NICHIA STS-DA1-3938 <Cat.No.150819> NICHIA CORPORATION SPECIFICATIONS FOR WHITE LED NT2W757GRT ● Pb-free Reflow Soldering Application ● Built-in ESD Protection Device ● RoHS Compliant NICHIA STS-DA1-3938 <Cat.No.150819> SPECIFICATIONS (1) Absolute Maximum Ratings Symbol Absolute Maximum Rating Unit Forward Current Item IF 150 mA Pulse Forward Current IFP 300 mA Allowable Reverse Current IR 85 mA Power Dissipation PD 975 mW Operating Temperature Topr -40~100 °C Storage Temperature Tstg -40~100 °C Junction Temperature TJ 120 °C * Absolute Maximum Ratings at TS=25°C. * IFP conditions with pulse width ≤10ms and duty cycle ≤10%. (2) Initial Electrical/Optical Characteristics Item Symbol Condition Typ Max Unit VF IF=75mA 5.9 - V Forward Voltage R70 Luminous Flux Φv IF=75mA 76.7 - lm R8000 Luminous Flux Φv IF=75mA 73.4 - lm R9050 Luminous Flux Φv IF=75mA 57.2 - lm x - IF=75mA 0.3447 - - y - IF=75mA 0.3553 - - RθJS - 12 18 °C/W Chromaticity Coordinate Thermal Resistance * Characteristics at TS=25°C. * Luminous Flux value as per CIE 127:2007 standard. * Chromaticity Coordinates as per CIE 1931 Chromaticity Chart. * RθJS is Thermal Resistance from junction to TS measuring point. 1 NICHIA STS-DA1-3938 <Cat.No.150819> RANKS Item Forward Voltage Luminous Flux Rank - Max Unit V 5.4 6.5 P16 72.0 85.6 P15 60.5 72.0 P14 51.0 60.5 P13 42.8 51.0 Ra 70 - - Ra 80 - - R9 0 - - Ra 90 - - R9 50 - - R70 Color Rendering Index Min R8000 R9050 lm Color Ranks The color rank has a chromaticity range within a 3-step MacAdam ellipse. Rank Rank Rank sm503 sm573 sm653 x 0.3447 0.3287 0.3123 y 0.3553 0.3417 0.3282 a 0.003555 0.003087 0.002709 Major Axis b 0.008418 0.007809 0.006561 Ellipse Rotation Angle Φ -31.78 -31.56 -32.35 Center Point Minor Axis The color rank has a chromaticity range within a 5-step MacAdam ellipse. Center Point Rank Rank Rank Rank Rank Rank sm5050a sm5050b sm5050c sm5050d sm5050e sm5050f x 0.3447 y 0.3553 a 0.005925 Major Axis b 0.014030 Ellipse Rotation Angle Φ -31.78 Minor Axis Center Point x Rank Rank Rank Rank Rank Rank sm5750a sm5750b sm5750c sm5750d sm5750e sm5750f 0.3287 y 0.3417 a 0.005145 Major Axis b 0.013015 Ellipse Rotation Angle Φ -31.56 Minor Axis 2 NICHIA STS-DA1-3938 <Cat.No.150819> Center Point Rank Rank Rank sm6550a sm6550b sm6550c x Rank Rank Rank sm6550d sm6550e sm6550f 0.3123 y 0.3282 Minor Axis a 0.004515 Major Axis b 0.010935 Ellipse Rotation Angle Φ -32.35 * Ranking at TS=25°C. * Forward Voltage Tolerance: ±0.07V * Luminous Flux Tolerance: ±5% * Color Rendering Index Ra Tolerance: ±2 * Color Rendering Index R9 Tolerance: ±4 * The R9 value for the above rank shall be greater than 0. * Chromaticity Coordinate Tolerance: ±0.003 * LEDs from the above ranks will be shipped. The rank combination ratio per shipment will be decided by Nichia. Definition of the MacAdam ellipse ranks: b 60° A perfect circle is divided into 60 degree-sections and then transformed into the MacAdam ellipse that is presented on the chromaticity diagram in this document. Φ a Luminous Flux Ranks by Color Rank, Color Rendering Index Rank Ranking by Luminous Flux Ranking by P13 P14 P15 P16 Color Coordinates, Color Rendering Index sm503,sm5050a,sm5050b,sm5050c,sm5050d,sm5050e,sm5050f, sm573,sm5750a,sm5750b,sm5750c,sm5750d,sm5750e,sm5750f, sm653,sm6550a,sm6550b,sm6550c,sm6550d,sm6550e,sm6550f R70,R8000 R9050 3 NICHIA STS-DA1-3938 <Cat.No.150819> CHROMATICITY DIAGRAM 0.38 5000K 0.37 sm5050c sm5050b sm5050a 0.36 5700K sm5750c 0.35 sm5750b sm5750a y sm5050d sm503 6500K sm5050e sm5050f 0.34 sm6550c sm6550b sm5750d sm573 sm5750e 0.33 sm5750f sm6550a sm6550d sm653 sm6550e 0.32 黒体放射軌跡 Blackbody Locus 0.31 0.29 0.30 sm6550f 0.31 0.32 0.33 0.34 0.35 0.36 x 4 NICHIA STS-DA1-3938 <Cat.No.150819> OUTLINE DIMENSIONS * 本製品はRoHS指令に適合しております。 