CAT34TS04 Digital Output Temperature Sensor with On-board SPD EEPROM Description The CAT34TS04 is a combination Temperature Sensor (TS) and 4−Kb of Serial Presence Detect (SPD) EEPROM, which implements the JEDEC TSE2004av DDR4 specification and supports the Standard (100 kHz), Fast (400 kHz) and Fast Plus (1 MHz) I2C protocols. The TS measures temperature at least 10 times every second. Temperature readings can be retrieved by the host via the serial interface, and are compared to high, low and critical trigger limits stored into internal registers. Over or under limit conditions can be signaled on the open−drain EVENT pin. One of the two available 2−Kb SPD EEPROM banks (referred to as SPD pages in the TSE2004av specification) is activated for access at power−up. After power−up, banks can be switched via software command. Each of the four 1−Kb SPD EEPROM blocks can be Write Protected by software command. Features • • • • • • • • • • JEDEC TSE2004av Compliant Temperature Sensor Temperature Range: −20°C to +125°C DDR4 DIMM Compliant SPD EEPROM Supply Range: 1.7 V − 5.5 V (SPD EEPROM) and 2.2 V − 5.5 V (TS) I2C / SMBus Interface Schmitt Triggers and Noise Suppression Filters on SCL and SDA Inputs 16−Byte Page Write Buffer Low Power CMOS Technology 2 x 3 x 0.75 mm TDFN Package and 2 x 3 x 0.5 mm UDFN Package These Devices are Pb−Free and are RoHS Compliant VCC http://onsemi.com UDFN−8 HU4 SUFFIX CASE 517AZ TDFN−8 VP2 SUFFIX CASE 511AK PIN CONFIGURATION 1 A0 A1 VCC EVENT (Top View) A2 SCL SDA VSS TDFN (VP2), UDFN (HU4) For the location of Pin 1, please consult the corresponding package drawing. MARKING DIAGRAM TDFN−8 4TA ALL YM G 4UA ALL YM G UDFN−8 4TA, 4UA = Specific Device Code A = Assembly Location Code LL = Assembly Lot Number (Last Two Digits) Y = Production Year (Last Digit) M = Production Month (1 − 9, O, N, D) G = Pb−Free Package = Pin 1 Indicator PIN FUNCTIONS SCL A2, A1, A0 Pin Name CAT34TS04 A0, A1, A2 EVENT SDA Figure 1. Functional Symbol Device Address Input SDA Serial Data Input/Output SCL Serial Clock Input EVENT VSS Function Open−drain Event Output VCC Power Supply VSS Ground DAP Backside Exposed DAP at VSS ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 18 of this data sheet. © Semiconductor Components Industries, LLC, 2013 October, 2013 − Rev. 6 1 Publication Order Number: CAT34TS04/D CAT34TS04 Table 1. ABSOLUTE MAXIMUM RATINGS Parameter Rating Units Operating Temperature −45 to +130 °C Storage Temperature −65 to +150 °C Voltage on any pin (except A0) with respect to Ground (Note 1) −0.5 to +6.5 V Voltage on pin A0 with respect to Ground −0.5 to +10.5 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The DC input voltage on any pin should not be lower than −0.5 V or higher than VCC + 0.5 V. The A0 pin can be raised to a HV level for SWP command execution. SCL and SDA inputs can be raised to the maximum limit, irrespective of VCC. Table 2. RELIABILITY CHARACTERISTICS Symbol Parameter NEND (Note 2) Endurance (EEPROM) TDR Min Units 1,000,000 Write Cycles 100 Years Data Retention (EEPROM) 2. Page Mode, VCC = 2.5 V, 25°C Table 3. TEMPERATURE CHARACTERISTICS (VCC = 2.2 V to 3.6 V, TA = −20°C to +125°C, unless otherwise specified) Parameter Test Conditions/Comments Temperature Reading Error Max Unit +75°C ≤ TA ≤ +95°C, active range ±1.0 °C +40°C ≤ TA ≤ +125°C, monitor range ±2.0 °C −20°C ≤ TA ≤ +125°C, sensing range ±3.0 °C 12 Bits ADC Resolution Temperature Resolution Conversion Time Thermal Resistance (Note 3) qJA Junction−to−Ambient (Still Air) 0.0625 °C 100 ms 92 °C/W 3. Power Dissipation is defined as PJ = (TJ − TA)/qJA, where TJ is the junction temperature and TA is the ambient temperature. The thermal resistance value refers to the case of a package being used on a standard 2−layer PCB. Table 4. D.C. OPERATING CHARACTERISTICS (VCC = 2.2 V to 3.6 V, TA = −20°C to +125°C, unless otherwise specified) Symbol ICC ISHDN Parameter Supply Current Test Conditions/Comments Min Max Unit TS active, SPD and Bus idle 1000 mA SPD Write, TS shut−down 1000 mA Standby Current TS shut−down; SPD and Bus idle 10 mA ILKG I/O Pin Leakage Current Pin at GND or VCC 2 mA VIL Input Low Voltage −0.5 0.3 x VCC V VIH Input High Voltage 0.7 x VCC VCC + 0.5 V VOL1 (Note 4) Output Low Voltage IOL = 3 mA, VCC > 2.2 V 0.4 V VOL2 Output Low Voltage IOL = 1 mA, VCC < 2.2 V 0.2 V 4. The device is able to handle RL values corresponding to the specified rise time (see Figure 2). http://onsemi.com 2 CAT34TS04 Table 5. A.C. CHARACTERISTICS (VCC = 2.2 V to 3.6 V, TA = −20°C to +125°C) Parameter Min Max