Intersil ISL6255AHRZ Highly integrated battery charger with automatic power source selector for notebook computer Datasheet

ISL6255, ISL6255A
®
Data Sheet
May 23, 2006
Highly Integrated Battery Charger with
Automatic Power Source Selector for
Notebook Computers
FN9203.2
Features
• ±0.5% Charge Voltage Accuracy (-10°C to 100°C)
The ISL6255, ISL6255A is a highly integrated battery charger
controller for Li-Ion/Li-Ion polymer batteries. High Efficiency is
achieved by a synchronous buck topology and the use of a
MOSFET, instead of a diode, for selecting power from the
adapter or battery. The low side MOSFET emulates a diode at
light loads to improve the light load efficiency and prevent
system bus boosting.
The constant output voltage can be selected for 2, 3 and 4
series Li-Ion cells with 0.5% accuracy over temperature. It can
also be programmed between 4.2V+5%/cell and 4.2V-5%/cell
to optimize battery capacity. When supplying the load and
battery charger simultaneously, the input current limit for the
AC adapter is programmable to within 3% accuracy to avoid
overloading the AC adapter, and to allow the system to make
efficient use of available adapter power for charging. It also
has a wide range of programmable charging current. The
ISL6255, ISL6255A provides outputs that are used to monitor
the current drawn from the AC adapter, and monitor for the
presence of an AC adapter. The ISL6255, ISL6255A
automatically transitions from regulating current mode to
regulating voltage mode.
ISL6255, ISL6255A has a feature for automatic power source
selection by switching to the battery when the AC adapter is
removed or switching to the AC adapter when the AC adapter
is available. It also provides a DC adapter monitor to support
aircraft power applications with the option of no battery
charging.
• ±3% Accurate Input Current Limit
• ±3% Accurate Battery Charge Current Limit
• ±25% Accurate Battery Trickle Charge Current Limit
(ISL6255A)
• Programmable Charge Current Limit, Adapter Current
Limit and Charge Voltage
• Fixed 300kHz PWM Synchronous Buck Controller with
Diode Emulation at Light Load
• Output for Current Drawn from AC Adapter
• AC Adapter Present Indicator
• Fast Input Current Limit Response
• Input Voltage Range 7V to 25V
• Support 2, 3 and 4 Cells Battery Pack
• Up to 17.64V Battery-Voltage Set Point
• Control Adapter Power Source Select MOSFET
• Thermal Shutdown
• Aircraft Power Capable
• DC Adapter Present Indicator
• Battery Discharge MOSFET Control
• Less than 10µA Battery Leakage Current
• Support Pulse Charging
• Charge Any Battery Chemistry: Li-Ion, NiCd, NiMH, etc.
Ordering Information
• Pb-Free Plus Anneal Available (RoHS Compliant)
PART
NUMBER
(Notes 1, 2)
PART
MARKING
ISL6255HRZ
ISL6255HRZ
-10 to 100
28 Ld 5x5 QFN L28.5×5
ISL6255HAZ
ISL6255HAZ
-10 to 100
28 Ld QSOP
ISL6255AHRZ ISL6255AHRZ
-10 to 100
28 Ld 5x5 QFN L28.5×5
ISL6255AHAZ ISL6255AHAZ
-10 to 100
28 Ld QSOP
TEMP
RANGE (°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
M28.15
Applications
• Notebook, Desknote and Sub-notebook Computers
• Personal Digital Assistant
M28.15
NOTES:
1. Intersil Pb-free plus anneal products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which are RoHS compliant and compatible
with both SnPb and Pb-free soldering operations. Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that
meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. Add “-T” for Tape and Reel.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2005, 2006. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL6255, ISL6255A
Pinouts
ISL6255, ISL6255A
(28 LD QSOP)
TOP VIEW
28
27
26
25
24
23
CSON
ACPRN
DCPRN
DCIN
VDD
ACSET
DCSET
ISL6255, ISL6255A
(28 LD QFN)
TOP VIEW
22
DCIN
1
28
DCPRN
VDD
2
27
ACPRN
ACSET
3
26
CSON
DCSET
4
25
CSOP
EN
1
21
CSOP
CELLS
2
20
CSIN
EN
5
24
CSIN
ICOMP
3
19
CSIP
CELLS
6
23
CSIP
ICOMP
7
22
SGATE
VCOMP
8
21
BGATE
VCOMP
4
18
SGATE
ICM
5
17
BGATE
ICM
9
20
PHASE
PHASE
VREF
10
19
UGATE
CHLIM
11
18
BOOT
15
2
12
13
VDDP
11
LGATE
10
PGND
9
GND
8
UGATE
ACLIM
12
17
VDDP
14
VADJ
13
16
LGATE
BOOT
7
VADJ
CHLIM
16
6
ACLIM
VREF
GND
14
15
PGND
FN9203.2
May 23, 2006
ISL6255, ISL6255A
Absolute Maximum Ratings
Thermal Information
DCIN, CSIP, CSON to GND. . . . . . . . . . . . . . . . . . . . . -0.3V to +28V
CSIP-CSIN, CSOP-CSON . . . . . . . . . . . . . . . . . . . . . -0.3V to +0.3V
CSIP-SGATE, CSIP-BGATE . . . . . . . . . . . . . . . . . . . . . -0.3V to 16V
PHASE to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -7V to 30V
BOOT to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +35V
BOOT to VDDP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2V to 28V
ACLIM, ACPRN, CHLIM, DCPRN, VDD to GND. . . . . . . -0.3V to 7V
BOOT-PHASE, VDDP-PGND . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
ACSET and DCSET to GND (Note 3) . . . . . . . . -0.3V to VDD+0.3V
ICM, ICOMP, VCOMP to GND. . . . . . . . . . . . . . -0.3V to VDD+0.3V
VREF, CELLS to GND . . . . . . . . . . . . . . . . . . . . -0.3V to VDD+0.3V
EN, VADJ, PGND to GND . . . . . . . . . . . . . . . . . -0.3V to VDD+0.3V
UGATE. . . . . . . . . . . . . . . . . . . . . . . . . PHASE-0.3V to BOOT+0.3V
LGATE . . . . . . . . . . . . . . . . . . . . . . . . . . PGND-0.3V to VDDP+0.3V
Thermal Resistance
θJA (°C/W)
θJC (°C/W)
QFN Package (Notes 4, 5). . . . . . . . . .
39
9.5
QSOP Package (Note 4) . . . . . . . . . . .
80
NA
Junction Temperature Range. . . . . . . . . . . . . . . . . .-10°C to +150°C
Operating Temperature Range . . . . . . . . . . . . . . . .-10°C to +100°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Lead Temperature (soldering, 10s) . . . . . . . . . . . . . . . . . . . . +300°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
3. When the voltage across ACSET and DCSET is below 0V, the current through ACSET and DCSET should be limited to less than 1mA.
4. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
5. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
DCIN = CSIP = CSIN = 18V, CSOP = CSON = 12V, ACSET = DCSET = 1.5V, ACLIM = VREF,
VADJ = Floating, EN = VDD = 5V, BOOT-PHASE = 5.0V, GND = PGND = 0V, CVDD = 1µF, IVDD = 0mA,
TA = -10°C to +100°C, TJ ≤ 125°C, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
25
V
1.4
3
mA
3
10
µA
5.075
5.225
V
SUPPLY AND BIAS REGULATOR
DCIN Input Voltage Range
7
DCIN Quiescent Current
EN = VDD or GND, 7V ≤ DCIN ≤ 25V
Battery Leakage Current (Note 6)
DCIN = 0, no load
VDD Output Voltage/Regulation
7V ≤ DCIN ≤ 25V, 0 ≤ IVDD ≤ 30mA
VDD Undervoltage Lockout Trip Point
VDD Rising
4.0
4.4
4.6
V
Hysteresis
200
250
400
mV
2.365
2.39
2.415
V
4.925
Reference Output Voltage VREF
0 ≤ IVREF ≤ 300µA
Battery Charge Voltage Accuracy
CSON = 16.8V, CELLS = VDD, VADJ = Float
-0.5
0.5
%
CSON = 12.6V, CELLS = GND, VADJ = Float
-0.5
0.5
%
CSON = 8.4V, CELLS = Float, VADJ = Float
-0.5
0.5
%
CSON = 17.64V, CELLS = VDD, VADJ = VREF
-0.5
0.5
%
CSON = 13.23V, CELLS = GND, VADJ = VREF
-0.5
0.5
%
CSON = 8.82V, CELLS = Float, VADJ = VREF
-0.5
0.5
%
CSON = 15.96V, CELLS = VDD, VADJ = GND
-0.5
0.5
%
CSON = 11.97V, CELLS = GND, VADJ = GND
-0.5
0.5
%
CSON = 7.98V, CELLS = Float, VADJ = GND
-0.5
0.5
%
TRIP POINTS
ACSET Threshold
1.24
1.26
1.28
V
ACSET Input Bias Current Hysteresis
2.2
3.4
4.4
µA
2.2
3.4
4.4
µA
ACSET Input Bias Current
ACSET ≥ 1.26V
ACSET Input Bias Current
ACSET < 1.26V
DCSET Threshold
3
-1
0
1
µA
1.24
1.26
1.28
V
FN9203.2
May 23, 2006
ISL6255, ISL6255A
Electrical Specifications
DCIN = CSIP = CSIN = 18V, CSOP = CSON = 12V, ACSET = DCSET = 1.5V, ACLIM = VREF,
VADJ = Floating, EN = VDD = 5V, BOOT-PHASE = 5.0V, GND = PGND = 0V, CVDD = 1µF, IVDD = 0mA,
TA = -10°C to +100°C, TJ ≤ 125°C, unless otherwise noted. (Continued)
PARAMETER
TEST CONDITIONS
DCSET Input Bias Current Hysteresis
MIN
TYP
MAX
UNITS
2.2
3.4
4.4
µA
DCSET Input Bias Current
DCSET ≥ 1.26V
2.2
3.4
4.4
µA
DCSET Input Bias Current
DCSET < 1.26V
-1
0
1
µA
245
300
355
kHz
OSCILLATOR
Frequency
PWM Ramp Voltage (peak-peak)
CSIP = 18V
1.6
V
CSIP = 11V
1
V
SYNCHRONOUS BUCK REGULATOR
Maximum Duty Cycle
97
99
99.6
%
3.0
Ω
UGATE Pull-Up Resistance
BOOT-PHASE = 5V, 500mA source current
1.8
UGATE Source Current
BOOT-PHASE = 5V, BOOT-UGATE = 2.5V
1.0
UGATE Pull-down Resistance
BOOT-PHASE = 5V, 500mA sink current
1.0
UGATE Sink Current
BOOT-PHASE = 5V, UGATE-PHASE = 2.5V
1.8
LGATE Pull-Up Resistance
VDDP-PGND = 5V, 500mA source current
1.8
LGATE Source Current
VDDP-PGND = 5V, VDDP-LGATE = 2.5V
1.0
LGATE Pull-Down Resistance
VDDP-PGND = 5V, 500mA sink current
1.0
LGATE Sink Current
VDDP-PGND = 5V, LGATE = 2.5V
1.8
A
1.8
Ω
A
3.0
Ω
A
1.8
Ω
A
CHARGING CURRENT SENSING AMPLIFIER
Input Common-Mode Range
0
Input Offset Voltage
Guaranteed by design
Input Bias Current at CSOP
0 < CSOP < 18V
Input Bias Current at CSON
0 < CSON < 18V
CHLIM Input Voltage Range
-2.5
18
V
0
2.5
mV
0.25
2
µA
75
100
µA
3.6
V
0
CSOP to CSON Full-Scale Current Sense
Voltage
ISL6255: CHLIM = 3.3V
157
165
173
mV
ISL6255A: CHLIM = 3.3V
160
165
170
mV
ISL6255: CHLIM = 2.0V
95
100
105
mV
ISL6255A: CHLIM = 2.0V
97
100
103
mV
ISL6255: CHLIM = 0.2V
5.0
10
15.0
mV
ISL6255A: CHLIM = 0.2V
7.5
10
12.5
mV
CHLIM Input Bias Current
CHLIM = GND or 3.3V, DCIN = 0V
-1
1
µA
CHLIM Power-Down Mode Threshold
Voltage
CHLIM rising
80
88
95
mV
15
25
40
mV
7
25
V
-2
2
mV
CHLIM Power-Down Mode Hysteresis
Voltage
ADAPTER CURRENT SENSING AMPLIFIER
Input Common-Mode Range
Input Offset Voltage
Guaranteed by design
Input Bias Current at CSIP and CSIN
Combined
CSIP = CSIN = 25V
100
130
µA
Input Bias Current at CSIN
0 < CSIN < DCIN, Guaranteed by design
0.10
1
µA
4
FN9203.2
May 23, 2006
ISL6255, ISL6255A
Electrical Specifications
DCIN = CSIP = CSIN = 18V, CSOP = CSON = 12V, ACSET = DCSET = 1.5V, ACLIM = VREF,
VADJ = Floating, EN = VDD = 5V, BOOT-PHASE = 5.0V, GND = PGND = 0V, CVDD = 1µF, IVDD = 0mA,
TA = -10°C to +100°C, TJ ≤ 125°C, unless otherwise noted. (Continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNITS
ACLIM = VREF
97
100
103
mV
ACLIM = Float
72
75
78
mV
ACLIM = GND
47
50
53
mV
ACLIM = VREF
10
16
20
µA
ACLIM = GND
-20
-16
-10
µA
ADAPTER CURRENT LIMIT THRESHOLD
CSIP to CSIN Full-Scale Current Sense
Voltage
ACLIM Input Bias Current
VOLTAGE REGULATION ERROR AMPLIFIER
30
µA/V
Charging Current Error Amplifier
Transconductance
50
µA/V
Adapter Current Error Amplifier
Transconductance
50
µA/V
Error Amplifier Transconductance from
CSON to VCOMP
CELLS = VDD
CURRENT REGULATION ERROR AMPLIFIER
BATTERY CELL SELECTOR
CELLS Input Voltage for 4 Cell Select
4.3
V
CELLS Input Voltage for 3 Cell Select
CELLS Input Voltage for 2 Cell Select
2
V
4.2
V
30
45
mA
2.1
MOSFET DRIVER
BGATE Pull-Up Current
CSIP-BGATE = 3V
10
BGATE Pull-Down Current
CSIP-BGATE = 5V
2.7
4.0
5.0
mA
CSIP-BGATE Voltage High
8
9.6
11
V
CSIP-BGATE Voltage Low
50
0
50
mV
-100
0
100
mV
DCIN-CSON Threshold for CSIP-BGATE
Going High
DCIN = 12V, CSON Rising
DCIN-CSON Threshold Hysteresis
250
300
400
mV
SGATE Pull-Up Current
CSIP-SGATE = 3V
7
12
15
mA
SGATE Pull-Down Current
CSIP-SGATE = 5V
50
160
370
µA
CSIP-SGATE Voltage High
8
9
11
V
CSIP-SGATE Voltage Low
-50
0
50
mV
CSIP-CSIN Threshold for CSIP-SGATE
Going High
2.5
8
13
mV
CSIP-CSIN Threshold Hysteresis
1.3
5
8
mV
VDD
V
LOGIC INTERFACE
EN Input Voltage Range
0
EN Threshold Voltage
Rising
1.030
1.06
1.100
V
Falling
0.985
1.000
1.025
V
Hysteresis
30
60
90
mV
EN Input Bias Current
EN = 2.5V
1.8
2.0
2.2
µA
ACPRN Sink Current
ACPRN = 0.4V
3
8
11
mA
ACPRN Leakage Current
ACPRN = 5V
0.5
µA
DCPRN Sink Current
DCPRN = 0.4V
11
mA
5
-0.5
3
8
FN9203.2
May 23, 2006
ISL6255, ISL6255A
Electrical Specifications
DCIN = CSIP = CSIN = 18V, CSOP = CSON = 12V, ACSET = DCSET = 1.5V, ACLIM = VREF,
VADJ = Floating, EN = VDD = 5V, BOOT-PHASE = 5.0V, GND = PGND = 0V, CVDD = 1µF, IVDD = 0mA,
TA = -10°C to +100°C, TJ ≤ 125°C, unless otherwise noted. (Continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
-0.5
MAX
UNITS
0.5
µA
DCPRN Leakage Current
DCPRN = 5V
ICM Output Accuracy
(Vicm = 19.9 x (Vcsip-Vcsin))
CSIP-CSIN = 100mV
-3
0
+3
%
CSIP-CSIN = 75mV
-4
0
+4
%
CSIP-CSIN = 50mV
-5
0
+5
%
Thermal Shutdown Temperature
150
°C
Thermal Shutdown Temperature Hysteresis
25
°C
NOTE:
6. This is the sum of currents in these pins (CSIP, CSIN, BGATE, BOOT, UGATE, PHASE, CSOP, CSON) all tied to 16.8V. No current in pins EN,
ACSET, DCSET, VADJ, CELLS, ACLIM, CHLIM.
