Kemet C1808C200GDGAC Ceramic chip / high voltage Datasheet

CERAMIC CHIP / HIGH VOLTAGE
KEMET's High Voltage Surface Mount Capacitors are designed to withstand high voltage applications. They
offer high capacitance with low leakage current and low ESR at high frequency. The capacitors have pure tin
(Sn) plated external electrodes for good solderability. X7R dielectrics are not designed for AC line filtering
applications. An insulating coating may be required to prevent surface arcing. These components are RoHS
compliant.
MARKETS
Markets
APPLICATIONS
Applications
• Switch Mode Power Supply
• Input Filter
• Resonators
• Tank Circuit
• Snubber Circuit
• Output Filter
• High Voltage Coupling
• High Voltage DC Blocking
• Lighting Ballast
• Voltage Multiplier Circuits
• Coupling Capacitor/CUK
• Power Supply
• High Voltage Power Supply
• DC-DC Converter
• LCD Fluorescent Backlight Ballast
• HID Lighting
• Telecommunications Equipment
• Industrial Equipment/Control
• Medical Equipment/Control
• Computer (LAN/WAN Interface)
• Analog and Digital Modems
• Automotive
OUTLINE
Outline DRAWING
Drawing
W
TIN PLATE
L
B
T
NICKEL PLATE
ELECTRODES
CONDUCTIVE
METALLIZATION
Ceramic Surface Mount
S
TABLE 1 - DIMENSIONS - MILLIMETERS (in.)
Metric
Code
EIA Size
Code
L - Length
W - Width
B - Bandwidth
Band
Separation
2012
0805
2.0 (0.079)
± 0.2 (0.008)
1.2 (0.049)
± 0.2 (0.008)
0.5 (0.02
±0.25 (0.010)
0.75 (0.030)
3216
1206
3.2 (0.126)
± 0.2 (0.008)
1.6 (0.063)
± 0.2 (0.008)
0.5 (0.02)
± 0.25 (0.010)
N/A
3225
1210
3.2 (0.126)
± 0.2 (0.008)
2.5 (0.098)
± 0.2 (0.008)
0.5 (0.02)
± 0.25 (0.010)
N/A
4520
1808
4.5 (0.177)
± 0.3 (0.012)
2.0 (0.079
± 0.2 (0.008)
0.6 (0.024)
± 0.35 (0.014)
N/A
4532
1812
4.5 (0.177)
± 0.3 (0.012)
3.2 (0.126)
± 0.3 (0.012)
0.6 (0.024)
± 0.35 (0.014)
N/A
4564
1825
4.5 (0.177)
± 0.3 (0.012)
6.4 (0.250)
± 0.4 (0.016)
0.6 (0.024)
± 0.35 (0.014)
N/A
5650
2220
5.6 (0.224)
± 0.4 (0.016)
5.0 (0.197)
± 0.4 (0.016)
0.6 (0.024)
± 0.35 (0.014)
N/A
5664
2225
5.6 (0.224)
± 0.4 (0.016)
6.4 (0.250)
± 0.4 (0.016)
0.6 (0.024)
± 0.35 (0.014)
N/A
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
81
CERAMIC CHIP / HIGH VOLTAGE
C0G DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.)
C,D
C,D
K,M
C,D
J,K,M
C,D
J,K,M
C,D
J,K,M
C,D
J,K,M
C,D
J,K,M
C,D G,J,K,M
C,D G,J,K,M
C,D G,J,K,M
C,D G,J,K,M
C,D G,J,K,M
C,D G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
D,F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
F,G,J,K,M
g
0.065
0.065
0.065
0.101
0.101
0.101
0.101
0.080
0.080
0.080
0.080
0.080
0.080
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
1500
2000
500
1000
1500
2000
500
1000
1500
2000
2500
3000
500
1000
1500
2000
2500
3000
500
1000
1500
2000
2500
3000
500
1000
1500
2000
2500
3000
500
1000
1500
2000
2500
3000
2225
0.065
2220
1000
1825
0.050
1812
500
1808
0.050
Cap Code/
Voltage
1210
109-249
279-519
569-919
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
* Contact KEMET Sales Representative for C, D, F & G Capacitance Tolerance availability.