This product complies with RoHS Directive. * 括弧で囲まれた寸法は参考値です。 The dimension(s) in parentheses are for reference purposes. 管理番号 No. Nx2x757GR STS-DA7-7231C (単位 Unit:±0.2) mm) (単位 Unit: mm, 公差 Tolerance: 3 （2.6） 3 （2.6） 0.65 Cathode Mark a (Cathode) b (Anode) 2.27 2.6 項目 Item 内容 Description パッケージ材質 Package Materials 耐熱性ポリマー Heat-Resistant Polymer 封止樹脂材質 Encapsulating Resin Materials シリコーン樹脂 （拡散剤+蛍光体入り） Silicone Resin (with diffuser and phosphor) 電極材質 Electrodes Materials 銅合金+銀メッキ Ag-plated Copper Alloy 質量 Weight 0.018g(TYP) * バリは寸法に含まないものとします。 Dimensions do not include mold flash. Cathode Anode 1.42 K * a>bとなる場合、aがカソード側です。 The side with the larger distance is the cathode. Example: a>b, then a is the side that has the cathode. 0.48 A 保護素子 Protection Device 5 NICHIA STS-DA1-3938 <Cat.No.150819> SOLDERING • Recommended Reflow Soldering Condition(Lead-free Solder) 1 to 5°C per sec • Recommended Hand Soldering Condition Temperature 350°C Max Soldering Time 3sec Max 260°CMax 10sec Max Pre-heat 180 to 200°C 60sec Max Above 220°C 120sec Max 1.53 0.69 0.6 1.45 0.95 0.58 3.15 2 0.6 2.3 2.3 0.6 ● Recommended Metal Solder Stencil Aperture 0.85 0.85 2.3 3.15 ● Recommended Soldering Pad Pattern 0.6 0.4 (単位 Unit: mm) * This LED is designed to be reflow soldered on to a PCB. If dip soldered, Nichia cannot guarantee its reliability. * Reflow soldering must not be performed more than twice. Hand soldering must not be performed more than once. * Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature. * Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation, caused by heat and/or atmosphere. * Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin. Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * When soldering, do not apply stress to the LED while the LED is hot. * When using a pick and place machine, choose an appropriate nozzle for this product. Using a pick-and-place nozzle with a smaller diameter than the size of the LED's emitting surface will cause damage to the emitting surface and may also cause the LED not to illuminate. 6 NICHIA STS-DA1-3938 <Cat.No.150819> * If the top cover tape is removed right next to where the nozzle picks up the LEDs, regardless of whether the LEDs have been baked or not, it may cause the LED to be picked up incorrectly; it is recommended to remove the top cover tape further from where the nozzle picks up the LEDs. Ensure that there are no issues with the conditions when the nozzle picks up the LEDs. ● Recommended Tape Removal Position(Removing the cover tape further from the pick-and-place nozzle) 吸着ノズル Pick-and-place nozzle テープ剥離位置 Tape Removal Position 製品テープ Top Cover Tape キャリアテープ引き出し方向 Feed Direction of the Carrier Tape ● Incorrect Tape Removal Position(Removing the cover tape right next to the pick-and-place nozzle) 吸着ノズル Pick-and-place nozzle テープ剥離位置 Tape Removal Position 製品テープ Top Cover Tape キャリアテープ引き出し方向 Feed Direction of the Carrier Tape * Verify the setting conditions when the LEDs are mounted onto a PCB to ensure that the LEDs are mounted onto the PCB with the correct polarity. If the cathode mark is not able to be easily recognized with a visual inspection, check the back or side of the LED to determine the polarity. * The recommended soldering pad pattern is designed for attachment of the LED without problems. When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad are suitable for the circuit design. * Consider factors such as the reflow soldering temperature, hand soldering temperature, etc. when choosing the solder. * When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the flux will come in contact with the LEDs. * Make sure that there are no issues with the type and amount of solder that is being used. * All of the electrode pads are on the backside of this product; solder connections will not be able to be seen nor confirmed by a normal visual inspection. When using the product, ensure that there are no issues with the soldering conditions. 