Typical Operating Performance
DCIN = 20V, 4S2P Li-Battery, TA = 25°C, unless otherwise noted.
0.1
VREF LOAD REGULATION ACCURACY (%)
VDD LOAD REGULATION ACCURACY (%)
0.6
VDD=5.075V
EN=0
0.3
0
-0.3
-0.6
0
8
16
24
32
VREF=2.390V
0.08
0.06
0.04
0.02
0
0
40
100
10
400
1
Test
9
8
0 .9 6
7
VCSON=12.6V
(3 CELLS)
0 .9 2
6
EFFICIENCY (%)
| ICM ACCURACY | (%)
300
FIGURE 2. VREF LOAD REGULATION
FIGURE 1. VDD LOAD REGULATION
5
4
3
2
VCSON=8.4V
2 CELLS
VCSON=16.8V
4 CELLS
0 .8 8
0 .8 4
0 .8
1
0
200
LOAD CURRENT (µA)
LOAD CURRENT (mA)
10
20
30
40
50
60
70
80
90
100
CSIP-CSIN (mV)
FIGURE 3. ICM ACCURACY vs AC ADAPTER CURRENT
6
0 .76
0
0 .5
1
1.5
2
2.5
3
3 .5
4
CHARGE CURRENT (A)
FIGURE 4. SYSTEM EFFICIENCY vs CHARGE CURRENT
FN9203.2
May 23, 2006
ISL6255, ISL6255A
Typical Operating Performance
DCIN = 20V, 4S2P Li-Battery, TA = 25°C, unless otherwise noted. (Continued)
LOAD
CURRENT
5A/div
DCIN
10V/div
ADAPTER
CURRENT
5A/div
ACSET
1V/div
DCSET
1V/div
DCPRN
5V/div
CHARGE
CURRENT
2A/div
LOAD STEP: 0-4A
CHARGE CURRENT: 3A
AC ADAPTER CURRENT LIMIT: 5.15A
BATTERY
VOLTAGE
2V/div
ACPRN
5V/div
FIGURE 5. AC AND DC ADAPTER DETECTION
FIGURE 6. LOAD TRANSIENT RESPONSE
CSON
5V/div
INDUCTOR
CURRENT
2A/div
EN
5V/div
BATTERY
INSERTION
BATTERY
REMOVAL
CSON
10V/div
INDUCTOR
CURRENT
2A/div
VCOMP
CHARGE
CURRENT
2A/div
FIGURE 7. CHARGE ENABLE AND SHUTDOWN
ICOMP
VCOMP
2V/div
ICOMP
2V/div
FIGURE 8. BATTERY INSERTION AND REMOVAL
CHLIM=0.2V
CSON=8V
PHASE
10V/div
PHASE
10V/div
FIGURE 9. AC ADAPTER REMOVAL
7
INDUCTOR
CURRENT
1A/div
UGATE
2V/div
UGATE
5V/div
LGATE
2V/div
FIGURE 10. AC ADAPTER INSERTION
FN9203.2
May 23, 2006
ISL6255, ISL6255A
Typical Operating Performance
DCIN = 20V, 4S2P Li-Battery, TA = 25°C, unless otherwise noted. (Continued)
BGATE-CSIP
2V/div
SGATE-CSIP
2V/div
ADAPTER REMOVAL
SYSTEM BUS
VOLTAGE
10V/div
SYSTEM BUS
VOLTAGE
10V/div
SGATE-CSIP
2V/div
BGATE-CSIP
2V/div
INDUCTOR
CURRENT
2A/div
FIGURE 11. SWITCHING WAVEFORMS AT DIODE EMULATION
ADAPTER INSERTION
INDUCTOR
CURRENT
2A/div
FIGURE 12. SWITCHING WAVEFORMS IN CC MODE
CHARGE
CURRENT
1A/div
CHLIM
1V/div
FIGURE 13. TRICKLE TO FULL-SCALE CHARGING
Functional Pin Descriptions
BOOT
Connect BOOT to a 0.1µF ceramic capacitor to PHASE pin
and connect to the cathode of the bootstrap schottky diode.
PHASE
The Phase connection pin connects to the high side
MOSFET source, output inductor, and low side MOSFET
drain.
CSOP/CSON
UGATE
UGATE is the high side MOSFET gate drive output.
SGATE
SGATE is the AC adapter power source select output. The
SGATE pin drives an external P-MOSFET used to switch to
AC adapter as the system power source.
CSOP/CSON is the battery charging current sensing
positive/negative input. The differential voltage across CSOP
and CSON is used to sense the battery charging current,
and is compared with the charging current limit threshold to
regulate the charging current. The CSON pin is also used as
the battery feedback voltage to perform voltage regulation.
CSIP/CSIN
BGATE
Battery power source select output. This pin drives an
external P-channel MOSFET used to switch the battery as
the system power source. When the voltage at CSON pin is
higher than the AC adapter output voltage at DCIN, BGATE
is driven to low and selects the battery as the power source.
CSIP/CSIN is the AC adapter current sensing
positive/negative input. The differential voltage across CSIP
and CSIN is used to sense the AC adapter current, and is
compared with the AC adapter current limit to regulate the
AC adapter current.
GND
LGATE
LGATE is the low side MOSFET gate drive output; swing
between 0V and VDDP.
8
GND is an analog ground.
FN9203.2
May 23, 2006
ISL6255, ISL6255A
DCIN
VDDP
The DCIN pin is the input of the internal 5V LDO. Connect it
to the AC adapter output. Connect a 0.1µF ceramic
capacitor from DCIN to CSON.
VDDP is the supply voltage for the low-side MOSFET gate
driver. Connect a 4.7Ω resistor to VDD and a 1μF ceramic
capacitor to power ground.
ACSET
ICOMP
ACSET is an AC adapter detection input. Connect to a
resistor divider from the AC adapter output.
ICOMP is a current loop error amplifier output.
ACPRN
VCOMP is a voltage loop amplifier output.
Open-drain output signals AC adapter is present. ACPRN
pulls low when ACSET is higher than 1.26V; and pulled high
when ACSET is lower than 1.26V.
DCSET
DCSET is a lower voltage adapter detection input (like
aircraft power 15V).Allows the adapter to power the system
where battery charging has been disabled.
DCPRN
Open-drain output signals DC adapter is present. DCPRN
pulls low when DCSET is higher than 1.26V; and pulled high
when DCSET is lower than 1.26V.
EN
EN is the Charge Enable input. Connecting EN to high
enables the charge control function, connecting EN to low
disables charging functions. Use with a thermistor to detect
a hot battery and suspend charging.
VCOMP
CELLS
This pin is used to select the battery voltage. CELLS = VDD
for a 4S battery pack, CELLS = GND for a 3S battery pack,
CELLS = Float for a 2S battery pack.
VADJ
VADJ adjusts battery regulation voltage. VADJ = VREF for
4.2V+5%/cell; VADJ = Floating for 4.2V/cell; VADJ = GND
for 4.2V-5%/cell. Connect to a resistor divider to program the
desired battery cell voltage between 4.2V-5% and 4.2V+5%.
CHLIM
CHLIM is the battery charge current limit set pin.CHLIM input
voltage range is 0.1V to 3.6V. When CHLIM = 3.3V, the set
point for CSOP-CSON is 165mV. The charger shuts down if
CHLIM is forced below 88mV.
ACLIM
ICM is the adapter current output. The output of this pin
produces a voltage proportional to the adapter current.
ACLIM is the adapter current limit set pin. ACLIM = VREF for
100mV, ACLIM = Floating for 75mV, and ACLIM = GND for
50mV. Connect a resistor divider to program the adapter
current limit threshold between 50mV and 100mV.
PGND
VREF
PGND is the power ground. Connect PGND to the source of
the low side MOSFET.
VREF is a 2.39V reference output pin. It is internally
compensated. Do not connect a decoupling capacitor.
ICM
VDD
VDD is an internal LDO output to supply IC analog circuit.
Connect a 1μF ceramic capacitor to ground.
