MC74AC00, MC74ACT00 Quad 2−Input NAND Gate High−Performance Silicon−Gate CMOS Features • • • • • • • Output Drive Capability: $24 mA Operating Voltage Range: 2 to 6 V AC00; 4.5 to 5.5 ACT00 Low Input Current: 1.0 mA High Noise Immunity Characteristic of CMOS Devices In Compliance With the JEDEC Standard No. 7A Requirements Chip Complexity: 32 FETs Pb−Free Packages are Available A1 B1 A2 B2 A3 B3 A4 B4 1 3 2 http://onsemi.com MARKING DIAGRAMS 14 PDIP−14 N SUFFIX CASE 646 14 6 5 1 1 14 SOIC−14 D SUFFIX CASE 751A Y1 14 4 MC74xxx00N AWLYYWWG 1 xxx00 AWLYWWG 1 Y2 14 Y = AB 9 8 10 12 11 13 Y3 xxx 00 ALYWG G TSSOP−14 DT SUFFIX CASE 948G 1 14 1 Y4 14 PIN 14 = VCC PIN 7 = GND SOEIAJ−14 M SUFFIX CASE 965 14 Figure 1. Logic Diagram 1 VCC B4 A4 Y4 B3 A3 Y3 14 13 12 11 10 9 8 1 2 3 4 5 6 7 A1 B1 Y1 A2 B2 Y2 GND 74xxx00 ALYWG 1 xxx = AC or ACT A = Assembly Location WL or L = Wafer Lot YY or Y = Year WW or W = Work Week G = Pb−Free Package FUNCTION TABLE Inputs Figure 2. Pinout: 14−Lead Packages (Top View) Output A B Y L L H H L H L H H H H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. © Semiconductor Components Industries, LLC, 2006 October, 2006 − Rev. 9 1 Publication Order Number: MC74AC00/D MC74AC00, MC74ACT00 MAXIMUM RATINGS Symbol Parameter Value Unit *0.5 to )7.0 V *0.5 v VI v VCC )0.5 V *0.5 v VO v VCC )0.5 V DC Input Diode Current $20 mA IOK DC Output Diode Current $50 mA IO DC Output Sink/Source Current $50 mA ICC DC Supply Current per Output Pin $50 mA IGND DC Ground Current per Output Pin $50 mA TSTG Storage Temperature Range *65 to )150 °C TL Lead temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction temperature under Bias )150 °C qJA Thermal resistance PDIP SOIC TSSOP 78 125 170 °C/W PD Power Dissipation in Still Air at 85°C PDIP SOIC TSSOP 78 125 170 mW MSL Moisture Sensitivity FR Flammability Rating VESD ESD Withstand Voltage ILatch−Up Latch−Up Performance VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK (Note 1) Level 1 Oxygen Index: 30% − 35% UL 94 V−0 @ 0.125 in Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 > 1000 V Above VCC and Below GND at 85°C (Note 5) $100 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. IO absolute maximum rating must be observed. 2. Tested to EIA/JESD22−A114−A. 3. Tested to EIA/JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter MC74AC00 MC74ACT00 Min Typ Max Unit 2.0 4.5 5.0 5.0 6.0 5.5 V 0 − VCC V VCC Supply Voltage Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) tr, tf Input Rise and Fall Time (Note 6) MC74AC00 VCC @ 3.0 V VCC @ 4.5 V VCC @ 5.5 V − − − 150 40 25 − − − ns/V tr, tf Input Rise and Fall Time (Note 7) MC74ACT00 VCC @ 4.5 V VCC @ 5.5 V − − 10 8.0 − − ns/V TJ Junction Temperature − − 150 °C TA Operating Ambient Temperature Range −55 25 125 °C IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA 6. Vin from 30% to 70% VCC. 7. Vin from 0.8 V to 2.0 V. http://onsemi.com 2 MC74AC00, MC74ACT00 DC CHARACTERISTICS MC74AC00 Symbol Parameter VCC (V) TA = +255C TA = −405C to +855C Typ TA = −555C + 1255C Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 2.1 3.15 3.85 2.1 3.15 