7 NICHIA STS-DA1-3938 <Cat.No.150819> TAPE AND REEL DIMENSIONS 3.5±0.05 Cathode Mark 4±0.1 0.2±0.05 Nxxx757x STS-DA7-7099 (単位 Unit: mm) 3.18±0.1 2 ±0.05 1.75±0.1 4±0.1 Φ1.5+0.1 -0 管理番号 No. 8+0.3 -0.1 テーピング部 Tape Φ1+0.2 -0 0.8±0.1 3.18±0.1 エンボスキャリアテープ Embossed Carrier Tape トレーラ部/リーダ部 Trailer and Leader トップカバーテープ Top Cover Tape 引き出し方向 Feed Direction トレーラ部最小160mm（空部） Trailer 160mm MIN(Empty Pockets) LED装着部 Loaded Pockets 引き出し部最小100mm（空部） Leader with Top Cover Tape 100mm MIN(Empty Pocket) リーダ部最小400mm Leader without Top Cover Tape 400mm MIN リール部 Reel 180+0 -3 11.4±1 9±0.3 * 数量は1リールにつき 5000個入りです。 Reel Size: 5000pcs Φ * JIS C 0806電子部品テーピングに準拠しています。 The tape packing method complies with JIS C 0806 (Packaging of Electronic Components on Continuous Tapes). ± 21 8 0. f2 1 ±0. ラベル Label Φ 13 ± 0 .2 f 13 Φ60+1 -0 8 ±0.2 * 実装作業の中断などでエンボスキャリアテープをリールに巻き取る場合、 エンボスキャリアテープを強く(10N以上)締めないで下さい。 LEDがカバーテープに貼り付く可能性があります。 When the tape is rewound due to work interruptions, no more than 10N should be applied to the embossed carrier tape. The LEDs may stick to the top cover tape. 8 NICHIA STS-DA1-3938 <Cat.No.150819> PACKAGING - TAPE & REEL シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。 Reels are shipped with desiccants in heat-sealed moisture-proof bags. 管理番号 No. Nxxxxxxx STS-DA7-4989 ラベル Label リール Reel シリカゲル Desiccants XXXX LED TYPE Nxxxxxxx ******* LOT YMxxxx-RRR QTY. PCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN 熱シール Seal アルミ防湿袋 Moisture-proof Bag アルミ防湿袋を並べて入れ、ダンボールで仕切ります。 Moisture-proof bags are packed in cardboard boxes with corrugated partitions. ラベル Label XXXX LED TYPE Nxxxxxxx ******* RANK RRR QTY. PCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Nichia LED * 客先型名を*******で示します。 客先型名が設定されていない場合は空白です。 ******* is the customer part number. If not provided, it will not be indicated on the label. * ロット表記方法についてはロット番号の項を 参照して下さい。 For details, see "LOT NUMBERING CODE" in this document. * ランク分けがない場合はランク表記はありません。 The label does not have the RANK field for un-ranked products. * 本製品はテーピングしたのち、輸送の衝撃から保護するためダンボールで梱包します。 Products shipped on tape and reel are packed in a moisture-proof bag. They are shipped in cardboard boxes to protect them from external forces during transportation. * 取り扱いに際して、落下させたり、強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。 Do not drop or expose the box to external forces as it may damage the products. * ダンボールには防水加工がされておりませんので、梱包箱が水に濡れないよう注意して下さい。 Do not expose to water. The box is not water-resistant. * 輸送、運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい。 Using the original package material or equivalent in transit is recommended. 