TI1 CC430F6145IRGCR Msp430 soc with rf core Datasheet

ECCN 5E002 TSPA - Technology / Software Publicly Available
CC430F614x
CC430F514x
CC430F512x
www.ti.com
SLAS555 – JUNE 2012
MSP430 SoC With RF Core
FEATURES
1
•
23
•
•
•
True System-on-Chip (SoC) for Low-Power
Wireless Communication Applications
Wide Supply Voltage Range: 1.8 V to 3.6 V
Ultralow Power Consumption:
– CPU Active Mode (AM): 160 µA/MHz
– Standby Mode (LPM3 RTC Mode): 2.0 µA
– Off Mode (LPM4 RAM Retention): 1.0 µA
– RTC Only Mode (LPM3.5): 1.0 µA
– Shutdown Mode (LPM4.5): 0.3 µA
– Radio in RX: 15 mA, 250 kbps, 915 MHz
MSP430™ System and Peripherals
– 16-Bit RISC Architecture, Extended
Memory, up to 20-MHz System Clock
– Wake-Up From Standby Mode in Less
Than 6 µs
– Flexible Power Management System With
SVS and Brownout
– Unified Clock System With FLL
– 16-Bit Timer TA0, Timer_A With Five
Capture/Compare Registers
– 16-Bit Timer TA1, Timer_A With Three
Capture/Compare Registers
– Hardware Real-Time Clock
– Two Universal Serial Communication
Interfaces
– USCI_A0 Supports UART, IrDA, SPI
– USCI_B0 Supports I2C™, SPI
– 10-Bit A/D Converter With Internal
Reference, Sample-and-Hold, and Autoscan
Features (Only CC430F614x and
CC430F514x)
– Comparator
– Integrated LCD Driver With Contrast
Control for up to 96 Segments (Only
CC430F614x)
– 128-Bit AES Security Encryption and
Decryption Coprocessor
– 32-Bit Hardware Multiplier
– Three-Channel Internal DMA
– Serial Onboard Programming, No External
Programming Voltage Needed
•
•
•
– Embedded Emulation Module (EEM)
High-Performance Sub-1-GHz RF Transceiver
Core
– Same as in CC1101
– Wide Supply Voltage Range: 2.0 V to 3.6 V
– Frequency Bands: 300 MHz to 348 MHz,
389 MHz to 464 MHz, and 779 MHz to
928 MHz
– Programmable Data Rate From 0.6 kBaud
to 500 kBaud
– High Sensitivity (-117 dBm at 0.6 kBaud,
‑111 dBm at 1.2 kBaud, 315 MHz, 1% Packet
Error Rate)
– Excellent Receiver Selectivity and Blocking
Performance
– Programmable Output Power Up to
+12 dBm for All Supported Frequencies
– 2-FSK, 2-GFSK, and MSK Supported as well
as OOK and Flexible ASK Shaping
– Flexible Support for Packet-Oriented
Systems: On-Chip Support for Sync Word
Detection, Address Check, Flexible Packet
Length, and Automatic CRC Handling
– Support for Automatic Clear Channel
Assessment (CCA) Before Transmitting (for
Listen-Before-Talk Systems)
– Digital RSSI Output
– Suited for Systems Targeting Compliance
With EN 300 220 (Europe) and
FCC CFR Part 15 (US)
– Suited for Systems Targeting Compliance
With Wireless M-Bus Standard
EN 13757‑‑4:2005
– Support for Asynchronous and
Synchronous Serial Receive/Transmit Mode
for Backward Compatibility With Existing
Radio Communication Protocols
Family Members Summarized in Table 1
For Complete Module Descriptions, See the
CC430 Family User's Guide (SLAU259)
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MSP430 is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
ECCN 5E002 TSPA - Technology / Software Publicly Available
CC430F614x
CC430F514x
CC430F512x
SLAS555 – JUNE 2012
www.ti.com
DESCRIPTION
The Texas Instruments CC430 family of ultralow-power microcontroller system-on-chip with integrated RF
transceiver cores consists of several devices featuring different sets of peripherals targeted for a wide range of
applications. The architecture, combined with seven low-power modes (including LPM3.5 and LMP4.5), is
optimized to achieve extended battery life in portable measurement applications. The device features the
powerful MSP430™ 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code
efficiency.
The CC430 family provides a tight integration between the microcontroller core, its peripherals, software, and the
RF transceiver, making these true system-on-chip solutions easy to use as well as improving performance.
The CC430F614x series are microcontroller system-on-chip configurations combining the excellent performance
of the state-of-the-art CC1101 sub-1-GHz RF transceiver with the MSP430 CPUXV2, up to 32 kB of in-system
programmable flash memory, up to 4 kB of RAM, two 16-bit timers, a high-performance 10-bit A/D converter with
eight external inputs plus internal temperature and battery sensors, comparator, universal serial communication
interfaces (USCIs), 128-bit AES security accelerator, hardware multiplier, DMA, real-time clock module with
alarm capabilities, LCD driver, and up to 44 I/O pins.
The CC430F514x and CC430F512x series are microcontroller system-on-chip configurations combining the
excellent performance of the state-of-the-art CC1101 sub-1-GHz RF transceiver with the MSP430 CPUXV2, up
to 32 kB of in-system programmable flash memory, up to 4 kB of RAM, two 16-bit timers, a high performance 10bit A/D converter with six external inputs plus internal temperature and battery sensors on CC430F514x devices,
comparator, universal serial communication interfaces (USCI), 128-bit AES security accelerator, hardware
multiplier, DMA, real-time clock module with alarm capabilities, and up to 30 I/O pins.
Typical applications for these devices include wireless analog and digital sensor systems, heat cost allocators,
thermostats, metering (AMR, AMI), smart grid wireless networks etc.
Family members available are summarized in Table 1.
For complete module descriptions, see the CC430 Family User's Guide (SLAU259).
Table 1. Family Members
USCI
Channel
B:
SPI, I2C
ADC10_A (2)
Comp_B
I/O
Package
Device
Program
(KB)
SRAM
(KB)
Timer_A (1)
LCD_B (2)
CC430F6147
32
4
5, 3
96 seg
1
1
8 ext,
4 int ch.
8 ch.
44
64 RGC
CC430F6145
16
2
5, 3
96 seg
1
1
8 ext,
4 int ch.
8 ch.
44
64 RGC
CC430F6143
8
2
5, 3
96 seg
1
1
8 ext,
4 int ch.
8 ch.
44
64 RGC
CC430F5147
32
4
5, 3
n/a
1
1
6 ext,
4 int ch.
6 ch.
30
48 RGZ
CC430F5145
16
2
5, 3
n/a
1
1
6 ext,
4 int ch.
6 ch.
30
48 RGZ
CC430F5143
8
2
5, 3
n/a
1
1
6 ext,
4 int ch.
6 ch.
30
48 RGZ
CC430F5125
16
2
5, 3
n/a
1
1
n/a
6 ch.
30
48 RGZ
CC430F5123
8
2
5, 3
n/a
1
1
n/a
6 ch.
30
48 RGZ
(1)
(2)
2
Channel
A:
UART,
LIN, IrDA,
SPI
Each number in the sequence represents an instantiation of Timer_A with its associated number of capture compare registers and PWM
output generators available. For example, a number sequence of 5, 3 would represent two instantiations of Timer_A, the first
instantiation having 5 and the second instantiation having 3 capture compare registers and PWM output generators, respectively.
n/a = not available
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CC430F614x
CC430F514x
CC430F512x
SLAS555 – JUNE 2012
Table 2. Ordering Information (1)
TA
-40°C to 85°C
PACKAGED DEVICES (2)
PLASTIC 64-PIN QFN (RGC)
PLASTIC 48-PIN QFN (RGZ)
CC430F6147IRGC
CC430F5147IRGZ
CC430F6145IRGC
CC430F5145IRGZ
CC430F6143IRGC
CC430F5143IRGZ
CC430F5125IRGZ
CC430F5123IRGZ
(1)
(2)
For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Copyright © 2012, Texas Instruments Incorporated
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CC430F614x
CC430F514x
CC430F512x
SLAS555 – JUNE 2012
www.ti.com
CC430F614x Functional Block Diagram
XIN XOUT
(32kHz)
P1.x/P2.x
2x8
REF
MCLK
Unified
Clock
System
ACLK
Comp_B
ADC10
SMCLK
DMA
Controller
3 Channel
Bus
Cntrl
Logic
MAB
Voltage
Reference
incl.
REFOUT
P3.x/P4.x
2x8
I/O Ports
P1/P2
2x8 I/Os
I/O Ports
P3/P4
2x8 I/Os
PA
1x16 I/Os
PB
1x16 I/Os
P5.x
1x8
I/O Ports
P5
1x8 I/Os
MDB
Sub-1GHz
Radio
(CC1101)
MDB
Flash
32kB
16kB
8kB
EEM
(S: 3+1)
SYS
RAM
4kB
2kB
incl.
Backup
RAM
(128B)
CRC16
Watchdog
CPU Interface
MPY32
Port
Mapping
Controller
MODEM
MDB
Spy-BiWire
Packet
Handler
Digital RSSI
Carrier Sense
PQI / LQI
CCA
MAB
CPUXV2
incl. 16
Registers
JTAG
Interface
RF_XIN RF_XOUT
(26MHz)
MAB
Frequency
Synthesizer
Power
Mgmt
LDO
SVM/SVS
Brownout
RTC_D
TA0
(Calendar
+
Counter
Mode)
5 CC
Registers
TA1
3 CC
Registers
USCI_A0
(UART,
IrDA, SPI)
USCI_B0
(SPI, I2C)
LCD_B
96
Segments
1,2,3,4
Mux
AES128
Security
En-/Decryption
RF/ANALOG
TX & RX
LPM3.5
Domain
RF_P
RF_N
NOTE: Edge-selectable interrupt and LPM3.5 and LPM4.5 wake-up input capability is available for ports P1 and P2.
4
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CC430F614x
CC430F514x
CC430F512x
www.ti.com
SLAS555 – JUNE 2012
P2.0/PM_CBOUT1/PM_TA1CLK/CB0/A0
P2.1/PM_TA1CCR0A/CB1/A1
P2.2/PM_TA1CCR1A/CB2/A2
P2.3/PM_TA1CCR2A/CB3/A3
P2.4/PM_RTCCLK/CB4/A4/VeREFP2.5/PM_SVMOUT/CB5/A5/VREF+/VeREF+
P2.6/PM_ACLK/CB6/A6
P2.7/PM_ADC10CLK/PM_DMAE0/CB7/A7
AVCC
P5.0/XIN
P5.1/XOUT
AVSS
DVCC
RST/NMI/SBWTDIO
TEST/SBWTCK
PJ.3/TCK
RGC PACKAGE
(TOP VIEW)
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
1
2
47
3
46
4
45
5
44
6
43
7
42
8
9
CC430F614x
41
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
P3.7/PM_SMCLK/S17
P3.6/PM_RFGDO1/S16
P3.5/PM_TA0CCR4A/S15
P3.4/PM_TA0CCR3A/S14
P3.3/PM_TA0CCR2A/S13
P3.2/PM_TA0CCR1A/S12
P3.1/PM_TA0CCR0A/S11
P3.0/PM_CBOUT0/PM_TA0CLK/S10
DVCC
P4.7/S9
P4.6/S8
P4.5/S7
P4.4/S6
P4.3/S5
P4.2/S4
P4.1/S3
P1.7/PM_UCA0CLK/PM_UCB0STE/R03
P1.6/PM_UCA0TXD/PM_UCA0SIMO/R13/LCDREF
P1.5/PM_UCA0RXD/PM_UCA0SOMI/R23
LCDCAP/R33
COM0
P5.7/COM1/S26
P5.6/COM2/S25
P5.5/COM3/S24
P5.4/S23
VCORE
DVCC
P1.4/PM_UCB0CLK/PM_UCA0STE/S22
P1.3/PM_UCB0SIMO/PM_UCB0SDA/S21
P1.2/PM_UCB0SOMI/PM_UCB0SCL/S20
P1.1/PM_RFGDO2/S19
P1.0/PM_RFGDO0/S18
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
GUARD
R_BIAS
AVCC_RF
AVCC_RF
RF_N
RF_P
AVCC_RF
AVCC_RF
RF_XOUT
RF_XIN
P5.2/S0
P5.3/S1
P4.0/S2
VSS
Exposed die
attached pad
NOTE: The secondary digital functions on ports P1, P2, and P3 are fully mappable. Pinout shows only the default mapping.
See Table 10 for details.
CAUTION: LCDCAP/R33 must be connected to VSS if not used.
Copyright © 2012, Texas Instruments Incorporated
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ECCN 5E002 TSPA - Technology / Software Publicly Available
CC430F614x
CC430F514x
CC430F512x
SLAS555 – JUNE 2012
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CC430F514x Functional Block Diagram
XIN XOUT
(32kHz)
P1.x/P2.x
2x8
REF
MCLK
Unified
Clock
System
ACLK
Comp_B
ADC10
SMCLK
DMA
Controller
3 Channel
Bus
Cntrl
Logic
MAB
Voltage
Reference
incl.
REFOUT
I/O Ports
P1/P2
2x8 I/Os
P3.x
P5.x
1x8
I/O Ports
P3
1x8 I/Os
1x2
I/O Ports
P5
1x2 I/Os
PA
1x16 I/Os
MDB
Sub-1GHz
Radio
(CC1101)
MDB
Flash
32kB
16kB
8kB
EEM
(S: 3+1)
SYS
RAM
4kB
2kB
incl.
Backup
RAM
(128B)
CRC16
Watchdog
CPU Interface
MPY32
Port
Mapping
Controller
MODEM
MDB
Spy-BiWire
Packet
Handler
Digital RSSI
Carrier Sense
PQI / LQI
CCA
MAB
CPUXV2
incl. 16
Registers
JTAG
Interface
RF_XIN RF_XOUT
(26MHz)
MAB
Frequency
Synthesizer
Power
Mgmt
LDO
SVM/SVS
Brownout
RTC_D
(Calendar
+
Counter
Mode)
TA0
TA1
5 CC
Registers
3 CC
Registers
USCI_A0
(UART,
IrDA, SPI)
USCI_B0
(SPI, I2C)
AES128
Security
En-/Decryption
RF/ANALOG
TX & RX
LPM3.5
Domain
RF_P
RF_N
NOTE: Edge-selectable interrupt and LPM3.5 and LPM4.5 wake-up input capability is available for ports P1 and P2.
6
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CC430F614x
CC430F514x
CC430F512x
P2.2/PM_TA1CCR1A/CB2/A2
P2.1/PM_TA1CCR0A/CB1/A1
PJ.3/TCK
PJ.2/TMS
TEST/SBWTCK
RST/NMI/SBWTDIO
AVSS
DVCC
P5.0/XIN
P5.1/XOUT
RGZ PACKAGE
(TOP VIEW)
AVCC
P2.5/PM_SVMOUT/CB5/A5/VREF+/VeREF+
P2.4/PM_RTCCLK/CB4/A4/VeREF-
SLAS555 – JUNE 2012
P2.3/PM_TA1CCR2A/CB3/A3
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1
48 47 46 45 44 43 42 41 40 39 38 37
36
2
35
PJ.0/TDO
PJ.1/TDI/TCLK
P2.0/PM_CBOUT1/PM_TA1CLK/CB0/A0
3
34
GUARD
P1.7/PM_UCA0CLK/PM_UCB0STE
4
33
R_BIAS
P1.6/PM_UCA0TXD/PM_UCA0SIMO
5
32
AVCC_RF
P1.5/PM_UCA0RXD/PM_UCA0SOMI
6
31
AVCC_RF
VCORE
7
30
RF_N
CC430F514x
DVCC
8
29
RF_P
P1.4/PM_UCB0CLK/PM_UCA0STE
9
28
AVCC_RF
P1.3/PM_UCB0SIMO/PM_UCB0SDA
10
27
AVCC_RF
P1.2/PM_UCB0SOMI/PM_UCB0SCL
11
26
RF_XOUT
P2.6/PM_ACLK
P2.7/PM_ADC10CLK/PM_DMAE0
DVCC
P3.0/PM_CBOUT0/PM_TA0CLK
P3.1/PM_TA0CCR0A
P3.2/PM_TA0CCR1A
P3.4/PM_TA0CCR3A
P3.3/PM_TA0CCR2A
P3.5/PM_TA0CCR4A
P3.7/PM_SMCLK
P3.6/PM_RFGDO1
25
12
13 14 15 16 17 18 19 20 21 22 23 24
P1.0/PM_RFGDO0
P1.1/PM_RFGDO2
RF_XIN
VSS
Exposed die
attached pad
NOTE: The secondary digital functions on ports P1, P2, and P3 are fully mappable. Pinout shows only the default mapping.
See Table 10 for details.
