TI ISO7141CCDBQ 4242-vpk small-footprint and low-power triple and quad channels digital isolator Datasheet

ISO7131CC, ISO7140CC, ISO7140FCC
ISO7141CC, ISO7141FCC
www.ti.com
SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
4242-VPK Small-Footprint and Low-Power Triple and Quad Channels Digital Isolators
Check for Samples: ISO7131CC, ISO7140CC, ISO7140FCC, ISO7141CC, ISO7141FCC
FEATURES
APPLICATIONS
•
•
1
2
•
•
•
•
•
•
•
•
•
Maximum Signaling Rate: 50 Mbps (with 5V
Supplies)
Robust Design With Integrated Noise Filter
Default Output Low Option (Suffix F)
Low Power Consumption, Typical ICC per
Channel (with 3.3 V Supplies):
– ISO7131: 1.5 mA at 1 Mbps,
2.6 mA at 25 Mbps
– ISO7140: 1 mA at 1 Mbps,
2.3 mA at 25 Mbps
– ISO7141: 1.3 mA at 1 Mbps,
2.6 mA at 25 Mbps
Low Propagation Delay: 23 ns Typical
(3.3 V Supplies)
Wide Temperature Range: –40°C to 125°C
50 kV/µs Transient Immunity, Typical
Long Life with SiO2 Isolation Barrier
Operates From 2.7 V, 3.3 V and 5 V Supply and
Logic Levels
Small QSOP-16 Package
General-Purpose Isolation
– Industrial Fieldbus
– Profibus
– Modbus™
– DeviceNet Data Buses
– RS-232, RS-485
– Serial Peripheral Interface
SAFETY AND REGULATORY
APPROVALS
•
2500 VRMS Isolation for 1 minute per UL 1577
(Approved)
4242 VPK Isolation per DIN EN 60747-5-2 (VDE
0884 Teil 2), 566 VPK Working Voltage
(Approved)
CSA Component Acceptance Notice 5A
(Approval Pending)
IEC 60950-1 and IEC 61010-1 End Equipment
Standards (Approval Pending)
GB 4943.1-2011 and GB 8898:2011 CQC
Certification (Approval Pending)
•
•
•
•
DESCRIPTION
ISO7131, ISO7140, and ISO7141 provide galvanic isolation up to 2500 VRMS for 1 minute per UL and 4242 VPK
per VDE. ISO7131 has three channels with two forward and one reverse-direction channels. ISO7140 and
ISO7141 are quad-channel isolators; ISO7140 has four forward, ISO7141 has three forward and one reversedirection channels. These devices are capable of 50 Mbps maximum data rate with 5V supplies and 40Mbps
maximum data rate with 3.3V or 2.7V supplies, with integrated filters on the inputs for noise-prone applications.
The suffix F indicates that default output state is low; otherwise, the default output state is high (see Table 1).
Each isolation channel has a logic input and output buffer separated by a silicon dioxide (SiO2) insulation barrier.
Used in conjunction with isolated power supplies, these devices prevent noise currents on a data bus or other
circuits from entering the local ground and interfering with or damaging sensitive circuitry. The devices have TTL
input thresholds and can operate from 2.7 V, 3.3 V, and 5 V supplies. All inputs are 5V tolerant when supplied
from a 2.7V or 3.3V supply.
PIN CONFIGURATIONS (TOP VIEW)
ISO7131
ISO7140
ISO7141
VCC1
1
16
VCC2
VCC1
1
16
VCC2
VCC1
1
16
GND1
2
15
GND2
GND1
2
15
GND2
GND1
2
15
GND2
INA
INB
3
14
OUTA
3
14
OUTA
14
OUTA
13
OUTB
4
13
OUTB
INA
INB
3
4
INA
INB
4
13
OUTB
OUTC
5
12
INC
INC
5
12
OUTC
INC
5
12
OUTC
NC
6
11
NC
IND
6
11
OUTD
OUTD
6
11
IND
EN1
7
10
EN2
NC
7
10
EN
EN1
7
10
EN2
GND1
8
9
GND1
8
9
GND1
8
9
GND2
GND2
VCC2
GND2
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Modbus is a trademark of Gould Inc.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
ISO7131CC, ISO7140CC, ISO7140FCC
ISO7141CC, ISO7141FCC
SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Table 1. FUNCTION TABLE (1)
INPUT
VCC
PU
(1)
OUTPUT
VCC
PU
OUTPUT
(OUTx)
INPUT
(INx)
OUTPUT ENABLE
(ENx)
ISO71xxCC
ISO71xxFCC
H
H or open
H
H
L
H or open
L
L
X
L
Z
Z
Open
H or open
H
L
H or open
H
L
PD
PU
X
PD
PU
X
L
Z
Z
PU
PD
X
X
Undetermined
Undetermined
PU = Powered Up (VCC ≥ 2.7 V); PD = Powered Down (VCC ≤ 2.1 V); X = Irrelevant; H = High Level; L
= Low Level; Z = High Impedance
AVAILABLE OPTIONS
PRODUCT
RATED
ISOLATION
INPUT
THRESHOLD
DEFAULT
OUTPUT
MAX DATA RATE
and
INPUT FILTER
ISO7131CC
CHANNEL
DIRECTION
ORDERING
NUMBER
2 forward,
1 reverse
ISO7131CCDBQR (reel)
High
ISO7140CCDBQ (tube)
ISO7140CC
ISO7140FCC
4242 VPK (1)
1.5-V TTL
(CMOS compatible)
ISO7141CC
Low
50 Mbps,
with noise filter
integrated
4 forward,
0 reverse
2
ISO7140FCCDBQ (tube)
ISO7141CCDBQ (tube)
3 forward,
1 reverse
(1)
ISO7140CCDBQR (reel)
ISO7140FCCDBQR (reel)
High
ISO7141FCC
ISO7131CCDBQ (tube)
Low
ISO7141CCDBQR (reel)
ISO7141FCCDBQ (tube)
ISO7141FCCDBQR (reel)
See the REGULATORY INFORMATION section for detailed Isolation Ratings.
