NXP LPC4088 32-bit arm cortex-m4 mcu; Datasheet

LPC408x/7x
32-bit ARM Cortex-M4 MCU; up to 512 kB flash, 96 kB SRAM;
USB Device/Host/OTG; Ethernet; LCD; EMC; SPIFI
Rev. 1 — 17 September 2012
Objective data sheet
1. General description
The LPC408x/7x is an ARM Cortex-M4 based digital signal controller for embedded
applications requiring a high level of integration and low power dissipation.
The ARM Cortex-M4 is a next generation core that offers system enhancements such as
low power consumption, enhanced debug features, and a high level of support block
integration. The ARM Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard
architecture with separate local instruction and data buses as well as a third bus for
peripherals, and includes an internal prefetch unit that supports speculative branching.
The ARM Cortex-M4 supports single-cycle digital signal processing and SIMD
instructions. A hardware floating-point processor is integrated in the core for several
versions of the part.
The LPC408x/7x adds a specialized flash memory accelerator to accomplish optimal
performance when executing code from flash. The LPC408x/7x is targeted to operate at
up to 120 MHz CPU frequency.
The peripheral complement of the LPC408x/7x includes up to 512 kB of flash program
memory, up to 96 kB of SRAM data memory, up to 4032 byte of EEPROM data memory,
External Memory controller (EMC), LCD, Ethernet, USB Device/Host/OTG, an SPI Flash
Interface (SPIFI), a General Purpose DMA controller, five UARTs, three SSP controllers,
three I2C-bus interfaces, a Quadrature Encoder Interface, four general purpose timers,
two general purpose PWMs with six outputs each and one motor control PWM, an
ultra-low power RTC with separate battery supply and event recorder, a windowed
watchdog timer, a CRC calculation engine and up to 165 general purpose I/O pins.
The analog peripherals include one eight-channel 12-bit ADC, two analog comparators,
and a DAC.
The pinout of LPC408x/7x is intended to allow pin function compatibility with the
LPC24xx/23xx as well as the LPC178x/7x families.
2. Features and benefits
 Functional replacement for LPC23xx/24xx and LPC178x/7x family devices.
 ARM Cortex-M4 core:
 ARM Cortex-M4 processor, running at frequencies of up to 120 MHz.
 ARM Cortex-M4 built-in Memory Protection Unit (MPU) supporting eight regions.
 ARM Cortex-M4 built-in Nested Vectored Interrupt Controller (NVIC).
 Hardware floating-point unit (not all versions).
 Non-maskable Interrupt (NMI) input.
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
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LPC408X_7X
Objective data sheet
 JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints, and four watch
points.
 System tick timer.
System:
 Multilayer AHB matrix interconnect provides a separate bus for each AHB master.
AHB masters include the CPU, and General Purpose DMA controller. This
interconnect provides communication with no arbitration delays unless two masters
attempt to access the same slave at the same time.
 Split APB bus allows for higher throughput with fewer stalls between the CPU and
DMA. A single level of write buffering allows the CPU to continue without waiting for
completion of APB writes if the APB was not already busy.
 Embedded Trace Macrocell (ETM) module supports real-time trace.
 Boundary scan for simplified board testing.
Memory:
 512 kB on-chip flash program memory with In-System Programming (ISP) and
In-Application Programming (IAP) capabilities. The combination of an enhanced
flash memory accelerator and location of the flash memory on the CPU local
code/data bus provides high code performance from flash.
 Up to 96 kB on-chip SRAM includes:
64 kB of main SRAM on the CPU with local code/data bus for high-performance
CPU access.
Two 16 kB peripheral SRAM blocks with separate access paths for higher
throughput. These SRAM blocks may be used for DMA memory as well as for
general purpose instruction and data storage.
 Up to 4032 byte on-chip EEPROM.
LCD controller, supporting both Super-Twisted Nematic (STN) and Thin-Film
Transistors (TFT) displays.
 Dedicated DMA controller.
 Selectable display resolution (up to 1024  768 pixels).
 Supports up to 24-bit true-color mode.
External Memory Controller (EMC) provides support for asynchronous static memory
devices such as RAM, ROM and flash, as well as dynamic memories such as single
data rate SDRAM.
Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer
matrix that can be used with the SSP, I2S, UART, CRC engine, Analog-to-Digital and
Digital-to-Analog converter peripherals, timer match signals, GPIO, and for
memory-to-memory transfers.
Serial interfaces:
 Quad SPI Flash Interface (SPIFI) with four lanes and up to 40 MB per second.
 Ethernet MAC with MII/RMII interface and associated DMA controller. These
functions reside on an independent AHB.
 USB 2.0 full-speed dual port device/host/OTG controller with on-chip PHY and
associated DMA controller.
 Five UARTs with fractional baud rate generation, internal FIFO, DMA support, and
RS-485/EIA-485 support. One UART (UART1) has full modem control I/O, and one
UART (USART4) supports IrDA, synchronous mode, and a smart card mode
conforming to ISO7816-3.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
2 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
 Three SSP controllers with FIFO and multi-protocol capabilities. The SSP
interfaces can be used with the GPDMA controller.
 Three enhanced I2C-bus interfaces, one with a true open-drain output supporting
the full I2C-bus specification and Fast-mode Plus with data rates of 1 Mbit/s, two
with standard port pins. Enhancements include multiple address recognition and
monitor mode.
 I2S (Inter-IC Sound) interface for digital audio input or output. It can be used with
the GPDMA.
 CAN controller with two channels.
 Digital peripherals:
 SD/MMC memory card interface.
 Up to 165 General Purpose I/O (GPIO) pins depending on the packaging, with
configurable pull-up/down resistors, open-drain mode, and repeater mode. All
GPIOs are located on an AHB bus for fast access and support Cortex-M4
bit-banding. GPIOs can be accessed by the General Purpose DMA Controller. Any
pin of ports 0 and 2 can be used to generate an interrupt.
 Two external interrupt inputs configurable as edge/level sensitive. All pins on port 0
and port 2 can be used as edge sensitive interrupt sources.
 Four general purpose timers/counters, with a total of eight capture inputs and ten
compare outputs. Each timer block has an external count input. Specific timer
events can be selected to generate DMA requests.
 Quadrature encoder interface that can monitor one external quadrature encoder.
 Two standard PWM/timer blocks with external count input option.
 One motor control PWM with support for three-phase motor control.
 Real-Time Clock (RTC) with a separate power domain. The RTC is clocked by a
dedicated RTC oscillator. The RTC block includes 20 bytes of battery-powered
backup registers, allowing system status to be stored when the rest of the chip is
powered off. Battery power can be supplied from a standard 3 V lithium button cell.
The RTC will continue working when the battery voltage drops to as low as 2.1 V.
An RTC interrupt can wake up the CPU from any reduced power mode.
 Event Recorder that can capture the clock value when an event occurs on any of
three inputs. The event identification and the time it occurred are stored in
registers. The Event Recorder is located in the RTC power domain and can
therefore operate as long as there is RTC power.
 Windowed Watchdog Timer (WWDT). Windowed operation, dedicated internal
oscillator, watchdog warning interrupt, and safety features.
 CRC Engine block can calculate a CRC on supplied data using one of three
standard polynomials. The CRC engine can be used in conjunction with the DMA
controller to generate a CRC without CPU involvement in the data transfer.
 Analog peripherals:
 12-bit Analog-to-Digital Converter (ADC) with input multiplexing among eight pins,
conversion rates up to 400 kHz, and multiple result registers. The 12-bit ADC can
be used with the GPDMA controller.
 10-bit Digital-to-Analog Converter (DAC) with dedicated conversion timer and DMA
support.
 Two analog comparators.
 Power control:
LPC408X_7X
Objective data sheet
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Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
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LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
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 Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep
power-down.
 The Wake-up Interrupt Controller (WIC) allows the CPU to automatically wake up
from any priority interrupt that can occur while the clocks are stopped in
Deep-sleep, Power-down, and Deep power-down modes.
 Processor wake-up from Power-down mode via any interrupt able to operate
during Power-down mode (includes external interrupts, RTC interrupt, PORT0/2
pin interrupt, and NMI).
 Brownout detect with separate threshold for interrupt and forced reset.
 On-chip Power-On Reset (POR).
Clock generation:
 Clock output function that can reflect the main oscillator clock, IRC clock, RTC
clock, CPU clock, USB clock, or the watchdog timer clock.
 On-chip crystal oscillator with an operating range of 1 MHz to 25 MHz.
 12 MHz Internal RC oscillator (IRC) trimmed to 1% accuracy that can optionally be
used as a system clock.
 An on-chip PLL allows CPU operation up to the maximum CPU rate without the
need for a high-frequency crystal. May be run from the main oscillator or the
internal RC oscillator.
 A second, dedicated PLL may be used for USB interface in order to allow added
flexibility for the Main PLL settings.
Versatile pin function selection feature allows many possibilities for using on-chip
peripheral functions.
Unique device serial number for identification purposes.
Single 3.3 V power supply (2.4 V to 3.6 V). Temperature range of 40 C to 85 C.
Available as LQFP208, TFBGA208, TFBGA180, LQFP144, and LQFP80 package.
3. Applications
 Communications:
 Point-of-sale terminals, web servers, multi-protocol bridges
 Industrial/Medical:
 Automation controllers, application control, robotics control, HVAC, PLC, inverters,
circuit breakers, medical scanning, security monitoring, motor drive, video intercom
 Consumer/Appliance:
 Audio, MP3 decoders, alarm systems, displays, printers, scanners, small
appliances, fitness equipment
 Automotive:
 After-market, car alarms, GPS/fleet monitors
LPC408X_7X
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
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LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
4. Ordering information
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC4088
LPC4088FBD208
LQFP208
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
SOT459-1
LPC4088FET208
TFBGA208
plastic thin fine-pitch ball grid array package; 208 balls; body
15  15  0.7 mm
SOT950-1
LPC4088FET180
TFBGA180
thin fine-pitch ball grid array package; 180 balls; body 12  12  0.8 mm
SOT570-2
LPC4088FBD144
LQFP144
plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
SOT486-1
LPC4078FBD208
LQFP208
plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
SOT459-1
LPC4078FET208
TFBGA208
plastic thin fine-pitch ball grid array package; 208 balls; body
15  15  0.7 mm
SOT950-1
LPC4078FET180
TFBGA180
thin fine-pitch ball grid array package; 180 balls; body 12  12  0.8 mm
SOT570-2
LLPC4078FBD144
LQFP144
plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
SOT486-1
LPC4078FBD80
LQFP80
plastic low-profile quad package; 80 leads; body 12  12  1.4 mm
SOT315-1
LPC4076FET180
TFBGA180
thin fine-pitch ball grid array package; 180 balls; body 12  12  0.8 mm
SOT570-2
LPC4076FBD144
LQFP144
plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
SOT486-1
LPC4074FBD144
LQFP144
plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
SOT486-1
LPC4074FBD80
LQFP80
plastic low-profile quad package; 80 leads; body 12  12  1.4 mm
SOT315-1
LQFP80
plastic low-profile quad package; 80 leads; body 12  12  1.4 mm
SOT315-1
LPC4078
LPC4076
LPC4074
LPC4072
LPC4072FBD80
Table 2.
Ordering options
EMC bus
width (bit)
LCD
Ethernet
USB
QEI
SD/MMC
Comparator
FPU
Package
96
4032
32
yes
yes
H/O/D 5
yes
yes
yes
yes
LQFP208
LPC4088FET208 512
96
4032
32
yes
yes
H/O/D 5
yes
yes
yes
yes
TFBGA208
UART
EEPROM (B)
LPC4088FBD208 512
Flash (kB)
SRAM (kB)
Type number
LPC4088
LPC4088FET180 512
96
4032
16
yes
yes
H/O/D 5
yes
yes
yes
yes
TFBGA180
LPC4088FBD144 512
96
4032
8
yes
yes
H/O/D 5
yes
yes
yes
yes
LQFP144
LPC4078FBD208 512
96
4032
32
no
yes
H/O/D 5
yes
yes
yes
yes
LQFP208
LPC4078FET208 512
96
4032
32
no
yes
H/O/D 5
yes
yes
yes
yes
TFBGA208
LPC4078FET180 512
96
4032
16
no
yes
H/O/D 5
yes
yes
yes
yes
TFBGA180
LPC4078FBD144 512
96
4032
8
no
yes
H/O/D 5
yes
yes
yes
yes
LQFP144
LPC4078FBD80
96
4032
-
no
yes
H/O/D 5
yes
yes
yes
yes
LQFP80
LPC4078
LPC408X_7X
Objective data sheet
512
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Rev. 1 — 17 September 2012
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LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 2.
Ordering options
EMC bus
width (bit)
LCD
Ethernet
USB
QEI
SD/MMC
Comparator
FPU
Package
80
2048
16
no
yes
H/O/D 5
yes
yes
yes
yes
TFBGA180
LPC4076FBD144 256
80
2048
8
no
yes
H/O/D 5
yes
yes
yes
yes
LQFP144
LPC4074FBD144 128
40
2048
-
no
no
D
4
no
no
no
no
LQFP144
LPC4074FBD80
128
40
2048
-
no
no
D
4
no
no
no
no
BGA80
64
24
2048
-
no
no
D
4
no
no
no
no
LQFP80
UART
EEPROM (B)
LPC4076FET180 256
Flash (kB)
SRAM (kB)
Type number
LPC4076
LPC4074
LPC4072
LPC4072FBD80
LPC408X_7X
Objective data sheet
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Rev. 1 — 17 September 2012
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LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
JTAG
interface
TEST/DEBUG
INTERFACE
slave
GPDMA
CONTROLLER
MPU
ARM
CORTEX-M4
I-code
bus
LPC408x/7x
FPU(1)
debug
port
EMULATION
TRACE MODULE
5. Block diagram
D-code
bus
system
bus
ETHERNET(1)
master
master
USB
DEVICE/
HOST(1)/OTG(1)
CLOCK
GENERATION,
POWER CONTROL,
SYSTEM
FUNCTIONS
clocks and
controls
master
slave
EMC(1)
ROM
slave
slave
LCD(1)
MULTILAYER AHB MATRIX
slave
slave
HIGH-SPEED
GPIO
SPIFI
slave
CRC
APB slave group 0
slave
AHB TO
APB
BRIDGE 0
SRAM
96/80/
40/24 kB
slave
AHB TO
APB
BRIDGE 1
SSP1
slave
FLASH
ACCELERATOR
FLASH
512/256/128/64 kB
4032 B/
2048 B
EEPROM
APB slave group 1
SSP0/2
UART0/1
UART2/3
I2C0/1
USART4(1)
CAN 0/1
I2C2
TIMER 0/1
SD/MMC(1)
WINDOWED WDT
TIMER2/3
PWM0/1
QUADRATURE ENCODER(1)
12-bit ADC
DAC
PIN CONNECT
GPIO INTERRUPT CONTROL
I2S
MOTOR CONTROL PWM
EVENT RECORDER
2 x ANALOG COMPARATOR(1)
32 kHz
OSCILLATOR
RTC
SYSTEM CONTROL
BACKUP REGISTERS
= connected to GPDMA
RTC POWER DOMAIN
002aag491
(1) Not available on all parts.
Fig 1.
Block diagram
LPC408X_7X
Objective data sheet
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Rev. 1 — 17 September 2012
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LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
6. Pinning information
156
105
6.1 Pinning
157
104
LPC408x/7xFBD208
53
1
52
208
Fig 2.
002aag732
Pin configuration (LQFP208)
ball A1
index area
2
1
4
3
6
5
8
7
9
10 12 14 16
11 13 15 17
A
B
C
D
E
F
G
H
J
LPC408x/7x
K
L
M
N
P
R
T
U
002aag733
Transparent top view
Fig 3.
LPC408X_7X
Objective data sheet
Pin configuration (TFBGA208)
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NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
ball A1
index area
LPC408x/7x
1 2 3 4 5 6 7 8 9 10 11 12 13 14
A
B
C
D
E
F
G
H
J
K
L
M
N
P
002aag734
Transparent top view
Pin configuration (TFBGA180)
73
108
Fig 4.
109
72
LPC408x/7x
37
1
36
144
41
Pin configuration (LQFP144)
60
Fig 5.
002aag735
61
40
LPC408x/7x
Fig 6.
LPC408X_7X
Objective data sheet
20
21
1
80
002aag865
Pin configuration (LQFP80)
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32-bit ARM Cortex-M4 microcontroller
6.2 Pin description
I/O pins on the LPC408x/7x are 5V tolerant and have input hysteresis unless otherwise
indicated in the table below. Crystal pins, power pins, and reference voltage pins are not
5V tolerant. In addition, when pins are selected to be ADC inputs, they are no longer 5V
tolerant and the input voltage must be limited to the voltage at the ADC positive reference
pin (VREFP).
All port pins Pn[m] are multiplexed, and the multiplexed functions appear in Table 3 in the
order defined by the FUNC bits of the corresponding IOCON register up to the highest
used function number. Each port pin can support up to eight multiplexed functions.
IOCON register FUNC values which are reserved are noted as “R” in the pin configuration
table.
P0[0] to
P0[31]
P0[0]
P0[1]
P0[2]
P0[3]
Type[2]
Pin LQFP80
Reset state[1]
Description
Pin LQFP144
Ball TFBGA180
Pin LQFP208
Symbol
Ball TFBGA208
Table 3.
Pin description
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
I/O
94
96
U15
T14
202 C4
204 D6
LPC408X_7X
Objective data sheet
M10 66
N11
D5
A3
67
37
38
141 79
142 80
[3]
[3]
[3]
[3]
I; PU I/O
Port 0: Port 0 is a 32-bit I/O port with individual direction
controls for each bit. The operation of port 0 pins
depends upon the pin function selected via the pin
connect block.
P0[0] — General purpose digital input/output pin.
I
CAN_RD1 — CAN1 receiver input.
O
U3_TXD — Transmitter output for UART3.
I/O
I2C1_SDA — I2C1 data input/output (this pin does not
use a specialized I2C pad).
O
U0_TXD — Transmitter output for UART0.
I; PU I/O
P0[1] — General purpose digital input/output pin.
O
CAN_TD1 — CAN1 transmitter output.
I
U3_RXD — Receiver input for UART3.
I/O
I2C1_SCL — I2C1 clock input/output (this pin does not
use a specialized I2C pad).
I
U0_RXD — Receiver input for UART0.
I; PU I/O
P0[2] — General purpose digital input/output pin.
O
U0_TXD — Transmitter output for UART0.
O
U3_TXD — Transmitter output for UART3.
I; PU I/O
P0[3] — General purpose digital input/output pin.
I
U0_RXD — Receiver input for UART0.
I
U3_RXD — Receiver input for UART3.
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32-bit ARM Cortex-M4 microcontroller
P0[5]
P0[6]
166 C12
164 D13
LPC408X_7X
Objective data sheet
116
-
B11
D11
115
113
-
64
[3]
[3]
[3]
Type[2]
A11
Reset state[1]
Pin LQFP80
168 B12
Pin LQFP144
P0[4]
Description
Ball TFBGA180
Pin LQFP208
Symbol
Ball TFBGA208
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
I; PU I/O
P0[4] — General purpose digital input/output pin.
I/O
I2S_RX_SCK — I2S Receive clock. It is driven by the
master and received by the slave. Corresponds to the
signal SCK in the I2S-bus specification.
I
CAN_RD2 — CAN2 receiver input.
I
T2_CAP0 — Capture input for Timer 2, channel 0.
-
R — Function reserved.
I/O
CMP_ROSC — Comparator relaxation oscillator for 555
timer applications.
-
R — Function reserved.
O
LCD_VD[0] — LCD data.
I; PU I/O
P0[5] — General purpose digital input/output pin.
I/O
I2S_RX_WS — I2S Receive word select. It is driven by
the master and received by the slave. Corresponds to the
signal WS in the I2S-bus specification.
O
CAN_TD2 — CAN2 transmitter output.
I
T2_CAP1 — Capture input for Timer 2, channel 1.
-
R — Function reserved.
I
CMP_RESET — Comparator reset.
-
R — Function reserved.
O
LCD_VD[1] — LCD data.
I; PU I/O
P0[6] — General purpose digital input/output pin.
I/O
I2S_RX_SDA — I2S Receive data. It is driven by the
transmitter and read by the receiver. Corresponds to the
signal SD in the I2S-bus specification.
I/O
SSP1_SSEL — Slave Select for SSP1.
O
T2_MAT0 — Match output for Timer 2, channel 0.
O
U1_RTS — Request to Send output for UART1. Can also
be configured to be an RS-485/EIA-485 output enable
signal for UART1.
I/O
CMP_ROSC — Comparator relaxation oscillator for 555
timer applications.
-
R — Function reserved.
O
LCD_VD[8] — LCD data.
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32-bit ARM Cortex-M4 microcontroller
P0[8]
P0[9]
160 A15
158 C14
LPC408X_7X
Objective data sheet
112
63
C12
A13
111
62
109 61
[4]
[4]
[4]
Type[2]
B12
Reset state[1]
Pin LQFP80
162 C13
Pin LQFP144
P0[7]
Description
Ball TFBGA180
Pin LQFP208
Symbol
Ball TFBGA208
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
I; IA
I/O
P0[7] — General purpose digital input/output pin.
I/O
I2S_TX_SCK — I2S transmit clock. It is driven by the
master and received by the slave. Corresponds to the
signal SCK in the I2S-bus specification.
I/O
SSP1_SCK — Serial Clock for SSP1.
I; IA
I; IA
O
T2_MAT1 — Match output for Timer 2, channel 1.
I
RTC_EV0 — Event input 0 to Event Monitor/Recorder.
I
CMP_VREF — Comparator reference voltage.
-
R — Function reserved.
O
LCD_VD[9] — LCD data.
I/O
P0[8] — General purpose digital input/output pin.
I/O
I2S_TX_WS — I2S Transmit word select. It is driven by
the master and received by the slave. Corresponds to the
signal WS in the I2S-bus specification.
I/O
SSP1_MISO — Master In Slave Out for SSP1.
O
T2_MAT2 — Match output for Timer 2, channel 2.
I
RTC_EV1 — Event input 1 to Event Monitor/Recorder.
I
CMP1_IN[3] — Comparator 1, input 3.
-
R — Function reserved.
O
LCD_VD[16] — LCD data.
I/O
P0[9] — General purpose digital input/output pin.
I/O
I2S_TX_SDA — I2S transmit data. It is driven by the
transmitter and read by the receiver. Corresponds to the
signal SD in the I2S-bus specification.
I/O
SSP1_MOSI — Master Out Slave In for SSP1.
O
T2_MAT3 — Match output for Timer 2, channel 3.
I
RTC_EV2 — Event input 2 to Event Monitor/Recorder.
I
CMP1_IN[2] — Comparator 1, input 2.
-
R — Function reserved.
O
LCD_VD[17] — LCD data.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
12 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
P0[11]
P0[12]
Pin LQFP144
Pin LQFP80
T15
L10
69
39
100 R14
41
R1
P12
J4
70
29
40
-
[3]
[3]
[5]
Type[2]
Ball TFBGA180
98
Reset state[1]
Ball TFBGA208
P0[10]
Description
Pin LQFP208
Symbol
I; PU I/O
O
U2_TXD — Transmitter output for UART2.
I/O
I2C2_SDA — I2C2 data input/output (this pin does not
use a specialized I2C pad).
O
T3_MAT0 — Match output for Timer 3, channel 0.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
LCD_VD[5] — LCD data.
I; PU I/O
45
LPC408X_7X
Objective data sheet
R2
J5
32
-
[5]
P0[11] — General purpose digital input/output pin.
I
U2_RXD — Receiver input for UART2.
I/O
I2C2_SCL — I2C2 clock input/output (this pin does not
use a specialized I2C pad).
O
T3_MAT1 — Match output for Timer 3, channel 1.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
LCD_VD[10] — LCD data.
I; PU I/O
O
P0[13]
P0[10] — General purpose digital input/output pin.
P0[12] — General purpose digital input/output pin.
USB_PPWR2 — Port Power enable signal for USB port
2.
I/O
SSP1_MISO — Master In Slave Out for SSP1.
I
ADC0_IN[6] — A/D converter 0, input 6. When
configured as an ADC input, the digital function of the pin
must be disabled.
I; PU I/O
P0[13] — General purpose digital input/output pin.
O
USB_UP_LED2 — USB port 2 GoodLink LED indicator.
It is LOW when the device is configured (non-control
endpoints enabled), or when the host is enabled and has
detected a device on the bus. It is HIGH when the device
is not configured, or when host is enabled and has not
detected a device on the bus, or during global suspend. It
transitions between LOW and HIGH (flashes) when the
host is enabled and detects activity on the bus.
I/O
SSP1_MOSI — Master Out Slave In for SSP1.
I
ADC0_IN[7] — A/D converter 0, input 7. When
configured as an ADC input, the digital function of the pin
must be disabled.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
13 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
P0[15]
P0[16]
P0[17]
P0[18]
Pin LQFP144
Pin LQFP80
T7
M5
48
-
128 J16
130 J14
126 K17
124 K15
LPC408X_7X
Objective data sheet
H13
H14
J12
J13
89
90
87
86
47
48
46
45
[3]
[3]
[3]
[3]
[3]
Type[2]
Ball TFBGA180
69
Reset state[1]
Ball TFBGA208
P0[14]
Description
Pin LQFP208
Symbol
I; PU I/O
P0[14] — General purpose digital input/output pin.
O
USB_HSTEN2 — Host Enabled status for USB port 2.
I/O
SSP1_SSEL — Slave Select for SSP1.
O
USB_CONNECT2 — SoftConnect control for USB port 2.
Signal used to switch an external 1.5 k resistor under
software control. Used with the SoftConnect USB feature.
I; PU I/O
P0[15] — General purpose digital input/output pin.
O
U1_TXD — Transmitter output for UART1.
I/O
SSP0_SCK — Serial clock for SSP0.
-
R — Function reserved.
-
R — Function reserved.
I/O
SPIFI_IO[2] — Data bit 0 for SPIFI.
I; PU I/O
P0 [16] — General purpose digital input/output pin.
I
U1_RXD — Receiver input for UART1.
I/O
SSP0_SSEL — Slave Select for SSP0.
-
R — Function reserved.
-
R — Function reserved.
I/O
SPIFI_IO[3] — Data bit 0 for SPIFI.
I; PU I/O
P0[17] — General purpose digital input/output pin.
I
U1_CTS — Clear to Send input for UART1.
I/O
SSP0_MISO — Master In Slave Out for SSP0.
-
R — Function reserved.
-
R — Function reserved.
I/O
SPIFI_IO[1] — Data bit 0 for SPIFI.
I; PU I/O
P0[18] — General purpose digital input/output pin.
I
U1_DCD — Data Carrier Detect input for UART1.
I/O
SSP0_MOSI — Master Out Slave In for SSP0.
-
R — Function reserved.
-
R — Function reserved.
I/O
SPIFI_IO[0] — Data bit 0 for SPIFI.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
14 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
P0[20]
P0[21]
P0[22]
85
-
120 M17 K14
118
116
M16 K11
N17
L14
83
82
80
-
-
44
[3]
[3]
[3]
[6]
Type[2]
J10
Reset state[1]
Pin LQFP80
122 L17
Pin LQFP144
P0[19]
Description
Ball TFBGA180
Pin LQFP208
Symbol
Ball TFBGA208
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
I; PU I/O
I
U1_DSR — Data Set Ready input for UART1.
