A62S7308B Series
Preliminary
128K X 8 BIT LOW VOLTAGE CMOS SRAM
Document Title
128K X 8 BIT LOW VOLTAGE CMOS SRAM
Revision History
Rev. No.
History
Issue Date
Remark
0.0
Initial issue
September 5, 2000
Preliminary
0.1
Change max. power supply voltage from 3.3V to 3.6V
October 12, 2000
Change min. VIH from 2.2V to 2.4V
Add feature “Interfaces directly with 3.3V typ. logic chip”
Remove A62S7308B-10S/SI part
0.2
Add A62S7308B-55S/SI part
March 9, 2001
Change Input Pulse Levels from 0.4V~2.4V to 0V~3.0V in AC Test
Conditions table
PRELIMINARY
(March, 2001, Version 0.2)
AMIC Technology, Inc.
A62S7308B Series
Preliminary
128K X 8 BIT LOW VOLTAGE CMOS SRAM
Features
n
n
n
n
n Power supply range: 2.7V to 3.6V
n Access times: 55ns (max.): for VCC = 3.0V to 3.6V
70ns (max.): for VCC = 2.7V to 3.6V
n Current:
A62S7308B-S series: Operating: 30mA (max.)
Standby: 5µA (max.)
A62S7308B-SI series: Operating: 30mA (max.)
Standby: 10µA (max.)
n Extended operating temperature range: -25°C to 85°C
for -SI series
Full static operation, no clock or refreshing required
All inputs and outputs are directly TTL compatible
Common I/O using three-state output
Output enable and two chip enable inputs for easy
application
n Data retention voltage: 2V (min.)
n Available in 32-pin SOP, TSOP, sTSOP (8X
13.4mm) forward type and 36-ball Mini BGA (6X8)
packages
n Interfaces directly with 3.3V typ. logic chip
General Description
The A62S7308B is a low operating current 1048,576-bit
static random access memory organized as 131,072
words by 8 bits and operates on a low power supply
voltage from 2.7V to 3.6V.
Inputs and three-state outputs are TTL compatible and
allow for direct interfacing with common system bus
structures.
Two chip enable inputs are provided for power down and
a device enable and an output enable input are included
for easy interfacing.
Data retention is guaranteed at a power supply voltage
as low as 2V.
Pin Configurations
1
32
VCC
2
31
A15
A14
3
30
CE2
A12
4
29
WE
A7
5
28
A13
A6
6
27
A8
A5
7
26
A9
A4
8
25
A11
24
OE
23
A10
A62S7308BM
NC
A16
A3
9
A2
10
A1
11
22
CE1
A0
12
21
I/O7
I/O 0
13
20
I/O6
I/O 1
14
19
I/O5
I/O 2
15
18
I/O4
GND
16
17
I/O3
PRELIMINARY
A11
A9
A8
A13
WE
CE2
A15
VCC
NC
A16
A14
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
(March, 2001, Version 0.2)
n Mini BGA (6X8) Top View
~
n TSOP/(sTSOP)
(forward type)
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A62S7308BV
(A62S7308BX)
~
~
n SOP
1
OE
A10
CE1
I/O7
I/O 6
I/O 5
I/O4
I/O 3
GND
I/O2
I/O1
I/O0
A0
A1
A2
A3
1
2
3
4
5
6
A
A0
A1
CE2
A3
A6
A8
B
I/O4
A2
WE
A4
A7
I/O0
C
I/O5
NC
A5
D
VSS
VCC
E
VCC
VSS
F
I/O6
G
I/O7
H
A9
I/O1
NC
NC
I/O2
OE
CE1
A16
A15
I/O3
A10
A11
A12
A13
A14
AMIC Technology, Inc.
A62S7308B Series
Block Diagram
A0
VCC
GND
A14
ROW
512 X 2048
DECODER
MEMORY ARRAY
INPUT DATA
CIRCUIT
COLUMN I/O
A15
A16
I/O0
I/O7
CE2
CE1
CONTROL
CIRCUIT
OE
WE
Pin Descriptions - SOP
Pin Description - TSOP/sTSOP
Pin No.
Symbol
1
NC
No Connection
2 - 12, 23,
25 - 28, 31
A0 - A16
13 - 15,
17 - 21
I/O0 - I/O7
16
GND
Ground
22
CE1
Chip Enable 1
24
OE
Output Enable
29
WE
Write Enable
30
CE2
Chip Enable 2
32
VCC
Power Supply
PRELIMINARY
Description
Pin No.
