Material Content Data Sheet Sales Product Name SAF-XC822MT-1FRI AA MA# MA000842326 Package PG-TSSOP-16-1 Issued 29. August 2013 Weight* 59.93 mg Average Mass [%] Sum [%] 5.29 Average Mass [ppm] Sum [ppm] 52858 52858 Construction Element Material Group Substances CAS# if applicable Weight [mg] chip leadframe inorganic material non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon nickel iron gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7440-02-0 7439-89-6 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 3.168 5.29 8.109 13.53 11.199 18.69 32.22 186852 322159 0.300 0.50 0.50 5013 5013 0.104 0.17 wire encapsulation leadfinish plating glue *deviation 135307 1728 4.385 7.32 30.038 50.10 57.59 501194 576085 0.915 1.53 1.53 15264 15264 0.856 1.43 1.43 14289 14289 0.189 0.32 0.670 1.12 73163 3153 1.44 11179 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 14332 1000000