Units Clock Frequency 0.01 1 MHz tHIGH High Period of SCL Clock 260 ns tLOW Low Period of SCL Clock 500 ns SMBus SCL Clock Low Timeout 25 Symbol FSCL (Note 5) tTIMEOUT (Note 6) 35 ms tR (Note 7) SDA and SCL Rise Time 120 ns tF (Note 7) SDA and SCL Fall Time 120 ns tSU:DAT Input Data Setup Time 50 ns tSU:STA START Condition Setup Time 260 ns tHD:STA START Condition Hold Time 260 ns tSU:STO STOP Condition Setup Time 260 ns Bus Free Time Between STOP and START 500 ns 0 ns tBUF tHD:DAT Input Data Hold Time tDH (Note 7) Output Data Hold Time Ti tWR tPU (Note 8) 120 300 ns Noise Pulse Filtered at SCL and SDA Inputs 50 ns Write Cycle Time 5 ms 100 ms Power-Up Delay to Valid Temperature Recording 5. Timing reference points are set at 30%, respectively 70% of VCC, as illustrated in Figure 5. Bus loading must be such as to allow meeting the VIL and VOL as well as all other timing requirements. The minimum clock frequency of 10 kHz is an SMBus recommendation; the minimum operating clock frequency is limited only by the SMBus time−out. The device also meets the Fast and Standard I2C specifications, except that Ti and tDH are shorter, as required by the 1 MHz Fast Plus protocol. 6. For the CAT34TS04, the interface will reset itself and will release the SDA line if the SCL line stays low beyond the tTIMEOUT limit. The time−out count takes place when SCL is low in the time interval between START and STOP. 7. In a “Wired−OR” system (such as I2C or SMBus), SDA rise time is determined by bus loading. Since each bus pull−down device must be able to sink the (external) bus pull−up current (in order to meet the VIL and/or VOL limits), it follows that SDA fall time is inherently faster than SDA rise time. SDA rise time can exceed the standard recommended tR limit, as long as it does not exceed tLOW − tDH − tSU:DAT, where tLOW and tDH are actual values (rather than spec limits). A shorter tDH leaves more room for a longer SDA tR, allowing for a more capacitive bus or a larger bus pull−up resistor. 8. The first valid temperature recording can be expected after tPU at nominal supply voltage. Table 6. PIN CAPACITANCE (TA = 25°C, VCC = 3.6 V, f = 1 MHz) CIN Parameter Test Conditions/Comments Min Max Unit SDA, EVENT Pin Capacitance VIN = 0 8 pF Input Capacitance (other pins) VIN = 0 6 pF PULL−UP RESISTANCE (kW) Symbol VCC 10 RL 300 ns Rise Time SDA 120 ns Rise Time 1 CL VSS 0.1 10 100 LOAD CAPACITANCE (pF) Figure 2. Pull−up Resistance vs. Load Capacitance http://onsemi.com 3 CAT34TS04 Pin Description SCL: The Serial Clock input pin accepts the Serial Clock generated by the Master (Host). SDA: The Serial Data I/O pin receives input data and transmits data stored in SPD memory or in the TS registers. In transmit mode, this pin is open drain. Data is acquired on the positive edge, and is delivered on the negative edge of SCL. A0, A1 and A2: The Address pins accept the device address. These pins have on−chip pull−down resistors. EVENT: The open−drain EVENT pin can be programmed to signal over/under temperature limit conditions. supply via pull−up resistors. Master and Slave devices connect to the bus via their respective SCL and SDA pins. The transmitting device pulls down the SDA line to ‘transmit’ a ‘0’ and releases it to ‘transmit’ a ‘1’. Data transfer may be initiated only when the bus is not busy (see A.C. Characteristics). During data transfer, the SDA line must remain stable while the SCL line is HIGH. An SDA transition while SCL is HIGH will be interpreted as a START or STOP condition (Figure 3). START The START condition precedes all commands. It consists of a HIGH to LOW transition on SDA while SCL is HIGH. The START acts as a ‘wake−up’ call to all Slaves. Absent a START, a Slave will not respond to commands. Power−On Reset (POR) The CAT34TS04 incorporates Power−On Reset (POR) circuitry which protects the device against powering up to an undetermined logic state. As VCC exceeds the POR trigger level, the TS component will power up into conversion mode and the SPD component will power up into standby mode. Both the TS and SPD components will power down into Reset mode when VCC drops below the POR trigger level. This bi−directional POR behavior protects the CAT34TS04 against brown−out failure following a temporary loss of power. The POR trigger level is set below the minimum operating VCC level. STOP The STOP condition completes all commands. It consists of a LOW to HIGH transition on SDA while SCL is HIGH. The STOP tells the Slave that no more data will be written to or read from the Slave. Device Addressing