ADC10040 www.ti.com SNAS224M – JULY 2003 – REVISED APRIL 2013 ADC10040/ADC10040Q 10-Bit, 40 MSPS, 3V, 55.5 mW A/D Converter Check for Samples: ADC10040 FEATURES DESCRIPTION • • The ADC10040 is a monolithic CMOS analog-todigital converter capable of converting analog input signals into 10-bit digital words at 40 Megasamples per second (MSPS). This converter uses a differential, pipeline architecture with digital error correction and an on-chip sample-and-hold circuit to provide a complete conversion solution, and to minimize power consumption, while providing excellent dynamic performance. A unique sampleand-hold stage yields a full-power bandwidth of 400 MHz. Operating on a single 3.0V power supply, this device consumes just 55.5 mW at 40 MSPS, including the reference current. The Standby feature reduces power consumption to just 13.5 mW. 1 2 • • • • • • • • Single +3.0V Operation Selectable 2.0 VP-P, 1.5 VP-P, or 1.0 VP-P fullscale input swing 400 MHz −3 dB Input Bandwidth Low Power Consumption Standby Mode On-Chip Reference and Sample-and-Hold Amplifier Offset Binary or Two’s Complement Data Format Separate Adjustable Output Driver Supply to Accommodate 2.5V and 3.3V Logic Families AEC-Q100 Grade 3 Qualified 28-Pin TSSOP Package KEY SPECIFICATIONS • • • • • • • Resolution: 10 Bits Conversion Rate: 40 MSPS Full Power Bandwidth: 400 MHz DNL: ±0.3 LSB typ) SNR (fIN = 11 MHz): 59.6 dB (typ) SFDR (fIN = 11 MHz): -80 dB (typ) Power Consumption, 40 MHz: 55.5 mW APPLICATIONS • • • • • • • • The differential inputs provide a full scale selectable input swing of 2.0 VP-P, 1.5 VP-P, 1.0 VP-P, with the possibility of a single-ended input. Full use of the differential input is recommended for optimum performance. An internal +1.2V precision bandgap reference is used to set the ADC full-scale range, and also allows the user to supply a buffered referenced voltage for those applications requiring increased accuracy. The output data format is user choice of offset binary or two’s complement. The ADC10040Q runs on an Automotive Grade Flow and is AEC-Q100 Grade 3 Qualified. This device is available in the 28-lead TSSOP package and will operate over the industrial temperature range of −40°C to +85°C. Ultrasound and Imaging Instrumentation Cellular Base Stations/Communications Receivers Sonar/Radar xDSL Wireless Local Loops Data Acquisition Systems DSP Front Ends 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2013, Texas Instruments Incorporated ADC10040 SNAS224M – JULY 2003 – REVISED APRIL 2013 www.ti.com Connection Diagram Figure 1. TSSOP Package See Package Number PW0028A Block Diagram 2 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 ADC10040 www.ti.com SNAS224M – JULY 2003 – REVISED APRIL 2013 Pin Descriptions and Equivalent Circuits Pin No. Symbol Equivalent Circuit Description ANALOG I/O 12 VIN− Inverting analog input signal. With a 1.2V reference the full-scale input signal level is a differential 1.0 VP-P. This pin may be tied to VCOM (pin 4) for single-ended operation. 13 VIN+ Non-inverting analog input signal. With a 1.2V reference the fullscale input signal level is a differential 1.0 VP-P. 6 VREF Reference Voltage. This device provides an internal 1.2V reference. This pin should be bypassed to VSSA with a 0.1 µF monolithic capacitor. VREF is 1.20V nominal. This pin may be driven by a 1.20V external reference if desired. Do not load this pin. 7 VREFT 4 VCOM 8 VREFB These pins are high impedance reference bypass pins only. Connect a 0.1 µF capacitor from each of these pins to VSSA. These pins should not be loaded. VCOM may be used to set the input common mode voltage VCM. DIGITAL I/O 1 CLK 15 DF 28 STBY 5 IRS (Input Range Select) Digital clock input. The range of frequencies for this input is 20 MHz to 40 MHz. The input is sampled on the rising edge of this input. DF = “1” Two’s Complement DF = “0” Offset Binary This is the standby pin. When high, this pin sets the converter into standby mode. When this pin is low, the converter is in active mode. IRS = “VDDA” 2.0 VP-P input range IRS = “VSSA” 1.5 VP-P input range IRS = “Floating” 1.0 VP-P input range If using both VIN+ and VIN- pins, (or differential mode), then the peak-to-peak voltage refers to the differential voltage (VIN+ - VIN-). Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 3 ADC10040 SNAS224M – JULY 2003 – REVISED APRIL 2013 www.ti.com Pin Descriptions and Equivalent Circuits (continued) Pin No. Symbol Equivalent Circuit Description 16–20, 23–27 D0–D9 Digital output data. D0 is the LSB and D9 is the MSB of the binary output word. 2, 9, 10 VDDA Positive analog supply pins. These pins should be connected to a quiet 3,0V source and bypassed to analog ground with a 0.1 µF monolithic capacitor located within 1 cm of these pins. A 4.7 µF capacitor should also be used in parallel. 3, 11, 14 VSSA Ground return for the analog supply. 22 VDDIO Positive digital supply pins for the ADC10040’s output drivers. This pin should be bypassed to digital ground with a 0.1 µF monolithic capacitor located within 1 cm of this pin. A 4.7 µF capacitor should also be used in parallel. The voltage on this pin should never exceed the voltage on VDDA by more than 300 mV. 21 VSSIO The ground return for the digital supply for the output drivers. This pin should be connected to the ground plane, but not near the analog circuitry. ANALOG POWER DIGITAL POWER These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 4 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 ADC10040 www.ti.com SNAS224M – JULY 2003 – REVISED APRIL 2013 Absolute Maximum Ratings (1) (2) (3) VDDA, VDDIO 3.9V −0.3V to VDDA or VDDIO +0.3V Voltage on Any Pin to GND Input Current on Any Pin ±25 mA (4) ±50 mA Package Input Current See (5) Package Dissipation at T = 25°C ESD Susceptibility Human Body Model (6) Machine Model 2500V (6) 250V Soldering Temperature Infrared, 10 sec. (7) 235°C −65°C to +150°C Storage Temperature (1) (2) (3) (4) (5) (6) (7) All voltages are measured with respect to GND = VSSA = VSSIO = 0V, unless otherwise specified. Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. When the voltage at any pin exceeds the power supplies (VIN < VSSA or VIN > VDDA), the current at that pin should be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two. The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA)/θJA. In the 28-pin TSSOP, θJA is 96°C/W, so PDMAX = 1,302 mW at 25°C and 677 mW at the maximum operating ambient temperature of 85°C. Note that the power dissipation of this device under normal operation will typically be about 55.5 mW. The values for maximum power dissipation listed above will be reached only when the ADC10040 is operated in a severe fault condition. Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω. The 235°C reflow temperature refers to infrared reflow. For Vapor Phase Reflow (VPR) the following conditions apply: Maintain the temperature at the top of the package body above 183°C for a minimum of 60 seconds. The temperature measured on the package body must not exceed 220°C. Only one excursion above 183°C is allowed per reflow cycle. Operating Ratings (1) (2) −40°C ≤ TA ≤ +85°C Operating Temperature Range VDDA (Supply Voltage) +2.7V to +3.6V VDDIO (Output Driver Supply Voltage) +2.5V to VDDA VREF 1.20V ≤ 100 mV |VSSA–VSSIO| Clock Duty Cycle (1) (2) 30 to 70 % Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. All voltages are measured with respect to GND = VSSA = VSSIO = 0V, unless otherwise specified. Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 5 ADC10040 SNAS224M – JULY 2003 – REVISED APRIL 2013 www.ti.com Converter Electrical Characteristics Unless otherwise specified, the following specifications apply for VSSA = VSSIO = 0V, VDDA = +3.0V, VDDIO = +2.5V, VIN = 2 VP-P, STBY = 0V, External VREF = 1.20V, fCLK = 40 MHz, 50% Duty Cycle, CL = 10 pF/pin. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C. (1) (2) (3) Symbol Parameter Conditions Min Typ Max Units STATIC CONVERTER CHARACTERISTICS No Missing Codes Ensured 10 Bits INL Integral Non-Linearity FIN = 250 kHz, −0 dB Full Scale −1.0 ±0.3 +1.0 LSB DNL Differential Non-Linearity FIN = 250 kHz, −0 dB Full Scale −0.9 ±0.3 +0.9 LSB GE Gain Error Positive Error −1.5 +0.4 +1.9 % FS Negative Error −1.5 −0.01 +1.9 % FS OE Offset Error (VIN+ = VIN−) −1.4 0.12 +1.6 % FS FPBW Under Range Output Code 0 Over Range Output Code 1023 Full Power Bandwidth (4) 400 MHz REFERENCE AND INPUT CHARACTERISTICS VCM Common Mode Input Voltage VCOM Output Voltage for use as an input common mode voltage (5) 1.45 V VREF Reference Voltage 1.2 V Reference Voltage Temperature Coefficient ±80 ppm/°C 4 pF VREFTC CIN 0.5 VIN Input Capacitance (each pin to VSSA) 1.5 V POWER SUPPLY CHARACTERISTICS IVDDA Analog Supply Current IVDDIO Digital Supply Current (6) PWR Power Consumption (7) (1) (2) (3) (4) (5) (6) (7) 6 STBY = 1 4.5 6.0 mA STBY = 0 18 25 mA STBY = 1, fIN = 0 Hz 0 STBY = 0, fIN = 0 Hz 0.6 0.8 mA STBY = 1 13.5 18 mW STBY = 0 55.5 77 mW mA To ensure accuracy, it is required that |VDDA–VDDIO| ≤ 100 mV and separate bypass capacitors are used at each power supply pin. With the test condition for 2 VP-P differential input, the 10-bit LSB is 1.95 mV. Typical figures are at TA = TJ = 25°C and represent most likely parametric norms. Test limits are ensured to TI's AOQL (Average Outgoing Quality Level). The input bandwidth is limited using a capacitor between VIN− and VIN+. VCOM is a typical value, measured at room temperature. It is not ensured by test. Do not load this pin. VDDIO is the current consumed by the switching of the output drivers and is primarily determined by load capacitance on the output pins, the supply voltage, VDR, and the rate at which the outputs are switching (which is signal dependent). IDR = VDR x (C0 x f0 + C1 x f1 + C2 + f2 +....C11 x f11) where VDR is the output driver supply voltage, Cn is the total load capacitance on the output pin, and fn is the average frequency at which the pin is toggling. Power consumption includes output driver power. (fIN = 0 MHz). Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 ADC10040 www.ti.com SNAS224M – JULY 2003 – REVISED APRIL 2013 DC and Logic Electrical Characteristics Unless otherwise specified, the following specifications apply for VSSA = VSSIO = 0V, VDDA = +3.0V, VDDIO = +2.5V, VIN = 2 VP-P, STBY = 0V, External VREF = 1.20V, fCLK = 40 MHz, 50% Duty Cycle, CL = 10 pF/pin. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C (1) (2) (3) Symbol Parameter Conditions Min Typ Max Units CLK, DF, STBY, SENSE Logical “1” Input Voltage 2 V Logical “0” Input Voltage 0.8 V Logical “1” Input Current +10 µA −10 Logical “0” Input Current µA D0–D9 OUTPUT CHARACTERISTICS Logical “1” Output Voltage IOUT = −0.5 mA Logical “0” Output Voltage IOUT = 1.6 mA VDDIO − 0.2 V 0.4 V DYNAMIC CONVERTER CHARACTERISTICS (4) ENOB SNR SINAD 2nd HD 3rd HD THD SFDR (1) (2) (3) (4) fIN = 11 MHz 9.4, 9.3 9.6 Bits fIN = 19 MHz 9.4, 9.3 9.6 Bits fIN = 11 MHz 58.7, 58.1 59.6 dB fIN = 19 MHz 58.6, 58 59.5 dB fIN = 11 MHz 58.6, 58 59.5 fIN = 19 MHz 58.5, 57.8 59.4 fIN = 11 MHz −75.9, −74.7 −89 dBc fIN = 19 MHz −74.4, −73 −86 dBc fIN = 11 MHz −69.5, −67.5 −78 dBc fIN = 19 MHz −68.8, −66.7 −77 dBc fIN = 11 MHz −69.5, −67.5 −78 dB f.IN = 19 MHz −68.8, −66.7 −77 dB fIN = 11 MHz −75.8, −74.5 −80 dBc fIN = 19 MHz −75.7, −74.3 −80 dBc Effective Number of Bits Signal-to-Noise Ratio Signal-to-Noise Ratio + Distortion 2nd Harmonic 3rd Harmonic Total Harmonic Distortion (First 6 Harmonics) Spurious Free Dynamic Range (Excluding 2nd and 3rd Harmonic) dB dB To ensure accuracy, it is required that |VDDA–VDDIO| ≤ 100 mV and separate bypass capacitors are used at each power supply pin. With the test condition for 2 VP-P differential input, the 10-bit LSB is 1.95 mV. Typical figures are at TA = TJ = 25°C and represent most likely parametric norms. Test limits are ensured to TI's AOQL (Average Outgoing Quality Level). Optimum dynamic performance will be obtained by keeping the reference input in the +1.2V. Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 7 ADC10040 SNAS224M – JULY 2003 – REVISED APRIL 2013 www.ti.com AC Electrical Characteristics Unless otherwise specified, the following specifications apply for VSSA = VSSIO = 0V, VDDA = +3.0V, VDDIO = +2.5V, VIN = 2 VP-P (full scale), STBY = 0V, External VREF = 1.20V, fCLK = 40 MHz, 50% Duty Cycle, CL = 10 pF/pin. Boldface limits apply for TA = TMIN to TMAX: all other limits TA = 25°C (1) (2) (3) Symbol Parameter Conditions Min (3) Typ (3) Max (3) Units 40 MHz (min) CLK, DF, STBY, SENSE fCLK1 Maximum Clock Frequency fCLK2 Minimum Clock Frequency 20 MHz tCH Clock High Time 12.5 ns tCL Clock Low Time 12.5 ns tCONV Conversion Latency tOD Data Output Delay after a Rising Clock Edge tAD Aperture Delay tAJ Aperture Jitter Over Range Recovery Time tSTBY (1) (2) (3) 8 T = 25°C 2 3.3 1 Differential VIN step from ±3V to 0V to get accurate conversion Standby Mode Exit Cycle 6 Cycles 5 ns 6 ns 1 ns 2 ps (RMS) 1 Clock Cycle 20 Cycles With the test condition for 2 VP-P differential input, the 10-bit LSB is 1.95 mV. Typical figures are at TA = TJ = 25°C and represent most likely parametric norms. Test limits are ensured to TI's AOQL (Average Outgoing Quality Level). Timing specifications are tested at TTL logic levels, VIL = 0.4V for a falling edge, and VIH = 2.4V for a rising edge. Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 ADC10040 www.ti.com SNAS224M – JULY 2003 – REVISED APRIL 2013 Specification Definitions APERTURE DELAY is the time after the rising edge of the clock to when the input signal is acquired or held for conversion. APERTURE JITTER (APERTURE UNCERTAINTY) is the variation in aperture delay from sample to sample. Aperture jitter manifests itself as noise in the output. COMMON MODE VOLTAGE (VCM) is the d.c. potential present at both signal inputs to the ADC. CONVERSION LATENCY See PIPELINE DELAY. DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1 LSB. DUTY CYCLE is the ratio of the time that a repetitive digital waveform is high to the total time of one period. The specification here refers to the ADC clock input signal. EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise and Distortion or SINAD. ENOB is defined as (SINAD - 1.76) / 6.02 and states that the converter is equivalent to a perfect ADC of this (ENOB) number of bits. FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental drops 3 dB below its low frequency value for a full scale input. GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated as: Gain Error = Pos. Full-Scale Error − Neg. Full-Scale Error (1) INTEGRAL NON LINEARITY (INL) is a measure of the deviation of each individual code from a line drawn from negative full scale through positive full scale. The deviation of any given code from this straight line is measured from the center of that code value. MISSING CODES are those output codes that will never appear at the ADC outputs. The ADC10040 is ensured not to have any missing codes. NEGATIVE FULL SCALE ERROR is the difference between the input voltage (VIN+ − VIN−) just causing a transition from negative full scale to the first code and its ideal value of 0.5 LSB. OFFSET ERROR is the input voltage that will cause a transition from a code of 01 1111 1111 to a code of 10 0000 0000. OUTPUT DELAY is the time delay after the rising edge of the clock before the data update is presented at the output pins. PIPELINE DELAY (LATENCY) is the number of clock cycles between initiation of conversion and when that data is presented to the output driver stage. Data for any given sample is available at the output pins the Pipeline Delay plus the Output Delay after the sample is taken. New data is available at every clock cycle, but the data lags the conversion by the pipeline delay. POSITIVE FULL SCALE ERROR is the difference between the actual last code transition and its ideal value of 1½ LSB below positive full scale. SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal to the rms value of the sum of all other spectral components below one-half the sampling frequency, not including harmonics or DC. SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of the input signal to the rms value of all of the other spectral components below half the clock frequency, including harmonics but excluding d.c. SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the input signal and the peak spurious signal, where a spurious signal is any signal present in the output spectrum that is not present at the input. Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 9 ADC10040 SNAS224M – JULY 2003 – REVISED APRIL 2013 www.ti.com TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dBc, of the rms total of the first six harmonic levels at the output to the level of the fundamental at the output. THD is calculated as: (2) where f1 is the RMS power of the fundamental (output) frequency and f2 through f6 are the RMS power in the first 6 harmonic frequencies. SECOND HARMONIC DISTORTION (2ND HARM) is the difference expressed in dB, between the RMS power in the input frequency at the output and the power in its 2nd harmonic level at the output. THIRD HARMONIC DISTORTION (3RD HARM) is the difference, expressed in dB, between the RMS power in the input frequency at the output and the power in its 3rd harmonic level at the output. Timing Diagram Figure 2. Clock and Data Timing Diagram Transfer Characteristics Figure 3. Input vs. Output Transfer Characteristic 10 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 ADC10040 www.ti.com SNAS224M – JULY 2003 – REVISED APRIL 2013 Typical Performance Characteristics Unless otherwise specified, the following specifications apply: VSSA = VSSIO = 0V, VDDA = +3.0V, VDDIO = +2.5V, VIN = 2 VP-P, STBY = 0V, External VREF = 1.2V, fCLK = 40 MHz, fIN = 19 MHz, 50% Duty Cycle. Figure 4. DNL Figure 5. DNL vs. fCLK Figure 6. DNL vs. Clock Duty Cycle (DC input) Figure 7. DNL vs. Temperature Figure 8. INL Figure 9. INL vs. fCLK Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 11 ADC10040 SNAS224M – JULY 2003 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following specifications apply: VSSA = VSSIO = 0V, VDDA = +3.0V, VDDIO = +2.5V, VIN = 2 VP-P, STBY = 0V, External VREF = 1.2V, fCLK = 40 MHz, fIN = 19 MHz, 50% Duty Cycle. 12 Figure 10. INL vs. Clock Duty Cycle Figure 11. SNR vs. VDDIO Figure 12. SNR vs. VDDA Figure 13. SNR vs. fCLK Figure 14. INL vs. Temperature Figure 15. SNR vs. Clock Duty Cycle Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 ADC10040 www.ti.com SNAS224M – JULY 2003 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following specifications apply: VSSA = VSSIO = 0V, VDDA = +3.0V, VDDIO = +2.5V, VIN = 2 VP-P, STBY = 0V, External VREF = 1.2V, fCLK = 40 MHz, fIN = 19 MHz, 50% Duty Cycle. Figure 16. SNR vs. Temperature Figure 17. THD vs. VDDA Figure 18. THD vs. VDDIO Figure 19. THD vs. fCLK Figure 20. SNR vs. IRS Figure 21. THD vs. IRS Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 13 ADC10040 SNAS224M – JULY 2003 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following specifications apply: VSSA = VSSIO = 0V, VDDA = +3.0V, VDDIO = +2.5V, VIN = 2 VP-P, STBY = 0V, External VREF = 1.2V, fCLK = 40 MHz, fIN = 19 MHz, 50% Duty Cycle. 14 Figure 22. SINAD vs. VDDA Figure 23. SINAD vs. VDDIO Figure 24. THD vs. Clock Duty Cycle Figure 25. SINAD vs. Clock Duty Cycle Figure 26. THD vs. Temperature Figure 27. SINAD vs. Temperature Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 ADC10040 www.ti.com SNAS224M – JULY 2003 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Unless otherwise specified, the following specifications apply: VSSA = VSSIO = 0V, VDDA = +3.0V, VDDIO = +2.5V, VIN = 2 VP-P, STBY = 0V, External VREF = 1.2V, fCLK = 40 MHz, fIN = 19 MHz, 50% Duty Cycle. Figure 28. SINAD vs. fCLK Figure 29. SFDR vs. VDDIO Figure 30. SINAD vs. IRS Figure 31. SFDR vs. fCLK Figure 32. SFDR vs. VDDA Figure 33. SFDR vs. IRS Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 15 ADC10040 SNAS224M – JULY 2003 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Unless otherwise specified, the following specifications apply: VSSA = VSSIO = 0V, VDDA = +3.0V, VDDIO = +2.5V, VIN = 2 VP-P, STBY = 0V, External VREF = 1.2V, fCLK = 40 MHz, fIN = 19 MHz, 50% Duty Cycle. 