Note: Actual thickness dimensions may be less than stated maximum. Check the KEMET website, www.kemet.com, for additional values and chip sizes available.
82
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Ceramic Surface Mount
1.0-2.4
2.7-5.1
5.6-9.1
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
1000
1100
1200
1300
1500
1600
1800
2000
2200
2400
2700
3000
3300
3600
3900
4300
4700
5100
5600
6200
6800
7500
8200
9100
10,000
*
Max
Thickness
(in)
1206
500
Cap
pF
Capacitance
Tolerance
0805
1000
p
Series
CERAMIC CHIP / HIGH VOLTAGE
X7R DIELECTRIC CAPACITANCE VALUES AND THICKNESS TARGETS (in.)
0.080
0.080
0.080
0.080
0.080
0.080
0.080
0.080
0.080
0.080
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
0.067
1000
1500
2000
500
1000
1500
2000
2500
3000
500
1000
1500
2000
2500
3000
500
1000
1500
2000
2500
3000
500
1000
1500
2000
2500
3000
500
1000
1500
2000
2500
3000
2225
0.065
2220
500
1825
0.065
1812
2000
1808
0.065
0.065
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
101
111
121
131
151
181
221
271
331
391
471
561
681
821
102
122
152
182
202
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
623
683
823
104
124
154
184
224
Ceramic Surface Mount
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
J,K,M
g
1210
1500
0.050
500
Cap Code/
Voltage
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
100
110
120
130
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2000
2200
2700
3300
3900
4700
5600
6800
8200
10,000
12,000
15,000
18,000
22,000
27,000
33,000
39,000
47,000
56,000
62,000
68,000
82,000
100,000
120,000
150,000
180,000
220,000
1206
1000
Max
Thickness
(in)
0.050
Capacitance
Tolerance
500
Cap
pF
0805
1000
p
Series
Note: Actual thickness dimensions may be less than stated maximum.
Check the KEMET website, www.kemet.com, for additional values and chip sizes available.
KEMET HIGH VOLTAGE SURFACE MOUNT CHIP (VOLTAGE CODES C,D,F,G,H, and Z)
THICKNESS AND REELING QUANTITIES
Chip size
EIA
0805
1206
1210
1808
1812/1813
1825
2220
2225
Metric
2012
3216
3225
4520
4532
4564
5650
5664
Max.
Thickness (in)
0.055
0.065
0.101
0.080
0.067
0.067
0.067
0.067
Max.
Thickness (mm)
1.27
1.65
2.57
2.03
1.70
1.70
1.70
1.70
Tape Width
(mm)
8
8
8
12
12
12
12
12
Qty per Reel Qty per Reel
7" Plastic
13" Plastic
2,500
10,000
2,000
8,000
2,000
8,000
1,000
4,000
1,000
4,000
1,000
4,000
1,000
4,000
1,000
4,000
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
83
CERAMIC CHIP / HIGH VOLTAGE
CAPACITOR
ORDERING
INFORMATION
Capacitor
Ordering Information
C
0805
C
102
K
C
R
A
C
Style
Style
C - Ceramic
Chip
ChipSize
Size
0805; 1206; 1210; 1808;
1812; 1825; 2220; 2225
End Metallization
Metallization
C = Standard
Failure
Failure Rate Level
A = Not Applicable
Specification
Specification
C - Standard
CapacitanceCode,
Code,pF
pF
Capacitance
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
(Use “9” for 1.0 through 9.9 pF)
(Use “8” for 0.1 through .99 pF)
Temperature Characteristic
Characteristic
Designated by Capacitance
Change over Temperature Range
G – (C0G) (±30ppm/C) (-55°C +125°C)
R – X7R (±15%) (-55°C +125°C)
Capacitance
CapacitanceTolerance
Tolerance
C = ±0.25pF*
J = ±5%
D = ±0.5pF*
K = ±10%
F = ±1%*
M = ±20%
G = ±2%*
* Contact KEMET Sales for availability.
C = 500V
D = 1000V
F = 1500V
Voltage
G = 2000V
Z = 2500V
H = 3000V
ELECTRICAL
Electrical PARAMETERS
Parameters
Property
Specification
C0G: 1 pF to 0.010 µF
X7R: 10 pF
pf to 0.22 µF
25°C, 1.0 ± 0.2 Vrms, 1 kHz (1 MHz for ≤ 1000 pF (C0G only)
C0G: C*, D*, F*, G*, J, K, M
* Contact KEMET Sales for availability.