9
FN9203.2
May 23, 2006
ISL6255, ISL6255A
+ CA1 CA1´X19.9
+
-
PHASE
ICOMP
PWM
+
+
Limit Set
Adapter
152K
Current Limit Set
VDDP
ACLIM
VDDP
152K
VREF
+
Adapter
1.27V
Current
+
Min
Current
Buffer
gm3
+
gm3
+
LGATE
PGND
LDO
LDO
Regulator
Regulator
1.26V
CSON
+
+
+ CA1 CA1´ 19.9
-
+
SGATE CSIP
CSIN
CSOP
CHLIM
+
EN
ICM
BOOT
VDD
DCIN
BGATE
+
1.26V DCSET
CSON
1.06V
- 1.065V
ACSET
UGATE
-
´ 20
X
CA2
- CA2
ACPRN
PHASE
2.1V
2.1V
+Min
Min
Voltage
Voltage
Buffer
Buffer
CA2
UGATE
+
Reference
DCPRN
GND
+
gm1
-
VDDP
VDD
VREF
VCA2V
BOOT
VCOMP
LGATE
CELLS
gm2
+
Voltage
+ Selector
-
++0.25V
0.25
VCA2
CA2
0.25V
0.25
VCA2
CA2
+++--
VDD
VREF
514K
LDO
LDO
Regulator
Regulator
DCIN
514K
PWM
+
+
Voltage
Selector
VADJ
gm1
+
gm1
Voltage +
Selector
Min
Min
Voltage
Voltage
Buffer
Buffer
+
gm1
-
VREF
514K
Min
Current
Buffer
VADJ
VDDP
VCOMP
gm2
ICOMP
VCA2V
PGND
Current Limit Set
CA2
Adapter
1.27V
Current
Limit Set
Adapter
2.1V
Voltage
+ Selector
-
-
BGATE
2.1V
152K
gm3
+
gm3
+
CELLS
152K
ACLIM
CSON
1.26V
514K
1.06V
- 1.065V
+
VDD
EN
+
VREF
´ 20
CA2
- CA2
+
+
+
1.26V -
Reference
+
ACPRN
DCPRN
DCSET
VREF
CHLIM
CSOP
CSIN
CSON
ACSET
SGATE CSIP
GND
ICM
FIGURE 14. FUNCTIONAL BLOCK DIAGRAM
10
FN9203.2
May 23, 2006
ISL6255, ISL6255A
Q3
AC ADAPTER
VDD
R8
130k
1%
Q5
R9
10.2k
1%
C8
0.1µF CSON
DCIN
DCIN
R5
100k
C9
1µF
VDDP
VDDP
CSIN
CSIN
VDD
VDD
FLOATING
4.2V/CELL
CHARGE
ENABLE
R11
130k
1%
SYSTEM LOAD
VDDP
C1:10 µF
BOOT
BOOT
Q4
D2
ACPRN
ACPRN
UGATE
UGATE
ICOMP
ICOMP
PHASE
PHASE
VCOMP
VCOMP
LGATE
PGND
PGND
EN
EN
CSOP
CSOP
ACLIM
ACLIM
CSON
CSON
VREF
VREF
CELLS
CHLIM
CHLIM
Q1
C4
0.1µF
D1
Optional
Q2
VADJ
VADJ
R12
2.6A CHARGE LIMIT
20k 1% 253mA Trickle Charge
R13
1.87k
1%
R2
20m
20mΩ
R3
18Ω
18
BGATE
C6:6.8nF
R6: 10k C5:10nF
TRICKLE
CHARGE
C2
0.1µF
ISL6255
ISL6255
ISL6255A
ISL6255A
ISL6255A
R10
4.7
4.7Ω
3.3V
VREF
CSIP
ACSET
ACSET
C7
1µF
To Host
Controller
SGATE
C3
1µF
R4
2.2
2.2Ω
VDD
4 CELLS
R1
40mΩ
40m
BAT+
C10
10µF
Battery
Pack
BAT-
ICM
R7: 100Ω
GND
L
10µH
C11
3300pF
Q6
FIGURE 15. ISL6255, ISL6255A TYPICAL APPLICATION CIRCUIT WITH FIXED CHARGING PARAMETERS
11
FN9203.2
May 23, 2006
ISL6255, ISL6255A
ADAPTER
R14
100k
1%
DCIN
DCIN
ACSET
ACSET
CSON
SGATE
SGATE
CSIP
CSIP
C2
0.1µF
CSIN
ISL6255 CSIN
ISL6255
ISL6255
C7
1µF
R10
4.7
4.7Ω
C9
1µF
ACPRN
ACPRN
DCPRN
DCPRN
D2
PHASE
PHASE
D1
Optional
LGATE
LGATE
R7: 100Ω
A/D INPUT
VREF
5.15A INPUT
CURRENT LIMIT
R11,R12
R13: 10K
PGND
PGND
EN
EN
CSOP
CSOP
C3
1µF
ICM
ICM
C11
3300pF
HOST
CHLIM
CHLIM
C6
6.8nF
ACLIM
ACLIM
Q1
C4
0.1µF
Q2
OUTPUT
C1:10µF
BOOT
BOOT
UGATE
UGATE
D/A OUTPUT
SYSTEM LOAD
Q4
VDDP
VDD
VDD
R5
100k
R2
20mΩ
20m
R3: 18Ω
ISL6255A
ISL6255A
ISL6255A
BGATE
BGATE
VDDP
VDDP
DIGITAL
INPUT
AVDD/VREF
Q3
DCSET
DCSET
VCC
DIGITAL
INPUT
Q5
R9
10.2k
1%
R15
11.5k
1%
R16
100k
C8
0.1µ
VDD
R8
130k
1%
R4
2.2Ω
2.2
L
10µH
R1
40m
40mΩ
CSON
CSON
CELLS
CELLS
VREF
VREF
VADJ
VADJ
ICOMP
ICOMP
GND
GND
BAT+
GND
3 CELLS
FLOATING
4.2V/CELL
C10
10µF
BATTERY
Pack
VCOMP
VCOMP
R6
10k
SCL
SDL
A/D INPUT
GND
C5
10nF
SCL
SDL
TEMP
BAT-
FIGURE 16. ISL6255, ISL6255A TYPICAL APPLICATION CIRCUIT WITH µP CONTROL AND AIRCRAFT POWER SUPPORT
12
FN9203.2
May 23, 2006
ISL6255, ISL6255A
Theory of Operation
Introduction
The ISL6255, ISL6255A includes all of the functions
necessary to charge 2 to 4 cell Li-Ion and Li-polymer
batteries. A high efficiency synchronous buck converter is
used to control the charging voltage and charging current up
to 10A. The ISL6255, ISL6255A has input current limiting
and analog inputs for setting the charge current and charge
voltage; CHLIM inputs are used to control charge current
and VADJ inputs are used to control charge voltage.
The ISL6255, ISL6255A charges the battery with constant
charge current, set by CHLIM input, until the battery voltage
rises up to a programmed charge voltage set by VADJ input;
then the charger begins to operate at a constant voltage
charge mode. The charger also drives an adapter isolation Pchannel MOSFET to efficiently switch in the adapter supply.
ISL6255, ISL6255A is a complete power source selection
controller for single battery systems and also aircraft power
applications. It drives a battery selector P-channel MOSFET
to efficiently select between a single battery and the adapter.
It controls the battery discharging MOSFET and switches to
the battery when the AC adapter is removed, or, switches to
the AC adapter when the AC adapter is inserted for single
battery system.
The EN input allows shutdown of the charger through a
command from a micro-controller. It also uses EN to safely
shutdown the charger when the battery is in extremely hot
conditions. The amount of adapter current is reported on the
ICM output. Figure 14 shows the IC functional block diagram.
The synchronous buck converter uses external N-channel
MOSFETs to convert the input voltage to the required
charging current and charging voltage. Figure 15 shows the
ISL6255, ISL6255A typical application circuit with charging
current and charging voltage fixed at specific values. The
typical application circuit shown in Figure 16 shows the
ISL6255, ISL6255A typical application circuit which uses a
micro-controller to adjust the charging current set by CHLIM
input for aircraft power applications. The voltage at CHLIM
and the value of R1 sets the charging current. The DC/DC
converter generates the control signals to drive two external
N-channel MOSFETs to regulate the voltage and current set
by the ACLIM, CHLIM, VADJ and CELLS inputs.
The ISL6255, ISL6255A features a voltage regulation loop
(VCOMP) and two current regulation loops (ICOMP). The
VCOMP voltage regulation loop monitors CSON to ensure
that its voltage never exceeds the voltage and regulates the
battery charge voltage set by VADJ. The ICOMP current
regulation loops regulate the battery charging current
delivered to the battery to ensure that it never exceeds the
charging current limit set by CHLIM; and the ICOMP current
regulation loops also regulate the input current drawn from
the AC adapter to ensure that it never exceeds the input
13
current limit set by ACLIM, and to prevent a system crash
and AC adapter overload.
