FSA8049 Audio Jack Detection and Configuration, MIC / GND Cross Point Switch Features Description Detection Audio Plug GND & MIC Polarity VDD 2.5 to 4.4V THD (MIC) 0.002% Typical ESD (IEC 61000-4-2) (Air Gap) 15kV Operating Temperature -40°C to 85°C 9-Ball WLCSP 3x3 Array, 0.4mm Terminal Pitch, 250µm Ball Package Top Mark M3 Ordering Information FSA8049UCX Detects 3- or 4-pole audio accessories Detects polarity of GND and MIC on 4-pole plugs Automatically routes GND and MIC to audio jack terminals Related Resources For evaluation boards and questions, please contact: Applications The FSA8049 is an audio jack detection switch for 3- or 4-pole accessories. The FSA8049 detects the locations of ground (GND) and microphone (MIC) poles on the audio plug and automatically routes them to the appropriate connections. This allows the end user to plug accessories, such as headsets with different audio pole configurations, into the mobile device and have them operate correctly. [email protected]. Cellular Phones, Smart Phones MP3 and Portable Multimedia Player Typical Application To Audio Plug Detection Circuit VDD Baseband Processor GPIO EN Audio Jack Oscillator & Logic Detection LSPKR CEXT Audio Sub System RSPKR Switch Enable Timing 3Pole 4Pole MIC Bias RMIC MIC CMIC GND/MIC1 MIC GND/MIC2 5Ω tOn/Off Capacitor 100mΩ GND GNDA Figure 1. Mobile Phone Example © 2011 Fairchild Semiconductor Corporation FSA8049 • Rev. 1.0.1 www.fairchildsemi.com FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch April 2012 FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch Physical Dimensions F 0.03 C A E 2X 0.40 B A1 PIN A1 INDEX AREA 0.40 D Ø0.20 Cu Pad Ø0.30 Solder Mask 0.03 C 2X LAND PATTERN RECOMMENDATION (NSMD PAD TYPE) TOP VIEW 0.06 C 0.05 C 0.625 0.547 C SEATING PLANE D 0.378±0.018 E 0.208±0.021 SIDE VIEWS NOTES: A. NO JEDEC REGISTRATION APPLIES. Ø0.260±0.020 9X 0.40 C. DIMENSIONS AND TOLERANCE PER ASMEY14.5M, 1994. C B A 0.40 B. DIMENSIONS ARE IN MILLIMETERS. D. DATUM C IS DEFINED BY THE SPHERICAL CROWNS OF THE BALLS. (Y)±0.018 E. PACKAGE NOMINAL HEIGHT IS 586 MICRONS ±39 MICRONS (547-625 MICRONS). F 1 2 3 (X)±0.018 F. FOR DIMENSIONS D, E, X, AND Y SEE PRODUCT DATASHEET. BOTTOM VIEW G. DRAWING FILNAME: MKT-UC009ABrev2 Figure 6. 9-Ball, Wafer-Level Chip-Scale Package (WLCSP), 3x3 Array, 0.4mm Pitch, 250µm Ball Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. Ordering Information Part Number FSA8049UCX Operating Top Temperature Mark Range -40 to +85°C © 2011 Fairchild Semiconductor Corporation FSA8049 • Rev. 1.0.1 M3 Package D E X Y 9-Ball, Wafer-Level Chip-Scale Package 1.16mm 1.16mm 0.18mm 0.18mm (WLCSP), 3x3 Array, 0.4mm Pitch, 250µm Ball www.fairchildsemi.com 7 FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch © 2011 Fairchild Semiconductor Corporation FSA8049 • Rev. 1.0.1 www.fairchildsemi.com 8 FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch © 2011 Fairchild Semiconductor Corporation FSA8049 • Rev. 1.0.1 www.fairchildsemi.com 9 FSA8049 — Audio Jack Detection and Configuration, MIC/GND Cross point Switch © 2011 Fairchild Semiconductor Corporation FSA8049 • Rev. 1.0.1 www.fairchildsemi.com 10