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ECCN 5E002 TSPA - Technology / Software Publicly Available
CC430F614x
CC430F514x
CC430F512x
SLAS555 – JUNE 2012
www.ti.com
CC430F512x Functional Block Diagram
XIN XOUT
(32kHz)
MCLK
Unified
Clock
System
P1.x/P2.x
2x8
REF
ACLK
Comp_B
Voltage
Reference
SMCLK
DMA
Controller
3 Channel
Bus
Cntrl
Logic
MAB
I/O Ports
P1/P2
2x8 I/Os
P3.x
P5.x
1x8
I/O Ports
P3
1x8 I/Os
1x2
I/O Ports
P5
1x2 I/Os
PA
1x16 I/Os
MDB
Sub-1GHz
Radio
(CC1101)
MDB
Flash
32kB
16kB
8kB
EEM
(S: 3+1)
SYS
RAM
4kB
2kB
incl.
Backup
RAM
(128B)
CRC16
Watchdog
CPU Interface
MPY32
Port
Mapping
Controller
MODEM
MDB
Spy-BiWire
Packet
Handler
Digital RSSI
Carrier Sense
PQI / LQI
CCA
MAB
CPUXV2
incl. 16
Registers
JTAG
Interface
RF_XIN RF_XOUT
(26MHz)
MAB
Frequency
Synthesizer
Power
Mgmt
LDO
SVM/SVS
Brownout
RTC_D
(Calendar
+
Counter
Mode)
TA0
TA1
5 CC
Registers
3 CC
Registers
USCI_A0
(UART,
IrDA, SPI)
USCI_B0
(SPI, I2C)
AES128
Security
En-/Decryption
RF/ANALOG
TX & RX
LPM3.5
Domain
RF_P
RF_N
NOTE: Edge-selectable interrupt and LPM3.5 and LPM4.5 wake-up input capability is available for ports P1 and P2.
8
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ECCN 5E002 TSPA - Technology / Software Publicly Available
CC430F614x
CC430F514x
CC430F512x
www.ti.com
SLAS555 – JUNE 2012
P2.2/PM_TA1CCR1A/CB2
P2.1/PM_TA1CCR0A/CB1
PJ.2/TMS
TEST/SBWTCK
PJ.3/TCK
RST/NMI/SBWTDIO
AVSS
DVCC
P5.0/XIN
P5.1/XOUT
P2.5/PM_SVMOUT/CB5
AVCC
P2.4/PM_RTCCLK/CB4
P2.3/PM_TA1CCR2A/CB3
RGZ PACKAGE
(TOP VIEW)
1
48 47 46 45 44 43 42 41 40 39 38 37
36
2
35
PJ.0/TDO
PJ.1/TDI/TCLK
P2.0/PM_CBOUT1/PM_TA1CLK/CB0
3
34
GUARD
P1.7/PM_UCA0CLK/PM_UCB0STE
4
33
R_BIAS
P1.6/PM_UCA0TXD/PM_UCA0SIMO
5
32
AVCC_RF
P1.5/PM_UCA0RXD/PM_UCA0SOMI
6
31
AVCC_RF
VCORE
7
30
RF_N
DVCC
8
29
RF_P
P1.4/PM_UCB0CLK/PM_UCA0STE
9
28
AVCC_RF
P1.3/PM_UCB0SIMO/PM_UCB0SDA
10
27
AVCC_RF
P1.2/PM_UCB0SOMI/PM_UCB0SCL
11
26
RF_XOUT
P2.6/PM_ACLK
DVCC
P2.7/PM_DMAE0
P3.1/PM_TA0CCR0A
P3.0/PM_CBOUT0/PM_TA0CLK
P3.2/PM_TA0CCR1A
P3.4/PM_TA0CCR3A
P3.3/PM_TA0CCR2A
P3.6/PM_RFGDO1
P3.5/PM_TA0CCR4A
P3.7/PM_SMCLK
25
12
13 14 15 16 17 18 19 20 21 22 23 24
P1.0/PM_RFGDO0
P1.1/PM_RFGDO2
CC430F512x
RF_XIN
VSS
Exposed die
attached pad
NOTE: The secondary digital functions on ports P1, P2, and P3 are fully mappable. Pinout shows only the default mapping.
See Table 10 for details.
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CC430F614x
CC430F514x
CC430F512x
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Table 3. CC430F614x Terminal Functions
TERMINAL
NAME
P1.7/ PM_UCA0CLK/
PM_UCB0STE/ R03
NO.
1
I/O (1)
DESCRIPTION
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_A0 clock input/output; USCI_B0 SPI slave transmit enable
Input/output port of lowest analog LCD voltage (V5)
P1.6/ PM_UCA0TXD/
PM_UCA0SIMO/ R13/ LCDREF
2
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_A0 UART transmit data; USCI_A0 SPI slave in master out
Input/output port of third most positive analog LCD voltage (V3 or V4)
External reference voltage input for regulated LCD voltage
P1.5/ PM_UCA0RXD/
PM_UCA0SOMI/ R23
3
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_A0 UART receive data; USCI_A0 SPI slave out master in
Input/output port of second most positive analog LCD voltage (V2)
LCDCAP/ R33
4
I/O
LCD capacitor connection
Input/output port of most positive analog LCD voltage (V1)
CAUTION: Must be connected to VSS if not used.
COM0
5
O
LCD common output COM0 for LCD backplane
P5.7/ COM1/ S26
6
I/O
General-purpose digital I/O
LCD common output COM1 for LCD backplane
LCD segment output S26
P5.6/ COM2/ S25
7
I/O
General-purpose digital I/O
LCD common output COM2 for LCD backplane
LCD segment output S25
P5.5/ COM3/ S24
8
I/O
General-purpose digital I/O
LCD common output COM3 for LCD backplane
LCD segment output S24
P5.4/ S23
9
I/O
General-purpose digital I/O
LCD segment output S23
VCORE
10
Regulated core power supply
DVCC
11
Digital power supply
P1.4/ PM_UCB0CLK/
PM_UCA0STE/ S22
12
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_B0 clock input/output; USCI_A0 SPI slave transmit enable
LCD segment output S22
P1.3/ PM_UCB0SIMO/
PM_UCB0SDA/ S21
13
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_B0 SPI slave in master out; USCI_B0 I2C data
LCD segment output S21
P1.2/ PM_UCB0SOMI/
PM_UCB0SCL/ S20
14
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_B0 SPI slave out master in; UCSI_B0 I2C clock
LCD segment output S20
P1.1/ PM_RFGDO2/ S19
15
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: Radio GDO2 output
LCD segment output S19
P1.0/ PM_RFGDO0/ S18
16
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: Radio GDO0 output
LCD segment output S18
P3.7/ PM_SMCLK/ S17
17
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: SMCLK output
LCD segment output S17
P3.6/ PM_RFGDO1/ S16
18
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: Radio GDO1 output
LCD segment output S16
P3.5/ PM_TA0CCR4A/ S15
19
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: TA0 CCR4 compare output, capture input
LCD segment output S15
P3.4/ PM_TA0CCR3A/ S14
20
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: TA0 CCR3 compare output, capture input
LCD segment output S14
P3.3/ PM_TA0CCR2A/ S13
21
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: TA0 CCR2 compare output, capture input
LCD segment output S13
(1)
10
I = input, O = output
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Table 3. CC430F614x Terminal Functions (continued)
TERMINAL
NAME
NO.
I/O (1)
DESCRIPTION
P3.2/ PM_TA0CCR1A/ S12
22
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: TA0 CCR1 compare output, capture input
LCD segment output S12
P3.1/ PM_TA0CCR0A/ S11
23
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: TA0 CCR0 compare output, capture input
LCD segment output S11
P3.0/ PM_CBOUT0/ PM_TA0CLK/
S10
24
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: Comparator_B output; TA0 clock input
LCD segment output S10
DVCC
25
P4.7/ S9
26
I/O
General-purpose digital I/O
LCD segment output S9
P4.6/ S8
27
I/O
General-purpose digital I/O
LCD segment output S8
P4.5/ S7
28
I/O
General-purpose digital I/O
LCD segment output S7
P4.4/ S6
29
I/O
General-purpose digital I/O
LCD segment output S6
P4.3/ S5
30
I/O
General-purpose digital I/O
LCD segment output S5
P4.2/ S4
31
I/O
General-purpose digital I/O
LCD segment output S4
P4.1/ S3
32
I/O
General-purpose digital I/O
LCD segment output S3
P4.0/ S2
33
I/O
General-purpose digital I/O
LCD segment output S2
P5.3/ S1
34
I/O
General-purpose digital I/O
LCD segment output S1
P5.2/ S0
35
I/O
General-purpose digital I/O
LCD segment output S0
RF_XIN
36
I
Input terminal for RF crystal oscillator or external clock input
RF_XOUT
37
O
Output terminal for RF crystal oscillator
AVCC_RF
38
AVCC_RF
39
Digital power supply
Radio analog power supply
Radio analog power supply
RF_P
40
RF
I/O
RF_N
41
RF
I/O
AVCC_RF
42
Radio analog power supply
AVCC_RF
43
Radio analog power supply
RBIAS
44
External bias resistor for radio reference current
GUARD
45
Power supply connection for digital noise isolation
PJ.0/ TDO
46
I/O
General-purpose digital I/O
Test data output port
PJ.1/ TDI/ TCLK
47
I/O
General-purpose digital I/O
Test data input or test clock input
PJ.2/ TMS
48
I/O
General-purpose digital I/O
Test mode select
PJ.3/ TCK
49
I/O
General-purpose digital I/O
Test clock
TEST/ SBWTCK
50
I
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Positive RF input to LNA in receive mode
Positive RF output from PA in transmit mode
Negative RF input to LNA in receive mode
Negative RF output from PA in transmit mode
Test mode pin - select digital I/O on JTAG pins
Spy-bi-wire input clock
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Table 3. CC430F614x Terminal Functions (continued)
TERMINAL
NAME
NO.
I/O (1)
Reset input active low
Non-maskable interrupt input
Spy-bi-wire data input/output
RST/NMI/ SBWTDIO
51
DVCC
52
Digital power supply
AVSS
53
Analog ground supply for ADC10
P5.1/ XOUT
54
I/O
General-purpose digital I/O
Output terminal of crystal oscillator XT1
P5.0/ XIN
55
I/O
General-purpose digital I/O
Input terminal for crystal oscillator XT1
AVCC
56
P2.7/ PM_ADC10CLK/
PM_DMAE0/ CB7 (/A7)
57
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: ADC10CLK output; DMA external trigger input
Comparator_B input CB7
Analog input A7 - 10-bit ADC
P2.6/ PM_ACLK/ CB6 (/A6)
58
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: ACLK output
Comparator_B input CB6
Analog input A6 - 10-bit ADC
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: SVM output
Comparator_B input CB5
Analog input A5 - 10-bit ADC
Output of reference voltage to the ADC
Positive terminal for the ADC reference voltage for both sources, the internal reference
voltage, or an external applied reference voltage
P2.5/ PM_SVMOUT/ CB5
(/A5/ VREF+/ VeREF+)
59
I/O
DESCRIPTION
Analog power supply
P2.4/ PM_RTCCLK/ CB4
(/A4/ VeREF-)
60
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: RTCCLK output
Comparator_B input CB4
Analog input A4 - 10-bit ADC
Negative terminal for the ADC reference voltage for an external applied reference
voltage
P2.3/ PM_TA1CCR2A/ CB3 (/A3)
61
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: TA1 CCR2 compare output, capture input
Comparator_B input CB3
Analog input A3 - 10-bit ADC
P2.2/ PM_TA1CCR1A/ CB2 (/A2)
62
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: TA1 CCR1 compare output, capture input
Comparator_B input CB2
Analog input A2 - 10-bit ADC
P2.1/PM_TA1CCR0A/CB1(/A1)
63
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: TA1 CCR0 compare output, capture input
Comparator_B input CB1
Analog input A1 - 10-bit ADC
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: Comparator_B output; TA1 clock input
Comparator_B input CB0
Analog input A0 - 10-bit ADC
P2.0/ PM_CBOUT1/ PM_TA1CLK/
CB0 (/A0)
64
VSS - Exposed die attach pad
12
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Ground supply
The exposed die attach pad must be connected to a solid ground plane as this is
the ground connection for the chip.
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CC430F514x
CC430F512x
SLAS555 – JUNE 2012
Table 4. CC430F514x and CC430F512x Terminal Functions
TERMINAL
NAME
NO.
I/O (1)
DESCRIPTION
P2.2/ PM_TA1CCR1A/ CB2/ (A2)
1
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: TA1 CCR1 compare output, capture input
Comparator_B input CB2
Analog input A2 - 10-bit ADC (only CC430F514x)
P2.1/ PM_TA1CCR0A/ CB1/ (A1)
2
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: TA1 CCR0 compare output, capture input
Comparator_B input CB1
Analog input A1 - 10-bit ADC (only CC430F514x)
P2.0/ PM_CBOUT1/ PM_TA1CLK/
CB0/ (A0)
3
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: Comparator_B output; TA1 clock input
Comparator_B input CB0
Analog input A0 - 10-bit ADC (only CC430F514x)
P1.7/ PM_UCA0CLK/
PM_UCA0STE
4
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_A0 clock input/output; USCI_B0 SPI slave transmit enable
P1.6/ PM_UCA0TXD/
PM_UCA0SIMO
5
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_A0 UART transmit data; USCI_A0 SPI slave in master out
P1.5/ PM_UCA0RXD/
PM_UCA0SOMI
6
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_A0 UART receive data; USCI_A0 SPI slave out master in
VCORE
7
Regulated core power supply
DVCC
8
Digital power supply
P1.4/ PM_UCB0CLK/
PM_UCA0STE
9
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_B0 clock input/output; USCI_A0 SPI slave transmit enable
P1.3/ PM_UCB0SIMO/
PM_UCB0SDA
10
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_B0 SPI slave in master out; USCI_B0 I2C data
P1.2/ PM_UCB0SOMI/
PM_UCB0SCL
11
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: USCI_B0 SPI slave out master in; UCSI_B0 I2C clock
P1.1/ PM_RFGDO2
12
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: Radio GDO2 output
P1.0/ PM_RFGDO0
13
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: Radio GDO0 output
P3.7/ PM_SMCLK
14
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: SMCLK output
P3.6/ PM_RFGDO1
15
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: Radio GDO1 output
P3.5/ PM_TA0CCR4A
16
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: TA0 CCR4 compare output, capture input
P3.4/ PM_TA0CCR3A
17
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: TA0 CCR3 compare output, capture input
P3.3/ PM_TA0CCR2A
18
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: TA0 CCR2 compare output, capture input
P3.2/ PM_TA0CCR1A
19
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: TA0 CCR1 compare output, capture input
P3.1/ PM_TA0CCR0A
20
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: TA0 CCR0 compare output, capture input
P3.0/ PM_CBOUT0/ PM_TA0CLK
21
I/O
General-purpose digital I/O with mappable secondary function
Default mapping: Comparator_B output; TA0 clock input
DVCC
22
P2.7/ PM_ADC10CLK/
PM_DMAE0
23
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: ADC10CLK output; DMA external trigger input
P2.6/ PM_ACLK
24
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: ACLK output
RF_XIN
25
I
Input terminal for RF crystal oscillator, or external clock input
RF_XOUT
26
O
Output terminal for RF crystal oscillator
AVCC_RF
27
(1)
Digital power supply
Radio analog power supply
I = input, O = output
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Table 4. CC430F514x and CC430F512x Terminal Functions (continued)
TERMINAL
NAME
AVCC_RF
NO.
I/O (1)
28
DESCRIPTION
Radio analog power supply
RF_P
29
RF
I/O
RF_N
30
RF
I/O
AVCC_RF
31
Radio analog power supply
AVCC_RF
32
Radio analog power supply
RBIAS
33
External bias resistor for radio reference current
GUARD
34
Power supply connection for digital noise isolation
PJ.0/ TDO
35
I/O
General-purpose digital I/O
Test data output port
PJ.1/ TDI/ TCLK
36
I/O
General-purpose digital I/O
Test data input or test clock input
PJ.2/ TMS
37
I/O
General-purpose digital I/O
Test mode select
PJ.3/ TCK
38
I/O
General-purpose digital I/O
Test clock
TEST/ SBWTCK
39
I
RST/NMI/ SBWTDIO
40
I/O
DVCC
41
Digital power supply
AVSS
42
Analog ground supply for ADC10
P5.1/ XOUT
43
I/O
General-purpose digital I/O
Output terminal of crystal oscillator XT1
P5.0/ XIN
44
I/O
General-purpose digital I/O
Input terminal for crystal oscillator XT1
AVCC
45
Analog power supply
46
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: SVM output
Comparator_B input CB5
Analog input A5 - 10-bit ADC (only CC430F514x)
Positive terminal for the ADC reference voltage for both sources, the internal reference
voltage, or an external applied reference voltage (only CC430F514x)
P2.5/ PM_SVMOUT/ CB5/
(A5/ VREF+/VeREF+)
Positive RF input to LNA in receive mode
Positive RF output from PA in transmit mode
Negative RF input to LNA in receive mode
Negative RF output from PA in transmit mode
Test mode pin - select digital I/O on JTAG pins
Spy-bi-wire input clock
Reset input active low
Non-maskable interrupt input
Spy-bi-wire data input/output
P2.4/ PM_RTCCLK/ CB4/
(A4/ VeREF-)
47
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: RTCCLK output
Comparator_B input CB4
Analog input A4 - 10-bit ADC (only CC430F514x)
Negative terminal for the ADC reference voltage for an external applied reference
voltage (only CC430F514x)
P2.3/ PM_TA1CCR2A/ CB3/ (A3)
48
I/O
General-purpose digital I/O with port interrupt and mappable secondary function
Default mapping: TA1 CCR2 compare output, capture input
Comparator_B input CB3
Analog input A3 - 10-bit ADC (only CC430F514x)
VSS - Exposed die attach pad
14
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Ground supply
The exposed die attach pad must be connected to a solid ground plane as this is
the ground connection for the chip.