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Product Folder Links: ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC
ISO7131CC, ISO7140CC, ISO7140FCC
ISO7141CC, ISO7141FCC
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SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
ABSOLUTE MAXIMUM RATINGS (1)
PARAMETER
VALUE
Supply voltage (2)
VCC1, VCC2
Input voltage
INx, ENx
Output voltage
OUTx
Output current
IO
–0.5 V to 6 V
–0.5 V to 6 V
–0.5 V to VCC+ 0.5 V
±15 mA
Human-body model
Electrostatic discharge
Field-induced charged device
model
Maximum junction
temperature
TJ
Storage temperature
TSTG
(1)
(2)
ESDA / JEDEC JS-001-2012
±4 kV
All pins
JEDEC JESD22-C101E
±1.5 kV
150°C
–65°C to 150°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak
voltage values.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
VCC1, VCC2
IOH
MIN
Supply voltage
2.7
High-level output current (VCC ≥ 3.0 V)
–4
High-level output current (VCC < 3.0 V)
–2
TYP
MAX
5.5
UNIT
V
mA
mA
IOL
Low-level output current
4
VIH
High-level input voltage
2
VCC
mA
V
VIL
Low-level input voltage
0
0.8
V
tui
Input pulse duration (VCC ≥ 4.5V)
20
tui
Input pulse duration (VCC < 4.5V)
25
1 / tui
Signaling rate (VCC ≥ 4.5V)
1 / tui
Signaling rate (VCC < 4.5V)
TJ
Junction temperature
TA
Ambient temperature
–40
ns
ns
0
50
Mbps
0
40
Mbps
–40
136
°C
125
°C
25
THERMAL INFORMATION
THERMAL METRIC (1)
ISO7131, ISO714x
DBQ (16 Pins)
UNIT
θJA
Junction-to-ambient thermal resistance
104.5
°C/W
θJC(top)
Junction-to-case(top) thermal resistance
57.8
°C/W
θJB
Junction-to-board thermal resistance
46.8
°C/W
ψJT
Junction-to-top characterization parameter
18.3
°C/W
ψJB
Junction-to-board characterization parameter
46.4
°C/W
θJC(bottom)
Junction-to-case(bottom) thermal resistance
n/a
°C/W
PD
Device power dissipation
150
mW
(1)
VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF
Input a 25-MHz, 50% duty cycle square wave
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Copyright © 2013, Texas Instruments Incorporated
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3
ISO7131CC, ISO7140CC, ISO7140FCC
ISO7141CC, ISO7141FCC
SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted.)
PARAMETER
TEST CONDITIONS
IOH = –4 mA; see Figure 1
VCCx
(1)
IOH = –20 μA; see Figure 1
VCCx
(1)
VOH
High-level output voltage
VOL
Low-level output voltage
VI(HYS)
Input threshold voltage
hysteresis
IIH
High-level input current
VIH = VCC at INx or ENx
IIL
Low-level input current
VIL = 0 V at INx or ENx
CMTI
Common-mode transient
immunity
VI = VCC or 0 V; see Figure 4
(1)
MIN
TYP
– 0.5
4.8
– 0.1
5
MAX
UNIT
V
IOL = 4 mA; see Figure 1
0.2
0.4
IOL = 20 μA; see Figure 1
0
0.1
V
450
mV
10
μA
–10
25
75
kV/μs
VCCx is the supply voltage, VCC1 or VCC2, for the output channel that is being measured.
SWITCHING CHARACTERISTICS
VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted.)