Symbol
1 - 4, 7,
10 - 20, 31
A0 - A16
Address Inputs
5
WE
Write Enable
Data Inputs/Outputs
6
CE2
Chip Enable 2
8
VCC
Power Supply
9
NC
No Connection
21 - 23,
25 - 29
I/O0 - I/O7
24
GND
Ground
30
CE1
Chip Enable 1
32
OE
Output Enable
(March, 2001, Version 0.2)
2
Description
Address Inputs
Data Inputs/Outputs
AMIC Technology, Inc.
A62S7308B Series
Recommended DC Operating Conditions
(TA = 0°C to + 70°C or -25°C to 85°C)
Symbol
Parameter
VCC
Supply Voltage
GND
Ground
Min.
Typ.
Max.
Unit
2.7
3.0
3.6
V
0
0
0
V
VIH
Input High Voltage
2.4
-
VCC + 0.3
V
VIL
Input Low Voltage
-0.3
-
+0.6
V
CL
Output Load
-
-
30
pF
TTL
Output Load
-
-
1
-
Absolute Maximum Ratings*
*Comments
VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to + 4.6V
IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V
Operating Temperature, Topr . . . . . . . . -25°C to + 85°C
Storage Temperature, Tstg . .. . . . . . . . -55°C to + 125°C
Power Dissipation, PT . . . . . . . . . . . . . . . . . . . . . . 0.7W
Soldering Temp. & Time . . . . . . . . . . . . . 260°C, 10 sec
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to this device.
These are stress ratings only. Functional operation of
this device at these or any other conditions above those
indicated in the operational sections of this specification
is not implied or intended. Exposure to the absolute
maximum rating conditions for extended periods may
affect device reliability.
DC Electrical Characteristics
Symbol
Parameter
(TA = 0°C to + 70°C or -25°C to 85°C, VCC = 2.7V to 3.6V, GND = 0V)
A62S7308B-55S/70S
A62S7308B-55SI/70SI
Min.
Max.
Min.
Max.
Unit
Conditions
ILI
Input Leakage
Current
-
1
-
1
µA
VIN = GND to VCC
ILO
Output Leakage
Current
-
1
-
1
µA
CE1 = VIH or CE2 = VIL or
OE = VIH or WE = VIL
VI/O = GND to VCC
ICC
Active Power Supply
Current
-
3
-
3
mA
CE1 = VIL, CE2 = VIH
II/O = 0mA
ICC1
Dynamic Operating
Current
-
30
-
30
mA
Min. Cycle, Duty = 100%
CE1 = VIL, CE2 = VIH
II/O = 0mA
ICC2
Dynamic Operating
Current
-
3
-
3
mA
CE1 = VIL, CE2 = VIH
VIH = VCC , VIL = 0V
F = 1MHz, II/O = 0mA
PRELIMINARY
(March, 2001, Version 0.2)
3
AMIC Technology, Inc.
A62S7308B Series
DC Electrical Characteristics (continued)
Symbol
A62S7308B-55S/70S
Parameter
A62S7308B-55SI/70SI
Min.
Max.
Min.
Max.
-
0.3
-
0.3
ISB
Standby Power
Supply Current
ISB1
Unit
Conditions
mA
CE1 = VIH or
CE2 = VIL
-
5
-
10
µA
CE2 ≤ 0.2V,
or CE1 ≥ VCC - 0.2V
CE2 ≥ VCC - 0.2V
{
VOL
Output Low Voltage
-
0.4
-
0.4
V
IOL = 2.1mA
VOH
Output High Voltage
2.4
-
2.4
-
V
IOH = -1.0mA
Truth Table
Mode
CE1
CE2
OE
WE
I/O Operation
H
X
X
X
High Z
ISB, ISB1
X
L
X
X
High Z
ISB, ISB1
Output Disable
L
H
H
H
High Z
ICC, ICC1, ICC2
Read
L
H
L
H
DOUT
ICC, ICC1, ICC2
Write
L
H
X
L
DIN
ICC, ICC1, ICC2
Standby
Supply Current
Note: X = H or L
Capacitance (TA = 25°C, f = 1.0MHz)
Symbol
Parameter
Min.
Max.
