AD ASDP-21365BBC-1AA Sharc processor Datasheet

a
SHARC® Processor
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
SUMMARY
The ADSP-2136x processors are available with a 333 MHz
core instruction rate and unique peripherals such as the digital audio interface, S/PDIF transceiver, DTCP (digital
transmission content protection protocol), serial ports,
8-channel asynchronous sample rate converter, precision
clock generators, and more. For complete ordering information, see Ordering Guide on Page 52.
High performance, 32-bit/40-bit, floating-point processor
optimized for high performance processing
Single-instruction, multiple-data (SIMD) computational
architecture
On-chip memory—3M bit of on-chip SRAM
Code compatible with all other members of the SHARC family
4 BLOCKS OF ON-CHIP MEMORY
CORE PROCESSOR
BLOCK 0
INSTRUCTION
CACHE
32-BIT ⴛ 48-BIT
TIMER
DAG1
8ⴛ4ⴛ32
DAG2
8ⴛ4ⴛ32
SRAM
1M BIT
ADDR
PROGRAM
SEQUENCER
ROM
2M BIT
DATA
BLOCK 1
SRAM
1M BIT
ADDR
SRAM
0.5M BIT
ROM
2M BIT
DATA
BLOCK 3
ADDR
SRAM
0.5M BIT
DATA
ADDR
DATA
32
PM ADDRESS BUS
DM ADDRESS BUS
PM DATA BUS
32
64
DM DATA BUS
64
IOA
IOD
IOA
PX REGISTER
PROCESSING
ELEMENT
(PEX)
BLOCK 2
PROCESSING
ELEMENT
(PEY)
IOP REGISTERS
(MEMORY MAPPED)
6
IOD
IOA
IOD
SPI
SPORTS
IDP
PCG
TIMERS
SRC
SPDIF
DTCP
IOA
IOD
SIGNAL
ROUTING
UNIT
JTAG TEST AND EMULATION
I/O PROCESSOR
AND PERIPHERALS
S
Figure 1. Functional Block Diagram—Processor Core
SHARC and the SHARC logo are registered trademarks of Analog Devices, Inc.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A.
Tel : 781.329.4700
www.analog.com
Fax: 781.461.3113
© 2006 Analog Devices, Inc. All rights reserved.
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
KEY FEATURES—PROCESSOR CORE
At 333 MHz (3.0 ns) core instruction rate, the ADSP-2136x
performs 2 GFLOPS/666 MMACs
3M bit on-chip SRAM (1M bit in blocks 0 and 1, and 0.50M bit
in blocks 2 and 3) for simultaneous access by the core processor and DMA
4M bit on-chip ROM (2M bit in block 0 and 2M bit in block 1)
Dual data address generators (DAGs) with modulo and bitreverse addressing
Zero-overhead looping with single-cycle loop setup, providing efficient program sequencing
Single-instruction multiple-data (SIMD) architecture
provides:
Two computational processing elements
Concurrent execution
Code compatibility with other SHARC family members at
the assembly level
Parallelism in buses and computational units allows single
cycle execution (with or without SIMD) of a multiply
operation, an ALU operation, a dual memory read or
write, and an instruction fetch
Transfers between memory and core at a sustained
5.4G bytes/s bandwidth at 333 MHz core instruction rate
INPUT/OUTPUT FEATURES
DMA controller supports:
25 DMA channels for transfers between ADSP-2136x internal
memory and a variety of peripherals
32-bit DMA transfers at peripheral clock speed, in parallel
with full-speed processor execution
Asynchronous parallel port provides access to asynchronous
external memory
16 multiplexed address/data lines support 24-bit address
external address range with 8-bit data or 16-bit address
external address range with 16-bit data
55M byte per sec transfer rate
External memory access in a dedicated DMA channel
8-bit to 32-bit and 16-bit to 32-bit packing options
Programmable data cycle duration: 2 CCLK to 31 CCLK
Digital audio interface (DAI) includes six serial ports, two precision clock generators, an input data port, three timers, an
S/PDIF transceiver, a DTCP cipher, an 8-channel asynchronous sample rate converter, an SPI port, and a signal
routing unit
Six dual data line serial ports that operate at up to 41.67M
bits/s on each data line—each has a clock, frame sync, and
two data lines that can be configured as either a receiver or
transmitter pair
Left-justified sample pair and I2S support, programmable
direction for up to 24 simultaneous receive or transmit
channels using two I2S-compatible stereo devices per
serial port
TDM support for telecommunications interfaces including
128 TDM channel support for newer telephony interfaces
such as H.100/H.110
Rev. A
| Page 2 of 52 |
Up to 12 TDM stream support, each with 128 channels per
frame
Companding selection on a per channel basis in TDM mode
Input data port provides an additional input path to the processor core, configurable as eight channels of serial data or
seven channels of serial data, and up to a 20-bit wide parallel data channel
Signal routing unit provides configurable and flexible connections between all DAI components–six serial ports, one
SPI port, eight channels of asynchronous sample rate converters, an S/PDIF receiver/transmitter, three timers, an SPI
port,10 interrupts, six flag inputs, six flag outputs, and
20 SRU I/O pins (DAI_Px)
Two serial peripheral interfaces (SPI): primary on dedicated
pins, secondary on DAI pins provide:
Master or slave serial boot through primary SPI
Full-duplex operation
Master slave mode multimaster support
Open drain outputs
Programmable baud rates, clock polarities, and phases
3 muxed flag/IRQ lines
1 muxed flag/timer expired line
DEDICATED AUDIO COMPONENTS
S/PDIF-compatible digital audio receiver/transmitter
supports:
EIAJ CP-340 (CP-1201), IEC-958, AES/EBU standards
Left-justified, I2S, or right-justified serial data input with
16-, 18-, 20- or 24-bit word widths (transmitter)
Two channel mode and single channel double frequency
(SCDF) mode
Sample rate converter (SRC) contains a serial input port,
de-emphasis filter, sample rate converter (SRC) and serial
output port providing up to –140 dB SNR performance (see
Table 2 on Page 4)
Supports left-justified, I2S, TDM, and right-justified
24-, 20-, 18-, and 16-bit serial formats (input)
Pulse-width modulation provides:
16 PWM outputs configured as four groups of four outputs
Supports center-aligned or edge-aligned PWM waveforms
Can generate complementary signals on two outputs in
paired mode or independent signals in nonpaired mode
ROM-based security features include:
JTAG access to memory permitted with a 64-bit key
Protected memory regions that can be assigned to limit
access under program control to sensitive code
PLL has a wide variety of software and hardware multiplier/divider ratios
Dual voltage: 3.3 V I/O, 1.2 V core
Available in 136-ball BGA package (see Ordering Guide on
Page 52)
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
TABLE OF CONTENTS
Summary ................................................................1
REVISION HISTORY
Key Features—Processor Core ..................................2
12/06—Rev 0 to Rev A
Input/Output Features ............................................2
Memory and I/O Interface Features ............................6
This version of the data sheet combines the ADSP-21362,
ADSP-21363, ADSP-21364, ADSP-21365, and ADSP-21366
data sheets. Throughout this document, these products are
referred to as “ADSP-2136x” except where features or specifications apply to a specific processor. For a comparison of each
processor, see Table 2 on Page 4.
Development Tools .............................................. 10
Added Package Information ......................................17
Additional Information ......................................... 11
Fixed Figure 6, Core Clock and System Clock Relationship to
CLKIN .................................................................18
Dedicated Audio Components ..................................2
General Description ..................................................4
SHARC Family Core Architecture .............................5
Pin Function Descriptions ........................................ 12
Address Data Pins as FLAGs .................................. 15
Address/Data Modes ............................................ 15
Boot Modes ........................................................ 15
Core Instruction Rate to CLKIN Ratio Modes ............. 15
Fixed Figure 24, IDP Master Timing ............................34
This version of the data sheet is for BGA parts only. An alternate
LQFP package (exposed pad) will be available in the future.
Information on that option is available on the ADSP-21365
product page. See Ordering Guide ...............................52
ADSP-2136x Specifications ....................................... 16
Operating Conditions ........................................... 16
Electrical Characteristics ........................................ 16
Package Information ............................................ 17
Maximum Power Dissipation ................................. 17
Absolute Maximum Ratings ................................... 17
ESD Sensitivity .................................................... 17
Timing Specifications ........................................... 18
Output Drive Currents .......................................... 46
Test Conditions ................................................... 46
Capacitive Loading ............................................... 46
Thermal Characteristics ........................................ 47
136-Ball BGA Pin Configurations ............................... 48
Outline Dimensions ................................................ 51
Surface Mount Design .......................................... 51
Ordering Guide ...................................................... 52
Rev. A
| Page 3 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
GENERAL DESCRIPTION
• On-chip ROM (4M bit)
• 8-bit or 16-bit parallel port that supports interfaces to offchip memory peripherals
• JTAG test access port
Speed
Benchmark Algorithm
(at 333 MHz)
1024 Point Complex FFT (Radix 4, with reversal) 27.9 μs
FIR Filter (per tap)1
1.5 ns
6.0 ns
IIR Filter (per biquad)1
Matrix Multiply (pipelined)
[3×3] × [3×1]
13.5 ns
[4×4] × [4×1]
23.9 ns
Divide (y/x)
10.5 ns
Inverse Square Root
16.3 ns
1
Assumes two files in multichannel SIMD mode
ADSP-21366
Table 1. Benchmarks (at 333 MHz)
ADSP-21365
Table 2 shows the features of the individual product offerings
and Table 1 shows performance benchmarks for the processors
running at 333 MHz.
Feature
ADSP-21364
As shown in the functional block diagram on Page 1, the
ADSP-2136x uses two computational units to deliver a significant performance increase over the previous SHARC processors
on a range of signal processing algorithms. Fabricated in a stateof-the-art, high speed, CMOS process, the ADSP-2136x processor achieves an instruction cycle time of 3.0 ns at 333 MHz.
With its SIMD computational hardware, the ADSP-2136x can
perform two GFLOPS running at 333 MHz.
ADSP-21363
Table 2. ADSP-2136x SHARC Processor Family Features
ADSP-21362
The ADSP-2136x SHARC processor is a member of the SIMD
SHARC family of DSPs that feature Analog Devices’ Super Harvard Architecture. The processor is source code-compatible
with the ADSP-2126x and ADSP-2116x DSPs, as well as with
first generation ADSP-2106x SHARC processors in SISD (single-instruction, single-data) mode. The ADSP-2136x is a
32-bit/40-bit floating-point processor optimized for high
performance automotive audio applications with a large onchip SRAM and ROM, multiple internal buses to eliminate I/O
bottlenecks, and an innovative digital audio interface (DAI).
RAM
3M bit
3M bit
3M bit
3M bit
3M bit
ROM
4M bit
4M bit
4M bit
4M bit
4M bit
Audio
Decoders in
ROM1
No
No
No
Yes
Yes
Pulse Width
Modulation
Yes
Yes
Yes
Yes
Yes
S/PDIF
Yes
No
Yes
Yes
Yes
DTCP2
Yes
No
No
Yes
No
SRC
Performance
128 dB
No SRC
140 dB
128 dB
128 dB
1
Audio decoding algorithms include PCM, Dolby Digital EX, Dolby Prologic IIx,
DTS 96/24, Neo:6, DTS ES, MPEG-2 AAC, MP3, and functions like Bass
management, delay, speaker equalization, graphic equalization, and more.
Decoder/post-processor algorithm combination support varies depending upon
the chip version and the system configurations. Please visit www.analog.com for
complete information.
2
The ADSP-21362 and ADSP-21365 processors provide the Digital Transmission
Content Protection protocol, a proprietary security protocol. Contact your
Analog Devices sales office for more information.
The block diagram on Page 7 illustrates the following architectural features:
The ADSP-2136x continues SHARC’s industry-leading standards of integration for DSPs, combining a high performance
32-bit DSP core with integrated, on-chip system features.
The block diagram on Page 1, illustrates the following architectural features:
• Two processing elements, each of which comprises an
ALU, multiplier, shifter, and data register file
• Data address generators (DAG1, DAG2)
• Program sequencer with instruction cache
• PM and DM buses capable of supporting four 32-bit data
transfers between memory and the core at every core processor cycle
• Three programmable interval timers with PWM generation, PWM capture/pulse width measurement, and
external event counter capabilities
• DMA controller
• Six full duplex serial ports
• Two SPI-compatible interface ports—primary on dedicated pins, secondary on DAI pins
• Digital audio interface that includes two precision clock
generators (PCG), an input data port (IDP), an S/PDIF
receiver/transmitter, eight channels asynchronous sample
rate converter, DTCP cipher, six serial ports, eight serial
interfaces, a 20-bit parallel input port, 10 interrupts, six flag
outputs, six flag inputs, three timers, and a flexible signal
routing unit (SRU)
Figure 2 shows a sample SPORT configuration using the precision clock generators to interface with an I2S ADC and an I2S
DAC with a much lower jitter clock than the serial port would
generate itself. Many other SRU configurations are possible.
• On-chip SRAM (3M bit)
Rev. A
| Page 4 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
ADSP-2136x
CLK OU T
C LK IN
X TA L
C LK _C FG1-0
2
B OOTC FG1 -0
D AC
(OPTI ONA L)
C LK
FS
S D AT
LA TCH
AD 1 5-0
A DD R
D ATA
RD
WE
FLA G0
CS
D A I_P1
DA I_ P2
DA I_ P3
S C LK 0
S FS0
S D 0A
S D 0B
SR U
D A I_P 18
D AI _P 19
DA I_ P2 0
OE
WR
PA R A LLEL
POR T
RAM
I /O D EVI CE
DATA
FLA G3-1
ADDRESS
3
A DC
(OPTI ONA L)
C LK
FS
S D AT
A LE
2
CONTROL
C LOC K
SP OR T0-5
TIME R S
SPD IF
SR C
ID P
S PI
C LK
FS
PC GA
P CG B
DAI
R ES ET
JTA G
6
Figure 2. ADSP-2136x System Sample Configuration
SHARC FAMILY CORE ARCHITECTURE
The ADSP-2136x is code-compatible at the assembly level with
the ADSP-2126x, ADSP-21160, and ADSP-21161, and with the
first generation ADSP-2106x SHARC processors. The
ADSP-2136x shares architectural features with the ADSP-2126x
and ADSP-2116x SIMD SHARC processors, as detailed in the
following sections.
SIMD Computational Engine
The ADSP-2136x contains two computational processing elements that operate as a single-instruction multiple-data (SIMD)
engine. The processing elements are referred to as PEX and PEY
and each contains an ALU, multiplier, shifter, and register file.
PEX is always active, and PEY may be enabled by setting the
PEYEN mode bit in the MODE1 register. When this mode is
enabled, the same instruction is executed in both processing elements, but each processing element operates on different data.
This architecture is efficient at executing math intensive signal
processing algorithms.