PARAMETER
tPLH, tPHL
PWD
tsk(o)
(1)
Pulse width distortion |tPHL – tPLH|
(2)
tsk(pp)
Propagation delay time
Channel-to-channel output skew time
(3)
Output signal rise time
tf
Output signal fall time
tPHZ, tPLZ
Disable propagation delay, high/low-to-high impedance output
tPZH, tPZL
Enable propagation delay, high impedance-to-high/low output
tfs
Fail-safe output delay time from input data or power loss
tGR
Input glitch rejection time
(3)
4
See Figure 1
MIN
TYP
12
19
MAX UNIT
35
3
Same-direction
channels
2
Opposite-direction
channels
4
Part-to-part skew time
tr
(1)
(2)
TEST CONDITIONS
ns
12
2
See Figure 1
ns
2
See Figure 2
See Figure 3
6
10
5
10
ns
9.5
μs
11
ns
Also known as pulse skew
tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same
direction while driving identical loads.
tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same
direction while operating at identical supply voltages, temperature, input signals, and loads.
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Product Folder Links: ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC
ISO7131CC, ISO7140CC, ISO7140FCC
ISO7141CC, ISO7141FCC
www.ti.com
SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
SUPPLY CURRENT
VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted.)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
2.2
3.7
UNIT
ISO7131
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
Disable
EN1 = EN2 = 0V
DC to 1 Mbps
10 Mbps
25 Mbps
DC signal: VI = VCC or 0 V
AC signal: All channels switching with square-wave
clock input; CL = 15 pF
50 Mbps
3.7
5
2.2
3.7
3.7
5
3.4
4.8
4.9
6.6
4.9
6.6
6.8
9
7.1
10
10.5
13
0.6
1.2
4.6
7
0.6
1.3
mA
ISO7140
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
Disable
EN = 0 V
DC to 1 Mbps
10 Mbps
25 Mbps
DC Signal: VI = VCC or 0 V,
AC Signal: All channels switching with square wave
clock input; CL = 15 pF
50 Mbps
4.8
7
1.4
2.2
6.9
9.2
2.7
3.9
10.3
13.5
4.7
6.5
15.6
21
2.5
4.2
mA
ISO7141
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
Disable
EN1 = EN2 = 0V
DC to 1 Mbps
10 Mbps
25 Mbps
DC signal: VI = VCC or 0 V,
AC signal: All channels switching with square wave
clock input; CL = 15 pF
50 Mbps
Copyright © 2013, Texas Instruments Incorporated
4.2
7
2.5
4.2
4.2
7
3.8
5.3
6.2
9.6
5.6
7.5
9.2
13
8.4
11.2
14
18.5
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mA
5
ISO7131CC, ISO7140CC, ISO7140FCC
ISO7141CC, ISO7141FCC
SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted.)
PARAMETER
TEST CONDITIONS
IOH = –4 mA; see Figure 1
VCCx
IOH = –20 μA; see Figure 1
VCCx
(1)
VOH
High-level output voltage
VOL
Low-level output voltage
VI(HYS)
Input threshold voltage hysteresis
IIH
High-level input current
VIH = VCC at INx or ENx
IIL
Low-level input current
VIL = 0 V at INx or ENx
CMTI
Common-mode transient
immunity
VI = VCC or 0 V; see Figure 4
(1)
MIN
(1)
TYP
– 0.5
3
– 0.1
3.3
MAX
V
IOL = 4 mA; see Figure 1
0.2
0.4
IOL = 20 μA; see Figure 1
0
0.1
425
V
mV
10
–10
25
UNIT
50
μA
kV/μs
VCCx is the supply voltage, VCC1 or VCC2, for the output channel that is being measured.
SWITCHING CHARACTERISTICS
VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted.)
PARAMETER
tPLH, tPHL
Propagation delay time
PWD (1)
Pulse width distortion |tPHL – tPLH|
tsk(o)
(2)
tsk(pp)
Channel-to-channel output skew time
(3)
Output signal rise time
tf
Output signal fall time
tPHZ, tPLZ
Disable propagation delay, from high/low to
high-impedance output
tPZH, tPZL
Enable propagation delay, from highimpedance to high/low output
tfs
Fail-safe output delay time from input data or
power loss
tGR
Input glitch rejection time
(3)
6
See Figure 1
MIN
TYP
MAX
15
23
45
UNIT
3
Same-direction Channels
2
Opposite-direction
Channels
4
Part-to-part skew time
tr
(1)
(2)
TEST CONDITIONS
ns
19
See Figure 1
2.5
ns
2.5
6.5
15
6.5
15
See Figure 2
ns
8
μs
12.5
ns
See Figure 3
Also known as pulse skew
tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same
direction while driving identical loads.
tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same
direction while operating at identical supply voltages, temperature, input signals and loads.