Unit
Conditions
CIN*
Input Capacitance
6
pF
VIN = 0V
CI/O*
Input/Output Capacitance
8
pF
VI/O = 0V
* These parameters are sampled and not 100% tested.
PRELIMINARY
(March, 2001, Version 0.2)
4
AMIC Technology, Inc.
A62S7308B Series
AC Characteristics (TA = 0°C to + 70°C or -25°C to 85°C)
Symbol
Parameter
A62S7308B-55S/SI
A62S7308B-70S/SI
(VCC = 3.0V to 3.6V)
(VCC = 2.7V to 3.6V)
Unit
Min.
Max.
Min.
Max.
55
-
70
-
ns
-
55
-
70
ns
CE1
-
55
-
70
ns
CE2
-
55
-
70
ns
-
30
-
35
ns
CE1
10
-
10
-
ns
CE2
10
-
10
-
ns
10
-
5
-
ns
CE1
0
20
0
25
ns
CE2
0
20
0
25
ns
Read Cycle
tRC
Read Cycle Time
tAA
Address Access Time
tACE1
Chip Enable Access Time
tACE2
tOE
Output Enable to Output Valid
tCLZ1
Chip Enable to Output in Low Z
tCLZ2
tOLZ
Output Enable to Output in Low Z
tCHZ1
Chip Disable to Output in High Z
tCHZ2
tOHZ
Output Disable to Output in High Z
0
20
0
25
ns
tOH
Output Hold from Address Change
5
-
10
-
ns
tWC
Write Cycle Time
55
-
70
-
ns
tCW
Chip Enable to End of Write
50
-
60
-
ns
tAS
Address Setup Time
0
-
0
-
ns
tAW
Address Valid to End of Write
50
-
60
-
ns
tWP
Write Pulse Width
40
-
50
-
ns
tWR
Write Recovery Time
0
-
0
-
ns
tWHZ
Write to Output in High Z
0
25
0
30
ns
tDW
Data to Write Time Overlap
25
-
30
-
ns
tDH
Data Hold from Write Time
0
-
0
-
ns
tOW
Output Active from End of Write
5
-
5
-
ns
Write Cycle
Notes:
tCHZ1, tCHZ2, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are
not referred to output voltage levels.
PRELIMINARY
(March, 2001, Version 0.2)
5
AMIC Technology, Inc.
A62S7308B Series
Timing Waveforms
Read Cycle 1(1)
tRC
Address
tAA
OE
tOE
tOH
tOLZ5
CE1
tACE1
tCHZ1 5
tCLZ1 5
CE2
tACE2
tOHZ5
tCHZ2 5
tCLZ2 5
DOUT
Read Cycle 2 (1, 2, 4)
tRC
Address
tAA
tOH
tOH
DOUT
PRELIMINARY
(March, 2001, Version 0.2)
6
AMIC Technology, Inc.
A62S7308B Series
Timing Waveforms (continued)
Read Cycle 3 (1, 3, 4, 6)
CE1
tACE1
tCLZ15
tCHZ15
DOUT
Read Cycle 4 (1, 4, 7, 8)
CE2
tACE2
tCHZ25
tCLZ25
DOUT
Notes: 1.
2.
3.
4.
5.
6.
7.
8.
WE is high for Read Cycle.
Device is continuously enabled CE1 = VIL and CE2 = VIH.
Address valid prior to or coincident with CE1 transition low.
OE = VIL.
Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
CE2 is high.
CE1 is low.
Address valid prior to or coincident with CE2 transition high.
PRELIMINARY
(March, 2001, Version 0.2)
7
AMIC Technology, Inc.
A62S7308B Series
Timing Waveforms (continued)
Write Cycle 1(6)
(Write Enable Controlled)
tWC
Address
tAW
tWR3
tCW5
CE1
(4)
CE2
(4)
tAS1
tWP2
WE
tDW
tDH
DIN
tWHZ
tOW
DOUT
PRELIMINARY
(March, 2001, Version 0.2)
8
AMIC Technology, Inc.
A62S7308B Series
Timing Waveforms (continued)
Write Cycle 2(6)
(Chip Enable Controlled)
tWC
Address
tWR3
tAW
tCW5
CE1
tAS1
CE2
(4)
(4)
tCW5
tWP2
WE
tDW
tDH
DIN
tWHZ7
DOUT
Notes: 1.
2.
3.
