Material Content Data Sheet Sales Product Name SPW11N60CFD MA# MA001082472 Package PG-TO247-3-41 Issued 29. August 2013 Weight* 6047.66 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal non noble metal noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel antimony silver tin phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7440-36-0 7440-22-4 7440-31-5 7723-14-0 7439-89-6 7440-50-8 7.017 0.12 0.530 0.01 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.12 1160 1160 88 0.159 0.00 529.068 8.75 8.76 87483 26 87597 1.194 0.02 0.02 197 197 20.027 0.33 3312 380.520 6.29 1602.190 26.49 33.11 264928 331160 31.874 0.53 0.53 5271 5271 29.065 0.48 0.48 4806 4806 0.353 0.01 0.883 0.01 2.296 0.04 1.033 0.02 3.442 0.06 3438.006 56.84 62920 58 146 0.06 380 569 56.92 568485 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 584 171 569225 1000000