O
SD_CLK — Clock output line for SD card interface.
I/O
I2C1_SDA — I2C1 data input/output (this pin does not
use a specialized I2C pad).
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
LCD_VD[13] — LCD data.
I; PU I/O
Objective data sheet
P0[20] — General purpose digital input/output pin.
O
U1_DTR — Data Terminal Ready output for UART1. Can
also be configured to be an RS-485/EIA-485 output
enable signal for UART1.
I/O
SD_CMD — Command line for SD card interface.
I/O
I2C1_SCL — I2C1 clock input/output (this pin does not
use a specialized I2C pad).
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
LCD_VD[14] — LCD data.
I; PU I/O
P0[21] — General purpose digital input/output pin.
I
U1_RI — Ring Indicator input for UART1.
O
SD_PWR — Power Supply Enable for external SD card
power supply.
O
U4_OE — RS-485/EIA-485 output enable signal for
UART4.
I
CAN_RD1 — CAN1 receiver input.
I/O
U4_SCLK — USART 4 clock input or output in
synchronous mode.
I; PU I/O
O
LPC408X_7X
P0[19] — General purpose digital input/output pin.
P0[22] — General purpose digital input/output pin.
U1_RTS — Request to Send output for UART1. Can also
be configured to be an RS-485/EIA-485 output enable
signal for UART1.
I/O
SD_DAT[0] — Data line 0 for SD card interface.
O
U4_TXD — Transmitter output for USART4 (input/output
in smart card mode).
O
CAN_TD1 — CAN1 transmitter output.
O
SPIFI_CLK — Clock output for SPIFI.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
15 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
P0[24]
P0[25]
P0[26]
P0[27]
Pin LQFP144
Pin LQFP80
H1
F5
13
-
16
14
12
50
LPC408X_7X
Objective data sheet
G2
F1
E1
T1
E1
E4
D1
L3
11
10
8
35
-
7
6
-
[5]
[5]
[5]
[7]
[8]
Type[2]
Ball TFBGA180
18
Reset state[1]
Ball TFBGA208
P0[23]
Description
Pin LQFP208
Symbol
I; PU I/O
I
ADC0_IN[0] — A/D converter 0, input 0. When
configured as an ADC input, the digital function of the pin
must be disabled.
I/O
I2S_RX_SCK — Receive Clock. It is driven by the
master and received by the slave. Corresponds to the
signal SCK in the I2S-bus specification.
I
T3_CAP0 — Capture input for Timer 3, channel 0.
I; PU I/O
P0[24] — General purpose digital input/output pin.
I
ADC0_IN[1] — A/D converter 0, input 1. When
configured as an ADC input, the digital function of the pin
must be disabled.
I/O
I2S_RX_WS — Receive Word Select. It is driven by the
master and received by the slave. Corresponds to the
signal WS in the I2S-bus specification.
I
T3_CAP1 — Capture input for Timer 3, channel 1.
I; PU I/O
P0[25] — General purpose digital input/output pin.
I
ADC0_IN[2] — A/D converter 0, input 2. When
configured as an ADC input, the digital function of the pin
must be disabled.
I/O
I2S_RX_SDA — Receive data. It is driven by the
transmitter and read by the receiver. Corresponds to the
signal SD in the I2S-bus specification.
O
U3_TXD — Transmitter output for UART3.
I; PU I/O
I
P0[23] — General purpose digital input/output pin.
P0[26] — General purpose digital input/output pin.
I
ADC0_IN[3] — A/D converter 0, input 3. When
configured as an ADC input, the digital function of the pin
must be disabled.
O
DAC_OUT — D/A converter output. When configured as
the DAC output, the digital function of the pin must be
disabled.
I
U3_RXD — Receiver input for UART3.
I/O
P0[27] — General purpose digital input/output pin.
I/O
I2C0_SDA — I2C0 data input/output. (This pin uses a
specialized I2C pad).
I/O
USB_SDA1 — I2C serial data for communication with an
external USB transceiver.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
16 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
P0[29]
P0[30]
P0[31]
Pin LQFP144
Pin LQFP80
R3
M1
34
-
61
62
51
U4
R6
T2
K5
N4
N1
42
43
36
22
23
-
[8]
[9]
[9]
[9]
P1[0] to
P1[31]
P1[0]
P1[1]
P1[2]
P1[3]
196 A3
194 B5
185 D9
177 A10
LPC408X_7X
Objective data sheet
B5
A5
B7
A9
136 76
135 75
-
-
-
-
[3]
[3]
[3]
[3]
Type[2]
Ball TFBGA180
48
Reset state[1]
Ball TFBGA208
P0[28]
Description
Pin LQFP208
Symbol
I
I/O
P0[28] — General purpose digital input/output pin.
I/O
I2C0_SCL — I2C0 clock input/output (this pin uses a
specialized I2C pad.
I/O
USB_SCL1 — I2C serial clock for communication with
an external USB transceiver.
I
I
I
I/O
P0[29] — General purpose digital input/output pin.
I/O
USB_D+1 — USB port 1 bidirectional D+ line.
I
EINT0 — External interrupt 0 input.
I/O
P0[30] — General purpose digital input/output pin.
I/O
USB_D1 — USB port 1 bidirectional D line.
I
EINT1 — External interrupt 1 input.
I/O
P0[31] — General purpose digital input/output pin.
I/O
USB_D+2 — USB port 2 bidirectional D+ line.
I/O
Port 1: Port 1 is a 32 bit I/O port with individual direction
controls for each bit. The operation of port 1 pins
depends upon the pin function selected via the pin
connect block
I; PU I/O
P1[0] — General purpose digital input/output pin.
O
ENET_TXD0 — Ethernet transmit data 0 (RMII/MII
interface).
-
R — Function reserved.
I
T3_CAP1 — Capture input for Timer 3, channel 1.
I/O
SSP2_SCK — Serial clock for SSP2.
I; PU I/O
P1[1] — General purpose digital input/output pin.
O
ENET_TXD1 — Ethernet transmit data 1 (RMII/MII
interface).
-
R — Function reserved.
O
T3_MAT3 — Match output for Timer 3, channel 3.
I/O
SSP2_MOSI — Master Out Slave In for SSP2.
I; PU I/O
P1[2] — General purpose digital input/output pin.
O
ENET_TXD2 — Ethernet transmit data 2 (MII interface).
O
SD_CLK — Clock output line for SD card interface.
O
PWM0[1] — Pulse Width Modulator 0, output 1.
I; PU I/O
P1[3] — General purpose digital input/output pin.
O
ENET_TXD3 — Ethernet transmit data 3 (MII interface).
I/O
SD_CMD — Command line for SD card interface.
O
PWM0[2] — Pulse Width Modulator 0, output 2.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
17 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
P1[5]
P1[6]
P1[7]
P1[8]
156 A17
171 B11
153 D14
190 C7
LPC408X_7X
Objective data sheet
B13
B10
C13
B6
-
-
-
-
-
-
132 73
[3]
[3]
[3]
[3]
[3]
Type[2]
133 74
Reset state[1]
Pin LQFP144
C6
Pin LQFP80
Ball TFBGA180
192 A5
Pin LQFP208
P1[4]
Description
Ball TFBGA208
Symbol
I; PU I/O
P1[4] — General purpose digital input/output pin.
O
ENET_TX_EN — Ethernet transmit data enable
(RMII/MII interface).
-
R — Function reserved.
O
T3_MAT2 — Match output for Timer 3, channel 2.
I/O
SSP2_MISO — Master In Slave Out for SSP2.
I; PU I/O
P1[5] — General purpose digital input/output pin.
O
ENET_TX_ER — Ethernet Transmit Error (MII interface).
O
SD_PWR — Power Supply Enable for external SD card
power supply.
O
PWM0[3] — Pulse Width Modulator 0, output 3.
-
R — Function reserved.
I
CMP1_IN[1] — Comparator 1, input 1.
I; PU I/O
P1[6] — General purpose digital input/output pin.
I
ENET_TX_CLK — Ethernet Transmit Clock (MII
interface).
I/O
SD_DAT[0] — Data line 0 for SD card interface.
O
PWM0[4] — Pulse Width Modulator 0, output 4.
-
R — Function reserved.
I
CMP0_IN[3] — Comparator 0, input 3.
I; PU I/O
P1[7] — General purpose digital input/output pin.
I
ENET_COL — Ethernet Collision detect (MII interface).
I/O
SD_DAT[1] — Data line 1 for SD card interface.
O
PWM0[5] — Pulse Width Modulator 0, output 5.
-
R — Function reserved.
I
CMP1_IN[0] — Comparator 1, input 0.
I; PU I/O
P1[8] — General purpose digital input/output pin.
I
ENET_CRS (ENET_CRS_DV) — Ethernet Carrier
Sense (MII interface) or Ethernet Carrier Sense/Data
Valid (RMII interface).
-
R — Function reserved.
O
T3_MAT1 — Match output for Timer 3, channel 1.
I/O
SSP2_SSEL — Slave Select for SSP2.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
18 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
P1[10]
P1[11]
P1[12]
P1[13]
186 C8
163 A14
157 A16
147 D16
A7
A12
A14
D14
129 71
-
-
-
-
-
-
[3]
[3]
[3]
[3]
[3]
Type[2]
131 72
Reset state[1]
Pin LQFP144
D7
Pin LQFP80
Ball TFBGA180
188 A6
Pin LQFP208
P1[9]
Description
Ball TFBGA208
Symbol
I; PU I/O
I
ENET_RXD0 — Ethernet receive data 0 (RMII/MII
interface).
-
R — Function reserved.
O
T3_MAT0 — Match output for Timer 3, channel 0.
I; PU I/O
P1[15]
184 A7
182 A8
LPC408X_7X
Objective data sheet
D8
A8
128 70
126 69
[3]
[3]
P1[10] — General purpose digital input/output pin.
I
ENET_RXD1 — Ethernet receive data 1 (RMII/MII
interface).
-
R — Function reserved.
I
T3_CAP0 — Capture input for Timer 3, channel 0.
I; PU I/O
P1[11] — General purpose digital input/output pin.
I
ENET_RXD2 — Ethernet Receive Data 2 (MII interface).
I/O
SD_DAT[2] — Data line 2 for SD card interface.
O
PWM0[6] — Pulse Width Modulator 0, output 6.
I; PU I/O
P1[12] — General purpose digital input/output pin.
I
ENET_RXD3 — Ethernet Receive Data (MII interface).
I/O
SD_DAT[3] — Data line 3 for SD card interface.
I
PWM0_CAP0 — Capture input for PWM0, channel 0.
-
R — Function reserved.
O
CMP1_OUT — Comparator 1, output.
I; PU I/O
I
P1[14]
P1[9] — General purpose digital input/output pin.
I; PU I/O
P1[13] — General purpose digital input/output pin.
ENET_RX_DV — Ethernet Receive Data Valid (MII
interface).
P1[14] — General purpose digital input/output pin.
I
ENET_RX_ER — Ethernet receive error (RMII/MII
interface).
-
R — Function reserved.
I
T2_CAP0 — Capture input for Timer 2, channel 0.
-
R — Function reserved.
I
CMP0_IN[0] — Comparator 0, input 0.
I; PU I/O
P1[15] — General purpose digital input/output pin.
I
ENET_RX_CLK (ENET_REF_CLK) — Ethernet Receive
Clock (MII interface) or Ethernet Reference Clock (RMII
interface).
-
R — Function reserved.
I/O
I2C2_SDA — I2C2 data input/output (this pin does not
use a specialized I2C pad).
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
19 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
P1[17]
P1[18]
P1[19]
180 D10
178 A9
66
68
LPC408X_7X
Objective data sheet
P7
U6
C9
L5
P5
123 -
46
47
25
26
[3]
[3]
[3]
[3]
Type[2]
125 -
Reset state[1]
B8
Pin LQFP80
Pin LQFP144
P1[16]
Description
Ball TFBGA180
Pin LQFP208
Symbol
Ball TFBGA208
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
I; PU I/O
P1[16] — General purpose digital input/output pin.
O
ENET_MDC — Ethernet MIIM clock.
O
I2S_TX_MCLK — I2S transmit master clock.
-
R — Function reserved.
-
R — Function reserved.
I
CMP0_IN[1] — Comparator 0, input 1.
I; PU I/O
P1[17] — General purpose digital input/output pin.
I/O
ENET_MDIO — Ethernet MIIM data input and output.
O
I2S_RX_MCLK — I2S receive master clock.
-
R — Function reserved.
-
R — Function reserved.
I
CMP0_IN[2] — Comparator 0, input 2.
I; PU I/O
P1[18] — General purpose digital input/output pin.
O
USB_UP_LED1 — It is LOW when the device is
configured (non-control endpoints enabled), or when the
host is enabled and has detected a device on the bus. It
is HIGH when the device is not configured, or when host
is enabled and has not detected a device on the bus, or
during global suspend. It transitions between LOW and
HIGH (flashes) when the host is enabled and detects
activity on the bus.
O
PWM1[1] — Pulse Width Modulator 1, channel 1 output.
I
T1_CAP0 — Capture input for Timer 1, channel 0.
-
R — Function reserved.
I/O
SSP1_MISO — Master In Slave Out for SSP1.
I; PU I/O
P1[19] — General purpose digital input/output pin.
O
USB_TX_E1 — Transmit Enable signal for USB port 1
(OTG transceiver).
O
USB_PPWR1 — Port Power enable signal for USB port
1.
I
T1_CAP1 — Capture input for Timer 1, channel 1.
O
MC_0A — Motor control PWM channel 0, output A.
I/O
SSP1_SCK — Serial clock for SSP1.
O
U2_OE — RS-485/EIA-485 output enable signal for
UART2.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
20 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
P1[21]
P1[22]
Pin LQFP144
Pin LQFP80
U7
K6
49
27
72
74
LPC408X_7X
Objective data sheet
R8
U8
N6
M6
50
51
-
28
[3]
[3]
[3]
Type[2]
Ball TFBGA180
70
Reset state[1]
Ball TFBGA208
P1[20]
Description
Pin LQFP208
Symbol
I; PU I/O
P1[20] — General purpose digital input/output pin.
O
USB_TX_DP1 — D+ transmit data for USB port 1 (OTG
transceiver).
O
PWM1[2] — Pulse Width Modulator 1, channel 2 output.
I
QEI_PHA — Quadrature Encoder Interface PHA input.
I
MC_FB0 — Motor control PWM channel 0 feedback
input.
I/O
SSP0_SCK — Serial clock for SSP0.
O
LCD_VD[6] — LCD data.
O
LCD_VD[10] — LCD data.
I; PU I/O
P1[21] — General purpose digital input/output pin.
O
USB_TX_DM1 — D transmit data for USB port 1 (OTG
transceiver).
O
PWM1[3] — Pulse Width Modulator 1, channel 3 output.
I/O
SSP0_SSEL — Slave Select for SSP0.
I
MC_ABORT — Motor control PWM, active low fast
abort.
-
R — Function reserved.
O
LCD_VD[7] — LCD data.
O
LCD_VD[11] — LCD data.
I; PU I/O
P1[22] — General purpose digital input/output pin.
I
USB_RCV1 — Differential receive data for USB port 1
(OTG transceiver).
I
USB_PWRD1 — Power Status for USB port 1 (host
power switch).
O
T1_MAT0 — Match output for Timer 1, channel 0.
O
MC_0B — Motor control PWM channel 0, output B.
I/O
SSP1_MOSI — Master Out Slave In for SSP1.
O
LCD_VD[8] — LCD data.
O
LCD_VD[12] — LCD data.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
21 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
P1[24]
P1[25]
Pin LQFP144
Pin LQFP80
P9
N7
53
29
78
80
LPC408X_7X
Objective data sheet
T9
T10
P7
L7
54
56
30
31
[3]
[3]
[3]
Type[2]
Ball TFBGA180
76
Reset state[1]
Ball TFBGA208
P1[23]
Description
Pin LQFP208
Symbol
I; PU I/O
P1[23] — General purpose digital input/output pin.
I
USB_RX_DP1 — D+ receive data for USB port 1 (OTG
transceiver).
O
PWM1[4] — Pulse Width Modulator 1, channel 4 output.
I
QEI_PHB — Quadrature Encoder Interface PHB input.
I
MC_FB1 — Motor control PWM channel 1 feedback
input.
I/O
SSP0_MISO — Master In Slave Out for SSP0.
O
LCD_VD[9] — LCD data.
O
LCD_VD[13] — LCD data.
I; PU I/O
P1[24] — General purpose digital input/output pin.
I
USB_RX_DM1 — D receive data for USB port 1 (OTG
transceiver).
O
PWM1[5] — Pulse Width Modulator 1, channel 5 output.
I
QEI_IDX — Quadrature Encoder Interface INDEX input.
I
MC_FB2 — Motor control PWM channel 2 feedback
input.
I/O
SSP0_MOSI — Master Out Slave in for SSP0.
O
LCD_VD[10] — LCD data.
O
LCD_VD[14] — LCD data.
I; PU I/O
P1[25] — General purpose digital input/output pin.
O
USB_LS1 — Low Speed status for USB port 1 (OTG
transceiver).
O
USB_HSTEN1 — Host Enabled status for USB port 1.
O
T1_MAT1 — Match output for Timer 1, channel 1.
O
MC_1A — Motor control PWM channel 1, output A.
O
CLKOUT — Selectable clock output.
O
LCD_VD[11] — LCD data.
O
LCD_VD[15] — LCD data.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
22 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
P1[27]
P1[28]
P1[29]
Pin LQFP144
Pin LQFP80
R10
P8
57
32
88
90
92
LPC408X_7X
Objective data sheet
T12
T13
U14
M9
P10
N10
61
63
64
-
35
36
[3]
[3]
[3]
[3]
Type[2]
Ball TFBGA180
82
Reset state[1]
Ball TFBGA208
P1[26]
Description
Pin LQFP208
Symbol
I; PU I/O
P1[26] — General purpose digital input/output pin.
O
USB_SSPND1 — USB port 1 Bus Suspend status (OTG
transceiver).
O
PWM1[6] — Pulse Width Modulator 1, channel 6 output.
I
T0_CAP0 — Capture input for Timer 0, channel 0.
O
MC_1B — Motor control PWM channel 1, output B.
I/O
SSP1_SSEL — Slave Select for SSP1.
O
LCD_VD[12] — LCD data.
O
LCD_VD[20] — LCD data.
I; PU I/O
P1[27] — General purpose digital input/output pin.
I
USB_INT1 — USB port 1 OTG transceiver interrupt
(OTG transceiver).
I
USB_OVRCR1 — USB port 1 Over-Current status.
I
T0_CAP1 — Capture input for Timer 0, channel 1.
O
CLKOUT — Selectable clock output.
-
R — Function reserved.
O
LCD_VD[13] — LCD data.
O
LCD_VD[21] — LCD data.
I; PU I/O
P1[28] — General purpose digital input/output pin.
I/O
USB_SCL1 — USB port 1 I2C serial clock (OTG
transceiver).
I
PWM1_CAP0 — Capture input for PWM1, channel 0.
O
T0_MAT0 — Match output for Timer 0, channel 0.
O
MC_2A — Motor control PWM channel 2, output A.
I/O
SSP0_SSEL — Slave Select for SSP0.
O
LCD_VD[14] — LCD data.
O
LCD_VD[22] — LCD data.
I; PU I/O
P1[29] — General purpose digital input/output pin.
I/O
USB_SDA1 — USB port 1 I2C serial data (OTG
transceiver).
I
PWM1_CAP1 — Capture input for PWM1, channel 1.
O
T0_MAT1 — Match output for Timer 0, channel 1.
O
MC_2B — Motor control PWM channel 2, output B.
O
U4_TXD — Transmitter output for USART4 (input/output
in smart card mode).
O
LCD_VD[15] — LCD data.
O
LCD_VD[23] — LCD data.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
23 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
Pin LQFP144
Pin LQFP80
P2
K3
30
18
[5]
Type[2]
Ball TFBGA180
42
Reset state[1]
Ball TFBGA208
P1[30]
Description
Pin LQFP208
Symbol
I; PU I/O
P1[30] — General purpose digital input/output pin.
I
USB_PWRD2 — Power Status for USB port 2.
I
USB_VBUS — Monitors the presence of USB bus
power.
This signal must be HIGH for USB reset to occur.
P1[31]
40
P1
K2
28
17
[5]
P2[0] to
P2[31]
P2[0]
154 B17
LPC408X_7X
Objective data sheet
D12
107 60
[3]
I
ADC0_IN[4] — A/D converter 0, input 4. When
configured as an ADC input, the digital function of the pin
must be disabled.
I/O
I2C0_SDA — I2C0 data input/output (this pin does not
use a specialized I2C pad.
O
U3_OE — RS-485/EIA-485 output enable signal for
UART3.
I; PU I/O
P1[31] — General purpose digital input/output pin.
I
USB_OVRCR2 — Over-Current status for USB port 2.
I/O
SSP1_SCK — Serial Clock for SSP1.
I
ADC0_IN[5] — A/D converter 0, input 5. When
configured as an ADC input, the digital function of the pin
must be disabled.
I/O
I2C0_SCL — I2C0 clock input/output (this pin does not
use a specialized I2C pad.
I/O
Port 2: Port 2 is a 32 bit I/O port with individual direction
controls for each bit. The operation of port 1 pins
depends upon the pin function selected via the pin
connect block.
I; PU I/O
P2[0] — General purpose digital input/output pin.
O
PWM1[1] — Pulse Width Modulator 1, channel 1 output.
O
U1_TXD — Transmitter output for UART1.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
LCD_PWR — LCD panel power enable.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
24 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
P2[2]
P2[3]
P2[4]
152 E14
150 D15
144 E16
142 D17
LPC408X_7X
Objective data sheet
E11
E13
E14
105 58
100 55
99
54
[3]
[3]
[3]
[3]
Type[2]
106 59
Reset state[1]
C14
Pin LQFP80
Pin LQFP144
P2[1]
Description
Ball TFBGA180
Pin LQFP208
Symbol
Ball TFBGA208
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
I; PU I/O
P2[1] — General purpose digital input/output pin.
O
PWM1[2] — Pulse Width Modulator 1, channel 2 output.
I
U1_RXD — Receiver input for UART1.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
LCD_LE — Line end signal.
I; PU I/O
P2[2] — General purpose digital input/output pin.
O
PWM1[3] — Pulse Width Modulator 1, channel 3 output.
I
U1_CTS — Clear to Send input for UART1.
O
T2_MAT3 — Match output for Timer 2, channel 3.
-
R — Function reserved.
O
TRACEDATA[3] — Trace data, bit 3.
-
R — Function reserved.
O
LCD_DCLK — LCD panel clock.
I; PU I/O
P2[3] — General purpose digital input/output pin.
O
PWM1[4] — Pulse Width Modulator 1, channel 4 output.
I
U1_DCD — Data Carrier Detect input for UART1.
O
T2_MAT2 — Match output for Timer 2, channel 2.
-
R — Function reserved.
O
TRACEDATA[2] — Trace data, bit 2.
-
R — Function reserved.
O
LCD_FP — Frame pulse (STN). Vertical synchronization
pulse (TFT).
I; PU I/O
P2[4] — General purpose digital input/output pin.
O
PWM1[5] — Pulse Width Modulator 1, channel 5 output.
I
U1_DSR — Data Set Ready input for UART1.
O
T2_MAT1 — Match output for Timer 2, channel 1.
-
R — Function reserved.
O
TRACEDATA[1] — Trace data, bit 1.
-
R — Function reserved.
O
LCD_ENAB_M — STN AC bias drive or TFT data enable
output.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
25 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
P2[6]
P2[7]
138 E17
136 G16
LPC408X_7X
Objective data sheet
97
53
F13
G11
96
95
52
51
[3]
[3]
[3]
Type[2]
F12
Reset state[1]
Pin LQFP80
140 F16
Pin LQFP144
P2[5]
Description
Ball TFBGA180
Pin LQFP208
Symbol
Ball TFBGA208
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
I; PU I/O
P2[5] — General purpose digital input/output pin.
O
PWM1[6] — Pulse Width Modulator 1, channel 6 output.
O
U1_DTR — Data Terminal Ready output for UART1. Can
also be configured to be an RS-485/EIA-485 output
enable signal for UART1.
O
T2_MAT0 — Match output for Timer 2, channel 0.
-
R — Function reserved.
O
TRACEDATA[0] — Trace data, bit 0.
-
R — Function reserved.
O
LCD_LP — Line synchronization pulse (STN). Horizontal
synchronization pulse (TFT).
I; PU I/O
P2[6] — General purpose digital input/output pin.
I
PWM1_CAP0 — Capture input for PWM1, channel 0.
I
U1_RI — Ring Indicator input for UART1.
I
T2_CAP0 — Capture input for Timer 2, channel 0.
O
U2_OE — RS-485/EIA-485 output enable signal for
UART2.
O
TRACECLK — Trace clock.
O
LCD_VD[0] — LCD data.
O
LCD_VD[4] — LCD data.
I; PU I/O
P2[7] — General purpose digital input/output pin.
I
CAN_RD2 — CAN2 receiver input.
O
U1_RTS — Request to Send output for UART1. Can also
be configured to be an RS-485/EIA-485 output enable
signal for UART1.
-
R — Function reserved.
-
R — Function reserved.
O
SPIFI_CS — Chip select output for SPIFI.
O
LCD_VD[1] — LCD data.
O
LCD_VD[5] — LCD data.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
26 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
P2[9]
P2[10]
132 H16
110
N15
50
H11
92
M13 76
49
41
[3]
[3]
[10]
Type[2]
G14 93
Reset state[1]
Pin LQFP80
134 H15
Description
Pin LQFP144
P2[8]
Ball TFBGA180
Pin LQFP208
Symbol
Ball TFBGA208
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
I; PU I/O
P2[8] — General purpose digital input/output pin.
O
CAN_TD2 — CAN2 transmitter output.
O
U2_TXD — Transmitter output for UART2.
I
U1_CTS — Clear to Send input for UART1.
O
ENET_MDC — Ethernet MIIM clock.
-
R — Function reserved.
O
LCD_VD[2] — LCD data.
O
LCD_VD[6] — LCD data.
I; PU I/O
P2[9] — General purpose digital input/output pin.
O
USB_CONNECT1 — USB1 SoftConnect control. Signal
used to switch an external 1.5 k resistor under the
software control. Used with the SoftConnect USB feature.
I
U2_RXD — Receiver input for UART2.
I
U4_RXD — Receiver input for USART4.
I/O
ENET_MDIO — Ethernet MIIM data input and output.
-
R — Function reserved.
I
LCD_VD[3] — LCD data.
I
LCD_VD[7] — LCD data.
I; PU I/O
P2[10] — General purpose digital input/output pin. This
pin includes a 5 ns input glitch filter.
A LOW on this pin while RESET is LOW forces the
on-chip boot loader to take over control of the part after a
reset and go into ISP mode.
P2[11]
108 T17
M12 75
-
[10]
I
EINT0 — External interrupt 0 input.
I
NMI — Non-maskable interrupt input.
I; PU I/O
I
LPC408X_7X
Objective data sheet
P2[11] — General purpose digital input/output pin. This
pin includes a 5 ns input glitch filter.
EINT1 — External interrupt 1 input.