4.
tAS is measured from the address valid to the beginning of Write.
A Write occurs during the overlap (tWP) of a low CE1 , a high CE2 and a low WE .
tWR is measured from the earliest of CE1 or WE going high or CE2 going low to the end of the Write cycle.
If the CE1 low transition or the CE2 high transition occurs simultaneously with the WE low transition or after
the WE transition, outputs remain in a high impedance state.
5. tCW is measured from the later of CE1 going low or CE2 going high to the end of Write.
6. OE is continuously low. ( OE = VIL)
7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested.
PRELIMINARY
(March, 2001, Version 0.2)
9
AMIC Technology, Inc.
A62S7308B Series
AC Test Conditions
Input Pulse Levels
0V to 3V
Input Rise and Fall Time
5 ns
Input and Output Timing Reference Levels
1.5V
Output Load
See Figures 1 and 2
TTL
TTL
CL
CL
30pF
5pF
* Including scope and jig.
* Including scope and jig.
Figure 1. Output Load
Data Retention Characteristics
Symbol
Figure 2. Output Load for tCLZ1,
tCLZ2, tOHZ, tOLZ, tCHZ1,
tCHZ2, tWHZ, and tOW
(TA = 0°C to + 70°C or -25°C to 85°C)
Parameter
VDR
VCC for Data Retention
ICCDR
Data Retention Current
S-Version
SI-Version
tCDR
Chip Disable to Data Retention Time
tR
Operation Recovery Time
Min.
Max.
Unit
2.0
3.6
V
CE2 ≤ 0.2V,
or CE1 ≥ VCC - 0.2V,
CE2 ≥ VCC - 0.2V
-
2*
µA
VCC = 2.0V, CE2 ≤ 0.2V,
or CE1 ≥ VCC - 0.2V
CE2 ≥ VCC - 0.2V
-
5**
0
-
ns
tRC
-
ns
Conditions
{
{
See Retention Waveform
* A62S7308B-55S/70S ICCDR: Max. 1µA at TA = 0°C to + 40°C
** A62S7308B-55SI/70SI ICCDR: Max. 1µA at TA = 0°C to + 40°C
PRELIMINARY
(March, 2001, Version 0.2)
10
AMIC Technology, Inc.
A62S7308B Series
Low VCC Data Retention Waveform (1) ( CE1 Controlled)
DATA RETENTION MODE
VCC
2.7V
tCDR
CE1
2.7V
tR
VDR ≥ 2V
VIH
VIH
CE1 ≥ VDR - 0.2V
Low VCC Data Retention Waveform (2) (CE2 Controlled)
DATA RETENTION MODE
VCC
2.7V
tCDR
CE2
2.7V
tR
VDR ≥ 2V
VIL
VIL
CE2 ≤ 0.2V
PRELIMINARY
(March, 2001, Version 0.2)
11
AMIC Technology, Inc.
A62S7308B Series
Ordering Information
Part No.
Access Time
(ns)
Operating Current
Max. (mA)
Standby Current
Max. (µ
µA)
Package
A62S7308BM-55S
5
32L SOP
A62S7308BM-55SI
10
32L SOP
A62S7308BV-55S
5
32L TSOP
10
32L TSOP
A62S7308BX-55S
5
32L sTSOP
A62S7308BX-55SI
10
32L sTSOP
A62S7308BG-55S
5
36B Mini BGA
A62S7308BG-55SI
10
36B Mini BGA
A62S7308BM-70S
5
32L SOP
A62S7308BM-70SI
10
32L SOP
A62S7308BV-70S
5
32L TSOP
10
32L TSOP
A62S7308BX-70S
5
32L sTSOP
A62S7308BX-70SI
10
32L sTSOP
A62S7308BG-70S
5
36B Mini BGA
A62S7308BG-70SI
10
36B Mini BGA
A62S7308BV-55SI
A62S7308BV-70SI
PRELIMINARY
55
70
(March, 2001, Version 0.2)
30
30
12
AMIC Technology, Inc.