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC
ISO7131CC, ISO7140CC, ISO7140FCC
ISO7141CC, ISO7141FCC
www.ti.com
SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
SUPPLY CURRENT
VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted.)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
1.9
2.7
2.6
3.8
1.9
2.7
2.6
3.8
2.4
3.5
3.5
4.7
3.2
4.6
4.7
6.2
5
7
7
9
0.3
0.7
3.6
5.2
0.4
0.8
3.7
5.3
0.9
1.4
5.1
6.8
1.7
2.4
7.3
10
2.4
3.7
9.4
13
2
3.1
3.2
4.9
2
3.1
3.2
4.9
2.8
3.8
4.5
6.1
4
5.2
6.4
8.3
UNIT
ISO7131
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
Disable
EN1 = EN2 = 0 V
DC to 1 Mbps
10 Mbps
25 Mbps
DC signal: VI = VCC or 0 V
AC signal: All channels switching with square-wave
clock input; CL = 15 pF
40 Mbps
mA
ISO7140
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
Disable
EN = 0 V
DC to 1 Mbps
10 Mbps
25 Mbps
DC signal: VI = VCC or 0 V,
AC signal: All channels switching with square-wave
clock input; CL = 15 pF
40 Mbps
mA
ISO7141
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
Disable
EN1 = EN2 = 0 V
DC to 1 Mbps
10 Mbps
25 Mbps
DC signal: VI = VCC or 0 V,
AC signal: All channels switching with square-wave
clock input; CL = 15 pF
40 Mbps
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5
8
8.2
11.6
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mA
7
ISO7131CC, ISO7140CC, ISO7140FCC
ISO7141CC, ISO7141FCC
SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
VCC1 and VCC2 at 2.7 V (over recommended operating conditions unless otherwise noted.)
PARAMETER
TEST CONDITIONS
IOH = –2 mA; see Figure 1
VCC
(1)
IOH = –20 μA; see Figure 1
VCC
(1)
VOH
High-level output voltage
VOL
Low-level output voltage
VI(HYS)
Input threshold voltage hysteresis
IIH
High-level input current
VIH = VCC at INx or ENx
IIL
Low-level input current
VIL = 0 V at INx or ENx
CMTI
Common-mode transient immunity
VI = VCC or 0 V; see Figure 4
(1)
MIN
TYP
– 0.3
2.5
– 0.1
2.7
MAX
UNIT
V
IOL = 4 mA; see Figure 1
0.2
0.4
IOL = 20 μA; see Figure 1
0
0.1
V
350
mV
10
μA
-10
25
50
kV/μs
MIN
TYP
MAX
15
27
50
VCCx is the supply voltage, VCC1 or VCC2, for the output channel that is being measured.
SWITCHING CHARACTERISTICS
VCC1 and VCC2 at 2.7 V (over recommended operating conditions unless otherwise noted.)
PARAMETER
tPLH, tPHL
Propagation delay time
PWD (1)
Pulse width distortion |tPHL – tPLH|
tsk(o)
(2)
tsk(pp)
Channel-to-channel output skew time
(3)
Output signal rise time
tf
Output signal fall time
tPHZ, tPLZ
Disable propagation delay, from high/low to highimpedance output
tPZH, tPZL
Enable propagation delay, from high-impedance to
high/low output
tfs
Fail-safe output delay time from input data or power loss
tGR
Input glitch rejection time
(3)
8
See Figure 1
UNIT
3
Same-direction Channels
2
Opposite-direction
Channels
4
Part-to-part skew time
tr
(1)
(2)
TEST CONDITIONS
ns
22
3
See Figure 1
ns
3
9
15
9
15
See Figure 2
ns
See Figure 3
8.5
μs
14
ns
Also known as pulse skew
tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same
direction while driving identical loads.
tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same
direction while operating at identical supply voltages, temperature, input signals, and loads.
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: ISO7131CC ISO7140CC ISO7140FCC ISO7141CC ISO7141FCC
ISO7131CC, ISO7140CC, ISO7140FCC
ISO7141CC, ISO7141FCC
www.ti.com
SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
SUPPLY CURRENT
VCC1 and VCC2 at 2.7 V (over recommended operating conditions unless otherwise noted.)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
1.2
2.4
2.3
3.3
1.2
2.4
2.3
3.3
2.1
3
2.9
4
3
3.8
4
5.2
4.2
5.3
5.8
7
0.2
0.4
3.2
4.7
0.2
0.5
3.4
4.8
0.6
1
4.5
6.3
1.2
1.8
6.2
8
1.8
2.6
8
11
1.6
2.6
2.8
4.1
1.6
2.6
2.8
4.1
2.3
3.2
3.8
5
3.3
4.2
5.4
6.8
4.3
5.8
6.9
9.2
UNIT
ISO7131
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
Disable
EN1 = EN2 = 0 V
DC to 1 Mbps
10 Mbps
25 Mbps
DC signal: VI = VCC or 0 V
AC signal: All channels switching with square-wave
clock input; CL = 15 pF
40 Mbps
mA
ISO7140
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
Disable
EN = 0 V
DC to 1 Mbps
10 Mbps
25 Mbps
DC signal: VI = VCC or 0 V,
AC signal: All channels switching with square-wave
clock input; CL = 15 pF
40 Mbps
mA
ISO7141
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
ICC1
ICC2
Disable
EN1 = EN2 = 0 V
DC to 1 Mbps
10 Mbps
25 Mbps
DC signal: VI = VCC or 0 V,
AC signal: All channels switching with square-wave
clock input; CL = 15 pF
40 Mbps
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mA
9
ISO7131CC, ISO7140CC, ISO7140FCC
ISO7141CC, ISO7141FCC
SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
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ISOLATION BARRIER
PARAMETER MEASUREMENT INFORMATION
IN
Input
Generator
NOTE A
50 W
VI
VCC1
VI
VCC/2
OUT
VCC/2
0V
tPHL
tPLH
VO
CL
NOTE
B
VOH
90%
VO
50%
10%
tf
tr
50%
VOL
A.