I/O
SD_DAT[1] — Data line 1 for SD card interface.
I/O
I2S_TX_SCK — Transmit Clock. It is driven by the
master and received by the slave. Corresponds to the
signal SCK in the I2S-bus specification.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
LCD_CLKIN — LCD clock.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
27 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
P2[13]
102 T16
73
-
M11 71
-
[10]
[10]
Type[2]
N14
Reset state[1]
Pin LQFP80
106 N14
Pin LQFP144
P2[12]
Description
Ball TFBGA180
Pin LQFP208
Symbol
Ball TFBGA208
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
I; PU I/O
I
EINT2 — External interrupt 2 input.
I/O
SD_DAT[2] — Data line 2 for SD card interface.
I/O
I2S_TX_WS — Transmit Word Select. It is driven by the
master and received by the slave. Corresponds to the
signal WS in the I2S-bus specification.
O
LCD_VD[4] — LCD data.
O
LCD_VD[3] — LCD data.
O
LCD_VD[8] — LCD data.
O
LCD_VD[18] — LCD data.
I; PU I/O
P2[15]
P2[16]
91
99
87
R12
P13
R11
-
-
P9
-
-
-
-
-
-
[3]
[3]
[3]
I
EINT3 — External interrupt 3 input.
SD_DAT[3] — Data line 3 for SD card interface.
I/O
I2S_TX_SDA — Transmit data. It is driven by the
transmitter and read by the receiver. Corresponds to the
signal SD in the I2S-bus specification.
-
R — Function reserved.
O
LCD_VD[5] — LCD data.
O
LCD_VD[9] — LCD data.
I; PU I/O
95
R13
P11
-
-
[3]
EMC_CS2 — LOW active Chip Select 2 signal.
I/O
I2C1_SDA — I2C1 data input/output (this pin does not
use a specialized I2C pad).
I
T2_CAP0 — Capture input for Timer 2, channel 0.
I; PU I/O
Objective data sheet
P2[15] — General purpose digital input/output pin.
O
EMC_CS3 — LOW active Chip Select 3 signal.
I/O
I2C1_SCL — I2C1 clock input/output (this pin does not
use a specialized I2C pad).
I
T2_CAP1 — Capture input for Timer 2, channel 1.
I; PU I/O
I; PU I/O
O
LPC408X_7X
LCD_VD[19] — LCD data.
P2[14] — General purpose digital input/output pin.
O
O
P2[17]
P2[13] — General purpose digital input/output pin. This
pin includes a 5 ns input glitch filter.
I/O
O
P2[14]
P2[12] — General purpose digital input/output pin. This
pin includes a 5 ns input glitch filter.
P2[16] — General purpose digital input/output pin.
EMC_CAS — LOW active SDRAM Column Address
Strobe.
P2[17] — General purpose digital input/output pin.
EMC_RAS — LOW active SDRAM Row Address Strobe.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
28 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
Pin LQFP144
Pin LQFP80
59
U3
P3
-
-
[6]
I; PU I/O
P2[19]
67
R7
N5
-
-
[6]
I; PU I/O
I; PU I/O
I; PU I/O
Type[2]
Ball TFBGA180
P2[18]
Reset state[1]
Ball TFBGA208
Description
Pin LQFP208
Symbol
O
O
P2[20]
73
T8
P6
-
-
[3]
P2[21]
81
U11
N8
-
-
[3]
-
[3]
O
O
P2[22]
P2[23]
85
64
U12
U5
-
-
-
-
-
[3]
P2[24]
53
P5
P1
-
-
[3]
P2[25]
54
R4
P2
-
-
[3]
-
[3]
I; PU I/O
P2[27]
P2[28]
47
49
T4
P3
P4
-
-
M2
-
-
-
-
-
[3]
[3]
43
N3
L1
-
-
[3]
Objective data sheet
P2[20] — General purpose digital input/output pin.
EMC_DYCS0 — SDRAM chip select 0.
P2[21] — General purpose digital input/output pin.
EMC_DYCS1 — SDRAM chip select 1.
P2[22] — General purpose digital input/output pin.
EMC_DYCS2 — SDRAM chip select 2.
I
T3_CAP0 — Capture input for Timer 3, channel 0.
I; PU I/O
P2[23] — General purpose digital input/output pin.
O
EMC_DYCS3 — SDRAM chip select 3.
I/O
SSP0_SSEL — Slave Select for SSP0.
I
T3_CAP1 — Capture input for Timer 3, channel 1.
I; PU I/O
I; PU I/O
I; PU I/O
P2[24] — General purpose digital input/output pin.
EMC_CKE0 — SDRAM clock enable 0.
P2[25] — General purpose digital input/output pin.
EMC_CKE1 — SDRAM clock enable 1.
P2[26] — General purpose digital input/output pin.
O
EMC_CKE2 — SDRAM clock enable 2.
I/O
SSP0_MISO — Master In Slave Out for SSP0.
O
T3_MAT0 — Match output for Timer 3, channel 0.
I; PU I/O
P2[27] — General purpose digital input/output pin.
O
EMC_CKE3 — SDRAM clock enable 3.
I/O
SSP0_MOSI — Master Out Slave In for SSP0.
O
T3_MAT1 — Match output for Timer 3, channel 1.
I; PU I/O
I; PU I/O
O
LPC408X_7X
EMC_CLK[1] — SDRAM clock 1.
SSP0_SCK — Serial clock for SSP0.
O
P2[29]
P2[19] — General purpose digital input/output pin.
O
O
57
EMC_CLK[0] — SDRAM clock 0.
I/O
O
P2[26]
P2[18] — General purpose digital input/output pin.
P2[28] — General purpose digital input/output pin.
EMC_DQM0 — Data mask 0 used with SDRAM and
static devices.
P2[29] — General purpose digital input/output pin.
EMC_DQM1 — Data mask 1 used with SDRAM and
static devices.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
29 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
Pin LQFP144
Pin LQFP80
L4
-
-
12
[3]
Type[2]
Ball TFBGA180
31
Reset state[1]
Ball TFBGA208
P2[30]
Description
Pin LQFP208
Symbol
I; PU I/O
O
EMC_DQM2 — Data mask 2 used with SDRAM and
static devices.
I/O
I2C2_SDA — I2C2 data input/output (this pin does not
use a specialized I2C pad).
O
P2[31]
39
N2
-
-
-
[3]
P3[0] to
P3[31]
I; PU I/O
EMC_DQM3 — Data mask 3 used with SDRAM and
static devices.
I/O
I2C2_SCL — I2C2 clock input/output (this pin does not
use a specialized I2C pad).
O
T3_MAT3 — Match output for Timer 3, channel 3.
I/O
Port 3: Port 3 is a 32-bit I/O port with individual direction
controls for each bit. The operation of port 3 pins
depends upon the pin function selected via the pin
connect block.
197 B4
D6
137 -
[3]
I; PU I/O
P3[1]
201 B3
E6
140 -
[3]
I; PU I/O
I; PU I/O
I; PU I/O
I/O
I/O
P3[2]
207 B1
A2
144 -
[3]
P3[3]
3
G5
2
-
[3]
I; PU I/O
I; PU I/O
I/O
I/O
P3[4]
13
F2
D3
9
-
[3]
P3[5]
17
G1
E3
12
-
[3]
I; PU I/O
I; PU I/O
I/O
I/O
P3[6]
23
J1
F4
16
-
[3]
P3[7]
27
L1
G3
19
-
[3]
I; PU I/O
I; PU I/O
I/O
I/O
P3[8]
191 D8
A6
-
-
[3]
P3[9]
199 C5
A4
-
-
[3]
I/O
I/O
LPC408X_7X
Objective data sheet
T3_MAT2 — Match output for Timer 3, channel 2.
P2[31] — General purpose digital input/output pin.
O
P3[0]
E4
P2[30] — General purpose digital input/output pin.
P3[0] — General purpose digital input/output pin.
EMC_D[0] — External memory data line 0.
P3[1] — General purpose digital input/output pin.
EMC_D[1] — External memory data line 1.
P3[2] — General purpose digital input/output pin.
EMC_D[2] — External memory data line 2.
P3[3] — General purpose digital input/output pin.
EMC_D[3] — External memory data line 3.
P3[4] — General purpose digital input/output pin.
EMC_D[4] — External memory data line 4.
P3[5] — General purpose digital input/output pin.
EMC_D[5] — External memory data line 5.
P3[6] — General purpose digital input/output pin.
EMC_D[6] — External memory data line 6.
P3[7] — General purpose digital input/output pin.
EMC_D[7] — External memory data line 7.
P3[8] — General purpose digital input/output pin.
EMC_D[8] — External memory data line 8.
P3[9] — General purpose digital input/output pin.
EMC_D[9] — External memory data line 9.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
30 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
B3
-
-
[3]
I; PU I/O
P3[11]
208 D5
B2
-
-
[3]
I; PU I/O
I; PU I/O
I; PU I/O
Type[2]
Pin LQFP80
205 B2
Reset state[1]
Pin LQFP144
P3[10]
Pin LQFP208
Ball TFBGA180
Description
Ball TFBGA208
Symbol
I/O
I/O
P3[12]
1
D4
A1
-
-
[3]
P3[13]
7
C1
C1
-
-
[3]
I; PU I/O
I; PU I/O
I/O
I/O
P3[14]
21
H2
F1
-
-
[3]
P3[15]
28
M1
G4
-
-
[3]
-
[3]
I/O
I/O
P3[16]
P3[17]
P3[18]
P3[19]
P3[20]
137 F17
143 F15
151 C15
161 B14
167 A13
LPC408X_7X
Objective data sheet
-
-
-
-
-
-
-
-
-
-
-
-
-
-
[3]
[3]
[3]
[3]
I; PU I/O
P3[10] — General purpose digital input/output pin.
EMC_D[10] — External memory data line 10.
P3[11] — General purpose digital input/output pin.
EMC_D[11] — External memory data line 11.
P3[12] — General purpose digital input/output pin.
EMC_D[12] — External memory data line 12.
P3[13] — General purpose digital input/output pin.
EMC_D[13] — External memory data line 13.
P3[14] — General purpose digital input/output pin.
EMC_D[14] — External memory data line 14.
P3[15] — General purpose digital input/output pin.
EMC_D[15] — External memory data line 15.
P3[16] — General purpose digital input/output pin.
I/O
EMC_D[16] — External memory data line 16.
O
PWM0[1] — Pulse Width Modulator 0, output 1.
O
U1_TXD — Transmitter output for UART1.
I; PU I/O
P3[17] — General purpose digital input/output pin.
I/O
EMC_D[17] — External memory data line 17.
O
PWM0[2] — Pulse Width Modulator 0, output 2.
I
U1_RXD — Receiver input for UART1.
I; PU I/O
P3[18] — General purpose digital input/output pin.
I/O
EMC_D[18] — External memory data line 18.
O
PWM0[3] — Pulse Width Modulator 0, output 3.
I
U1_CTS — Clear to Send input for UART1.
I; PU I/O
P3[19] — General purpose digital input/output pin.
I/O
EMC_D[19] — External memory data line 19.
O
PWM0[4] — Pulse Width Modulator 0, output 4.
I
U1_DCD — Data Carrier Detect input for UART1.
I; PU I/O
P3[20] — General purpose digital input/output pin.
I/O
EMC_D[20] — External memory data line 20.
O
PWM0[5] — Pulse Width Modulator 0, output 5.
I
U1_DSR — Data Set Ready input for UART1.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
31 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
P3[22]
P3[23]
P3[24]
P3[25]
P3[26]
P3[27]
P3[28]
195 C6
65
58
56
55
T6
R5
U2
T3
203 A1
5
LPC408X_7X
Objective data sheet
D2
-
-
-
M4
N3
M3
K7
-
-
-
45
40
39
38
-
-
--
-
-
-
-
-
-
[3]
[3]
[3]
[3]
[3]
[3]
[3]
[3]
Type[2]
-
Reset state[1]
Pin LQFP80
175 C10
Pin LQFP144
P3[21]
Description
Ball TFBGA180
Pin LQFP208
Symbol
Ball TFBGA208
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
I; PU I/O
P3[21] — General purpose digital input/output pin.
I/O
EMC_D[21] — External memory data line 21.
O
PWM0[6] — Pulse Width Modulator 0, output 6.
O
U1_DTR — Data Terminal Ready output for UART1. Can
also be configured to be an RS-485/EIA-485 output
enable signal for UART1.
I; PU I/O
P3[22] — General purpose digital input/output pin.
I/O
EMC_D[22] — External memory data line 22.
I
PWM0_CAP0 — Capture input for PWM0, channel 0.
I
U1_RI — Ring Indicator input for UART1.
I; PU I/O
P3[23] — General purpose digital input/output pin.
I/O
EMC_D[23] — External memory data line 23.
I
PWM1_CAP0 — Capture input for PWM1, channel 0.
I
T0_CAP0 — Capture input for Timer 0, channel 0.
I; PU I/O
P3[24] — General purpose digital input/output pin.
I/O
EMC_D[24] — External memory data line 24.
O
PWM1[1] — Pulse Width Modulator 1, output 1.
I
T0_CAP1 — Capture input for Timer 0, channel 1.
I; PU I/O
P3[25] — General purpose digital input/output pin.
I/O
EMC_D[25] — External memory data line 25.
O
PWM1[2] — Pulse Width Modulator 1, output 2.
O
T0_MAT0 — Match output for Timer 0, channel 0.
I; PU I/O
P3[26] — General purpose digital input/output pin.
I/O
EMC_D[26] — External memory data line 26.
O
PWM1[3] — Pulse Width Modulator 1, output 3.
O
T0_MAT1 — Match output for Timer 0, channel 1.
I
STCLK — System tick timer clock input.
I; PU I/O
P3[27] — General purpose digital input/output pin.
I/O
EMC_D[27] — External memory data line 27.
O
PWM1[4] — Pulse Width Modulator 1, output 4.
I
T1_CAP0 — Capture input for Timer 1, channel 0.
I; PU I/O
P3[28] — General purpose digital input/output pin.
I/O
EMC_D[28] — External memory data line 28.
O
PWM1[5] — Pulse Width Modulator 1, output 5.
I
T1_CAP1 — Capture input for Timer 1, channel 1.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
32 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
P3[30]
P3[31]
Pin LQFP144
Pin LQFP80
F3
-
-
-
19
25
H3
J3
-
-
-
-
-
-
[3]
[3]
[3]
P4[0] to
P4[31]
P4[0]
75
U9
L6
52
Type[2]
Ball TFBGA180
11
Reset state[1]
Ball TFBGA208
P3[29]
Description
Pin LQFP208
Symbol
I; PU I/O
I/O
EMC_D[29] — External memory data line 29.
O
PWM1[6] — Pulse Width Modulator 1, output 6.
O
T1_MAT0 — Match output for Timer 1, channel 0.
I; PU I/O
EMC_D[30] — External memory data line 30.
O
U1_RTS — Request to Send output for UART1. Can also
be configured to be an RS-485/EIA-485 output enable
signal for UART1.
O
T1_MAT1 — Match output for Timer 1, channel 1.
I; PU I/O
EMC_D[31] — External memory data line 31.
-
R — Function reserved.
O
T1_MAT2 — Match output for Timer 1, channel 2.
I/O
Port 4: Port 4 is a 32-bit I/O port with individual direction
controls for each bit. The operation of port 4 pins
depends upon the pin function selected via the pin
connect block.
-
[3]
I; PU I/O
I; PU I/O
I; PU I/O
P4[1]
79
U10
M7
55
-
P4[2]
83
T11
M8
58
-
[3]
I; PU I/O
I; PU I/O
I/O
I/O
U16
P4[4]
103 R15
K9
68
-
[3]
P13
72
-
[3]
I; PU I/O
I; PU I/O
I/O
I/O
H10
74
-
[3]
M14 K10
78
-
[3]
I; PU I/O
I; PU I/O
P4[5]
107 R16
P4[6]
113
I/O
I/O
P4[7]
121 L16
K12
84
-
[3]
P4[8]
127 J17
J11
88
-
[3]
I/O
I/O
LPC408X_7X
Objective data sheet
P3[31] — General purpose digital input/output pin.
I/O
I/O
97
P3[30] — General purpose digital input/output pin.
I/O
[3]
P4[3]
P3[29] — General purpose digital input/output pin.
P4[0] — General purpose digital input/output pin.
EMC_A[0] — External memory address line 0.
P4[1] — General purpose digital input/output pin.
EMC_A[1] — External memory address line 1.
P4[2] — General purpose digital input/output pin.
EMC_A[2] — External memory address line 2.
P4[3] — General purpose digital input/output pin.
EMC_A[3] — External memory address line 3.
P4[4] — General purpose digital input/output pin.
EMC_A[4] — External memory address line 4.
P4[5] — General purpose digital input/output pin.
EMC_A[5] — External memory address line 5.
P4[6] — General purpose digital input/output pin.
EMC_A[6] — External memory address line 6.
P4[7] — General purpose digital input/output pin.
EMC_A[7] — External memory address line 7.
P4[8] — General purpose digital input/output pin.
EMC_A[8] — External memory address line 8.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
33 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
H12
91
-
[3]
I; PU I/O
P4[10]
135 G17
G12 94
-
[3]
I; PU I/O
I; PU I/O
I; PU I/O
Type[2]
131 H17
Reset state[1]
Pin LQFP80
P4[9]
Pin LQFP208
Pin LQFP144
Description
Ball TFBGA180
Symbol
Ball TFBGA208
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
I/O
I/O
P4[11]
145 F14
F11
101 -
[3]
P4[12]
149 C16
F10
104 -
[3]
I; PU I/O
I; PU I/O
I/O
I/O
P4[13]
155 B16
B14
108 -
[3]
P4[14]
159 B15
E8
110
-
[3]
I; PU I/O
I; PU I/O
I/O
I/O
P4[15]
173 A11
C10
120 -
[3]
P4[16]
101 U17
N12
-
-
[3]
I; PU I/O
I; PU I/O
I/O
I/O
P4[17]
104 P14
N13
-
-
[3]
P4[18]
105 P15
P14
-
-
[3]
M14 -
-
[3]
I; PU I/O
-
-
[3]
I; PU I/O
I/O
I/O
P4[19]
111
P16
P4[20]
109 R17
I/O
P4[21]
P4[22]
115
M15 -
123 K14
LPC408X_7X
Objective data sheet
-
-
-
-
-
-
[3]
[3]
P4[9] — General purpose digital input/output pin.
EMC_A[9] — External memory address line 9.
P4[10] — General purpose digital input/output pin.
EMC_A[10] — External memory address line 10.
P4[11] — General purpose digital input/output pin.
EMC_A[11] — External memory address line 11.
P4[12] — General purpose digital input/output pin.
EMC_A[12] — External memory address line 12.
P4[13] — General purpose digital input/output pin.
EMC_A[13] — External memory address line 13.
P4[14] — General purpose digital input/output pin.
EMC_A[14] — External memory address line 14.
P4[15] — General purpose digital input/output pin.
EMC_A[15] — External memory address line 15.
P4[16] — General purpose digital input/output pin.
EMC_A[16] — External memory address line 16.
P4[17] — General purpose digital input/output pin.
EMC_A[17] — External memory address line 17.
P4[18] — General purpose digital input/output pin.
EMC_A[18] — External memory address line 18.
P4[19] — General purpose digital input/output pin.
EMC_A[19] — External memory address line 19.
P4[20] — General purpose digital input/output pin.
I/O
EMC_A[20] — External memory address line 20.
I/O
I2C2_SDA — I2C2 data input/output (this pin does not
use a specialized I2C pad).
I/O
SSP1_SCK — Serial Clock for SSP1.
I; PU I/O
P4[21] — General purpose digital input/output pin.
I/O
EMC_A[21] — External memory address line 21.
I/O
I2C2_SCL — I2C2 clock input/output (this pin does not
use a specialized I2C pad).
I/O
SSP1_SSEL — Slave Select for SSP1.
I; PU I/O
P4[22] — General purpose digital input/output pin.
I/O
EMC_A[22] — External memory address line 22.
O
U2_TXD — Transmitter output for UART2.
I/O
SSP1_MISO — Master In Slave Out for SSP1.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
34 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
-
-
[3]
Type[2]
-
Reset state[1]
Pin LQFP80
129 J15
Pin LQFP144
P4[23]
Description
Ball TFBGA180
Pin LQFP208
Symbol
Ball TFBGA208
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
I; PU I/O
I/O
EMC_A[23] — External memory address line 23.
I
U2_RXD — Receiver input for UART2.
I/O
SSP1_MOSI — Master Out Slave In for SSP1.
P4[24]
183 B8
C8
127 --
[3]
P4[25]
179 B9
D9
124 -
[3]
I; PU I/O
I; PU I/O
I; PU I/O
I; PU I/O
O
O
P4[26]
119
L15
K13
-
-
[3]
P4[27]
139 G15
F14
-
-
[3]
65
[3]
O
O
P4[28]
P4[29]
P4[30]
170 C11
176 B10
187 B7
LPC408X_7X
Objective data sheet
D10
B9
C7
118
122 68
130 -
[3]
[3]
P4[23] — General purpose digital input/output pin.
I; PU I/O
P4[24] — General purpose digital input/output pin.
EMC_OE — LOW active Output Enable signal.
P4[25] — General purpose digital input/output pin.
EMC_WE — LOW active Write Enable signal.
P4[26] — General purpose digital input/output pin.
EMC_BLS0 — LOW active Byte Lane select signal 0.
P4[27] — General purpose digital input/output pin.
EMC_BLS1 — LOW active Byte Lane select signal 1.
P4 [28] — General purpose digital input/output pin.
O
EMC_BLS2 — LOW active Byte Lane select signal 2.
O
U3_TXD — Transmitter output for UART3.
O
T2_MAT0 — Match output for Timer 2, channel 0.
-
R — Function reserved.
O
LCD_VD[6] — LCD data.
O
LCD_VD[10] — LCD data.
O
LCD_VD[2] — LCD data.
I; PU I/O
P4[29] — General purpose digital input/output pin.
O
EMC_BLS3 — LOW active Byte Lane select signal 3.
I
U3_RXD — Receiver input for UART3.
O
T2_MAT1 — Match output for Timer 2, channel 1.
I/O
I2C2_SCL — I2C2 clock input/output (this pin does not
use a specialized I2C pad).
O
LCD_VD[7] — LCD data.
O
LCD_VD[11] — LCD data.
O
LCD_VD[3] — LCD data.
I; PU I/O
P4[30] — General purpose digital input/output pin.
O
EMC_CS0 — LOW active Chip Select 0 signal.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
O
CMP0_OUT — Comparator 0, output.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
35 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
[3]
I; PU I/O
P5[0] to P5[4]
P5[0]
P5[1]
P5[2]
P5[3]
P5[4]
9
30
117
F4
J4
L14
141 G14
206 C3
E5
H1
L12
6
21
81
G10 98
C4
-
-
-
-
143 -
[3]
[3]
[11]
[11]
[3]
Type[2]
134 -
Reset state[1]
Pin LQFP144
E7
Pin LQFP80
Ball TFBGA180
193 A4
Pin LQFP208
P4[31]
Description
Ball TFBGA208
Symbol
P4[31] — General purpose digital input/output pin.
O
EMC_CS1 — LOW active Chip Select 1 signal.
I/O
Port 5: Port 5 is a 5-bit I/O port with individual direction
controls for each bit. The operation of port 5 pins
depends upon the pin function selected via the pin
connect block.
I; PU I/O
P5[0] — General purpose digital input/output pin.
I/O
EMC_A[24] — External memory address line 24.
I/O
SSP2_MOSI — Master Out Slave In for SSP2.
O
T2_MAT2 — Match output for Timer 2, channel 2.
I; PU I/O
P5[1] — General purpose digital input/output pin.
I/O
EMC_A[25] — External memory address line 25.
I/O
SSP2_MISO — Master In Slave Out for SSP2.
O
T2_MAT3 — Match output for Timer 2, channel 3.
I/O
P5[2] — General purpose digital input/output pin.
-
R — Function reserved.
-
R — Function reserved.
I
I
O
T3_MAT2 — Match output for Timer 3, channel 2.
-
R — Function reserved.
I/O
I2C0_SDA — I2C0 data input/output (this pin uses a
specialized I2C pad that supports I2C Fast Mode Plus).
I/O
P5[3] — General purpose digital input/output pin.
-
R — Function reserved.
-
R — Function reserved.
-
R — Function reserved.
I
U4_RXD — Receiver input for USART4.
I/O
I2C0_SCL — I2C0 clock input/output (this pin uses a
specialized I2C pad that supports I2C Fast Mode Plus.
I; PU I/O
P5[4] — General purpose digital input/output pin.
O
U0_OE — RS-485/EIA-485 output enable signal for
UART0.
-
R — Function reserved.
O
T3_MAT3 — Match output for Timer 3, channel 3.
O
U4_TXD — Transmitter output for USART4 (input/output
in smart card mode).
JTAG_TDO
(SWO)
2
D3
B1
1
1
[3]
O
Test Data Out for JTAG interface. Also used as Serial
wire trace output.
JTAG_TDI
4
C2
C3
3
2
[3]
I
Test Data In for JTAG interface.
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LPC408x/7x
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32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
Pin LQFP144
Pin LQFP80
6
E3
C2
4
3
[3]
I
Test Mode Select for JTAG interface. Also used as Serial
wire debug data input/output.
JTAG_TRST
8
D1
D4
5
4
[3]
I
Test Reset for JTAG interface.
I
Test Clock for JTAG interface. This clock must be slower
than 1 /6 of the CPU clock (CCLK) for the JTAG interface
to operate. Also used as serial wire clock.
Type[2]
Ball TFBGA180
JTAG_TMS
(SWDIO)
Reset state[1]
Ball TFBGA208
Description
Pin LQFP208
Symbol
JTAG_TCK
(SWDCLK)
10
E2
D2
7
5
[3]
RESET
35
M2
J1
24
14
[12]
I
External reset input. A LOW on this pin resets the device,
causing I/O ports and peripherals to take on their default
states, and processor execution to begin at address 0.
This pin includes a 20 ns input glitch filter.
RSTOUT
29
K3
H2
20
11
[3]
O
Reset status output. A LOW output on this pin indicates
that the device is in the reset state for any reason. This
reflects the RESET input pin and all internal reset
sources.
RTC_ALARM
37
N1
H5
26
-
[13]
O
RTC controlled output. This is a 1.8 V pin. It goes HIGH
when a RTC alarm is generated.
RTCX1
34
K2
J2
23
13
[14]
I
Input to the RTC 32 kHz ultra-low power oscillator circuit.
O
Output from the RTC 32 kHz ultra-low power oscillator
circuit.
I/O
USB port 2 bidirectional D line.
I
RTC power supply: 3.3 V on this pin supplies power to
the RTC.
[15]
RTCX2
36
L2
J3
25
15
[14]
[15]
[9]
USB_D2
52
U1
N2
37
-
VBAT
38
M3
K1
27
16
VDD(REG)(3V3)
26, H4, G1,
86, P11, N9,
174 D11 E9
18, 34,
60, 67
121
S
3.3 V regulator supply voltage: This is the power supply
for the on-chip voltage regulator that supplies internal
logic.
VDDA
20
G4
F2
14
8
S
Analog 3.3 V pad supply voltage: This can be connected
to the same supply as VDD(3V3) but should be isolated to
minimize noise and error. This voltage is used to power
the ADC and DAC. Tie this pin to 3.3 V if the ADC and
DAC are not used.