9 NICHIA STS-DA1-3938 <Cat.No.150819> LOT NUMBERING CODE Lot Number is presented by using the following alphanumeric code. YMxxxx - RRR Y - Year Year Y 2014 E 2015 F 2016 G 2017 H 2018 I 2019 J M - Month Month M Month M 1 1 7 7 2 2 8 8 3 3 9 9 4 4 10 A 5 5 11 B 6 6 12 C xxxx-Nichia's Product Number RRR-Ranking by Color Coordinates, Ranking by Luminous Flux, Ranking by Color Rendering Index 10 NICHIA STS-DA1-3938 <Cat.No.150819> DERATING CHARACTERISTICS NT2x757xR 管理番号 No. STS-DA7-4473A 周囲温度-許容順電流特性 Ambient Temperature vs Allowable Forward Current Derating1 はんだ接合部温度(カソード側)-許容順電流特性 Solder Temperature(Cathode Side) vs Allowable Forward Current Derating2 RθJA =74°C/W 300 300 250 許容順電流 200 (48, 150) 150 100 50 (100, 42.0) 0 20 40 60 80 100 120 周囲温度 Ambient Temperature(°C) デューティー比-許容順電流特性 Duty Ratio vs Allowable Forward Current Duty 1000 許容順電流 200 (100, 150) 150 100 50 0 0 Allowable Forward Current(mA) Allowable Forward Current(mA) 許容順電流 Allowable Forward Current(mA) 250 0 20 40 60 80 100 120 はんだ接合部温度(カソード側) Solder Temperature(Cathode Side)(°C) T A =25°C 300 150 100 10 1 10 100 デューティー比 Duty Ratio(%) 11 NICHIA STS-DA1-3938 <Cat.No.150819> OPTICAL CHARACTERISTICS NT2W757GR 管理番号 No. STS-DA7-8076 * 本特性は参考です。 All characteristics shown are for reference only and are not guaranteed. 発光スペクトル Spectrum TA =25°C IF=75mA Spectrum 1.0 相対発光強度 Relative Emission Intensity(a.u.) 0.8 0.6 0.4 0.2 0.0 350 400 450 500 550 600 650 700 750 波長 Wavelength(nm) Directivity1 指向特性 Directivity -20° -10° 0° TA =25°C IFP=75mA 10° 20° -30° 30° -40° 40° 放射角度 Radiation Angle -50° 50° -60° 60° -70° 70° -80° 80° -90° 90° 1 0.5 0 0.5 1 相対照度 Relative Illuminance(a.u.) * 本特性は演色性ランクR70に対応しています。 The graphs above show the characteristics for R70 LEDs of this product. 12 NICHIA STS-DA1-3938 <Cat.No.150819> OPTICAL CHARACTERISTICS NT2W757GR 管理番号 No. STS-DA7-8077 * 本特性は参考です。 All characteristics shown are for reference only and are not guaranteed. 発光スペクトル Spectrum TA =25°C IF=75mA Spectrum 1.0 相対発光強度 Relative Emission Intensity(a.u.) 0.8 0.6 0.4 0.2 0.0 350 400 450 500 550 600 650 700 750 波長 Wavelength(nm) Directivity1 指向特性 Directivity -20° -10° 0° TA =25°C IFP=75mA 10° 20° -30° 30° -40° 40° 放射角度 Radiation Angle -50° 50° -60° 60° -70° 70° -80° 80° -90° 90° 1 0.5 0 0.5 1 相対照度 Relative Illuminance(a.u.) * 本特性は演色性ランクR8000に対応しています。 The graphs above show the characteristics for R8000 LEDs of this product. 13 NICHIA STS-DA1-3938 <Cat.No.150819> OPTICAL CHARACTERISTICS NT2W757GR 管理番号 No. STS-DA7-8078 * 本特性は参考です。 All characteristics shown are for reference only and are not guaranteed. 発光スペクトル Spectrum TA =25°C IF=75mA Spectrum 1.0 相対発光強度 Relative Emission Intensity(a.u.) 0.8 0.6 0.4 0.2 0.0 400 450 500 550 600 650 700 750 800 波長 Wavelength(nm) Directivity1 指向特性 Directivity -20° -10° 0° TA =25°C IFP=75mA 10° 20° -30° 30° -40° 40° 放射角度 Radiation Angle -50° 50° -60° 60° -70° 70° -80° 80° -90° 90° 1 0.5 0 0.5 1 相対照度 Relative Illuminance(a.u.) * 本特性は演色性ランクR9050に対応しています。 The graphs above show the characteristics for R9050 LEDs of this product. 14 NICHIA STS-DA1-3938 <Cat.No.150819> FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS NT2W757GR 管理番号 No. STS-DA7-8079 * 本特性は参考です。 All characteristics shown are for reference only and are not guaranteed. 順電圧-順電流特性 Forward Voltage vs Forward Current 周囲温度-順電圧特性 Ambient Temperature vs Forward Voltage VfIf TA =25°C 1000 TaVf IFP=75mA 7.5 順電圧 Forward Voltage(V) 順電流 Forward Current(mA) 7.0 300 100 75 6.5 6.0 5.5 10 5.0 5.0 5.5 6.0 6.5 7.0 7.5 -60 -40 -20 順電圧 Forward Voltage(V) 順電流-相対光束特性 Forward Current vs Relative Luminous Flux 20 40 60 80 100 120 周囲温度 Ambient Temperature(°C) 周囲温度-相対光束特性 Ambient Temperature vs Relative Luminous Flux IfIv TA =25°C 4.0 0 TaIv IFP=75mA 1.4 相対光束 Relative Luminous Flux(a.u.) 相対光束 Relative Luminous Flux(a.u.) 3.5 3.0 2.5 2.0 1.5 1.0 1.2 1.0 0.8 0.5 0.0 0.6 0 100 200 300 順電流 Forward Current(mA) 400 -60 -40 -20 0 20 40 60 80 100 120 周囲温度 Ambient Temperature(°C) 15 NICHIA STS-DA1-3938 <Cat.No.150819> FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS NT2W757GR 管理番号 No. STS-DA7-8080 * 本特性は参考です。 All characteristics shown are for reference only and are not guaranteed. 