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SHORT-FORM DESCRIPTION
Sub-1-GHz Radio
The implemented sub-1-GHz radio module is based on the industry-leading CC1101, requiring very few external
components. Figure 1 shows a high-level block diagram of the implemented radio.
0
RF_N
FREQ
SYNTH
90
PA
BIAS
RC OSC
RBIAS
XOSC
RF_XIN
MODULATOR
RF_P
INTERFACE TO MCU
ADC
RXFIFO
LNA
TXFIFO
ADC
PACKET HANDLER
DEMODULATOR
RADIO CONTROL
RF_XOUT
Figure 1. Sub-1 GHz Radio Block Diagram
The radio features a low-IF receiver. The received RF signal is amplified by a low-noise amplifier (LNA) and
down-converted in quadrature to the intermediate frequency (IF). At IF, the I/Q signals are digitized. Automatic
gain control (AGC), fine channel filtering, demodulation bit and packet synchronization are performed digitally.
The transmitter part is based on direct synthesis of the RF frequency. The frequency synthesizer includes a
completely on-chip LC VCO and a 90° phase shifter for generating the I and Q LO signals to the downconversion mixers in receive mode.
The 26-MHz crystal oscillator generates the reference frequency for the synthesizer, as well as clocks for the
ADC and the digital part.
A memory mapped register interface is used for data access, configuration and status request by the CPU.
The digital baseband includes support for channel configuration, packet handling, and data buffering.
For complete module descriptions, see the CC430 Family User's Guide (SLAU259).
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CPU
The MSP430 CPU has a 16-bit RISC architecture that is highly transparent to the application. All operations,
other than program-flow instructions, are performed as register operations in conjunction with seven addressing
modes for source operand and four addressing modes for destination operand.
The CPU is integrated with 16 registers that provide reduced instruction execution time. The register-to-register
operation execution time is one cycle of the CPU clock.
Four of the registers, R0 to R3, are dedicated as program counter, stack pointer, status register, and constant
generator, respectively. The remaining registers are general-purpose registers.
Peripherals are connected to the CPU using data, address, and control buses, and can be handled with all
instructions.
The instruction set consists of the original 51 instructions with three formats and seven address modes and
additional instructions for the expanded address range. Each instruction can operate on word and byte data.
Operating Modes
The CC430 has one active mode and seven software selectable low-power modes of operation. An interrupt
event can wake up the device from any of the low-power modes, service the request, and restore back to the
low-power mode on return from the interrupt program.
The following eight operating modes can be configured by software:
• Low-power mode 4 (LPM4)
• Active mode (AM)
– CPU is disabled
– All clocks are active
– ACLK is disabled
• Low-power mode 0 (LPM0)
– MCLK, FLL loop control, and DCOCLK are
– CPU is disabled
disabled
– ACLK and SMCLK remain active, MCLK is
– DCO's dc-generator is disabled
disabled
– Crystal oscillator is stopped
– FLL loop control remains active
– Complete data retention
• Low-power mode 1 (LPM1)
• Low-power mode 3.5 (LPM3.5)
– CPU is disabled
– Internal regulator disabled
– FLL loop control is disabled
– No data retention except Backup RAM and
– ACLK and SMCLK remain active, MCLK is
RTC
disabled
– RTC enabled and clocked by low-frequency
• Low-power mode 2 (LPM2)
crystal oscillator XT1
– CPU is disabled
– Wake up from RST/NMI, RTC, P1, P2
– MCLK and FLL loop control and DCOCLK are
• Low-power mode 4.5 (LPM4.5)
disabled
– Internal regulator disabled
– DCO's dc-generator remains enabled
– No data retention except Backup RAM
– ACLK remains active
– Wake up from RST/NMI, P1, P2
• Low-power mode 3 (LPM3)
– CPU is disabled
– MCLK, FLL loop control, and DCOCLK are
disabled
– DCO's dc-generator is disabled
– ACLK remains active
16
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Interrupt Vector Addresses
The interrupt vectors and the power-up start address are located in the address range 0FFFFh to 0FF80h. The
vector contains the 16-bit address of the appropriate interrupt-handler instruction sequence.
Table 5. Interrupt Sources, Flags, and Vectors
INTERRUPT SOURCE
INTERRUPT FLAG
SYSTEM
INTERRUPT
WORD
ADDRESS
PRIORITY
System Reset
Power-Up
External Reset
Watchdog Timeout, Password
Violation
Flash Memory Password Violation
WDTIFG, KEYV (SYSRSTIV) (1) (2)
Reset
0FFFEh
63, highest
System NMI
PMM
Vacant Memory Access
JTAG Mailbox
SVMLIFG, SVMHIFG, DLYLIFG, DLYHIFG,
VLRLIFG, VLRHIFG, VMAIFG, JMBNIFG,
JMBOUTIFG (SYSSNIV) (1) (3)
(Non)maskable
0FFFCh
62
User NMI
NMI
Oscillator Fault
Flash Memory Access Violation
NMIIFG, OFIFG, ACCVIFG (SYSUNIV) (1) (3)
(Non)maskable
0FFFAh
61
Comparator_B
Comparator_B Interrupt Flags (CBIV) (1)
Maskable
0FFF8h
60
Watchdog Interval Timer Mode
WDTIFG
Maskable
0FFF6h
59
USCI_A0 Receive/Transmit
UCA0RXIFG, UCA0TXIFG (UCA0IV) (1)
Maskable
0FFF4h
58
USCI_B0 Receive/Transmit
UCB0RXIFG, UCB0TXIFG, I2C Status Interrupt
Flags (UCB0IV) (1)
Maskable
0FFF2h
57
ADC10_A
(Reserved on CC430F512x)
ADC10IFG0, ADC10INIFG, ADC10LOIFG,
ADC10HIIFG, ADC10TOVIFG, ADC10OVIFG
(ADC10IV) (1)
Maskable
0FFF0h
56
TA0
TA0CCR0 CCIFG0
Maskable
0FFEEh
55
TA0
TA0CCR1 CCIFG1 ... TA0CCR4 CCIFG4,
TA0IFG (TA0IV) (1)
Maskable
0FFECh
54
RF1A CC1101-based Radio
Radio Interface Interrupt Flags (RF1AIFIV)
Radio Core Interrupt Flags (RF1AIV)
Maskable
0FFEAh
53
DMA
DMA0IFG, DMA1IFG, DMA2IFG (DMAIV) (1)
Maskable
0FFE8h
52
TA1
TA1CCR0 CCIFG0
Maskable
0FFE6h
51
TA1
TA1CCR1 CCIFG1 ... TA1CCR2 CCIFG2,
TA1IFG (TA1IV) (1)
Maskable
0FFE4h
50
I/O Port P1
P1IFG.0 to P1IFG.7 (P1IV) (1)
Maskable
0FFE2h
49
I/O Port P2
P2IFG.0 to P2IFG.7 (P2IV) (1)
Maskable
0FFE0h
48
LCD_B
(Reserved on CC430F514x and
CC430F512x)
LCD_B Interrupt Flags (LCDBIV) (1)
Maskable
0FFDEh
47
RTC_D
RTCRDYIFG, RTCTEVIFG, RTCAIFG,
RT0PSIFG, RT1PSIFG, RTCOFIFG (RTCIV) (1)
Maskable
0FFDCh
46
AES
AESRDYIFG
Maskable
0FFDAh
45
0FFD8h
44
⋮
⋮
0FF80h
0, lowest
Reserved
(1)
(2)
(3)
(4)
Reserved (4)
Multiple source flags
A reset is generated if the CPU tries to fetch instructions from within peripheral space.
(Non)maskable: the individual interrupt enable bit can disable an interrupt event, but the general interrupt enable cannot disable it.
Reserved interrupt vectors at addresses are not used in this device and can be used for regular program code if necessary. To maintain
compatibility with other devices, it is recommended to reserve these locations.
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Memory Organization
Table 6. Memory Organization (1)
Main Memory (flash)
CC430F6147
CC430F5147
CC430F6145
CC430F5145
CC430F5125
CC430F6143
CC430F5143
CC430F5123
32kB
16kB
8kB
00FFFFh-00FF80h
00FFFFh-00FF80h
00FFFFh-00FF80h
32kB
00FFFFh-008000h
16kB
00FFFFh-00C000h
8kB
00FFFFh-00E000h
4kB
2kB
2kB
Sect 1
2kB
002BFFh-002400h
not available
not available
Sect 0
1.875kB
0023FFh-001C80h
1.875kB
0023FFh-001C80h
1.875kB
0023FFh-001C80h
128B
001C7Fh-001C00h
128B
001C7Fh-001C00h
128B
001C7Fh-001C00h
128 B
001AFFh to 001A80h
128 B
001AFFh to 001A80h
128 B
001AFFh to 001A80h
128 B
001A7Fh to 001A00h
128 B
001A7Fh to 001A00h
128 B
001A7Fh to 001A00h
Info A
128 B
0019FFh to 001980h
128 B
0019FFh to 001980h
128 B
0019FFh to 001980h
Info B
128 B
00197Fh to 001900h
128 B
00197Fh to 001900h
128 B
00197Fh to 001900h
Info C
128 B
0018FFh to 001880h
128 B
0018FFh to 001880h
128 B
0018FFh to 001880h
Info D
128 B
00187Fh to 001800h
128 B
00187Fh to 001800h
128 B
00187Fh to 001800h
BSL 3
512 B
0017FFh to 001600h
512 B
0017FFh to 001600h
512 B
0017FFh to 001600h
BSL 2
512 B
0015FFh to 001400h
512 B
0015FFh to 001400h
512 B
0015FFh to 001400h
BSL 1
512 B
0013FFh to 001200h
512 B
0013FFh to 001200h
512 B
0013FFh to 001200h
BSL 0
512 B
0011FFh to 001000h
512 B
0011FFh to 001000h
512 B
0011FFh to 001000h
4 KB
000FFFh to 0h
4 KB
000FFFh to 0h
4 KB
000FFFh to 0h
Total
Size
Main: Interrupt vector
Main: code memory
Bank 0
Total
Size
RAM
Backup RAM (2)
Device Descriptor
Information memory
(flash)
Bootstrap loader
(BSL) memory (flash)
Peripherals
(1)
(2)
18
All memory regions not specified here are vacant memory and any access to them causes a Vacant Memory Interrupt.
Content retained in LPM3.5 and LPM4.5.
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Bootstrap Loader (BSL)
The BSL enables users to program the flash memory or RAM using various serial interfaces. Access to the
device memory via the BSL is protected by an user-defined password. BSL entry requires a specific entry
sequence on the RST/NMI/SBWTDIO and TEST/SBWTCK pins. For a complete description of the features of the
BSL and its implementation, see the MSP430 Programming Via the Bootstrap Loader User's Guide (SLAU319).
Table 7. UART BSL Pin Requirements and Functions
DEVICE SIGNAL
BSL FUNCTION
RST/NMI/SBWTDIO
Entry sequence signal
TEST/SBWTCK
Entry sequence signal
P1.6
Data transmit
P1.5
Data receive
VCC
Power supply
VSS
Ground supply
JTAG Operation
JTAG Standard Interface
The CC430 family supports the standard JTAG interface which requires four signals for sending and receiving
data. The JTAG signals are shared with general-purpose I/O. The TEST/SBWTCK pin is used to enable the
JTAG signals. In addition to these signals, the RST/NMI/SBWTDIO is required to interface with MSP430
development tools and device programmers. The JTAG pin requirements are shown in Table 8. For further
details on interfacing to development tools and device programmers, see the MSP430 Hardware Tools User's
Guide (SLAU278). For a complete description of the features of the JTAG interface and its implementation, see
MSP430 Programming Via the JTAG Interface (SLAU320).
Table 8. JTAG Pin Requirements and Functions
DEVICE SIGNAL
DIRECTION
FUNCTION
PJ.3/TCK
IN
JTAG clock input
PJ.2/TMS
IN
JTAG state control
PJ.1/TDI/TCLK
IN
JTAG data input, TCLK input
PJ.0/TDO
OUT
JTAG data output
TEST/SBWTCK
IN
Enable JTAG pins
RST/NMI/SBWTDIO
IN
External reset
VCC
Power supply
VSS
Ground supply
Spy-Bi-Wire Interface
In addition to the standard JTAG interface, the CC430 family supports the two wire Spy-Bi-Wire interface. Spy-BiWire can be used to interface with MSP430 development tools and device programmers. The Spy-Bi-Wire
interface pin requirements are shown in Table 9. For further details on interfacing to development tools and
device programmers, see the MSP430 Hardware Tools User's Guide (SLAU278). For a complete description of
the features of the JTAG interface and its implementation, see MSP430 Programming Via the JTAG Interface
(SLAU320).
Table 9. Spy-Bi-Wire Pin Requirements and Functions
DEVICE SIGNAL
DIRECTION
FUNCTION
TEST/SBWTCK
IN
Spy-Bi-Wire clock input
RST/NMI/SBWTDIO
IN, OUT
Spy-Bi-Wire data input/output
VCC
Power supply
VSS
Ground supply
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Flash Memory
The flash memory can be programmed via the JTAG port, Spy-Bi-Wire (SBW), or in-system by the CPU. The
CPU can perform single-byte, single-word, and long-word writes to the flash memory. Features of the flash
memory include:
• Flash memory has n segments of main memory and four segments of information memory (Info A to Info D)
of 128 bytes each. Each segment in main memory is 512 bytes in size.
• Segments 0 to n may be erased in one step, or each segment may be individually erased.
• Segments Info A to Info D can be erased individually, or as a group with the main memory segments.
Segments Info A to Info D are also called information memory.
• Segment A can be locked separately.
RAM Memory
The RAM memory is made up of n sectors. Each sector can be completely powered down to save leakage,
however all data is lost. Features of the RAM memory include:
• RAM memory has n sectors of 2k bytes each.
• Each sector 0 to n can be complete disabled; however, data retention is lost.
• Each sector 0 to n automatically enters low-power retention mode when possible.
Backup RAM
The backup RAM provides 128 bytes of memory that are retained even in LPM3.5 and LPM4.5 when the core is
powered down.
Peripherals
Peripherals are connected to the CPU through data, address, and control buses and can be handled using all
instructions. For complete module descriptions, see the CC430 Family User's Guide (SLAU259).
Oscillator and System Clock
The Unified Clock System (UCS) module includes support for a 32768-Hz watch crystal oscillator, an internal
very-low-power low-frequency oscillator (VLO), an internal trimmed low-frequency oscillator (REFO), an
integrated internal digitally-controlled oscillator (DCO), and a high-frequency crystal oscillator. The UCS module
is designed to meet the requirements of both low system cost and low-power consumption. The UCS module
features digital frequency locked loop (FLL) hardware that, in conjunction with a digital modulator, stabilizes the
DCO frequency to a programmable multiple of the watch crystal frequency. The internal DCO provides a fast
turn-on clock source and stabilizes in less than 5 µs. The UCS module provides the following clock signals:
• Auxiliary clock (ACLK), sourced from a 32768-Hz watch crystal, a high-frequency crystal, the internal lowfrequency oscillator (VLO), or the trimmed low-frequency oscillator (REFO).
• Main clock (MCLK), the system clock used by the CPU. MCLK can be sourced by same sources made
available to ACLK.
• Sub-Main clock (SMCLK), the subsystem clock used by the peripheral modules. SMCLK can be sourced by
same sources made available to ACLK.
• ACLK/n, the buffered output of ACLK, ACLK/2, ACLK/4, ACLK/8, ACLK/16, ACLK/32.