X7R: J, K, M
C0G: 0.1% Max
X7R: 2.5% Max
Capacitance
Cap Tolerance
DF
Voltage Ratings
500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V
Operating Temperature Range
From -55ºC
-55C to
to +125C
+125ºC
25ºC IR @ 500V
100 GΩ or 1000 MΩ-µF, whichever is less
125ºC IR @ 500V
10 GΩ or 100 MΩ-µF, whichever is less
-55ºC TCC
+125ºC TCC
X7R: + 15%
C0G: + 30 ppm / ºC
150% of Rated Voltage for Rated Voltage <1000 V
120% of Rated Voltage for Rated Voltage >=1000V
Dielectric Strength
Ripple Current
Consult KEMET Sales Representative
MARKING
Marking
These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost.
Details on the marking format is located on page 97.
Packaging
PACKAGING
KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk
bag as outlined on page 83. Please consult factory for waffle packaging options.
SOLDERING
PROCESS
Soldering Process
The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and
larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of
pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of
the termination.
RecommendedSOLDER
Solder Pad
RECOMMENDED
PADDimensions
DIMENSIONS
Chip Size
0805
1206
1210
1808
1812
1825
2220
2225
84
T (Total Length)
S (Separation
mm
3.30
4.50
4.50
5.90
5.90
5.90
7.00
7.00
mm
0.70
1.50
1.50
2.30
2.30
2.30
3.30
3.30
in.
0.130
0.177
0.177
0.232
0.232
0.232
0.276
0.276
in.
0.028
0.059
0.059
0.091
0.091
0.091
0.130
0.130
W (Pad Width)
mm
1.60
2.00
2.90
2.40
3.70
6.90
5.50
6.80
in.
0.063
0.079
0.114
0.094
0.146
0.272
0.217
0.268
L (Pad Length)
mm
1.30
1.50
1.50
1.80
1.80
1.80
1.85
1.85
in.
0.051
0.059
0.059
0.071
0.071
0.071
0.073
0.073
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
Packaging Information
Tape & Reel Packaging
KEMET offers Multilayer Ceramic Chip Capacitors
packaged in 8mm and 12mm plastic tape on 7" and
13" reels in accordance with EIA standard 481-1:
Taping of surface mount components for automatic
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 78
for details on reeling quantities for commercial chips
and page 87 for MIL-PRF-55681 chips.
g
handling. This packaging system is compatible with all
tape fed automatic pick and place systems. See page 81
for details on reeling quantities for commercial chips
and page 90 for MIL-PRF-55681 chips.
Anti-Static Reel
Embossed Carrier*
0402 and 0603 case sizes
available on punched paper only.
®
T
ME
KE
Chip Orientation
in Pocket
(except 1825 Commercial, and 1825 & 2225 Military)
Embossment
8mm ±.30
(.315 ±.012")
or
12mm ±.30
(.472 ±.012")
178mm (7.00")
or
330mm (13.00")
Anti-Static Cover Tape
(.10mm (.004") Max Thickness)
* Punched paper carrier used for 0402 and 0603 case size.
SURFACE MOUNT LAND DIMENSIONS - CERAMIC CHIP CAPACITORS - MM
Reflow Solder
Dimension
0402
0603
0805
1206
1210
1812
1825
2220
2225
CourtyardC
C
X
X
GG
Y
Z
Z
Y
Z
2.14
2.78
3.30
4.50
4.50
5.90
5.90
7.00
7.00
G
0.28
0.68
0.70
1.50
1.50
2.30
2.30
3.30
3.30
X Y(ref) C(ref)
0.74 0.93 1.21
1.08 1.05 1.73
1.60 1.30 2.00
2.00 1.50 3.00
2.90 1.50 3.00
3.70 1.80 4.10
6.90 1.80 4.10
5.50 1.85 5.15
6.80 1.85 5.15
Wave Solder
Z
G
X
Y(ref) Smin
Not Recommended
3.18
3.70
4.90
4.90
0.68
0.70
1.50
1.50
0.80
1.10
1.40
2.00
1.25
1.50
1.70
1.70
1.93
2.20
3.20
3.20
Not Recommended
Packaging
Grid
Grid
placement
courtyard
Placement
Calculation Formula
Z = Lmin + 2Jt + Tt
G = Smax - 2Jh -Th
X = Wmin + 2Js + Ts
Tt, Th, Ts = Combined tolerances
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
93
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Performance Notes
1. Cover Tape Break Force: 1.0 Kg Minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width
Peel Strength
8 mm
0.1 Newton to 1.0 Newton (10g to 100g)
12 mm
0.1 Newton to 1.3 Newton (10g to 130g)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier
tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape
shall be pulled at a velocity of 300 ±10 mm/minute.