The input pulse is supplied by a generator having the following characteristics: PRR ≤ 50 kHz, 50% duty cycle, tr ≤ 3
ns, tf ≤ 3 ns, ZO = 50 Ω. At the input, a 50-Ω resistor is required to terminate the input-generator signal. It is not
needed in an actual application.
B.
CL = 15 pF and includes instrumentation and fixture capacitance within ±20%.
Figure 1. Switching-Characteristics Test Circuit and Voltage Waveforms
VCC
VCC
ISOLATION BARRIER
0V
R L = 1 k W ± 1%
IN
Input
Generator
VI
OUT
EN
VO
0V
tPLZ
tPZL
VO
CL
VCC/2
VCC/2
VCC
0.5 V
50%
VOL
NOTE
B
VI
50 W
ISOLATION BARRIER
NOTE A
IN
3V
Input
Generator
NOTE A
VI
VCC
OUT
VO
VCC/2
VI
VCC/2
0V
EN
CL
NOTE
B
50 W
tPZH
R L = 1 k W ± 1%
VO
VOH
50%
0.5 V
tPHZ
A.
The input pulse is supplied by a generator having the following characteristics: PRR ≤ 50 kHz, 50% duty cycle, tr ≤ 3
ns, tf ≤ 3 ns, ZO = 50 Ω.
B.
CL = 15 pF and includes instrumentation and fixture capacitance within ±20%.
0V
Figure 2. Enable/Disable Propagation Delay-Time Test Circuit and Waveform
10
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SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
PARAMETER MEASUREMENT INFORMATION (continued)
VI
IN = 0 V (Devices without suffix F)
IN = VCC (Devices with suffix F)
A.
IN
VCC
ISOLATION BARRIER
VCC
2.7 V
VI
OUT
0V
t fs
VO
fs high
CL
NOTE A
VO
VOH
50%
fs low V
OL
CL = 15 pF and includes instrumentation and fixture capacitance within ±20%.
Figure 3. Failsafe Delay-Time Test Circuit and Voltage Waveforms
VCC1
VCC2
IN
S1
ISOLATION BARRIER
C = 0.1 mF ±1%
GND1
C = 0.1 mF ±1%
OUT
CL
NOTE A
Pass/Fail Criterion –
the output must
remain stable.
VOH or VOL
GND2
VTEST
A.
CL = 15pF and includes instrumentation and fixture capacitance within ±20%.
Figure 4. Common-Mode Transient Immunity Test Circuit
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SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
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DEVICE INFORMATION
INSULATION AND SAFETY-RELATED SPECIFICATIONS
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIOTM
Maximum transient overvoltage per
DIN EN 60747-5-2 (VDE 0884 Teil
2)
4242
VPK
VIORM
Maximum working voltage per DIN
EN 60747-5-2 (VDE 0884 Teil 2)
566
VPK
VTEST = VISO, t = 60 sec (qualification)
2500
VRMS
VTEST = 1.2 * VISO, t = 1 sec (100% production)
3000
VRMS
Isolation Voltage per UL 1577
VISO
VPR
Input-to-output test voltage
After Input/Output safety test subgroup 2/3,
VPR = VIORM x 1.2, t = 10 s,
Partial discharge < 5 pC
679
Method a, After environmental tests subgroup 1,
VPR = VIORM x 1.6, t = 10 s,
Partial discharge < 5 pC
906
Method b1, 100% production test,
VPR = VIORM x 1.875, t = 1 s,
Partial discharge < 5 pC
VPK
1061
L(I01)
Minimum air gap (clearance)
Shortest terminal to terminal distance through air
3.7
mm
L(I02)
Minimum external tracking
(creepage)
Shortest terminal to terminal distance across the
package surface
3.7
mm
Minimum internal gap (internal
clearance)
Distance through the insulation
0.014
mm
Pollution degree
Tracking resistance (comparative
tracking index)
CTI
RIO
(1)
CIO
(1)
CI
(1)
(2)
2
DIN IEC 60112 / VDE 0303 Part 1
Isolation Resistance, Input to Output
(2)
≥400
V
VIO = 500 V, TA < 100oC
>1012
o
Ω
>1011
VIO = 500 V, 100 C ≤ TA ≤ max
Barrier capacitance, input to output
VI = 0.4 sin (2πft), f = 1 MHz
2.3
pF
Input capacitance
VI = VCC/2 + 0.4 sin (2πft), f = 1 MHz, VCC = 5 V
2.8
pF
All pins on each side of the barrier tied together creating a two-terminal device.