The Master initiates data transfer by creating a START condition on the bus. The Master then broadcasts an 8−bit serial Slave address. The first 4 bits of the Slave address (the preamble) determine whether the command is intended for the Temperature Sensor (TS) or the EEPROM. The next 3 bits, A2, A1 and A0, select one of 8 possible Slave devices. The last bit, R/W, specifies whether a Read (1) or Write (0) operation is being performed. Device Interface The CAT34TS04 supports the Inter−Integrated Circuit (I2C) and the System Management Bus (SMBus) data transmission protocols. These protocols describe serial communication between transmitters and receivers sharing a 2−wire data bus. Data flow is controlled by a Master device, which generates the serial clock and the START and STOP conditions. The CAT34TS04 acts as a Slave device. Master and Slave alternate as transmitter and receiver. Up to 8 CAT34TS04 devices may be present on the bus simultaneously, and can be individually addressed by matching the logic state of the address inputs A0, A1, and A2. Acknowledge A matching Slave address is acknowledged (ACK) by the Slave by pulling down the SDA line during the 9th clock cycle (Figure 4). After that, the Slave will acknowledge all data bytes sent to the bus by the Master. When the Slave is the transmitter, the Master will in turn acknowledge data bytes in the 9th clock cycle. The Slave will stop transmitting after the Master does not respond with acknowledge (NoACK) and then issues a STOP. Bus timing is illustrated in Figure 5. I2C/SMBus Protocol The I2C/SMBus uses two ‘wires’, one for clock (SCL) and one for data (SDA). The two wires are connected to the VCC SDA SCL START BIT STOP BIT Figure 3. Start/Stop Timing http://onsemi.com 4 CAT34TS04 SCL FROM MASTER 1 8 9 DATA OUTPUT FROM TRANSMITTER DATA OUTPUT FROM RECEIVER ACKNOWLEDGE START Figure 4. Acknowledge Timing tF tHIGH tR 70% 30% 70% SCL tLOW tSU:STA 70% 30% tHD:DAT tHD:STA 70% 30% SDA IN 70% tSU:STO tSU:DAT 70% 30% 30% 70% 70% tBUF tDH 70% SDA OUT 30% Figure 5. Bus Timing Table 7. COMMAND SET (Notes 9, 10) Function Specific Preamble Select Address R/W_n Abbr b7 b6 b5 b4 b3 b2 b1 b0 Read Temperature Registers RTR 0 0 1 1 LSA2 LSA1 LSA0 1 Write Temperature Registers WTR Read EE Memory RSPD Write EE Memory WSPD Set Write Protection, block 0 SWP0 Set Write Protection, block 1 Function A0 Pin 0 or 1 0 1 0 1 0 LSA2 LSA1 LSA0 0 1 1 0 0 0 1 0 VHV SWP1 1 0 0 0 VHV Set Write Protection, block 2 SWP2 1 0 1 0 VHV Set Write Protection, block 3 SWP3 0 0 0 0 VHV Clear All Write Protection CWP 0 1 1 0 VHV Read Protection Status, block 0 RPS0 0 0 1 1 0, 1 or VHV Read Protection Status, block 1 RPS1 1 0 0 1 0, 1 or VHV Read Protection Status, block 2 RPS2 1 0 1 1 0, 1 or VHV Read Protection Status, block 3 RPS3 0 0 0 1 0, 1 or VHV Set SPD Page Address to 0 (Select Lower Bank) SPA0 1 1 0 0 0, 1 or VHV Set SPD Page Address to 1 (Select Upper Bank) SPA1 1 1 1 0 0, 1 or VHV Read SPD Page Address RPA 1 1 0 1 0, 1 or VHV Reserved 1 0 or 1 0 − All Other Encodings 9. LSAx stands for Logic State of Address pin x. 10. If VHV is not applied on the A0 pin during SWP/CWP commands, the CAT34TS04 will respond with NoACK after the 3rd byte and will not execute the SWP/CWP instruction. During RPS/SPA/RPA commands the state of pin A0 must be stable for the duration of the sequence. http://onsemi.com 5 CAT34TS04 SPD EEPROM Bank Selection Upon power−up, the address pointers for both the Temperature Sensor (TS) and on−board EEPROM are initialized to 00h. The TS address pointer will thus point to the Capability Register and the EEPROM address pointer will point to the first location in the lower 2−Kb bank (SPD page 0). Only one SPD page is visible (active) at any given time. The lower SPD page is automatically selected at power−up. The upper SPD page can be activated (and the lower one implicitly de−activated) by executing the SPA1 utility command. The SPA0 utility command can then be used to re−activate the lower SPD page without powering down. The identity of the active SPD page can be retrieved with the RPA command. SPD page selection related command details are presented in Table 9c, Table 9d, Figure 13 and Figure 14. fashion within the 16−byte wide data buffer. The internal Write cycle then starts following the STOP. Write Operations Immediate Read Acknowledge Polling Acknowledge polling can be used to determine if the CAT34TS04 is busy writing to EEPROM, or is ready to accept commands. Polling is executed by interrogating the device with a ‘Selective Read’ command (see READ OPERATIONS). The CAT34TS04 will not acknowledge the Slave address as long as internal EEPROM Write is in progress. Delivery State The CAT34TS04 is shipped ‘unprotected’, i.e. none of the Software Write Protection (SWP) flags is set. The entire memory is erased, i.e. all bytes are 0xFF. Read Operations A CAT34TS04 presented with a Slave address containing a ‘1’ in the R/W position will acknowledge the Slave address and will then start transmitting SPD data or respectively TS register data from the current address pointer location. The Master stops this transmission by responding with NoACK, followed by a STOP (Figures 10a, 10b). EEPROM Byte and TS Register Write To write data to a TS register, or to the on−board EEPROM, the Master creates a START condition on the bus, and then sends out the appropriate Slave address (with the R/W bit set to ‘0’), followed by a starting data byte address or TS register address, followed by data. The matching Slave will acknowledge the Slave address, EEPROM byte address or TS register address and the data byte(s), one for EEPROM data (Figure 6) and two for TS register data (Figure 7). The Master then ends the session by creating a STOP condition on the bus. The STOP completes the (volatile) TS register update or starts the internal Write cycle for the (non−volatile) EEPROM data (Figure 8). Selective Read The Read operation can be started from a specific address, by preceding the Immediate Read sequence with a ‘data less’ Write sequence. The Master sends out a START, Slave address and byte or register address, but rather than following up with data (as in a Write operation), the Master then issues another START and continuous with an Immediate Read sequence (Figures 11a, 11b). EEPROM Page Write Each of the two 2−Kb banks is organized as 16 pages of 16 bytes each (not to be confused with the SPD page, which refers to the entire 2−Kb bank). One of the 16 memory pages is selected by the 4 most significant bits of the byte address, while the 4 least significant bits point to the byte position within the page. Up to 16 bytes can be written in one Write cycle (Figure 9). During data load, the internal byte position pointer is automatically incremented after each data byte is loaded. If the Master transmits more than 16 data bytes, then earlier data will be replaced by later data in a ‘wrap−around’ BUS ACTIVITY: MASTER SDA LINE SLAVE S T A R T SPD SLAVE ADDRESS Sequential EEPROM Read EEPROM data can be read out indefinitely, as long as the Master responds with ACK (Figure 12). The internal address pointer is automatically incremented after every data byte sent to the bus. If the end of the active 2−Kb bank is reached during continuous Read, then the address count ‘wraps−around’ to the beginning of the active 2−Kb bank, etc. Sequential Read works with either Immediate Read or Selective Read, the only difference being that in the latter case the starting address is intentionally updated. BYTE ADDRESS S T O P DATA P S A C K A C K Figure 6. EEPROM Byte Write http://onsemi.com 6 A C K CAT34TS04 BUS ACTIVITY: MASTER SDA LINE S T A R T TS SLAVE ADDRESS REGISTER ADDRESS DATA (MSB) S T O P DATA (LSB) P S A C K A C K A C K A C K SLAVE Figure 7. Temperature Sensor Register Write SCL SDA 8th Bit Byte n ACK tWR STOP CONDITION START CONDITION ADDRESS Figure 8. EEPROM Write Cycle Timing BUS ACTIVITY: MASTER SDA LINE S T A R T SPD SLAVE ADDRESS BYTE ADDRESS (n) DATA n S T O P DATA n+P DATA n+1 S P A C K SLAVE A C K A C K A C K NOTE: In this example n = XXXX 0000(B); X = 1 or 0 Figure 9. EEPROM Page Write BUS ACTIVITY: MASTER SDA LINE S T A R T N OS AT CO KP SPD SLAVE ADDRESS P S A C K SLAVE DATA Figure 10a. EEPROM Immediate Read BUS ACTIVITY: MASTER SDA LINE SLAVE S T A R T TS SLAVE ADDRESS N OS AT CO KP A C K P S A C K DATA (MSB) DATA (LSB) Figure 10b. Temperature Sensor Immediate Read http://onsemi.com 7 A C K CAT34TS04 BUS ACTIVITY: MASTER S T A R T SDA LINE SPD SLAVE ADDRESS S T A R T BYTE ADDRESS (n) N OS AT CO KP SLAVE ADDRESS P S S A C K SLAVE A C K A C K DATA n Figure 11a. EEPROM Selective Read BUS ACTIVITY: MASTER SDA LINE S T A R T TS SLAVE ADDRESS S T A R T REGISTER ADDRESS N OS AT CO KP A C K SLAVE ADDRESS P S S A C K SLAVE A C K A C K DATA (MSB) DATA (LSB) Figure 11b. Temperature Sensor Selective Read BUS ACTIVITY: MASTER SPD SLAVE ADDRESS A C K A C K A C K N OS A T CO KP SDA LINE SLAVE P A C K DATA n DATA n+2 DATA n+1 DATA n+x Figure 12. EEPROM Sequential Read Software Write Protection Each 1−Kb memory block can be individually protected against Write