16 Figure 34. SFDR vs. Clock Duty Cycle Figure 35. Spectral Response @ 11 MHz Input Figure 36. SFDR vs. Temperature Figure 37. Spectral Response @ 19 MHz Input Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 ADC10040 www.ti.com SNAS224M – JULY 2003 – REVISED APRIL 2013 FUNCTIONAL DESCRIPTION The ADC10040 uses a pipeline architecture and has error correction circuitry to help ensure maximum performance. Differential analog input signals are digitized to 10 bits. In differential mode , each analog input signal should have a peak-to-peak voltage equal to 1.0V, 0.75V or 0.5V, depending on the state of the IRS pin (pin 5), and be centered around VCM and be 180° out of phase with each other. If single ended operation is desired, VIN- may be tied to the VCOM pin (pin 4). A single ended input signal may then be applied to VIN+, and should have an average value in the range of VCM. The signal amplitude should be 2.0V, 1.5V or 1.0V peak-topeak, depending on the state or the IRS pin (pin 5). APPLICATIONS INFORMATION ANALOG INPUTS The ADC10040 has two analog signal inputs, VIN+ and VIN−. These two pins form a differential input pair. There is one common mode pin VCOM that may be used to set the common mode input voltage. REFERENCE PINS The ADC10040 is designed to operate with an internal or external 1.2V reference. The internal 1.2V reference is the defualt condition. If an external voltage is applied to the VREF pin, then that voltage is used for the reference. The VREF pin should be bypassed to ground with a 0.1 µF capacitor placed close to the pin. Do not load this pin when using the internal reference. The voltages at VCOM, VREFT, and VREFB are derived from the reference voltage. These pins are made available for bypass purposes only. These pins should each be bypassed to ground with a 0.1 µF capacitor placed close to the pin. It is very important that all grounds associated with the reference voltage and the input signal make connection to the analog ground plane at a single point to minimize the effects of noise currents in the ground path. DO NOT LOAD these pins. VCOM PIN This pin supplies a voltage for possible use to set the common mode input voltage. This pin may also be connected to VIN-, so that VIN+ may be used as a single ended input. These pins should be bypassed with at least a 0.1uF capacitor. Do not load this pin. SIGNAL INPUTS The signal inputs are VIN+ and VIN−. The input signal amplitude is defined as VIN+ − VIN− and is represented schematically in Figure 38: 2.5V Max VCM + 0.5V VCM VCM - 0.5V 0V Min Figure 38. Input Voltage Waveforms for a 2VP-P differential Input Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 17 ADC10040 SNAS224M – JULY 2003 – REVISED APRIL 2013 www.ti.com 2.5V Max VCM + 1V VCM VCM - 1V 0V Min Figure 39. Input Voltage Waveform for a 2VP-P Single Ended Input A single ended input signal is shown in Figure 39. The internal switching action at the analog inputs causes energy to be output from the input pins. As the driving source tries to compensate for this, it adds noise to the signal. To minimize the effects of this, use 18Ω series resistors at each of the signal inputs with a 25 pF capacitor across the inputs, as shown in Figure 40. These components should be placed close to the ADC because the input pins of the ADC is the most sensitive part of the system and this is the last opportunity to filter the input. The two 16Ω resistors and the 24 pF capacitor, together with the 4 pF ADC input capacitance, form a low-pass filter with a -3 dB frequency of 177 MHz. CLK PIN The CLK signal controls the timing of the sampling process. Drive the clock input with a stable, low jitter clock signal