Measured from input pin to ground.
spacer
NOTE
Creepage and clearance requirements should be applied according to the specific
equipment isolation standards of an application. Care should be taken to maintain the
creepage and clearance distance of a board design to ensure that the mounting pads of
the isolator on the printed circuit board do not reduce this distance.
Creepage and clearance on a printed circuit board become equal in certain cases.
Techniques such as inserting grooves and/or ribs on a printed circuit board are used to
help increase these specifications.
Table 2. IEC 60664-1 RATINGS TABLE
PARAMETER
Basic Isolation Group
Installation classification
12
TEST CONDITIONS
SPECIFICATION
Material Group
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II
Rated mains voltage ≤ 150 VRMS
I–IV
Rated mains voltage ≤ 300 VRMS
I–III
Rated mains voltage ≤ 400 VRMS
I–II
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ISO7141CC, ISO7141FCC
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SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
REGULATORY INFORMATION
VDE
UL
Certified according to DIN EN
60747-5-2
CSA
Recognized under 1577
Approved under CSA Component Certified according to GB 4943.1Component Recognition Program Acceptance Notice
2011 and GB 8898:2011
Basic Insulation
Maximum Transient Overvoltage,
4242 VPK
Single protection, 2500 VRMS
Maximum Working Voltage, 566
VPK
File number: 40016131
(1)
CQC
File number: E181974
(1)
Reinforced Insulation per CSA
60950-1-03 and IEC 60950-1
(2nd Ed.), 150 VRMS maximum
working voltage
Basic Insulation per CSA 609501-03 and IEC 60950-1 (2nd Ed.),
380 VRMS maximum working
voltage
Reinforced Insulation per CSA
61010-1-04 and IEC 61010-1
(2nd Edition), 150 VRMS
maximum working voltage
Basic Insulation, Altitude ≤
5000m, Tropical Climate, 250
VRMS maximum working voltage
File number: 220991 (approval
pending)
Report Number: Pending
Production tested ≥ 3000 Vrms for 1 second in accordance with UL 1577.
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.
A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate
sufficient power to overheat the die and damage the isolation barrier, potentially leading to secondary system
failures.
PARAMETER
IS
TS
Safety input, output, or supply
current
TEST CONDITIONS
DBQ-16
MIN
TYP MAX
θJA = 104.5°C/W, VI = 5.5V, TJ = 150°C, TA = 25°C
217
θJA = 104.5°C/W, VI = 3.6V, TJ = 150°C, TA = 25°C
332
θJA = 104.5°C/W, VI = 2.7V, TJ = 150°C, TA = 25°C
443
Maximum case temperature
150
UNIT
mA
°C
Safety Limiting Current – mA
The safety-limiting constraint is the absolute-maximum junction temperature specified in the Absolute Maximum
Ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Information table is that of a device installed on a high-K test board for leaded surface-mount packages.
The power is the recommended maximum input voltage times the current. The junction temperature is then the
ambient temperature plus the power times the junction-to-air thermal resistance.
500
450
400
350
300
250
200
150
100
50
0
VCC1 = VCC2 = 2.7V
VCC1 = VCC2 = 3.6V
VCC1 = VCC2 = 5.5V
0
50
100
150
200
Case Temperature – oC
Figure 5. DBQ-16 θJC Thermal Derating Curve
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ISO7141CC, ISO7141FCC
SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
VCC1
www.ti.com
2 mm
max. from
2 mm
max. from
VCC2
VCC2
VCC1
ISO7131
0.1 mF
GND1
INA
0.1 mF
1
16
2
15
3
14
OUTA
OUTB
INB
4
13
OUTC
5
12
NC
EN1
GND2
INC
NC
6
11
7
10
8
9
EN2
GND1
GND 2
VCC1
2 mm
max. from
2 mm
max. from
VCC1
VCC2
VCC2
ISO7140
0.1 mF
GND1
0.1 mF
1
16
GND2
2
15
INA
3
14
OUTA
INB
4
13
OUTB
INC
5
12
OUTC
IND
6
11
NC
OUTD
EN
7
10
8
9
GND 2
GND1
Figure 6. Typical Application Circuits for ISO7131 and ISO7140
VCC1
2 mm
max. from
2 mm
max. from
VCC1
VCC2
VCC2
ISO7141
0.1 mF
0.1 mF
1
16
2
15
3
14
OUTA
INB
4
13
OUTB
INC
5
12
OUTC
GND1
INA
OUTD
EN1
6
11
7
10
8
9
GND2
IND
EN2
GND1
GND 2
Figure 7. Typical Application Circuit for ISO7141
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ISO7141CC, ISO7141FCC
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SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
Note: For detailed layout recommendations, see Application Note SLLA284, Digital Isolator Design Guide.