3. Reel Sizes: Molded tantalum capacitors are available on either 180 mm (7") reels (standard) or 330 mm (13")
reels (with C-7280). Note that 13” reels are preferred.
4. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes.
Refer to EIA-556.
Embossed Carrier Tape Configuration: Figure 1
Table 1 — EMBOSSED TAPE DIMENSIONS (Metric will govern)
Constant Dimensions — Millimeters (Inches)
Tape Size
8 mm
and
12 mm
D0
E
1.5
1.75 ±0.10
+0.10 -0.0
(0.059
(0.069 ±0.004)
+0.004, -0.0)
P0
P2
T Max
T1 Max
4.0 ±0.10
2.0 ±0.05
0.600
0.100
(0.157 ±0.004)
(0.079 ±0.002)
(0.024)
(0.004)
Variable Dimensions — Millimeters (Inches)
Tape Size
Pitch
B1 Max.
Note 1
D1 Min.
Note 2
F
P1
R Min.
Note 3
T2 Max
W
8 mm
Single
(4 mm)
4.4
1.0
3.5 ±0.05
4.0 ±0.10
25.0
2.5
8.0 ±0.30
(.315 ±0.012)
12 mm
Double
(8 mm)
(0.173)
(0.039) (0.138 ±0.002)
(0.157 ±0.004) (0.984)
(0.098)
8.2
(0.323)
1.5
5.5 ±0.05
(0.059) (0.217 ±0.002)
8.0 ±0.10
30.0
(0.315 ±0.004) (1.181)
4.6
12.0 ±0.30
(0.181) (0.472 ±0.012)
A0B0K0
Note 4
NOTES
1. B1 dimension is a reference dimension for tape feeder clearance only.
2. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of
embossment location and hole location shall be applied independent of each other.
3. Tape with components shall pass around radius “R” without damage (see sketch A). The minimum trailer length (Fig. 2) may require
additional length to provide R min. for 12 mm embossed tape for reels with hub diameters approaching N min. (Table 2)
4. The cavity defined by A0, B0, and K0 shall be configured to surround the part with sufficient clearance such that the chip does not protrude beyond the sealing plane of the cover tape, the chip can be removed from the cavity in a vertical direction without mechanical
restriction, rotation of the chip is limited to 20 degrees maximum in all 3 planes, and lateral movement of the chip is restricted to 0.5 mm
maximum in the pocket (not applicable to vertical clearance.)
94
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
TANTALUM, CERAMIC AND
ALUMINUM CHIP CAPACITORS
Packaging Information
Embossed Carrier Tape Configuration (cont.)
20°
Sketch D: Tape Camber (Top View)
1mm (0.039) Max.
1mm (0.039) Max.
250mm (9.843)
Allowable camber to be 1 mm/250 mm.
400mm (15.75) Min.