requests. Block identities are: pin A0 before the START and maintained just beyond the STOP. The D.C. OPERATING CONDITIONS for SWP operations are shown in Table 8. SWP command details are listed in Tables 9a and 9b. SWP Slave addresses follow the standard I2C convention, i.e. to read the state of a SWP flag, the LSB of the Slave address must be ‘1’, and to set or clear a flag, it must be ‘0’. For Set/Clear commands a dummy byte address and dummy data byte must be provided (Figure 13). In contrast to a regular memory Read, a SWP Read does not return data. Instead the CAT34TS04 will respond with NoACK if the flag is set and with ACK if the flag is not set (Figure 14). Block 0: byte address 0x00...0x7F (SPD page address = 0) Block 1: byte address 0x80...0xFF (SPD page address = 0) Block 2: byte address 0x00...0x7F (SPD page address = 1) Block 3: byte address 0x80...0xFF (SPD page address = 1) Block Software Write Protection (SWP) flags can be set or cleared in the presence of a very high voltage VHV on address pin A0. The VHV condition must be established on Table 8. SWPn AND CWP D.C. OPERATION CONDITION Symbol Parameter DVHV A0 Overdrive (VHV − VCC) IHVD A0 High Voltage Detector Current VHV A0 Very High Voltage Test Conditions Min Max 4.8 1.7 V < VCC < 3.6 V 7 http://onsemi.com 8 Units V 0.1 mA 10 V CAT34TS04 Table 9a. SWP SET COMMAND DETAIL (following Slave Address) Command Block(x) Protection Slave Response Address Byte Slave Response Data Byte Slave Response Write Cycle SWPx(Note 11) Not Set ACK (Dummy) ACK (Dummy) ACK Yes Set NoACK (Dummy) NoACK (Dummy) NoACK No X ACK (Dummy) ACK (Dummy) ACK Yes CWP Table 9b. SWP QUERRY COMMAND DETAIL (following Slave Address) Command Block(x) Protection Slave Response Data Byte Master (Response) Data Byte Master (Response) RPSx (Nots 11, 12) Not Set ACK Dummy (NoACK) Dummy (NoACK) Set NoACK Dummy (NoACK) Dummy (NoACK) Table 9c. SPD PAGE SELECT COMMAND DETAIL (following Slave Address) Command SPD Active Page Slave Response Address Byte Slave Response Data Byte Slave Response Write Cycle SPAx (Notes 13, 14) X ACK (Dummy) ACK (Dummy) NoACK No Table 9d. SPD ACTIVE PAGE QUERRY COMMAND DETAIL (following Slave Address) Command RPA (Notes 11, 12, 15) SPD Active Page Slave Response Data Byte Master (Response) Data Byte Master (Response) 0 ACK Dummy (NoACK) Dummy (NoACK) 1 NoACK Dummy (NoACK) Dummy (NoACK) 11. The Master can terminate the sequence by issuing a STOP once the CAT34TS04 responds with NoACK 12. The Master can terminate the sequence by responding with (NoACK) followed by STOP after any dummy data byte. 13. Setting the SPD Page Address to ‘0’ selects the lower 2−Kb EEPROM bank, setting it to ‘1’ selects the upper 2−Kb EEPROM bank. 14. The lower 2−Kb EEPROM bank (corresponding to SPD page address ‘0’) is active (visible) immediately following power−up. 15. The device will respond with ACK when the lower 2−Kb EEPROM bank is active and with NoACK when the upper 2−Kb EEPROM bank is active. BUS ACTIVITY: S T A MASTER R T Dummy ADDRESS SLAVE ADDRESS Dummy DATA S T O P SDA LINE SLAVE N A C or O A K C K X = Don’t Care N A C or O A K C K N A C or O A K C K Figure 13. SWP & SPA Timing BUS ACTIVITY: S T A MASTER R T N O A C K SLAVE ADDRESS N OS AT CO KP SDA LINE SLAVE X = Don’t Care N A C or O A K C K Dummy DATA Dummy DATA Figure 14. RPS & RPA Timing http://onsemi.com 9 CAT34TS04 Registers The CAT34TS04 contains eight 16−bit wide registers allocated to TS functions, as shown in Table 10. Upon power−up, the internal address counter points to the capability register. Temperature Sensor Operation The TS component in the CAT34TS04 combines a Proportional to Absolute Temperature (PTAT) sensor with a S−D modulator, yielding a 12 bit plus sign digital temperature representation. The TS runs on an internal clock, and starts a new conversion cycle at least every 100 ms. The result of the most recent conversion is stored in the Temperature Data Register (TDR), and remains there following a TS Shut−Down. Reading from the TDR does not interfere with the conversion cycle. The value stored in the TDR is compared against limits stored in the High Limit Register (HLR), the Low Limit Register (LLR) and/or Critical Temperature Register (CTR). If the measured value is outside the alarm limits or above the critical limit, then the EVENT pin may be asserted. The EVENT output function is programmable, via the Configuration Register for interrupt mode, comparator mode and polarity. The temperature limit registers can be Read or Written by the host, via the serial interface. At