VDD(3V3)
15,
60,
71,
89,
112,
125,
146,
165,
181,
198
G3,
P6,
P8,
U13,
P17,
K16,
C17,
B13,
C9,
D7
E2,
L4,
K8,
L11,
J14,
E12,
E10,
C5
41,
62,
77,
102,
114,
138
21,
42,
56,
77
S
3.3 V supply voltage: This is the power supply voltage for
I/O other than pins in the VBAT domain.
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32-bit ARM Cortex-M4 microcontroller
Table 3.
Pin description …continued
Not all functions are available on all parts. See Table 2 (Ethernet, USB, LCD, QEI, SD/MMC, comparator pins) and Table 5
(EMC pins).
Pin LQFP144
Pin LQFP80
24
K1
G2
17
10
S
ADC positive reference voltage: This should be the same
voltage as VDDA, but should be isolated to minimize noise
and error. The voltage level on this pin is used as a
reference for ADC and DAC. Tie this pin to 3.3 V if the
ADC and DAC are not used.
VSS
33,
63,
77,
93,
114,
133,
148,
169,
189,
200
L3,
T5,
R9,
P12,
N16,
H14,
E15,
A12,
B6,
A2
H4,
P4,
L9,
L13,
G13,
D13,
C11,
B4
44,
65,
79,
103,
117,
139
24,
43,
57,
78
G
Ground: 0 V reference for digital IO pins.
VSSREG
32, D12, H3,
84, K4, L8,
172 P10 A10
22,
59,
119
33,
66
G
Ground: 0 V reference for internal logic.
VSSA
22
J2
F3
15
9
G
Analog ground: 0 V power supply and reference for the
ADC and DAC. This should be the same voltage as VSS,
but should be isolated to minimize noise and error.
XTAL1
44
M4
L2
31
19
I
Input to the oscillator circuit and internal clock generator
circuits.
O
Output from the oscillator amplifier.
[14]
Type[2]
Ball TFBGA180
VREFP
Reset state[1]
Ball TFBGA208
Description
Pin LQFP208
Symbol
[16]
XTAL2
46
N4
K4
33
20
[14]
[16]
[1]
PU = internal pull-up enabled (for VDD(REG)(3V3) = 3.3 V, pulled up to 3.3 V); IA = inactive, no pull-up/down enabled; F = floating; floating
pins, if not used, should be tied to ground or power to minimize power consumption.
[2]
I = Input; O = Output; G = Ground; S = Supply.
[3]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
[4]
5 V tolerant standard pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present, do not exceed 3.6 V) providing digital I/O functions with
TTL levels and hysteresis. This pad can be powered by VBAT.
[5]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and analog input. When configured as a ADC input, digital
section of the pad is disabled.
[6]
5 V tolerant fast pad (5 V tolerant if VDD(3V3) present; if VDD(3V3) not present, do not exceed 3.6 V) providing digital I/O functions with TTL
levels and hysteresis.
[7]
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
[8]
Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 400 kHz specification. It requires an external pull-up to provide output
functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain
configuration applies to all functions on this pin.
[9]
Not 5 V tolerant. Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0
(Full-speed and Low-speed mode only).
[10] 5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
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32-bit ARM Cortex-M4 microcontroller
[11] Open-drain 5 V tolerant digital I/O pad, compatible with I2C-bus 1 MHz specification. It requires an external pull-up to provide output
functionality. When power is switched off, this pin connected to the I2C-bus is floating and does not disturb the I2C lines. Open-drain
configuration applies to all functions on this pin.
[12] 5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
[13] This pad can be powered from VBAT.
[14] Pad provides special analog functionality.
[15] If the RTC is not used, these pins can be left floating.
[16] When the main oscillator is not used, connect XTAL1 and XTAL2 as follows: XTAL1 can be left floating or can be grounded (grounding
is preferred to reduce susceptibility to noise). XTAL2 should be left floating.
7. Functional description
7.1 Architectural overview
The ARM Cortex-M4 includes three AHB-Lite buses: the system bus, the I-code bus, and
the D-code bus. The I-code and D-code core buses are faster than the system bus and
are used similarly to Tightly Coupled Memory (TCM) interfaces: one bus dedicated for
instruction fetch (I-code) and one bus for data access (D-code). The use of two core
buses allows for simultaneous operations if concurrent operations target different devices.
The LPC408x/7x use a multi-layer AHB matrix to connect the ARM Cortex-M4 buses and
other bus masters to peripherals in a flexible manner that optimizes performance by
allowing peripherals that are on different slaves ports of the matrix to be accessed
simultaneously by different bus masters.
7.2 ARM Cortex-M4 processor
The ARM Cortex-M4 processor is running at frequencies of up to 120 MHz. The processor
executes the Thumb-2 instruction set for optimal performance and code size, including
hardware division, single-cycle multiply, and bit-field manipulation. A Memory Protection
Unit (MPU) supporting eight regions is included.
7.3 ARM Cortex-M4 Floating Point Unit (FPU)
Remark: The FPU is available on parts LP4088/78/76.
The FPU supports single-precision floating-point computation functionality in compliance
with the ANSI/IEEE Standard 754-2008. The FPU provides add, subtract, multiply, divide,
multiply and accumulate, and square root operations. It also performs a variety of
conversions between fixed-point, floating-point, and integer data formats.
7.4 On-chip flash program memory
The LPC408x/7x contain up to 512 kB of on-chip flash program memory. A new two-port
flash accelerator maximizes performance for use with the two fast AHB-Lite buses.
7.5 EEPROM
The LPC408x/7x contains up to 4032 byte of on-chip byte-erasable and
byte-programmable EEPROM data memory.
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32-bit ARM Cortex-M4 microcontroller
7.6 On-chip SRAM
The LPC408x/7x contain a total of up to 96 kB on-chip SRAM data memory. This includes
64 kB main SRAM, accessible by the CPU and DMA controller on a higher-speed bus,
and up to two additional 16 kB peripheral SRAM blocks situated on a separate slave port
on the AHB multilayer matrix.
This architecture allows CPU and DMA accesses to be spread over three separate RAMs
that can be accessed simultaneously.
7.7 Memory Protection Unit (MPU)
The LPC408x/7x have a Memory Protection Unit (MPU) which can be used to improve the
reliability of an embedded system by protecting critical data within the user application.
The MPU allows separating processing tasks by disallowing access to each other's data,
disabling access to memory regions, allowing memory regions to be defined as read-only
and detecting unexpected memory accesses that could potentially break the system.
The MPU separates the memory into distinct regions and implements protection by
preventing disallowed accesses. The MPU supports up to eight regions each of which can
be divided into eight subregions. Accesses to memory locations that are not defined in the
MPU regions, or not permitted by the region setting, will cause the Memory Management
Fault exception to take place.
7.8 Memory map
Table 4.
LPC408x/7x memory usage and details
Address range
General Use
Address range details and description
0x0000 0000 to
0x1FFF FFFF
On-chip non-volatile
memory
0x0000 0000 - 0x0007 FFFF
For devices with 512 kB of flash memory.
0x0000 0000 - 0x0003 FFFF
For devices with 256 kB of flash memory.
0x0000 0000 - 0x0001 FFFF
For devices with 128 kB of flash memory.
0x0000 0000 - 0x0000 FFFF
For devices with 64 kB of flash memory.
0x1000 0000 - 0x1000 FFFF
For devices with 64 kB of main SRAM.
0x1000 0000 - 0x1000 7FFF
For devices with 32 kB of main SRAM.
0x1000 0000 - 0x1000 3FFF
For devices with 16 kB of main SRAM.
Boot ROM
0x1FFF 0000 - 0x1FFF 1FFF
8 kB Boot ROM with flash services.
On-chip SRAM
(typically used for
peripheral data)
0x2000 0000 - 0x2000 1FFF
Peripheral SRAM - bank 0 (first 8 kB)
On-chip SRAM
0x2000 0000 to
0x3FFF FFFF
0x4000 0000 to
0x7FFF FFFF
0x2000 2000 - 0x2000 3FFF
Peripheral SRAM - bank 0 (second 8 kB)
0x2000 4000 - 0x2000 7FFF
Peripheral SRAM - bank 1 (16 kB)
AHB peripherals
0x2008 0000 - 0x200B FFFF
See Figure 7 for details
APB Peripherals
0x4000 0000 - 0x4007 FFFF
APB0 Peripherals, up to 32 peripheral blocks of
16 kB each.
0x4008 0000 - 0x400F FFFF
APB1 Peripherals, up to 32 peripheral blocks of
16 kB each.
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LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 4.
LPC408x/7x memory usage and details
Address range
General Use
Address range details and description
0x8000 0000 to
0xDFFF FFFF
Off-chip Memory via
the External Memory
Controller
Four static memory chip selects:
0x8000 0000 - 0x83FF FFFF
Static memory chip select 0 (up to 64 MB)
0x9000 0000 - 0x93FF FFFF
Static memory chip select 1 (up to 64 MB)
0x9800 0000 - 0x9BFF FFFF
Static memory chip select 2 (up to 64 MB)
0x9C00 0000 - 0x9FFF FFFF
Static memory chip select 3 (up to 64 MB)
Four dynamic memory chip selects:
0xE000 0000 to
0xE00F FFFF
Cortex-M4 Private
Peripheral Bus
0xA000 0000 - 0xAFFF FFFF
Dynamic memory chip select 0 (up to 256MB)
0xB000 0000 - 0xBFFF FFFF
Dynamic memory chip select 1 (up to 256MB)
0xC000 0000 - 0xCFFF FFFF
Dynamic memory chip select 2 (up to 256MB)
0xD000 0000 - 0xDFFF FFFF
Dynamic memory chip select 3 (up to 256MB)
0xE000 0000 - 0xE00F FFFF
Cortex-M4 related functions, includes the NVIC
and System Tick Timer.
The LPC408x/7x incorporate several distinct memory regions, shown in the following
figures. Figure 7 shows the overall map of the entire address space from the user
program viewpoint following reset. The interrupt vector area supports address remapping.
The AHB peripheral area is 2 MB in size, and is divided to allow for up to 128 peripherals.
The APB peripheral area is 1 MB in size and is divided to allow for up to 64 peripherals.
Each peripheral of either type is allocated 16 kB of space. This allows simplifying the
address decoding for each peripheral.
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xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx
xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx
xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
4 GB
LPC408x/7x
reserved
30 - 17 reserved
private peripheral bus
16
SD/MMC(1)
reserved
15
QEI(1)
0x400B 8000
14
0x400B 4000
13
motor control PWM
reserved
0x400B 0000
12
reserved
0x400A C000
11
SSP2
0x400A 8000
10
I2S
0x400A 4000
9
USART4(1)
0x400A 0000
8
I2C2
reserved
0x4009 C000
7
UART3
APB1 peripherals
0x4009 8000
6
UART2
0x4009 4000
5
timer 3
0x4009 0000
4
timer 2
0x4008 C000
3
DAC
0x4008 8000
2
SSP0
0x400C 0000
0x400B C000
0x4008 0000
31
0x4004 4000
16
CAN common
0x4004 0000
15
CAN AF registers
14
CAN AF RAM
13
ADC
0x4003 4000
12
SSP1
0x4003 0000
11
pin connect
0x4002 C000
10
GPIO interrupts
0x4002 8000
9
RTC/event recorder
+ backup registers
0x4002 4000
8
reserved
7
I2C0
0x4001 C000
6
PWM1
0x4001 8000
5
PWM0
0x4001 4000
0x200A 0000
4
UART1
0x4001 0000
0x2008 0000
3
UART0
0x4000 C000
2
timer 1
0x4000 8000
0x4000 4000
8 kB peripheral SRAM0 (LPC4074/72)
1
0
timer 0
16 kB peripheral SRAM0 (LPC4088/78/76)
0x2000 8000
0x2000 4000
0x2000 2000
WWDT
0x4000 0000
0x2000 0000
APB0 peripherals
reserved
SPIFI data
reserved
peripheral SRAM bit-band
alias addressing
reserved
reserved
16 kB peripheral SRAM1 (LPC4088/78)
reserved
8 kB boot ROM
reserved
64 kB main SRAM (LPC4088/78/76)
(1) Not available on all parts. See Table 2 and Table 4.
Fig 7.
0x8000 0000
LPC408x/7x memory map
32 kB main SRAM (LPC4074)
16 kB main SRAM (LPC4072)
reserved
512 kB on-chip flash (LPC4078)
256 kB on-chip flash (LPC4076)
128 kB on- chip flash (LPC4074)
64 kB on- chip flash (LPC4072)
0x4200 0000
0x4010 0000
0x4008 0000
0x4000 0000
0x2900 0000
0x2800 0000
0x2400 0000
0x2200 0000
AHB peripherals
0x1FFF 2000
7
EMC registers
0x1FFF 0000
6
GPIO
0x1001 0000
0x1000 8000
0x1000 4000
0x1000 0000
0x0008 0000
0x0004 0000
0x0002 0000
0x0001 0000
0x0000 0000
5
reserved
4
CRC engine
3
USB(1)
2
LCD(1)
1
Ethernet(1)
0
GPDMA controller
0x4004 8000
0x4003 C000
0x4003 8000
0x4002 0000
0x200A 0000
0x2009 C000
0x2009 8000
0x2009 4000
0x2009 0000
0x2008 C000
0x2008 8000
0x2008 4000
0x2008 0000
002aag736
LPC408x/7x
42 of 123
© NXP B.V. 2012. All rights reserved.
0 GB
0x4004 C000
CAN1
peripheral bit-band alias addressing
active interrupt vectors
0x4005 C000
17
0x4400 0000
+ 256 words
0x4006 0000
CAN2
AHB peripherals
0x0000 0000
0xE000 0000
reserved
I-code/D-code
memory space
I2C1
22 - 19 reserved
0xA000 0000
0.5 GB
23
0x4008 0000
18
EMC 4 x static chip select(1)
1 - 0 reserved
0x0000 0400
0xE004 0000
EMC 4 x dynamic chip select(1)
1 GB
31 - 24 reserved
0xE010 0000
32-bit ARM Cortex-M4 microcontroller
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Rev. 1 — 17 September 2012
system control
0x400F C000
APB0 peripherals
0xFFFF FFFF
NXP Semiconductors
LPC408X_7X
Objective data sheet
APB1 peripherals
0x4010 0000
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
7.9 Nested Vectored Interrupt Controller (NVIC)
The NVIC is an integral part of the Cortex-M4. The tight coupling to the CPU allows for low
interrupt latency and efficient processing of late arriving interrupts.
7.9.1 Features
•
•
•
•
•
•
Controls system exceptions and peripheral interrupts.
On the LPC408x/7x, the NVIC supports 40 vectored interrupts.
32 programmable interrupt priority levels, with hardware priority level masking.
Relocatable vector table.
Non-Maskable Interrupt (NMI).
Software interrupt generation.
7.9.2 Interrupt sources
Each peripheral device has one interrupt line connected to the NVIC but may have several
interrupt flags. Individual interrupt flags may also represent more than one interrupt
source.
Any pin on port 0 and port 2 regardless of the selected function can be programmed to
generate an interrupt on a rising edge, a falling edge, or both.
7.10 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one
function. Configuration registers control the multiplexers to allow connection between the
pin and the on-chip peripherals.
Peripherals should be connected to the appropriate pins prior to being activated and prior
to any related interrupts being enabled. Activity of any enabled peripheral function that is
not mapped to a related pin should be considered undefined.
Most pins can also be configured as open-drain outputs or to have a pull-up, pull-down, or
no resistor enabled.
7.11 External Memory Controller (EMC)
Remark: The EMC is available for parts LPC4088/78/76. Supported memory size and
type and EMC bus width vary for different packages (see Table 2). The EMC pin
configuration for each part is shown in Table 5.
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Table 5.
External memory controller pin configuration
Parts
Data bus pins Address bus
pins
Control pins
SRAM
SDRAM
LPC4088FBD208 EMC_D[31:0]
LPC4088FET208
LPC4078FBD208
LPC4078FET208
EMC_A[25:0]
EMC_BLS[3:0],
EMC_CS[3:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[3:0],
EMC_CLK[1:0], EMC_CKE[3:0],
EMC_DQM[3:0]
LPC4088FET180
LPC4078FET180
LPC4076FET180
EMC_A[19:0]
EMC_BLS[1:0],
EMC_CS[1:0],
EMC_OE, EMC_WE
EMC_RAS, EMC_CAS, EMC_DYCS[1:0],
EMC_CLK[1:0], EMC_CKE[1:0],
EMC_DQM[1:0]
EMC_A[15:0]
EMC_BLS[3:2],
EMC_CS[1:0],
EMC_OE, EMC_WE
not available
EMC_D[15:0]
LPC4088FBD144 EMC_D[7:0]
LPC4078FBD144
LPC4076FBD144
The LPC408x/7x EMC is an ARM PrimeCell MultiPort Memory Controller peripheral
offering support for asynchronous static memory devices such as RAM, ROM, and flash.
In addition, it can be used as an interface with off-chip memory-mapped devices and
peripherals. The EMC is an Advanced Microcontroller Bus Architecture (AMBA) compliant
peripheral.
7.11.1 Features
• Dynamic memory interface support including single data rate SDRAM.
• Asynchronous static memory device support including RAM, ROM, and flash, with or
without asynchronous page mode.
•
•
•
•
•
Low transaction latency.
Read and write buffers to reduce latency and to improve performance.
8/16/32 data and 16/20/26 address lines wide static memory support.
16 bit and 32 bit wide chip select SDRAM memory support.
Static memory features include:
– Asynchronous page mode read
– Programmable Wait States
– Bus turnaround delay
– Output enable and write enable delays
– Extended wait
• Four chip selects for synchronous memory and four chip selects for static memory
devices.
• Power-saving modes dynamically control EMC_CKE and EMC_CLK outputs to
SDRAMs.
• Dynamic memory self-refresh mode controlled by software.
• Controller supports 2048 (A0 to A10), 4096 (A0 to A11), and 8192 (A0 to A12) row
address synchronous memory parts. That is typical 512 MB, 256 MB, and 128 MB
parts, with 4, 8, 16, or 32 data bits per device.
• Separate reset domains allow the for auto-refresh through a chip reset if desired.
Note: Synchronous static memory devices (synchronous burst mode) are not supported.
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7.12 General purpose DMA controller
The GPDMA is an AMBA AHB compliant peripheral allowing selected peripherals to have
DMA support.
The GPDMA enables peripheral-to-memory, memory-to-peripheral,
peripheral-to-peripheral, and memory-to-memory transactions. The source and
destination areas can each be either a memory region or a peripheral and can be
accessed through the AHB master. The GPDMA controller allows data transfers between
the various on-chip SRAM areas and supports the SD/MMC card interface, all SSPs, the
I2S, all UARTs, the A/D Converter, and the D/A Converter peripherals. DMA can also be
triggered by selected timer match conditions. Memory-to-memory transfers and transfers
to or from GPIO are supported.
7.12.1 Features
• Eight DMA channels. Each channel can support an unidirectional transfer.
• 16 DMA request lines.
• Single DMA and burst DMA request signals. Each peripheral connected to the DMA
Controller can assert either a burst DMA request or a single DMA request. The DMA
burst size is set by programming the DMA Controller.
• Memory-to-memory, memory-to-peripheral, peripheral-to-memory, and
peripheral-to-peripheral transfers are supported.
• Scatter or gather DMA is supported through the use of linked lists. This means that
the source and destination areas do not have to occupy contiguous areas of memory.
• Hardware DMA channel priority.
• AHB slave DMA programming interface. The DMA Controller is programmed by
writing to the DMA control registers over the AHB slave interface.
• One AHB bus master for transferring data. The interface transfers data when a DMA
request goes active.
• 32-bit AHB master bus width.
• Incrementing or non-incrementing addressing for source and destination.
• Programmable DMA burst size. The DMA burst size can be programmed to more
efficiently transfer data.
• Internal four-word FIFO per channel.
• Supports 8, 16, and 32-bit wide transactions.
• Big-endian and little-endian support. The DMA Controller defaults to little-endian
mode on reset.
• An interrupt to the processor can be generated on a DMA completion or when a DMA
error has occurred.
• Raw interrupt status. The DMA error and DMA count raw interrupt status can be read
prior to masking.
7.13 CRC engine
The Cyclic Redundancy Check (CRC) generator with programmable polynomial settings
supports several CRC standards commonly used. To save system power and bus
bandwidth, the CRC engine supports DMA transfers.
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7.13.1 Features
• Supports three common polynomials CRC-CCITT, CRC-16, and CRC-32.
– CRC-CCITT: x16 + x12 + x5 + 1
– CRC-16: x16 + x15 + x2 + 1
– CRC-32: x32 + x26 + x23 + x22 + x16 + x12 + x11 + x10 + x8 + x7 + x5 + x4 + x2 + x + 1
• Bit order reverse and 1’s complement programmable setting for input data and CRC
sum.
• Programmable seed number setting.
• Supports CPU PIO or DMA back-to-back transfer.
• Accept any size of data width per write: 8, 16 or 32-bit.
– 8-bit write: 1-cycle operation
– 16-bit write: 2-cycle operation (8-bit x 2-cycle)
– 32-bit write: 4-cycle operation (8-bit x 4-cycle)
7.14 LCD controller
Remark: The LCD controller is available on parts LPC4088.
The LCD controller provides all of the necessary control signals to interface directly to a
variety of color and monochrome LCD panels. Both STN (single and dual panel) and TFT
panels can be operated. The display resolution is selectable and can be up to 1024  768
pixels. Several color modes are provided, up to a 24-bit true-color non-palettized mode.
An on-chip 512-byte color palette allows reducing bus utilization (i.e. memory size of the
displayed data) while still supporting a large number of colors.
The LCD interface includes its own DMA controller to allow it to operate independently of
the CPU and other system functions. A built-in FIFO acts as a buffer for display data,
providing flexibility for system timing. Hardware cursor support can further reduce the
amount of CPU time needed to operate the display.
7.14.1 Features
•
•
•
•
AHB master interface to access frame buffer.
Setup and control via a separate AHB slave interface.
Dual 16-deep programmable 64-bit wide FIFOs for buffering incoming display data.
Supports single and dual-panel monochrome Super Twisted Nematic (STN) displays
with 4-bit or 8-bit interfaces.
• Supports single and dual-panel color STN displays.
• Supports Thin Film Transistor (TFT) color displays.
• Programmable display resolution including, but not limited to: 320  200, 320  240,
640  200, 640  240, 640  480, 800  600, and 1024  768.
•
•
•
•
LPC408X_7X
Objective data sheet
Hardware cursor support for single-panel displays.
15 gray-level monochrome, 3375 color STN, and 32 K color palettized TFT support.
1, 2, or 4 bits-per-pixel (bpp) palettized displays for monochrome STN.
1, 2, 4, or 8 bpp palettized color displays for color STN and TFT.
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32-bit ARM Cortex-M4 microcontroller
•
•
•
•
•
•
•
•
16 bpp true-color non-palettized, for color STN and TFT.
24 bpp true-color non-palettized, for color TFT.
Programmable timing for different display panels.
256 entry, 16-bit palette RAM, arranged as a 128  32-bit RAM.
Frame, line, and pixel clock signals.
AC bias signal for STN, data enable signal for TFT panels.
Supports little and big-endian, and Windows CE data formats.
LCD panel clock may be generated from the peripheral clock, or from a clock input
pin.
7.15 Ethernet
Remark: The Ethernet block is available on parts LPC4088/78/76.
The Ethernet block contains a full featured 10 Mbit/s or 100 Mbit/s Ethernet MAC
designed to provide optimized performance through the use of DMA hardware
acceleration. Features include a generous suite of control registers, half or full duplex
operation, flow control, control frames, hardware acceleration for transmit retry, receive
packet filtering and wake-up on LAN activity. Automatic frame transmission and reception
with scatter-gather DMA off-loads many operations from the CPU.
The Ethernet block and the CPU share the ARM Cortex-M4 D-code and system bus
through the AHB-multilayer matrix to access the various on-chip SRAM blocks for
Ethernet data, control, and status information.
The Ethernet block interfaces between an off-chip Ethernet PHY using the Media
Independent Interface (MII) or Reduced MII (RMII) protocol and the on-chip Media
Independent Interface Management (MIIM) serial bus.
7.15.1 Features
• Ethernet standards support:
– Supports 10 Mbit/s or 100 Mbit/s PHY devices including 10 Base-T, 100 Base-TX,
100 Base-FX, and 100 Base-T4.
– Fully compliant with IEEE standard 802.3.
– Fully compliant with 802.3x Full Duplex Flow Control and Half Duplex back
pressure.
– Flexible transmit and receive frame options.
– Virtual Local Area Network (VLAN) frame support.
• Memory management:
– Independent transmit and receive buffers memory mapped to shared SRAM.
– DMA managers with scatter/gather DMA and arrays of frame descriptors.
– Memory traffic optimized by buffering and pre-fetching.
• Enhanced Ethernet features:
– Receive filtering.
– Multicast and broadcast frame support for both transmit and receive.
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– Optional automatic Frame Check Sequence (FCS) insertion with Circular
Redundancy Check (CRC) for transmit.
– Selectable automatic transmit frame padding.
– Over-length frame support for both transmit and receive allows any length frames.
– Promiscuous receive mode.
– Automatic collision back-off and frame retransmission.
– Includes power management by clock switching.
– Wake-on-LAN power management support allows system wake-up: using the
receive filters or a magic frame detection filter.
• Physical interface:
– Attachment of external PHY chip through standard MII or RMII interface.
– PHY register access is available via the MIIM interface.
7.16 USB interface
Remark: The USB Device/Host/OTG controller is available on parts LPC4088/78/76. The
USB Device-only controller is available on part LPC4074/72.
The Universal Serial Bus (USB) is a 4-wire bus that supports communication between a
host and one or more (up to 127) peripherals. The host controller allocates the USB
bandwidth to attached devices through a token-based protocol. The bus supports hot
plugging and dynamic configuration of the devices. All transactions are initiated by the
host controller.
See Section 13.1 for details on typical USB interfacing solutions.
7.16.1 USB device controller
The device controller enables 12 Mbit/s data exchange with a USB host controller. It
consists of a register interface, serial interface engine, endpoint buffer memory, and a
DMA controller. The serial interface engine decodes the USB data stream and writes data
to the appropriate endpoint buffer. The status of a completed USB transfer or error
condition is indicated via status registers. An interrupt is also generated if enabled. When
enabled, the DMA controller transfers data between the endpoint buffer and the USB
RAM.
7.16.1.1
Features
•
•
•
•
•
Fully compliant with USB 2.0 Specification (full speed).
Supports 32 physical (16 logical) endpoints with a 4 kB endpoint buffer RAM.
Supports Control, Bulk, Interrupt and Isochronous endpoints.
Scalable realization of endpoints at run time.
Endpoint Maximum packet size selection (up to USB maximum specification) by
software at run time.
• Supports SoftConnect and GoodLink features.
• While USB is in the Suspend mode, the LPC408x/7x can enter one of the reduced
power modes and wake up on USB activity.
• Supports DMA transfers with all on-chip SRAM blocks on all non-control endpoints.
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• Allows dynamic switching between CPU-controlled and DMA modes.
• Double buffer implementation for Bulk and Isochronous endpoints.