Entering SIMD mode also has an effect on the way data is transferred between memory and the processing elements. When in
SIMD mode, twice the data bandwidth is required to sustain
computational operation in the processing elements. Because of
this requirement, entering SIMD mode also doubles the
Rev. A
| Page 5 of 52 |
bandwidth between memory and the processing elements.
When using the DAGs to transfer data in SIMD mode, two data
values are transferred with each access of memory or the register file.
Independent, Parallel Computation Units
Within each processing element is a set of computational units.
The computational units consist of an arithmetic/logic unit
(ALU), multiplier, and shifter. These units perform all operations in a single cycle. The three units within each processing
element are arranged in parallel, maximizing computational
throughput. Single multifunction instructions execute parallel
ALU and multiplier operations. In SIMD mode, the parallel
ALU and multiplier operations occur in both processing
elements. These computation units support IEEE 32-bit
single-precision floating-point, 40-bit extended-precision
floating-point, and 32-bit fixed-point data formats.
Data Register File
A general-purpose data register file is contained in each processing element. The register files transfer data between the
computation units and the data buses, and store intermediate
results. These 10-port, 32-register (16 primary, 16 secondary)
register files, combined with the ADSP-2136x enhanced
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Harvard architecture, allow unconstrained data flow between
computation units and internal memory. The registers in PEX
are referred to as R0–R15 and in PEY as S0–S15.
Single-Cycle Fetch of Instruction and Four Operands
The ADSP-2136x features an enhanced Harvard architecture in
which the data memory (DM) bus transfers data and the program memory (PM) bus transfers both instructions and data
(see Figure 1 on Page 1). With the processor’s separate program
and data memory buses and on-chip instruction cache, the processor can simultaneously fetch four operands (two over each
data bus) and one instruction (from the cache), all in a
single cycle.
Instruction Cache
The ADSP-2136x includes an on-chip instruction cache that
enables three-bus operation for fetching an instruction and four
data values. The cache is selective—only the instructions whose
fetches conflict with PM bus data accesses are cached. This
cache allows full-speed execution of core, looped operations
such as digital filter multiply-accumulates, and FFT butterfly
processing.
Data Address Generators with Zero-Overhead Hardware
Circular Buffer Support
The ADSP-2136x’s two data address generators (DAGs) are
used for indirect addressing and implementing circular data
buffers in hardware. Circular buffers allow efficient programming of delay lines and other data structures required in digital
signal processing, and are commonly used in digital filters and
Fourier transforms. The two DAGs contain sufficient registers
to allow the creation of up to 32 circular buffers (16 primary
register sets, 16 secondary). The DAGs automatically handle
address pointer wraparound, reduce overhead, increase performance, and simplify implementation. Circular buffers can start
and end at any memory location.
Flexible Instruction Set
The 48-bit instruction word accommodates a variety of parallel
operations, for concise programming. For example, the
ADSP-2136x can conditionally execute a multiply, an add, and a
subtract in both processing elements while branching and fetching up to four 32-bit values from memory—all in a single
instruction.
MEMORY AND I/O INTERFACE FEATURES
The ADSP-2136x adds the following architectural features to
the SIMD SHARC family core.
On-Chip Memory
The ADSP-2136x contains three megabits of internal SRAM
and four megabits of internal ROM. Each block can be configured for different combinations of code and data storage (see
Table 3). Each memory block supports single-cycle, independent accesses by the core processor and I/O processor. The
processor’s memory architecture, in combination with its separate on-chip buses, allows two data transfers from the core and
one from the I/O processor, in a single cycle.
Table 3. ADSP-2136x Internal Memory Space
IOP Registers 0x0000 0000–0003 FFFF
Long Word (64 Bits)
Extended Precision Normal or
Instruction Word (48 Bits)
Normal Word (32 Bits)
Short Word (16 Bits)
BLOCK 0 ROM
0x0004 0000–0x0004 7FFF
BLOCK 0 ROM
0x0008 0000–0x0008 AAA9
BLOCK 0 ROM
0x0008 0000–0x0008 FFFF
BLOCK 0 ROM
0x0010 0000–0x0011 FFFF
Reserved
0x0009 0000–0x0009 7FFF
Reserved
0x0012 0000–0x0012 FFFF
Reserved
0x0004 8000–0x0004 BFFF
BLOCK 0 SRAM
0x0004 C000–0x0004 FFFF
BLOCK 0 SRAM
0x0009 0000–0x0009 5554
BLOCK 0 SRAM
0x0009 8000–0x0009 FFFF
BLOCK 0 SRAM
0x0013 0000–0x0013 FFFF
BLOCK 1 ROM
0x0005 0000–0x0005 7FFF
BLOCK 1 ROM
0x000A 0000–0x000A AAA9
BLOCK 1 ROM
0x000A 0000–0x000A FFFF
BLOCK 1 ROM
0x0014 0000–0x0015 FFFF
Reserved
0x000B 0000–0x000B 7FFF
Reserved
0x0016 0000–0x0016 FFFF
Reserved
0x0005 8000–0x0005 BFFF
BLOCK 1 SRAM
0x0005 C000–0x0005 FFFF
BLOCK 1 SRAM
0x000B 0000–0x000B 5554
BLOCK 1 SRAM
0x000B 8000–0x000B FFFF
BLOCK 1 SRAM
0x0017 0000–0x0017 FFFF
BLOCK 2 SRAM
0x0006 0000–0x0006 1FFF
BLOCK 2 SRAM
0x000C 0000–0x000C 2AA9
BLOCK 2 SRAM
0x000C 0000–0x000C 3FFF
BLOCK 2 SRAM
0x0018 0000–0x0018 7FFF
Reserved
0x000C 4000–0x000D FFFF
Reserved
0x0018 8000–0x001B FFFF
BLOCK 3 SRAM
0x000E 0000–0x000E 3FFF
BLOCK 3 SRAM
0x001C 0000–0x001C 7FFF
Reserved
0x0006 2000–0x0006 FFFF
BLOCK 3 SRAM
0x0007 0000–0x0007 1FFF
BLOCK 3 SRAM
0x000E 0000–0x000E 2AA9
Rev. A
| Page 6 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Table 3. ADSP-2136x Internal Memory Space (Continued)
IOP Registers 0x0000 0000–0003 FFFF
Long Word (64 Bits)
Extended Precision Normal or
Instruction Word (48 Bits)
Normal Word (32 Bits)
Reserved
0x0007 2000–0x0007 FFFF
Short Word (16 Bits)
Reserved
0x000E 4000–0x000F FFFF
Reserved
0x001C 8000–0x001F FFFF
Reserved
0x0020 0000–0xFFFF FFFF
The SRAM can be configured as a maximum of 96K words of
32-bit data, 192K words of 16-bit data, 64K words of 48-bit
instructions (or 40-bit data), or combinations of different word
sizes up to three megabits. All of the memory can be accessed as
16-bit, 32-bit, 48-bit, or 64-bit words. A 16-bit floating-point
storage format is supported that effectively doubles the amount
of data that may be stored on-chip. Conversion between the 32bit floating-point and 16-bit floating-point formats is performed in a single instruction. While each memory block can
store combinations of code and data, accesses are most efficient
when one block stores data using the DM bus for transfers, and
the other block stores instructions and data using the PM bus
for transfers.
DAI- associated peripherals for a much wider variety of applications by using a larger set of algorithms than is possible with
nonconfigurable signal paths.
TO PROCESSOR BUSES AND
SYSTEM MEMORY
IO ADDRESS
BUS (18)
IO DATA
BUS (32)
GPIO FLAGS/IRQ/TIMEXP
4
DMA CONTROLLER
25 CHANNELS
CONTROL/GPIO
Using the DM bus and PM buses, with one bus dedicated to
each memory block, assures single-cycle execution with two
data transfers. In this case, the instruction must be available in
the cache.
3
16
ADDRESS/DATA BUS/ GPIO
PARALLEL PORT
PWM (16)
4
DMA Controller
4
SPI PORT (1)
SERIAL PORTS (6)
SIGNAL ROUTING UNIT
CONTROL, STATUS, AND DATA BUFFERS
The ADSP-2136x’s on-chip DMA controllers allow data transfers without processor intervention. The DMA controller
operates independently and invisibly to the processor core,
allowing DMA operations to occur while the core is simultaneously executing its program instructions. DMA transfers can
occur between the processor’s internal memory and its serial
ports, the SPI-compatible (serial peripheral interface) ports, the
IDP (input data port), the parallel data acquisition port (PDAP),
or the parallel port. Twenty-five channels of DMA are available
on the processors—two for the SPI interface, 12 via the serial
ports, eight via the input data port, two for DTCP (or memoryto-memory data transfer when DTCP is not used), and one via
the processor’s parallel port. Programs can be downloaded to
the processors using DMA transfers. Other DMA features
include interrupt generation upon completion of DMA transfers, and DMA chaining for automatic linked DMA transfers.
IOP REGISTERS
(MEMORY MAPPED)
SPI PORT (1)
INPUT
DATA PORTS (8)
DTCP CIPHER
SPDIF (Rx/Tx)
SRC (8 CHANNELS)
PRECISION CLOCK
GENERATORS (2)
3
TIMERS (3)
Digital Audio Interface (DAI)
DIGITAL AUDIO INTERFACE
The digital audio interface (DAI) provides the ability to connect
various peripherals to any of the DSP’s DAI pins (DAI_P20–1).
I/O PROCESSOR
Programs make these connections using the signal routing unit
(SRU, shown in Figure 3).
The SRU is a matrix routing unit (or group of multiplexers) that
enables the peripherals provided by the DAI to be interconnected under software control. This allows easy use of the
Rev. A
| Page 7 of 52 |
Figure 3. ADSP-2136x I/O Processor and
Peripherals Block Diagram
The DAI also includes six serial ports, an S/PDIF receiver/transmitter, a DTCP cipher, a precision clock generator (PCG), eight
channels of asynchronous sample rate converters, an input data
port (IDP), an SPI port, six flag outputs and six flag inputs, and
December 2006
20
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
three timers. The IDP provides an additional input path to the
ADSP-2136x core, configurable as either eight channels of I2S
serial data or as seven channels plus a single 20-bit wide synchronous parallel data acquisition port. Each data channel has
its own DMA channel that is independent from the processor’s
serial ports.
For complete information on using the DAI, see the
ADSP-2136x SHARC Processor Hardware Reference.
Serial Ports
The ADSP-2136x features six synchronous serial ports that provide an inexpensive interface to a wide variety of digital and
mixed-signal peripheral devices such as Analog Devices’
AD183x family of audio codecs, ADCs, and DACs. The serial
ports are made up of two data lines, a clock, and a frame sync.
The data lines can be programmed to either transmit or receive
and each data line has a dedicated DMA channel.
Serial ports are enabled via 12 programmable and simultaneous
receive or transmit pins that support up to 24 transmit or 24
receive channels of audio data when all six SPORTS are enabled,
or six full duplex TDM streams of 128 channels per frame.
The serial ports operate at a maximum data rate of 41.67 M
bits/s. Serial port data can be automatically transferred to and
from on-chip memory via dedicated DMA channels. Each of the
serial ports can work in conjunction with another serial port to
provide TDM support. One SPORT provides two transmit signals while the other SPORT provides the two receive signals.
The frame sync and clock are shared.
Serial ports operate in four modes:
Parallel Port
The parallel port provides interfaces to SRAM and peripheral
devices. The multiplexed address and data pins (AD15–0) can
access 8-bit devices with up to 24 bits of address, or 16-bit
devices with up to 16 bits of address. In either mode, 8-bit or
16-bit, the maximum data transfer rate is 55M bytes/sec.
DMA transfers are used to move data to and from internal
memory. Access to the core is also facilitated through the parallel port register read/write functions. The RD, WR, and ALE
(address latch enable) pins are the control pins for the
parallel port.
Serial Peripheral (Compatible) Interface
The processors contain two serial peripheral interface ports
(SPIs). The SPI is an industry-standard synchronous serial link,
enabling the ADSP-2136x SPI-compatible port to communicate
with other SPI-compatible devices. The SPI consists of two data
pins, one device select pin, and one clock pin. It is a full-duplex
synchronous serial interface, supporting both master and slave
modes. The SPI port can operate in a multimaster environment
by interfacing with up to four other SPI-compatible devices,
either acting as a master or slave device. The ADSP-2136x SPIcompatible peripheral implementation also features programmable baud rate, clock phase, and polarities. The SPIcompatible port uses open drain drivers to support a multimaster configuration and to avoid data contention.
S/PDIF-Compatible Digital Audio Receiver/Transmitter
and Synchronous/Asynchronous Sample Rate Converter
The S/PDIF transmitter has no separate DMA channels. It
receives audio data in serial format and converts it into a
biphase encoded signal. The serial data input to the transmitter
can be formatted as left-justified, I2S, or right-justified with
word widths of 16, 18, 20, or 24 bits.
• Standard DSP serial mode
• Multichannel (TDM) mode
• I2S mode
• Left-justified sample pair mode
Left-justified sample pair mode is a mode where in each frame
sync cycle two samples of data are transmitted/received—one
sample on the high segment of the frame sync, the other on the
low segment of the frame sync. Programs have control over various attributes of this mode.
Each of the serial ports supports the left-justified sample pair
and I2S protocols (I2S is an industry-standard interface commonly used by audio codecs, ADCs, and DACs, such as the
Analog Devices AD183x family), with two data pins, allowing
four left-justified sample pair or I2S channels (using two stereo
devices) per serial port, with a maximum of up to 24 I2S channels. The serial ports permit little-endian or big-endian
transmission formats and word lengths selectable from 3 bits to
32 bits. For the left-justified sample pair and I2S modes, dataword lengths are selectable between 8 bits and 32 bits. Serial
ports offer selectable synchronization and transmit modes as
well as optional μ-law or A-law companding selection on a per
channel basis. Serial port clocks and frame syncs can be internally or externally generated.
The serial data, clock, and frame sync inputs to the S/PDIF
transmitter are routed through the signal routing unit (SRU).
They can come from a variety of sources such as the SPORTs,
external pins, the precision clock generators (PCGs), or the
sample rate converters (SRC) and are controlled by the SRU
control registers.
The sample rate converter (SRC) contains four SRC blocks and
is the same core as that used in the AD1896 192 kHz stereo
asynchronous sample rate converter and provides up to 140 dB
SNR (see Table 2 on Page 4 for details). The SRC block is used
to perform synchronous or asynchronous sample rate conversion across independent stereo channels, without using internal
processor resources. The four SRC blocks can also be configured to operate together to convert multichannel audio data
without phase mismatches. Finally, the SRC is used to clean up
audio data from jittery clock sources such as the S/PDIF
receiver. The S/PDIF and SRC are not available on the
ADSP-21363 models.
Digital Transmission Content Protection
The DTCP specification defines a cryptographic protocol for
protecting audio entertainment content from illegal copying,
intercepting, and tampering as it traverses high performance
Rev. A
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December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
digital buses, such as the IEEE 1394 standard. Only legitimate
entertainment content delivered to a source device via another
approved copy protection system (such as the DVD content
scrambling system) will be protected by this copy protection
system. This feature is available on the ADSP-21362 and
ADSP-21365 processors only. Licensing through DTLA is
required for these products. Visit www.dtcp.com for more
information.