power−on, all the (writable) internal registers default to 0x0000, and should therefore be initialized by the host to the desired values. The EVENT output starts out disabled (corresponding to polarity active low); thus preventing irrelevant event bus activity before the limit registers are initialized. While the TS is enabled (not shut−down), event conditions are normally generated by a change in measured temperature as recorded in the TDR, but limit changes can also trigger events as soon as the new limit creates an event condition, i.e. asynchronously with the temperature sampling activity. In order to minimize the thermal resistance between sensor and PCB, it is recommended that the exposed backside die attach pad (DAP) be soldered to the PCB ground plane. Capability Register (User Read Only) This register lists the capabilities of the TS, as detailed in the corresponding bit map. Configuration Register (Read/Write) This register controls the various operating modes of the TS, as detailed in the corresponding bit map. Temperature Trip Point Registers (Read/Write) The CAT34TS04 features 3 temperature limit registers, the HLR, LLR and CLR mentioned earlier. The temperature value recorded in the TDR is compared to the various limit values, and the result is used to activate the EVENT pin. To avoid undesirable EVENT pin activity, this pin is automatically disabled at power−up to allow the host to initialize the limit registers and the converter to complete the first conversion cycle under nominal supply conditions. Data format is two’s complement with the LSB representing 0.25°C, as detailed in the corresponding bit maps. Temperature Data Register (User Read Only) This register stores the measured temperature, as well as trip status information. B15, B14, and B13 are the trip status bits, representing the relationship between measured temperature and the 3 limit values; these bits are not affected by EVENT status or by Configuration register settings regarding EVENT pin. Measured temperature is represented by bits B12 to B0. Data format is two’s complement, where B12 represents the sign, B11 represents 128°C, etc. and B0 represents 0.0625°C. Manufacturer ID Register (Read Only) The manufacturer ID assigned by the PCI−SIG trade organization to the CAT34TS04 device is fixed at 0x1B09. Device ID and Revision Register (Read Only) This register contains manufacturer specific device ID and device revision information. http://onsemi.com 10 CAT34TS04 Table 10. THE TS REGISTERS Register Address Register Name Power−On Default Read/Write 0x00 Capability Register 0x007F Read 0x01 Configuration Register 0x0000 Read/Write 0x02 High Limit Register 0x0000 Read/Write 0x03 Low Limit Register 0x0000 Read/Write 0x04 Critical Limit Register 0x0000 Read/Write 0x05 Temperature Data Register Undefined Read 0x06 Manufacturer ID Register 0x1B09 Read 0x07 Device ID/Revision Register 0x2200 Read Table 11. CAPABILITY REGISTER B15 B14 B13 B12 B11 B10 B9 B8 RFU (Note 16) RFU RFU RFU RFU RFU RFU RFU B7 B6 B5 B4 B3 B2 B1 B0 EVSD TMOUT VHV RANGE ACC EVENT TRES [1:0] 16. RFU stands for Reserved for Future Use Bit B15:B8 B7 (Note 17) Description Reserved for future use; can not be written; should be ignored; will read as 0 0: 1: Configuration Register bit 4 is frozen upon Configuration Register bit 8 being set (i.e. a TS shut−down freezes the EVENT output) Configuration Register bit 4 is cleared upon Configuration Register bit 8 being set (i.e. a TS shut−down de−asserts the EVENT output) B6 0: 1: Not used The TS implements SMBus time−out within the range 25 to 35 ms B5 0: 1: Not used Defined for compatibility with CAT34TS02 device (VHV is supported) B4:B3 00: 01: 10: 11: LSB = 0.50°C (9 bit resolution) LSB = 0.25°C (10 bit) LSB = 0.125°C (11 bit) LSB = 0.0625°C (12 bit) B2 0: 1: Not used The temperature monitor can read temperatures below 0°C and sets the sign bit appropriately B1 0: 1: Not used The temperature monitor has ±1°C accuracy over the active range (75°C to 95°C) and ±2°C accuracy over the monitoring range (40°C to 125°C) B0 0: 1: Not used The device supports interrupt capabilities 17. Configuration Register bit 4 can be cleared (but not set) after Configuration Register bit 8 is set, by writing a “1” to Configuration Register bit 5 (EVENT output can be de−asserted during TS shut−down periods) http://onsemi.com 11 CAT34TS04 Table 12. CONFIGURATION REGISTER B15 B14 B13 B12 B11 RFU RFU RFU RFU RFU B7 B6 B5 B4 B3 B2 B1 B0 TCRIT_LOCK ALARM_LOCK CLEAR EVENT_STS EVENT_CTRL TCRIT_ONLY EVENT_POL EVENT_MODE Bit B15:B11 