Power Management Module (PMM)
The PMM includes an integrated voltage regulator that supplies the core voltage to the device and contains
programmable output levels to provide for power optimization. The PMM also includes supply voltage supervisor
(SVS) and supply voltage monitoring (SVM) circuitry, as well as brownout protection. The brownout circuit is
implemented to provide the proper internal reset signal to the device during power-on and power-off. The
SVS/SVM circuitry detects if the supply voltage drops below a user-selectable level and supports both supply
voltage supervision (the device is automatically reset) and supply voltage monitoring (SVM, the device is not
automatically reset). SVS and SVM circuitry is available on the primary supply and core supply.
20
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Digital I/O
There are up to five 8-bit I/O ports implemented: ports P1 through P5.
• All individual I/O bits are independently programmable.
• Any combination of input, output, and interrupt conditions is possible.
• Programmable pullup or pulldown on all ports.
• Programmable drive strength on all ports.
• Edge-selectable interrupt and LPM3.5 and LPM4.5 wake-up input capability is available for all the eight bits of
ports P1 and P2.
• Read and write access to port-control registers is supported by all instructions.
• Ports can be accessed byte-wise (P1 through P5) or word-wise in pairs (PA and PB).
Port Mapping Controller
The port mapping controller allows the flexible and re-configurable mapping of digital functions to port pins of
ports P1 through P3.
Table 10. Port Mapping Mnemonics and Functions
VALUE
0
1 (1)
PM_NONE
None
PM_CBOUT0
OUTPUT PIN FUNCTION
(PxDIR.y = 1)
DVSS
Comparator_B output (on TA0 clock input)
PM_TA0CLK
TA0 clock input
-
-
Comparator_B output (on TA1 clock input)
PM_TA1CLK
TA1 clock input
-
PM_ACLK
None
ACLK output
4
PM_MCLK
None
MCLK output
5
PM_SMCLK
None
SMCLK output
6
PM_RTCCLK
None
RTCCLK output
PM_ADC10CLK
-
ADC10CLK output
PM_DMAE0
DMA external trigger input
-
8
PM_SVMOUT
None
SVM output
3
7 (1)
9
PM_TA0CCR0A
TA0 CCR0 capture input CCI0A
TA0 CCR0 compare output Out0
10
PM_TA0CCR1A
TA0 CCR1 capture input CCI1A
TA0 CCR1 compare output Out1
11
PM_TA0CCR2A
TA0 CCR2 capture input CCI2A
TA0 CCR2 compare output Out2
12
PM_TA0CCR3A
TA0 CCR3 capture input CCI3A
TA0 CCR3 compare output Out3
13
PM_TA0CCR4A
TA0 CCR4 capture input CCI4A
TA0 CCR4 compare output Out4
14
PM_TA1CCR0A
TA1 CCR0 capture input CCI0A
TA1 CCR0 compare output Out0
15
PM_TA1CCR1A
TA1 CCR1 capture input CCI1A
TA1 CCR1 compare output Out1
16
PM_TA1CCR2A
TA1 CCR2 capture input CCI2A
TA1 CCR2 compare output Out2
17 (2)
18 (2)
19 (3)
20 (4)
(4)
INPUT PIN FUNCTION
(PxDIR.y = 0)
PM_CBOUT1
2 (1)
(1)
(2)
(3)
PxMAPy MNEMONIC
PM_UCA0RXD
USCI_A0 UART RXD (Direction controlled by USCI - input)
PM_UCA0SOMI
USCI_A0 SPI slave out master in (direction controlled by USCI)
PM_UCA0TXD
USCI_A0 UART TXD (Direction controlled by USCI - output)
PM_UCA0SIMO
USCI_A0 SPI slave in master out (direction controlled by USCI)
PM_UCA0CLK
USCI_A0 clock input/output (direction controlled by USCI)
PM_UCB0STE
USCI_B0 SPI slave transmit enable (direction controlled by USCI - input)
PM_UCB0SOMI
USCI_B0 SPI slave out master in (direction controlled by USCI)
PM_UCB0SCL
USCI_B0 I2C clock (open drain and direction controlled by USCI)
Input or output function is selected by the corresponding setting in the port direction register PxDIR.
UART or SPI functionality is determined by the selected USCI mode.
UCA0CLK function takes precedence over UCB0STE function. If the mapped pin is required as UCA0CLK input or output, USCI_B0 is
forced to 3-wire SPI mode even if 4-wire mode is selected.
SPI or I2C functionality is determined by the selected USCI mode. If I2C functionality is selected, the output of the mapped pin drives
only the logical 0 to VSS level.
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Table 10. Port Mapping Mnemonics and Functions (continued)
VALUE
21 (4)
22 (5)
(6)
OUTPUT PIN FUNCTION
(PxDIR.y = 1)
PM_UCB0SIMO
USCI_B0 SPI slave in master out (direction controlled by USCI)
PM_UCB0SDA
USCI_B0 I2C data (open drain and direction controlled by USCI)
PM_UCB0CLK
USCI_B0 clock input/output (direction controlled by USCI)
PM_UCA0STE
USCI_A0 SPI slave transmit enable (direction controlled by USCI - input)
23
PM_RFGDO0
Radio GDO0 (direction controlled by Radio)
24
PM_RFGDO1
Radio GDO1 (direction controlled by Radio)
25
PM_RFGDO2
26
Reserved
None
DVSS
27
Reserved
None
DVSS
28
Reserved
None
DVSS
29
Reserved
None
DVSS
30
Reserved
None
DVSS
31 (0FFh) (6)
(5)
INPUT PIN FUNCTION
(PxDIR.y = 0)
PxMAPy MNEMONIC
PM_ANALOG
Radio GDO2 (direction controlled by Radio)
Disables the output driver and the input Schmitt trigger to prevent parasitic cross currents
when applying analog signals.
UCB0CLK function takes precedence over UCA0STE function. If the mapped pin is required as UCB0CLK input or output, USCI_A0 is
forced to 3-wire SPI mode even if 4-wire mode is selected.
The value of the PMPAP_ANALOG mnemonic is set to 0FFh. The port mapping registers are only 5 bits wide and the upper bits are
ignored resulting in a read out value of 31.
Table 11. Default Mapping
22
PIN
PxMAPy MNEMONIC
INPUT PIN FUNCTION
(PxDIR.y = 0)
OUTPUT PIN FUNCTION
(PxDIR.y = 1)
P1.0/P1MAP0
PM_RFGDO0
None
Radio GDO0
P1.1/P1MAP1
PM_RFGDO2
None
Radio GDO2
P1.2/P1MAP2
PM_UCB0SOMI/PM_UCB0SCL
USCI_B0 SPI slave out master in (direction controlled by USCI)
USCI_B0 I2C clock (open drain and direction controlled by USCI)
P1.3/P1MAP3
PM_UCB0SIMO/PM_UCB0SDA
USCI_B0 SPI slave in master out (direction controlled by USCI)
USCI_B0 I2C data (open drain and direction controlled by USCI)
P1.4/P1MAP4
PM_UCB0CLK/PM_UCA0STE
USCI_B0 clock input/output (direction controlled by USCI)
USCI_A0 SPI slave transmit enable (direction controlled by USCI - input)
P1.5/P1MAP5
PM_UCA0RXD/PM_UCA0SOMI
USCI_A0 UART RXD (Direction controlled by USCI - input)
USCI_A0 SPI slave out master in (direction controlled by USCI)
P1.6/P1MAP6
PM_UCA0TXD/PM_UCA0SIMO
USCI_A0 UART TXD (Direction controlled by USCI - output)
USCI_A0 SPI slave in master out (direction controlled by USCI)
P1.7/P1MAP7
PM_UCA0CLK/PM_UCB0STE
USCI_A0 clock input/output (direction controlled by USCI)
USCI_B0 SPI slave transmit enable (direction controlled by USCI - input)
P2.0/P2MAP0
PM_CBOUT1/PM_TA1CLK
TA1 clock input
Comparator_B output
P2.1/P2MAP1
PM_TA1CCR0A
TA1 CCR0 capture input CCI0A
TA1 CCR0 compare output Out0
P2.2/P2MAP2
PM_TA1CCR1A
TA1 CCR1 capture input CCI1A
TA1 CCR1 compare output Out1
P2.3/P2MAP3
PM_TA1CCR2A
TA1 CCR2 capture input CCI2A
TA1 CCR2 compare output Out2
P2.4/P2MAP4
PM_RTCCLK
None
RTCCLK output
P2.5/P2MAP5
PM_SVMOUT
None
SVM output
P2.6/P2MAP6
PM_ACLK
None
ACLK output
P2.7/P2MAP7
PM_ADC10CLK/PM_DMAE0
DMA external trigger input
ADC10CLK output
P3.0/P3MAP0
PM_CBOUT0/PM_TA0CLK
TA0 clock input
Comparator_B output
P3.1/P3MAP1
PM_TA0CCR0A
TA0 CCR0 capture input CCI0A
TA0 CCR0 compare output Out0
P3.2/P3MAP2
PM_TA0CCR1A
TA0 CCR1 capture input CCI1A
TA0 CCR1 compare output Out1
P3.3/P3MAP3
PM_TA0CCR2A
TA0 CCR2 capture input CCI2A
TA0 CCR2 compare output Out2
P3.4/P3MAP4
PM_TA0CCR3A
TA0 CCR3 capture input CCI3A
TA0 CCR3 compare output Out3
P3.5/P3MAP5
PM_TA0CCR4A
TA0 CCR4 capture input CCI4A
TA0 CCR4 compare output Out4
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Table 11. Default Mapping (continued)
PIN
PxMAPy MNEMONIC
INPUT PIN FUNCTION
(PxDIR.y = 0)
OUTPUT PIN FUNCTION
(PxDIR.y = 1)
P3.6/P3MAP6
PM_RFGDO1
None
Radio GDO1
P3.7/P3MAP7
PM_SMCLK
None
SMCLK output
System Module (SYS)
The SYS module handles many of the system functions within the device. These include power on reset and
power up clear handling, NMI source selection and management, reset interrupt vector generators, boot strap
loader entry mechanisms, as well as, configuration management (device descriptors). It also includes a data
exchange mechanism via JTAG called a JTAG mailbox that can be used in the application.
Table 12. System Module Interrupt Vector Registers
INTERRUPT VECTOR REGISTER
ADDRESS
INTERRUPT EVENT
VALUE
SYSRSTIV, System Reset
019Eh
No interrupt pending
00h
Brownout (BOR)
02h
RST/NMI (POR)
04h
DoBOR (BOR)
06h
SYSSNIV, System NMI
SYSUNIV, User NMI
019Ch
019Ah
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Reserved
08h
Security violation (BOR)
0Ah
SVSL (POR)
0Ch
SVSH (POR)
0Eh
SVML_OVP (POR)
10h
SVMH_OVP (POR)
12h
DoPOR (POR)
14h
WDT timeout (PUC)
16h
WDT password violation (PUC)
18h
KEYV flash password violation (PUC)
1Ah
Reserved
1Ch
Peripheral area fetch (PUC)
1Eh
PMM password violation (PUC)
20h
Reserved
22h to 3Eh
No interrupt pending
00h
SVMLIFG
02h
SVMHIFG
04h
DLYLIFG
06h
DLYHIFG
08h
VMAIFG
0Ah
JMBINIFG
0Ch
JMBOUTIFG
0Eh
VLRLIFG
10h
VLRHIFG
12h
Reserved
14h to 1Eh
No interrupt pending
00h
NMIFG
02h
OFIFG
04h
ACCVIFG
06h
Reserved
08h to 1Eh
PRIORITY
Highest
Lowest
Highest
Lowest
Highest
Lowest
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DMA Controller
The DMA controller allows movement of data from one memory address to another without CPU intervention.
Using the DMA controller can increase the throughput of peripheral modules. The DMA controller reduces
system power consumption by allowing the CPU to remain in sleep mode, without having to awaken to move
data to or from a peripheral.
Table 13. DMA Trigger Assignments (1)
TRIGGER
(1)
(2)
CHANNEL
0
1
2
0
DMAREQ
DMAREQ
DMAREQ
1
TA0CCR0 CCIFG
TA0CCR0 CCIFG
TA0CCR0 CCIFG
2
TA0CCR2 CCIFG
TA0CCR2 CCIFG
TA0CCR2 CCIFG
3
TA1CCR0 CCIFG
TA1CCR0 CCIFG
TA1CCR0 CCIFG
4
TA1CCR2 CCIFG
TA1CCR2 CCIFG
TA1CCR2 CCIFG
5
Reserved
Reserved
Reserved
6
Reserved
Reserved
Reserved
7
Reserved
Reserved
Reserved
8
Reserved
Reserved
Reserved
9
Reserved
Reserved
Reserved
10
Reserved
Reserved
Reserved
11
Reserved
Reserved
Reserved
12
Reserved
Reserved
Reserved
13
Reserved
Reserved
Reserved
14
RFRXIFG
RFRXIFG
RFRXIFG
15
RFTXIFG
RFTXIFG
RFTXIFG
16
UCA0RXIFG
UCA0RXIFG
UCA0RXIFG
17
UCA0TXIFG
UCA0TXIFG
UCA0TXIFG
18
UCB0RXIFG
UCB0RXIFG
UCB0RXIFG
19
UCB0TXIFG
UCB0TXIFG
UCB0TXIFG
20
Reserved
Reserved
Reserved
21
Reserved
Reserved
Reserved
22
Reserved
Reserved
Reserved
23
Reserved
Reserved
(2)
ADC10IFG0
Reserved
(2)
ADC10IFG0 (2)
24
ADC10IFG0
25
Reserved
Reserved
Reserved
26
Reserved
Reserved
Reserved
27
Reserved
Reserved
Reserved
28
Reserved
Reserved
Reserved
29
MPY ready
MPY ready
MPY ready
30
DMA2IFG
DMA0IFG
DMA1IFG
31
DMAE0
DMAE0
DMAE0
Reserved DMA triggers may be used by other devices in the family. Reserved DMA triggers will not
cause any DMA trigger event when selected.
Only on CC430F614x and CC430F514x. Reserved on CC430F512x.
Watchdog Timer (WDT_A)
The primary function of the watchdog timer is to perform a controlled system restart after a software problem
occurs. If the selected time interval expires, a system reset is generated. If the watchdog function is not needed
in an application, the timer can be configured as an interval timer and can generate interrupts at selected time
intervals.
24
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CRC16
The CRC16 module produces a signature based on a sequence of entered data values and can be used for data
checking purposes. The CRC16 module signature is based on the CRC-CCITT standard.
Hardware Multiplier
The multiplication operation is supported by a dedicated peripheral module. The module performs operations with
32-bit, 24-bit, 16-bit, and 8-bit operands. The module is capable of supporting signed and unsigned multiplication
as well as signed and unsigned multiply and accumulate operations.
AES128 Accelerator
The AES accelerator module performs encryption and decryption of 128-bit data with 128-bit keys according to
the Advanced Encryption Standard (AES) (FIPS PUB 197) in hardware.
Universal Serial Communication Interface (USCI)
The USCI module is used for serial data communication. The USCI module supports synchronous
communication protocols such as SPI (3 or 4 pin) and I2C, and asynchronous communication protocols such as
UART, enhanced UART with automatic baudrate detection, and IrDA.
The USCI_An module provides support for SPI (3 or 4 pin), UART, enhanced UART, and IrDA.
The USCI_Bn module provides support for SPI (3 or 4 pin) and I2C.
A USCI_A0 and USCI_B0 module are implemented.
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TA0
TA0 is a 16-bit timer/counter (Timer_A type) with five capture/compare registers. TA0 can support multiple
capture/compares, PWM outputs, and interval timing. TA0 also has extensive interrupt capabilities. Interrupts
may be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 14. TA0 Signal Connections
DEVICE INPUT SIGNAL
MODULE INPUT NAME
PM_TA0CLK
TACLK
(1)
(2)
26
ACLK (internal)
ACLK
SMCLK (internal)
SMCLK
RFCLK/192 (1)
INCLK
PM_TA0CCR0A
CCI0A
DVSS
CCI0B
DVSS
GND
MODULE BLOCK
MODULE OUTPUT
SIGNAL
Timer
NA
DEVICE OUTPUT
SIGNAL
PM_TA0CCR0A
CCR0
TA0
DVCC
VCC
PM_TA0CCR1A
CCI1A
PM_TA0CCR1A
CBOUT (internal)
CCI1B
ADC10 (internal) (2)
ADC10SHSx = {1}
DVSS
GND
DVCC
VCC
PM_TA0CCR2A
CCI2A
ACLK (internal)
CCI2B
DVSS
GND
DVCC
VCC
PM_TA0CCR3A
CCI3A
GDO1 from radio
(internal)
CCI3B
DVSS
GND
DVCC
VCC
PM_TA0CCR4A
CCI4A
GDO2 from radio
(internal)
CCI4B
DVSS
GND
DVCC
VCC
CCR1
TA1
PM_TA0CCR2A
CCR2
TA2
PM_TA0CCR3A
CCR3
TA3
PM_TA0CCR4A
CCR4
TA4
If a different RFCLK divider setting is selected for a radio GDO output, this divider setting is also used for the Timer_A INCLK.