順電流-色度 特性 Forward Current vs Chromaticity Coordinate Ifxy TA =25°C 0.38 y 0.37 0.36 10mA 20mA 75mA 150mA 0.35 0.34 0.32 300mA 0.33 0.34 0.35 0.36 x 周囲温度-色度 特性 Ambient Temperature vs Chromaticity Coordinate Taxy IFP= 75mA 0.38 y 0.37 -40˚C 0.36 0˚C 25˚C 100˚C 0.35 0.34 0.32 0.33 0.34 0.35 0.36 x * 本特性は演色性ランクR70に対応しています。 The graphs above show the characteristics for R70 LEDs of this product. 16 NICHIA STS-DA1-3938 <Cat.No.150819> FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS NT2W757GR 管理番号 No. STS-DA7-8081 * 本特性は参考です。 All characteristics shown are for reference only and are not guaranteed. 順電流-色度 特性 Forward Current vs Chromaticity Coordinate Ifxy TA =25°C 0.38 y 0.37 0.36 75mA 300mA 10mA 0.35 0.34 0.32 0.33 0.34 0.35 0.36 x 周囲温度-色度 特性 Ambient Temperature vs Chromaticity Coordinate Taxy IFP= 75mA 0.38 y 0.37 0.36 -40˚C 0˚C 25˚C 0.35 0.34 0.32 100˚C 0.33 0.34 0.35 0.36 x * 本特性は演色性ランクR8000に対応しています。 The graphs above show the characteristics for R8000 LEDs of this product. 17 NICHIA STS-DA1-3938 <Cat.No.150819> FORWARD CURRENT CHARACTERISTICS / TEMPERATURE CHARACTERISTICS NT2W757GR 管理番号 No. STS-DA7-8082 * 本特性は参考です。 All characteristics shown are for reference only and are not guaranteed. 順電流-色度 特性 Forward Current vs Chromaticity Coordinate Ifxy TA =25°C 0.38 y 0.37 0.36 300mA 75mA 10mA 0.35 0.34 0.32 0.33 0.34 0.35 0.36 x 周囲温度-色度 特性 Ambient Temperature vs Chromaticity Coordinate Taxy IFP= 75mA 0.38 0.37 y -40˚C 0.36 0˚C 25˚C 0.35 100˚C 0.34 0.32 0.33 0.34 0.35 0.36 x * 本特性は演色性ランクR9050に対応しています。 The graphs above show the characteristics for R9050 LEDs of this product. 18 NICHIA STS-DA1-3938 <Cat.No.150819> RELIABILITY (1) Tests and Results Reference Test Standard Resistance to Test Test Conditions Duration JEITA ED-4701 Tsld=260°C, 10sec, 2reflows, 300 301 Precondition: 30°C, 70%RH, 168hr Solderability JEITA ED-4701 Tsld=245±5°C, 5sec, (Reflow Soldering) 303 303A Lead-free Solder(Sn-3.0Ag-0.5Cu) JEITA ED-4701 -40°C(30min)~25°C(5min)~ 100 105 100°C(30min)~25°C(5min) Moisture Resistance JEITA ED-4701 25°C~65°C~-10°C, 90%RH, (Cyclic) 200 203 24hr per cycle High Temperature JEITA ED-4701 Storage 200 201 Temperature Humidity JEITA ED-4701 Storage 100 103 Low Temperature JEITA ED-4701 Storage 200 202 Soldering Heat (Reflow Soldering) Temperature Cycle Room Temperature Room Temperature #2 0/22 100cycles #1 0/50 10cycles #1 0/22 TA=100°C 1000hours #1 0/22 TA=60°C, RH=90% 1000hours #1 0/22 TA=-40°C 1000hours #1 0/22 1000hours #1 0/22 500hours #1 0/22 1000hours #1 0/22 500hours #1 0/22 1000hours #1 0/22 48minutes #1 0/22 #1 0/22 #3 0/22 #1 0/22 TA=25°C, IF=150mA Operating Life Test board: See NOTES below Condition 2 High Temperature TA=100°C, IF=40mA Operating Life Test board: See NOTES below Temperature Humidity 60°C, RH=90%, IF=75mA Operating Life Test board: See NOTES below Low Temperature TA=-40°C, IF=75mA Operating Life Test board: See NOTES below Vibration Electrostatic Discharges JEITA ED-4701 200m/s2, 100~2000~100Hz, 400 403 4cycles, 4min, each X, Y, Z JEITA ED-4701 HBM, 2kV, 1.5kΩ, 100pF, 3pulses, 300 304 alternately positive or negative 1bend to a deflection of 2mm Board Bending for 5±1sec Soldering Joint Shear JEITA ED-4702B Strength 002 3 Failed/Tested 0/22 Test board: See NOTES below Condition 1 # Units #1 TA=25°C, IF=75mA Operating Life Failure Criteria 5N, 10±1sec NOTES: 1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, RθJA≈74°C/W The Board Bending is performed using an exclusive test board. 2) Measurements are performed after allowing the LEDs to return to room temperature. (2) Failure Criteria Criteria # Items Conditions Failure Criteria Forward Voltage(VF) IF=75mA >U.S.L.