7.16.2 USB host controller
The host controller enables full- and low-speed data exchange with USB devices attached
to the bus. It consists of register interface, serial interface engine and DMA controller. The
register interface complies with the Open Host Controller Interface (OHCI) specification.
7.16.2.1
Features
• OHCI compliant
• Two downstream ports
• Supports per-port power switching
7.16.3 USB OTG controller
USB OTG is a supplement to the USB 2.0 Specification that augments the capability of
existing mobile devices and USB peripherals by adding host functionality for connection to
USB peripherals.
The OTG Controller integrates the host controller, device controller, and a master-only I2C
interface to implement OTG dual-role device functionality. The dedicated I2C interface
controls an external OTG transceiver.
7.16.3.1
Features
• Fully compliant with On-The-Go supplement to the USB 2.0 Specification, Revision
1.0a.
• Hardware support for Host Negotiation Protocol (HNP).
• Includes a programmable timer required for HNP and Session Request Protocol
(SRP).
• Supports any OTG transceiver compliant with the OTG Transceiver Specification
(CEA-2011), Rev. 1.0.
7.17 SD/MMC card interface
Remark: The SD/MMC card interface is available on parts LPC4088/78/76.
The Secure Digital and Multimedia Card Interface (MCI) allows access to external SD
memory cards. The SD card interface conforms to the SD Multimedia Card Specification
Version 2.11.
7.17.1 Features
• The MCI provides all functions specific to the SD/MMC memory card. These include
the clock generation unit, power management control, and command and data
transfer.
• Conforms to Multimedia Card Specification v2.11.
• Conforms to Secure Digital Memory Card Physical Layer Specification, v0.96.
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• Can be used as a multimedia card bus or a secure digital memory card bus host. The
SD/MMC can be connected to several multimedia cards or a single secure digital
memory card.
• DMA supported through the GPDMA controller.
7.18 Fast general purpose parallel I/O
Device pins that are not connected to a specific peripheral function are controlled by the
GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate
registers allow setting or clearing any number of outputs simultaneously. The value of the
output register may be read back as well as the current state of the port pins.
LPC408x/7x use accelerated GPIO functions:
• GPIO registers are accessed through the AHB multilayer bus so that the fastest
possible I/O timing can be achieved.
• Mask registers allow treating sets of port bits as a group, leaving other bits
unchanged.
•
•
•
•
All GPIO registers are byte and half-word addressable.
Entire port value can be written in one instruction.
Support for Cortex-M4 bit banding.
Support for use with the GPDMA controller.
Additionally, any pin on Port 0 and Port 2 providing a digital function can be programmed
to generate an interrupt on a rising edge, a falling edge, or both. The edge detection is
asynchronous, so it may operate when clocks are not present such as during Power-down
mode. Each enabled interrupt can be used to wake up the chip from Power-down mode.
7.18.1 Features
• Bit level set and clear registers allow a single instruction to set or clear any number of
bits in one port.
• Direction control of individual bits.
• All I/O default to inputs after reset.
• Pull-up/pull-down resistor configuration and open-drain configuration can be
programmed through the pin connect block for each GPIO pin.
7.19 12-bit ADC
The LPC408x/7x contain one ADC. It is a single 12-bit successive approximation ADC
with eight channels and DMA support.
7.19.1 Features
•
•
•
•
•
LPC408X_7X
Objective data sheet
12-bit successive approximation ADC.
Input multiplexing among eight pins.
Power-down mode.
Measurement range VSS to VREFP.
12-bit conversion rate: up to 400 kHz.
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•
•
•
•
•
Individual channels can be selected for conversion.
Burst conversion mode for single or multiple inputs.
Optional conversion on transition of input pin or Timer Match signal.
Individual result registers for each ADC channel to reduce interrupt overhead.
DMA support.
7.20 10-bit DAC
The LPC408x/7x contain one DAC. The DAC allows to generate a variable analog output.
The maximum output value of the DAC is VREFP.
7.20.1 Features
•
•
•
•
•
•
•
10-bit DAC
Resistor string architecture
Buffered output
Power-down mode
Selectable output drive
Dedicated conversion timer
DMA support
7.21 Comparator
Remark: The comparator is available on parts LPC4088/7876.
Two embedded comparators are available to compare the voltage levels on external pins
or against internal voltages. Up to four voltages on external pins and several internal
reference voltages are selectable on each comparator. Additionally, two of the external
inputs can be selected to drive an input common on both comparators.
7.21.1 Features
• Up to five selectable external sources per comparator; fully configurable on either
positive or negative comparator input channels.
• 0.9 V internal band gap reference voltage selectable as either positive or negative
input on each comparator.
• 32-stage voltage ladder internal reference for selectable voltages on each
comparator; configurable on either positive or negative comparator input.
• Voltage ladder source voltage is selectable from an external pin or the 3.3 V analog
voltage supply.
• Voltage ladder can be separately powered down for applications only requiring the
comparator function.
• Relaxation oscillator circuitry output, for a 555 style timer operation.
• Individual comparator outputs can be connected to I/O pins.
• Separate interrupt for each comparator.
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• Edge and level comparator outputs connect to two timers allowing edge counting
while a level match has been asserted or measuring the time between two voltage trip
points.
7.22 UART0/1/2/3 and USART4
Remark: UART0/1/2/3 are available on all parts. USART4 is available on parts
LPC4088/78/76.
The LPC408x/7x contain five UARTs. In addition to standard transmit and receive data
lines, UART1 also provides a full modem control handshake interface and support for
RS-485/9-bit mode allowing both software address detection and automatic address
detection using 9-bit mode.
The UARTs include a fractional baud rate generator. Standard baud rates such as
115200 Bd can be achieved with any crystal frequency above 2 MHz.
7.22.1 Features
•
•
•
•
•
Maximum UART data bit rate of 7.5 MBit/s.
16 B Receive and Transmit FIFOs.
Register locations conform to 16C550 industry standard.
Receiver FIFO trigger points at 1 B, 4 B, 8 B, and 14 B.
Built-in fractional baud rate generator covering wide range of baud rates without a
need for external crystals of particular values.
• Auto-baud capability.
• Fractional divider for baud rate control, auto baud capabilities and FIFO control
mechanism that enables software flow control implementation.
• Support for RS-485/9-bit/EIA-485 mode and multiprocessor addressing.
• All UARTs have DMA support for both transmit and receive.
• UART1 equipped with standard modem interface signals. This module also provides
full support for hardware flow control (auto-CTS/RTS).
• USART4 includes an IrDA mode to support infrared communication.
• USART4 supports synchronous mode and a smart card mode conforming to
ISO7816-3.
7.23 SPIFI
The SPI Flash Interface allows low-cost serial flash memories to be connected to the ARM
Cortex-M4 processor with little performance penalty compared to parallel flash devices
with higher pin count.
The entire flash content is accessible as normal memory using byte, halfword, and word
accesses by the processor and/or DMA channels.
SPIFI provides sufficient flexibility to be compatible with common flash devices and
includes extensions to help insure compatibility with future devices.
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7.23.1 Features
• Quad SPI Flash Interface (SPIFI) interface to external flash.
• Transfer rates of up to SPIFI_CLK/2 bytes per second.
• Code in the serial flash memory can be executed as if it was in the CPU’s internal
memory space. This is accomplished by mapping the external flash memory directly
into the CPU memory space.
• Supports 1-, 2-, and 4-bit bidirectional serial protocols.
• Half-duplex protocol compatible with various vendors and devices.
• Supported by a driver library available from NXP Semiconductors.
7.24 SSP serial I/O controller
The LPC408x/7x contain three SSP controllers. The SSP controller is capable of
operation on a SPI, 4-wire SSI, or Microwire bus. It can interact with multiple masters and
slaves on the bus. Only a single master and a single slave can communicate on the bus
during a given data transfer. The SSP supports full duplex transfers, with frames of 4 bits
to 16 bits of data flowing from the master to the slave and from the slave to the master. In
practice, often only one of these data flows carries meaningful data.
7.24.1 Features
• Maximum SSP speed of 60 Mbit/s (master) or 10 Mbit/s (slave)
• Compatible with Motorola SPI, 4-wire Texas Instruments SSI, and National
Semiconductor Microwire buses
•
•
•
•
•
Synchronous serial communication
Master or slave operation
8-frame FIFOs for both transmit and receive
4-bit to 16-bit frame
DMA transfers supported by GPDMA
7.25 I2C-bus serial I/O controllers
The LPC408x/7x contain three I2C-bus controllers.
The I2C-bus is bidirectional for inter-IC control using only two wires: a Serial Clock Line
(SCL) and a Serial Data Line (SDA). Each device is recognized by a unique address and
can operate as either a receiver-only device (e.g., an LCD driver) or a transmitter with the
capability to both receive and send information (such as memory). Transmitters and/or
receivers can operate in either master or slave mode, depending on whether the chip has
to initiate a data transfer or is only addressed. The I2C is a multi-master bus and can be
controlled by more than one bus master connected to it.
7.25.1 Features
• All I2C-bus controllers can use standard GPIO pins with bit rates of up to 400 kbit/s
(Fast I2C-bus). The I2C0-bus interface uses special open-drain pins with bit rates of
up to 400 kbit/s.
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32-bit ARM Cortex-M4 microcontroller
• The I2C-bus interface supports Fast-mode Plus with bit rates up to 1 Mbit/s for I2C0
using pins P5[2] and P5[3].
•
•
•
•
•
Easy to configure as master, slave, or master/slave.
Programmable clocks allow versatile rate control.
Bidirectional data transfer between masters and slaves.
Multi-master bus (no central master).
Arbitration between simultaneously transmitting masters without corruption of serial
data on the bus.
• Serial clock synchronization allows devices with different bit rates to communicate via
one serial bus.
• Serial clock synchronization can be used as a handshake mechanism to suspend and
resume serial transfer.
• The I2C-bus can be used for test and diagnostic purposes.
• Both I2C-bus controllers support multiple address recognition and a bus monitor
mode.
7.26 I2S-bus serial I/O controllers
The LPC408x/7x contain one I2S-bus interface. The I2S-bus provides a standard
communication interface for digital audio applications.
The I2S-bus specification defines a 3-wire serial bus using one data line, one clock line,
and one word select signal. The basic I2S connection has one master, which is always the
master, and one slave. The I2S interface on the LPC408x/7x provides a separate transmit
and receive channel, each of which can operate as either a master or a slave.
7.26.1 Features
• The interface has separate input/output channels each of which can operate in master
or slave mode.
• Capable of handling 8-bit, 16-bit, and 32-bit word sizes.
• Mono and stereo audio data supported.
• The sampling frequency can range from 16 kHz to 48 kHz (16, 22.05, 32, 44.1,
48) kHz.
•
•
•
•
Configurable word select period in master mode (separately for I2S input and output).
Two 8 word FIFO data buffers are provided, one for transmit and one for receive.
Generates interrupt requests when buffer levels cross a programmable boundary.
Two DMA requests, controlled by programmable buffer levels. These are connected
to the GPDMA block.
• Controls include reset, stop and mute options separately for I2S input and I2S output.
7.27 CAN controller and acceptance filters
The LPC408x/7x contain one CAN controller with two channels.
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The Controller Area Network (CAN) is a serial communications protocol which efficiently
supports distributed real-time control with a very high level of security. Its domain of
application ranges from high-speed networks to low cost multiplex wiring.
The CAN block is intended to support multiple CAN buses simultaneously, allowing the
device to be used as a gateway, switch, or router between two of CAN buses in industrial
or automotive applications.
Each CAN controller has a register structure similar to the NXP SJA1000 and the PeliCAN
Library block, but the 8-bit registers of those devices have been combined in 32-bit words
to allow simultaneous access in the ARM environment. The main operational difference is
that the recognition of received Identifiers, known in CAN terminology as Acceptance
Filtering, has been removed from the CAN controllers and centralized in a global
Acceptance Filter.
7.27.1 Features
•
•
•
•
•
Two CAN controllers and buses.
Data rates to 1 Mbit/s on each bus.
32-bit register and RAM access.
Compatible with CAN specification 2.0B, ISO 11898-1.
Global Acceptance Filter recognizes 11-bit and 29-bit receive identifiers for all CAN
buses.
• Acceptance Filter can provide FullCAN-style automatic reception for selected
Standard Identifiers.
• FullCAN messages can generate interrupts.
7.28 General purpose 32-bit timers/external event counters
The LPC408x/7x include four 32-bit timer/counters.
The timer/counter is designed to count cycles of the system derived clock or an
externally-supplied clock. It can optionally generate interrupts, generate timed DMA
requests, or perform other actions at specified timer values, based on four match
registers. Each timer/counter also includes two capture inputs to trap the timer value when
an input signal transitions, optionally generating an interrupt.
7.28.1 Features
• A 32-bit timer/counter with a programmable 32-bit prescaler.
• Counter or timer operation.
• Two 32-bit capture channels per timer, that can take a snapshot of the timer value
when an input signal transitions. A capture event may also generate an interrupt.
• Four 32-bit match registers that allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
• Up to four external outputs corresponding to match registers, with the following
capabilities:
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– Set LOW on match.
– Set HIGH on match.
– Toggle on match.
– Do nothing on match.
• Up to two match registers can be used to generate timed DMA requests.
7.29 Pulse Width Modulator (PWM)
The LPC408x/7x contain two standard PWMs.
The PWM is based on the standard Timer block and inherits all of its features, although
only the PWM function is pinned out on the LPC408x/7x. The Timer is designed to count
cycles of the system derived clock and optionally switch pins, generate interrupts or
perform other actions when specified timer values occur, based on seven match registers.
The PWM function is in addition to these features, and is based on match register events.
The ability to separately control rising and falling edge locations allows the PWM to be
used for more applications. For instance, multi-phase motor control typically requires
three non-overlapping PWM outputs with individual control of all three pulse widths and
positions.
Two match registers can be used to provide a single edge controlled PWM output. One
match register (PWMMR0) controls the PWM cycle rate, by resetting the count upon
match. The other match register controls the PWM edge position. Additional single edge
controlled PWM outputs require only one match register each, since the repetition rate is
the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a
rising edge at the beginning of each PWM cycle, when an PWMMR0 match occurs.
Three match registers can be used to provide a PWM output with both edges controlled.
Again, the PWMMR0 match register controls the PWM cycle rate. The other match
registers control the two PWM edge positions. Additional double edge controlled PWM
outputs require only two match registers each, since the repetition rate is the same for all
PWM outputs.
With double edge controlled PWM outputs, specific match registers control the rising and
falling edge of the output. This allows both positive going PWM pulses (when the rising
edge occurs prior to the falling edge), and negative going PWM pulses (when the falling
edge occurs prior to the rising edge).
7.29.1 Features
• LPC408x/7x has two PWM blocks with Counter or Timer operation (may use the
peripheral clock or one of the capture inputs as the clock source).
• Seven match registers allow up to 6 single edge controlled or 3 double edge
controlled PWM outputs, or a mix of both types. The match registers also allow:
– Continuous operation with optional interrupt generation on match.
– Stop timer on match with optional interrupt generation.
– Reset timer on match with optional interrupt generation.
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• Supports single edge controlled and/or double edge controlled PWM outputs. Single
edge controlled PWM outputs all go high at the beginning of each cycle unless the
output is a constant low. Double edge controlled PWM outputs can have either edge
occur at any position within a cycle. This allows for both positive going and negative
going pulses.
• Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will
occur at the same repetition rate.
• Double edge controlled PWM outputs can be programmed to be either positive going
or negative going pulses.
• Match register updates are synchronized with pulse outputs to prevent generation of
erroneous pulses. Software must ‘release’ new match values before they can become
effective.
• May be used as a standard 32-bit timer/counter with a programmable 32-bit prescaler
if the PWM mode is not enabled.
7.30 Motor control PWM
The LPC408x/7x contain one motor control PWM.
The motor control PWM is a specialized PWM supporting 3-phase motors and other
combinations. Feedback inputs are provided to automatically sense rotor position and use
that information to ramp speed up or down. An abort input is also provided that causes the
PWM to immediately release all motor drive outputs. At the same time, the motor control
PWM is highly configurable for other generalized timing, counting, capture, and compare
applications.
The maximum PWM speed is determined by the PWM resolution (n) and the operating
frequency f: PWM speed = f/2n (see Table 6).
Table 6.
PWM speed at operating frequency 120 MHz
PWM resolution
PWM speed
6 bit
1.875 MHz
8 bit
0.468 MHz
10 bit
0.117 MHz
7.31 Quadrature Encoder Interface (QEI)
Remark: The QEI is available on parts LPC4088/78/76.
A quadrature encoder, also known as a 2-channel incremental encoder, converts angular
displacement into two pulse signals. By monitoring both the number of pulses and the
relative phase of the two signals, the user can track the position, direction of rotation, and
velocity. In addition, a third channel, or index signal, can be used to reset the position
counter. The quadrature encoder interface decodes the digital pulses from a quadrature
encoder wheel to integrate position over time and determine direction of rotation. In
addition, the QEI can capture the velocity of the encoder wheel.
7.31.1 Features
• Tracks encoder position.
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•
•
•
•
•
•
•
•
•
Increments/decrements depending on direction.
Programmable for 2 or 4 position counting.
Velocity capture using built-in timer.
Velocity compare function with “less than” interrupt.
Uses 32-bit registers for position and velocity.
Three position compare registers with interrupts.
Index counter for revolution counting.
Index compare register with interrupts.
Can combine index and position interrupts to produce an interrupt for whole and
partial revolution displacement.
• Digital filter with programmable delays for encoder input signals.
• Can accept decoded signal inputs (clk and direction).
• Connected to APB.
7.32 ARM Cortex-M4 system tick timer
The ARM Cortex-M4 includes a system tick timer (SYSTICK) that is intended to generate
a dedicated SYSTICK exception at a 10 ms interval. In the LPC408x/7x, this timer can be
clocked from the internal AHB clock or from a device pin.
7.33 Windowed WatchDog Timer (WWDT)
The purpose of the watchdog is to reset the controller if software fails to periodically
service it within a programmable time window.
7.33.1 Features
• Internally resets chip if not periodically reloaded during the programmable time-out
period.
• Optional windowed operation requires reload to occur between a minimum and
maximum time period, both programmable.
• Optional warning interrupt can be generated at a programmable time prior to
watchdog time-out.
• Enabled by software but requires a hardware reset or a watchdog reset/interrupt to be
disabled.
•
•
•
•
Incorrect feed sequence causes reset or interrupt if enabled.
Flag to indicate watchdog reset.
Programmable 24-bit timer with internal prescaler.
Selectable time period from (Tcy(WDCLK)  256  4) to (Tcy(WDCLK)  224  4) in
multiples of Tcy(WDCLK)  4.
• The Watchdog Clock (WDCLK) source is a dedicated watchdog oscillator, which is
always running if the watchdog timer is enabled.
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7.34 RTC and backup registers
The RTC is a set of counters for measuring time when system power is on, and optionally
when it is off. The RTC on the LPC408x/7x is designed to have extremely low power
consumption, i.e. less than 1 A. The RTC will typically run from the main chip power
supply conserving battery power while the rest of the device is powered up. When
operating from a battery, the RTC will continue working down to 2.1 V. Battery power can
be provided from a standard 3 V lithium button cell.
An ultra-low power 32 kHz oscillator will provide a 1 Hz clock to the time counting portion
of the RTC, moving most of the power consumption out of the time counting function.
The RTC includes a calibration mechanism to allow fine-tuning the count rate in a way
that will provide less than 1 second per day error when operated at a constant voltage and
temperature.
The RTC contains a small set of backup registers (20 bytes) for holding data while the
main part of the LPC408x/7x is powered off.
The RTC includes an alarm function that can wake up the LPC408x/7x from all reduced
power modes with a time resolution of 1 s.
7.34.1 Features
• Measures the passage of time to maintain a calendar and clock.
• Ultra low power design to support battery powered systems.
• Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and
Day of Year.
•
•
•
•
Dedicated power supply pin can be connected to a battery or to the main 3.3 V.
Periodic interrupts can be generated from increments of any field of the time registers.
Backup registers (20 bytes) powered by VBAT.
RTC power supply is isolated from the rest of the chip.
7.35 Event monitor/recorder
The event monitor/recorder allows recording of tampering events in sealed product
enclosures. Sensors report any attempt to open the enclosure, or to tamper with the
device in any other way. The event monitor/recorder stores records of such events when
the device is powered only by the backup battery.
7.35.1 Features
• Supports three digital event inputs in the VBAT power domain.
• An event is defined as a level change at the digital event inputs.
• For each event channel, two timestamps mark the first and the last occurrence of an
event. Each channel also has a dedicated counter tracking the total number of events.
Timestamp values are taken from the RTC.
• Runs in VBAT power domain, independent of system power supply. The
event/recorder/monitor can therefore operate in Deep power-down mode.
• Very low power consumption.
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• Interrupt available if system is running.
• A qualified event can be used as a wake-up trigger.
• State of event interrupts accessible by software through GPIO.
7.36 Clocking and power control
7.36.1 Crystal oscillators
The LPC408x/7x include four independent oscillators. These are the main oscillator, the
IRC oscillator, the watchdog oscillator, and the RTC oscillator.
Following reset, the LPC408x/7x will operate from the Internal RC oscillator until switched
by software. This allows systems to operate without any external crystal and the boot
loader code to operate at a known frequency.
See Figure 8 for an overview of the LPC408x/7x clock generation.
LPC408x/7x
IRC oscillator
MAIN PLL0
main oscillator
(osc_clk)
pll_clk
sysclk
CLKSRCSEL
(system clock select)
ALT PLL1
alt_pll_clk
sysclk
pll_clk
CCLKSEL
(CPU clock select)
CPU CLOCK
DIVIDER
cclk
PERIPHERAL
CLOCK DIVIDER
pclk
EMC
CLOCK DIVIDER
emc_clk
USB
CLOCK DIVIDER
usb_clk
sysclk
pll_clk
alt_pll_clk
USBCLKSEL
(USB clock select)
002aag737
Fig 8.
LPC408X_7X
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LPC408x/7x clock generation block diagram
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7.36.1.1
Internal RC oscillator
The IRC may be used as the clock that drives the PLL and subsequently the CPU. The
nominal IRC frequency is 12 MHz. The IRC is trimmed to 1 % accuracy over the entire
voltage and temperature range.
Upon power-up or any chip reset, the LPC408x/7x use the IRC as the clock source.
Software may later switch to one of the other available clock sources.
7.36.1.2
Main oscillator
The main oscillator can be used as the clock source for the CPU, with or without using the
PLL. The main oscillator also provides the clock source for the alternate PLL1.
The main oscillator operates at frequencies of 1 MHz to 25 MHz. This frequency can be
boosted to a higher frequency, up to the maximum CPU operating frequency, by the main
PLL. The clock selected as the PLL input is PLLCLKIN. The ARM processor clock
frequency is referred to as CCLK elsewhere in this document. The frequencies of
PLLCLKIN and CCLK are the same value unless the PLL is active and connected. The
clock frequency for each peripheral can be selected individually and is referred to as
PCLK. Refer to Section 7.36.2 for additional information.
7.36.1.3
RTC oscillator
The RTC oscillator provides a 1 Hz clock to the RTC and a 32 kHz clock output that can
be output on the CLKOUT pin in order to allow trimming the RTC oscillator without
interference from a probe.
7.36.1.4
Watchdog oscillator
The Watchdog Timer has a dedicated oscillator that provides a 500 kHz clock to the
Watchdog Timer that is always running if the Watchdog Timer is enabled. The Watchdog
oscillator clock can be output on the CLKOUT pin in order to allow observe its frequency.
In order to allow Watchdog Timer operation with minimum power consumption, which can
be important in reduced power modes, the Watchdog oscillator frequency is not tightly
controlled. The Watchdog oscillator frequency will vary over temperature and power
supply within a particular part, and may vary by processing across different parts. This
variation should be taken into account when determining Watchdog reload values.
Within a particular part, temperature and power supply variations can produce up to a
17 % frequency variation. Frequency variation between devices under the same
operating conditions can be up to 30 %.
7.36.2 Main PLL (PLL0) and Alternate PLL (PLL1)
PLL0 (also called the Main PLL) and PLL1 (also called the Alternate PLL) are functionally
identical but have somewhat different input possibilities and output connections. These
possibilities are shown in Figure 8. The Main PLL can receive its input from either the IRC
or the main oscillator and can potentially be used to provide the clocks to nearly
everything on the device. The Alternate PLL receives its input only from the main oscillator
and is intended to be used as an alternate source of clocking to the USB. The USB has
timing needs that may not always be filled by the Main PLL.
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Both PLLs are disabled and powered off on reset. If the Alternate PLL is left disabled, the
USB clock can be supplied by PLL0 if everything is set up to provide 48 MHz to the USB
clock through that route. The source for each clock must be selected via the CLKSEL
registers and can be further reduced by clock dividers as needed.
PLL0 accepts an input clock frequency from either the IRC or the main oscillator. If only
the Main PLL is used, then its output frequency must be an integer multiple of all other
clocks needed in the system. PLL1 takes its input only from the main oscillator, requiring
an external crystal in the range of 10 to 25 MHz. In each PLL, the Current Controlled
Oscillator (CCO) operates in the range of 156 MHz to 320 MHz, so there are additional
dividers to bring the output down to the desired frequencies. The minimum output divider
value is 2, insuring that the output of the PLLs have a 50 % duty cycle.
If the USB is used, the possibilities for the CPU clock and other clocks will be limited by
the requirements that the frequency be precise and very low jitter, and that the PLL0
output must be a multiple of 48 MHz. Even multiples of 48 MHz that are within the
operating range of the PLL are 192 MHz and 288 MHz. Also, only the main oscillator in
conjunction with the PLL can meet the precision and jitter specifications for USB. It is due
to these limitations that the Alternate PLL is provided.
The alternate PLL accepts an input clock frequency from the main oscillator in the range
of 10 MHz to 25 MHz only. When used as the USB clock, the input frequency is multiplied
up to a multiple of 48 MHz (192 MHz or 288 MHz as described above).
7.36.3 Wake-up timer
The LPC408x/7x begin operation at power-up and when awakened from Power-down
mode by using the 12 MHz IRC oscillator as the clock source. This allows chip operation
to resume quickly. If the main oscillator or the PLL is needed by the application, software
will need to enable these features and wait for them to stabilize before they are used as a
clock source.
When the main oscillator is initially activated, the wake-up timer allows software to ensure
that the main oscillator is fully functional before the processor uses it as a clock source
and starts to execute instructions. This is important at power on, all types of reset, and
whenever any of the aforementioned functions are turned off for any reason. Since the
oscillator and other functions are turned off during Power-down mode, any wake-up of the
processor from Power-down mode makes use of the wake-up Timer.
The wake-up timer monitors the crystal oscillator to check whether it is safe to begin code
execution. When power is applied to the chip, or when some event caused the chip to exit
Power-down mode, some time is required for the oscillator to produce a signal of sufficient
amplitude to drive the clock logic. The amount of time depends on many factors, including
the rate of VDD(3V3) ramp (in the case of power on), the type of crystal and its electrical
characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g.,
capacitors), and the characteristics of the oscillator itself under the existing ambient
conditions.