Only on CC430F614x and CC430F514x.
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TA1
TA1 is a 16-bit timer/counter (Timer_A type) with three capture/compare registers. TA1 can support multiple
capture/compares, PWM outputs, and interval timing. TA1 also has extensive interrupt capabilities. Interrupts
may be generated from the counter on overflow conditions and from each of the capture/compare registers.
Table 15. TA1 Signal Connections
DEVICE INPUT SIGNAL
MODULE INPUT NAME
PM_TA1CLK
TACLK
ACLK (internal)
ACLK
SMCLK (internal)
SMCLK
RFCLK/192 (1)
INCLK
PM_TA1CCR0A
CCI0A
RF Async. Output
(internal)
CCI0B
(1)
DVSS
GND
DVCC
VCC
PM_TA1CCR1A
CCI1A
CBOUT (internal)
CCI1B
DVSS
GND
DVCC
VCC
PM_TA1CCR2A
CCI2A
ACLK (internal)
CCI2B
DVSS
GND
DVCC
VCC
MODULE BLOCK
Timer
MODULE OUTPUT
SIGNAL
DEVICE OUTPUT
SIGNAL
PZ
NA
PM_TA1CCR0A
CCR0
TA0
RF Async. Input (internal)
PM_TA1CCR1A
CCR1
TA1
PM_TA1CCR2A
CCR2
TA2
If a different RFCLK divider setting is selected for a radio GDO output, this divider setting is also used for the Timer_A INCLK.
Real-Time Clock (RTC_D)
The RTC_D module can be used as a general-purpose 32-bit counter (counter mode) or as an integrated realtime clock (RTC) (calendar mode). In counter mode, the RTC_D also includes two independent 8-bit timers that
can be cascaded to form a 16-bit timer/counter. Both timers can be read and written by software. Calendar mode
integrates an internal calendar which compensates for months with less than 31 days and includes leap year
correction. The RTC_D also supports flexible alarm functions and offset-calibration hardware.
REF Voltage Reference (Including Output)
The reference module (REF) is responsible for generation of all critical reference voltages that can be used by
the various analog peripherals in the device. These include the ADC10_A, LCD_B, and COMP_B modules.
It can also provide the ADC reference voltages to the VREF+ pin (see the pin schematics).
LCD_B (Only CC430F614x)
The LCD_B driver generates the segment and common signals required to drive a Liquid Crystal Display (LCD).
The LCD_B controller has dedicated data memories to hold segment drive information. Common and segment
signals are generated as defined by the mode. Static, 2-mux, 3-mux, and 4-mux LCDs are supported. The
module can provide a LCD voltage independent of the supply voltage with its integrated charge pump. It is
possible to control the level of the LCD voltage and thus contrast by software. The module also provides an
automatic blinking capability for individual segments.
Comparator_B
The primary function of the Comparator_B module is to support precision slope analog-to-digital conversions,
battery voltage supervision, and monitoring of external analog signals.
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ADC10_A (Only CC430F614x and CC430F514x)
The ADC10_A module supports fast, 10-bit analog-to-digital conversions. The module implements a 10-bit SAR
core, sample select control, reference generator and a conversion result buffer. A window comparator with a
lower and upper limit allows CPU independent result monitoring with three window comparator interrupt flags.
Embedded Emulation Module (EEM) (S Version)
The Embedded Emulation Module (EEM) supports real-time in-system debugging. The S version of the EEM
implemented on all devices has the following features:
• Three hardware triggers or breakpoints on memory access
• One hardware trigger or breakpoint on CPU register write access
• Up to four hardware triggers can be combined to form complex triggers or breakpoints
• One cycle counter
• Clock control on module level
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Peripheral File Map
Table 16. Peripherals
MODULE NAME
BASE ADDRESS
OFFSET ADDRESS
RANGE
Special Functions (see Table 17)
0100h
000h-01Fh
PMM (see Table 18)
0120h
000h-00Fh
Flash Control (see Table 19)
0140h
000h-00Fh
CRC16 (see Table 20)
0150h
000h-007h
RAM Control (see Table 21)
0158h
000h-001h
Watchdog (see Table 22)
015Ch
000h-001h
UCS (see Table 23)
0160h
000h-01Fh
SYS (see Table 24)
0180h
000h-01Fh
Shared Reference (see Table 25)
01B0h
000h-001h
Port Mapping Control (see Table 26)
01C0h
000h-007h
Port Mapping Port P1 (see Table 27)
01C8h
000h-007h
Port Mapping Port P2 (see Table 28)
01D0h
000h-007h
Port Mapping Port P3 (see Table 29)
01D8h
000h-007h
Port P1, P2 (see Table 30)
0200h
000h-01Fh
Port P3, P4 (see Table 31)
(P4 not available on CC430F514x and
CC430F512x)
0220h
000h-01Fh
Port P5 (see Table 32)
0240h
000h-01Fh
Port PJ (see Table 33)
0320h
000h-01Fh
TA0 (see Table 34)
0340h
000h-03Fh
TA1 (see Table 35)
0380h
000h-03Fh
RTC_D (see Table 36)
04A0h
000h-01Fh
32-Bit Hardware Multiplier (see Table 37)
04C0h
000h-02Fh
DMA Module Control (see Table 38)
0500h
000h-00Fh
DMA Channel 0 (see Table 39)
0510h
000h-00Fh
DMA Channel 1 (see Table 40)
0520h
000h-00Fh
DMA Channel 2 (see Table 41)
0530h
000h-00Fh
USCI_A0 (see Table 42)
05C0h
000h-01Fh
USCI_B0 (see Table 43)
05E0h
000h-01Fh
ADC10 (see Table 44)
(only CC430F614x and CC430F514x)
0740h
000h-01Fh
Comparator_B (see Table 45)
08C0h
000h-00Fh
AES Accelerator (see Table 46)
09C0h
000h-00Fh
LCD_B (see Table 47, only CC430F614x)
0A00h
000h-05Fh
Radio Interface (see Table 48)
0F00h
000h-03Fh
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Table 17. Special Function Registers (Base Address: 0100h)
REGISTER DESCRIPTION
REGISTER
OFFSET
SFR interrupt enable
SFRIE1
00h
SFR interrupt flag
SFRIFG1
02h
SFR reset pin control
SFRRPCR
04h
Table 18. PMM Registers (Base Address: 0120h)
REGISTER DESCRIPTION
REGISTER
OFFSET
PMM Control 0
PMMCTL0
00h
PMM control 1
PMMCTL1
02h
SVS high side control
SVSMHCTL
04h
SVS low side control
SVSMLCTL
06h
PMM interrupt flags
PMMIFG
0Ch
PMM interrupt enable
PMMIE
0Eh
PMM power mode 5 control
PM5CTL0
10h
Table 19. Flash Control Registers (Base Address: 0140h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Flash control 1
FCTL1
00h
Flash control 3
FCTL3
04h
Flash control 4
FCTL4
06h
Table 20. CRC16 Registers (Base Address: 0150h)
REGISTER DESCRIPTION
REGISTER
OFFSET
CRC data input
CRC16DI
00h
CRC data input reverse byte
CRCDIRB
02h
CRC initialization and result
CRCINIRES
04h
CRC result reverse byte
CRCRESR
06h
Table 21. RAM Control Registers (Base Address: 0158h)
REGISTER DESCRIPTION
RAM control 0
REGISTER
RCCTL0
OFFSET
00h
Table 22. Watchdog Registers (Base Address: 015Ch)
REGISTER DESCRIPTION
Watchdog timer control
REGISTER
WDTCTL
OFFSET
00h
Table 23. UCS Registers (Base Address: 0160h)
REGISTER DESCRIPTION
REGISTER
OFFSET
UCS control 0
UCSCTL0
00h
UCS control 1
UCSCTL1
02h
UCS control 2
UCSCTL2
04h
UCS control 3
UCSCTL3
06h
UCS control 4
UCSCTL4
08h
UCS control 5
UCSCTL5
0Ah
UCS control 6
UCSCTL6
0Ch
UCS control 7
UCSCTL7
0Eh
UCS control 8
UCSCTL8
10h
30
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Table 24. SYS Registers (Base Address: 0180h)
REGISTER DESCRIPTION
REGISTER
OFFSET
System control
SYSCTL
00h
Bootstrap loader configuration area
SYSBSLC
02h
JTAG mailbox control
SYSJMBC
06h
JTAG mailbox input 0
SYSJMBI0
08h
JTAG mailbox input 1
SYSJMBI1
0Ah
JTAG mailbox output 0
SYSJMBO0
0Ch
JTAG mailbox output 1
SYSJMBO1
0Eh
Bus Error vector generator
SYSBERRIV
18h
User NMI vector generator
SYSUNIV
1Ah
System NMI vector generator
SYSSNIV
1Ch
Reset vector generator
SYSRSTIV
1Eh
Table 25. Shared Reference Registers (Base Address: 01B0h)
REGISTER DESCRIPTION
Shared reference control
REGISTER
REFCTL
OFFSET
00h
Table 26. Port Mapping Control Registers (Base Address: 01C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port mapping key register
PMAPKEYID
00h
Port mapping control register
PMAPCTL
02h
Table 27. Port Mapping Port P1 Registers (Base Address: 01C8h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P1.0 mapping register
P1MAP0
00h
Port P1.1 mapping register
P1MAP1
01h
Port P1.2 mapping register
P1MAP2
02h
Port P1.3 mapping register
P1MAP3
03h
Port P1.4 mapping register
P1MAP4
04h
Port P1.5 mapping register
P1MAP5
05h
Port P1.6 mapping register
P1MAP6
06h
Port P1.7 mapping register
P1MAP7
07h
Table 28. Port Mapping Port P2 Registers (Base Address: 01D0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P2.0 mapping register
P2MAP0
00h
Port P2.1 mapping register
P2MAP1
01h
Port P2.2 mapping register
P2MAP2
02h
Port P2.3 mapping register
P2MAP3
03h
Port P2.4 mapping register
P2MAP4
04h
Port P2.5 mapping register
P2MAP5
05h
Port P2.6 mapping register
P2MAP6
06h
Port P2.7 mapping register
P2MAP7
07h
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Table 29. Port Mapping Port P3 Registers (Base Address: 01D8h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P3.0 mapping register
P3MAP0
00h
Port P3.1 mapping register
P3MAP1
01h
Port P3.2 mapping register
P3MAP2
02h
Port P3.3 mapping register
P3MAP3
03h
Port P3.4 mapping register
P3MAP4
04h
Port P3.5 mapping register
P3MAP5
05h
Port P3.6 mapping register
P3MAP6
06h
Port P3.7 mapping register
P3MAP7
07h
Table 30. Port P1, P2 Registers (Base Address: 0200h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P1 input
P1IN
00h
Port P1 output
P1OUT
02h
Port P1 direction
P1DIR
04h
Port P1 pullup/pulldown enable
P1REN
06h
Port P1 drive strength
P1DS
08h
Port P1 selection
P1SEL
0Ah
Port P1 interrupt vector word
P1IV
0Eh
Port P1 interrupt edge select
P1IES
18h
Port P1 interrupt enable
P1IE
1Ah
Port P1 interrupt flag
P1IFG
1Ch
Port P2 input
P2IN
01h
Port P2 output
P2OUT
03h
Port P2 direction
P2DIR
05h
Port P2 pullup/pulldown enable
P2REN
07h
Port P2 drive strength
P2DS
09h
Port P2 selection
P2SEL
0Bh
Port P2 interrupt vector word
P2IV
1Eh
Port P2 interrupt edge select
P2IES
19h
Port P2 interrupt enable
P2IE
1Bh
Port P2 interrupt flag
P2IFG
1Dh
Table 31. Port P3, P4 Registers (Base Address: 0220h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P3 input
P3IN
00h
Port P3 output
P3OUT
02h
Port P3 direction
P3DIR
04h
Port P3 pullup/pulldown enable
P3REN
06h
Port P3 drive strength
P3DS
08h
Port P3 selection
P3SEL
0Ah
Port P4 input
P4IN
01h
Port P4 output
P4OUT
03h
Port P4 direction
P4DIR
05h
Port P4 pullup/pulldown enable
P4REN
07h
Port P4 drive strength
P4DS
09h
Port P4 selection
P4SEL
0Bh
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Table 32. Port P5 Registers (Base Address: 0240h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port P5 input
P5IN
00h
Port P5 output
P5OUT
02h
Port P5 direction
P5DIR
04h
Port P5 pullup/pulldown enable
P5REN
06h
Port P5 drive strength
P5DS
08h
Port P5 selection
P5SEL
0Ah
Table 33. Port J Registers (Base Address: 0320h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Port PJ input
PJIN
00h
Port PJ output
PJOUT
02h
Port PJ direction
PJDIR
04h
Port PJ pullup/pulldown enable
PJREN
06h
Port PJ drive strength
PJDS
08h
Table 34. TA0 Registers (Base Address: 0340h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA0 control
TA0CTL
00h
Capture/compare control 0
TA0CCTL0
02h
Capture/compare control 1
TA0CCTL1
04h
Capture/compare control 2
TA0CCTL2
06h
Capture/compare control 3
TA0CCTL3
08h
Capture/compare control 4
TA0CCTL4
0Ah
TA0 counter register
TA0R
10h
Capture/compare register 0
TA0CCR0
12h
Capture/compare register 1
TA0CCR1
14h
Capture/compare register 2
TA0CCR2
16h
Capture/compare register 3
TA0CCR3
18h
Capture/compare register 4
TA0CCR4
1Ah
TA0 expansion register 0
TA0EX0
20h
TA0 interrupt vector
TA0IV
2Eh
Table 35. TA1 Registers (Base Address: 0380h)
REGISTER DESCRIPTION
REGISTER
OFFSET
TA1 control
TA1CTL
00h
Capture/compare control 0
TA1CCTL0
02h
Capture/compare control 1
TA1CCTL1
04h
Capture/compare control 2
TA1CCTL2
06h
TA1 counter register
TA1R
10h
Capture/compare register 0
TA1CCR0
12h
Capture/compare register 1
TA1CCR1
14h
Capture/compare register 2
TA1CCR2
16h
TA1 expansion register 0
TA1EX0
20h
TA1 interrupt vector
TA1IV
2Eh
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Table 36. Real Time Clock Registers (Base Address: 04A0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
RTC control 0
RTCCTL0
00h
RTC control 1
RTCCTL1
01h
RTC control 2
RTCCTL2
02h
RTC control 3
RTCCTL3
03h
RTC prescaler 0 control
RTCPS0CTL
08h
RTC prescaler 1 control
RTCPS1CTL
0Ah
RTC prescaler 0
RTCPS0
0Ch
RTC prescaler 1
RTCPS1
0Dh
RTC interrupt vector word
RTCIV
0Eh
RTC seconds/counter register 1
RTCSEC/RTCNT1
10h
RTC minutes/counter register 2
RTCMIN/RTCNT2
11h
RTC hours/counter register 3
RTCHOUR/RTCNT3
12h
RTC day of week/counter register 4
RTCDOW/RTCNT4
13h
RTC days
RTCDAY
14h
RTC month
RTCMON
15h
RTC year low
RTCYEARL
16h
RTC year high
RTCYEARH
17h
RTC alarm minutes
RTCAMIN
18h
RTC alarm hours
RTCAHOUR
19h
RTC alarm day of week
RTCADOW
1Ah
RTC alarm days
RTCADAY
1Bh
Table 37. 32-Bit Hardware Multiplier Registers (Base Address: 04C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
16-bit operand 1 - multiply
MPY
00h
16-bit operand 1 - signed multiply
MPYS
02h
16-bit operand 1 - multiply accumulate
MAC
04h
16-bit operand 1 - signed multiply accumulate
MACS
06h
16-bit operand 2
OP2
08h
16 × 16 result low word
RESLO
0Ah
16 × 16 result high word
RESHI
0Ch
16 × 16 sum extension register
SUMEXT
0Eh
32-bit operand 1 - multiply low word
MPY32L
10h
32-bit operand 1 - multiply high word
MPY32H
12h
32-bit operand 1 - signed multiply low word
MPYS32L
14h
32-bit operand 1 - signed multiply high word
MPYS32H