ISO71xxFCC Input
VCC1
VCC1
Output
500Q
IN
VCC2
7.5 uA
8Q
OUT
13Q
ISO71xxCC Input
VCC1
VCC1
VCC1
7.5 uA
500Q
IN
Figure 8. Device I/O Schematics
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ISO7131CC, ISO7140CC, ISO7140FCC
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SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
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TYPICAL CHARACTERISTICS
12.00
ICC2
5VV
ICC2
at 5
ICC2
3.3VV
ICC2
at 3.3
ICC1
at 5
ICC1
5VV
ICC1
at 3.3
ICC1
3.3VV
16
Supply Current (mA)
10.00
Supply Current (mA)
18
ICC1
3.3VV
ICC1 atat3.3
ICC2 atat3.3
ICC2
3.3VV
ICC1 atat5 5VV
ICC1
ICC2 atat5 5VV
ICC2
8.00
6.00
4.00
14
12
10
8
6
4
2.00
2
0.00
0
0
10
20
30
40
50
Data Rate (Mbps)
60
0
40
50
60
C001
Figure 10. ISO7140 SUPPLY CURRENT FOR ALL
CHANNELS vs DATA RATE
5.00
High-Level Output Voltage (V)
Supply Current (mA)
12
30
6.00
ICC2
5VV
ICC2
at 5
ICC2
at 3.3
ICC2
3.3VV
ICC1
at 5
ICC1
5VV
ICC1
at 3.3
ICC1
3.3VV
14
20
Data Rate (Mbps)
Figure 9. ISO7131 SUPPLY CURRENT FOR ALL CHANNELS
vs DATA RATE
16
10
C001
10
8
6
4
2
4.00
3.00
2.00
1.00
3.3V V
VVCC
3.3
CC atat
0.00
VVCC
5 5V V
CC atat
0
±1.00
0
10
20
30
40
50
Data Rate (Mbps)
60
±15
2.00
Low-Level Output Voltage (V)
VCC
3.3VV
V
CC atat3.3
V
VCC
CC atat55VV
1.50
1.25
1.00
0.75
0.50
0.25
0.00
0
5
10
Low-Level Output Current (mA)
Figure 13. LOW-LEVEL OUTPUT VOLTAGE vs
LOW-LEVEL OUTPUT CURRENT
16
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0
±5
C002
Figure 12. HIGH-LEVEL OUTPUT VOLTAGE vs
HIGH-LEVEL OUTPUT CURRENT
15
C003
Power Supply Under Voltage Threshold (V)
Figure 11. ISO7141 SUPPLY CURRENT FOR ALL
CHANNELS vs DATA RATE
1.75
±10
High-Level Output Current (mA)
C001
2.48
VCC
Rising
V
CC Rising
2.46
V
VCC
Falling
CC Falling
2.44
2.42
2.40
2.38
2.36
2.34
±50
0
50
100
150
Free-Air Temperature (ƒC)
C004
Figure 14. VCC UNDERVOLTAGE THRESHOLD vs
FREE-AIR TEMPERATURE
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SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
1.2
25
1
Pk-Pk Output Jitter (ns)
Propagation Delay Time (ns)
TYPICAL CHARACTERISTICS (continued)
30
20
15
10
ttpLH
3.3
3.3VV
pLH atat
ttpHL
3.3
3.3VV
pHL atat
ttpLH
5 5VV
pLH atat
ttpHL
5 5VV
pHL atat
5
0
±50
0
50
100
0.8
0.6
0.4
0.2
Output Jitter at 5 V
Output Jitter at 3.3 V
0
150
Free-Air Temperature (ƒC)
C005
Figure 15. PROPAGATION DELAY TIME vs
FREE-AIR TEMPERATURE
0
20
40
Data Rate (Mbps)
60
C006
Figure 16. OUTPUT JITTER vs DATA RATE
Input Glitch Rejection Time (ns)
18
16
14
12
10
8
6
4
ttGR
2.7VV
GR atat2.7
ttGR
3.3VV
GR atat3.3
ttGR
GR atat55VV
2
0
±50
0
50
100
150
Free-Air Temperature (ƒC)
C007
Figure 17. INPUT GLITCH REJECTION vs
FREE-AIR TEMPERATURE
Figure 18. TYPICAL EYE DIAGRAM AT 40 MBPS,
PRBS 216 - 1, 2.7-V OPERATION
Figure 19. TYPICAL EYE DIAGRAM AT 40 MBPS,
PRBS 216 - 1, 3.3-V OPERATION
Figure 20. TYPICAL EYE DIAGRAM AT 50 MBPS,
PRBS 216 - 1, 5-V OPERATION
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SLLSE83E – APRIL 2013 – REVISED SEPTEMBER 2013
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REVISION HISTORY
Changes from Original (April 2013) to Revision A
Page
•
Changed the SWITCHING CHARACTERISTICS table, Input glitch rejection time. Values by device. ............................... 4
•
Changed the SWITCHING CHARACTERISTICS table, Input glitch rejection time. Values by device. ............................... 6
•
Changed the SWITCHING CHARACTERISTICS table, Input glitch rejection time. Values by device. ............................... 8
•
Added Figure 11 ................................................................................................................................................................. 16
Changes from Revision A (June 2013) to Revision B
•
Page
Changed device ISO7141CC From: Product Preview To: Released in the Product Status table ........................................ 1
Changes from Revision B (June 2013) to Revision C
Page
•
Changed Feature From: ISO7140: TBD at 1 Mbps, TBD at 25 Mbps To: ISO7140: 1 mA at 1 Mbps, 2.3 mA at 25
Mbps ..................................................................................................................................................................................... 1
•
Changed the SAFETY and REGULATORY APPROVALS .................................................................................................. 1
•
Added text to the Description: "All inputs are 5V tolerant when supplied from a 2.7V or 3.3V supply." .............................. 1
•