in the frequency range indicated in the AC Electrical Characteristics Table with rise and fall times of less than 2 ns. The trace carrying the clock signal should be as short as possible and should not cross any other signal line, analog or digital, not even at 90°. The CLK signal also drives an internal state machine. If the CLK is interrupted, or its frequency is too low, the charge on internal capacitors can dissipate to the point where the accuracy of the output data will degrade. This is what limits the lowest sample rate. The duty cycle of the clock signal can affect the performance of any A/D Converter. Because achieving a precise duty cycle is difficult, the ADC10040 is designed to maintain performance over a range of duty cycles. While it is specified and performance is ensured with a 50% clock duty cycle, performance is typically maintained with minimum clock low and high times indicated in the AC Electrical Characteristics Table. Both minimum high and low times may not be held simultaneously. STBY PIN The STBY pin, when high, holds the ADC10040 in a power-down mode to conserve power when the converter is not being used. The power consumption in this state is 13.5 mW. The output data pins are undefined in this mode. Power consumption during power-down is not affected by the clock frequency, or by whether there is a clock signal present. The data in the pipeline is corrupted while in the power down. DF PIN The DF (Data Format) pin, when high, forces the ADC10040 to output the 2’s complement data format. When DF is tied low, the output format is offset binary. IRS PIN The IRS (Input Range Select) pin defines the input signal amplitude that will produce a full scale output. The table below describes the function of the IRS pin. Table 1. IRS Pin Functions 18 IRS Pin Full-Scale Input VDDA 2.0VP-P VSSA 1.5VP-P Floating 1.0VP-P Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 ADC10040 www.ti.com SNAS224M – JULY 2003 – REVISED APRIL 2013 OUTPUT PINS The ADC10040 has 10 TTL/CMOS compatible Data Output pins. The offset binary data is present at these outputs while the DF and STBY pins are low. Be very careful when driving a high capacitance bus. The more capacitance the output drivers must charge for each conversion, the more instantaneous digital current flows through VDDIO and VSSIO. These large charging current spikes can cause on-chip noise and couple into the analog circuitry, degrading dynamic performance. Adequate bypassing, limiting output capacitance and careful attention to the ground plane will reduce this problem. Additionally, bus capacitance beyond the specified 10 pF/pin will cause tOD to increase, making it difficult to properly latch the ADC output data. The result could be an apparent reduction in dynamic performance. To minimize noise due to output switching, minimize the load currents at the digital outputs. This can be done by minimizing load capacitance and by connecting buffers between the ADC outputs and any other circuitry, which will isolate the outputs from trace and other circuit capacitances and limit the output currents, which could otherwise result in performance degradation. Only one driven input should be connected to the ADC output pins. While the tOD time provides information about output timing, a simple way to capture a valid output is to latch the data on the rising edge of the conversion clock. APPLICATION SCHEMATICS The following figures show simple examples of using the ADC10040. The ADC10040 performs best with a differential input signal. Narrow Band A.C. Signals Figure 40 shows a typical circuit for an AC coupled, differentially driven input. The 16Ω resistors and 24 pF capacitor, together with the 4 pF input capacitance of the ADC10040, provides a −3dB input bandwidth of 177 MHz, while the 0.1µF capacitor at VCOM stabilizes the common move voltage at the transformer center tap. VDDIO 1 7 VCC VCC 18 VCC 31 VCC 42 4 OE 3 OE 25 2 OE 48 1 OE 24 26 4A3 29 4A2 30 4A1 VDDIO AIN 12 4 