Pulse-Width Modulation
The PWM module is a flexible, programmable, PWM waveform
generator that can be programmed to generate the required
switching patterns for various applications related to motor and
engine control or audio power control. The PWM generator can
generate either center-aligned or edge-aligned PWM waveforms. In addition, it can generate complementary signals on
two outputs in paired mode or independent signals in nonpaired mode (applicable to a single group of four PWM
waveforms).
The entire PWM module has four groups of four PWM outputs
each. Therefore, this module generates 16 PWM outputs in
total. Each PWM group produces two pairs of PWM signals on
the four PWM outputs.
The PWM generator is capable of operating in two distinct
modes while generating center-aligned PWM waveforms: single
update mode or double update mode. In single update mode the
duty cycle values are programmable only once per PWM period.
This results in PWM patterns that are symmetrical about the
midpoint of the PWM period. In double update mode, a second
updating of the PWM registers is implemented at the midpoint
of the PWM period. In this mode, it is possible to produce
asymmetrical PWM patterns that produce lower harmonic distortion in three-phase PWM inverters.
Timers
The ADSP-2136x has a total of four timers: a core timer that can
generate periodic software interrupts and three general-purpose
timers that can generate periodic interrupts and be independently set to operate in one of three modes:
Additionally, the processor is not freely accessible via the JTAG
port. Instead, a unique 64-bit key, which must be scanned in
through the JTAG or test access port will be assigned to each
customer. The device will ignore a wrong key. Emulation features and external boot modes are only available after the
correct key is scanned.
Program Booting
The internal memory of the ADSP-2136x boots at system
power-up from an 8-bit EPROM via the parallel port, an SPI
master, an SPI slave, or an internal boot. Booting is determined
by the boot configuration (BOOTCFG1–0) pins (see Table 7 on
Page 15). Selection of the boot source is controlled via the SPI as
either a master or slave device, or it can immediately begin executing from ROM.
Phase-Locked Loop
The processors use an on-chip phase-locked loop (PLL) to generate the internal clock for the core. On power up, the
CLKCFG1–0 pins are used to select ratios of 32:1, 16:1, and 6:1
(see Table 8 on Page 15). After booting, numerous other ratios
can be selected via software control.
The ratios are made up of software configurable numerator values from 1 to 64 and software configurable divisor values of 1, 2,
4, and 8.
Power Supplies
The ADSP-2136x has a separate power supply connection for
the internal (VDDINT), external (VDDEXT), and analog (AVDD/AVSS)
power supplies. The internal and analog supplies must meet the
1.2 V requirement for K, B, and Y grade models, and the 1.0 V
requirement for Y and W Grade models. (For information on
the temperature ranges offered for this product, see Operating
Conditions on Page 16, Package Information on Page 17, and
Ordering Guide on Page 52. The external supply must meet the
3.3 V requirement. All external supply pins must be connected
to the same power supply.
The core timer can be configured to use FLAG3 as a timer
expired signal, and each general-purpose timer has one bidirectional pin and four registers that implement its mode of
operation: a 6-bit configuration register, a 32-bit count register,
a 32-bit period register, and a 32-bit pulse width register. A single control and status register enables or disables all three
general-purpose timers independently.
Note that the analog supply pin (AVDD) powers the processor’s
internal clock generator PLL. To produce a stable clock, it is recommended that PCB designs use an external filter circuit for the
AVDD pin. Place the filter components as close as possible to the
AVDD/AVSS pins. For an example circuit, see Figure 4. (A recommended ferrite chip is the muRata BLM18AG102SN1D). To
reduce noise coupling, the PCB should use a parallel pair of
power and ground planes for VDDINT and GND. Use wide traces
to connect the bypass capacitors to the analog power (AVDD) and
ground (AVSS) pins. Note that the AVDD and AVSS pins specified in
Figure 4 are inputs to the processor and not the analog ground
plane on the board—the AVSS pin should connect directly to digital ground (GND) at the chip.
ROM-Based Security
Target Board JTAG Emulator Connector
The ADSP-2136x has a ROM security feature that provides
hardware support for securing user software code by preventing
unauthorized reading from the internal code when enabled.
When using this feature, the processor does not boot-load any
external code, executing exclusively from internal SRAM/ROM.
Analog Devices DSP Tools product line of JTAG emulators uses
the IEEE 1149.1 JTAG test access port of the processor to monitor and control the target board processor during emulation.
Analog Devices’ DSP Tools product line of JTAG emulators
provides emulation at full processor speed, allowing inspection
• Pulse waveform generation mode
• Pulse width count/capture mode
• External event watchdog mode
Rev. A
| Page 9 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
100nF
10nF
ADSP-213xx
1nF
AVDD
VDDINT
HI Z FERRITE
BEAD CHIP
• View mixed C/C++ and assembly code (interleaved source
and object information)
• Insert breakpoints
AVSS
• Set conditional breakpoints on registers, memory,
and stacks
LOCATE ALL COMPONENTS
CLOSE TO AVDD AND AVSS PINS
• Trace instruction execution
• Perform linear or statistical profiling of program execution
Figure 4. Analog Power (AVDD) Filter Circuit
and modification of memory, registers, and processor stacks.
The processor’s JTAG interface ensures that the emulator will
not affect target system loading or timing.
For complete information on Analog Devices’ SHARC DSP
Tools product line of JTAG emulator operation, see the appropriate “Emulator Hardware User’s Guide.”
DEVELOPMENT TOOLS
The ADSP-2136x is supported with a complete set of
CROSSCORE®† software and hardware development tools,
including Analog Devices emulators and VisualDSP++®‡ development environment. The same emulator hardware that
supports other SHARC processors also fully emulates the
ADSP-2136x.
The VisualDSP++ project management environment lets programmers develop and debug an application. This environment
includes an easy to use assembler (which is based on an algebraic syntax), an archiver (librarian/library builder), a linker, a
loader, a cycle-accurate instruction-level simulator, a C/C++
compiler, and a C/C++ runtime library that includes DSP and
mathematical functions. A key point for these tools is C/C++
code efficiency. The compiler has been developed for efficient
translation of C/C++ code to DSP assembly. The SHARC has
architectural features that improve the efficiency of compiled
C/C++ code.
The VisualDSP++ debugger has a number of important features. Data visualization is enhanced by a plotting package that
offers a significant level of flexibility. This graphical representation of user data enables the programmer to quickly determine
the performance of an algorithm. As algorithms grow in complexity, this capability can have increasing significance on the
designer’s development schedule, increasing productivity. Statistical profiling enables the programmer to nonintrusively poll
the processor as it is running the program. This feature, unique
to VisualDSP++, enables the software developer to passively
gather important code execution metrics without interrupting
the real-time characteristics of the program. Essentially, the
developer can identify bottlenecks in software quickly and
efficiently. By using the profiler, the programmer can focus on
those areas in the program that impact performance and take
corrective action.
†
‡
Debugging both C/C++ and assembly programs with the
VisualDSP++ debugger, programmers can:
• Perform source level debugging
• Create custom debugger windows
The VisualDSP++ IDDE lets programmers define and manage
DSP software development. Its dialog boxes and property pages
let programmers configure and manage all of the SHARC development tools, including the color syntax highlighting in the
VisualDSP++ editor. This capability permits programmers to:
• Control how the development tools process inputs and
generate outputs
• Maintain a one-to-one correspondence with the tool’s
command line switches
The VisualDSP++ Kernel (VDK) incorporates scheduling and
resource management tailored specifically to address the memory and timing constraints of DSP programming. These
capabilities enable engineers to develop code more effectively,
eliminating the need to start from the very beginning, when
developing new application code. The VDK features include
threads, critical and unscheduled regions, semaphores, events,
and device flags. The VDK also supports priority-based, preemptive, cooperative, and time-sliced scheduling approaches. In
addition, the VDK was designed to be scalable. If the application
does not use a specific feature, the support code for that feature
is excluded from the target system.
Because the VDK is a library, a developer can decide whether to
use it or not. The VDK is integrated into the VisualDSP++
development environment, but can also be used via standard
command line tools. When the VDK is used, the development
environment assists the developer with many error-prone tasks
and assists in managing system resources, automating the generation of various VDK-based objects, and visualizing the
system state, when debugging an application that uses the VDK.
VisualDSP++ component software engineering (VCSE) is Analog Devices’ technology for creating, using, and reusing software
components (independent modules of substantial functionality)
to quickly and reliably assemble software applications. It allows
downloading components from the Web, dropping them into
the application, and publishing component archives from
within VisualDSP++. VCSE supports component implementation in C/C++ or assembly language.
Use the expert linker to visually manipulate the placement of
code and data on the embedded system. View memory utilization in a color-coded graphical form, easily move code and data
to different areas of the processor or external memory with a
CROSSCORE is a registered trademark of Analog Devices, Inc.
VisualDSP++ is a registered trademark of Analog Devices, Inc.
Rev. A |
• Fill, dump, and graphically plot the contents of memory
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December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
drag of the mouse and examine runtime stack and heap usage.
The expert linker is fully compatible with the existing linker definition file (LDF), allowing the developer to move between the
graphical and textual environments.
In addition to the software and hardware development tools
available from Analog Devices, third parties provide a wide
range of tools supporting the SHARC processor family. Hardware tools include SHARC processor PC plug-in cards. Third
party software tools include DSP libraries, real-time operating
systems, and block diagram design tools.
Designing an Emulator-Compatible DSP Board (Target)
The Analog Devices family of emulators are tools that every
DSP developer needs to test and debug hardware and software
systems. Analog Devices has supplied an IEEE 1149.1 JTAG test
access port (TAP) on each JTAG processor. Nonintrusive incircuit emulation is assured by the use of the processor’s JTAG
interface—the emulator does not affect target system loading or
timing. The emulator uses the TAP to access the internal features of the processor, allowing the developer to load code, set
breakpoints, observe variables, observe memory, and examine
registers. The processor must be halted to send data and commands, but once an operation has been completed by the
emulator, the DSP system is set running at full speed with no
impact on system timing.
With a full version of VisualDSP++ installed (sold separately),
engineers can develop software for the EZ-KIT Lite or any custom defined system. Connecting one of Analog Devices’ JTAG
emulators to the EZ-KIT Lite board enables high speed, nonintrusive emulation.
ADDITIONAL INFORMATION
This data sheet provides a general overview of the
ADSP-2136x architecture and functionality. For detailed information on the ADSP-2136x family core architecture and
instruction set, refer to the ADSP-2136x SHARC Processor
Hardware Reference and the ADSP-2136x SHARC Processor
Programming Reference.
To use these emulators, the target board must include a header
that connects the DSP’s JTAG port to the emulator.
For details on target board design issues including mechanical
layout, single processor connections, multiprocessor scan
chains, signal buffering, signal termination, and emulator pod
logic, see the EE-68: Analog Devices JTAG Emulation Technical
Reference on the Analog Devices website (www.analog.com)—
use site search on “EE-68.” This document is updated regularly
to keep pace with improvements to emulator support.
Evaluation Kit
Analog Devices offers a range of EZ-KIT Lite®† evaluation platforms to use as a cost-effective method to learn more about
developing or prototyping applications with Analog Devices
processors, platforms, and software tools. Each EZ-KIT Lite
platform includes an evaluation board along with an evaluation
suite of the VisualDSP++ development and debugging environment with the C/C++ compiler, assembler, and linker. Also
included are sample application programs, power supply, and a
USB cable. All evaluation versions of the software tools are limited for use only with the EZ-KIT Lite product.
The USB controller on the EZ-KIT Lite board connects the
board to the USB port of the user’s PC, enabling the
VisualDSP++ evaluation suite to emulate the on-board processor in-circuit. This permits the customer to download, execute,
and debug programs for the EZ-KIT Lite system. It also allows
in-circuit programming of the on-board flash device to store
user-specific boot code, enabling the board to run as a standalone unit without being connected to the PC.
†
EZ-KIT Lite is a registered trademark of Analog Devices, Inc.
Rev. A |
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PIN FUNCTION DESCRIPTIONS
The ADSP-2136x pin definitions are listed below. Inputs identified as synchronous (S) must meet timing requirements with
respect to CLKIN (or with respect to TCK for TMS and TDI).
Inputs identified as asynchronous (A) can be asserted asynchronously to CLKIN (or to TCK for TRST). Tie or pull unused
inputs to VDDEXT or GND, except for the following:
• DAI_Px, SPICLK, MISO, MOSI, EMU, TMS, TRST, TDI,
and AD15–0 (NOTE: These pins have pull-up resistors.)
The following symbols appear in the Type column of Table 4:
A = asynchronous, G = ground, I = input, O = output,
P = power supply, S = synchronous, (A/D) = active drive,
(O/D) = open drain, and T = three-state, (pd) = pull-down resistor, (pu) = pull-up resistor.
Table 4. Pin Descriptions
Pin
AD15–0
Type
I/O/T
(pu)
State During and
After Reset
Three-state with
pull-up enabled
RD
O
(pu)
Three-state, driven
high1
WR
O
(pu)
Three-state, driven
high1
ALE
O
(pd)
Three-state, driven
low1
FLAG3–0
I/O/A
Three-state
DAI_P20–1
I/O/T
(pu)
Three-state with
programmable
pull-up
Description
Parallel Port Address/Data. The ADSP-2136x parallel port and its corresponding
DMA unit output addresses and data for peripherals on these multiplexed pins. The
multiplex state is determined by the ALE pin. The parallel port can operate in either
8-bit or 16-bit mode. Each AD pin has a 22.5 kΩ internal pull-up resistor. See
Address/Data Modes on Page 15 for details of the AD pin operation.
For 8-bit mode: ALE is automatically asserted whenever a change occurs in the upper
16 external address bits, A23–8; ALE is used in conjunction with an external latch to
retain the values of the A23–8.
For detailed information on I/O operations and pin multiplexing, see the ADSP-2136x
SHARC Processor Hardware Reference.
Parallel Port Read Enable. RD is asserted low whenever the processor reads 8-bit or
16-bit data from an external memory device. When AD15–0 are flags, this pin remains
deasserted. RD has a 22.5 kΩ internal pull-up resistor.
Parallel Port Write Enable. WR is asserted low whenever the processor writes 8-bit or
16-bit data to an external memory device. When AD15–0 are flags, this pin remains
deasserted. WR has a 22.5 kΩ internal pull-up resistor.
Parallel Port Address Latch Enable. ALE is asserted whenever the processor drives
a new address on the parallel port address pins. On reset, ALE is active high. However,
it can be reconfigured using software to be active low. When AD15–0 are flags, this
pin remains deasserted. ALE has a 20 kΩ internal pull-down resistor.
Flag Pins. Each flag pin is configured via control bits as either an input or output. As
an input, it can be tested as a condition. As an output, it can be used to signal external
peripherals. These pins can be used as an SPI interface slave select output during SPI
mastering. These pins are also multiplexed with the IRQx and the TIMEXP signals. For
detailed information on I/O operations and pin multiplexing, see the ADSP-2136x
SHARC Processor Hardware Reference.
