1.0 +2.0 μA/°C ±0.08 ±0.08 °C Quiescent current is defined in the circuit of Figure 2. For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate. TYPICAL CHARACTERISTICS To generate these curves the LM50/LM50-Q1 was mounted to a printed circuit board as shown in Figure 14. Thermal Resistance Junction to Air Thermal Time Constant Figure 3. Figure 4. Thermal Response in Still Air with Heat Sink (Figure 14) Thermal Response in Stirred Oil Bath with Heat Sink Figure 5. Figure 6. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 3 LM50, LM50-Q1 SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) To generate these curves the LM50/LM50-Q1 was mounted to a printed circuit board as shown in Figure 14. 4 Start-Up Voltage vs Temperature Thermal Response in Still Air without a Heat Sink Figure 7. Figure 8. Quiescent Current vs Temperature (Figure 2) Accuracy vs Temperature Figure 9. Figure 10. Noise Voltage Supply Voltage vs Supply Current Figure 11. Figure 12. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 LM50, LM50-Q1 www.ti.com SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013 TYPICAL CHARACTERISTICS (continued) To generate these curves the LM50/LM50-Q1 was mounted to a printed circuit board as shown in Figure 14. Start-Up Response Figure 13. PRINTED CIRCUIT BOARD A. ½″ Square Printed Circuit Board with 2 oz. Foil or Similar Figure 14. Printed Circuit Board Used for Heat Sink to Generate All Curves Mounting The LM50/LM50-Q1 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface and its temperature will be within about 0.2°C of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature of the LM50/LM50Q1 die would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity the backside of the LM50/LM50-Q1 die is directly attached to the GND pin. The lands and traces to the LM50/LM50-Q1 will, of course, be part of the printed circuit board, which is the object whose temperature is being measured. These printed circuit board lands and traces will not cause the LM50/LM50-Q1s temperature to deviate from the desired temperature. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 5 LM50, LM50-Q1 SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013 www.ti.com Alternatively, the LM50/LM50-Q1 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM50/LM50-Q1 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM50/LM50-Q1 or its connections. Table 1. Temperature Rise of LM50/LM50-Q1 Due to Self-Heating (Thermal Resistance, θJA) Still air SOT-23 SOT-23 no heat sink (1) small heat fin (2) 450°C/W 260°C/W Moving air (1) (2) 180°C/W Part soldered to 30 gauge wire. Heat sink used is ½″ square printed circuit board with 2 oz. foil with part attached as shown in Figure 14. Capacitive Loads Figure 15. LM50/LM50-Q1 No Decoupling Required for Capacitive Load Figure 16. LM50C/LM50-Q1 with Filter for Noisy Environment The LM50/LM50-Q1 handles capacitive loading very well. Without any special precautions, the LM50/LM50-Q1 can drive any capacitive load. The LM50/LM50-Q1 has a nominal 2 kΩ output impedance (as can be seen in Figure 17). The temperature coefficient of the output resistors is around 1300 ppm/°C. Taking into account this temperature coefficient and the initial tolerance of the resistors the output impedance of the LM50/LM50-Q1 will not exceed 4 kΩ. In an extremely noisy environment it may be necessary to add some filtering to minimize noise pickup. It is recommended that 0.1 μF be added from VIN to GND to bypass the power supply voltage, as shown in Figure 16. In a noisy environment it may be necessary to add a capacitor from the output to ground. A 1 μF output capacitor with the 4 kΩ output impedance will form a 40 Hz lowpass filter. Since the thermal time constant of the LM50/LM50-Q1 is much slower than the 25 ms time constant formed by the RC, the overall response time of the LM50/LM50-Q1 will not be significantly affected. For much larger capacitors this additional time lag will increase the overall response time of the LM50/LM50-Q1. 6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 LM50, LM50-Q1 www.ti.com SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013 *R2 ≈ 2k with a typical 1300 ppm/°C drift. Figure 17. Block Diagram TYPICAL APPLICATIONS Figure 18. Centigrade Thermostat/Fan Controller Figure 19. Temperature To Digital Converter (Serial Output) (+125°C Full Scale) Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 7 LM50, LM50-Q1 SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013 www.ti.com Figure 20. Temperature To Digital Converter (Parallel TRI-STATE Outputs for Standard Data Bus to μP Interface) (125°C Full Scale) Figure 21. LM50/LM50-Q1 With Voltage-To-Frequency Converter And Isolated Output (−40°C to +125°C; 100 Hz to 1750 Hz) 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 LM50, LM50-Q1 www.ti.com SNIS118E – JULY 1999 – REVISED SEPTEMBER 2013 REVISION HISTORY Changes from Revision C (February 2013) to Revision E Page • Added LM50-Q1 option throughout document ...................................................................................................................... 1 • Added Charged Device Model ESD for LM50B and LM50C ................................................................................................ 2 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM50 LM50-Q1 9 PACKAGE OPTION ADDENDUM www.ti.com 23-Aug-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM50BIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 150 T5B LM50BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 150 T5B LM50BIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 150 T5B LM50BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 150 T5B LM50CIM3 ACTIVE SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 150 T5C LM50CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 150 T5C LM50CIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 150 T5C LM50CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 150 T5C LM50QIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 150 T5Q LM50QIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 150 T5Q (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com (4) 23-Aug-2015 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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OTHER QUALIFIED VERSIONS OF LM50, LM50-Q1 : • Catalog: LM50 • Automotive: LM50-Q1 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 6-Mar-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LM50BIM3 SOT-23 DBZ 3 1000 178.0 8.4 LM50BIM3/NOPB SOT-23 DBZ 3 1000 178.0 LM50BIM3X SOT-23 DBZ 3 3000 178.0 LM50BIM3X/NOPB SOT-23 DBZ 3 3000 LM50CIM3 SOT-23 DBZ 3 LM50CIM3/NOPB SOT-23 DBZ LM50CIM3X SOT-23 DBZ LM50CIM3X/NOPB SOT-23 LM50QIM3/NOPB LM50QIM3X/NOPB 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 8.4 3.3 2.9 1.22 4.0 8.0 Q3 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 Pack Materials-Page 1 W Pin1 (mm) Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 6-Mar-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM50BIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM50BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM50BIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM50BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM50CIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM50CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM50CIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM50CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM50QIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM50QIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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