7.36.4 Power control
The LPC408x/7x support a variety of power control features. There are four special
modes of processor power reduction: Sleep mode, Deep-sleep mode, Power-down mode,
and Deep power-down mode. The CPU clock rate may also be controlled as needed by
changing clock sources, reconfiguring PLL values, and/or altering the CPU clock divider
value. This allows a trade-off of power versus processing speed based on application
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requirements. In addition, the peripheral power control allows shutting down the clocks to
individual on-chip peripherals, allowing fine tuning of power consumption by eliminating all
dynamic power use in any peripherals that are not required for the application. Each of the
peripherals has its own clock divider which provides even better power control.
The integrated PMU (Power Management Unit) automatically adjusts internal regulators
to minimize power consumption during Sleep, Deep-sleep, Power-down, and Deep
power-down modes.
The LPC408x/7x also implement a separate power domain to allow turning off power to
the bulk of the device while maintaining operation of the RTC and a small set of registers
for storing data during any of the power-down modes.
7.36.4.1
Sleep mode
When Sleep mode is entered, the clock to the core is stopped. Resumption from the Sleep
mode does not need any special sequence other than re-enabling the clock to the ARM
core.
In Sleep mode, execution of instructions is suspended until either a Reset or interrupt
occurs. Peripheral functions continue operation during Sleep mode and may generate
interrupts to cause the processor to resume execution. Sleep mode eliminates dynamic
power used by the processor itself, memory systems and related controllers, and internal
buses.
The DMA controller can continue to work in Sleep mode and has access to the peripheral
RAMs and all peripheral registers. The flash memory and the main SRAM are not
available in Sleep mode, they are disabled in order to save power.
Wake-up from Sleep mode will occur whenever any enabled interrupt occurs.
7.36.4.2
Deep-sleep mode
In Deep-sleep mode, the oscillator is shut down and the chip receives no internal clocks.
The processor state and registers, peripheral registers, and internal SRAM values are
preserved throughout Deep-sleep mode and the logic levels of chip pins remain static.
The output of the IRC is disabled but the IRC is not powered down to allow fast wake-up.
The RTC oscillator is not stopped because the RTC interrupts may be used as the
wake-up source. The PLL is automatically turned off and disconnected. The clock divider
registers are automatically reset to zero.
The Deep-sleep mode can be terminated and normal operation resumed by either a
Reset or certain specific interrupts that are able to function without clocks. Since all
dynamic operation of the chip is suspended, Deep-sleep mode reduces chip power
consumption to a very low value. Power to the flash memory is left on in Deep-sleep
mode, allowing a very quick wake-up.
Wake-up from Deep-sleep mode can initiated by the NMI, External Interrupts EINT0
through EINT3, GPIO interrupts, the Ethernet Wake-on-LAN interrupt, Brownout Detect,
an RTC Alarm interrupt, a USB input pin transition (USB activity interrupt), a CAN input
pin transition, or a Watchdog Timer time-out, when the related interrupt is enabled.
Wake-up will occur whenever any enabled interrupt occurs.
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On wake-up from Deep-sleep mode, the code execution and peripherals activities will
resume after four cycles expire if the IRC was used before entering Deep-sleep mode. If
the main external oscillator was used, the code execution will resume when 4096 cycles
expire. PLL and clock dividers need to be reconfigured accordingly.
7.36.4.3
Power-down mode
Power-down mode does everything that Deep-sleep mode does but also turns off the
power to the IRC oscillator and the flash memory. This saves more power but requires
waiting for resumption of flash operation before execution of code or data access in the
flash memory can be accomplished.
When the chip enters Power-down mode, the IRC, the main oscillator, and all clocks are
stopped. The RTC remains running if it has been enabled and RTC interrupts may be
used to wake up the CPU. The flash is forced into Power-down mode. The PLLs are
automatically turned off and the clock selection multiplexers are set to use the system
clock sysclk (the reset state). The clock divider control registers are automatically reset to
zero. If the Watchdog timer is running, it will continue running in Power-down mode.
On the wake-up of Power-down mode, if the IRC was used before entering Power-down
mode, it will take IRC 60 s to start-up. After this four IRC cycles will expire before the
code execution can then be resumed if the code was running from SRAM. In the
meantime, the flash wake-up timer then counts 12 MHz IRC clock cycles to make the
100 s flash start-up time. When it times out, access to the flash will be allowed. Users
need to reconfigure the PLL and clock dividers accordingly.
7.36.4.4
Deep power-down mode
The Deep power-down mode can only be entered from the RTC block. In Deep
power-down mode, power is shut off to the entire chip with the exception of the RTC
module and the RESET pin.
To optimize power conservation, the user has the additional option of turning off or
retaining power to the 32 kHz oscillator. It is also possible to use external circuitry to turn
off power to the on-chip regulator via the VDD(REG)(3V3) pins and/or the I/O power via the
VDD(3V3) pins after entering Deep Power-down mode. Power must be restored before
device operation can be restarted.
The LPC408x/7x can wake up from Deep power-down mode via the RESET pin or an
alarm match event of the RTC.
7.36.4.5
Wake-up Interrupt Controller (WIC)
The WIC allows the CPU to automatically wake up from any enabled priority interrupt that
can occur while the clocks are stopped in Deep-sleep, Power-down, and Deep
power-down modes.
The WIC works in connection with the Nested Vectored Interrupt Controller (NVIC). When
the CPU enters Deep-sleep, Power-down, or Deep power-down mode, the NVIC sends a
mask of the current interrupt situation to the WIC.This mask includes all of the interrupts
that are both enabled and of sufficient priority to be serviced immediately. With this
information, the WIC simply notices when one of the interrupts has occurred and then it
wakes up the CPU.
The WIC eliminates the need to periodically wake up the CPU and poll the interrupts
resulting in additional power savings.
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7.36.5 Peripheral power control
A power control for peripherals feature allows individual peripherals to be turned off if they
are not needed in the application, resulting in additional power savings.
7.36.6 Power domains
The LPC408x/7x provide two independent power domains that allow the bulk of the
device to have power removed while maintaining operation of the RTC and the backup
registers.
On the LPC408x/7x, I/O pads are powered by VDD(3V3), while VDD(REG)(3V3) powers the
on-chip voltage regulator which in turn provides power to the CPU and most of the
peripherals.
Depending on the LPC408x/7x application, a design can use two power options to
manage power consumption.
The first option assumes that power consumption is not a concern and the design ties the
VDD(3V3) and VDD(REG)(3V3) pins together. This approach requires only one 3.3 V power
supply for both pads, the CPU, and peripherals. While this solution is simple, it does not
support powering down the I/O pad ring “on the fly” while keeping the CPU and
peripherals alive.
The second option uses two power supplies; a 3.3 V supply for the I/O pads (VDD(3V3)) and
a dedicated 3.3 V supply for the CPU (VDD(REG)(3V3)). Having the on-chip voltage regulator
powered independently from the I/O pad ring enables shutting down of the I/O pad power
supply “on the fly” while the CPU and peripherals stay active.
The VBAT pin supplies power only to the RTC domain. The RTC requires a minimum of
power to operate, which can be supplied by an external battery. The device core power
(VDD(REG)(3V3)) is used to operate the RTC whenever VDD(REG)(3V3) is present. There is no
power drain from the RTC battery when VDD(REG)(3V3) is available and VDD(REG)(3V3) >
VBAT.
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LPC408x/7x
VDD(3V3)
to I/O pads
to core
VSS
VDD(REG)(3V3)
(typical 3.3 V)
REGULATOR
to memories,
peripherals,
oscillators,
PLLs
MAIN POWER DOMAIN
VBAT
(typical 3.0 V)
POWER
SELECTOR
ULTRA-LOW
POWER
REGULATOR
BACKUP REGISTERS
RTCX1
RTCX2
32 kHz
OSCILLATOR
REAL-TIME CLOCK
RTC POWER DOMAIN
DAC
VDDA
VREFP
ADC
VSSA
ADC POWER DOMAIN
002aag738
Fig 9.
Power distribution
7.37 System control
7.37.1 Reset
Reset has four sources on the LPC408x/7x: the RESET pin, the Watchdog reset,
Power-On Reset (POR), and the BrownOut Detection (BOD) circuit. The RESET pin is a
Schmitt trigger input pin. Assertion of chip Reset by any source, once the operating
voltage attains a usable level, starts the Wake-up timer (see description in
Section 7.36.3), causing reset to remain asserted until the external Reset is de-asserted,
the oscillator is running, a fixed number of clocks have passed, and the flash controller
has completed its initialization.
When the internal Reset is removed, the processor begins executing at address 0, which
is initially the Reset vector mapped from the boot block. At that point, all of the processor
and peripheral registers have been initialized to predetermined values.
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7.37.2 Brownout detection
The LPC408x/7x include 2-stage monitoring of the voltage on the VDD(REG)(3V3) pins. If this
voltage falls below 2.95 V, the BOD asserts an interrupt signal to the Vectored Interrupt
Controller. This signal can be enabled for interrupt in the Interrupt Enable Register in the
NVIC in order to cause a CPU interrupt; if not, software can monitor the signal by reading
a dedicated status register.
The second stage of low-voltage detection asserts reset to inactivate the LPC408x/7x
when the voltage on the VDD(REG)(3V3) pins falls below 2.65 V. This reset prevents
alteration of the flash as operation of the various elements of the chip would otherwise
become unreliable due to low voltage. The BOD circuit maintains this reset down below
1 V, at which point the power-on reset circuitry maintains the overall reset.
Both the 2.95 V and 2.65 V thresholds include some hysteresis. In normal operation, this
hysteresis allows the 2.95 V detection to reliably interrupt, or a regularly executed event
loop to sense the condition.
7.37.3 Code security (Code Read Protection - CRP)
This feature of the LPC408x/7x allows user to enable different levels of security in the
system so that access to the on-chip flash and use of the JTAG and ISP can be restricted.
When needed, CRP is invoked by programming a specific pattern into a dedicated flash
location. IAP commands are not affected by the CRP.
There are three levels of the Code Read Protection.
CRP1 disables access to chip via the JTAG and allows partial flash update (excluding
flash sector 0) using a limited set of the ISP commands. This mode is useful when CRP is
required and flash field updates are needed but all sectors can not be erased.
CRP2 disables access to chip via the JTAG and only allows full flash erase and update
using a reduced set of the ISP commands.
Running an application with level CRP3 selected fully disables any access to chip via the
JTAG pins and the ISP. This mode effectively disables ISP override using P2[10] pin, too.
It is up to the user’s application to provide (if needed) flash update mechanism using IAP
calls or call reinvoke ISP command to enable flash update via UART0.
CAUTION
If level three Code Read Protection (CRP3) is selected, no future factory testing can be
performed on the device.
7.37.4 APB interface
The APB peripherals are split into two separate APB buses in order to distribute the bus
bandwidth and thereby reducing stalls caused by contention between the CPU and the
GPDMA controller.
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7.37.5 AHB multilayer matrix
The LPC408x/7x use an AHB multilayer matrix. This matrix connects the instruction
(I-code) and data (D-code) CPU buses of the ARM Cortex-M4 to the flash memory, the
main (32 kB) static RAM, and the Boot ROM. The GPDMA can also access all of these
memories. Additionally, the matrix connects the CPU system bus and all of the DMA
controllers to the various peripheral functions.
7.37.6 External interrupt inputs
The LPC408x/7x include up to 30 edge sensitive interrupt inputs combined with one level
sensitive external interrupt input as selectable pin function. The external interrupt input
can optionally be used to wake up the processor from Power-down mode.
7.37.7 Memory mapping control
The Cortex-M4 incorporates a mechanism that allows remapping the interrupt vector table
to alternate locations in the memory map. This is controlled via the Vector Table Offset
Register contained in the NVIC.
The vector table may be located anywhere within the bottom 1 GB of Cortex-M4 address
space. The vector table must be located on a 128 word (512 byte) boundary because the
NVIC on the LPC408x/7x is configured for 128 total interrupts.
7.38 Debug control
Debug and trace functions are integrated into the ARM Cortex-M4. Serial wire debug and
trace functions are supported in addition to a standard JTAG debug and parallel trace
functions. The ARM Cortex-M4 is configured to support up to eight breakpoints and four
watch points.
8. Limiting values
Table 7.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
external rail
Min
Max
Unit
VDD(3V3)
supply voltage (3.3 V)
2.4
3.6
V
VDD(REG)(3V3)
regulator supply voltage (3.3 V)
2.4
3.6
V
VDDA
analog 3.3 V pad supply voltage
0.5
+4.6
V
Vi(VBAT)
input voltage on pin VBAT
for the RTC
0.5
+4.6
V
Vi(VREFP)
input voltage on pin VREFP
0.5
+4.6
V
VIA
analog input voltage
on ADC related
pins
0.5
+5.1
V
VI
input voltage
5 V tolerant digital
I/O pins;
0.5
+5.5
V
0.5
+3.6
V
0.5
VDD(3V3) +
0.5
V
[2]
VDD(3V3)  2.4V
VDD(3V3)  0 V
other I/O pins
[2][3]
IDD
supply current
per supply pin
-
100
mA
ISS
ground current
per ground pin
-
100
mA
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Table 7.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
Ilatch
I/O latch-up current
(0.5VDD(3V3)) < VI
< (1.5VDD(3V3));
-
100
mA
65
+150
C
-
1.5
W

4000
V
Tj < 125 C
Tstg
storage temperature
non-operating
Ptot(pack)
total power dissipation (per package)
based on package
heat transfer, not
device power
consumption
VESD
electrostatic discharge voltage
human body
model; all pins
[1]
[4]
[5]
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated
maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless
otherwise noted.
[2]
Including voltage on outputs in 3-state mode.
[3]
Not to exceed 4.6 V.
[4]
The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined
based on the required shelf lifetime. Please refer to the JEDEC spec for further details.
[5]
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
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9. Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
T j = T amb +  P D  R th  j – a  
(1)
• Tamb = ambient temperature (C),
• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)
• PD = sum of internal and I/O power dissipation
Table 8.
Thermal characteristics
VDD = 3.0 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified;
Symbol
Parameter
Tj(max)
maximum junction
temperature
Conditions
Min
Typ
Max
Unit
-
-
125
C
Table 9.
Thermal resistance (LQFP packages)
Tamb = 40 C to +85 C unless otherwise specified.
Thermal resistance value (C/W): ±15 %
LQFP80
LQFP144
LQFP208
0 m/s
41
31
27
1 m/s
35
28
25
2.5 m/s
32
26
24
0 m/s
61
43
35
1 m/s
47
35
31
ja
JEDEC (4.5 in  4 in)
Single-layer (4.5 in  3 in)
43
33
29
jc
2.5 m/s
7.8
9.2
10.5
jb
11.6
13.5
15.2
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Table 10. Thermal resistance value (TFBGA packages)
Tamb = 40 C to +85 C unless otherwise specified.
Thermal resistance value (C/W): ±15 %
TFBGA180
TFBGA208
0 m/s
47
43
1 m/s
39
37
2.5 m/s
35
33
0 m/s
39
37
1 m/s
35
33
2.5 m/s
31
30
jc
8.5
7.4
jb
13
16
ja
JEDEC (4.5 in  4 in)
8-layer (4.5 in  3 in)
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10. Static characteristics
Table 11. Static characteristics
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
Conditions
VDD(3V3)
supply voltage (3.3 V)
external rail
VDD(REG)(3V3)
regulator supply voltage
(3.3 V)
VDDA
analog 3.3 V pad supply
voltage
Vi(VBAT)
input voltage on pin
VBAT
Vi(VREFP)
input voltage on pin
VREFP
IDD(REG)(3V3)
regulator supply current active mode; code
(3.3 V)
while(1){}
Min
Typ[1]
Max
Unit
2.4
3.3
3.6
V
2.4
3.3
3.6
V
2.7
3.3
3.6
V
2.1
3.0
3.6
V
2.7
3.3
VDDA
V
Supply pins
[2]
[3]
executed from flash; all
peripherals disabled
PCLK = CCLK/4
CCLK = 12 MHz; PLL
disabled
[4][5]
-
7
-
mA
CCLK = 120 MHz; PLL
enabled
[4][6]
-
51
-
mA
active mode; code
while(1){}
executed from flash; all
peripherals enabled;
PCLK = CCLK/4
IBAT
battery supply current
CCLK = 12 MHz; PLL
disabled
[4][5]
14
CCLK = 120 MHz; PLL
enabled
[4][6]
100
mA
Sleep mode
[4][7]
-
5
-
mA
Deep-sleep mode
[4][8]
-
550
-
A
Power-down mode
[4][8]
-
280
-
A
[9]
-
1
-
A
RTC running;
part powered down;
VDD(REG)(3V3) =0 V;
Vi(VBAT) = 3.0 V;
VDD(3V3) = 0 V.
part powered;
VDD(REG)(3V3) = 3.3 V;
Vi(VBAT) = 3.0 V
LPC408X_7X
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Table 11. Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
Standard port pins, RESET
IIL
LOW-level input current VI = 0 V; on-chip pull-up
resistor disabled
-
0.5
10
nA
IIH
HIGH-level input
current
VI = VDD(3V3); on-chip
pull-down resistor
disabled
-
0.5
10
nA
VI
input voltage
pin configured to provide
a digital function
0
-
5.0
V
0
-
VDD(3V3)
V
V
[14][15]
[16]
VO
output voltage
VIH
HIGH-level input
voltage
0.7VDD(3V3) -
-
VIL
LOW-level input voltage
-
-
0.3VDD(3V3) V
Vhys
hysteresis voltage
0.4
-
-
V
VOH
HIGH-level output
voltage
IOH = 4 mA
VDD(3V3) 
0.45
-
-
V
VOL
LOW-level output
voltage
IOL = 4 mA
-
-
0.45
V
IOH
HIGH-level output
current
VOH = VDD(3V3)  0.4 V
4
-
-
mA
IOL
LOW-level output
current
VOL = 0.4 V
4
-
-
mA
IOHS
HIGH-level short-circuit VOH = 0 V
output current
[17]
-
-
50
mA
IOLS
LOW-level short-circuit
output current
VOL = VDD(3V3)
[17]
-
-
60
mA
Ipd
pull-down current
VI = 5 V
10
50
150
A
Ipu
pull-up current
VI = 0 V
15
50
85
A
VDD(3V3) < VI < 5 V
0
0
0
A
V
I2C-bus
output active
pins (P0[27] and P0[28])
VIH
HIGH-level input
voltage
0.7VDD(3V3) -
-
VIL
LOW-level input voltage
-
-
0.3VDD(3V3) V
Vhys
hysteresis voltage
-
0.05 
VDD(3V3)
-
V
VOL
LOW-level output
voltage
IOLS = 3 mA
-
-
0.4
V
ILI
input leakage current
VI = VDD(3V3)
-
2
4
A
-
10
22
A
[19]
-
-
10
A
[19]
-
-
5.25
V
[19]
0.2
-
-
V
[18]
VI = 5 V
USB pins
IOZ
OFF-state output
current
VBUS
bus supply voltage
VDI
differential input
sensitivity voltage
LPC408X_7X
Objective data sheet
0 V < VI < 3.3 V
(D+)  (D)
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Table 11. Static characteristics …continued
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
Min
Typ[1]
Max
Unit
[19]
0.8
-
2.5
V
[19]
0.8
-
2.0
V
Conditions
VCM
differential common
mode voltage range
includes VDI range
Vth(rs)se
single-ended receiver
switching threshold
voltage
VOL
LOW-level output
voltage for
low-/full-speed
RL of 1.5 k to 3.6 V
[19]
-
-
0.18
V
VOH
HIGH-level output
voltage (driven) for
low-/full-speed
RL of 15 k to GND
[19]
2.8
-
3.5
V
Ctrans
transceiver capacitance pin to GND
[19]
-
-
20
pF
Oscillator pins (see Section 13.2)
Vi(XTAL1)
input voltage on pin
XTAL1
0.5
1.8
1.95
V
Vo(XTAL2)
output voltage on pin
XTAL2
0.5
1.8
1.95
V
Vi(RTCX1)
input voltage on pin
RTCX1
0.5
-
3.6
V
Vo(RTCX2)
output voltage on pin
RTCX2
0.5
-
3.6
V
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply voltages.
[2]
For USB operation 3.0 V  VDD((3V3)  3.6 V. Guaranteed by design.
[3]
The RTC typically fails when Vi(VBAT) drops below 1.6 V.
[4]
VDD(REG)(3V3) = 3.3 V; Tamb = 25 C for all power consumption measurements.
[5]
Boost control bits in the PBOOST register set to 0x0 (see LPC408x/7x User manual).
[6]
Boost control bits in the PBOOST register set to 0x3 (see LPC408x/7x User manual).
[7]
IRC running at 12 MHz; main oscillator and PLL disabled; PCLK = CCLK/4.
[8]
BOD disabled.
[9]
On pin VBAT; VDD(REG)(3V3) = VDD(3V3) = VDDA = 0; Tamb = 25 C.
[10] On pin VBAT; VDD(REG)(3V3) = VDD(3V3) = VDDA = 3.3 V; Tamb = 25 C.
[11] All internal pull-ups disabled. All pins configured as output and driven LOW. VDD(3V3) = 3.3 V; Tamb = 25 C.
[12] VDDA = 3.3 V; Tamb = 25 C.
[13] Vi(VREFP) = 3.3 V; Tamb = 25 C.
[14] Including voltage on outputs in 3-state mode.
[15] VDD(3V3) supply voltages must be present.
[16] 3-state outputs go into 3-state mode in Deep power-down mode.
[17] Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[18] To VSS.
[19] 3.0 V  VDD(3V3)  3.6 V.
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10.1 Power consumption
002aah051
1.5
IDD(REG)(3V3)
(mA)
VDD(REG)(3V3) = 3.6 V
3.3 V
3.0 V
2.4 V
1.1
0.7
0.3
-40
-15
10
35
60
85
temperature (°C)
Conditions: BOD disabled.
Fig 10. Deep-sleep mode: Typical regulator supply current IDD(REG)(3V3) versus
temperature
002aah052
900
IDD(REG)(3V3)
(μA)
600
300
0
-40
VDD(REG)(3V3) = 3.6 V
3.3 V
3.0 V
2.4 V
-15
10
35
60
85
temperature (°C)
Conditions: BOD disabled.
Fig 11. Power-down mode: Typical regulator supply current IDD(REG)(3V3) versus
temperature
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002aah074
2.0
IBAT
(μA)
1.6
1.2
0.8
0.4
0
-40
-15
10
35
60
85
temperature (°C)
Conditions: VDD(REG)(3V3) = VDDA = VDD(3V3) = 0; VBAT = 3.0 V.
Fig 12. Part powered off: Typical battery supply current (IBAT) versus temperature
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10.2 Peripheral power consumption
The supply current per peripheral is measured as the difference in supply current between
the peripheral block enabled and the peripheral block disabled in the PCONP register. All
other blocks are disabled and no code is executed. Measured on a typical sample at
Tamb = 25 C. The peripheral clock was set to PCLK = CCLK/4 with CCLK = 12 MHz,
48 MHz, and 120 MHz.
The combined current of several peripherals running at the same time can be less than
the sum of each individual peripheral current measured separately.
Table 12. Power consumption for individual analog and digital blocks
Tamb = 25 C; VDD(REG)(3V3) = VDD(3V3) = VDDA = 3.3 V; PCLK = CCLK/4.
Peripheral
Conditions
Typical supply current in mA
12 MHz[1] 48 MHz[1] 120 MHz[2]
Timer0
0.01
0.06
0.15
Timer1
0.02
0.07
0.16
Timer2
0.02
0.07
0.17
Timer3
0.01
0.07
0.16
Timer0 + Timer1 + Timer2 + Timer3
0.07
0.28
0.67
UART0
0.05
0.19
0.45
UART1
0.06
0.24
0.56
UART2
0.05
0.2
0.47
UART3
0.06
0.23
0.56
USART4
0.07
0.27
0.66
UART0 + UART1 + UART2 + UART3 +
USART4
0.29
1.13
2.74
PWM0 + PWM1
0.08
0.31
0.75
Motor control PWM
0.04
0.15
0.36
I2C0
0.01
0.03
0.08
I2C1
0.01
0.03
0.1
I2C2
0.01
0.03
0.08
I2C0 + I2C1 + I2C2
0.02
0.1
0.26
SSP0
0.03
0.1
0.26
SSP1
0.02
0.11
0.27
DAC
0.3
0.31
0.33
ADC (12 MHz clock)
1.51
1.61
1.7
Comparator
0.01
0.03
0.06
CAN1
0.11
0.44
1.08
CAN2
0.1
0.4
0.98
0.15
0.59
1.44
1.1
4.27
10.27
QEI
0.02
0.11
0.28
GPIO
0.4
1.72
4.16
LCD
0.99
3.84
9.25
CAN1 + CAN2
DMA
LPC408X_7X
Objective data sheet
PCLK = CCLK
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Table 12. Power consumption for individual analog and digital blocks …continued
Tamb = 25 C; VDD(REG)(3V3) = VDD(3V3) = VDDA = 3.3 V; PCLK = CCLK/4.
Peripheral
Conditions
Typical supply current in mA
12 MHz[1] 48 MHz[1] 120 MHz[2]
I2S
0.04
0.18
0.46
EMC
0.82
3.17
7.63
RTC
0.01
0.01
0.05
USB + PLL1
0.62
0.97
1.67
PCENET bit set 0.54
to 1 in the
PCONP register
2.08
5.03
Ethernet
LPC408X_7X
Objective data sheet
[1]
Boost control bits in the PBOOST register set to 0x0 (see LPC178x/7x User manual UM10470).
[2]
Boost control bits in the PBOOST register set to 0x3 (see LPC178x/7x User manual UM10470).
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10.3 Electrical pin characteristics
002aaf112
3.6
VOH
(V)
T = 85 °C
25 °C
−40 °C
3.2
2.8
2.4
2.0
0
8
16
24
IOH (mA)
Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins.
Fig 13. Typical HIGH-level output voltage VOH versus HIGH-level output source current
IOH
002aaf111
15
IOL
(mA)
T = 85 °C
25 °C
−40 °C
10
5
0
0
0.2
0.4
0.6
VOL (V)
Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins.
Fig 14. Typical LOW-level output current IOL versus LOW-level output voltage VOL
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002aaf108
10
Ipu
(μA)
−10
−30
T = 85 °C
25 °C
−40 °C
−50
−70
0
1
2
3
4
5
VI (V)
Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins.
Fig 15. Typical pull-up current Ipu versus input voltage VI
002aaf109
90
Ipd
(μA)
70
T = 85 °C
25 °C
−40 °C
50
30
10
−10
0
1
2
3
4
5
VI (V)
Conditions: VDD(REG)(3V3) = VDD(3V3) = 3.3 V; standard port pins.
Fig 16. Typical pull-down current Ipd versus input voltage VI
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11. Dynamic characteristics
11.1 Flash memory
Table 13. Flash characteristics
Tamb = 40 C to +85 C, unless otherwise specified.
Symbol
Parameter
Nendu
endurance
tret
retention time
ter
erase time
tprog
programming
time
Conditions
[1]
Min
Typ
Max
Unit
10000
100000 -
cycles
powered
10
-
-
years
unpowered
20
-
-
years
sector or multiple
consecutive sectors
95
100
105
ms
0.95
1
1.05
ms
[2]
[1]
Number of program/erase cycles.
[2]
Programming times are given for writing 256 bytes from RAM to the flash. Data must be written to the flash
in blocks of 256 bytes.