PWM Control
The ISL6255, ISL6255A employs a fixed frequency PWM
current mode control architecture with a feed-forward
function. The feed-forward function maintains a constant
modulator gain of 11 to achieve fast line regulation as the
buck input voltage changes. When the battery charge
voltage approaches the input voltage, the DC/DC converter
operates in dropout mode, where there is a timer to prevent
the frequency from dropping into the audible frequency
range. It can achieve duty cycle of up to 99.6%.
To prevent boosting of the system bus voltage, the battery
charger operates in standard-buck mode when CSOPCSON drops below 4.25mV. Once in standard-buck mode,
hysteresis does not allow synchronous operation of the
DC/DC converter until CSOP-CSON rises above 12.5mV.
An adaptive gate drive scheme is used to control the dead
time between two switches. The dead time control circuit
monitors the LGATE output and prevents the upper side
MOSFET from turning on until LGATE is fully off, preventing
cross-conduction and shoot-through. In order for the dead
time circuit to work properly, there must be a low resistance,
low inductance path from the LGATE driver to MOSFET
gate, and from the source of MOSFET to PGND. The
external Schottky diode is between the VDDP pin and BOOT
pin to keep the bootstrap capacitor charged.
Setting the Battery Regulation Voltage
The ISL6255, ISL6255A uses a high-accuracy trimmed
band-gap voltage reference to regulate the battery charging
voltage. The VADJ input adjusts the charger output voltage,
and the VADJ control voltage can vary from 0 to VREF,
providing a 10% adjustment range (from 4.2V-5% to
4.2V+5%) on CSON regulation voltage. An overall voltage
accuracy of better than 0.5% is achieved.
The per-cell battery termination voltage is a function of the
battery chemistry. Consult the battery manufacturers to
determine this voltage.
• Float VADJ to set the battery voltage VCSON = 4.2V ×
number of the cells,
• Connect VADJ to VREF to set 4.41V × number of cells,
• Connect VADJ to ground to set 3.99V × number of the
cells.
So, the maximum battery voltage of 17.6V can be achieved.
Note that other battery charge voltages can be set by
connecting a resistor divider from VREF to ground. The resistor
divider should be sized to draw no more than 100µA from
VREF; or connect a low impedance voltage source like the D/A
converter in the micro-controller. The programmed battery
voltage per cell can be determined by the following equation:
VCELL = 0.175 VVADJ + 3.99 V
FN9203.2
May 23, 2006
ISL6255, ISL6255A
An external resistor divider from VREF sets the voltage at
VADJ according to:
R bot_VADJ || 514k
V VADJ = VREF × ------------------------------------------------------------------------------------------------R top_VADJ || 514k + R
|| 514k
bot_VADJ
where Rbot_VADJ and Rtop_VADJ are external resistors at
VADJ.
To minimize accuracy loss due to interaction with VADJ's
internal resistor divider, ensure the AC resistance looking
back into the resistor divider is less than 25k.
Connect CELLS as shown in Table 1 to charge 2, 3 or 4 Li+
cells. When charging other cell chemistries, use CELLS to
select an output voltage range for the charger. The internal
error amplifier gm1 maintains voltage regulation. The voltage
error amplifier is compensated at VCOMP. The component
values shown in Figure 16 provide suitable performance for
most applications. Individual compensation of the voltage
regulation and current-regulation loops allows for optimal
compensation.
TABLE 1. CELL NUMBER PROGRAMMING
CELLS
CELL NUMBER
VDD
4
GND
3
Float
2
Setting the Battery Charge Current Limit
The CHLIM input sets the maximum charging current. The
current set by the current sense-resistor connects between
CSOP and CSON. The full-scale differential voltage between
CSOP and CSON is 165mV for CHLIM = 3.3V, so the
maximum charging current is 4.125A for a 40mΩ sensing
resistor. Other battery charge current-sense threshold
values can be set by connecting a resistor divider from
VREF or 3.3V to ground, or by connecting a low impedance
voltage source like a D/A converter in the micro-controller.
Unlike VADJ and ACLIM, CHLIM does not have an internal
resistor divider network. The charge current limit threshold is
given by:
efficiency. However, adjusting CHLIM voltage to reduce the
voltage across the current sense resistor R1 will degrade
accuracy due to the smaller signal to the input of the current
sense amplifier. There is a trade-off between accuracy and
power dissipation. A low pass filter is recommended to
eliminate switching noise. Connect the resistor to the CSOP
pin instead of the CSON pin, as the CSOP pin has lower
bias current and less influence on current-sense accuracy
and voltage regulation accuracy.
Setting the Input Current Limit
The total input current from an AC adapter, or other DC
source, is a function of the system supply current and the
battery-charging current. The input current regulator limits
the input current by reducing the charging current, when the
input current exceeds the input current limit set point.
System current normally fluctuates as portions of the system
are powered up or down. Without input current regulation,
the source must be able to supply the maximum system
current and the maximum charger input current
simultaneously. By using the input current limiter, the current
capability of the AC adapter can be lowered, reducing
system cost.
The ISL6255, ISL6255A limits the battery charge current
when the input current-limit threshold is exceeded, ensuring
the battery charger does not load down the AC adapter
voltage. This constant input current regulation allows the
adapter to fully power the system and prevent the AC
adapter from overloading and crashing the system bus.
An internal amplifier gm3 compares the voltage between
CSIP and CSIN to the input current limit threshold voltage
set by ACLIM. Connect ACLIM to REF, Float and GND for
the full-scale input current limit threshold voltage of 100mV,
75mV and 50mV, respectively, or use a resistor divider from
VREF to ground to set the input current limit as the following
equation
1 ⎛ 0.05
⎞
IINPUT =
VACLIM + 0.050 ⎟
⎜
R2 ⎝ VREF
⎠
An external resistor divider from VREF sets the voltage at
ACLIM according to:
R bot_ACLIM || 152k
V ACLIM = VREF × -----------------------------------------------------------------------------------------------------R top_ACLIM || 152k + R
|| 152k
165mV V CHLIM
I CHG = ------------------- ---------------------3.3V
R1
bot_ACLIM
To set the trickle charge current for the dumb charger, a
resistor in series with a switch Q6 (Figure 15) controlled by
the micro-controller is connected from CHLIM pin to ground.
The trickle charge current is determined by:
165mV V CHLIM ,trickle
I CHG = ------------------- ---------------------------------------3.3V
R1
When the CHLIM voltage is below 88mV (typical), it will
disable the battery charge. When choosing the current
sensing resistor, note that the voltage drop across the
sensing resistor causes further power dissipation, reducing
14
where Rbot_ACLIM and Rtop_ACLIM are external resistors at
ACLIM.
To minimize accuracy loss due to interaction with ACLIM's
internal resistor divider, ensure the AC resistance looking
back into the resistor divider is less than 25k.
When choosing the current sense resistor, note that the
voltage drop across this resistor causes further power
dissipation, reducing efficiency. The AC adapter current
sense accuracy is very important. Use a 1% tolerance
FN9203.2
May 23, 2006
ISL6255, ISL6255A
current-sense resistor. The highest accuracy of ±3% is
achieved with 100mV current-sense threshold voltage for
ACLIM = VREF, but it has the highest power dissipation. For
example, it has 400mW power dissipation for rated 4A AC
adapter and 1W sensing resistor may have to be used. ±4%
and ±6% accuracy can be achieved with 75mV and 50mV
current-sense threshold voltage for ACLIM = Floating and
ACLIM = GND, respectively.
voltage of ICM is proportional to the voltage drop across
CSIP and CSIN, and is given by the following equation:
A low pass filter is suggested to eliminate the switching
noise. Connect the resistor to CSIN pin instead of CSIP pin
because CSIN pin has lower bias current and less influence
on the current-sense accuracy.
LDO Regulator
AC Adapter Detection
Connect the AC adapter voltage through a resistor divider to
ACSET to detect when AC power is available, as shown in
Figure 15. ACPRN is an open-drain output and is high when
ACSET is less than Vth,rise, and active low when ACSET is
above Vth,fall. Vth,rise and Vth,fall are given by:
⎛R
⎞
Vth ,rise = ⎜⎜ 8 + 1 ⎟⎟ • VACSET
R
9
⎝
⎠
⎞
⎛R
Vth,fall = ⎜⎜ 8 + 1 ⎟⎟ • V ACSET − I hys R8
R
⎠
⎝ 9
Where Ihys is the ACSET input bias current hysteresis and
VACSET = 1.24V (min), 1.26V (typ) and 1.28V (max). The
hysteresis is IhysR8, where Ihys = 2.2µA (min), 3.4µA (typ)
and 4.4µA (max).
