SAW BANDPASS FILTER ACT PART NO.: ACTF9201_2535MHz_DCC6C Product Type: Customer: SAW Filter Part NO.: Customer Part NO.: ACTF9201_2535MHz_DCC6C PREPARED BY Issued Date: CHECKED BY APPROVED BY Features Low-loss RF filter for mobile systems Low amplitude ripple No matching network required for operation at 50Ω Ceramic package for Surface Mounted Technology (SMT) Lead-free production and RoHS compliant Package Dimensions Ceramic Package: DCC6C Pin Configuration 2 Input 5 Output 1, 3, 4, 6 Ground Marking Top View, Laser Marking "ACT”: Manufacturer’s mark “F”: SAW filter “9201”: Part number ” · ”: Terminal 1 “＊”: Code 1 2 Lot number (The code shown below varies in a 4-year cycle) 3 4 5 6 7 8 9 10 11 12 2009 A B C D E F G H J K L M 2010 N P Q R S T U V W X Y Z 2011 a b c d e f g h i j k m 2012 n p q r s t u v w x y z Maximum Ratings Rating Value Unit P 10 dBm DC Voltage VDC 12 V Operating Temperature Range TA -40 ~ +85 °C Storage Temperature Range Tstg -40 ~ +85 °C Input Power Level -2- Electrical Characteristics Item Minimum Center Frequency fC Insertion Loss IL 2500.00 …. 2570.00 MHz Group Delay Ripple -- Unit MHz 1.8 2.6 dB 8 20 ns α DC …. 1000.00 MHz 23 28 dB 1000.00 …. 2400.00 MHz 23 28 dB 2400.00 …. 2460.00 MHz 15 27 dB 2620.00 …. 2690.00 MHz 28 38 dB 2690.00 …. 3000.00 MHz 30 34 dB 3000.00 …. 3500.00 MHz 30 34 dB 3500.00 …. 5000.00 MHz 20 Amplitude Ripple (p-p) 2500.00 …. 2570.00 MHz Output Maximum 2535 2500.00 …. 2570.00 MHz Absolute Attenuation Intput Typical VSWR VSWR Δα dB 0.9 1.5 2500.00 …. 2570.00 MHz 1.2：1 2.0：1 2500.00 …. 2570.00 MHz 1.2：1 2.0：1 Input / Output Impedance (Nominal) 50 RoHS Compliant Electrostatic Sensitive Device Typical Frequency Response -3- dB Ω -4- Stability Characteristics Test item Condition of test 1 Mechanical shock (a) Drops: 3 times on concrete floor (b) Height: 1.0 m 2 Vibration resistance (a) Frequency of vibration: 10~55Hz (c) Directions: X,Y and Z (b) Amplitude: 1.5 mm (d) Duration: 2 hours 3 Moisture resistance (a) Condition: 40°C, 90~95% R.H. (c) Wait 4 hours before measurement (b) Duration: 96 hours 4 Climatic sequence (a) +70°C for 16 hours (b) +55°C for 24 hours, 90~95% R.H. (c) -25°C for 2 hours (d) +40°C for 24 hours, 90~95% R.H. (e) Wait 4 hours before measurement 5 High temperature exposure (a) Temperature: 70°C (c) Wait 4 hours before measurement 6 Thermal impact (a) +70°C for 30 minutes ⇒ -25°C for 30 minutes repeated 3 times (b) Wait 4 hours before measurement (b) Duration: 250 hours Requirements: The SAW filer shall remain within the electrical specifications after tests. Remarks SAW devices should not be used in any type of fluid such as water, oil, organic solvent, etc. Be certain not to apply voltage exceeding the rated voltage of components. Do not operate outside the recommended operating temperature range of components. Sudden change of temperature shall be avoided, deterioration of the characteristics can occur. Be careful of soldering temperature and duration of components when soldering. Do not place soldering iron on the body of components. Be careful not to subject the terminals or leads of components to excessive force. SAW devices are electrostatic sensitive. Please avoid static voltage during operation and storage. Ultrasonic cleaning shall be avoided. Ultrasonic vibration may cause destruction of components. Test Circuit Recommended Land Pattern -5- Packing Information Carrier Tape Reel Dimensions Outer Packing Type Carton Box Ⅰ Carton Box Ⅱ Quantity Dimension Description Weight 10000 190×190×95 0.85 20000 190×190×190 anti-static plastic bag & carton box 1 reel / bag 5 bags / box (10000 pcs) 10 bags / box (20000 pcs) Unit: mm 1.80 Unit: kg -6- Recommended Soldering Profile C ACT 2010. All Rights Reserved. ○ E 1. 2. 3. A The specifications of this device are subject to change or obsolescence without notice. Typically, equipment utilizing this device requires emissions testing and government approval, which is the responsibility of the equipment manufacturer. Our liability is only assumed for the Surface Acoustic Wave (SAW) component(s) per se, not for applications, processes and circuits implemented within components or assemblies. -7-