Table 14. EEPROM characteristics
Tamb = 40 C to +85 C; VDD(REG)(3V3) = 2.7 V to 3.6 V.
Symbol
Parameter
fclk
Min
Typ
Max
Unit
clock frequency
200
375
400
kHz
Nendu
endurance
100000
500000
-
cycles
tret
retention time
powered
10
-
-
years
unpowered
10
-
-
years
64 bytes
[1]
-
1.8
-
ms
64 bytes
[1]
-
1.1
-
ms
ter
tprog
[1]
LPC408X_7X
Objective data sheet
erase time
programming
time
Conditions
EEPROM clock frequency = 375 kHz. Programming/erase times increase with decreasing EEPROM clock
frequency.
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11.2 External memory interface
Table 15. Dynamic characteristics: Static external memory interface
CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design.
Symbol
Parameter[1]
Read cycle
parameters[2]
tCSLAV
tCSLOEL
tCSLBLSL
Conditions[1]
Min
Max
Unit
CS LOW to address valid
time
RD1
1.4
2.5
ns
CS LOW to OE LOW time
RD2
[3]
1.3 + Tcy(clk)  WAITOEN 2.5 + Tcy(clk)  WAITOEN ns
RD3; PB = 1
[3]
1.5
3.0
ns
(WAITRD  WAITOEN +
1)  Tcy(clk)  1.0
(WAITRD  WAITOEN +
1)  Tcy(clk)  1.6
ns
(WAITRD 
WAITOEN +1) Tcy(clk) 
7.2
(WAITRD 
WAITOEN +1) 
Tcy(clk)  15.5
ns
[3]
[5]
0.1
0.1
ns
CS LOW to BLS LOW time
tOELOEH
OE LOW to OE HIGH time
RD4
[3]
tam
memory access time
RD5
[4]
th(D)
data input hold time
RD6
[3]
tCSHBLSH
CS HIGH to BLS HIGH time PB = 1
1.5
3.0
ns
tCSHOEH
CS HIGH to OE HIGH time
[3]
1.3
2.5
ns
tOEHANV
OE HIGH to address invalid
time
[3]
0.09
0.13
ns
tdeact
deactivation time
[3]
1.4
2.5
ns
1.4
2.5
ns
RD7
Write cycle
parameters[2]
tCSLAV
CS LOW to address valid
time
WR1
tCSLDV
CS LOW to data valid time
WR2
1.5
2.9
ns
1.4 + Tcy(clk) 
(1 + WAITWEN)
2.5 + Tcy(clk) 
(1 + WAITWEN)
ns
3.0
ns
tCSLWEL
CS LOW to WE LOW time
WR3; PB =1
[3]
tCSLBLSL
CS LOW to BLS LOW time
WR4; PB = 1
[3]
3.0
WR5; PB =1
[3]
(WAITWR  WAITWEN + (WAITWR  WAITWEN + ns
1)  Tcy(clk)  1.0
1)  Tcy(clk)  1.7
tWELWEH
WE LOW to WE HIGH time
tBLSLBLSH
BLS LOW to BLS HIGH time PB = 1
[3]
(WAITWR  WAITWEN + (WAITWR  WAITWEN + ns
3)  Tcy(clk)  2.7
3)  Tcy(clk)  1.4
tWEHDNV
WE HIGH to data invalid
time
WR6; PB =1
[3]
1.2 + Tcy(clk)
2.1 + Tcy(clk)
ns
tWEHEOW
WE HIGH to end of write
time
WR7; PB = 1
[6]
Tcy(clk)  1.4
Tcy(clk)  2.5
ns
tBLSHDNV
BLS HIGH to data invalid
time
PB = 1
1.4
2.7
ns
tWEHANV
WE HIGH to address invalid PB = 1
time
[3]
1 + Tcy(clk)
1.7 + Tcy(clk)
ns
tdeact
deactivation time
WR8; PB = 0;
PB = 1
[3]
1.4
2.5
ns
tCSLBLSL
CS LOW to BLS LOW
WR9; PB = 0
[3]
3.0 + Tcy(clk)
(1 + WAITWEN)
3.0 + Tcy(clk)
(1 + WAITWEN)
ns
LPC408X_7X
Objective data sheet
[3]
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Table 15. Dynamic characteristics: Static external memory interface …continued
CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design.
Parameter[1]
Symbol
Conditions[1]
Min
tBLSLBLSH
BLS LOW to BLS HIGH time WR10; PB = 0
[3]
tBLSHEOW
BLS HIGH to end of write
time
WR11; PB = 0
[6]
BLS HIGH to data invalid
time
WR12;
PB = 0
tBLSHDNV
Max
Unit
(WAITWR  WAITWEN + (WAITWR  WAITWEN + ns
3)  Tcy(clk)  1.4
3)  Tcy(clk)  2.7
1.3 + Tcy(clk)
2.2 + Tcy(clk)
ns
1.4 + Tcy(clk)
2.7 + Tcy(clk)
ns
[3]
[3]
[1]
Parameters are shown as RDn or WDn in Figure 17 as indicated in the Conditions column.
[2]
Parameters specified for 40 % of VDD(3V3) for rising edges and 60 % of VDD(3V3) for falling edges.
[3]
Tcy(clk) = 1/CCLK (see LPC408x/7x User manual).
[4]
Latest of address valid, EMC_CSx LOW, EMC_OE LOW, EMC_BLSx LOW (PB = 1).
[5]
After End Of Read (EOR): Earliest of EMC_CSx HIGH, EMC_OE HIGH, EMC_BLSx HIGH (PB = 1), address invalid.
[6]
End Of Write (EOW): Earliest of address invalid, EMC_CSx HIGH, EMC_BLSx HIGH (PB = 1).
EMC_Ax
RD1
WR1
EMC_CSx
WR8
RD2
RD4
EMC_OE
RD7
WR9
WR10
WR11
EMC_BLSx
EMC_WE
RD5
RD5
RD5
RD6
WR2
WR12
EMC_Dx
EOR
EOW
002aag214
Fig 17. External static memory read/write access (PB = 0)
LPC408X_7X
Objective data sheet
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EMC_Ax
RD1
WR1
EMC_CSx
WR8
RD2
RD4
EMC_OE
RD3
WR4
RD7
EMC_BLSx
WR8
RD7
WR3
WR5
WR7
EMC_WE
RD5
RD5
RD5
RD6
RD5
WR2
WR6
EMC_Dx
EOR
EOW
002aag215
Fig 18. External static memory read/write access (PB =1)
EMC_Ax
EMC_CSx
EMC_OE
EMC_BLSx
EMC_WE
RD5
RD5
RD5
RD5
EMC_Dx
002aag216
Fig 19. External static memory burst read cycle
Table 16.
Dynamic characteristics: Dynamic external memory interface, read strategy bits
(RD bits) = 00
CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. All programmable delays
EMCDLYCTL are bypassed. Values guaranteed by design.
Symbol
Parameter
Min
Max
Unit
12.5
-
ns
Common to read and write cycles
LPC408X_7X
Objective data sheet
[1]
Tcy(clk)
clock cycle time
td(SV)
chip select valid delay time
2.9
6.2
ns
th(S)
chip select hold time
1.2
3.3
ns
td(RASV)
row address strobe valid delay time
2.8
6.2
ns
th(RAS)
row address strobe hold time
1.3
3.5
ns
td(CASV)
column address strobe valid delay time
2.8
6.2
ns
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Table 16.
Dynamic characteristics: Dynamic external memory interface, read strategy bits
(RD bits) = 00 …continued
CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. All programmable delays
EMCDLYCTL are bypassed. Values guaranteed by design.
Symbol
Parameter
Min
Max
Unit
th(CAS)
column address strobe hold time
1.3
3.5
ns
td(WV)
write valid delay time
3.6
7.7
ns
th(W)
write hold time
1.6
4.2
ns
td(AV)
address valid delay time
3.4
7.4
ns
th(A)
address hold time
1.1
3.0
ns
Read cycle parameters
tsu(D)
th(D)
data input set-up time
[2]
5.3
1.5
ns
data input hold time
[3]
3.7
5.2
ns
Write cycle parameters
td(QV)
data output valid delay time
3.9
8.7
ns
th(Q)
data output hold time
0.2
1.6
ns
[1]
Refers to SDRAM clock signal EMC_CLKx.
[2]
The data input set-up time has to be selected with the following margin:
tsu(D) + delay time of feedback clock  SDRAM access time  board delay time  0.
[3]
The data input hold time has to be selected with the following margin:
th(D) + SDRAM access time  board delay time  delay time of feedback clock  0.
Table 17.
Dynamic characteristics: Dynamic external memory interface, read strategy bits
(RD bits) = 01
CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. All programmable delays
EMCDLYCTL are bypassed. Values guaranteed by design.
Symbol
Parameter
Min
Max
Unit
12.5
-
ns
Common to read and write cycles
Tcy(clk)
clock cycle time
[1]
td(SV)
chip select valid delay time
2.7
6.0
ns
th(S)
chip select hold time
1.0
3.1
ns
td(RASV)
row address strobe valid delay time
2.7
6.0
ns
th(RAS)
row address strobe hold time
1.1
3.3
ns
td(CASV)
column address strobe valid delay time
2.7
6.1
ns
th(CAS)
column address strobe hold time
1.2
3.3
ns
td(WV)
write valid delay time
3.2
7.1
ns
th(W)
write hold time
1.6
4.2
ns
td(AV)
address valid delay time
3.3
7.3
ns
th(A)
address hold time
1.0
2.8
ns
Read cycle parameters
tsu(D)
th(D)
data input set-up time
[2]
5.3
1.5
ns
data input hold time
[3]
3.7
5.2
ns
Write cycle parameters
LPC408X_7X
Objective data sheet
td(QV)
data output valid delay time
3.3
7.3
ns
th(Q)
data output hold time
0.2
1.6
ns
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[1]
Refers to SDRAM clock signal EMC_CLKx.
[2]
The data input set-up time has to be selected with the following margin:
tsu(D) + delay time of feedback clock  SDRAM access time  board delay time  0.
[3]
The data input hold time has to be selected with the following margin:
th(D) + SDRAM access time - board delay time - delay time of feedback clock  0.
Tcy(clk)
EMC_CLKn
delay = 0
td(xV)
EMC_DYCSn,
EMC_RAS,
EMC_CAS,
EMC_WE,
EMC_CKEOUTn,
EMC_A[22:0],
EMC_DQMOUTn
th(x)
td(QV)
th(Q)
EMC_D[31:0]
write
tsu(D)
th(D)
EMC_D[31:0]
read
002aah129
Fig 20. Dynamic external memory interface signal timing
Table 18.
Dynamic characteristics: Dynamic external memory interface programmable
clock delays
CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V.Values guaranteed by design.
Symbol
Parameter
Conditions
Min
Max
Unit
td
delay time
Programmable delay block 0 (CMDDLY
or CLKOUTnDLY bit 0 = 1)
[1]
0.1
0.2
ns
Programmable delay block 1 (CMDDLY
or CLKOUTnDLY bit 1 = 1)
[1]
0.2
0.5
ns
Programmable delay block 2 (CMDDLY
or CLKOUTnDLY bit 2 = 1)
[1]
0.5
1.3
ns
Programmable delay block 3 (CMDDLY
or CLKOUTnDLY bit 3 = 1)
[1]
1.2
2.9
ns
Programmable delay block 4 (CMDDLY
or CLKOUTnDLY bit 4 = 1)
[1]
2.4
6.0
ns
[1]
LPC408X_7X
Objective data sheet
The programmable delay blocks are controlled by the EMCDLYCTL register in the EMC register block. All
delay times are incremental delays for each element starting from delay block 0. See the LPC408x/7x user
manual for details.
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11.3 External clock
Table 19. Dynamic characteristic: external clock (see Figure 37)
Tamb = 40 C to +85 C; VDD(3V3) over specified ranges.[1]
Min
Typ[2]
Max
Unit
oscillator frequency
1
-
25
MHz
Tcy(clk)
clock cycle time
40
-
1000
ns
tCHCX
clock HIGH time
Tcy(clk)  0.4
-
-
ns
tCLCX
clock LOW time
Tcy(clk)  0.4
-
-
ns
tCLCH
clock rise time
-
-
5
ns
tCHCL
clock fall time
-
-
5
ns
Symbol
Parameter
fosc
Conditions
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
tCHCL
tCHCX
tCLCH
tCLCX
Tcy(clk)
002aaa907
Fig 21. External clock timing (with an amplitude of at least Vi(RMS) = 200 mV)
11.4 Internal oscillators
Table 20. Dynamic characteristic: internal oscillators
Tamb = 40 C to +85 C; 2.7 V  VDD(3V3)  3.6 V.[1]
Symbol
Parameter
Conditions
Min
Typ[2]
Max
Unit
fosc(RC)
internal RC oscillator
frequency
-
11.88
12
12.12
MHz
fi(RTC)
RTC input frequency
-
-
32.768 -
kHz
[1]
Parameters are valid over operating temperature range unless otherwise specified.
[2]
Typical ratings are not guaranteed. The values listed are at room temperature (25 C), nominal supply
voltages.
11.5 I/O pins
Table 21. Dynamic characteristic: I/O pins[1]
Tamb = 40 C to +85 C; VDD(3V3) over specified ranges.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tr
rise time
pin configured as
output
3.0
-
5.0
ns
tf
fall time
pin configured as
output
2.5
-
5.0
ns
[1]
LPC408X_7X
Objective data sheet
Applies to standard port pins and RESET pin. For details, see the LPC408x/7x IBIS model available on the
NXP website.
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32-bit ARM Cortex-M4 microcontroller
11.6 SSP interface
Table 22. Dynamic characteristics: SSP pins in SPI mode
CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design.
Symbol
Parameter
Conditions
clock cycle time
full-duplex
mode
Min
Max
Unit
30
-
ns
30
-
ns
SSP master
Tcy(clk)
[1]
when only
transmitting
tDS
data set-up time
in SPI mode
[2]
14.8
-
ns
tDH
data hold time
in SPI mode
[2]
2
-
ns
data output valid time in SPI mode
[2]
-
6.3
ns
data output hold time in SPI mode
[2]
2.4
-
ns
tv(Q)
th(Q)
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32-bit ARM Cortex-M4 microcontroller
Table 22. Dynamic characteristics: SSP pins in SPI mode
CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design.
Symbol
Parameter
Conditions
Min
Max
Unit
SSP slave
Tcy(PCLK)
PCLK cycle time
120
-
ns
[3][4]
14.8
-
ns
in SPI mode
[3][4]
2
-
ns
data output valid time in SPI mode
[3][4]
-
6.3
ns
data output hold time in SPI mode
[3][4]
2.4
-
ns
clock cycle time
tDS
data set-up time
tv(Q)
th(Q)
[1]
ns
in SPI mode
Tcy(clk)
tDH
10
[3]
data hold time
Tcy(clk) = (SSPCLKDIV  (1 + SCR)  CPSDVSR) / fmain. 1The clock cycle time derived from the SPI bit rate
Tcy(clk) is a function of the main clock frequency fmain, the SSP peripheral clock divider (SSPCLKDIV), the
SSP SCR parameter (specified in the SSP0CR0 register), and the SSP CPSDVSR parameter (specified in
the SSP clock prescale register).
[2]
Tamb = 40 C to 85 C; VDD(3V3) = 3.0 V to 3.6 V.
[3]
Tcy(clk) = 12  Tcy(PCLK).
[4]
Tamb = 25 C; VDD(3V3) = 3.3 V.
Tcy(clk)
tclk(H)
tclk(L)
SCK (CPOL = 0)
SCK (CPOL = 1)
tv(Q)
th(Q)
DATA VALID
MOSI
DATA VALID
tDS
DATA VALID
MISO
tDH
DATA VALID
tv(Q)
MOSI
th(Q)
DATA VALID
DATA VALID
tDH
tDS
MISO
CPHA = 1
DATA VALID
CPHA = 0
DATA VALID
002aae829
Fig 22. SSP master timing in SPI mode
LPC408X_7X
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Tcy(clk)
tclk(H)
tclk(L)
tDS
tDH
SCK (CPOL = 0)
SCK (CPOL = 1)
MOSI
DATA VALID
DATA VALID
tv(Q)
MISO
th(Q)
DATA VALID
tDS
MOSI
DATA VALID
tDH
DATA VALID
tv(Q)
MISO
CPHA = 1
DATA VALID
th(Q)
DATA VALID
CPHA = 0
DATA VALID
002aae830
Fig 23. SSP slave timing in SPI mode
11.7 I2C-bus
Table 23. Dynamic characteristic: I2C-bus pins[1]
Tamb = 40 C to +85 C.[2]
Symbol
Parameter
Conditions
Min
Max
Unit
fSCL
SCL clock
frequency
Standard-mode
0
100
kHz
tf
[4][5][6][7]
fall time
Fast-mode
0
400
kHz
Fast-mode Plus
0
1
MHz
of both SDA and
SCL signals
-
300
ns
Fast-mode
20 + 0.1  Cb
300
ns
Fast-mode Plus
-
120
ns
Standard-mode
4.7
-
s
Fast-mode
1.3
-
s
Fast-mode Plus
0.5
-
s
Standard-mode
4.0
-
s
Standard-mode
tLOW
tHIGH
LPC408X_7X
Objective data sheet
LOW period of
the SCL clock
HIGH period of
the SCL clock
Fast-mode
0.6
-
s
Fast-mode Plus
0.26
-
s
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Table 23. Dynamic characteristic: I2C-bus pins[1]
Tamb = 40 C to +85 C.[2]
Symbol
Parameter
tHD;DAT
data hold time
data set-up
time
tSU;DAT
[3][4][8]
[9][10]
Conditions
Min
Max
Unit
Standard-mode
0
-
s
Fast-mode
0
-
s
Fast-mode Plus
0
-
s
Standard-mode
250
-
ns
Fast-mode
100
-
ns
Fast-mode Plus
50
-
ns
[1]
See the I2C-bus specification UM10204 for details.
[2]
Parameters are valid over operating temperature range unless otherwise specified.
[3]
tHD;DAT is the data hold time that is measured from the falling edge of SCL; applies to data in transmission
and the acknowledge.
[4]
A device must internally provide a hold time of at least 300 ns for the SDA signal (with respect to the
VIH(min) of the SCL signal) to bridge the undefined region of the falling edge of SCL.
[5]
Cb = total capacitance of one bus line in pF.
[6]
The maximum tf for the SDA and SCL bus lines is specified at 300 ns. The maximum fall time for the SDA
output stage tf is specified at 250 ns. This allows series protection resistors to be connected in between the
SDA and the SCL pins and the SDA/SCL bus lines without exceeding the maximum specified tf.
[7]
In Fast-mode Plus, fall time is specified the same for both output stage and bus timing. If series resistors
are used, designers should allow for this when considering bus timing.
[8]
The maximum tHD;DAT could be 3.45 s and 0.9 s for Standard-mode and Fast-mode but must be less than
the maximum of tVD;DAT or tVD;ACK by a transition time (see UM10204). This maximum must only be met if
the device does not stretch the LOW period (tLOW) of the SCL signal. If the clock stretches the SCL, the
data must be valid by the set-up time before it releases the clock.
[9]
tSU;DAT is the data set-up time that is measured with respect to the rising edge of SCL; applies to data in
transmission and the acknowledge.
[10] A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system but the requirement tSU;DAT =
250 ns must then be met. This will automatically be the case if the device does not stretch the LOW period
of the SCL signal. If such a device does stretch the LOW period of the SCL signal, it must output the next
data bit to the SDA line tr(max) + tSU;DAT = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus
specification) before the SCL line is released. Also the acknowledge timing must meet this set-up time.
tf
SDA
tSU;DAT
70 %
30 %
70 %
30 %
tHD;DAT
tf
70 %
30 %
SCL
tVD;DAT
tHIGH
70 %
30 %
70 %
30 %
70 %
30 %
tLOW
S
1 / fSCL
002aaf425
Fig 24. I2C-bus pins clock timing
LPC408X_7X
Objective data sheet
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LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
11.8 I2S-bus interface
Table 24. Dynamic characteristics: I2S-bus interface pins
CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design.
Symbol
Parameter
Conditions
Min
Max
Unit
common to input and output
tr
rise time
[1]
-
6.7
ns
tf
fall time
[1]
-
8.0
ns
tWH
pulse width HIGH
on pins I2S_TX_SCK and
I2S_RX_SCK
[1]
25
-
-
tWL
pulse width LOW
on pins I2S_TX_SCK and
I2S_RX_SCK
[1]
-
25
ns
data output valid time
on pin I2S_TX_SDA;
[1]
-
6
ns
data input set-up time
on pin I2S_RX_SDA
[1]
5
-
ns
on pin I2S_RX_SDA
[1]
2
-
ns
output
tv(Q)
input
tsu(D)
th(D)
[1]
data input hold time
CCLK = 100 MHz; peripheral clock to the I2S-bus interface PCLK = CCLK / 4. I2S clock cycle time Tcy(clk) =
1600 ns, corresponds to the SCK signal in the I2S-bus specification.
Tcy(clk)
tf
tr
I2S_TX_SCK
tWH
tWL
I2S_TX_SDA
tv(Q)
I2S_TX_WS
tv(Q)
002aag202
Fig 25. I2S-bus timing (transmit)
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Tcy(clk)
tf
tr
I2S_RX_SCK
tWH
tWL
I2S_RX_SDA
tsu(D)
th(D)
I2S_RX_WS
tsu(D)
002aag203
tsu(D)
Fig 26. I2S-bus timing (receive)
11.9 LCD
Remark: The LCD controller is available on parts LPC4088.
Table 25. Dynamic characteristics: LCD
CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design.
Symbol
Parameter
Conditions
Min
Max
Unit
fclk
clock frequency
on pin LCD_DCLK
-
50
MHz
td(QV)
data output valid delay time
-
12
ns
th(Q)
data output hold time
0.5
-
ns
Tcy(clk)
LCD_DCLK
td(QV)
th(Q)
LCD_VD[n]
002aah325
The LCD panel clock is shown with the default polarity. The clock can be inverted via the IPC bit in
the LCD_POL register. Typically, the LCD panel uses the falling edge of the LCD_DCLK to sample
the data.
Fig 27. LCD timing
11.10 SD/MMC
Remark: The SD/MMC card interface is available on parts LPC4088/78/76.
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Table 26. Dynamic characteristics: SD/MMC
CL = 10 pF, Tamb = 40 C to 85 C, VDD(3V3) = 3.0 V to 3.6 V. Values guaranteed by design.
Symbol
Parameter
fclk
clock frequency
Conditions
Min
on pin SD_CLK; data transfer mode
-
on pin SD_CLK; identification mode
Max
Unit
25
MHz
25
MHz
tsu(D)
data input set-up
time
on pins SD_CMD, SD_DAT[3:0] as
inputs
6
-
ns
th(D)
data input hold time on pins SD_CMD, SD_DAT[3:0] as
inputs
6
-
ns
td(QV)
data output valid
delay time
on pins SD_CMD, SD_DAT[3:0] as
outputs
-
23
ns
th(Q)
data output hold
time
on pins SD_CMD, SD_DAT[3:0] as
outputs
3.5
-
ns
Tcy(clk)
SD_CLK
td(QV)
th(Q)
SD_CMD (O)
SD_DATn (O)
tsu(D)
th(D)
SD_CMD (I)
SD_DATn (I)
002aag204
Fig 28. SD/MMC timing
12. Characteristics of the analog peripherals
12.1 ADC electrical characteristics
Table 27. 12-bit ADC characteristics
VDDA = 2.7 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified.
Symbol
Parameter
Conditions
VIA
analog input voltage
Min
Typ
Max
Unit
0
-
VDDA
V
[1][2][3]
-
-
1
LSB
12-bit resolution; 400 kSamples/sec
LPC408X_7X
Objective data sheet
ED
differential linearity
error
EL(adj)
integral non-linearity
[1][4]
-
-
6
LSB
EO
offset error
[1][5]
-
-
5
LSB
EG
gain error
[1][6]
-
-
5
LSB
ET
absolute error
[1][7]
-
-
<8
LSB
fclk(ADC)
ADC clock frequency
-
-
12.4
MHz
fc(ADC)
ADC conversion
frequency
-
-
400
kHz
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Table 27. 12-bit ADC characteristics …continued
VDDA = 2.7 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified.
Symbol
Parameter
Conditions
Cia
analog input
capacitance
Rvsi
voltage source
interface resistance
Min
Typ
Max
Unit
-
-
5
pF
[8]
-
-
1
k
[1][2][3]
-
1
-
LSB
8-bit resolution[9]; 1.16 MSamples/sec
ED
differential linearity
error
EL(adj)
integral non-linearity
[1][4]
-
1
-
LSB
offset error
[1][5]
-
1
-
LSB
gain error
[1][6]
-
1
-
LSB
[1][7]
EO
EG
LPC408X_7X
Objective data sheet
ET
absolute error
-
-
<1.5
LSB
fclk(ADC)
ADC clock frequency
-
-
36
MHz
fc(ADC)
ADC conversion
frequency
-
-
1.16
MHz
Cia
analog input
capacitance
-
-
5
pF
Rvsi
voltage source
interface resistance
-
-
1
k
[8]
[1]
Conditions: VSSA = 0 V, VDDA = 3.3 V.
[2]
The ADC is monotonic, there are no missing codes.
[3]
The differential linearity error (ED) is the difference between the actual step width and the ideal step width.
See Figure 29.
[4]
The integral non-linearity (EL(adj)) is the peak difference between the center of the steps of the actual and
the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 29.
[5]
The offset error (EO) is the absolute difference between the straight line which fits the actual curve and the
straight line which fits the ideal curve. See Figure 29.
[6]
The gain error (EG) is the relative difference in percent between the straight line fitting the actual transfer
curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 29.
[7]
The absolute error (ET) is the maximum difference between the center of the steps of the actual transfer
curve of the non-calibrated ADC and the ideal transfer curve. See Figure 29.
[8]
See Figure 30.
[9]
8-bit resolution is achieved by ignoring the lower four bits of the ADC conversion result.
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offset
error
EO
gain
error
EG
4095
4094
4093
4092
4091
4090
(2)
7
code
out
(1)
6
5
(5)
4
(4)
3
(3)
2
1 LSB
(ideal)
1
0
1
2
3
4
5
6
7
4090
4091
4092
4093
4094
4095
4096
VIA (LSBideal)
offset error
EO
1 LSB =
VREFP - VSS
4096
002aaf436
(1) Example of an actual transfer curve.
(2) The ideal transfer curve.
(3) Differential linearity error (ED).
(4) Integral non-linearity (EL(adj)).
(5) Center of a step of the actual transfer curve.
Fig 29. 12-bit ADC characteristics
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LPC408x/7x
C3
1.6 pF
ADC
COMPARATOR
BLOCK
Rcmp
90 Ω - 300 Ω
C1
110 fF
Rsw
500 Ω - 2 kΩ
AD0[n]
C2
80 fF
Cia
Rvsi
VSS
VEXT
002aah275
The values of resistor components Rcmp and Rsw vary with temperature and input voltage and are
process-dependent.
Fig 30. ADC interface to pins ADC0_IN[n]
Table 28.
ADC interface components
Component
Range
Description
Rcmp
90  to 300 
Switch-on resistance for the comparator input switch. Varies
with temperature, input voltage, and process.