B10 B9 B8 HYST [1:0] SHDN Description Reserved for future use; can not be written; should be ignored; will read as 0 B10:B9 (Note 18) 00: 01: 10: 11: Disable hysteresis Set hysteresis at 1.5°C Set hysteresis at 3°C Set hysteresis at 6°C B8 (Note 22) 0: 1: Thermal Sensor is enabled; temperature readings are updated at sampling rate Thermal Sensor is shut down; temperature reading is frozen to value recorded before SHDN B7 (Note 21) 0: 1: Critical trip register can be updated Critical trip register cannot be modified; this bit can be cleared only at POR B6 (Note 21) 0: 1: Alarm trip registers can be updated Alarm trip registers cannot be modified; this bit can be cleared only at POR B5 (Note 20) 0: 1: Always reads as 0 (self−clearing) Writing a 1 to this position clears an event recording in interrupt mode only B4 (Note 19) 0: 1: EVENT output pin is not being asserted EVENT output pin is being asserted B3 (Note 18) 0: 1: EVENT output disabled; polarity dependent: open−drain for B1 = 0; grounded for B1 = 1 EVENT output enabled B2 (Note 24) 0: 1: event condition triggered by alarm or critical temperature limit crossing event condition triggered by critical temperature limit crossing only B1 (Notes 18, 23) 0: 1: EVENT output active low EVENT output active high B0 (Note 18) 0: 1: Comparator mode Interrupt mode 18. Can not be altered (set or cleared) as long as either one of the two lock bits, B6 or B7 is set. 19. This bit is a polarity independent ‘software’ copy of the EVENT pin, i.e. it is under the control of B3. This bit is read−only. 20. Writing a ‘1’ to this bit clears an event condition in Interrupt mode, but has no effect in comparator mode. When read, this bit always returns 0. Once the measured temperature exceeds the critical limit, setting this bit has no effect (see Figure 15). 21. Cleared at power−on reset (POR). Once set, this bit can only be cleared by a POR condition. 22. The TS powers up into active mode, i.e. this bit is cleared at power−on reset (POR). When the TS is shut down the ADC is disabled and the temperature reading is frozen to the most recently recorded value. The TS can not be shut down (B8 can not be set) as long as either one of the two lock bits, B6 or B7 is set. However, the bit can be cleared at any time. 23. The EVENT output is “open−drain” and requires an external pull−up resistor for either polarity. The “natural” polarity is “active low”, as it allows “wired−or” operation on the EVENT bus. 24. Can not be set as long as lock bit B6 is set. http://onsemi.com 12 CAT34TS04 Table 13. HIGH LIMIT REGISTER B15 B14 B13 B12 B11 B10 B9 B8 0 0 0 Sign 128°C 64°C 32°C 16°C B7 B6 B5 B4 B3 B2 B1 B0 8°C 4°C 2°C 1°C 0.5°C 0.25°C 0 0 Table 14. LOW LIMIT REGISTER B15 B14 B13 B12 B11 B10 B9 B8 0 0 0 Sign 128°C 64°C 32°C 16°C B7 B6 B5 B4 B3 B2 B1 B0 8°C 4°C 2°C 1°C 0.5°C 0.25°C 0 0 Table 15. TCRIT LIMIT REGISTER B15 B14 B13 B12 B11 B10 B9 B8 0 0 0 Sign 128°C 64°C 32°C 16°C B7 B6 B5 B4 B3 B2 B1 B0 8°C 4°C 2°C 1°C 0.5°C 0.25°C 0 0 Table 16. TEMPERATURE DATA REGISTER B15 B14 B13 B12 B11 B10 B9 B8 TCRIT HIGH LOW Sign 128°C 64°C 32°C 16°C B7 B6 B5 B4 B3 B2 B1 B0 8°C 4°C 2°C 1°C 0.5°C 0.25°C (Note 25) 0.125°C (Note 25) 0.0625°C (Note 25) 25. When supported − as defined by Capability Register bits TRES (1:0); unsupported bits will read as 0 Bit Description B15 0: Temperature is below the TCRIT limit 1: Temperature is equal to or above the TCRIT limit B14 0: Temperature is equal to or below the High limit 1: Temperature is above the High limit B13 0: Temperature is equal to or above the Low limit 1: Temperature is below the Low limit B12 0: Positive temperature 1: Negative temperature http://onsemi.com 13 CAT34TS04 Register Data Format Event Pin Functionality The values used in the temperature data register and the 3 temperature trip point registers are expressed in two’s complement format. The measured temperature value is expressed with 12−bit resolution, while the 3 trip temperature limits are set with 10−bit resolution. The total temperature range is arbitrarily defined as 256°C, thus yielding an LSB of 0.0625°C for the measured temperature and 0.25°C for the 3 limit values. Bit B12 in all temperature registers represents the sign, with a ‘0’ indicating a positive, and a ‘1’ a negative value. In two’s complement format, negative values are obtained by complementing their positive counterpart and adding a ‘1’, so that the sum of opposite signed numbers, but of equal absolute value, adds up to zero. Note that trailing ‘0’ bits, are ‘0’ irrespective of polarity. Therefore the