×1.1 Luminous Flux(ΦV) IF=75mA <L.S.L.×0.7 #2 Solderability - Less than 95% solder coverage #3 Appearance - The light emission is abnormal #1 U.S.L. : Upper Specification Limit L.S.L. : Lower Specification Limit 19 NICHIA STS-DA1-3938 <Cat.No.150819> CAUTIONS (1) Storage Conditions Storage Temperature Humidity Time Before Opening Aluminum Bag ≤30°C ≤90%RH Within 1 Year from Delivery Date After Opening Aluminum Bag ≤30°C ≤70%RH ≤168hours 65±5°C - ≥24hours Baking ● Product complies with JEDEC MSL 3 or equivalent. See IPC/JEDEC STD-020 for moisture-sensitivity details. ● Absorbed moisture in LED packages can vaporize and expand during soldering, which can cause interface delamination and result in optical performance degradation. Products are packed in moisture-proof aluminum bags to minimize moisture absorption during transportation and storage. Included silica gel desiccants change from blue to red if moisture had penetrated bags. ● After opening the moisture-proof aluminum bag, the products should go through the soldering process within the range of the conditions stated above. Unused remaining LEDs should be stored with silica gel desiccants in a hermetically sealed container, preferably the original moisture-proof bags for storage. ● After the “Period After Opening” storage time has been exceeded or silica gel desiccants are no longer blue, the products should be baked. Baking should only be done once. ● Customer is advised to keep the LEDs in an airtight container when not in use. Exposure to a corrosive environment may cause the plated metal parts of the product to tarnish, which could adversely affect soldering and optical characteristics. It is also recommended to return the LEDs to the original moisture proof bags and reseal. ● After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere. The above should be taken into consideration when designing. Resin materials, in particular, may contain substances which can affect silver plating, such as halogen. ● Do not use sulfur-containing materials in commercial products. Some materials, such as seals and adhesives, may contain sulfur. The extremely corroded or contaminated plating of LEDs might cause an open circuit. Silicone rubber is recommended as a material for seals. Bear in mind, the use of silicones may lead to silicone contamination of electrical contacts inside the products, caused by low molecular weight volatile siloxane. ● To prevent water condensation, please avoid large temperature and humidity fluctuations for the storage conditions. ● Do not store the LEDs in a dusty environment. ● Do not expose the LEDs to direct sunlight and/or an environment where the temperature is higher than normal room temperature. (2) Directions for Use ● When designing a circuit, the current through each LED must not exceed the Absolute Maximum Rating. Operating at a constant current per LED is recommended. In case of operating at a constant voltage, Circuit B is recommended. If the LEDs are operated with constant voltage using Circuit A, the current through the LEDs may vary due to the variation in Forward Voltage characteristics of the LEDs. (A) (B) ... ... ● This product should be operated using forward current. Ensure that the product is not subjected to either forward or reverse voltage while it is not in use. In particular, subjecting it to continuous reverse voltage may cause migration, which may cause damage to the LED die. When used in displays that are not used for a long time, the main power supply should be switched off for safety. ● It is recommended to operate the LEDs at a current greater than 10% of the sorting current to stabilize the LED characteristics. ● Ensure that excessive voltages such as lightning surges are not applied to the LEDs. ● For outdoor use, necessary measures should be taken to prevent water, moisture and salt air damage. 