A62S7308B Series
Package Information
SOP (W.B.) 32L Outline Dimensions
HE
17
E
32
unit: inches/mm
θ
L
1
b
16
Detail F
D
Seating Plane
LE
A1
e
S
A
A2
c
D
y
See Detail F
Dimensions in inches
Symbol
Dimensions in mm
Min
Nom
Max
Min
Nom
Max
A
-
-
0.118
-
-
3.00
A1
0.004
-
-
0.10
-
-
A2
0.101
0.106
0.111
2.57
2.69
2.82
b
0.014
0.016
0.020
0.36
0.41
0.51
c
0.006
0.008
0.012
0.15
0.20
0.31
D
-
0.805
0.817
-
20.45
20.75
E
0.440
0.445
0.450
11.18
11.30
11.43
e
0.044
0.050
0.056
1.12
1.27
1.42
HE
0.546
0.556
0.566
13.87
14.12
14.38
L
0.023
0.031
0.039
0.58
0.79
0.99
LE
0.047
0.055
0.063
1.19
1.40
1.60
S
-
-
0.036
-
-
0.91
y
-
-
0.004
-
-
0.10
θ
0°
-
10°
0°
-
10°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(March, 2001, Version 0.2)
13
AMIC Technology, Inc.
A62S7308B Series
Package Information
TSOP 32L TYPE I (8 X 20mm) Outline Dimensions
unit: inches/mm
A
A1
c
E
A2
e
D
θ
L
LE
HD
Detail "A"
D
Detail "A"
y
S
Dimensions in inches
Symbol
Min
Nom
Max
b
Dimensions in mm
Min
Nom
Max
1.20
A
-
-
0.047
-
-
A1
0.002
-
0.006
0.05
-
0.15
A2
0.037
0.039
0.041
0.95
1.00
1.05
b
0.007
0.009
0.011
0.18
0.22
0.27
c
0.004
-
0.008
0.11
-
0.20
D
0.720
0.724
0.728
18.30
18.40
18.50
E
-
0.315
0.319
-
8.00
8.10
e
0.020 BSC
0.50 BSC
HD
0.779
0.787
0.795
19.80
20.00
20.20
L
0.016
0.020
0.024
0.40
0.50
0.60
LE
-
0.032
-
-
0.80
-
S
-
-
0.020
-
-
0.50
y
-
-
0.003
-
-
0.08
θ
0°
-
5°
0°
-
5°
Notes:
1. The maximum value of dimension D includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(March, 2001, Version 0.2)
14
AMIC Technology, Inc.
A62S7308B Series
Package Information
sTSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions
A
A1
c
E
A2
e
unit: inches/mm
θ
L
LE
D1
D
Detail "A"
D
Detail "A"
0.076MM
S
b
SEATING PLANE
Dimensions in inches
Symbol
Min
Nom
A
-
A1
A2
Dimensions in mm
Max
Min
Nom
Max
-
0.049
-
-
1.25
0.002
-
-
0.05
-
-
0.037
0.039
0.041
0.95
1.00
1.05
b
0.007
0.008
0.009
0.17
0.20
0.23
c
0.0056
0.0059
0.0062
0.142
0.150
0.158
E
0.311
0.315
0.319
7.90
8.00
8.10
e
0.020 TYP
0.50 TYP
D
0.520
0.528
0.535
13.20
13.40
13.60
D1
0.461
0.465
0.469
11.70
11.80
11.90
L
0.012
0.020
0.028
0.30
0.50
0.70
LE
0.0275
0.0315
0.0355
0.700
0.800
0.900
S
θ
0.0109 TYP
0°
3°
0.278 TYP
5°
0°
3°
5°
Notes:
1. The maximum value of dimension D1 includes end flash.
2. Dimension E does not include resin fins.
3. Dimension S includes end flash.
PRELIMINARY
(March, 2001, Version 0.2)
15
AMIC Technology, Inc.
A62S7308B Series
Package Information
Mini BGA 6X8 (36 BALLS) Outline Dimensions
unit : millimeter(mm)
Bottom View
Top View
Pin A1 Index
Pin A1 Index
6 5 4
3 2 1
C
C1
A
B
C
D
A
E
F
G
H
A
B
Diameter D
Solder Ball
B1
D
E2
0.10
E1
E
PRELIMINARY
Symbol
Min
Typ
Max
A
-
0.75
-
B
5.90
6.00
6.10
B1
-
3.75
-
C
7.90
8.00
8.10
C1
-
5.25
-
D
0.30
0.35
0.40
E
1.00
1.10
1.20
E1
-
0.36
-
E2
-
0.22
-
(March, 2001, Version 0.2)
16
AMIC Technology, Inc.