VDDA 22 10 D1 D2 D3 VIN- VCOM 24 pF 13 D0 VIN+ 16: D4 D5 D6 D7 D8 D9 0.1 PF VSSA 14 VSSA 24 23 20 19 18 17 16 15 28 3A4 3A3 35 3A2 36 3A1 33 37 2A4 38 2A3 40 2A2 41 2A1 43 1A4 44 1A3 46 1A2 47 1A1 3Y4 17 3Y3 16 14 3Y2 13 3Y1 D0 CLKOUT D1 12 2Y4 11 2Y3 9 2Y2 8 2Y1 D2 6 1Y4 5 1Y3 1Y2 3 2 1Y1 D6 D7 D3 D4 D5 D8 D9 21 3 0.1 PF 11 0.1 PF VSSA VREF VREFT 8 VREFB 7 26 25 VSSIO DF STBY 6 27 CLKIN 4Y4 23 4Y3 22 4Y2 20 19 4Y1 4 GND 10 GND 15 GND 21 GND 28 GND 34 GND 39 GND 45 GND 16: 4.7 PF IRS CLK 32 0.1 PF ADC10040 1 CLKIN VDDA VDDA 5 9 0.1 PF 4.7 PF VDDA 2 VDDA 74ACTQ16244 27 0.1 PF Figure 40. A Simple Application Using a Differential Signal Source Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 19 ADC10040 SNAS224M – JULY 2003 – REVISED APRIL 2013 www.ti.com D.C. Applications For very low frequency and DC input applications, a d.c. coupled amplifier or buffer may be needed, especially when the input is single-ended and the advantages of a differential input signal is desired. Figure 41 shows the input drive circuit that can be used to replace the transformer of Figure 40. The LMH6550 provides excellent performance and is well-suited for this application. The common mode output voltage of the LMH6550 is the same as its VCM input. RF RT RG 16: VCM LMH6550 ADC Input 24 pF + RT RG 50: 16: 50: From ADC RF VCOM Figure 41. Using the LMH6550 for DC and wideband applications Single Ended Applications Performance of the ADC10040 with a single-ended input is not as good as its performance with a differential input. However, if the lower performance is adequate, the circuit of Figure 42 shows an acceptable method of driving the analog input. VDDIO 1 7 VCC VCC 18 VCC 31 VCC 42 4 OE 3 OE 25 2 OE 48 1 OE 24 26 4A3 29 4A2 30 4A1 VDDIO CLK VIN- AIN 13 VCOM VIN+ 51 pF D4 D5 D6 D7 D8 D9 DF STBY VSSA 14 3 0.1 PF VSSA 0.1 PF 11 V 7 REF VREFT 8 VREFB VSSA 6 27 26 25 24 23 20 19 18 17 16 15 28 3A4 3A3 35 3A2 36 3A1 33 37 2A4 38 2A3 40 2A2 41 2A1 43 1A4 44 1A3 46 1A2 47 1A1 3Y4 17 3Y3 16 14 3Y2 13 3Y1 D0 CLKOUT D1 12 2Y4 11 2Y3 9 2Y2 8 2Y1 D2 6 1Y4 5 1Y3 1Y2 3 2 1Y1 D6 D7 D3 D4 D5 D8 D9 4 GND 10 GND 15 GND 21 GND 28 GND 34 GND 39 GND 45 GND 16: VDDA 22 10 D1 D2 D3 IRS 0.1 PF 4 D0 CLKIN VSSIO 12 4.7 PF 4Y4 23 4Y3 22 4Y2 20 19 4Y1 21 1 CLKIN 32 0.1 PF ADC10040 5 VDDA VDDA 9 0.1 PF 4.7 PF VDDA 2 VDDA 74ACTQ16244 27 0.1 PF Figure 42. A Simple Application Using a Single Ended Signal Source 20 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 ADC10040 www.ti.com SNAS224M – JULY 2003 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision L (April 2013) to Revision M • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 20 Submit Documentation Feedback Copyright © 2003–2013, Texas Instruments Incorporated Product Folder Links: ADC10040 21 PACKAGE OPTION ADDENDUM www.ti.com 13-Sep-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) ADC10040CIMT/NOPB ACTIVE TSSOP PW 28 48 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 ADC10040 CIMT ADC10040CIMTX/NOPB ACTIVE TSSOP PW 28 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 ADC10040 CIMT ADC10040QCIMT/NOPB ACTIVE TSSOP PW 28 48 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 ADC10040 QCIMT ADC10040QCIMTX/NOPB ACTIVE TSSOP PW 28 2500 Green (RoHS & no Sb/Br) CU SN Level-3-260C-168 HR -40 to 85 ADC10040 QCIMT (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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OTHER QUALIFIED VERSIONS OF ADC10040, ADC10040-Q1 : • Catalog: ADC10040 • Automotive: ADC10040-Q1 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device ADC10040CIMTX/NOPB Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TSSOP PW 28 2500 330.0 16.4 6.8 10.2 1.6 8.0 16.0 Q1 ADC10040QCIMTX/NOPB TSSOP PW 28 2500 330.0 16.4 6.8 10.2 1.6 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADC10040CIMTX/NOPB TSSOP PW 28 2500 367.0 367.0 38.0 ADC10040QCIMTX/NOPB TSSOP PW 28 2500 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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