3.85 2.1 3.15 3.85 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 3.0 4.5 5.5 1.5 2.25 2.75 0.9 1.35 1.65 0.9 1.35 1.65 0.9 1.35 1.65 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 3.0 4.5 5.5 2.99 4.49 5.49 2.9 4.4 5.4 2.9 4.4 5.4 2.9 4.4 5.4 V IOUT = −50 mA 3.0 4.5 5.5 − − − 2.56 3.86 4.86 2.46 3.76 4.76 2.4 3.7 4.7 V *VIN = VIL or VIH −12 mA IOH −24 mA −24 mA 3.0 4.5 5.5 0.002 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 V IOUT = 50 mA 3.0 4.5 5.5 − − − 0.36 0.36 0.36 0.44 0.44 0.44 0.5 0.5 0.5 V *VIN = VIL or VIH 12 mA IOL 24 mA 24 mA VOL Maximum Low Level Output Voltage IIN Maximum Input Leakage Current 5.5 − $0. 1 $1.0 $1.0 mA VI = VCC, GND IOLD †Minimum Dynamic Output Current 5.5 − − 75 50 mA VOLD = 1.65 V Max 5.5 − − −75 −50 mA VOHD = 3.85 V Min Maximum Quiescent Supply Current 5.5 − 4.0 40 40 mA VIN = VCC or GND IOHD ICC *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC. AC CHARACTERISTICS (tr = tf = 3.0 nS; CL = 50 pF; see Figures 3 and 4 for Waveforms) MC74AC00 VCC* (V) TA = +255C TA = −405C to +855C TA = −555C to + 1255C Min Typ Max Min Max Min Max Unit tPLH Propagation Delay 3.3 5.0 2.0 1.5 7.0 6.0 9.5 8.0 2.0 1.5 10.0 8.5 1.0 1.0 11.0 8.5 ns tPHL Propagation Delay 3.3 5.0 1.5 1.5 5.5 4.5 8.0 6.5 1.0 1.0 8.5 7.0 1.0 1.0 9.0 7.0 ns Symbol Parameter *Voltage Range 3.3 V is 3.3 V $0.3 V. Voltage Range 5.0 V is 5.0 V $0.5 V. http://onsemi.com 3 MC74AC00, MC74ACT00 DC CHARACTERISTICS MC74ACT00 Symbol Parameter VCC (V) TA = +255C TA = −405C to +855C Typ TA = −555C to + 1255C Guaranteed Limits Unit Conditions VIH Minimum High Level Input Voltage 4.5 5.5 1.5 1.5 2.0 2.0 2.0 2.0 2.0 2.0 V VOUT = 0.1 V or VCC − 0.1 V VIL Maximum Low Level Input Voltage 4.5 5.5 1.5 1.5 0.8 0.8 0.8 0.8 0.8 0.8 V VOUT = 0.1 V or VCC − 0.1 V VOH Minimum High Level Output Voltage 4.5 5.5 4.49 5.49 4.4 5.4 4.4 5.4 4.4 5.4 V IOUT = −50 mA 4.5 5.5 − − 3.86 4.86 3.76 4.76 3.7 4.7 V *VIN = VIL or VIH IOH −24 mA −24 mA 4.5 5.5 0.001 0.001 0.1 0.1 0.1 0.1 0.1 0.1 V IOUT = 50 mA 4.5 5.5 − − 0.36 0.36 0.44 0.44 0.5 0.5 V *VIN = VIL or VIH IOL 24 mA 24 mA VOL Maximum Low Level Output Voltage IIN Maximum Input Leakage Current 5.5 − $0.1 $1.0 $1.0 mA VI = VCC, GND DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 1.6 mA VI = VCC − 2.1 V IOLD †Minimum Dynamic Output Current 5.5 − − 75 50 mA VOLD = 1.65 V Max 5.5 − − −75 −50 mA VOHD = 3.85 V Min Maximum Quiescent Supply Current 5.5 − 4.0 40 40 mA VIN = VCC or GND IOHD ICC *All outputs loaded; thresholds on input associated with output under test. †Maximum test duration 2.0 ms, one output loaded at a time. AC CHARACTERISTICS (tr = tf = 3.0 nS; CL = 50 pF; see Figures 3 and 4 for Waveforms) MC74ACT00 Symbol Parameter TA = +255C TA = −405C to +855C TA = −555C to +1255C VCC* (V) Min Typ Max Min Max Min Max Unit tPLH Propagation Delay 5.0 1.5 5.5 9.0 1.0 9.5 1.0 9.5 ns tPHL Propagation Delay 5.0 1.5 4.0 7.0 1.0 8.0 1.0 8.0 ns *Voltage Range 5.0 V is 5.0 V $0.5 V. CAPACITANCE Symbol Parameter Value Typ Test Conditions Unit CIN Input Capacitance 4.5 VCC = 5.0 V pF CPD Power Dissipation Capacitance 30 VCC = 5.0 V pF