Figure 2:
Tape Leader
& Trailer
Dimensions
(Metric
Dimensions
Will Govern)
Packaging
Figure 3: Reel Dimensions (Metric Dimensions will govern)
Table 2 – REEL DIMENSIONS (Metric will govern)
Tape Size
8 mm
A Max
330.0
(12.992)
B* Min
1.5
(0.059)
C
13.0 ± 0.20
(0.512 ± 0.008)
D* Min
20.2
(0.795)
12 mm
330.0
(12.992)
1.5
(0.059)
13.0 ± 0.20
(0.512 ± 0.008)
20.2
(0.795)
N Min
50.0
(1.969)
See
Note 3
Table 1
W1
8.4
+1.5, -0.0
(0.331
+0.059, -0.0)
12.4
+2.0, -0.0
(0.488
+0.078, -0.0)
W2 Max
14.4
(0.567)
18.4
(0.724)
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
W3
7.9 Min
(0.311)
10.9 Max
(0.429)
11.9 Min
(0.469)
15.4 Max
(0.606)
95
CERAMIC CHIP CAPACITORS
Packaging Information
Punched Carrier (Paper Tape) Configuration (Ceramic Chips Only):
10 pitches cumulative
tolerance on tape
±0.2 (±0.008)
P0
T
P2
D0
E
Top
Tape
Cover
Bottom
Tape
Cover
A0
F
W
B0
G2
T1
P1
User Direction of Feed
Center lines
of cavity
Max. Cavity Size
See Note 1
Table 1
Table 1: 8 & 12mm Punched Tape
(Metric Dimensions Will Govern)
Constant Dimensions - Millimeters (Inches)
Tape
Size
D0
P0
E
T1
P2
G1
G2
R Min.
8mm
1.5
1.75 ±0.10
4.0 ± 0.10
2.0 ± 0.05
0.10 0.75 0.75 25 (.984)
and
+0.10, -0.0
(.004) (.030) (.030) See Note 2
12mm
(.059
(.069 ±0.004) (.157 ± 0.004) (.079 ± 0.002) Max. Min. Min.
Table 1
+0.004, -0.0)
Table 1: 8 & 12mm Punched Tape
(Metric Dimensions Will Govern)
Variable Dimensions - Millimeters (Inches)
Tape
Size
8mm
1/2
Pitch
P1
2.0 ± 0.10
(.079 ±.004)
3.5 ± 0.05
See Requirements
Section 3.3 (d) (.138 ± .002)
8mm
4.0 ± 0.10
(0.157 ± .004)
12mm
4.0 ± 0.10
(0.157 ± .004)
A0B0
W
F
5.5 ± 0.05
12mm
8.0 ± 0.10
(.217 ± .002)
Double (0.315 ± .004)
Pitch
8.0 ± 0.3
(.315 ± 0.012)
See Note 1
Table 1
12.0 ± 0.3
T
1.1mm (.043)
Max. for Paper
Base Tape and
1.6mm (.063)
Max. for NonPaper Base
Compositions.
See Note 3.
(.472 ± .012)
Note:
1. A0, B0 and T determined by the maximum dimensions to the ends of the terminals extending from the
body and/or the body dimensions of the component. The clearance between the ends of the terminals or
body of the component to the sides and depth of the cavity (A0, B0 and T) must be within 0.05mm (.002)
minimum and 0.50mm (.020) maximum. The clearance allowed must also prevent rotation of the component
within the cavity of not more than 20 degrees (see sketches A and B).
2. Tape with components shall pass around radius "R" without damage.
3. KEMET nominal thicknesses are: 0402 = 0.6mm and all others 0.95mm minimum.
Sketch A:
Bending Radius
See Note 2
Table 1
Sketch B:
Max. Component
Rotation - Front
Cross Sectional View
R
(Min.)
20°
96
Sketch C:
Component Rotation - Top View
Maximum
20° component rotation.
Typical
component
center line
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
CERAMIC CHIP CAPACITORS
Packaging Information
Bulk Cassette Packaging (Ceramic Chips only)
Table 2 – Capacitance Values Available
In Bulk Cassette Packaging
6.8 ± 0.1
8.8 ± 0.1
12.0 ± 0.1
(Meets Dimensional Requirements IEC-286-6 and EIAJ 7201)
53.3*
2.0 ±
31.5 ± 0.2
0
3.0 ±
0.1
0
0
0.1
0.2
0
0402
All
All
All
All
0603
All
All
All
All
0805
C0G
200
100
50
109
109
109
181
331
102
X7R
200
100
50
25
16
221
221
221
221
221
392
103
273
104
104
Y5V
25
16
104
104
224
224
19.0*
1.5 ±
Unit: mm
* Reference
36 ± 00.2
10*
Min. Max.