Digital Audio Interface Pins. These pins provide the physical interface to the SRU.
The SRU configuration registers define the combination of on-chip peripheral inputs
or outputs connected to the pin and to the pin’s output enable. The configuration
registers of these peripherals then determines the exact behavior of the pin. Any input
or output signal present in the SRU may be routed to any of these pins. The SRU
provides the connection from the serial ports, input data port, precision clock generators and timers, sample rate converters and SPI to the DAI_P20–1 pins. These pins
have internal 22.5 kΩ pull-up resistors which are enabled on reset. These pull-ups can
be disabled in the DAI_PIN_PULLUP register.
Rev. A |
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December 2006
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Table 4. Pin Descriptions (Continued)
Pin
SPICLK
Type
I/O
(pu)
State During and
After Reset
Three-state with
pull-up enabled
SPIDS
I
Input only
MOSI
I/O (O/D)
(pu)
Three-state with
pull-up enabled
MISO
I/O (O/D)
(pu)
Three-state with
pull-up enabled
BOOTCFG1–0
I
Input only
CLKIN
I
Input only
XTAL
O
Output only2
CLKCFG1–0
I
Input only
Description
Serial Peripheral Interface Clock Signal. Driven by the master, this signal controls
the rate at which data is transferred. The master may transmit data at a variety of baud
rates. SPICLK cycles once for each bit transmitted. SPICLK is a gated clock that is active
during data transfers, only for the length of the transferred word. Slave devices ignore
the serial clock if the slave select input is driven inactive (HIGH). SPICLK is used to shift
out and shift in the data driven on the MISO and MOSI lines. The data is always shifted
out on one clock edge and sampled on the opposite edge of the clock. Clock polarity
and clock phase relative to data are programmable into the SPICTL control register
and define the transfer format. SPICLK has a 22.5 kΩ internal pull-up resistor.
Serial Peripheral Interface Slave Device Select. An active low signal used to select
the processor as an SPI slave device. This input signal behaves like a chip select, and
is provided by the master device for the slave devices. In multimaster mode the
processor’s SPIDS signal can be driven by a slave device to signal to the processor (as
SPI master) that an error has occurred, as some other device is also trying to be the
master device. If asserted low when the device is in master mode, it is considered a
multimaster error. For a single-master, multiple-slave configuration where flag pins
are used, this pin must be tied or pulled high to VDDEXT on the master device. For
processor to processor SPI interaction, any of the master processor’s flag pins can be
used to drive the SPIDS signal on the SPI slave device.
SPI Master Out Slave In. If the ADSP-2136x is configured as a master, the MOSI pin
becomes a data transmit (output) pin, transmitting output data. If the processor is
configured as a slave, the MOSI pin becomes a data receive (input) pin, receiving input
data. In a SPI interconnection, the data is shifted out from the MOSI output pin of the
master and shifted into the MOSI input(s) of the slave(s). MOSI has a 22.5 kΩ internal
pull-up resistor.
SPI Master In Slave Out. If the ADSP-2136x is configured as a master, the MISO pin
becomes a data receive (input) pin, receiving input data. If the processor is configured
as a slave, the MISO pin becomes a data transmit (output) pin, transmitting output
data. In an SPI interconnection, the data is shifted out from the MISO output pin of the
slave and shifted into the MISO input pin of the master. MISO has a 22.5 kΩ internal
pull-up resistor. MISO can be configured as O/D by setting the OPD bit in the SPICTL
register.
Note: Only one slave is allowed to transmit data at any given time. To enable broadcast
transmission to multiple SPI-slaves, the processor’s MISO pin may be disabled by
setting (=1) Bit 5 (DMISO) of the SPICTL register.
Boot Configuration Select. This pin is used to select the boot mode for the processor.
The BOOTCFG pins must be valid before reset is asserted. See Table 7 for a description
of the boot modes.
Local Clock In. Used in conjunction with XTAL. CLKIN is the ADSP-2136x clock input.
It configures the ADSP-2136x to use either its internal clock generator or an external
clock source. Connecting the necessary components to CLKIN and XTAL enables the
internal clock generator. Connecting the external clock to CLKIN while leaving XTAL
unconnected configures the processors to use the external clock source such as an
external clock oscillator. The core is clocked either by the PLL output or this clock input
depending on the CLKCFG1–0 pin settings. CLKIN may not be halted, changed, or
operated below the specified frequency.
Crystal Oscillator Terminal. Used in conjunction with CLKIN to drive an external
crystal.
Core/CLKIN Ratio Control. These pins set the start up clock frequency. See Table 8
for a description of the clock configuration modes. Note that the operating frequency
can be changed by programming the PLL multiplier and divider in the PMCTL register
at any time after the core comes out of reset.
Rev. A |
Page 13 of 52 |
December 2006
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Table 4. Pin Descriptions (Continued)
Pin
Type
RSTOUT/CLKOUT O
State During and
After Reset
Output only
RESET
I/A
Input only
TCK
I
Input only3
TMS
I/S
(pu)
I/S
(pu)
O
I/A
(pu)
Three-state with
pull-up enabled
Three-state with
pull-up enabled
Three-state4
Three-state with
pull-up enabled
Three-state with
pull-up enabled
VDDINT
O (O/D)
(pu)
P
VDDEXT
AVDD
P
P
AVSS
GND
G
G
TDI
TDO
TRST
EMU
Description
Local Clock Out/Reset Out. Drives out the core reset signal to an external device.
CLKOUT can also be configured as a reset out pin. The functionality can be switched
between the PLL output clock and reset out by setting Bit 12 of the PMCTREG register.
The default is reset out.
Processor Reset. Resets the ADSP-2136x to a known state. Upon deassertion, there is
a 4096 CLKIN cycle latency for the PLL to lock. After this time, the core begins program
execution from the hardware reset vector address. The RESET input must be asserted
(low) at power-up.
Test Clock (JTAG). Provides a clock for JTAG boundary scan. TCK must be asserted
(pulsed low) after power-up or held low for proper operation of the processors.
Test Mode Select (JTAG). Used to control the test state machine. TMS has a 22.5 kΩ
internal pull-up resistor.
Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a
22.5 kΩ internal pull-up resistor.
Test Data Output (JTAG). Serial scan output of the boundary scan path.
Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low)
after power-up or held low for proper operation of the ADSP-2136x. TRST has a
22.5 kΩ internal pull-up resistor.
Emulation Status. Must be connected to the processor’s JTAG emulators target board
connector only. EMU has a 22.5 kΩ internal pull-up resistor.
Core Power Supply. Nominally +1.2 V dc for the K, B grade models, and
1.0 V dc for the Y and W grade models, and supplies the processor’s core (13 pins).
I/O Power Supply. Nominally +3.3 V dc (6 pins).
Analog Power Supply. Nominally +1.2 V dc for the K, B grade models, and
1.0 V dc for the Y and W Grade models, and supplies the processor’s internal PLL (clock
generator). This pin has the same specifications as VDDINT, except that added filtering
circuitry is required. For more information, see Power Supplies on Page 9.
Analog Power Supply Return.
Power Supply Return. (54 pins)
1
RD, WR, and ALE are three-stated (and not driven) only when RESET is active.
Output only is a three-state driver with its output path always enabled.
3
Input only is a three-state driver with both output path and pull-up disabled.
4
Three-state is a three-state driver with pull-up disabled.
2
Rev. A |
Page 14 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
ADDRESS DATA PINS AS FLAGS
BOOT MODES
To use these pins as flags (FLAGS15–0) set (=1) Bit 20 of the
SYSCTL register to disable the parallel port. Then set (=1)
Bits 22 to 25 in the SYSCTL register accordingly.
Table 5. AD15–0 to Flag Pin Mapping
AD Pin
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
Flag Pin
FLAG8
FLAG9
FLAG10
FLAG11
FLAG12
FLAG13
FLAG14
FLAG15
AD Pin
AD8
AD9
AD10
AD11
AD12
AD13
AD14
AD15
Flag Pin
FLAG0
FLAG1
FLAG2
FLAG3
FLAG4
FLAG5
FLAG6
FLAG7
Table 7. Boot Mode Selection
BOOTCFG1–0
00
01
10
CORE INSTRUCTION RATE TO CLKIN RATIO MODES
For details on processor timing, see Timing Specifications and
Figure 6 on Page 18.
Table 8. Core Instruction Rate/CLKIN Ratio Selection
CLKCFG1–0
00
01
10
ADDRESS/DATA MODES
The following table shows the functionality of the AD pins for
8-bit and 16-bit transfers to the parallel port. For 8-bit data
transfers, ALE latches Address Bits A23–A8 when asserted, followed by Address Bits A7–A0 and Data Bits D7–D0 when
deasserted. For 16-bit data transfers, ALE latches Address Bits
A15–A0 when asserted, followed by Data Bits D15–D0 when
deasserted.
Table 6. Address/Data Mode Selection
PP Data
Mode
8-bit
8-bit
16-bit
16-bit
ALE
Asserted
Deasserted
Asserted
Deasserted
AD7–AD0
Function
A15–A8
D7–D0
A7–A0
D7–D0
AD15–AD8
Function
A23–A16
A7–A0
A15–A8
D15–D8
Rev. A |
Booting Mode
SPI Slave Boot
SPI Master Boot
Parallel Port Boot via EPROM
Page 15 of 52 |
December 2006
Core to CLKIN Ratio
6:1
32:1
16:1
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
ADSP-2136x SPECIFICATIONS
OPERATING CONDITIONS
K Grade
B Grade
Parameter1
Description
Min
Max
Min
Max
Unit
VDDINT
Internal (Core) Supply Voltage
1.14
1.26
1.14
1.26
V
AVDD
Analog (PLL) Supply Voltage
1.14
1.26
1.14
1.26
V
VDDEXT
External (I/O) Supply Voltage
3.13
3.47
3.13
3.47
V
VIH
High Level Input Voltage @ VDDEXT = max
2.0
VDDEXT + 0.5
2.0
VDDEXT + 0.5
V
VIL2
Low Level Input Voltage @ VDDEXT = min
–0.5
+0.8
–0.5
+0.8
V
VIH_CLKIN3
High Level Input Voltage @ VDDEXT = max
1.74
VDDEXT + 0.5
1.74
VDDEXT + 0.5
V
VIL_CLKIN
Low Level Input Voltage @ VDDEXT = min
–0.5
+1.19
–0.5
+1.19
V
Ambient Operating Temperature
0
+70
–40
+85
°C
2
TAMB
4, 5
1
Specifications subject to change without notice.
Applies to input and bidirectional pins: AD15–0, FLAG3–0, DAI_Px, SPICLK, MOSI, MISO, SPIDS, BOOTCFGx, CLKCFGx, RESET, TCK, TMS, TDI, TRST.
3
Applies to input pin CLKIN.
4
See Thermal Characteristics on Page 47 for information on thermal specifications.
5
See Engineer-to-Engineer Note (No. EE-277) for further information.
2
ELECTRICAL CHARACTERISTICS
Parameter1
Description
Test Conditions
VOH2
High Level Output Voltage
@ VDDEXT = min, IOH = –1.0 mA3
2
VOL
4, 5
IIH
IIL4
Max
2.4
3
Unit
V
Low Level Output Voltage
@ VDDEXT = min, IOL = 1.0 mA
0.4
V
High Level Input Current
@ VDDEXT = max, VIN = VDDEXT max
10
μA
Low Level Input Current
@ VDDEXT = max, VIN = 0 V
10
μA
5
Low Level Input Current Pull-Up
@ VDDEXT = max, VIN = 0 V
200
μA
6, 7
Three-State Leakage Current
@ VDDEXT= max, VIN = VDDEXT max
10
μA
6
Three-State Leakage Current
@ VDDEXT = max, VIN = 0 V
10
μA
Three-State Leakage Current Pull-Up
@ VDDEXT = max, VIN = 0 V
200
μA
Supply Current (Internal)
tCCLK = min, VDDINT = nom
800
mA
Supply Current (Analog)
AVDD = max
10
mA
Input Capacitance
fIN = 1 MHz, TCASE = 25°C, VIN = 1.2 V
4.7
pF
IILPU
IOZH
IOZL
IOZLPU7
8, 9
IDD-INTYP
AIDD
10
11, 12
CIN
Min
1
Specifications subject to change without notice.
Applies to output and bidirectional pins: AD15–0, RD, WR, ALE, FLAG3–0, DAI_Px, SPICLK, MOSI, MISO, EMU, TDO, CLKOUT, XTAL.
3
See Output Drive Currents on Page 46 for typical drive current capabilities.
4
Applies to input pins: SPIDS, BOOTCFGx, CLKCFGx, TCK, RESET, CLKIN.
5
Applies to input pins with 22.5 kΩ internal pull-ups: TRST, TMS, TDI.
6
Applies to three-stateable pins: FLAG3–0.
7
Applies to three-stateable pins with 22.5 kΩ pull-ups: AD15–0, DAI_Px, SPICLK, EMU, MISO, MOSI.
8
Typical internal current data reflects nominal operating conditions.
9
See Engineer-to-Engineer Note (No. EE-277) for further information.
10
Characterized, but not tested.
11
Applies to all signal pins.
12
Guaranteed, but not tested.
2
Rev. A |
Page 16 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
PACKAGE INFORMATION
MAXIMUM POWER DISSIPATION
The information presented in Figure 5 provides details about
the package branding for the ADSP-2136x processor. For a
complete listing of product availability, see Ordering Guide on
Page 52.
See Engineer-to-Engineer Note (EE-277) for detailed thermal
and power information regarding maximum power dissipation.
For information on package thermal specifications, see Thermal
Characteristics on Page 47.
ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed below may cause permanent
damage to the device. These are stress ratings only; functional
operation of the device at these or any other conditions greater
than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
a
ADSP-2136x
tppZ-cc
vvvvvv.x n.n
yyww country_of_origin
S
Parameter
Internal (Core) Supply Voltage (VDDINT)
Analog (PLL) Supply Voltage (AVDD)
External (I/O) Supply Voltage (VDDEXT)
Input Voltage
Output Voltage Swing
Load Capacitance
Storage Temperature Range
Junction Temperature Under Bias
Figure 5. Typical Package Brand
Table 9. Package Brand Information
Brand Key
t
pp
Z
cc
vvvvvv.x
n.n
yyww
Field Description
Temperature Range
Package Type
Lead Free Option
See Ordering Guide
Assembly Lot Code
Silicon Revision
Date Code
ESD SENSITIVITY
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADSP-2136x features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
Rev. A |
Page 17 of 52 |
December 2006
Rating
–0.3 V to +1.5 V
–0.3 V to +1.5 V
–0.3 V to +4.6 V
–0.5 V to +3.8 V
–0.5 V to VDDEXT + 0.5 V
200 pF
–65°C to +150°C
125°C
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
TIMING SPECIFICATIONS
The ADSP-2136x’s internal clock (a multiple of CLKIN) provides the clock signal for timing internal memory, processor
core, serial ports, and parallel port (as required for read/write
strobes in asynchronous access mode). During reset, program
the ratio between the processor’s internal clock frequency and
external (CLKIN) clock frequency with the CLKCFG1–0 pins
(see Table 8 on Page 15). To determine switching frequencies
for the serial ports, divide down the internal clock, using the
programmable divider control of each port (DIVx for the
serial ports).