16h
32-bit operand 1 - multiply accumulate low word
MAC32L
18h
32-bit operand 1 - multiply accumulate high word
MAC32H
1Ah
32-bit operand 1 - signed multiply accumulate low word
MACS32L
1Ch
32-bit operand 1 - signed multiply accumulate high word
MACS32H
1Eh
32-bit operand 2 - low word
OP2L
20h
32-bit operand 2 - high word
OP2H
22h
32 × 32 result 0 - least significant word
RES0
24h
32 × 32 result 1
RES1
26h
32 × 32 result 2
RES2
28h
32 × 32 result 3 - most significant word
RES3
2Ah
MPY32 control register 0
MPY32CTL0
2Ch
34
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Table 38. DMA Module Control Registers (Base Address: 0500h)
REGISTER DESCRIPTION
REGISTER
OFFSET
DMA module control 0
DMACTL0
00h
DMA module control 1
DMACTL1
02h
DMA module control 2
DMACTL2
04h
DMA module control 3
DMACTL3
06h
DMA module control 4
DMACTL4
08h
DMA interrupt vector
DMAIV
0Ah
Table 39. DMA Channel 0 Registers (Base Address: 0510h)
REGISTER DESCRIPTION
REGISTER
OFFSET
DMA channel 0 control
DMA0CTL
00h
DMA channel 0 source address low
DMA0SAL
02h
DMA channel 0 source address high
DMA0SAH
04h
DMA channel 0 destination address low
DMA0DAL
06h
DMA channel 0 destination address high
DMA0DAH
08h
DMA channel 0 transfer size
DMA0SZ
0Ah
Table 40. DMA Channel 1 Registers (Base Address: 0520h)
REGISTER DESCRIPTION
REGISTER
OFFSET
DMA channel 1 control
DMA1CTL
00h
DMA channel 1 source address low
DMA1SAL
02h
DMA channel 1 source address high
DMA1SAH
04h
DMA channel 1 destination address low
DMA1DAL
06h
DMA channel 1 destination address high
DMA1DAH
08h
DMA channel 1 transfer size
DMA1SZ
0Ah
Table 41. DMA Channel 2 Registers (Base Address: 0530h)
REGISTER DESCRIPTION
REGISTER
OFFSET
DMA channel 2 control
DMA2CTL
00h
DMA channel 2 source address low
DMA2SAL
02h
DMA channel 2 source address high
DMA2SAH
04h
DMA channel 2 destination address low
DMA2DAL
06h
DMA channel 2 destination address high
DMA2DAH
08h
DMA channel 2 transfer size
DMA2SZ
0Ah
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Table 42. USCI_A0 Registers (Base Address: 05C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI control 1
UCA0CTL1
00h
USCI control 0
UCA0CTL0
01h
USCI baud rate 0
UCA0BR0
06h
USCI baud rate 1
UCA0BR1
07h
USCI modulation control
UCA0MCTL
08h
USCI status
UCA0STAT
0Ah
USCI receive buffer
UCA0RXBUF
0Ch
USCI transmit buffer
UCA0TXBUF
0Eh
USCI LIN control
UCA0ABCTL
10h
USCI IrDA transmit control
UCA0IRTCTL
12h
USCI IrDA receive control
UCA0IRRCTL
13h
USCI interrupt enable
UCA0IE
1Ch
USCI interrupt flags
UCA0IFG
1Dh
USCI interrupt vector word
UCA0IV
1Eh
Table 43. USCI_B0 Registers (Base Address: 05E0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
USCI synchronous control 1
UCB0CTL1
00h
USCI synchronous control 0
UCB0CTL0
01h
USCI synchronous bit rate 0
UCB0BR0
06h
USCI synchronous bit rate 1
UCB0BR1
07h
USCI synchronous status
UCB0STAT
0Ah
USCI synchronous receive buffer
UCB0RXBUF
0Ch
USCI synchronous transmit buffer
UCB0TXBUF
0Eh
USCI I2C own address
UCB0I2COA
10h
USCI I2C slave address
UCB0I2CSA
12h
USCI interrupt enable
UCB0IE
1Ch
USCI interrupt flags
UCB0IFG
1Dh
USCI interrupt vector word
UCB0IV
1Eh
Table 44. ADC10_A Registers (Base Address: 0740h)
REGISTER DESCRIPTION
REGISTER
OFFSET
ADC10_A Control register 0
ADC10CTL0
00h
ADC10_A Control register 1
ADC10CTL1
02h
ADC10_A Control register 2
ADC10CTL2
04h
ADC10_A Window Comparator Low Threshold
ADC10LO
06h
ADC10_A Window Comparator High Threshold
ADC10HI
08h
ADC10_A Memory Control Register 0
ADC10MCTL0
0Ah
ADC10_A Conversion Memory Register
ADC10MEM0
12h
ADC10_A Interrupt Enable
ADC10IE
1Ah
ADC10_A Interrupt Flags
ADC10IGH
1Ch
ADC10_A Interrupt Vector Word
ADC10IV
1Eh
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Table 45. Comparator_B Registers (Base Address: 08C0h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Comp_B control register 0
CBCTL0
00h
Comp_B control register 1
CBCTL1
02h
Comp_B control register 2
CBCTL2
04h
Comp_B control register 3
CBCTL3
06h
Comp_B interrupt register
CBINT
0Ch
Comp_B interrupt vector word
CBIV
0Eh
Table 46. AES Accelerator Registers (Base Address: 09C0h)
REGISTER DESCRIPTION
AES accelerator control register 0
REGISTER
AESACTL0
OFFSET
00h
Reserved
02h
AES accelerator status register
AESASTAT
04h
AES accelerator key register
AESAKEY
06h
AES accelerator data in register
AESADIN
008h
AES accelerator data out register
AESADOUT
00Ah
Table 47. LCD_B Registers (Base Address: 0A00h)
REGISTER DESCRIPTION
REGISTER
OFFSET
LCD_B control register 0
LCDBCTL0
000h
LCD_B control register 1
LCDBCTL1
002h
LCD_B blinking control register
LCDBBLKCTL
004h
LCD_B memory control register
LCDBMEMCTL
006h
LCD_B voltage control register
LCDBVCTL
008h
LCD_B port control register 0
LCDBPCTL0
00Ah
LCD_B port control register 1
LCDBPCTL1
00Ch
LCD_B charge pump control register
LCDBCTL0
012h
LCD_B interrupt vector word
LCDBIV
01Eh
LCD_B memory 1
LCDM1
020h
LCD_B memory 2
LCDM2
021h
LCD_B memory 14
LCDM14
02Dh
LCD_B blinking memory 1
LCDBM1
040h
LCD_B blinking memory 2
LCDBM2
041h
LCDBM14
04Dh
...
...
LCD_B blinking memory 14
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Table 48. Radio Interface Registers (Base Address: 0F00h)
REGISTER DESCRIPTION
REGISTER
OFFSET
Radio interface control register 0
RF1AIFCTL0
00h
Radio interface control register 1
RF1AIFCTL1
02h
Radio interface error flag register
RF1AIFERR
06h
Radio interface error vector word
RF1AIFERRV
0Ch
Radio interface interrupt vector word
RF1AIFIV
0Eh
Radio instruction word register
RF1AINSTRW
10h
Radio instruction word register, 1-byte auto-read
RF1AINSTR1W
12h
Radio instruction word register, 2-byte auto-read
RF1AINSTR2W
14h
Radio data in register
RF1ADINW
16h
Radio status word register
RF1ASTATW
20h
Radio status word register, 1-byte auto-read
RF1ASTAT1W
22h
Radio status word register, 2-byte auto-read
RF1AISTAT2W
24h
Radio data out register
RF1ADOUTW
28h
Radio data out register, 1-byte auto-read
RF1ADOUT1W
2Ah
Radio data out register, 2-byte auto-read
RF1ADOUT2W
2Ch
Radio core signal input register
RF1AIN
30h
Radio core interrupt flag register
RF1AIFG
32h
Radio core interrupt edge select register
RF1AIES
34h
Radio core interrupt enable register
RF1AIE
36h
Radio core interrupt vector word
RF1AIV
38h
38
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Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
Voltage applied at DVCC and AVCC pins to VSS
-0.3 V to 4.1 V
-0.3 V to (VCC + 0.3 V),
4.1 V Maximum
Voltage applied to any pin (excluding VCORE, RF_P, RF_N, and R_BIAS) (2)
Voltage applied to VCORE, RF_P, RF_N, and R_BIAS (2)
-0.3 V to 2.0 V
Input RF level at pins RF_P and RF_N
10 dBm
Diode current at any device terminal
±2 mA
Storage temperature range (3), Tstg
-55°C to 150°C
Maximum junction temperature, TJ
95°C
(1)
(2)
(3)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to VSS.
Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
Thermal Packaging Characteristics CC430F51xx
θJA
Junction-to-ambient thermal resistance, still air
Low-K board
48 QFN (RGZ)
98°C/W
High-K board
48 QFN (RGZ)
28°C/W
Low-K board
64 QFN (RGC)
83°C/W
High-K board
64 QFN (RGC)
26°C/W
Thermal Packaging Characteristics CC430F61xx
θJA
Junction-to-ambient thermal resistance, still air
Recommended Operating Conditions
MIN
NOM
MAX
UNIT
Supply voltage range applied at all DVCC and AVCC
pins (1) (2) during program execution and flash
programming with PMM default settings. Radio is not
operational with PMMCOREVx = 0, 1. (3)
PMMCOREVx = 0
(default after POR)
1.8
3.6
V
PMMCOREVx = 1
2.0
3.6
V
Supply voltage range applied at all DVCC and AVCC
pins (1) (2) during program execution, flash programming
and radio operation with PMM default settings. (3)
PMMCOREVx = 2
2.2
3.6
V
VCC
PMMCOREVx = 3
2.4
3.6
V
VCC
Supply voltage range applied at all DVCC and AVCC
pins (1) (2) during program execution, flash programming
and radio operation with PMMCOREVx = 2, high-side
SVS level lowered (SVSHRVLx = SVSHRRRLx = 1) or
high-side SVS disabled (SVSHE = 0). (4) (3)
PMMCOREVx = 2,
SVSHRVLx = SVSHRRRLx = 1
or SVSHE = 0
2.0
3.6
V
VSS
Supply voltage applied at the exposed die attach VSS
and AVSS pin
TA
Operating free-air temperature
-40
85
TJ
Operating junction temperature
-40
85
CVCORE
Recommended capacitor at VCORE
CVCORE
Reduced capacitor at VCORE
CDVCC
Recommended capacitor at DVCC
VCC
(1)
(2)
(3)
(4)
0
V
470
fSYSTEM ≤ 16 MHz,
PMMCOREVx ≤ 2, VCC ≥ 2.2 V
°C
°C
nF
100
nF
4.7
µF
It is recommended to power AVCC and DVCC from the same source. A maximum difference of 0.3 V between AVCC and DVCC can be
tolerated during power up and operation.
The minimum supply voltage is defined by the supervisor SVS levels when it is enabled. See the PMM, SVS High Side threshold
parameters for the exact values and further details.
Modules may have a different supply voltage range specification. See the specification of the respective module in this data sheet.
Lowering the high-side SVS level or disabling the high-side SVS might cause the LDO to operate out of regulation but the core voltage
still stays within its limits and is still supervised by the low-side SVS to ensure reliable operation.
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Recommended Operating Conditions (continued)
MIN
fSYSTEM
Processor (MCLK) frequency (5) (see Figure 2)
PINT
Internal power dissipation
PIO
I/O power dissipation of I/O pins powered by DVCC
PMAX
Maximum allowed power dissipation, PMAX > PIO + PINT
(5)
MAX
UNIT
0
8
MHz
PMMCOREVx = 1
0
12
MHz
PMMCOREVx = 2
0
16
MHz
PMMCOREVx = 3
0
20
MHz
PMMCOREVx = 0
(default condition)
NOM
VCC × IDVCC
W
(VCC - VIOH) × IIOH +
VIOL × IIOL
W
(TJ - TA) / θJA
W
Modules may have a different maximum input clock specification. See the specification of the respective module in this data sheet.
System Frequency - MHz
20
3
16
2
2, 3
1
1, 2
1, 2, 3
0, 1
0, 1, 2
0, 1, 2, 3
12
8
0
0
1.8
2.0
2.2
2.4
3.6
Supply Voltage - V
The numbers within the fields denote the supported PMMCOREVx settings.
Figure 2. Maximum System Frequency
40
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Electrical Characteristics
Active Mode Supply Current Into VCC Excluding External Current
over recommended operating free-air temperature (unless otherwise noted) (1) (2) (3)
FREQUENCY (fDCO = fMCLK = fSMCLK)
PARAMETER
IAM,
IAM,
(1)
(2)
(3)
(4)
(5)
Flash
RAM
(4)
(5)
EXECUTION
MEMORY
Flash
RAM
VCC
PMMCOREVx
3.0 V
3.0 V
1 MHz
8 MHz
12 MHz
TYP
MAX
1.55
2.30
2.65
1.75
16 MHz
TYP
MAX
TYP
MAX
0
0.23
0.26
1.35
1.60
TYP
MAX
1
0.25
0.28
2
0.27
0.30
2.60
3.45
3.90
3
0.28
0.32
1.85
0
0.18
0.20
0.95
2.75
3.65
1
0.20
0.22
1.10
1.60
2
0.21
0.24
1.20
1.80
2.40
3
0.22
0.25
1.30
1.90
2.50
20 MHz
TYP
UNIT
MAX
mA
4.55
5.10
1.10
1.85
mA
2.70
3.10
3.60
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
Characterized with program executing typical data processing.
fACLK = 32786 Hz, fDCO = fMCLK = fSMCLK at specified frequency.
XTS = CPUOFF = SCG0 = SCG1 = OSCOFF= SMCLKOFF = 0.
Active mode supply current when program executes in flash at a nominal supply voltage of 3.0 V.
Active mode supply current when program executes in RAM at a nominal supply voltage of 3.0 V.
Typical Characteristics - Active Mode Supply Currents
Active Mode Supply Current
vs
MCLK Frequency
IAM - Active Mode Supply Current - mA
5
V CC = 3.0 V
PMMVCOREx=3
4
3
PMMVCOREx=2
2
PMMVCOREx=1
1
PMMVCOREx=0
0
0
5
10
15
20
MCLK Frequency - MHz
Figure 3.
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Low-Power Mode Supply Currents (Into VCC) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
(2)
Temperature (TA)
PARAMETER
VCC
PMMCOREVx
-40°C
TYP
ILPM0,1MHz
Low-power mode 0 (3) (4)
ILPM2
Low-power mode 2 (5) (4)
ILPM3,XT1LF
ILPM3,VLO,WDT
ILPM4
ILPM3.5
ILPM4.5
Low-power mode 3,
crystal mode (6) (4)
Low-power mode 3,
VLO mode, only WDT
enabled (7) (4)
Low-power mode 4 (8) (4)
Low-power mode 3.5 (9)
Low-power mode 4.5 (10)
25°C
MAX
TYP
60°C
MAX
TYP
85°C
MAX
TYP
UNIT
MAX
2.2 V
0
80
100
80
100
80
100
80
100
3.0 V
3
90
110
90
110
90
110
90
110
2.2 V
0
6.5
11
6.5
11
6.5
11
6.5
11
3.0 V
3
7.5
12
7.5
12
7.5
12
7.5
12
0
1.8
2.0
2.6
3.0
4.0
4.4
5.9
1
1.9
2.1
3.2
4.8
2
2.0
2.2
3.4
5.1
3
2.0
2.2
2.9
3.5
4.8
5.3
7.4
0
0.9
1.1
2.3
2.1
3.7
3.5
5.6
1
1.0
1.2
2.3
3.9
2
1.1
1.3
2.5
4.2
3
1.1
1.3
2.6
2.6
4.5
4.4
7.1
0
0.8
1.0
2.2
2.0
3.6
3.4
5.5
1
0.9
1.1
2.2
3.8
2
1.0
1.2
2.4
4.1
3.0 V
3.0 V
3.0 V
µA
µA
µA
µA
µA
3
1.0
1.2
2.5
2.5
4.4
4.3
7.0
2.2 V
n/a
0.7
0.9
1.4
1.0
1.5
1.2
1.7
µA
3.0 V
n/a
1.0
1.0
1.5
1.2
1.7
1.4
1.8
µA
2.2 V
n/a
0.2
0.25
0.7
0.4
0.9
0.6
1.1
µA
3.0 V
n/a
0.3
0.3
0.8
0.4
0.9
0.7
1.2
µA
(1)
(2)
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
(3) Current for watchdog timer clocked by SMCLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 0, OSCOFF = 0 (LPM0); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 1 MHz
(4) Current for brownout and high-side supervisor (SVSH) normal mode included. Low-side supervisor (SVSL) and low-side monitor (SVML)
disabled. High-side monitor disabled (SVMH). RAM retention enabled.
(5) Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low frequency crystal operation
(XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 0, SCG1 = 1, OSCOFF = 0 (LPM2); fACLK = 32768 Hz, fMCLK = 0 MHz, fSMCLK = fDCO = 0 MHz; DCO setting = 1
MHz operation, DCO bias generator enabled.
