ESD5V3U1U... Ultra-Low Capacitance TVS Diode • ESD / transient protection of high-speed data lines exceeding IEC61000-4-2 (ESD): ±20 kV (air / contact) IEC61000-4-4 (EFT): 2.5 kV / 50 A (5/50 ns) IEC61000-4-5 (surge): 3 A (8/20 µs) • Extremely small form factor down to 0.62 x 0.32 x 0.31 mm³ • Reverse working voltage: 5.3 V max. • Very low reverse current: < 10 nA typ. • Extremely low capacitance: 0.4 pF typ. • Very low clamping voltage: 12 V typ. at positive transients, 4 V typ. at negative transients • Very low series inductance down to 0.2 nH typ. • Pb-free (RoHS compliant) package Applications • USB 2.0, 10/100/1000 Ethernet, Firewire, DVI, HDMI, S-ATA • Mobile communication • Consumer products (STB, MP3, DVD, DSC...) • LCD displays, camera • Notebooks and desktop computers, peripherals ESD5V3U1U-02LS ESD5V3U1U-02LRH 2 1 Type ESD5V3U1U-02LRH ESD5V3U1U-02LS Package TSLP-2-7 TSSLP-2-1 Configuration 1 line, uni-directional 1 line, uni-directional 1 Marking E5 L 2010-03-12 ESD5V3U1U... Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Unit ESD (air / contact) discharge 1) VESD 20 kV Peak pulse current (tp = 8 / 20 µs)2) I pp 3 A Operating temperature range T op -55...125 °C Storage temperature T stg -65...150 Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Characteristics Reverse working voltage VRWM - - 5.3 Breakdown voltage V(BR) 6 - - IR - < 10 100 V I(BR) = 1 mA, from pin 1 to 2 Reverse current nA VR = 5.3 V, from pin 1 to 2 Clamping voltage V VCL IPP = 1 A, tp = 8/20 µs2) , from pin 1 to 2 - 10 13 IPP = 3 A, tp = 8/20 µs2) , from pin 1 to 2 - 12 15 IPP = 1 A, tp = 8/20 µs2) , from pin 2 to 1 - 2 4 IPP = 3 A, tp = 8/20 µs2) , from pin 2 to 1 - 4 6 - 0.4 0.6 Forward clamping voltage VFC Line capacitance3) CT pF VR = 0 V, f = 1 MHz Series inductance nH LS ESD5V3U1U-02LS - 0.2 - ESD5V3U1U-02LRH - 0.4 - 1V ESD according to IEC61000-4-2 2I pp according to IEC61000-4-5 3Total capacitance line to ground 2 2010-03-12 ESD5V3U1U... Clamping voltage, V cl = ƒ(Ipp) tp = 8 / 20 µs, from pin 1 to 2 Forward clamping voltage V FC = ƒ(IPP) tp = 8 / 20 µs, from pin 2 to 1 13 6 V V 11 V cl V FC 4 10 3 9 2 8 1 7 6 0 1 A 2 0 0 4 1 2 3 A Ipp 5 Ipp Reverse current IR = ƒ (TA) Line capacitance CT = ƒ (VR) VR = 5.3 V, from pin 1 to 2 f = 1 MHz, from pin 1 to 2 10 -6 0.6 A pF CT IR 10 -7 10 -8 0.4 0.3 10 -9 0.2 10 -10 0.1 10 -11 25 50 75 100 °C 0 0 150 TA 1 2 3 V 5 VR 3 2010-03-12 ESD5V3U1U... Line capacitance CT = ƒ (f) Line capacitance CT = ƒ(TA) VR = parameter, from pin 1 to 2 VR = 0 V, f = 1 MHz 0.7 0.6 pF 0.5 VR=0V 0.4 5.3 V CT CT pF 0.4 VR=5.3V 0V 0.3 0.3 0.2 0.2 0.1 0 0 0.1 500 1000 1500 2000 MHz 0 -50 3000 -25 0 25 50 °C 100 TA f 4 2010-03-12 ESD5V3U1U... Connector Application example ESD5V3U1U... 1-channel, uni-directional Protected line, signal level up to +VRWM (uni-directional) I/O 1 ESD sensitive device The protection diode should be placed very close to the location where the ESD or other transients can occur to keep loops and inductances as small as possible. Pin 2 should be connected directly to a ground plane on the board. 2 5 2010-03-12 TSLP-2-7 (mm) ESD5V3U1U... Package Outline Top view Bottom view 0.39 +0.01 -0.03 0.6 ±0.05 0.05 MAX. 1 1 0.25 ±0.035 1) 2 1±0.05 0.65 ±0.05 2 0.5 ±0.035 1) Cathode marking 1) Dimension applies to plated terminal Foot Print 0.45 Copper Solder mask 0.375 0.35 0.275 1 0.925 0.3 0.35 0.6 0.275 For board assembly information please refer to Infineon website "Packages" Stencil apertures Marking Layout (Example) BAR90-02LRH Type code Cathode marking Laser marking Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 mm = 50.000 Pieces/Reel (optional) 0.5 Cathode marking 8 1.16 4 0.76 6 2010-03-12 TSSLP-2-1 (mm) 7 ESD5V3U1U... 2010-03-12 ESD5V3U1U... Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ( <www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 8 2010-03-12