Table 11. Clock Periods
Timing
Requirements
tCK
tCCLK
tPCLK
tSCLK
tSPICLK
1
The ADSP-2136x’s internal clock switches at higher frequencies
than the system input clock (CLKIN). To generate the internal
clock, the processor uses an internal phase-locked loop (PLL).
This PLL-based clocking minimizes the skew between the system clock (CLKIN) signal and the processor’s internal clock (the
clock source for the parallel port logic and I/O pads).
Note the definitions of various clock periods that are a function
of CLKIN and the appropriate ratio control shown in Table 10
and Table 11.
Description
Input Clock
Core Clock
where:
SR = serial port-to-peripheral clock ratio (wide range, determined by SPORT
CLKDIV)
SPIR = SPI-to-peripheral clock ratio (wide range, determined by SPIBAUD
register)
DAI_Px = serial port clock
SPICLK = SPI clock
Figure 6 shows core to CLKIN ratios of 6:1, 16:1, and 32:1 with
external oscillator or crystal. Note that more ratios are possible
and can be set through software using the power management
control register (PMCTL). For more information, see the
ADSP-2136x SHARC Processor Programming Reference.
Table 10. ADSP-2136x Clock Generation Operation
Timing
Requirements
CLKIN
CCLK
Use the exact timing information given. Do not attempt to
derive parameters from the addition or subtraction of others.
While addition or subtraction would yield meaningful results
for an individual device, the values given in this data sheet
reflect statistical variations and worst cases. Consequently, it is
not meaningful to add parameters to derive longer times. See
Figure 39 on Page 46 under Test Conditions for voltage
reference levels.
Calculation
1/tCK
1/tCCLK
CCLK
(CORE CLOCK)
CLKIN
XTAL
Description1
CLKIN Clock Period
(Processor) Core Clock Period
(Peripheral) Clock Period = 2 × tCCLK
Serial Port Clock Period = (tPCLK) × SR
SPI Clock Period = (tPCLK) × SPIR
XTAL
OSC
INDIV
÷1, 2
DIVEN
÷2, 4, 8, 16
PLLM
PLLICLK
÷2
PCLK
(PERIPHERAL CLOCK)
CLK_CFG [1:0]
(6:1, 16:1, 32:1)
RESET
DELAY
CLKOUT
OR
RESETOUT
Figure 6. Core Clock and System Clock Relationship to CLKIN
Timing Requirements apply to signals that are controlled by circuitry external to the processor, such as the data input for a read
operation. Timing requirements guarantee that the processor
operates correctly with other devices.
circumstance. Use switching characteristics to ensure that any
timing requirement of a device connected to the processor (such
as memory) is satisfied.
Switching Characteristics specify how the processor changes its
signals. Circuitry external to the processor must be designed for
compatibility with these signal characteristics. Switching characteristics describe what the processor will do in a given
Rev. A |
Page 18 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Power-Up Sequencing
The timing requirements for processor startup are given in
Table 12.
Table 12. Power-Up Sequencing Timing Requirements (Processor Startup)
Parameter
Timing Requirements
tRSTVDD
tIVDDEVDD
tCLKVDD1
tCLKRST
tPLLRST
Min
RESET Low Before VDDINT/VDDEXT On
VDDINT On Before VDDEXT
CLKIN Valid After VDDINT/VDDEXT Valid
CLKIN Valid Before RESET Deasserted
PLL Control Setup Before RESET Deasserted
0
–50
0
102
20
Switching Characteristic
Core Reset Deasserted After RESET Deasserted
tCORERST
Max
+200
+200
Unit
ns
ms
ms
μs
μs
4096tCK + 2 tCCLK 3, 4
1
Valid VDDINT/VDDEXT assumes that the supplies are fully ramped to their 1.2 volt rails and 3.3 volt rails. Voltage ramp rates can vary from microseconds to hundreds of
milliseconds depending on the design of the power supply subsystem.
2
Assumes a stable CLKIN signal, after meeting worst-case start-up timing of crystal oscillators. Refer to your crystal oscillator manufacturer’s data sheet for start-up time.
Assume a 25 ms maximum oscillator start-up time if using the XTAL pin and internal oscillator circuit in conjunction with an external crystal.
3
Applies after the power-up sequence is complete. Subsequent resets require a minimum of 4 CLKIN cycles for RESET to be held low in order to properly initialize and
propagate default states at all I/O pins.
4
The 4096 cycle count depends on tSRST specification in Table 14. If setup time is not met, 1 additional CLKIN cycle may be added to the core reset time, resulting in 4097
cycles maximum.
RESET
tRSTVDD
VDDINT
tIVDDEVDD
tCLKVDD
VDDEXT
CLKIN
tCLKRST
CLK_CFG1-0
tCORERST
tPLLRST
RSTOUT
Figure 7. Power-Up Sequencing
Rev. A |
Page 19 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Clock Input
Table 13. Clock Input
Parameter
333 MHz
Max
Min
Timing Requirements
tCK
CLKIN Period
tCKL
CLKIN Width Low
tCKH
CLKIN Width High
tCKRF
CLKIN Rise/Fall (0.4 V to 2.0 V)
tCCLK2
CCLK Period
CLKIN Jitter Tolerance
tCKJ3,4
181
7.51
7.51
Unit
100
ns
ns
ns
ns
ns
ps
3
10
+250
3.01
–250
1
Applies only for CLKCFG1–0 = 00 and default values for PLL control bits in PMCTL.
Any changes to PLL control bits in the PMCTL register must meet core clock timing specification tCCLK.
3
Actual input jitter should be combined with ac specifications for accurate timing analysis.
4
Jitter specification is maximum peak-to-peak time interval error (TIE) jitter.
2
tC K J
tC K
C LK IN
tC K H
tC K L
Figure 8. Clock Input
Clock Signals
The ADSP-2136x can use an external clock or a crystal. See the
CLKIN pin description in Table 4 on Page 12. The user application program can configure theADSP-2136x to use its internal
clock generator by connecting the necessary components to the
CLKIN and XTAL pins. Figure 9 shows the component connections used for a fundamental frequency crystal operating in
parallel mode.
Note that the clock rate is achieved using a 16.67 MHz crystal
and a PLL multiplier ratio 16:1 (CCLK:CLKIN achieves a clock
speed of 266.72 MHz). To achieve the full core clock rate, programs need to configure the multiplier bits in the
PMCTL register.
ADSP-2136X
R1
1M⍀*
CLKIN
XTAL
R2
47⍀*
C1
22pF
Y1
C2
22pF
24.576MHz
R2 SHOULD BE CHOSEN TO LIMIT CRYSTAL
DRIVE POWER. REFER TO CRYSTAL
MANUFACTURER’S SPECIFICATIONS
*TYPICAL VALUES
Figure 9. 333 MHz Operation (Fundamental Mode Crystal)
Rev. A |
Page 20 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Reset
Table 14. Reset
Parameter
Timing Requirements
tWRST1
RESET Pulse Width Low
tSRST
RESET Setup Before CLKIN Low
1
Min
Max
Unit
4tCK
8
ns
ns
Applies after the power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 100 μs while RESET is low, assuming stable
VDD and CLKIN (not including start-up time of external clock oscillator).
CLKIN
tSRST
tWRST
RESET
Figure 10. Reset
Interrupts
The following timing specification applies to the FLAG0,
FLAG1, and FLAG2 pins when they are configured as IRQ0,
IRQ1, and IRQ2 interrupts.
Table 15. Interrupts
Parameter
Timing Requirement
tIPW
IRQx Pulse Width
Min
2 × tPCLK +2
DAI20-1
FLAG2-0
(IRQ2-0)
tIPW
Figure 11. Interrupts
Rev. A |
Page 21 of 52 |
December 2006
Max
Unit
ns
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Core Timer
The following timing specification applies to FLAG3 when it is
configured as the core timer (CTIMER).
Table 16. Core Timer
Parameter
Switching Characteristic
tWCTIM
CTIMER Pulse Width
Min
Max
Unit
2 × tPCLK – 1
ns
tWCTIM
FLAG3
(CTIMER)
Figure 12. Core Timer
Timer PWM_OUT Cycle Timing
The following timing specification applies to Timer0, Timer1,
and Timer2 in PWM_OUT (pulse-width modulation) mode.
Timer signals are routed to the DAI_P20–1 pins through the
SRU. Therefore, the timing specifications provided below are
valid at the DAI_P20–1 pins.
Table 17. Timer PWM_OUT Timing
Parameter
Switching Characteristic
tPWMO
Timer Pulse Width Output
Min
Max
Unit
2 tPCLK – 1
2(231 – 1) tPCLK
ns
tPWM O
DAI_P20 -1
(TIMER2-0)
Figure 13. Timer PWM_OUT Timing
Rev. A |
Page 22 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Timer WDTH_CAP Timing
The following timing specification applies to Timer0, Timer1,
and Timer2 in WDTH_CAP (pulse width count and capture)
mode. Timer signals are routed to the DAI_P20–1 pins through
the SRU. Therefore, the timing specification provided below are
valid at the DAI_P20–1 pins.
Table 18. Timer Width Capture Timing
Parameter
Timing Requirement
tPWI
Timer Pulse Width
Min
Max
Unit
2 tPCLK
2(231– 1) tPCLK
ns
tPWI
DAI_P20-1
(TIMER2-0)
Figure 14. Timer Width Capture Timing
DAI Pin to Pin Direct Routing
For direct pin connections only (for example, DAI_PB01_I to
DAI_PB02_O).
Table 19. DAI Pin to Pin Routing
Parameter
Timing Requirement
tDPIO
Delay DAI Pin Input Valid to DAI Output Valid
Min
Max
Unit
1.5
10
ns
DAI_Pn
DAI_Pm
tDPIO
Figure 15. DAI Pin to Pin Direct Routing
Rev. A |
Page 23 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Precision Clock Generator (Direct Pin Routing)
This timing is only valid when the SRU is configured such that
the precision clock generator (PCG) takes its inputs directly
from the DAI pins (via pin buffers) and sends its outputs
directly to the DAI pins. For the other cases, where the PCG’s
inputs and outputs are not directly routed to/from DAI pins (via
pin buffers) there is no timing data available. All timing parameters and switching characteristics apply to external DAI pins
(DAI_P01 – DAI_P20).
Table 20. Precision Clock Generator (Direct Pin Routing)
Parameter
Min
Max
Unit
Timing Requirements
tPCGIP
Input Clock Period
20
ns
tSTRIG
PCG Trigger Setup Before Falling
4.5
ns
Edge of PCG Input Clock
tHTRIG
PCG Trigger Hold After Falling
3
ns
Edge of PCG Input Clock
Switching Characteristics
tDPCGIO
PCG Output Clock and Frame Sync Active Edge
Delay After PCG Input Clock
2.5
10
ns
tDTRIGCLK
PCG Output Clock Delay After PCG Trigger
2.5 + ((2.5 + D) × tPCGIP)
10 + ((2.5 + D) × tPCGIP)
ns
tDTRIGFS
PCG Frame Sync Delay After PCG Trigger
2.5 + ((2.5 + D – PH) × tPCGIP)
10 + ((2.5 + D – PH) × tPCGIP)
ns
tPCGOP
Output Clock Period
2 × tPCGIP1
ns
D = FSxDIV, PH = FSxPHASE. For more information, see the ADSP-2136x SHARC Processor Hardware Reference, “Precision Clock Generators”
chapter.
1
In normal mode, tPCGOP (min) = 2 × tPCGIP.
tSTRIG
tHTRIG
DAI_Pn
PCG_TRIGx_I
tPCGIP
DAI_Pm
PCG_EXTx_I
(CLKIN)
tDPCGIO
DAI_Py
PCG_CLKx_O
tDTRIGCLK
tDPCGIO
DAI_Pz
PCG_FSx_O
tDTRIGFS
Figure 16. Precision Clock Generator (Direct Pin Routing)
Rev. A |
Page 24 of 52 |
December 2006
tPCGOP
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Flags
The timing specifications provided below apply to the FLAG3–0
and DAI_P20–1 pins, the parallel port, and the serial peripheral
interface (SPI). See Table 4, “Pin Descriptions,” on Page 12 for
more information on flag use.
Table 21. Flags
Parameter
Timing Requirement
tFIPW
FLAG3–0 IN Pulse Width
Min
Switching Characteristic
tFOPW
FLAG3–0 OUT Pulse Width
ns
2 × tPCLK – 1
ns
tFIPW
DAI_P20-1
(FLAG3-0OUT)
(DATA31-0)
tFOPW
Figure 17. Flags
Page 25 of 52 |
Unit
2 × tPCLK + 3
DAI_P20-1
(FLAG3-0IN)
(DATA31-0)
Rev. A |
Max
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Memory Read—Parallel Port
Use these specifications for asynchronous interfacing to memories (and memory-mapped peripherals) when the ADSP-2136x
is accessing external memory space.
Table 22. 8-Bit Memory Read Cycle
Parameter
Timing Requirements
AD7–0 Data Setup Before RD High
tDRS1
tDRH
AD7–0 Data Hold After RD High
tDAD1
AD15–8 Address to AD7–0 Data Valid
Min
2
The timing specified here is sufficient to satisfy either tDAD or tDRS as they are independent.
On reset, ALE is an active high cycle. However, it can be configured by software to be active low.
Rev. A |
Unit
D + tPCLK – 5.0
ns
ns
ns
3.3
0
Switching Characteristics
tALEW
ALE Pulse Width
2 × tPCLK – 2.0
tADAS2
AD15–0 Address Setup Before ALE Deasserted
tPCLK – 2.5
tRRH
Delay Between RD Rising Edge to Next
H + tPCLK – 1.4
Falling Edge
tALERW
ALE Deasserted to Read Asserted
2 × tPCLK – 3.8
tRWALE
Read Deasserted to ALE Asserted
F + H + 0.5
tADAH2
AD15–0 Address Hold After ALE Deasserted
tPCLK – 2.3
ALE Deasserted to AD7–0 Address in High Z
tPCLK
tALEHZ2
tRW
RD Pulse Width
D – 2.0
tRDDRV
AD7–0 ALE Address Drive After Read High
F + H + tPCLK – 2.3
tADRH
AD15–8 Address Hold After RD High
H
tDAWH
AD15–8 Address to RD High
D + tPCLK – 4.0
D = (data cycle duration = the value set by the PPDUR Bits (5–1) in the PPCTL register) × tPCLK
H = tPCLK (if a hold cycle is specified, else H = 0)
F = 7 × tPCLK (if FLASH_MODE is set, else F = 0)
tPCLK = (peripheral) clock period = 2 × tCCLK
1
Max
Page 26 of 52 |
December 2006
ns
ns
ns
tPCLK + 3.0
ns
ns
ns
ns
ns
ns
ns
ns
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
tRWALE
ALE
tALERW
tALEW
tRRH
RD
tRW
tRDDRV
WR
tDAWH
tADAS
AD15-8
tADRH
tADAH
VALID ADDRESS
VALID ADDRESS
VALID ADDRESS
tDAD
AD7-0
VALID ADDRESS
VALID
DATA
tALEHZ
NOTE: MEMORY READS ALWAYS OCCUR IN GROUPS OF FOUR
BETWEEN ALE CYCLES. THIS FIGURE ONLY SHOWS TWO MEMORY
READS IN ORDER TO PROVIDE THE NECESSARY TIMING INFORMATION.