(6) Current for watchdog timer clocked by ACLK and RTC clocked by LFXT1 (32768 Hz) included. ACLK = low frequency crystal operation
(XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz
(7) Current for watchdog timer clocked by VLO included.
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = fVLO, fMCLK = fSMCLK = fDCO = 0 MHz
(8) CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1 (LPM4); fDCO = fACLK = fMCLK = fSMCLK = 0 MHz
(9) Internal regulator disabled. No data retention except Backup RAM. CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1, PMMREGOFF =
1 (LPMx.5), RTC active (Calendar mode) with RTCHOLD = 0 (LPM3.5) and fXT1 = 32768 Hz, fDCO = fACLK = fMCLK = fSMCLK = 0 MHz.
(10) Internal regulator disabled. No data retention except bBackup RAM. CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 1, PMMREGOFF
= 1 (LPMx.5), RTC disabled with RTCHOLD = 1 (LPM4.5), fDCO = fACLK = fMCLK = fSMCLK = 0 MHz.
42
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Typical Characteristics - Low-Power Mode Supply Currents
LPM3 Supply Current
vs
Temperature
LPM4 Supply Current
vs
Temperature
5
5
V DD = 3.0 V
ILPM4 - LPM4 Supply Current - uA
ILPM3,XT1LF - LPM3 Supply Current - uA
V CC = 3.0 V
4
3
PMMCOREVx = 3
2
PMMCOREVx = 0
1
4
3
2
PMMCOREVx = 3
1
PMMCOREVx = 0
0
-40
-20
0
20
40
60
0
-40
80
TA - Free-Air Tem perature - °C
-20
0
60
80
Figure 5.
LPM3.5 Supply Current
vs
Temperature
LPM4.5 Supply Current
vs
Temperature
VCC = 3.0 V
VCC = 3.0 V
2
ILPM4.5 - LPM4.5 Supply Current - uA
ILPM3.5 - LPM3.5 Supply Current - uA
40
TA - Free-Air Tem perature - °C
Figure 4.
2
20
1.5
1
0.5
1.5
1
0.5
0
0
-40
-20
0
20
40
60
TA - Free-Air Temperature - °C
Figure 6.
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80
-40
-20
0
20
40
60
80
TA - Free-Air Temperature - ˚C
Figure 7.
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Low-Power Mode With LCD Supply Currents (Into VCC) Excluding External Current
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
(2)
Temperature (TA)
PARAMETER
VCC
PMMCOREVx
-40°C
TYP
ILPM3
LCD,
int. bias
Low-power mode 3
(LPM3) current, LCD 4mux mode, internal
biasing, charge pump
disabled (3) (4)
3.0 V
2.2 V
ILPM3
LCD,CP
(1)
(2)
(3)
(4)
(5)
44
Low-power mode 3
(LPM3) current, LCD 4mux mode, internal
biasing, charge pump
enabled (3) (5)
3.0 V
MAX
25°C
TYP
60°C
MAX
TYP
85°C
TYP
0
3.1
3.3
4.3
5.8
1
3.2
3.4
4.5
6.2
2
3.3
3.5
4.7
6.5
3
3.3
3.5
4.8
6.7
0
4.0
1
4.1
2
4.2
0
4.2
1
4.3
2
4.5
3
4.5
4.0
MAX
4.3
UNIT
MAX
7.4
µA
8.9
µA
All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
The currents are characterized with a Micro Crystal MS1V-T1K crystal with a load capacitance of 12.5 pF. The internal and external load
capacitance are chosen to closely match the required 12.5 pF.
Current for watchdog timer and RTC clocked by ACLK included. ACLK = low frequency crystal operation (XTS = 0, XT1DRIVEx = 0).
CPUOFF = 1, SCG0 = 1, SCG1 = 1, OSCOFF = 0 (LPM3); fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO = 0 MHz
Current for brownout, high-side supervisor (SVSH) normal mode included. Low-side supervisor and monitors disabled (SVSL, SVML).
High side monitor disabled (SVMH). RAM retention enabled.
LCDMx = 11 (4-mux mode), LCDREXT=0, LCDEXTBIAS=0 (internal biasing), LCD2B=0 (1/3 bias), LCDCPEN=0 (charge pump
disabled), LCDSSEL=0, LCDPREx=101, LCDDIVx=00011 (fLCD = 32768 Hz/32/4 = 256 Hz)
Even segments S0, S2,...=0, odd segments S1, S3,...=1. No LCD panel load.
LCDMx = 11 (4-mux mode), LCDREXT=0, LCDEXTBIAS=0 (internal biasing), LCD2B=0 (1/3 bias), LCDCPEN = 1 (charge pump
enabled), VLCDx = 1000 (VLCD= 3 V typ.), LCDSSEL=0, LCDPREx=101, LCDDIVx=00011 (fLCD = 32768 Hz/32/4 = 256 Hz)
Even segments S0, S2,...=0, odd segments S1, S3,...=1. No LCD panel load.
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Digital Inputs
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VIT+
Positive-going input threshold voltage
VIT-
Negative-going input threshold voltage
Vhys
Input voltage hysteresis (VIT+ - VIT-)
RPull
Pullup/pulldown resistor
For pullup: VIN = VSS,
For pulldown: VIN = VCC
CI
Input capacitance
VIN = VSS or VCC
Ilkg(Px.x)
High-impedance leakage current
t(int)
External interrupt timing (external trigger pulse
duration to set interrupt flag) (3)
(1)
(2)
(3)
VCC
MIN
1.8 V
0.80
1.40
3V
1.50
2.10
1.8 V
0.45
1.00
3V
0.75
1.65
1.8 V
0.3
0.8
3V
0.4
1.0
20
35
MAX
1.8 V, 3 V
UNIT
V
V
V
50
kΩ
±50
nA
5
(1) (2)
Ports with interrupt capability
(see block diagram and
terminal function descriptions)
TYP
pF
20
ns
The leakage current is measured with VSS or VCC applied to the corresponding pin(s), unless otherwise noted.
The leakage of the digital port pins is measured individually. The port pin is selected for input and the pullup/pulldown resistor is
disabled.
An external signal sets the interrupt flag every time the minimum interrupt pulse duration t(int) is met. It may be set by trigger signals
shorter than t(int).
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Digital Outputs
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
MAX
UNIT
VOH
High-level output voltage,
Reduced Drive Strength (1)
I(OHmax) = -1 mA, PxDS.y = 0 (2)
1.8 V
VCC - 0.25
VCC
V
VOH
High-level output voltage,
Reduced Drive Strength (1)
I(OHmax) = -3 mA, PxDS.y = 0 (3)
1.8 V
VCC - 0.60
VCC
V
VOH
High-level output voltage,
Reduced Drive Strength (1)
I(OHmax) = -2 mA, PxDS.y = 0 (2)
3.0 V
VCC - 0.25
VCC
V
VOH
High-level output voltage,
Reduced Drive Strength (1)
I(OHmax) = -6 mA, PxDS.y = 0 (3)
3.0 V
VCC - 0.60
VCC
V
VOL
Low-level output voltage,
Reduced Drive Strength (1)
I(OLmax) = 1 mA, PxDS.y = 0 (2)
1.8 V
VSS VSS + 0.25
V
VOL
Low-level output voltage,
Reduced Drive Strength (1)
I(OLmax) = 3 mA, PxDS.y = 0 (3)
1.8 V
VSS VSS + 0.60
V
VOL
Low-level output voltage,
Reduced Drive Strength (1)
I(OLmax) = 2 mA, PxDS.y = 0 (2)
3.0 V
VSS VSS + 0.25
V
VOL
Low-level output voltage,
Reduced Drive Strength (1)
I(OLmax) = 6 mA, PxDS.y = 0 (3)
3.0 V
VSS VSS + 0.60
V
VOH
High-level output voltage,
Full Drive Strength
I(OHmax) = -3 mA, PxDS.y = 1 (2)
1.8 V
VCC - 0.25
VCC
V
VOH
High-level output voltage,
Full Drive Strength
I(OHmax) = -10 mA, PxDS.y = 1 (3)
1.8 V
VCC - 0.60
VCC
V
VOH
High-level output voltage,
Full Drive Strength
I(OHmax) = -5 mA, PxDS.y = 1 (2)
3V
VCC - 0.25
VCC
V
VOH
High-level output voltage,
Full Drive Strength
I(OHmax) = -15 mA, PxDS.y = 1 (3)
3V
VCC - 0.60
VCC
V
VOL
Low-level output voltage,
Full Drive Strength
I(OLmax) = 3 mA, PxDS.y = 1 (2)
1.8 V
VSS VSS + 0.25
V
VOL
Low-level output voltage,
Full Drive Strength
I(OLmax) = 10 mA, PxDS.y = 1 (3)
1.8 V
VSS VSS + 0.60
V
VOL
Low-level output voltage,
Full Drive Strength
I(OLmax) = 5 mA, PxDS.y = 1 (2)
3V
VSS VSS + 0.25
V
VOL
Low-level output voltage,
Full Drive Strength
I(OLmax) = 15 mA, PxDS.y = 1 (3)
3V
VSS VSS + 0.60
V
fPx.y
Port output frequency
(with load)
fPort_CLK
(1)
(2)
(3)
(4)
(5)
46
Clock output frequency
CL = 20 pF, RL
CL = 20 pF (5)
(4) (5)
VCC = 1.8 V,
PMMCOREVx = 0
16
VCC = 3 V,
PMMCOREVx = 2
25
VCC = 1.8 V,
PMMCOREVx = 0
16
VCC = 3 V,
PMMCOREVx = 2
25
MHz
MHz
Selecting reduced drive strength may reduce EMI.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±48 mA to hold the maximum voltage drop
specified.
The maximum total current, I(OHmax) and I(OLmax), for all outputs combined should not exceed ±100 mA to hold the maximum voltage
drop specified.
A resistive divider with 2 × R1 between VCC and VSS is used as load. The output is connected to the center tap of the divider. For full
drive strength, R1 = 550 Ω. For reduced drive strength, R1 = 1.6 kΩ. CL = 20 pF is connected to the output to VSS.
The output voltage reaches at least 10% and 90% VCC at the specified toggle frequency.
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Typical Characteristics - Outputs, Reduced Drive Strength (PxDS.y = 0)
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
8
V CC = 3.0 V
P4.3
IOL - Typical Low-Level Output Current - mA
IOL - Typical Low-Level Output Current - mA
25
TA = 25°C
20
TA = 85°C
15
10
5
0
V CC = 1.8 V
V DD = 5.5 V
P4.3
7
6
TA = 85°C
5
4
3
2
1
0
0
0.5
1
1.5
2
2.5
3
3.5
0
V OL - Low -Level Output Voltage - V
0.5
1
1.5
2
V OL - Low -Level Output Voltage - V
Figure 8.
Figure 9.
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0
0
V CC = 3.0 V
V CC = 3.0 V
P4.3
IOH - Typical High-Level Output Current - mA
IOH - Typical High-Level Output Current - mA
TA = 25°C
-5
-10
-15
TA = 85°C
-20
TA = 25°C
-25
V CC = 1.8 V
V DD = 5.5 V
P4.3
-1
-2
-3
-4
-5
TA = 85°C
-6
TA = 25°C
-7
-8
0
0.5
1
1.5
2
2.5
3
V OH - High-Level Output Voltage - V
Figure 10.
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3.5
0
0.5
1
1.5
2
V OH - High-Level Output Voltage - V
Figure 11.
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Typical Characteristics - Outputs, Full Drive Strength (PxDS.y = 1)
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
TYPICAL LOW-LEVEL OUTPUT CURRENT
vs
LOW-LEVEL OUTPUT VOLTAGE
25
V CC = 3.0 V
P4.3
TA = 25°C
IOL - Typical Low-Level Output Current - mA
IOL - Typical Low-Level Output Current - mA
60
50
TA = 85°C
40
30
20
10
0
V CC = 1.8 V
V DD = 5.5 V
P4.3
TA = 25°C
20
TA = 85°C
15
10
5
0
0
0.5
1
1.5
2
2.5
3
3.5
0
V OL - Low -Level Output Voltage - V
0.5
2
Figure 13.
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
TYPICAL HIGH-LEVEL OUTPUT CURRENT
vs
HIGH-LEVEL OUTPUT VOLTAGE
0
0
V CC = 3.0 V
V CC = 3.0 V
P4.3
IOH - Typical High-Level Output Current - mA
IOH - Typical High-Level Output Current - mA
1.5
V OL - Low -Level Output Voltage - V
Figure 12.
-10
-20
-30
-40
TA = 85°C
-50
TA = 25°C
-60
V CC = 1.8 V
V DD = 5.5 V
P4.3
-5
-10
-15
TA = 85°C
-20
TA = 25°C
-25
0
0.5
1
1.5
2
2.5
3
V OH - High-Level Output Voltage - V
Figure 14.
48
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3.5
0
0.5
1
1.5
2
V OH - High-Level Output Voltage - V
Figure 15.
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Crystal Oscillator, XT1, Low-Frequency Mode (1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 1, TA = 25°C
ΔIDVCC.LF
Differential XT1 oscillator crystal
current consumption from lowest
drive setting, LF mode
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 2, TA = 25°C
3V
0.170
0.290
32768
XT1 oscillator crystal frequency,
LF mode
XTS = 0, XT1BYPASS = 0
fXT1,LF,SW
XT1 oscillator logic-level squarewave input frequency, LF mode
XTS = 0, XT1BYPASS = 1 (2) (3)
OALF
Oscillation allowance for
LF crystals (4)
10
fFault,LF
tSTART,LF
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
32.768
XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 0,
fXT1,LF = 32768 Hz, CL,eff = 6 pF
210
XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 1,
fXT1,LF = 32768 Hz, CL,eff = 12 pF
300
UNIT
µA
Hz
50
kHz
kΩ
XTS = 0, XCAPx = 0 (6)
Integrated effective load
capacitance, LF mode (5)
MAX
0.075
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3, TA = 25°C
fXT1,LF0
CL,eff
TYP
2
XTS = 0, XCAPx = 1
5.5
XTS = 0, XCAPx = 2
8.5
XTS = 0, XCAPx = 3
12.0
pF
Duty cycle, LF mode
XTS = 0, Measured at ACLK,
fXT1,LF = 32768 Hz
30
70
%
Oscillator fault frequency,
LF mode (7)
XTS = 0 (8)
10
10000
Hz
Startup time, LF mode
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 0,
TA = 25°C, CL,eff = 6 pF
fOSC = 32768 Hz, XTS = 0,
XT1BYPASS = 0, XT1DRIVEx = 3,
TA = 25°C, CL,eff = 12 pF
1000
3V
ms
500
To improve EMI on the XT1 oscillator, the following guidelines should be observed.
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in
the Schmitt-trigger Inputs section of this datasheet.
Maximum frequency of operation of the entire device cannot be exceeded.
Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the
XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following
guidelines, but should be evaluated based on the actual crystal selected for the application:
(a) For XT1DRIVEx = 0, CL,eff ≤ 6 pF
(b) For XT1DRIVEx = 1, 6 pF ≤ CL,eff ≤ 9 pF
(c) For XT1DRIVEx = 2, 6 pF ≤ CL,eff ≤ 10 pF
(d) For XT1DRIVEx = 3, CL,eff ≥ 6 pF
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
Measured with logic-level input frequency but also applies to operation with crystals.