Rsw
500  to 2 k
Switch-on resistance for channel selection switch. Varies with
temperature, input voltage, and process.
C1
110 fF
Parasitic capacitance from the ADC block level.
C2
80 fF
Parasitic capacitance from the ADC block level.
C3
1.6 pF
Sampling capacitor.
12.2 DAC electrical characteristics
Table 29. 10-bit DAC electrical characteristics
VDDA = 2.7 V to 3.6 V; Tamb = 40 C to +85 C unless otherwise specified
Symbol
Parameter
ED
Conditions
Min
Typ
Max
Unit
differential linearity
error
-
1
-
LSB
EL(adj)
integral non-linearity
-
1.5
-
LSB
EO
offset error
-
0.6
-
%
EG
gain error
-
0.6
-
%
CL
load capacitance
-
-
200
pF
RL
load resistance
1
-
-
k
12.3 Comparator electrical characteristics
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Table 30. Comparator characteristics
VDDA= 3.0 V and Tamb = 25 C unless noted otherwise.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Static characteristics
IDD
supply current
-
55
-
A
VIC
common-mode input voltage
0
-
VDDA
V
DVO
output voltage variation
0
-
VDDA
V
Voffset
offset voltage
VIC = 0.1 V
-
4 to +4.2 -
mV
VIC = 1.5 V
-
2
mV
VIC = 2.8 V
-
2.5
-
4
-
s
-
mV
Dynamic characteristics
tstartup
start-up time
nominal process
tPD
propagation delay
HIGH to LOW; VDDA = 3.3 V;
propagation delay
tPD
VIC = 0.1 V; 50 mV overdrive input
[1]
122
130
142
ns
VIC = 0.1 V; rail-to-rail input
[1]
173
189
233
ns
VIC = 1.5 V; 50 mV overdrive input
[1]
101
108
119
ns
VIC = 1.5 V; rail-to-rail input
[1]
114
127
162
ns
VIC = 2.9 V; 50 mV overdrive input
[1]
123
134
143
ns
VIC = 2.9 V; rail-to-rail input
[1]
79
91
120
ns
VIC = 0.1 V; 50 mV overdrive input
[1]
221
232
254
ns
VIC = 0.1 V; rail-to-rail input
[1]
59
63
68
ns
VIC = 1.5 V; 50 mV overdrive input
[1]
183
229
249
ns
VIC = 1.5 V; rail-to-rail input
[1]
147
174
213
ns
VIC = 2.9 V; 50 mV overdrive input
[1]
171
192
216
ns
VIC = 2.9 V; rail-to-rail input
[1]
LOW to HIGH; VDDA = 3.3 V;
235
305
450
ns
Vhys
hysteresis voltage
positive hysteresis; VDDA = 3.0 V;
VIC = 1.5 V
[2]
-
5, 10, 20
-
mV
Vhys
hysteresis voltage
negative hysteresis; VDDA = 3.0 V;
VIC = 1.5 V
[2]
-
5, 10, 20
-
mV
Rlad
ladder resistance
-
-
1.034
-
M
[1]
CL = 10 pF; results from measurements on silicon samples over process corners and over the full temperature range Tamb = -40 C to
+85 C.
[2]
Input hysteresis is relative to the reference input channel and is software programmable.
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Table 31.
Symbol
Comparator voltage ladder dynamic characteristics
Parameter
Conditions
ts(pu)
power-up settling
time
to 99% of voltage
ladder output
value
[1]
ts(sw)
switching settling
time
to 99% of voltage
ladder output
value
[1]
Min
Typ
Max
Unit
-
-
30
s
-
-
15
s
[2]
[1]
Maximum values are derived from worst case simulation (VDDA = 2.6 V; Tamb = 85 C; slow process
models).
[2]
Settling time applies to switching between comparator and ADC channels.
Table 32. Comparator voltage ladder reference static characteristics
VDDA = 3.3 V; Tamb = -40 C to + 85C.
Max[1]
Unit
decimal code = 00
0
0
0
%
decimal code = 08
0.45
0.5
0.55
%
decimal code = 16
0.99
1.1
1.21
%
decimal code = 24
1.26
1.4
1.54
%
decimal code = 30
1.35
1.5
1.65
%
decimal code = 31
1.35
1.5
1.65
%
decimal code = 00
0
0
0
%
decimal code = 08
0.44
0.4
0.36
%
decimal code = 16
0.18
0.2
0.22
%
decimal code = 24
0.45
0.5
0.55
%
decimal code = 30
0.54
0.6
0.66
%
decimal code = 31
0.45
0.5
0.55
%
Conditions
EV(O)
output voltage error
Internal VDDA supply
[1]
Objective data sheet
Typ
Parameter
EV(O)
LPC408X_7X
Min
Symbol
output voltage error
External VDDCMP
supply
Measured on typical silicon samples with a 2 kHz input signal and overdrive < 100 V. Power switched off
to all analog peripherals except the comparator.
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13. Application information
13.1 Suggested USB interface solutions
Remark: The USB controller is available as a device/Host/OTG controller on parts
LPC4088 and LPC4078/76 and as device-only controller on parts LPC4074/72.
VDD(3V3)
USB_UP_LED
USB_CONNECT
LPC40xx
SoftConnect switch
R1
1.5 kΩ
VBUS
USB_D+ RS = 33 Ω
USB_D-
USB-B
connector
RS = 33 Ω
VSS
002aah267
Fig 31. USB interface on a self-powered device
VDD(3V3)
R2
LPC40xx
USB_UP_LED
R1
1.5 kΩ
VBUS
USB_D+ RS = 33 Ω
USB_D-
RS = 33 Ω
USB-B
connector
VSS
002aah268
Fig 32. USB interface on a bus-powered device
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VDD
R1
R2
R3
R4
RSTOUT
RESET_N
VBUS
ADR/PSW
ID
OE_N/INT_N
VDD
SPEED
SUSPEND
R4
R5
ISP1302
DP
33 Ω
DM
33 Ω
R6
USB_SCL1
SCL
USB_SDA1
SDA
USB_INT1
Mini-AB
connector
VSSIO,
VSSCORE
INT_N
USB_D+1
USB_D-1
VDD
USB_UP_LED1
LPC408x/7x
R7
5V
VDD
IN
USB_PPWR2
ENA
LM3526-L
OUTA
FLAGA
USB_OVRCR2
VBUS
USB_PWRD2
USB_D+2
33 Ω
D+
USB_D-2
33 Ω
D15 kΩ
15 kΩ
USB-A
connector
VSSIO,
VSSCORE
VDD
USB_UP_LED2
R8
002aah269
Fig 33. USB OTG port configuration: port 1 OTG dual-role device, port 2 host
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VDD
RSTOUT
RESET_N
OE_N/INT_N
USB_TX_E1
USB_TX_DP1
DAT_VP
USB_TX_DM1
SE0_VM
RCV
USB_RCV1
USB_RX_DP1
USB_RX_DM1
VP
VBUS
VM
ID
VDD
ISP1302
LPC408x/7x
ADR/PSW
SPEED
DP
33 Ω
DM
33 Ω
USB MINI-AB
connector
VSSIO,
VSSCORE
SUSPEND
USB_SCL1
SCL
SDA
USB_SDA1
INT_N
USB_INT1
VDD
USB_UP_LED1
002aah270
Fig 34. USB OTG port configuration: VP_VM mode
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VDD
USB_UP_LED1
VSSIO,
VSSCORE
USB_D+1
33 Ω
D+
USB_D-1
33 Ω
D15 kΩ
USB-A
connector
15 kΩ
VDD
VBUS
USB_PWRD1
USB_OVRCR1
USB_PPWR1
FLAGA
ENA
OUTA
5V
IN
LPC408x/7x
USB_PPWR2
LM3526-L
ENB
VDD
OUTB
FLAGB
USB_OVRCR2
VBUS
USB_PWRD2
USB_D+2
33 Ω
USB_D-2
33 Ω
D+
USB-A
connector
D15 kΩ
VSSIO,
15 kΩ
VSSCORE
VDD
USB_UP_LED2
002aah271
Fig 35. USB host port configuration: port 1 and port 2 as hosts
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VDD
USB_UP_LED1
VSSIO,
VSSCORE
USB_D+1
33 Ω
D+
USB_D-1
33 Ω
D15 kΩ
USB-A
connector
15 kΩ
VDD
VBUS
USB_PWRD1
USB_OVRCR1
USB_PPWR1
FLAGA
ENA
5V
IN
LM3526-L
OUTA
LPC408x/7x
VDD
USB_UP_LED2
VDD
USB_CONNECT2
VSSIO,
VSSCORE
USB_D+2
33 Ω
D+
USB_D-2
33 Ω
D-
VBUS
USB-B
connector
VBUS
002aah272
Fig 36. USB device port configuration: port 1 host and port 2 device
13.2 Crystal oscillator XTAL input and component selection
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
Ci = 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground Cg which attenuates the input voltage by a factor Ci/(Ci + Cg). In slave
mode, a minimum of 200 mV(RMS) is needed.
LPC40xx
XTAL1
Ci
100 pF
Cg
002aah273
Fig 37. Slave mode operation of the on-chip oscillator
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In slave mode the input clock signal should be coupled by means of a capacitor of 100 pF
(Figure 37), with an amplitude between 200 mV(RMS) and 1000 mV(RMS). This
corresponds to a square wave signal with a signal swing of between 280 mV and 1.4 V.
The XTALOUT pin in this configuration can be left unconnected.
External components and models used in oscillation mode are shown in Figure 38 and in
Table 33 and Table 34. Since the feedback resistance is integrated on chip, only a crystal
and the capacitances CX1 and CX2 need to be connected externally in case of
fundamental mode oscillation (the fundamental frequency is represented by L, CL and
RS). Capacitance CP in Figure 38 represents the parallel package capacitance and should
not be larger than 7 pF. Parameters FOSC, CL, RS and CP are supplied by the crystal
manufacturer.
LPC40xx
L
XTALIN
XTALOUT
=
CL
CP
XTAL
RS
CX2
CX1
002aah274
Fig 38. Oscillator modes and models: oscillation mode of operation and external crystal
model used for CX1/CX2 evaluation
Table 33.
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters): low frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1/CX2
1 MHz - 5 MHz
10 pF
< 300 
18 pF, 18 pF
20 pF
< 300 
39 pF, 39 pF
30 pF
< 300 
57 pF, 57 pF
10 pF
< 300 
18 pF, 18 pF
20 pF
< 200 
39 pF, 39 pF
30 pF
< 100 
57 pF, 57 pF
10 MHz - 15 MHz
10 pF
< 160 
18 pF, 18 pF
20 pF
< 60 
39 pF, 39 pF
15 MHz - 20 MHz
10 pF
< 80 
18 pF, 18 pF
5 MHz - 10 MHz
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NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Table 34.
Recommended values for CX1/CX2 in oscillation mode (crystal and external
components parameters): high frequency mode
Fundamental oscillation
frequency FOSC
Crystal load
capacitance CL
Maximum crystal
series resistance RS
External load
capacitors CX1, CX2
15 MHz - 20 MHz
10 pF
< 180 
18 pF, 18 pF
20 pF
< 100 
39 pF, 39 pF
10 pF
< 160 
18 pF, 18 pF
20 pF
< 80 
39 pF, 39 pF
20 MHz - 25 MHz
13.3 XTAL Printed-Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors Cx1, Cx2, and Cx3 in case of
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of Cx1 and Cx2 should be chosen smaller
accordingly to the increase in parasitics of the PCB layout.
13.4 Standard I/O pin configuration
Figure 39 shows the possible pin modes for standard I/O pins with analog input function:
•
•
•
•
•
Digital output driver: Open-drain mode enabled/disabled
Digital input: Pull-up enabled/disabled
Digital input: Pull-down enabled/disabled
Digital input: Repeater mode enabled/disabled
Analog input
The default configuration for standard I/O pins is input with pull-up enabled. The weak
MOS devices provide a drive capability equivalent to pull-up and pull-down resistors.
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VDD
VDD
open-drain enable
pin configured
as digital output
driver
strong
pull-up
output enable
ESD
data output
PIN
strong
pull-down
ESD
VSS
VDD
weak
pull-up
pull-up enable
pin configured
as digital input
weak
pull-down
repeater mode
enable
pull-down enable
data input
select analog input
pin configured
as analog input
analog input
002aaf272
Fig 39. Standard I/O pin configuration with analog input
13.5 Reset pin configuration
VDD
VDD
VDD
Rpu
reset
ESD
20 ns RC
GLITCH FILTER
PIN
ESD
VSS
002aaf274
Fig 40. Reset pin configuration
13.6 Reset pin configuration for RTC operation
Under certain circumstances, the RTC may temporarily pause and lose fractions of a
second during the rising and falling edges of the RESET signal.
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To eliminate the loss of time counts in the RTC due to voltage swing or ramp rate of the
RESET signal, connect an RC filter between the RESET pin and the external reset input.
10 kΩ
RESET pin
0.1 μF
External
RESET input
002aag552
Fig 41. Reset input with RC filter
LPC408X_7X
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14. Package outline
LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm
SOT459-1
c
y
X
A
105
156
157
104
ZE
e
E HE
(A 3)
A A2 A1
wM
θ
Lp
bp
L
detail X
pin 1 index
208
53
1
52
v M A
ZD
wM
bp
e
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
28.1
27.9
28.1
27.9
0.5
HD
HE
30.15 30.15
29.85 29.85
L
Lp
v
w
y
ZD
ZE
θ
1
0.75
0.45
0.12
0.08
0.08
1.43
1.08
1.43
1.08
7o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT459-1
136E30
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-02-06
03-02-20
Fig 42. LQFP208 package
LPC408X_7X
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32-bit ARM Cortex-M4 microcontroller
TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm
B
D
SOT950-1
A
ball A1
index area
A2
A
E
A1
detail X
e1
∅v
∅w
b
e
M
M
C
C A B
C
y
y1 C
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
e
e2
ball A1
index area
1
3
2
4
5
6
7
8
9
10
11
12
13
14
15
16
17
X
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A1
A2
b
D
E
e
e1
e2
v
w
y
y1
mm
1.2
0.4
0.3
0.8
0.6
0.5
0.4
15.1
14.9
15.1
14.9
0.8
12.8
12.8
0.15
0.08
0.12
0.1
OUTLINE
VERSION
REFERENCES
IEC
SOT950-1
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
06-06-01
06-06-14
---
Fig 43. TFBGA208 package
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32-bit ARM Cortex-M4 microcontroller
TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm
D
SOT570-2
A
B
ball A1
index area
A
A2
E
A1
detail X
C
e1
e
∅v M C A B
∅wM C
b
1/2 e
y1 C
y
P
N
e
M
L
K
J
H
e2
G
F
1/2 e
E
D
C
B
A
ball A1
index area
1
2
3
4
5
6
7
8
9 10 11 12 13 14
X
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
b
D
E
e
e1
e2
v
w
y
y1
mm
1.2
0.35
0.25
0.85
0.75
0.5
0.4
12.2
11.8
12.2
11.8
0.8
10.4
10.4
0.15
0.08
0.12
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
03-03-03
06-03-14
SOT570-2
Fig 44. TFBGA180 package
LPC408X_7X
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LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
SOT486-1
c
y
X
A
73
72
108
109
ZE
e
E HE
A A2
(A 3)
A1
θ
wM
Lp
bp
L
pin 1 index
detail X
37
144
1
36
v M A
ZD
wM
bp
e
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
20.1
19.9
20.1
19.9
0.5
HD
HE
22.15 22.15
21.85 21.85
L
Lp
v
w
y
1
0.75
0.45
0.2
0.08
0.08
Z D(1) Z E(1)
1.4
1.1
1.4
1.1
θ
7o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT486-1
136E23
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-03-14
03-02-20
Fig 45. LQFP144 package
LPC408X_7X
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LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
LQFP80: plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm
SOT315-1
c
y
X
A
60
41
40 Z E
61
e
E HE
A A2
(A 3)
A1
w M
θ
bp
Lp
L
pin 1 index
80
21
detail X
20
1
ZD
e
v M A
w M
bp
D
B
HD
v M B
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
mm
1.6
0.16
0.04
1.5
1.3
0.25
0.27
0.13
0.18
0.12
12.1
11.9
12.1
11.9
0.5
HD
HE
14.15 14.15
13.85 13.85
L
Lp
v
w
y
1
0.75
0.30
0.2
0.15
0.1
Z D (1) Z E (1)
θ
1.45
1.05
7o
o
0
1.45
1.05
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT315-1
136E15
MS-026
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
03-02-25
Fig 46. LQFP80 package
LPC408X_7X
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15. Soldering
Footprint information for reflow soldering of LQFP208 package
SOT459-1
Hx
Gx
P2
Hy
(0.125)
P1
Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1
0.500
P2
Ax
Ay
Bx
By
0.560 31.300 31.300 28.300 28.300
C
D1
D2
1.500
0.280
0.400
Gx
Gy
Hx
Hy
28.500 28.500 31.550 31.550
sot459-1_fr
Fig 47. Reflow soldering of the LQFP208 package
LPC408X_7X
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NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Footprint information for reflow soldering of TFBGA180 package
SOT570-2
Hx
P
P
Hy
see detail X
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
SL
SP
occupied area
SR
solder resist
detail X
DIMENSIONS in mm
P
SL
SP
SR
0.80
0.400
0.400
0.550
Hx
Hy
12.575 12.575
sot570-2_fr
Fig 48. Reflow soldering of the TFBGA180 package
LPC408X_7X
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NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Footprint information for reflow soldering of LQFP144 package
SOT486-1
Hx
Gx
P2
Hy
(0.125)
P1
Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1
0.500
P2
Ax
Ay
Bx
By
0.560 23.300 23.300 20.300 20.300
C
D1
D2
1.500
0.280
0.400
Gx
Gy
Hx
Hy
20.500 20.500 23.550 23.550
sot486-1_fr
Fig 49. Reflow soldering of the LQFP144 package
LPC408X_7X
Objective data sheet
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LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
Footprint information for reflow soldering of LQFP80 package
SOT315-1
Hx
Gx
P2
Hy
(0.125)
P1
Gy
By
Ay
C
D2 (8×)
D1
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
occupied area
DIMENSIONS in mm
P1
0.500
P2
Ax
Ay
Bx
By
0.560 15.300 15.300 12.300 12.300
C
D1
D2
1.500
0.280
0.400
Gx
Gy
Hx
Hy
12.500 12.500 15.550 15.550
sot315-1_fr
Fig 50. Reflow soldering of the LQFP80 package
LPC408X_7X
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16. Abbreviations
Table 35.
LPC408X_7X
Objective data sheet
Abbreviations
Acronym
Description
ADC
Analog-to-Digital Converter
AHB
Advanced High-performance Bus
AMBA
Advanced Microcontroller Bus Architecture
APB
Advanced Peripheral Bus
BOD
BrownOut Detection
CAN
Controller Area Network
DAC
Digital-to-Analog Converter
DMA
Direct Memory Access
EOP
End Of Packet
ETM
Embedded Trace Macrocell
GPIO
General Purpose Input/Output
GPS
Global Positioning System
HVAC
Heating, Venting, and Air Conditioning
IRC
Internal RC
IrDA
Infrared Data Association
JTAG
Joint Test Action Group
MAC
Media Access Control
MIIM
Media Independent Interface Management
OHCI
Open Host Controller Interface
OTG
On-The-Go
PHY
Physical Layer
PLC
Programmable Logic Controller
PLL
Phase-Locked Loop
PWM
Pulse Width Modulator
RMII
Reduced Media Independent Interface
SE0
Single Ended Zero
SPI
Serial Peripheral Interface
SSI
Serial Synchronous Interface
SSP
Synchronous Serial Port
TCM
Tightly Coupled Memory
TTL
Transistor-Transistor Logic
UART
Universal Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
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17. Revision history
Table 36.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
LPC408X_7X v.1
20120917
Objective data sheet
-
-
LPC408X_7X
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18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
LPC408X_7X
Objective data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
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20. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 5
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 8
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . 10
7
Functional description . . . . . . . . . . . . . . . . . . 39
7.1
Architectural overview . . . . . . . . . . . . . . . . . . 39
7.2
ARM Cortex-M4 processor . . . . . . . . . . . . . . . 39
7.3
ARM Cortex-M4 Floating Point Unit (FPU) . . . 39
7.4
On-chip flash program memory . . . . . . . . . . . 39
7.5
EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
7.6
On-chip SRAM . . . . . . . . . . . . . . . . . . . . . . . . 40
7.7
Memory Protection Unit (MPU). . . . . . . . . . . . 40
7.8
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 40
7.9
Nested Vectored Interrupt Controller (NVIC) . 43
7.9.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
7.9.2
Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 43
7.10
Pin connect block . . . . . . . . . . . . . . . . . . . . . . 43
7.11
External Memory Controller (EMC). . . . . . . . . 43
7.11.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
7.12
General purpose DMA controller . . . . . . . . . . 45
7.12.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
7.13
CRC engine . . . . . . . . . . . . . . . . . . . . . . . . . . 45
7.13.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
7.14
LCD controller. . . . . . . . . . . . . . . . . . . . . . . . . 46
7.14.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
7.15
Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
7.15.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
7.16
USB interface . . . . . . . . . . . . . . . . . . . . . . . . . 48
7.16.1
USB device controller . . . . . . . . . . . . . . . . . . . 48
7.16.1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
7.16.2
USB host controller. . . . . . . . . . . . . . . . . . . . . 49
7.16.2.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
7.16.3
USB OTG controller . . . . . . . . . . . . . . . . . . . . 49
7.16.3.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
7.17
SD/MMC card interface . . . . . . . . . . . . . . . . . 49
7.17.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
7.18
Fast general purpose parallel I/O . . . . . . . . . . 50
7.18.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
7.19
12-bit ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
7.19.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
7.20
10-bit DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
7.20.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
7.21
Comparator. . . . . . . . . . . . . . . . . . . . . . . . . . . 51
7.21.1
7.22
7.22.1
7.23
7.23.1
7.24
7.24.1
7.25
7.25.1
7.26
7.26.1
7.27
7.27.1
7.28
7.28.1
7.29
7.29.1
7.30
7.31
7.31.1
7.32
7.33
7.33.1
7.34
7.34.1
7.35
7.35.1
7.36
7.36.1
7.36.1.1
7.36.1.2
7.36.1.3
7.36.1.4
7.36.2
7.36.3
7.36.4
7.36.4.1
7.36.4.2
7.36.4.3
7.36.4.4
7.36.4.5
7.36.5
7.36.6
7.37
7.37.1
7.37.2
7.37.3
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
UART0/1/2/3 and USART4 . . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SPIFI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SSP serial I/O controller. . . . . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2C-bus serial I/O controllers . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
I2S-bus serial I/O controllers . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
CAN controller and acceptance filters . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General purpose 32-bit timers/external
event counters . . . . . . . . . . . . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pulse Width Modulator (PWM). . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Motor control PWM . . . . . . . . . . . . . . . . . . . .
Quadrature Encoder Interface (QEI) . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
ARM Cortex-M4 system tick timer . . . . . . . . .
Windowed WatchDog Timer (WWDT) . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
RTC and backup registers . . . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Event monitor/recorder . . . . . . . . . . . . . . . . .
Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clocking and power control . . . . . . . . . . . . . .
Crystal oscillators . . . . . . . . . . . . . . . . . . . . . .
Internal RC oscillator . . . . . . . . . . . . . . . . . . .
Main oscillator . . . . . . . . . . . . . . . . . . . . . . . .
RTC oscillator . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog oscillator . . . . . . . . . . . . . . . . . . . .
Main PLL (PLL0) and Alternate PLL (PLL1) .
Wake-up timer . . . . . . . . . . . . . . . . . . . . . . . .
Power control . . . . . . . . . . . . . . . . . . . . . . . . .
Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . .
Deep-sleep mode. . . . . . . . . . . . . . . . . . . . . .
Power-down mode . . . . . . . . . . . . . . . . . . . . .
Deep power-down mode . . . . . . . . . . . . . . . .
Wake-up Interrupt Controller (WIC) . . . . . . . .
Peripheral power control . . . . . . . . . . . . . . . .
Power domains . . . . . . . . . . . . . . . . . . . . . . .
System control . . . . . . . . . . . . . . . . . . . . . . . .
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Brownout detection . . . . . . . . . . . . . . . . . . . .
Code security (Code Read Protection - CRP)
51
52
52
52
53
53
53
53
53
54
54
54
55
55
55
56
56
57
57
57
58
58
58
59
59
59
59
60
60
61
61
61
61
61
62
62
63
63
64
64
64
65
65
66
66
67
67
continued >>
LPC408X_7X
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 17 September 2012
© NXP B.V. 2012. All rights reserved.
122 of 123
LPC408x/7x
NXP Semiconductors
32-bit ARM Cortex-M4 microcontroller
7.37.4
7.37.5
7.37.6
7.37.7
7.38
8
9
10
10.1
10.2
10.3
11
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
12
12.1
12.2
12.3
13
13.1
13.2
13.3
13.4
13.5
13.6
14
15
16
17
18
18.1
18.2
18.3
18.4
19
20
APB interface . . . . . . . . . . . . . . . . . . . . . . . . . 67
AHB multilayer matrix . . . . . . . . . . . . . . . . . . . 68
External interrupt inputs . . . . . . . . . . . . . . . . . 68
Memory mapping control . . . . . . . . . . . . . . . . 68
Debug control . . . . . . . . . . . . . . . . . . . . . . . . . 68
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 68
Thermal characteristics . . . . . . . . . . . . . . . . . 70
Static characteristics. . . . . . . . . . . . . . . . . . . . 72
Power consumption . . . . . . . . . . . . . . . . . . . . 75
Peripheral power consumption . . . . . . . . . . . . 77
Electrical pin characteristics . . . . . . . . . . . . . . 79
Dynamic characteristics . . . . . . . . . . . . . . . . . 81
Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . 81
External memory interface . . . . . . . . . . . . . . . 82
External clock . . . . . . . . . . . . . . . . . . . . . . . . . 87
Internal oscillators. . . . . . . . . . . . . . . . . . . . . . 87
I/O pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
SSP interface . . . . . . . . . . . . . . . . . . . . . . . . . 88
I2C-bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
I2S-bus interface . . . . . . . . . . . . . . . . . . . . . . . 92
LCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
SD/MMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Characteristics of the analog peripherals . . . 94
ADC electrical characteristics . . . . . . . . . . . . . 94
DAC electrical characteristics . . . . . . . . . . . . 97
Comparator electrical characteristics . . . . . . . 97
Application information. . . . . . . . . . . . . . . . . 100
Suggested USB interface solutions . . . . . . . 100
Crystal oscillator XTAL input and component
selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
XTAL Printed-Circuit Board (PCB) layout
guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Standard I/O pin configuration . . . . . . . . . . . 106
Reset pin configuration . . . . . . . . . . . . . . . . . 107
Reset pin configuration for RTC operation . . 107
Package outline . . . . . . . . . . . . . . . . . . . . . . . 109
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 118
Revision history . . . . . . . . . . . . . . . . . . . . . . . 119
Legal information. . . . . . . . . . . . . . . . . . . . . . 120
Data sheet status . . . . . . . . . . . . . . . . . . . . . 120
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . 121
Contact information. . . . . . . . . . . . . . . . . . . . 121
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 17 September 2012
Document identifier: LPC408X_7X