Figure 18. Read Cycle for 8-Bit Memory Timing
Rev. A |
Page 27 of 52 |
December 2006
tDRS
VALID
ADDRESS
tDRH
VALID
DATA
VALID
ADDRESS
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Table 23. 16-Bit Memory Read Cycle
Parameter
Timing Requirements
tDRS
AD15–0 Data Setup Before RD High
AD15–0 Data Hold After RD High
tDRH
Min
Max
3.3
0
ns
ns
Switching Characteristics
tALEW
ALE Pulse Width
2 × tPCLK – 2.0
AD15–0 Address Setup Before ALE Deasserted
tPCLK – 2.5
tADAS1
tALERW
ALE Deasserted to Read Asserted
2 × tPCLK – 3.8
tRRH2
Delay Between RD Rising Edge to Next Falling Edge
H + tPCLK – 1.4
tRWALE
Read Deasserted to ALE Asserted
F + H + 0.5
tRDDRV
ALE Address Drive After Read High
F + H + tPCLK – 2.3
tADAH1
AD15–0 Address Hold After ALE Deasserted
tPCLK – 2.3
ALE Deasserted to Address/Data15–0 in High Z
tPCLK
tALEHZ1
tRW
RD Pulse Width
D – 2.0
D = (data cycle duration = the value set by the PPDUR Bits (5–1) in the PPCTL register) × tPCLK
H = tPCLK (if a hold cycle is specified, else H = 0)
F = 7 × tPCLK (if FLASH_MODE is set, else F = 0)
tPCLK = (peripheral) clock period = 2 × tCCLK
1
2
On reset, ALE is an active high cycle. However, it can be configured by software to be active low.
This parameter is only available when in EMPP = 0 mode.
tRWALE
tALERW
ALE
tALEW
tRRH
RD
tRW
WR
tALEHZ
tADAS
AD15-0
tADAH
VALID ADDRESS
tRDDRV
tDRS
tDRH
VALID DATA
VALID DATA
VALID
ADDRESS
NOTE: FOR 16-BIT MEMORY READS, WHEN EMPP ⫽ 0, ONLY ONE RD PULSE OCCURS BETWEEN ALE CYCLES.
WHEN EMPP = 0, MULTIPLE RD PULSES OCCUR BETWEEN ALE CYCLES. FOR COMPLETE INFORMATION,
SEE THE ADSP-2136X SHARC PROCESSOR HARDWARE REFERENCE.
Figure 19. Read Cycle for 16-Bit Memory Timing
Rev. A |
Page 28 of 52 |
December 2006
Unit
tPCLK + 3.0
ns
ns
ns
ns
ns
ns
ns
ns
ns
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Memory Write—Parallel Port
Use these specifications for asynchronous interfacing to memories (and memory-mapped peripherals) when the
ADSP-2136x is accessing external memory space.
Table 24. 8-Bit Memory Write Cycle
Parameter
Switching Characteristics
ALE Pulse Width
tALEW
tADAS1
AD15–0 Address Setup Before ALE Deasserted
tALERW
ALE Deasserted to Write Asserted
tRWALE
Write Deasserted to ALE Asserted
tWRH
Delay Between WR Rising Edge to Next WR Falling Edge
tADAH1
AD15–0 Address Hold After ALE Deasserted
WR Pulse Width
tWW
tADWL
AD15–8 Address to WR Low
tADWH
AD15–8 Address Hold After WR High
tDWS
AD7–0 Data Setup Before WR High
tDWH
AD7–0 Data Hold After WR High
tDAWH
AD15–8 Address to WR High
D = (data cycle duration = the value set by the PPDUR Bits (5–1) in the PPCTL register) × tPCLK.
H = tPCLK (if a hold cycle is specified, else H = 0)
F = 7 × tPCLK (if FLASH_MODE is set, else F = 0). If FLASH_MODE is set, D must be ≥ 9 × tPCLK.
tPCLK = (peripheral) clock period = 2 × tCCLK
1
Min
2 × tPCLK – 2.0
tPCLK – 2.8
2 × tPCLK – 3.8
H + 0.5
F + H + tPCLK – 2.3
tPCLK – 0.5
D – F – 2.0
tPCLK – 2.8
H
D – F + tPCLK – 4.0
H
D – F + tPCLK – 4.0
On reset, ALE is an active high cycle. However, it can be configured by software to be active low.
ALE
tALERW
tALEW
tRWALE
tWW
WR
tWRH
tADWL
tDAWH
RD
tADAS
tADAH
tADWH
AD15-8
VALID
ADDRESS
VALID ADDRESS
VALID ADDRESS
tDWH
tDWS
AD7-0
VALID
ADDRESS
VALID DATA
VALID DATA
NOTE: MEMORY WRITES ALWAYS OCCUR IN GROUPS OF FOUR
BETWEEN ALE CYCLES. THIS FIGURE ONLY SHOWS TWO MEMORY
WRITES IN ORDER TO PROVIDE THE NECESSARY TIMING INFORMATION.
Figure 20. Write Cycle for 8-Bit Memory Timing
Rev. A |
Page 29 of 52 |
December 2006
Max
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Table 25. 16-Bit Memory Write Cycle
Parameter
Min
Switching Characteristics
tALEW
ALE Pulse Width
2 × tPCLK – 2.0
AD15–0 Address Setup Before ALE Deasserted
tPCLK – 2.5
tADAS1
tALERW
ALE Deasserted to Write Asserted
2 × tPCLK – 3.8
tRWALE
Write Deasserted to ALE Asserted
H + 0.5
tWRH2
Delay Between WR Rising Edge to Next WR Falling Edge
F + H + tPCLK – 2.3
tADAH1
AD15–0 Address Hold After ALE Deasserted
tPCLK – 2.3
tWW
WR Pulse Width
D – F – 2.0
tDWS
AD15–0 Data Setup Before WR High
D – F + tPCLK – 4.0
AD15–0 Data Hold After WR High
H
tDWH
D = (data cycle duration = the value set by the PPDUR Bits (5–1) in the PPCTL register) × tPCLK.
H = tPCLK (if a hold cycle is specified, else H = 0)
F = 7 × tPCLK (if FLASH_MODE is set, else F = 0). If FLASH_MODE is set, D must be ≥ 9 × tPCLK.
tPCLK = (peripheral) clock period = 2 × tCCLK
1
2
Max
ns
ns
ns
ns
ns
ns
ns
ns
ns
On reset, ALE is an active high cycle. However, it can be configured by software to be active low.
This parameter is only available when in EMPP = 0 mode.
tALEW
tALERW
ALE
tRWALE
tWW
WR
tWRH
RD
tADAS
AD15-0
tDWH
tADAH
VALID
ADDRESS
VALID DATA
VALID DATA
tDWS
NOTE: FOR 16-BIT MEMORY WRITES, WHEN EMPP ⫽ 0, ONLY ONE WR PULSE OCCURS BETWEEN ALE CYCLES.
WHEN EMPP = 0, MULTIPLE WR PULSES OCCUR BETWEEN ALE CYCLES. FOR COMPLETE INFORMATION,
SEE THE ADSP-2136X SHARC PROCESSOR HARDWARE REFERENCE.
Figure 21. Write Cycle for 16-Bit Memory Timing
Rev. A |
Page 30 of 52 |
December 2006
Unit
VALID
ADDRESS
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Serial Ports
To determine whether communication is possible between two
devices at clock speed n, the following specifications must be
confirmed: 1) frame sync delay and frame sync setup and hold,
2) data delay and data setup and hold, and 3) SCLK width.
Serial port signals (SCLK, FS, data channel A, data channel B)
are routed to the DAI_P20–1 pins using the SRU. Therefore, the
timing specifications provided below are valid at the
DAI_P20–1 pins.
Table 26. Serial Ports—External Clock
Parameter
Timing Requirements
tSFSE1
FS Setup Before SCLK
(Externally Generated FS in Either Transmit or Receive Mode)
tHFSE1
FS Hold After SCLK
(Externally Generated FS in Either Transmit or Receive Mode)
1
tSDRE
Receive Data Setup Before Receive SCLK
tHDRE1
Receive Data Hold After SCLK
tSCLKW
SCLK Width
tSCLK
SCLK Period
Switching Characteristics
tDFSE2
FS Delay After SCLK
(Internally Generated FS in Either Transmit or Receive Mode)
tHOFSE2
FS Hold After SCLK
(Internally Generated FS in Either Transmit or Receive Mode)
tDDTE2
Transmit Data Delay After Transmit SCLK
tHDTE2
Transmit Data Hold After Transmit SCLK
1
2
Min
Max
Unit
2.5
ns
2.5
2.5
2.5
12
24
ns
ns
ns
ns
ns
9.5
ns
9.5
ns
ns
ns
2
2
Referenced to sample edge.
Referenced to drive edge.
Table 27. Serial Ports—Internal Clock
Parameter
Timing Requirements
tSFSI1
FS Setup Before SCLK
(Externally Generated FS in Either Transmit or Receive Mode)
FS Hold After SCLK
tHFSI1
(Externally Generated FS in Either Transmit or Receive Mode)
1
tSDRI
Receive Data Setup Before SCLK
tHDRI1
Receive Data Hold After SCLK
Switching Characteristics
tDFSI2
FS Delay After SCLK (Internally Generated FS in Transmit Mode)
FS Hold After SCLK (Internally Generated FS in Transmit Mode)
tHOFSI2
2
tDFSIR
FS Delay After SCLK (Internally Generated FS in Receive Mode)
tHOFSIR2
FS Hold After SCLK (Internally Generated FS in Receive Mode)
tDDTI2
Transmit Data Delay After SCLK
2
tHDTI
Transmit Data Hold After SCLK
tSCLKIW
Transmit or Receive SCLK Width
1
2
Referenced to the sample edge.
Referenced to drive edge.
Rev. A |
Page 31 of 52 |
December 2006
Min
Max
Unit
7
ns
2.5
7
2.5
ns
ns
ns
3
–1.0
8
–1.0
3
–1.0
0.5tSCLK – 2
0.5tSCLK + 2
ns
ns
ns
ns
ns
ns
ns
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Table 28. Serial Ports—Enable and Three-State
Parameter
Switching Characteristics
tDDTEN1
Data Enable from External Transmit SCLK
Data Disable from External Transmit SCLK
tDDTTE1
tDDTIN1
Data Enable from Internal Transmit SCLK
1
Min
Max
Unit
7
ns
ns
ns
Max
Unit
9
ns
ns
2
–1
Referenced to drive edge.
Table 29. Serial Ports—External Late Frame Sync
Parameter
Min
Switching Characteristics
tDDTLFSE1
Data Delay from Late External Transmit FS or External Receive
FS with MCE = 1, MFD = 0
tDDTENFS1
Data Enable for MCE = 1, MFD = 0
0.5
1
The tDDTLFSE and tDDTENFS parameters apply to left-justified sample pair as well as DSP serial mode, and MCE = 1, MFD = 0.
EXTERNAL RECEIVE FS WITH MCE = 1, MFD = 0
DAI_P20-1
(SCLK)
DRIVE
SAMPLE
tSFSE/I
DRIVE
tHFSE/I
DAI_P20-1
(FS)
tDDTE/I
tDDTENFS
tHDTE/I
DAI_P20-1
(DATA CHANNEL A/B)
1ST BIT
2ND BIT
tDDTLFSE
LATE EXTERNAL TRANSMIT FS
DAI_P20-1
(SCLK)
DRIVE
SAMPLE
tSFSE/I
DRIVE
tHFSE/I
DAI_P20-1
(FS)
tDDTE/I
tDDTENFS
tHDTE/I
DAI_P20-1
(DATA CHANNEL A/B)
1ST BIT
2ND BIT
tDDTLFSE
NOTE: SERIAL PORT SIGNALS (SCLK, FS, DATA CHANNEL A/B) ARE ROUTED TO THE DAI_P20-1 PINS
USING THE SRU. THE TIMING SPECIFICATIONS PROVIDED HERE ARE VALID AT THE DAI_P20-1 PINS.
Figure 22. External Late Frame Sync1
1
This figure reflects changes made to support left-justified sample pair mode.
Rev. A |
Page 32 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
DATA RECEIVE—EXTERNAL CLOCK
DATA RECEIVE—INTERNAL CLOCK
DRIVE EDGE
DRIVE EDGE
SAMPLE EDGE
SAMPLE EDGE
tSCLKIW
tSCLKW
DAI_P20-1
(SCLK)
DAI_P20-1
(SCLK)
tDFSIR
tDFSE
tHFSI
tSFSI
tHOFSR
DAI_P20-1
(FS)
tHFSE
tSFSE
tHOFSE
DAI_P20-1
(FS)
tSDRI
tHDRI
DAI_P20-1
(DATA CHANNEL A/B)
tSDRE
tHDRE
DAI_P20-1
(DATA CHANNEL A/B)
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL), SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DATA TRANSMIT—INTERNAL CLOCK
DRIVE EDGE
DATA TRANSMIT—EXTERNAL CLOCK
SAMPLE EDGE
DRIVE EDGE
SAMPLE EDGE
tSCLKIW
tSCLKW
DAI_P20-1
(SCLK)
DAI_P20-1
(SCLK)
tDFSI
tHOFSI
tDFSE
tHFSI
tSFSI
DAI_P20-1
(FS)
tHOFSE
tSFSE
tHFSE
DAI_P20-1
(FS)
tDDTI
tHDTI
tHDTE
DAI_P20-1
(DATA CHANNEL A/B)
tDDTE
DAI_P20-1
(DATA CHANNEL A/B)
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL), SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DRIVE EDGE
DRIVE EDGE
DAI_P20-1
SCLK (EXT)
SCLK
tDDTEN
tDDTTE
DAI_P20-1
(DATA CHANNEL A/B)
DRIVE EDGE
DAI_P20-1
SCLK (INT)
tDDTIN
DAI_P20-1
(DATA CHANNEL A/B)
Figure 23. Serial Ports
Rev. A |
Page 33 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Input Data Port (IDP)
The timing requirements for the IDP are given in Table 30. IDP
signals (SCLK, FS, SDATA) are routed to the DAI_P20–1 pins
using the SRU. Therefore, the timing specifications provided
below are valid at the DAI_P20–1 pins.