DC Adapter Detection
Connect the DC adapter voltage like aircraft power through a
resistor divider to DCSET to detect when DC power is
available, as shown in Figure 16. DCPRN is an open-drain
output and is high when DCSET is less than Vth,rise, and
active low when DCSET is above Vth,fall. Vth,rise and Vth,fall
are given by:
⎛ R 14
⎞
- + 1⎟ • V DCSET
V th, rise = ⎜ --------R
⎝ 15
⎠
⎛ R 14
⎞
V th, fall = ⎜ --------- + 1⎟ • V DCSET – I hys R 14
⎝ R 15
⎠
Where Ihys is the DCSET input bias current hysteresis and
VDCSET = 1.24V (min), 1.26V (typ) and 1.28V (max). The
hysteresis is IhysR14, where Ihys = 2.2µA (min), 3.4µA (typ)
and 4.4µA (max).
Current Measurement
Use ICM to monitor the input current being sensed across
CSIP and CSIN. The output voltage range is 0 to 2.5V. The
15
ICM = 19.9 • I INPUT • R 2
where IINPUT is the DC current drawn from the AC adapter.
ICM has ±3% accuracy. It is recommended to have an RC
filter at the ICM output for minimizing the switching noise.
VDD provides a 5.0V supply voltage from the internal LDO
regulator from DCIN and can deliver up to 30mA of current.
The MOSFET drivers are powered by VDDP, which must be
connected to VDDP as shown in Figure 15. VDDP connects
to VDD through an external low pass filter. Bypass VDDP
and VDD with a 1µF capacitor.
Shutdown
The ISL6255, ISL6255A features a low-power shutdown
mode. Driving EN low shuts down the ISL6255, ISL6255A. In
shutdown, the DC/DC converter is disabled, and VCOMP
and ICOMP are pulled to ground. The ICM, ACPRN and
DCPRN outputs continue to function.
EN can be driven by a thermistor to allow automatic
shutdown of the ISL6255, ISL6255A when the battery pack
is hot. Often a NTC thermistor is included inside the battery
pack to measure its temperature. When connected to the
charger, the thermistor forms a voltage divider with a
resistive pull-up to the VREF. The threshold voltage of EN is
1.0V with 60mV hysteresis. The thermistor can be selected
to have a resistance vs temperature characteristic that
abruptly decreases above a critical temperature. This
arrangement automatically shuts down the ISL6255,
ISL6255A when the battery pack is above a critical
temperature.
Another method for inhibiting charging is to force CHLIM
below 85mV (typ).
Supply Isolation
If the voltage across the adapter sense resistor R2 is
typically greater than 8mV, the P-channel MOSFET
controlled by SGATE is turned on reducing the power
dissipation. If the voltage across the adapter sense resistor
R2 is less than 3mV, SGATE turns off the P-channel
MOSFET isolating the adapter from the system bus.
Battery Power Source Selection and Aircraft
Power Application
The battery voltage is monitored by CSON. If the battery
voltage measured on CSON is less than the adapter voltage
measured on DCIN, then the P-channel MOSFET controlled by
BGATE turns off and the P-channel MOSFET controlled by
SGATE is allowed to turn on when the adapter current is high
enough. If it is greater, then the P-channel MOSFET controlled
by SGATE turns off and BGATE turns on the battery discharge
P-channel MOSFET to minimize the power loss. Also, the
FN9203.2
May 23, 2006
ISL6255, ISL6255A
charging function is disabled. If designing for airplane power,
DCSET is tied to a resistor divider sensing the adapter voltage.
When a user is plugged into the 15V airplane supply and the
battery voltage is lower than 15V, the MOSFET driven by
BGATE (See Figure 16) is turned off which keeps the battery
from supplying the system bus. The comparator looking at
CSON and DCIN has 300mV of hysteresis to avoid chattering.
Only 2S and 3S are supported for DC aircraft power
applications. For 4S battery packs, set DCSET = 0.
Short Circuit Protection and 0V Battery Charging
Since the battery charger will regulate the charge current to
the limit set by CHLIM, it automatically has short circuit
protection and is able to provide the charge current to wake
up an extremely discharged battery.
Over Temperature Protection
If the die temp exceeds 150°C, it stops charging. Once the
die temp drops below 125°C, charging will start up again.
Application Information
The following battery charger design refers to the typical
application circuit in Figure 15, where typical battery
configuration of 4S2P is used. This section describes how to
select the external components including the inductor, input
and output capacitors, switching MOSFETs, and current
sensing resistors.
Inductor Selection
The inductor selection has trade-offs between cost, size and
efficiency. For example, the lower the inductance, the
smaller the size, but ripple current is higher. This also results
in higher AC losses in the magnetic core and the windings,
which decrease the system efficiency. On the other hand,
the higher inductance results in lower ripple current and
smaller output filter capacitors, but it has higher DCR (DC
resistance of the inductor) loss, and has slower transient
response. So, the practical inductor design is based on the
inductor ripple current being ±(15-20)% of the maximum
operating DC current at maximum input voltage. The
required inductance can be calculated from:
L=
VIN ,MAX − VBAT
Δ IL
VBAT
VIN ,MAX fs
Where VIN,MAX, VBAT, and fs are the maximum input
voltage, battery voltage and switching frequency,
respectively. The inductor ripple current ΔI is found from:
Δ I L = 30% ⋅ I BAT,MAX
where the maximum peak-to-peak ripple current is 30% of
the maximum charge current is used.
For VIN,MAX = 19V, VBAT = 16.8V, IBAT,MAX = 2.6A, and
fs = 300kHz, the calculated inductance is 8.3µH. Choosing
the closest standard value gives L = 10µH. Ferrite cores are
often the best choice since they are optimized at 300kHz to
16
600kHz operation with low core loss. The core must be large
enough not to saturate at the peak inductor current IPeak:
I Peak = I BAT ,MAX +
1
Δ IL
2
Output Capacitor Selection
The output capacitor in parallel with the battery is used to
absorb the high frequency switching ripple current and
smooth the output voltage. The RMS value of the output
ripple current Irms is given by:
IRMS =
VIN ,MAX
12 L fs
D (1 − D )
where the duty cycle D is the ratio of the output voltage
(battery voltage) over the input voltage for continuous
conduction mode which is typical operation for the battery
charger. During the battery charge period, the output voltage
varies from its initial battery voltage to the rated battery
voltage. So, the duty cycle change can be in the range of
between 0.5 and 0.88 for the minimum battery voltage of
10V (2.5V/Cell) and the maximum battery voltage of 16.8V.
The maximum RMS value of the output ripple current occurs
at the duty cycle of 0.5 and is expressed as:
I RMS =
VIN ,MAX
4 12 L f s
For VIN,MAX = 19V, L = 10H, and fs = 300kHz, the maximum
RMS current is 0.46A. A typical 10µF ceramic capacitor is a
good choice to absorb this current and also has very small
size. The tantalum capacitor has a known failure mechanism
when subjected to high surge current.
EMI considerations usually make it desirable to minimize
ripple current in the battery leads. Beads may be added in
series with the battery pack to increase the battery
impedance at 300kHz switching frequency. Switching ripple
current splits between the battery and the output capacitor
depending on the ESR of the output capacitor and battery
impedance. If the ESR of the output capacitor is 10mΩ and
battery impedance is raised to 2Ω with a bead, then only
0.5% of the ripple current will flow in the battery.
MOSFET Selection
The Notebook battery charger synchronous buck converter
has the input voltage from the AC adapter output. The
maximum AC adapter output voltage does not exceed 25V.
Therefore, 30V logic MOSFET should be used.
The high side MOSFET must be able to dissipate the
conduction losses plus the switching losses. For the battery
charger application, the input voltage of the synchronous
buck converter is equal to the AC adapter output voltage,
which is relatively constant. The maximum efficiency is
achieved by selecting a high side MOSFET that has the
conduction losses equal to the switching losses. Ensure that
ISL6255, ISL6255A LGATE gate driver can supply sufficient
FN9203.2
May 23, 2006
ISL6255, ISL6255A
gate current to prevent it from conduction, which is due to
the injected current into the drain-to-source parasitic
capacitor (Miller capacitor Cgd), and caused by the voltage
rising rate at phase node at the time instant of the high-side
MOSFET turning on; otherwise, cross-conduction problems
may occur. Reasonably slowing turn-on speed of the highside MOSFET by connecting a resistor between the BOOT
pin and gate drive supply source, and the high sink current
capability of the low-side MOSFET gate driver help reduce
the possibility of cross-conduction.