don’t care bits (B1 and B0) in the 10−bit resolution temperature limit registers, are always ‘0’. The EVENT output reacts to temperature changes as illustrated in Figure 15, and according to the operating mode defined by the Configuration register. In Interrupt Mode, the (enabled) EVENT output will be asserted every time the temperature crosses one of the alarm window limits, and can be de−asserted by writing a ‘1’ to the clear event bit (B5) in the configuration register. Once the temperature exceeds the critical limit, the EVENT remains asserted as long as the temperature stays above the critical limit and cannot be cleared. A clear request sent to the CAT34TS04 while the temperature is above the critical limit will be acknowledged, but will be executed only after the temperature drops below the critical limit. In Comparator Mode, the EVENT output is asserted outside the alarm window limits, while in Critical Temperature Mode, EVENT is asserted only above the critical limit. Clear requests are ignored in this mode. The exact trip limits are determined by the 3 temperature limit settings and the hysteresis offsets, as illustrated in Figure 16. Following a TS shut−down request, the converter is stopped and the most recently recorded temperature value present in the TDR is frozen; the EVENT output will continue to reflect the state immediately preceding the shut−down command. Therefore, if the state of the EVENT output creates an undesirable bus condition, appropriate action must be taken either before or after shutting down the TS. This may require clearing the event, disabling the EVENT output or perhaps changing the EVENT output polarity. In normal use, events are triggered by a change in recorded temperature, but the CAT34TS04 will also respond to limit register changes. Whereas recorded temperature values are updated at sampling rate frequency, limits can be modified at any time. The enabled EVENT output will react to limit changes as soon as the respective registers are updated. This feature may be useful during testing. Table 17. 12−BIT TEMPERATURE DATA FORMAT Binary (B12 to B0) Hex Temperature 1 1100 1001 0000 1C90 −55°C 1 1100 1110 0000 1CE0 −50°C 1 1110 0111 0000 1E70 −25°C 1 1111 1111 1111 1FFF −0.0625°C 0 0000 0000 0000 000 0°C 0 0000 0000 0001 001 +0.0625°C 0 0001 1001 0000 190 +25°C 0 0011 0010 0000 320 +50°C 0 0111 1101 0000 7D0 +125°C http://onsemi.com 14 CAT34TS04 TEMPERATURE CRITICAL HYSTERESIS AFFECTS THESE TRIP POINTS UPPER ALARM WINDOW LOWER TIME EVENT in “INTERRUPT” Mode EVENT in “INTERRUPT” Mode EVENT in “INTERRUPT” Mode EVENT in “COMPARATOR” Mode EVENT in “CRITICAL TEMP ONLY” Mode Clear request executed immediately Clear request acknowledged but execution delayed until measured temperature drops below the active Critical Temperature limit Figure 15. Event Detail TH TH − HYST TL TL − HYST BELOW WINDOW BIT ABOVE WINDOW BIT Figure 16. Hysteresis Detail http://onsemi.com 15 CAT34TS04 PACKAGE DIMENSIONS TDFN8, 2x3 CASE 511AK−01 ISSUE A D A e b E2 E PIN#1 IDENTIFICATION A1 PIN#1 INDEX AREA D2 TOP VIEW SIDE VIEW SYMBOL MIN NOM MAX A 0.70 0.75 0.80 A1 0.00 0.02 0.05 A2 0.45 0.55 0.65 A3 A2 A3 0.20 0.25 0.30 D 1.90 2.00 2.10 D2 1.30 1.40 1.50 E 2.90 3.00 3.10 E2 1.20 1.30 1.40 L BOTTOM VIEW 0.20 REF b e FRONT VIEW 0.50 TYP 0.20 0.30 L 0.40 Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC MO-229. http://onsemi.com 16 CAT34TS04 PACKAGE DIMENSIONS UDFN8, 2x3 EXTENDED PAD CASE 517AZ−01 ISSUE O D b A e L DAP SIZE 1.8 x 1.8 E2 E PIN #1 IDENTIFICATION A1 PIN #1 INDEX AREA D2 TOP VIEW SYMBOL MIN SIDE VIEW NOM MAX A 0.45 0.50 0.55 A1 0.00 0.02 0.05 A3 0.127 REF b 0.20 0.25 0.30 D 1.95 2.00 2.05 D2 1.35 1.40 1.45 E 2.95 3.00 3.05 E2 1.25 1.30 1.35 e L BOTTOM VIEW DETAIL A 0.065 REF A3 A FRONT VIEW 0.50 REF 0.25 0.30 0.35 A3 Notes: (1) All dimensions are in millimeters. (2) Refer JEDEC MO-236/MO-252. 0.0 - 0.05 DETAIL A http://onsemi.com 17 0.065 REF Copper Exposed CAT34TS04 Example of Ordering Information Specific Device Marking Package Type Lead Finish CAT34TS04VP2GT4A 4TA TDFN−8 NiPdAu Tape & Reel, 4,000 Units / Reel A CAT34TS04HU4GT4A 4UA UDFN−8 NiPdAu Tape & Reel, 4,000 Units / Reel A Device Order Number Shipping Device Revision 26. All packages are RoHS−compliant (Lead−free, Halogen−free) 27. The standard lead finish is NiPdAu. 28. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ON Semiconductor is licensed by Philips Corporation to carry the I2C Bus Protocol. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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