20 NICHIA STS-DA1-3938 <Cat.No.150819> (3) Handling Precautions ● Do not handle the LEDs with bare hands as it will contaminate the LED surface and may affect the optical characteristics: it might cause the LED to be deformed and/or the wire to break, which will cause the LED not to illuminate. ● When handling the product with tweezers, be careful not to apply excessive force to the resin. Otherwise, The resin can be cut, chipped, delaminate or deformed, causing wire-bond breaks and catastrophic failures. ● Dropping the product may cause damage. ● Do not stack assembled PCBs together. Failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed. It may cause wire to break, leading to catastrophic failures. ● CRI Rank R9050 LEDs in this specification use materials that contain halogen-based compounds; the halogen element found in these materials will not affect the LEDs when the LEDs are used under the conditions specified in this specification. The other CRI ranks in this specification do not use these materials. ● Due to the variation in the amount of the reflective material (white resin) that is coating the protection device, the area around the protection device may appear to be a black spot; this will not affect the characteristics of the LED. Do not use the location of the protection device to determine the polarity of the LED; use the cathode mark. (4) Design Consideration ● PCB warpage after mounting the products onto a PCB can cause the package to break. The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist. ● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines. The LED should be placed in a way to minimize the stress on the LEDs due to board flexing. ● Board separation must be performed using special jigs, not using hands. ● Volatile organic compounds that have been released from materials present around the LEDs (e.g. housing, packing, adhesive, secondary lens, lens cover, etc.) may penetrate the LED lens and/or encapsulating resin. If the LEDs are being used in a hermetically sealed environment, these volatile compounds can discolor after being exposed to heat and/or photon energy and it may greatly reduce the LED light output and/or cause a color shift. In this case, ventilating the environment may improve the reduction in light output and/or color shift. Perform a light-up test of the chosen application for optical evaluation to ensure that there are no issues, especially if the LEDs are planned to be used in a hermetically sealed environment. (5) Electrostatic Discharge (ESD) ● The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability. When handling the products, the following measures against electrostatic discharge are strongly recommended: Eliminating the charge Grounded wrist strap, ESD footwear, clothes, and floors Grounded workstation equipment and tools ESD table/shelf mat made of conductive materials ● Ensure that tools (e.g. soldering irons), jigs and machines that are being used are properly grounded and that proper grounding techniques are used in work areas. For devices/equipment that mount the LEDs, protection against surge voltages should also be used. ● If tools or equipment contain insulating materials such as glass or plastic, the following measures against electrostatic discharge are strongly recommended: Dissipating static charge