Case
Cap Cap
Size Dielectric Voltage Value Value
5.0*
110 ± 0.7
Table 1 – Capacitor Dimensions for Bulk
Cassette Packaging – Millimeters
Metric
Size
Code
EIA
Size
Code
1005
1608
2012
0402
0603
0805
Length
L
Width
W
Thickness Bandwidth
T
B
1.0 ± 0.05 0.5 ± 0.05
1.6 ± 0.07 0.8 ± 0.07
2.0 ± 0.10 1.25 ± 0.10
0.5 ± .05
0.8 ± .07
0.6 ± .10
0.2 to 0.4
0.2 to 0.5
0.5 to 0.75
Minimum
Separation
S
Number of
Pcs/Cassette
0.3
0.7
0.75
50,000
15,000
10,000
Terminations: KEMET nickel barrier layer with a tin overplate.
CAPACITOR MARKING TABLE
(Marking Optional - Not Available
for 0402 Size or Y5V Dielectric)
9
0
1
2
3
4
5
6
7
A
B
C
D
E
F
G
H
J
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Z
a
b
d
e
f
m
n
t
y
0.10
0.11
0.12
0.13
0.15
0.16
0.18
0.20
0.22
0.24
0.27
0.30
0.33
0.36
0.39
0.43
0.47
0.51
0.56
0.62
0.68
0.75
0.82
0.91
0.25
0.35
0.40
0.45
0.50
0.60
0.70
0.80
0.90
1.0
1.1
1.2
1.3
1.5
1.6
1.8
2.0
2.2
2.4
2.7
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.2
6.8
7.5
8.2
9.1
2.5
3.5
4.0
4.5
5.0
6.0
7.0
8.0
9.0
10
11
12
13
15
16
18
20
22
24
27
30
33
36
39
43
47
51
56
62
68
75
82
91
25
35
40
45
50
60
70
80
90
100
110
120
130
150
160
180
200
220
240
270
300
330
360
390
430
470
510
560
620
680
750
820
910
250
350
400
450
500
600
700
800
900
1000
1100
1200
1300
1500
1600
1800
2000
2200
2400
2700
3000
3300
3600
3900
4300
4700
5100
5600
6200
6800
7500
8200
9100
2500
3500
4000
4500
5000
6000
7000
8000
9000
10,000
11,000
12,000
13,000
15,000
16,000
18,000
20,000
22,000
24,000
27,000
30,000
33,000
36,000
39,000
43,000
47,000
51,000
56,000
62,000
68,000
75,000
82,000
91,000
25,000
35,000
40,000
45,000
50,000
60,000
70,000
80,000
90,000
100,000
110,000
120,000
130,000
150,000
160,000
180,000
200,000
220,000
240,000
270,000
300,000
330,000
360,000
390,000
430,000
470,000
510,000
560,000
620,000
680,000
750,000
820,000
910,000
250,000
350,000
400,000
450,000
500,000
600,000
700,000
800,000
900,000
1,000,000
1,100,000
1,200,000
1,300,000
1,500,000
1,600,000
1,800,000
2,000,000
2,200,000
2,400,000
2,700,000
3,000,000
3,300,000
3,600,000
3,900,000
4,300,000
4,700,000
5,100,000
5,600,000
6,200,000
6,800,000
7,500,000
8,200,000
9,100,000
2,500,000
3,500,000
4,000,000
4,500,000
5,000,000
6,000,000
7,000,000
8,000,000
9,000,000
10,000,000
11,000,000
12,000,000
13,000,000
15,000,000
16,000,000
18,000,000
20,000,000
22,000,000
24,000,000
27,000,000
30,000,000
33,000,000
36,000,000
39,000,000
43,000,000
47,000,000
51,000,000
56,000,000
62,000,000
68,000,000
75,000,000
82,000,000
91,000,000
25,000,000
35,000,000
40,000,000
45,000,000
50,000,000
60,000,000
70,000,000
80,000,000
90,000,000
Laser marking is available as an extra-cost option for
most KEMET ceramic chips. Such marking is two
sided, and includes a K to identify KEMET, followed by
two characters (per EIA-198 - see table below) to
identify the capacitance value. Note that marking is
not available for size 0402 nor for any Y5V chip. In
addition, the 0603 marking option is limited to the K
only.
KA3
Example shown is 1,000 pF capacitor.
©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300
Packaging
Capacitance (pF) For Various Numeral Identifiers
Numeral
Alpha
Character
97