Deleted the Product Status table .......................................................................................................................................... 1
•
Changed the AVAILABLE OPTIONS table ........................................................................................................................... 2
•
Changed the ABSOLUTE MAXIMUM RATINGS table ......................................................................................................... 3
•
Changed the SWITCHING CHARACTERISTICS table, Input glitch rejection time. ............................................................. 4
•
Changed ISO7140 in the SUPPLY CURRENT table From: TBD To: values ....................................................................... 5
•
Changed the SWITCHING CHARACTERISTICS table, Input glitch rejection time. ............................................................. 6
•
Changed ISO7140 in the SUPPLY CURRENT table From: TBD To: values ....................................................................... 7
•
Changed the SWITCHING CHARACTERISTICS table, Input glitch rejection time. ............................................................. 8
•
Changed ISO7140 in the SUPPLY CURRENT table From: TBD To: values ....................................................................... 9
•
Changed Figure 9 X-axis scale ........................................................................................................................................... 16
Changes from Revision C (July 2013) to Revision D
Page
•
Added Safety List item "GB 4943.1-2011 and GB 8898:2011 CQC Certification (Approval Pending)" ............................... 1
•
Deleted "Product Preview" From the AVAILABLE OPTIONS table ...................................................................................... 2
•
Changed the REGULATORY INFORMATION, added column for CQC ............................................................................ 13
•
Added Figure 10 ................................................................................................................................................................. 16
Changes from Revision D (August 2013) to Revision E
Page
•
Changed From: 2500 VRMS Isolation for 1 minute per UL 1577 (Approval Pending) To: (Approved) .................................. 1
•
Added note1 to the AVAILABLE OPTIONS table ................................................................................................................. 2
•
Changed From: Basic Insulation To: Basic Insulation, Altitude ≤ 5000m, Tropical Climate, 250 VRMS maximum
working voltage in the Regulatory Information table ........................................................................................................... 13
•
Changed File number: E181974 (approval pending) To: File number: E181974 in the Regulatory Information table ...... 13
•
Changed Figure 5 ............................................................................................................................................................... 13
•
Changed the title of Figure 18, Figure 19, and Figure 19 to include "PRBS 216 - 1" ......................................................... 17
18
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PACKAGE OPTION ADDENDUM
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10-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
ISO7131CCDBQ
ACTIVE
SSOP
DBQ
16
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
7131CC
ISO7131CCDBQR
ACTIVE
SSOP
DBQ
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
7131CC
ISO7140CCDBQ
ACTIVE
SSOP
DBQ
16
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
7140CC
ISO7140CCDBQR
ACTIVE
SSOP
DBQ
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
7140CC
ISO7140FCCDBQ
ACTIVE
SSOP
DBQ
16
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
7140FC
ISO7140FCCDBQR
ACTIVE
SSOP
DBQ
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
7140FC
ISO7141CCDBQ
ACTIVE
SSOP
DBQ
16
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
7141CC
ISO7141CCDBQR
ACTIVE
SSOP
DBQ
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
7141CC
ISO7141FCCDBQ
ACTIVE
SSOP
DBQ
16
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
7141FC
ISO7141FCCDBQR
ACTIVE
SSOP
DBQ
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 125
7141FC
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Sep-2013
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
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