with conductive materials Preventing charge generation with moisture Neutralizing the charge with ionizers ● The customer is advised to check if the LEDs are damaged by ESD when performing the characteristics inspection of the LEDs in the application. Damage can be detected with a forward voltage measurement or a light-up test at low current (≤1mA). ● ESD damaged LEDs may have current flow at a low voltage or no longer illuminate at a low current. Failure Criteria: VF<4.0V at IF=0.5mA 21 NICHIA STS-DA1-3938 <Cat.No.150819> (6) Thermal Management ● Proper thermal management is an important when designing products with LEDs. LED die temperature is affected by PCB thermal resistance and LED spacing on the board. Please design products in a way that the LED die temperature does not exceed the maximum Junction Temperature (TJ). ● Drive current should be determined for the surrounding ambient temperature (TA) to dissipate the heat from the product. ● The following equations can be used to calculate the junction temperature of the products. 1) TJ=TA+RθJA･W 2) TJ=TS+RθJS･W *TJ=LED junction temperature: °C TA=Ambient temperature: °C TS=Soldering temperature (cathode side): °C RθJA=Thermal resistance from junction to ambient: °C/W RθJS=Thermal resistance from junction to TS measuring point: °C/W W=Input power(IF×VF): W Ts Point (7) Cleaning ● The LEDs should not be cleaned with water, benzine, and/or thinner. ● If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs due to the damage to the resin portion. The effects of such solvents should be verified prior to use. In addition, the use of CFCs such as Freon is heavily regulated. ● When dust and/or dirt adheres to the LEDs, soak a cloth with Isopropyl alcohol (IPA), then squeeze it before wiping the LEDs. ● Ultrasonic cleaning is not recommended since it may have adverse effects on the LEDs depending on the ultrasonic power and how LED is assembled. If ultrasonic cleaning must be used, the customer is advised to make sure the LEDs will not be damaged prior to cleaning. (8) Eye Safety ● In 2006, the International Electrical Commission (IEC) published IEC 62471:2006 Photobiological safety of lamps and lamp systems, which added LEDs in its scope. On the other hand, the IEC 60825-1:2007 laser safety standard removed LEDs from its scope. However, please be advised that some countries and regions have adopted standards based on the IEC laser safety standard IEC 60825-1:20112001, which still includes LEDs in its scope. Most of Nichia's LEDs can be classified as belonging into either the Exempt Group or Risk Group 1. High-power LEDs, that emit light containing blue wavelengths, may be classified as Risk Group 2. Please proceed with caution when viewing directly any LEDs driven at high current, or viewing LEDs with optical instruments which may greatly increase the damages to your eyes. ● Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product, please be careful to avoid adverse effects on the human body caused by light stimulation. (9) Others ● The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control system, automobiles, traffic control equipment, life support systems and safety devices). ● The customer shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the customer shall inform Nichia directly before disassembling or analysis. ● The specifications and appearance of this product may change without notice; Nichia does not guarantee the contents of this specification. Both the customer and Nichia will agree on the official specifications of supplied products before the volume production of a program begins. 22