Table 30. IDP
Parameter
Timing Requirements
tSISFS1
FS Setup Before SCLK Rising Edge
1
tSIHFS
FS Hold After SCLK Rising Edge
SDATA Setup Before SCLK Rising Edge
tSISD1
tSIHD1
SDATA Hold After SCLK Rising Edge
tIDPCLKW
Clock Width
tIDPCLK
Clock Period
1
Min
3
3
3
3
9
24
Max
Unit
ns
ns
ns
ns
ns
ns
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG’s input can be either CLKIN or any of the DAI pins.
SAMPLE EDGE
tIDPCLK
tIDPCLKW
DAI_P20-1
(SCLK)
tSISFS
tSIHFS
DAI_P20-1
(FS)
tSISD
tSIHD
DAI_P20-1
(SDATA)
Figure 24. IDP Master Timing
Rev. A |
Page 34 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Hardware Reference. Note that the most significant 16 bits of
external PDAP data can be provided through either the parallel
port AD15–0 or the DAI_P20–5 pins. The remaining 4 bits can
only be sourced through DAI_P4–1. The timing below is valid
at the DAI_P20–1 pins or at the AD15–0 pins.
Parallel Data Acquisition Port (PDAP)
The timing requirements for the PDAP are provided in
Table 31. PDAP is the parallel mode operation of Channel 0 of
the IDP. For details on the operation of the IDP, see the IDP
chapter of the ADSP-2136x SHARC Processor
Table 31. Parallel Data Acquisition Port (PDAP)
1
Parameter
Timing Requirements
tSPCLKEN1
PDAP_CLKEN Setup Before PDAP_CLK Sample Edge
1
tHPCLKEN
PDAP_CLKEN Hold After PDAP_CLK Sample Edge
PDAP_DAT Setup Before SCLK PDAP_CLK Sample Edge
tPDSD1
tPDHD1
PDAP_DAT Hold After SCLK PDAP_CLK Sample Edge
tPDCLKW
Clock Width
tPDCLK
Clock Period
Min
Max
Unit
2.5
2.5
3.0
2.5
7.0
24
ns
ns
ns
ns
ns
ns
Switching Characteristics
tPDHLDD
Delay of PDAP Strobe After Last PDAP_CLK Capture Edge for a Word
tPDSTRB
PDAP Strobe Pulse Width
2 × tPCLK – 1
2 × tPCLK – 1.5
ns
ns
Source pins of DATA are ADDR7–0, DATA7–0, or DAI pins. Source pins for SCLK and FS are: 1) DAI pins, 2) CLKIN through PCG, or 3) DAI pins through PCG.
SAMPLE EDGE
t PDCLK
t PDCLKW
DAI_P20 -1
(PDAP_CLK)
t SPCLKEN
t HPCLKEN
DAI_P20 -1
(PDAP_CLKEN)
t PDSD
t PDHD
DATA
DAI_P20-1
(PDAP_STROBE)
tPDSTRB
t PDHLDD
Figure 25. PDAP Timing
Rev. A |
Page 35 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Pulse-Width Modulation Generators
Table 32. PWM Timing
Parameter
Switching Characteristics
tPWMW
PWM Output Pulse Width
tPWMP
PWM Output Period
Min
Max
Unit
tPCLK – 2
2 × tPCLK – 1.5
(216 – 2) × tPCLK – 2
(216 – 1) × tPCLK
ns
ns
tPWMW
PWM
OUTPUTS
tPWMP
Figure 26. PWM Timing
Sample Rate Converter—Serial Input Port
The SRC input signals (SCLK, FS, and SDATA) are routed from
the DAI_P20–1 pins using the SRU. Therefore, the timing specifications provided in Table 33 are valid at the DAI_P20–1 pins.
This feature is not available on the ADSP-21363 models.
Table 33. SRC, Serial Input Port
Parameter
Timing Requirements
tSRCSFS1
FS Setup Before SCLK Rising Edge
FS Hold After SCLK Rising Edge
tSRCHFS1
1
tSRCSD
SDATA Setup Before SCLK Rising Edge
tSRCHD1
SDATA Hold After SCLK Rising Edge
tSRCCLKW
Clock Width
tSRCCLK
Clock Period
1
Min
3
3
3
3
36
80
Max
Unit
ns
ns
ns
ns
ns
ns
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG’s input can be either CLKIN or any of the DAI pins.
SAMPLE EDGE
tSRCCLK
tSRCCLKW
DAI_P20-1
(SCLK)
tSRCSFS
tSRCHFS
DAI_P20-1
(FS)
tSRCSD
tSRCHD
DAI_P20-1
(SDATA)
Figure 27. SRC Serial Input Port Timing
Rev. A |
Page 36 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Sample Rate Converter—Serial Output Port
For the serial output port, the frame-sync is an input and should
meet setup and hold times with regard to SCLK on the output
port. The serial data output, SDATA, has a hold time and delay
specification with regard to SCLK. Note that SCLK rising edge is
the sampling edge and the falling edge is the drive edge.
Table 34. SRC, Serial Output Port
1
Parameter
Timing Requirements
tSRCSFS1
FS Setup Before SCLK Rising Edge
tSRCHFS1
FS Hold After SCLK Rising Edge
Min
3
3
Switching Characteristics
tSRCTDD1
Transmit Data Delay After SCLK Falling Edge
tSRCTDH1
Transmit Data Hold After SCLK Falling Edge
2
Max
Unit
ns
ns
10.5
ns
ns
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG’s input can be either CLKIN or any of the DAI pins.
SAMPLE EDGE
tSRCCLK
tSRCCLKW
DAI_P20-1
(SCLK)
tSRCSFS
tSRCHFS
DAI_P20-1
(FS)
tSRCTDD
DAI_P20-1
(SDATA)
tSRCTDH
Figure 28. SRC Serial Output Port Timing
Rev. A |
Page 37 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
SPDIF Transmitter
SPDIF Transmitter—Serial Input Waveforms
Serial data input to the SPDIF transmitter can be formatted as
left-justified, I2S, or right-justified with word widths of 16, 18,
20, or 24 bits. The following sections provide timing for the
transmitter. This feature is not available on the
ADSP-21363 models.
Figure 29 shows the right-justified mode. LRCLK is HI for the
left channel and LO for the right channel. Data is valid on the
rising edge of SCLK. The MSB is delayed 12-bit clock periods
(in 20-bit output mode) or 16-bit clock periods (in 16-bit output
mode) from an LRCLK transition, so that when there are
64 SCLK periods per LRCLK period, the LSB of the data will be
right-justified to the next LRCLK transition.
LRCLK
RIGHT CHANNEL
LEFT CHANNEL
SCLK
SDATA
LSB
MSB
MSB-1
MSB-2
LSB+2 LSB+1
LSB
MSB
MSB-1 MSB-2
LSB+2
LSB+1
LSB
Figure 29. Right -Justified Mode
Figure 30 shows the default I2S-justified mode. LRCLK is LO for
the left channel and HI for the right channel. Data is valid on the
rising edge of SCLK. The MSB is left-justified to an LRCLK
transition but with a single SCLK period delay.
RIGHT CHANNEL
LRCLK
LEFT CHANNEL
SCLK
SDATA
MSB
MSB-1 MSB-2
LSB+2 LSB+1
LSB
MSB
MSB-1
MSB-2
LSB+2
LSB+1
LSB
MSB
Figure 30. I2S-Justified Mode
Figure 31 shows the left-justified mode. LRCLK is HI for the left
channel and LO for the right channel. Data is valid on the rising
edge of SCLK. The MSB is left-justified to an LRCLK transition
with no MSB delay.
LRCLK
RIGHT CHANNEL
LEFT CHANNEL
SCLK
SDATA
MSB
MSB-1
MSB-2
LSB+2
LSB+1
LSB
MSB
MSB-1
MSB-2
Figure 31. Left-Justified Mode
Rev. A |
Page 38 of 52 |
December 2006
LSB+2
LSB+1
LSB
MSB
MSB+1
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
SPDIF Transmitter Input Data Timing
The timing requirements for the input port are given in
Table 35. Input signals (SCLK, FS, and SDATA) are routed to
the DAI_P20–1 pins using the SRU. Therefore, the timing specifications provided below are valid at the DAI_P20–1 pins.
Table 35. SPDIF Transmitter Input Data Timing
Parameter
Timing Requirements
tSISFS1
FS Setup Before SCLK Rising Edge
tSIHFS1
FS Hold After SCLK Rising Edge
tSISD1
SDATA Setup Before SCLK Rising Edge
tSIHD1
SDATA Hold After SCLK Rising Edge
Clock Width
tSISCLKW
tSISCLK
Clock Period
tSITXCLKW
Transmit Clock Width
tSITXCLK
Transmit Clock Period
1
Min
Max
3
3
3
3
36
80
9
20
Unit
ns
ns
ns
ns
ns
ns
ns
ns
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG’s input can be either CLKIN or any of the DAI pins.
tSITXCLKW
SAMPLE EDGE
tSITXCLK
DAI_P20-1
(TXCLK)
tSISCLKW
DAI_P20-1
(SCLK)
tSISFS
tSIHFS
DAI_P20-1
(FS)
tSISD
tSIHD
DAI_P20-1
(SDATA)
Figure 32. SPDIF Transmitter Input Timing
Oversampling Clock (TXCLK) Switching Characteristics
SPDIF Transmitter has an over sampling clock. This TXCLK
input is divided down to generate the biphase clock.
Table 36. Oversampling Clock (TXCLK) Switching Characteristics
Parameter
TXCLK Frequency for TXCLK = 768 × FS
TXCLK Frequency for TXCLK = 512 × FS
TXCLK Frequency for TXCLK = 384 × FS
TXCLK Frequency for TXCLK = 256 × FS
Frame Rate
Min
Rev. A |
Page 39 of 52 |
December 2006
Max
147.5
98.4
73.8
49.2
192.0
Unit
MHz
MHz
MHz
MHz
kHz
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
SPDIF Receiver
The following section describes timing as it relates to the SPDIF
receiver. This feature is not available on the
ADSP-21363 models.
Internal Digital PLL Mode
In the internal digital phase-locked loop mode the internal PLL
(digital PLL) generates the 512 × FS clock.
Table 37. SPDIF Receiver Output Timing (Internal Digital PLL Mode)
Parameter
Switching Characteristics
tDFSI
tHOFSI
tDDTI
tHDTI
tSCLKIW1
tCCLK
1
Min
LRCLK Delay After SCLK
LRCLK Hold After SCLK
Transmit Data Delay After SCLK
Transmit Data Hold After SCLK
Transmit SCLK Width
Core Clock Period
5
ns
ns
ns
ns
ns
ns
5
–2
38
5
DRIVE EDGE
SAMPLE EDGE
tSCLKIW
DAI_P20-1
(SCLK)
tDFSI
tHOFSI
DAI_P20-1
(FS)
tDDTI
DAI_P20-1
(DATA CHANNEL A/B)
Figure 33. SPDIF Receiver Internal Digital PLL Mode Timing
Rev. A |
Unit
–2
SCLK frequency is 64 × FS where FS = the frequency of LRCLK.
tHDTI
Max
Page 40 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
SPI Interface—Master
The ADSP-2136x contains two SPI ports. The primary has dedicated pins and the secondary is available through the DAI. The
timing provided in Table 38 and Table 39 applies to both.
Table 38. SPI Interface Protocol—Master Switching and Timing Specifications
Parameter
Timing Requirements
Data Input Valid to SPICLK Edge (Data Input Setup Time)
tSSPIDM
tSSPIDM
Data Input Valid to SPICLK Edge (Data Input Setup Time)
(SPI2)
tHSPIDM
SPICLK Last Sampling Edge to Data
Input Not Valid
Switching Characteristics
Serial Clock Cycle
tSPICLKM
tSPICHM
Serial Clock High Period
tSPICLM
Serial Clock Low Period
tDDSPIDM
SPICLK Edge to Data Out Valid
(Data Out Delay Time)
tDDSPIDM
SPICLK Edge to Data Out Valid
(Data Out Delay Time) (SPI2)
tHDSPIDM
SPICLK Edge to Data Out Not Valid
(Data Out Hold Time)
tSDSCIM
FLAG3–0IN (SPI Device Select) Low to First SPICLK Edge
tSDSCIM
FLAG3–0IN (SPI Device Select) Low to First SPICLK Edge (SPI2)
tHDSM
Last SPICLK Edge to FLAG3–0IN High
tSPITDM
Sequential Transfer Delay
Rev. A |
Page 41 of 52 |
Min
Max
Unit
5.2
8.2
ns
ns
2
ns
8 × tPCLK – 2
4 × tPCLK – 2
4 × tPCLK – 2
3.0
ns
ns
ns
ns
8.0
ns
2
ns
4 × tPCLK – 2.5
4 × tPCLK – 2.5
4 × tPCLK – 2
4 × tPCLK – 1
ns
ns
ns
ns
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
FLAG3-0
(OUTPUT)
tSDSCIM
tSPICHM
tSPICLM
tSPICLM
tSPICHM
tSPICLKM
tHDSM
tSPIT DM
SPICLK
(CP = 0)
(OUTPUT)
SPICLK
(CP = 1)
(OUTPUT)
t HDSPIDM
tD D S P I D M
MOSI
(OUTPUT)
MSB
LSB
tS S P I D M
CPHASE = 1
tSSPIDM
MISO
(INPUT)
MSB
VALID
LSB
VALID
tDDSPIDM
MOSI
(OUTPUT)
CPHASE = 0
MISO
(INPUT)
tH S P I D M
tHSPIDM
tHDSPIDM
MSB
tSSPIDM
LSB
tHSPIDM
MSB
VALID
LSB
VALID
Figure 34. SPI Master Timing
Rev. A |
Page 42 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
SPI Interface—Slave
Table 39. SPI Interface Protocol—Slave Switching and Timing Specifications
Parameter
Timing Requirements
tSPICLKS
Serial Clock Cycle
tSPICHS
Serial Clock High Period
tSPICLS
Serial Clock Low Period
tSDSCO
SPIDS Assertion to First SPICLK Edge
CPHASE = 0
CPHASE = 1
Last SPICLK Edge to SPIDS Not Asserted, CPHASE = 0
tHDS
tSSPIDS
Data Input Valid to SPICLK Edge (Data Input Setup Time)
tHSPIDS
SPICLK Last Sampling Edge to Data Input Not Valid
tSDPPW
SPIDS Deassertion Pulse Width (CPHASE = 0)
Switching Characteristics
tDSOE
SPIDS Assertion to Data Out Active
1
tDSOE
SPIDS Assertion to Data Out Active (SPI2)
tDSDHI
SPIDS Deassertion to Data High Impedance
SPIDS Deassertion to Data High Impedance (SPI2)
tDSDHI1
tDDSPIDS
SPICLK Edge to Data Out Valid (Data Out Delay Time)
tHDSPIDS
SPICLK Edge to Data Out Not Valid (Data Out Hold Time)
tDSOV
SPIDS Assertion to Data Out Valid (CPHASE = 0)
1
Min
Max
Unit
4 × tPCLK – 2
2 × tPCLK – 2
2 × tPCLK – 2
ns
ns
ns
2 × tPCLK
2 × tPCLK
2 × tPCLK
2
2
2 × tPCLK
ns
ns
ns
ns
ns
ns
0
0
0
0
5
8
5
8.6
9.5
2 × tPCLK
5 × tPCLK
ns
ns
ns
ns
ns
ns
ns
The timing for these parameters applies when the SPI is routed through the signal routing unit. For more information, see the ADSP-2136x SHARC Processor Hardware
Reference, “Serial Peripheral Interface Port” chapter.