For the high-side MOSFET, the worst-case conduction
losses occur at the minimum input voltage:
PQ1,Conduction =
VOUT 2
I BAT R DSON
VIN
The optimum efficiency occurs when the switching losses
equal the conduction losses. However, it is difficult to
calculate the switching losses in the high-side MOSFET
since it must allow for difficult-to-quantify factors that
influence the turn-on and turn-off times. These factors
include the MOSFET internal gate resistance, gate charge,
threshold voltage, stray inductance, pull-up and pull-down
resistance of the gate driver. The following switching loss
calculation provides a rough estimate.
PQ1,Switching
Qgd
Qgd
1
1
= VIN ILV fs
+ VIN ILP fs
+ QrrVIN fs
2
Ig ,source 2
Ig ,sin k
Where Qgd: drain-to-gate charge, Qrr: total reverse recovery
charge of the body-diode in low side MOSFET, ILV: inductor
valley current, ILP: Inductor peak current, Ig,sink and Ig,source
are the peak gate-drive source/sink current of Q1, respectively.
To achieve low switching losses, it requires low drain-to-gate
charge Qgd. Generally, the lower the drain-to-gate charge,
the higher the on-resistance. Therefore, there is a trade-off
between the on-resistance and drain-to-gate charge. Good
MOSFET selection is based on the Figure of Merit (FOM),
which is a product of the total gate charge and
on-resistance. Usually, the smaller the value of FOM, the
higher the efficiency for the same application.
For the low-side MOSFET, the worst-case power dissipation
occurs at minimum battery voltage and maximum input
voltage:
PQ2
⎛
V
= ⎜⎜1 − OUT
VIN
⎝
⎞ 2
⎟ I BAT R DSON
⎟
⎠
Choose a low-side MOSFET that has the lowest possible
on-resistance with a moderate-sized package like the SO-8
and is reasonably priced. The switching losses are not an
issue for the low side MOSFET because it operates at
zero-voltage-switching.
Choose a Schottky diode in parallel with low-side MOSFET
Q2 with a forward voltage drop low enough to prevent the
low-side MOSFET Q2 body-diode from turning on during the
17
dead time. This also reduces the power loss in the high-side
MOSFET associated with the reverse recovery of the
low-side MOSFET Q2 body diode.
As a general rule, select a diode with DC current rating equal
to one-third of the load current. One option is to choose a
combined MOSFET with the Schottky diode in a single
package. The integrated packages may work better in
practice because there is less stray inductance due to a
short connection. This Schottky diode is optional and may be
removed if efficiency loss can be tolerated. In addition,
ensure that the required total gate drive current for the
selected MOSFETs should be less than 24mA. So, the total
gate charge for the high-side and low-side MOSFETs is
limited by the following equation:
QGATE ≤
I GATE
fs
Where IGATE is the total gate drive current and should be
less than 24mA. Substituting IGATE = 24mA and fs = 300kHz
into the previous equation yields that the total gate charge
should be less than 80nC. Therefore, the ISL6255,
ISL6255A easily drives the battery charge current up to 8A.
Input Capacitor Selection
The input capacitor absorbs the ripple current from the
synchronous buck converter, which is given by:
Irms = IBAT
VOUT (VIN − VOUT )
VIN
This RMS ripple current must be smaller than the rated RMS
current in the capacitor datasheet. Non-tantalum chemistries
(ceramic, aluminum, or OSCON) are preferred due to their
resistance to power-up surge currents when the AC adapter
is plugged into the battery charger. For Notebook battery
charger applications, it is recommend that ceramic
capacitors or polymer capacitors from Sanyo be used due to
their small size and reasonable cost.
Table 2 shows the component lists for the typical application
circuit in Figure 15.
TABLE 2. COMPONENT LIST
PARTS
C1, C10
PART NUMBERS AND MANUFACTURER
10μF/25V ceramic capacitor, Taiyo Yuden
TMK325 MJ106MY X5R (3.2x2.5x1.9mm)
C2, C4, C8 0.1μF/50V ceramic capacitor
C3, C7, C9 1μF/10V ceramic capacitor, Taiyo Yuden
LMK212BJ105MG
C5
10nF ceramic capacitor
C6
6.8nF ceramic capacitor
C11
3300pF ceramic capacitor
D1
30V/3A Schottky diode, EC31QS03L (optional)
D2
100mA/30V Schottky Diode, Central Semiconductor
FN9203.2
May 23, 2006
ISL6255, ISL6255A
TABLE 2. COMPONENT LIST (Continued)
PARTS
L
Transfer function F2(S) from control to inductor current is:
PART NUMBERS AND MANUFACTURER
Vin
=
F2 (S ) =
Ro + RL S 2
d̂
î L
10μH/3.8A/26mΩ, Sumida, CDRH104R-100
Q1, Q2
30V/35mΩ, FDS6912A, Fairchild
Q3, Q4
-30V/30mΩ, SI4835BDY, Siliconix
Q5
Signal P-channel MOSFET, NDS352AP
Q6
Signal N-channel MOSFET, 2N7002
R1
40mΩ, ±1%, LRC-LR2512-01-R040-F, IRC
R2
20mΩ, ±1%, LRC-LR2010-01-R020-F, IRC
R3
18Ω, ±5%, (0805)
R4
2.2Ω, ±5%, (0805)
R5
100kΩ, ±5%, (0805)
R6
10k, ±5%, (0805)
R7
100Ω, ±5%, (0805)
R8, R11
130k, ±1%, (0805)
R9
10.2kΩ, ±1%, (0805)
R10
4.7Ω, ±5%, (0805)
R12
20kΩ, ±1%, (0805)
R13
1.87kΩ, ±1%, (0805)
1+
S
ωz
1
, where ω z ≈
.
S
R
+
+1
o Co
2
Q
ω
o p
ωo
Current loop gain Ti(S) is expressed as the following
equation:
T i ( S ) = 0.25 R T F 2 ( S )M
where RT is the trans-resistance in current loop. RT is
usually equal to the product of the charging current sensing
resistance and the gain of the current sense amplifier, CA2.
For ISL6255, ISL6255A, RT = 20R1.
The voltage gain with open current loop is:
T v ( S ) = KM F 1 ( S )A V ( S )
VFB
Where K =
, VFB is the feedback voltage of the voltage
Vo
error amplifier. The Voltage loop gain with current loop
closed is given by:
Lv ( S ) =
Tv (S )
1 + Ti (S )
If Ti(S)>>1, then it can be simplified as follows:
Loop Compensation Design
ωP
From the above equation, it is shown that the system is a
single order system, which has a single pole located at ω p
before the half switching frequency. Therefore, simple type II
compensator can be easily used to stabilize the system.
î in
v̂ in
+
ISL6255, ISL6255A uses a constant frequency current mode
control architecture to achieve fast loop transient response.
An accurate current sensing resistor in series with the output
inductor is used to regulate the charge current, and the
sensed current signal is injected into the voltage loop to
achieve current mode control to simplify the loop
compensation design. The inductor is not considered as a
state variable for current mode control and the system
becomes a single order system. It is much easier to design a
compensator to stabilize the voltage loop than voltage mode
control. Figure 17 shows the small signal model of the
synchronous buck regulator.
S1 + ----------ω esr
4 VF B ( RO + RL )
1
L V ( S ) = --------------- ------------------------------ ------------------------ A V ( S ), ω P ≈ ----------------RT
S
VO
CO
R
O
1 + -------
ILd̂
1:D
îL
L
v̂ o
Vind̂
+
PWM Comparator Gain Fm:
RT
The PWM comparator gain Fm for peak current mode
control is given by:
VCA2
11
M = --------- .
V IN
Rc
Ro
Co
Ti(S)
d̂
K
11/Vin
Power Stage Transfer Functions
Transfer function F1(S) from control to output voltage is:
v̂
F1 (S ) = o = Vin
d̂
S2
ω o2
Where ω esr =
1+
+
0.25VCA2 +
-
S
ω esr
v̂ comp
S
+1
ω oQ p
1
Co
, Q p ≈ Ro
, ωo =
Rc Co
L
18
Tv(S)
1
LC o
-Av(S)
FIGURE 17. SMALL SIGNAL MODEL OF SYNCHRONOUS
BUCK REGULATOR
FN9203.2
May 23, 2006
ISL6255, ISL6255A
PCB Layout Considerations
Vo
Power and Signal Layers Placement on the PCB
VFB
VREF
+
gm
VCOMP
As a general rule, power layers should be close together,
either on the top or bottom of the board, with signal layers on
the opposite side of the board. As an example, layer
arrangement on a 4-layer board is shown below:
R1
C1
1. Top Layer: signal lines, or half board for signal lines and
the other half board for power lines
2. Signal Ground
3. Power Layers: Power Ground
FIGURE 18. VOLTAGE LOOP COMPENSATOR
Figure 17 shows the voltage loop compensator, and its
transfer function is expressed as follows:
Av (S ) =
v̂ comp
v̂ FB
where ω cz =
1+
= gm
S
ω cz
SC1
4. Bottom Layer: Power MOSFET, Inductors and other
Power traces
Separate the power voltage and current flowing path from
the control and logic level signal path. The controller IC will
stay on the signal layer, which is isolated by the signal
ground to the power signal traces.