http://onsemi.com 4 MC74AC00, MC74ACT00 tf tr VCC 90% INPUT Vmi A OR B 10% GND tPLH OUTPUT Y tPHL 50% Vmi = 50% for MC74AC00 = 1.5 V for MC74ACT00 Figure 3. Switching Waveforms INPUT OUTPUT DEVICE UNDER TEST 450 W CL* *Includes all probe and jig capacitance Figure 4. Test Circuit http://onsemi.com 5 50 W Scope Test Point MC74AC00, MC74ACT00 ORDER INFORMATION Device Package MC74AC00D SOIC−14 MC74AC00DG SOIC−14 (Pb−Free) MC74AC00N PDIP−14 MC74AC00NG PDIP−14 (Pb−Free) MC74AC00DR2 SOIC−14 MC74AC00DR2G SOIC−14 (Pb−Free) MC74AC00DTR2 TSSOP−14* MC74AC00DTR2G TSSOP−14* MC74AC00MEL SOEIAJ−14 MC74AC00MELG SOEIAJ−14 (Pb−Free) MC74ACT00N PDIP−14 MC74ACT00NG PDIP−14 (Pb−Free) MC74ACT00D SOIC−14 MC74ACT00DG SOIC−14 (Pb−Free) MC74ACT00DR2 SOIC−14 MC74ACT00DR2G SOIC−14 (Pb−Free) MC74ACT00DTR2 TSSOP−14* MC74ACT00DTR2G TSSOP−14* MC74ACT00MEL SOEIAJ−14 MC74ACT00MELG SOEIAJ−14 (Pb−Free) Shipping † 55 Units / Rail 25 Units / Rail 2500 / Tape and Reel 2000 / Tape and Reel 25 Units / Rail 55 Units / Rail 2500 / Tape and Reel 2000 / Tape and Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 6 MC74AC00, MC74ACT00 PACKAGE DIMENSIONS SOIC−14 CASE 751A−03 ISSUE H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 14 8 −B− P 7 PL 0.25 (0.010) M 7 1 G −T− D 14 PL 0.25 (0.010) T B S A DIM A B C D F G J K M P R J M K M F R X 45 _ C SEATING PLANE B M S SOLDERING FOOTPRINT* 7X 7.04 14X 1.52 1 14X 0.58 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 MC74AC00, MC74ACT00 PDIP−14 CASE 646−06 ISSUE P 14 8 1 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. B A F L N C −T− SEATING PLANE H G D 14 PL J K 0.13 (0.005) M M http://onsemi.com 8 DIM A B C D F G H J K L M N INCHES MIN MAX 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 BSC 0.052 0.095 0.008 0.015 0.115 0.135 0.290 0.310 −−− 10 _ 0.015 0.039 MILLIMETERS MIN MAX 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 BSC 1.32 2.41 0.20 0.38 2.92 3.43 7.37 7.87 −−− 10 _ 0.38 1.01 MC74AC00, MC74ACT00 PACKAGE DIMENSIONS TSSOP−14 CASE 948G−01 ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S N 2X 14 L/2 M B −U− L PIN 1 IDENT. N F 7 1 0.15 (0.006) T U 0.25 (0.010) 8 S DETAIL E ÇÇÇ ÉÉÉ ÇÇÇ ÉÉÉ ÇÇÇ K A −V− K1 J J1 SECTION N−N −W− C 0.10 (0.004) −T− SEATING PLANE D H G DETAIL E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C −−− 1.20 −−− 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.50 0.60 0.020 0.024 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC M 0_ 8_ 0_ 8_ SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 MC74AC00, MC74ACT00 PACKAGE DIMENSIONS SOEIAJ−14 CASE 965−01 ISSUE A 14 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 8 Q1 E HE M_ L 7 1 DETAIL P Z D VIEW P A e A1 b 0.13 (0.005) c M 0.10 (0.004) DIM A A1 b c D E e HE 0.50 LE M Q1 Z MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.10 0.20 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 −−− 1.42 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.004 0.008 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 −−− 0.056 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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