Rev. A |
Page 43 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
SPIDS
(INPUT)
t S P IC H S
tSPICLS
tSPICL KS
tHDS
SPICLK
(CP = 0)
(INPUT)
tSPICLS
tSDSCO
SPICLK
(CP = 1)
(INPUT)
tSPICHS
tDSDHI
tDDSPIDS
tDSOE
tSDPPW
tDDSPIDS
MISO
(OUTPUT)
tHDSPIDS
MSB
LSB
tHSPIDS
tSSPIDS
CPHASE = 1
tSSPIDS
MOSI
(INPUT)
MSB VALID
LSB VALID
tDSOV
MISO
(OUTPUT)
LSB
MSB
CPHASE = 0
MOSI
(INPUT)
tHDSPIDS
tDDSPIDS
tD S O E
tHSPIDS
tSSPIDS
MSB VALID
LSB VALID
Figure 35. SPI Slave Timing
Rev. A |
Page 44 of 52 |
December 2006
tDSDHI
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
JTAG Test Access Port and Emulation
Table 40. JTAG Test Access Port and Emulation
Parameter
Timing Requirements
tTCK
TCK Period
tSTAP
TDI, TMS Setup Before TCK High
tHTAP
TDI, TMS Hold After TCK High
tSSYS1
System Inputs Setup Before TCK High
1
tHSYS
System Inputs Hold After TCK High
tTRSTW
TRST Pulse Width
Min
tCK
5
6
7
18
4tCK
Switching Characteristics
tDTDO
TDO Delay from TCK Low
2
System Outputs Delay After TCK Low
tDSYS
1
2
Max
ns
ns
ns
ns
ns
ns
7
tCK ÷ 2 + 7
System Inputs = AD15–0, SPIDS, CLKCFG1–0, RESET, BOOTCFG1–0, MISO, MOSI, SPICLK, DAI_Px, FLAG3–0.
System Outputs = MISO, MOSI, SPICLK, DAI_Px, AD15–0, RD, WR, FLAG3–0, CLKOUT, EMU, ALE.
tTCK
TCK
tSTAP
tHTAP
TMS
TDI
tDTDO
TDO
tSSYS
tHSYS
SYSTEM
INPUTS
tDSYS
SYSTEM
OUTPUTS
Figure 36. IEEE 1149.1 JTAG Test Access Port
Rev. A |
Page 45 of 52 |
December 2006
Unit
ns
ns
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
OUTPUT DRIVE CURRENTS
CAPACITIVE LOADING
Figure 37 shows typical I-V characteristics for the output drivers of the ADSP-2136x. The curves represent the current drive
capability of the output drivers as a function of output voltage.
Output delays and holds are based on standard capacitive loads:
30 pF on all pins (see Figure 38). Figure 42 shows graphically
how output delays and holds vary with load capacitance. The
graphs of Figure 40, Figure 41, and Figure 42 may not be linear
outside the ranges shown for Typical Output Delay vs. Load
Capacitance and Typical Output Rise Time (20% to 80%,
V = Min) vs. Load Capacitance.
40
VOH
3.3V, +25°C
3.47V, -45°C
20
12
10
3.11V, +125°C
10
0
-10
3.11V, +125°C
-20
3.3V, +25°C
VOL
-30
3.47V, -45°C
-40
0
0.5
1.5
2.5
1.0
2.0
SWEEP (VDDEXT) VOLTAGE (V)
3.0
y = 0.0467x + 1.6323
RISE AND FALL TIMES (ns)
SOURCE (VDDEXT) CURRENT (mA)
30
3.5
RISE
FALL
8
6
4
y = 0.045x + 1.524
2
Figure 37. ADSP-2136x Typical Drive
0
0
50
TEST CONDITIONS
100
150
200
250
LOAD CAPACITANCE (pF)
The ac signal specifications (timing parameters) appear in
Table 14 on Page 21 through Table 40 on Page 45. These include
output disable time, output enable time, and capacitive loading.
The timing specifications for the SHARC apply for the voltage
reference levels in Figure 38.
50⍀
TO
OUTPUT
PIN
1.5V
30pF
12
RISE
10
RISE AND FALL TIMES (ns)
Timing is measured on signals when they cross the 1.5 V level as
described in Figure 39. All delays (in nanoseconds) are measured between the point that the first signal reaches 1.5 V and
the point that the second signal reaches 1.5 V.
Figure 40. Typical Output Rise/Fall Time
(20% to 80%, VDDEXT = Max)
y = 0.049x + 1.5105
FALL
8
6
y = 0.0482x + 1.4604
4
2
0
Figure 38. Equivalent Device Loading for AC Measurements
(Includes All Fixtures)
0
50
100
150
200
LOAD CAPACITANCE (pF)
INPUT
1.5V
OR
OUTPUT
Figure 41. Typical Output Rise/Fall Time
(20% to 80%, VDDEXT = Min)
1.5V
Figure 39. Voltage Reference Levels for AC Measurements
Rev. A |
Page 46 of 52 |
December 2006
250
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Table 41. Thermal Characteristics for BGA (No thermal vias
in PCB)
10
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
OUTPUT DELAY OR HOLD (ns)
8
Y = 0.0488x - 1.5923
6
4
2
0
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
25.40
21.90
20.90
5.07
0.140
0.330
0.410
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
-2
-4
0
50
100
150
200
LOAD CAPACITANCE (pF)
Figure 42. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
THERMAL CHARACTERISTICS
The ADSP-2136x processor is rated for performance over the
temperature range specified in Operating Conditions
on Page 16.
Table 42. Thermal Characteristics for BGA (Thermal vias in
PCB)
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
Table 41 and Table 42 airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-toboard measurement complies with JESD51-8. Test board and
thermal via design comply with JEDEC standards JESD51-9
(BGA). The junction-to-case measurement complies with MILSTD-883. All measurements use a 2S2P JEDEC test board.
Industrial applications using the BGA package require thermal
vias, to an embedded ground plane, in the PCB. Refer to JEDEC
standard JESD51-9 for printed circuit board thermal ball land
and thermal via design information.
To determine the junction temperature of the device while on
the application PCB, use:
T J = T T + ( Ψ JT × P D )
where:
TJ = junction temperature (°C)
TT = case temperature (°C) measured at the top center of the
package
ΨJT = junction-to-top (of package) characterization parameter
is the typical value from Table 41.
PD = power dissipation (see EE Note No. EE-277 for more
information).
Values of θJA are provided for package comparison and PCB
design considerations.
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Note that the thermal characteristics values provided in
Table 41 and Table 42 are modeled values.
Rev. A |
Page 47 of 52 |
December 2006
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
23.40
20.00
19.20
5.00
0.130
0.300
0.360
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
136-BALL BGA PIN CONFIGURATIONS
The following table shows the ADSP-2136x’s pin names and
their default function after reset (in parentheses).
Table 43. BGA Pin Assignments
Ball Name
CLKCFG0
XTAL
TMS
TCK
TDI
CLKOUT
TDO
EMU
MOSI
MISO
SPIDS
VDDINT
GND
GND
VDDINT
GND
GND
GND
GND
GND
GND
GND
GND
FLAG3
Ball No.
A01
A02
A03
A04
A05
A06
A07
A08
A09
A10
A11
A12
A13
A14
E01
E02
E04
E05
E06
E09
E10
E11
E13
E14
Ball Name
CLKCFG1
GND
VDDEXT
CLKIN
TRST
AVSS
AVDD
VDDEXT
SPICLK
RESET
VDDINT
GND
GND
GND
FLAG1
FLAG0
GND
GND
GND
GND
GND
GND
FLAG2
DAI_P20 (SFS45)
Rev. A |
Ball No.
B01
B02
B03
B04
B05
B06
B07
B08
B09
B10
B11
B12
B13
B14
F01
F02
F04
F05
F06
F09
F10
F11
F13
F14
Ball Name
BOOTCFG1
BOOTCFG0
GND
GND
GND
VDDINT
Ball No.
C01
C02
C03
C12
C13
C14
Ball Name
VDDINT
GND
GND
GND
GND
GND
GND
GND
GND
VDDINT
Ball No.
D01
D02
D04
D05
D06
D09
D10
D11
D13
D14
AD7
VDDINT
VDDEXT
DAI_P19 (SCLK45)
G01
G02
G13
G14
AD6
VDDEXT
DAI_P18 (SD5B)
DAI_P17 (SD5A)
H01
H02
H13
H14
Page 48 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
Table 43. BGA Pin Assignments (Continued)
Ball Name
AD5
AD4
GND
GND
GND
GND
GND
GND
VDDINT
DAI_P16 (SD4B)
AD15
ALE
RD
VDDINT
VDDEXT
AD8
VDDINT
DAI_P2 (SD0B)
VDDEXT
DAI_P4 (SFS0)
VDDINT
VDDINT
GND
DAI_P10 (SD2B)
Ball No.
J01
J02
J04
J05
J06
J09
J10
J11
J13
J14
N01
N02
N03
N04
N05
N06
N07
N08
N09
N10
N11
N12
N13
N14
Ball Name
AD3
VDDINT
GND
GND
GND
GND
GND
GND
GND
DAI_P15 (SD4A)
AD14
AD13
AD12
AD11
AD10
AD9
DAI_P1 (SD0A)
DAI_P3 (SCLK0)
DAI_P5 (SD1A)
DAI_P6 (SD1B)
DAI_P7 (SCLK1)
DAI_P8 (SFS1)
DAI_P9 (SD2A)
DAI_P11 (SD3A)
Rev. A |
Ball No.
K01
K02
K04
K05
K06
K09
K10
K11
K13
K14
P01
P02
P03
P04
P05
P06
P07
P08
P09
P10
P11
P12
P13
P14
Ball Name
AD2
AD1
GND
GND
GND
GND
GND
GND
GND
DAI_P14 (SFS23)
Page 49 of 52 |
December 2006
Ball No.
L01
L02
L04
L05
L06
L09
L10
L11
L13
L14
Ball Name
AD0
WR
GND
GND
DAI_P12 (SD3B)
DAI_P13 (SCLK23)
Ball No.
M01
M02
M03
M12
M13
M14
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
14 13 12 11 10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
KEY
VDDINT
GND*
AVDD
VDDEXT
AVSS
I/O SIGNALS
*USE THE CENTER BLOCK OF GROUND PINS TO PROVIDE
THERMAL PATHWAYS TO YOUR PRINTED
CIRCUIT BOARD’S GROUND PLANE.
Figure 43. BGA Pin Assignments (Bottom View, Summary)
1
2
3
4
5
6
7
8
9
10 11 12 13 14
A
B
C
D
E
F
G
H
J
K
L
M
N
P
KEY
VDDINT
GND*
AVDD
VDDEXT
AVSS
I/O SIGNALS
*USE THE CENTER BLOCK OF GROUND PINS TO PROVIDE
THERMAL PATHWAYS TO YOUR PRINTED
CIRCUIT BOARD’S GROUND PLANE.
Figure 44. BGA Pin Assignments (Top View, Summary)
Rev. A |
Page 50 of 52 |
December 2006
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
OUTLINE DIMENSIONS
The ADSP-2136x is available in a 136-ball BGA package.
10.40 BSC SQ
12.00 BSC SQ
0.80
BSC
TYP
PIN A1 INDICATOR
A
B
C
D
E
F
G
H
J
K
L
M
N
P
0.80
BSC
TYP
14 13 12 11 10 9 8 7 6 5 4 3 2 1
BOTTOM VIEW
TOP VIEW
1.70
MAX
DETAIL A
0.25
1. DIMENSIONS ARE IN MILIMETERS (MM).
MIN
2. THE ACTUAL POSITION OF THE BALL GRID IS
WITHIN 0.15 MM OF ITS IDEAL POSITION RELATIVE
TO THE PACKAGE EDGES.
3. COMPLIANT TO JEDEC STANDARD MO-205-AE, EXCEPT FOR
THE BALL DIAMETER.
4. CENTER DIMENSIONS ARE NOMINAL.
0.50
0.45
0.40
(BALL
DIAMETER)
SEATING
PLANE
0.12 MAX (BALL
COPLANARITY)
DETAIL A
Figure 45. 136-Ball Chip Scale Package Ball Grid Array [CSP_BGA](BC-136-2)
SURFACE MOUNT DESIGN
Table 44 is provided as an aide to PCB design. For industrystandard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 44. BGA Data for Use with Surface Mount Design
Package
136-Ball Grid Array (BC-136-2)
Ball Attach Type
Solder Mask Defined
Rev. A |
Page 51 of 52 |
Solder Mask Opening
0.40 mm diameter
December 2006
Ball Pad Size
0.53 mm diameter
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
ORDERING GUIDE
Model
ADSP-21362KBC-1AA
ADSP-21362KBCZ-1AA2
ADSP-21362BBC-1AA
ADSP-21362BBCZ-1AA2
ADSP-21362WBBCZ-1A2
ADSP-21363KBC-1AA
ADSP-21363KBCZ-1AA2
ADSP-21363BBC-1AA
ADSP-21363BBCZ-1AA2
ADSP-21363WBBCZ-1A2
ADSP-21364KBC-1AA
ADSP-21364KBCZ-1AA2
ADSP-21364BBC-1AA
ADSP-21364BBCZ-1AA2
ADSP-21364WBBCZ-1A2
ASDP-21365KBC-1AA3
ASDP-21365KBCZ-1AA2, 3
ASDP-21365BBC-1AA3
ASDP-21365BBCZ-1AA2, 3
ASDP-21365WBBCZ-1A2, 3
ADSP-21366KBC-1AA3
ADSP-21366KBCZ-1AA2, 3
ADSP-21366BBC-1AA3
ADSP-21366BBCZ-1AA2, 3
ADSP-21366WBBCZ-1A2, 3
Temperature
Range 1
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Instruction
Rate
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
333 MHz
On-Chip
SRAM
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
3M Bit
ROM
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
4M Bit
Operating
Voltage
Internal/External
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1.2 V/3.3 V
1
Package Description
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
136-Ball CSP-BGA
Package
Option
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
BC-136-2
Referenced temperature is ambient temperature.
Z = Pb-free part.
3
Available with a wide variety of audio algorithm combinations sold as part of a chipset and bundled with necessary software. For a complete list, visit our website at
www.analog.com/SHARC.
2
©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06359-0-12/06(A)
Rev. A |
Page 52 of 52 |
December 2006