Component Placement
1
R1C1
The power MOSFET should be close to the IC so that the
gate drive signal, the LGATE, UGATE, PHASE, and BOOT,
traces can be short.
Compensator design goal:
• High DC gain
1 ⎞
⎛1
−
⎟ fs
⎝ 5 20 ⎠
• Gain margin: >10dB
Place the components in such a way that the area under the
IC has less noise traces with high dv/dt and di/dt, such as
gate signals and phase node signals.
• Phase margin: 40°
Signal Ground and Power Ground Connection
The compensator design procedure is as follows:
At minimum, a reasonably large area of copper, which will
shield other noise couplings through the IC, should be used
as signal ground beneath the IC. The best tie-point between
the signal ground and the power ground is at the negative
side of the output capacitor on each side, where there is little
noise; a noisy trace beneath the IC is not recommended.
• Loop bandwidth fc: ⎜
1. Put compensator zero at
ωcz = (1 − 3 )
1
RoCo
2. Put one compensator pole at zero frequency to achieve
high DC gain, and put another compensator pole at either
esr zero frequency or half switching frequency, whichever
is lower.
The loop gain Tv(S) at cross over frequency of fc has unity
gain. Therefore, the compensator resistance R1 is
determined by:
2π fcVo C o RT
8
R1 =
11 g mVFB
where gm is the trans-conductance of the voltage loop error
amplifier. Compensator capacitor C1 is then given by:
C1 =
1
R1 ω cz
GND and VDD Pin
At least one high quality ceramic decoupling cap should be
used to cross these two pins. The decoupling cap can be put
close to the IC.
LGATE Pin
This is the gate drive signal for the bottom MOSFET of the
buck converter. The signal going through this trace has both
high dv/dt and high di/dt, and the peak charging and
discharging current is very high. These two traces should be
short, wide, and away from other traces. There should be no
other traces in parallel with these traces on any layer.
PGND Pin
Example: Vin = 20V, Vo = 16.8V, Io = 2.6A, fs = 300kHz,
Co = 10μF/10mΩ, L = 10μH, gm = 250μs, RT = 0.8Ω,
VFB = 2.1V, fc = 20kHz, then compensator resistance
R1 = 10kΩ. Put the compensator zero at 1.5kHz. The
compensator capacitor is C1 = 6.5nF. Therefore, choose
voltage loop compensator: R1 = 10k, C1 = 6.5nF.
19
PGND pin should be laid out to the negative side of the
relevant output cap with separate traces.The negative side
of the output capacitor must be close to the source node of
the bottom MOSFET. This trace is the return path of LGATE.
FN9203.2
May 23, 2006
ISL6255, ISL6255A
PHASE Pin
DCIN Pin
This trace should be short, and positioned away from other
weak signal traces. This node has a very high dv/dt with a
voltage swing from the input voltage to ground. No trace
should be in parallel with it. This trace is also the return path
for UGATE. Connect this pin to the high-side MOSFET
source.
This pin connects to AC adapter output voltage, and should
be less noise sensitive.
UGATE Pin
This pin has a square shape waveform with high dv/dt. It
provides the gate drive current to charge and discharge the
top MOSFET with high di/dt. This trace should be wide,
short, and away from other traces similar to the LGATE.
BOOT Pin
This pin’s di/dt is as high as the UGATE; therefore, this trace
should be as short as possible.
CSOP, CSON Pins
The current sense resistor connects to the CSON and the
CSOP pins through a low pass filter. The CSON pin is also
used as the battery voltage feedback. The traces should be
away from the high dv/dt and di/di pins like PHASE, BOOT
pins. In general, the current sense resistor should be close
to the IC. Other layout arrangements should be adjusted
accordingly.
Copper Size for the Phase Node
The capacitance of PHASE should be kept very low to
minimize ringing. It would be best to limit the size of the
PHASE node copper in strict accordance with the current
and thermal management of the application.
Identify the Power and Signal Ground
The input and output capacitors of the converters, the source
terminal of the bottom switching MOSFET PGND should
connect to the power ground. The other components should
connect to signal ground. Signal and power ground are tied
together at one point.
Clamping Capacitor for Switching MOSFET
It is recommended that ceramic caps be used closely
connected to the drain of the high-side MOSFET, and the
source of the low-side MOSFET. This capacitor reduces the
noise and the power loss of the MOSFET.
EN Pin
This pin stays high at enable mode and low at idle mode and
is relatively robust. Enable signals should refer to the signal
ground.
20
FN9203.2
May 23, 2006
ISL6255, ISL6255A
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
2X
9
MILLIMETERS
D/2
D1
D1/2
2X
N
6
INDEX
AREA
0.15 C B
1
2
3
E1/2
E1
E
9
0.15 C A
4X
A1
-
0.02
0.05
-
A2
-
0.65
1.00
9
0.30
5,8
A3
0.20 REF
0.18
9
0.25
D
5.00 BSC
-
D1
4.75 BSC
9
2.95
3.10
-
4.75 BSC
2.95
3.10
9
3.25
7,8
0.50 BSC
-
k
0.20
-
-
-
L
0.50
0.60
0.75
8
N
28
2
0
7
3
Ne
7
3
8
P
-
-
0.60
9
NX k
θ
-
-
12
9
7
Rev. 1 11/04
1
(DATUM A)
NOTES:
2
3
6
INDEX
AREA
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
(Ne-1)Xe
REF.
E2
2. N is the number of terminals.
7
E2/2
NX L
N e
3. Nd and Ne refer to the number of terminals on each D and E.
8
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
9
CORNER
OPTION 4X
(Nd-1)Xe
REF.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
BOTTOM VIEW
A1
NX b
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
5
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
SECTION "C-C"
9. Features and dimensions A2, A3, D1, E1, P & θ are present when
Anvil singulation method is used and not present for saw
singulation.
C
L
L1
7,8
Nd
D2
2 N
C
L
3.25
5.00 BSC
4X P
8
9
0.10 M C A B
D2
(DATUM B)
A1
5
4X P
-
e
/ / 0.10 C
0.08 C
NX b
NOTES
1.00
E2
A
A3
MAX
0.90
E1
A2
SIDE VIEW
NOMINAL
0.80
E
B
C
SEATING PLANE
MIN
A
D2
0.15 C B
TOP VIEW
SYMBOL
b
E/2
2X
2X
28 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220VHHD-1 ISSUE I)
0.15 C A
D
A
L28.5x5
10
L
L1
e
10
L
e
C C
TERMINAL TIP
FOR ODD TERMINAL/SIDE
FOR EVEN TERMINAL/SIDE
21
FN9203.2
May 23, 2006
ISL6255, ISL6255A
Shrink Small Outline Plastic Packages (SSOP)
Quarter Size Outline Plastic Packages (QSOP)
M28.15
N
INDEX
AREA
H
0.25(0.010) M
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
(0.150” WIDE BODY)
B M
E
1
2
INCHES
GAUGE
PLANE
-B-
SYMBOL
3
L
0.25
0.010
SEATING PLANE
-A-
A
D
h x 45°
-C-
α
e
A2
A1
B
C
0.10(0.004)
MIN
MAX
MILLIMETERS
MIN
MAX
NOTES
A
0.053
0.069
1.35
1.75
-
A1
0.004
0.010
0.10
0.25
-
A2
-
0.061
-
1.54
-
B
0.008
0.012
0.20
0.30
9
C
0.007
0.010
0.18
0.25
-
D
0.386
0.394
9.81
10.00
3
E
0.150
0.157
3.81
3.98
4
e
0.025 BSC
0.635 BSC
-
H
0.228
0.244
5.80
6.19
-
h
0.0099
0.0196
0.26
0.49
5
NOTES:
L
0.016
0.050
0.41
1.27
6
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch)
per side.
5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.10mm (0.004 inch) total in excess of “B”
dimension at maximum material condition.
10. Controlling dimension: INCHES. Converted millimeter dimensions
are not necessarily exact.
N
0.17(0.007) M
C A M
B S
α
28
0°
28
8°
0°
7
8°
Rev. 1 6/04
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
22
FN9203.2
May 23, 2006