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Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
fVLO
VLO frequency
Measured at ACLK
1.8 V to 3.6 V
dfVLO/dT
VLO frequency temperature drift
Measured at ACLK (1)
1.8 V to 3.6 V
Measured at ACLK (2)
1.8 V to 3.6 V
Measured at ACLK
1.8 V to 3.6 V
dfVLO/dVCC VLO frequency supply voltage drift
Duty cycle
(1)
(2)
MIN
TYP
MAX
6
9.4
14
0.5
kHz
%/°C
4
40
UNIT
%/V
50
60
TYP
MAX
%
Calculated using the box method: (MAX(-40 to 85°C) - MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C - (-40°C))
Calculated using the box method: (MAX(1.8 to 3.6 V) - MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V - 1.8 V)
Internal Reference, Low-Frequency Oscillator (REFO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
IREFO
REFO oscillator current consumption
TA = 25°C
1.8 V to 3.6 V
3
fREFO
REFO frequency calibrated
Measured at ACLK
1.8 V to 3.6 V
32768
REFO absolute tolerance calibrated
Full temperature range
1.8 V to 3.6 V
µA
Hz
±3.5
REFO absolute tolerance calibrated
TA = 25°C
REFO frequency temperature drift
Measured at ACLK (1)
1.8 V to 3.6 V
0.01
%/°C
dfREFO/dVCC
REFO frequency supply voltage drift
Measured at ACLK (2)
1.8 V to 3.6 V
1.0
%/V
Duty cycle
Measured at ACLK
1.8 V to 3.6 V
REFO startup time
40%/60% duty cycle
1.8 V to 3.6 V
(1)
(2)
50
±1.5
%
dfREFO/dT
tSTART
3V
UNIT
40
50
25
60
%
%
µs
Calculated using the box method: (MAX(-40 to 85°C) - MIN(-40 to 85°C)) / MIN(-40 to 85°C) / (85°C - (-40°C))
Calculated using the box method: (MAX(1.8 to 3.6 V) - MIN(1.8 to 3.6 V)) / MIN(1.8 to 3.6 V) / (3.6 V - 1.8 V)
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DCO Frequency
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
fDCO(0,0)
DCO frequency (0, 0)
DCORSELx = 0, DCOx = 0, MODx = 0
0.07
0.20
MHz
fDCO(0,31)
DCO frequency (0, 31)
DCORSELx = 0, DCOx = 31, MODx = 0
0.70
1.70
MHz
fDCO(1,0)
DCO frequency (1, 0)
DCORSELx = 1, DCOx = 0, MODx = 0
0.15
0.36
MHz
fDCO(1,31)
DCO frequency (1, 31)
DCORSELx = 1, DCOx = 31, MODx = 0
1.47
3.45
MHz
fDCO(2,0)
DCO frequency (2, 0)
DCORSELx = 2, DCOx = 0, MODx = 0
0.32
0.75
MHz
fDCO(2,31)
DCO frequency (2, 31)
DCORSELx = 2, DCOx = 31, MODx = 0
3.17
7.38
MHz
fDCO(3,0)
DCO frequency (3, 0)
DCORSELx = 3, DCOx = 0, MODx = 0
0.64
1.51
MHz
fDCO(3,31)
DCO frequency (3, 31)
DCORSELx = 3, DCOx = 31, MODx = 0
6.07
14.0
MHz
fDCO(4,0)
DCO frequency (4, 0)
DCORSELx = 4, DCOx = 0, MODx = 0
1.3
3.2
MHz
fDCO(4,31)
DCO frequency (4, 31)
DCORSELx = 4, DCOx = 31, MODx = 0
12.3
28.2
MHz
fDCO(5,0)
DCO frequency (5, 0)
DCORSELx = 5, DCOx = 0, MODx = 0
2.5
6.0
MHz
fDCO(5,31)
DCO frequency (5, 31)
DCORSELx = 5, DCOx = 31, MODx = 0
23.7
54.1
MHz
fDCO(6,0)
DCO frequency (6, 0)
DCORSELx = 6, DCOx = 0, MODx = 0
4.6
10.7
MHz
fDCO(6,31)
DCO frequency (6, 31)
DCORSELx = 6, DCOx = 31, MODx = 0
39.0
88.0
MHz
fDCO(7,0)
DCO frequency (7, 0)
DCORSELx = 7, DCOx = 0, MODx = 0
8.5
19.6
MHz
fDCO(7,31)
DCO frequency (7, 31)
DCORSELx = 7, DCOx = 31, MODx = 0
60
135
MHz
SDCORSEL
Frequency step between range
DCORSEL and DCORSEL + 1
SRSEL = fDCO(DCORSEL+1,DCO)/fDCO(DCORSEL,DCO)
1.2
2.3
ratio
SDCO
Frequency step between tap
DCO and DCO + 1
SDCO = fDCO(DCORSEL,DCO+1)/fDCO(DCORSEL,DCO)
1.02
1.12
ratio
Duty cycle
Measured at SMCLK
dfDCO/dT
DCO frequency temperature drift
fDCO = 1 MHz
0.1
%/°C
dfDCO/dVCC
DCO frequency voltage drift
fDCO = 1 MHz
1.9
%/V
40
50
60
%
Typical DCO Frequency, VCC = 3.0 V, TA = 25°C
100
fDCO – MHz
10
DCOx = 31
1
0.1
DCOx = 0
0
1
2
3
4
5
6
7
DCORSEL
Figure 16. Typical DCO frequency
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PMM, Brown-Out Reset (BOR)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V(DVCC_BOR_IT-)
BORH on voltage,
DVCC falling level
| dDVCC/dt | < 3 V/s
V(DVCC_BOR_IT+)
BORH off voltage,
DVCC rising level
| dDVCC/dt | < 3 V/s
V(DVCC_BOR_hys) BORH hysteresis
tRESET
MIN
0.80
TYP
1.30
60
Pulse duration required at RST/NMI pin to accept a reset
MAX
UNIT
1.45
V
1.50
V
250
mV
2
µs
PMM, Core Voltage
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VCORE3(AM)
Core voltage, active mode, PMMCOREV = 3
2.4 V ≤ DVCC ≤ 3.6 V
1.90
V
VCORE2(AM)
Core voltage, active mode, PMMCOREV = 2
2.2 V ≤ DVCC ≤ 3.6 V
1.80
V
VCORE1(AM)
Core voltage, active mode, PMMCOREV = 1
2.0 V ≤ DVCC ≤ 3.6 V
1.60
V
VCORE0(AM)
Core voltage, active mode, PMMCOREV = 0
1.8 V ≤ DVCC ≤ 3.6 V
1.40
V
VCORE3(LPM)
Core voltage, low-current mode, PMMCOREV = 3
2.4 V ≤ DVCC ≤ 3.6 V
1.93
V
VCORE2(LPM)
Core voltage, low-current mode, PMMCOREV = 2
2.2 V ≤ DVCC ≤ 3.6 V
1.90
V
VCORE1(LPM)
Core voltage, low-current mode, PMMCOREV = 1
2.0 V ≤ DVCC ≤ 3.6 V
1.70
V
VCORE0(LPM)
Core voltage, low-current mode, PMMCOREV = 0
1.8 V ≤ DVCC ≤ 3.6 V
1.50
V
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PMM, SVS High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVSHE = 0, DVCC = 3.6 V
I(SVSH)
V(SVSH_IT-)
SVS current consumption
SVSH on voltage level (1)
V(SVSH_IT+) SVSH off voltage level (1)
tpd(SVSH)
SVSH propagation delay
t(SVSH)
SVSH on or off delay time
dVDVCC/dt
DVCC rise time
(1)
TYP
MAX
UNIT
0
nA
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 0
200
nA
SVSHE = 1, DVCC = 3.6 V, SVSHFP = 1
1.5
µA
SVSHE = 1, SVSHRVL = 0
1.55
1.62
1.69
SVSHE = 1, SVSHRVL = 1
1.75
1.82
1.89
SVSHE = 1, SVSHRVL = 2
1.95
2.02
2.09
SVSHE = 1, SVSHRVL = 3
2.05
2.12
2.19
SVSHE = 1, SVSMHRRL = 0
1.60
1.70
1.80
SVSHE = 1, SVSMHRRL = 1
1.80
1.90
2.00
SVSHE = 1, SVSMHRRL = 2
2.00
2.10
2.20
SVSHE = 1, SVSMHRRL = 3
2.10
2.20
2.30
SVSHE = 1, SVSMHRRL = 4
2.25
2.35
2.50
SVSHE = 1, SVSMHRRL = 5
2.52
2.65
2.78
SVSHE = 1, SVSMHRRL = 6
2.85
3.00
3.15
SVSHE = 1, SVSMHRRL = 7
2.85
3.00
3.15
SVSHE = 1, dVDVCC/dt = 10 mV/µs, SVSHFP = 1
2.5
SVSHE = 1, dVDVCC/dt = 1 mV/µs, SVSHFP = 0
20
SVSHE = 0 → 1, dVDVCC/dt = 10 mV/µs, SVSHFP = 1
12.5
SVSHE = 0 → 1, dVDVCC/dt = 1 mV/µs, SVSHFP = 0
100
0
V
V
µs
µs
1000
V/s
The SVSH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the CC430 Family User's Guide (SLAU259) on recommended settings and use.
PMM, SVM High Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
SVMHE = 0, DVCC = 3.6 V
I(SVMH)
V(SVMH)
SVMH current consumption
SVMH on or off voltage level
(1)
SVMH propagation delay
t(SVMH)
SVMH on or off delay time
(1)
MAX
UNIT
0
nA
SVMHE= 1, DVCC = 3.6 V, SVMHFP = 0
200
nA
SVMHE = 1, DVCC = 3.6 V, SVMHFP = 1
1.5
µA
SVMHE = 1, SVSMHRRL = 0
1.60
1.70
1.80
SVMHE = 1, SVSMHRRL = 1
1.80
1.90
2.00
SVMHE = 1, SVSMHRRL = 2
2.00
2.10
2.20
SVMHE = 1, SVSMHRRL = 3
2.10
2.20
2.30
SVMHE = 1, SVSMHRRL = 4
2.25
2.35
2.50
SVMHE = 1, SVSMHRRL = 5
2.52
2.65
2.78
SVMHE = 1, SVSMHRRL = 6
2.85
3.00
3.15
SVMHE = 1, SVSMHRRL = 7
2.85
3.00
3.15
SVMHE = 1, SVMHOVPE = 1
tpd(SVMH)
TYP
V
3.75
SVMHE = 1, dVDVCC/dt = 10 mV/µs, SVMHFP = 1
2.5
SVMHE = 1, dVDVCC/dt = 1 mV/µs, SVMHFP = 0
20
SVMHE = 0 → 1, dVDVCC/dt = 10 mV/µs, SVMHFP = 1
12.5
SVMHE = 0 → 1, dVDVCC/dt = 1 mV/µs, SVMHFP = 0
100
µs
µs
The SVMH settings available depend on the VCORE (PMMCOREVx) setting. See the Power Management Module and Supply Voltage
Supervisor chapter in the CC430 Family User's Guide (SLAU259) on recommended settings and use.
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PMM, SVS Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
SVSLE = 0, PMMCOREV = 2
I(SVSL)
SVSL current consumption
tpd(SVSL)
SVSL propagation delay
t(SVSL)
SVSL on or off delay time
MAX
UNIT
0
nA
SVSLE = 1, PMMCOREV = 2, SVSLFP = 0
200
nA
SVSLE = 1, PMMCOREV = 2, SVSLFP = 1
1.5
µA
SVSLE = 1, dVCORE/dt = 10 mV/µs, SVSLFP = 1
2.5
SVSLE = 1, dVCORE/dt = 1 mV/µs, SVSLFP = 0
20
SVSLE = 0 → 1, dVCORE/dt = 10 mV/µs, SVSLFP = 1
12.5
SVSLE = 0 → 1, dVCORE/dt = 1 mV/µs, SVSLFP = 0
100
µs
µs
PMM, SVM Low Side
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
SVMLE = 0, PMMCOREV = 2
I(SVML)
SVML current consumption
tpd(SVML)
SVML propagation delay
t(SVML)
SVML on or off delay time
MAX
UNIT
0
nA
SVMLE= 1, PMMCOREV = 2, SVMLFP = 0
200
nA
SVMLE= 1, PMMCOREV = 2, SVMLFP = 1
1.5
µA
SVMLE = 1, dVCORE/dt = 10 mV/µs, SVMLFP = 1
2.5
SVMLE = 1, dVCORE/dt = 1 mV/µs, SVMLFP = 0
20
SVMLE = 0 → 1, dVCORE/dt = 10 mV/µs, SVMLFP = 1
12.5
SVMLE = 0 → 1, dVCORE/dt = 1 mV/µs, SVMLFP = 0
100
µs
µs
Wake-up From Low-Power Modes and Reset
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
tWAKE-UPFAST
tWAKE-UPSLOW
tWAKE-UPLPM5
tWAKE-UPRESET
(1)
(2)
(3)
TEST CONDITIONS
MIN
TYP MAX UNIT
fMCLK ≥ 4.0 MHz
5
fMCLK < 4.0 MHz
6
Wake-up time from LPM2, LPM3, or
LPM4 to active mode (1)
PMMCOREV = SVSMLRRL = n
(where n = 0, 1, 2, or 3),
SVSLFP = 1
Wake-up time from LPM2, LPM3 or
LPM4 to active mode (2)
PMMCOREV = SVSMLRRL = n (where n = 0, 1, 2, or 3),
SVSLFP = 0
µs
150
165
µs
Wake-up time from LPMx.5 to active
mode (3)
2
3
ms
Wake-up time from RST or BOR
event to active mode (3)
2
3
ms
This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance
mode of the low-side supervisor (SVSL) and low side monitor (SVML). Fastest wakeup times are possible with SVSLand SVML in full
performance mode or disabled when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while
operating in LPM2, LPM3, and LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the CC430 Family
User's Guide (SLAU259).
This value represents the time from the wakeup event to the first active edge of MCLK. The wakeup time depends on the performance
mode of the low-side supervisor (SVSL) and low side monitor (SVML). In this case, the SVSLand SVML are in normal mode (low current)
mode when operating in AM, LPM0, and LPM1. Various options are available for SVSLand SVML while operating in LPM2, LPM3, and
LPM4. See the Power Management Module and Supply Voltage Supervisor chapter in the CC430 Family User's Guide (SLAU259).
This value represents the time from the wakeup event to the reset vector execution.
Timer_A
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
fTA
Timer_A input clock frequency
Internal: SMCLK, ACLK,
External: TACLK,
Duty cycle = 50% ± 10%
tTA,cap
Timer_A capture timing
All capture inputs, minimum pulse
duration required for capture
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VCC
1.8 V,
3.0 V
1.8 V,
3.0 V
MIN
20
TYP
MAX
UNIT
25
MHz
ns
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USCI (UART Mode) Recommended Operating Conditions
PARAMETER
CONDITIONS
VCC
MIN
TYP
Internal: SMCLK, ACLK
External: UCLK
Duty cycle = 50% ± 10%
fUSCI
USCI input clock frequency
fBITCLK
BITCLK clock frequency
(equals baud rate in MBaud)
MAX
UNIT
fSYSTEM
MHz
1
MHz
MAX
UNIT
USCI (UART Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
UART receive deglitch time (1)
tτ
(1)
TEST CONDITIONS
VCC
MIN
TYP
2.2 V
50
600
3V
50
600
ns
Pulses on the UART receive input (UCxRX) shorter than the UART receive deglitch time are suppressed. To ensure that pulses are
correctly recognized their width should exceed the maximum specification of the deglitch time.
USCI (SPI Master Mode) Recommended Operating Conditions
PARAMETER
fUSCI
CONDITIONS
VCC
MIN
TYP
Internal: SMCLK, ACLK
Duty cycle = 50% ± 10%
USCI input clock frequency
MAX
UNIT
fSYSTEM
MHz
USCI (SPI Master Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise
noted) (1)Figure 17Figure 18
PARAMETER
TEST CONDITIONS
PMM
COREVx
0
tSU,MI
SOMI input data setup time
3
0
tHD,MI
SOMI input data hold time
3
0
tVALID,MO
SIMO output data valid time
(2)
UCLK edge to SIMO valid,
CL = 20 pF
3
0
tHD,MO
SIMO output data hold time
(3)
CL = 20 pF
3
(1)
(2)
(3)
VCC
MIN
1.8 V
55
3.0 V
38
2.4 V
30
3.0 V
25
1.8 V
0
3.0 V
0
2.4 V
0
3.0 V
0
TYP
MAX UNIT
ns
ns
ns
ns
1.8 V
20
3.0 V
18
2.4 V
16
3.0 V
15
1.8 V
-10
3.0 V
-8
2.4 V
-10
3.0 V
-8
ns
ns
ns
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(USCI) + tSU,SI(Slave), tSU,MI(USCI) + tVALID,SO(Slave)).
For the slave's parameters tSU,SI(Slave) and tVALID,SO(Slave) see the SPI parameters of the attached slave.
Specifies the time to drive the next valid data to the SIMO output after the output changing UCLK clock edge. See the timing diagrams
in Figure 17 and Figure 18.
Specifies how long data on the SIMO output is valid after the output changing UCLK clock edge. Negative values indicate that the data
on the SIMO output can become invalid before the output changing clock edge observed on UCLK. See the timing diagrams in
Figure 17 and Figure 18.
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1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
tHD,MO
tVALID,MO
SIMO
Figure 17. SPI Master Mode, CKPH = 0
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tSU,MI
tHD,MI
SOMI
tHD,MO
tVALID,MO
SIMO
Figure 18. SPI Master Mode, CKPH = 1
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USCI (SPI Slave Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise
noted) (1)Figure 19Figure 20
PARAMETER
TEST CONDITIONS
PMM
COREVx
0
tSTE,LEAD
STE lead time, STE low to clock
3
0
tSTE,LAG
STE lag time, Last clock to STE high
3
0
tSTE,ACC
STE access time, STE low to SOMI
data out
3
0
tSTE,DIS
STE disable time, STE high to SOMI
high impedance
3
0
tSU,SI
SIMO input data setup time
3
0
tHD,SI
SIMO input data hold time
3
0
tVALID,SO
SOMI output data valid time (2)
UCLK edge to SOMI valid,
CL = 20 pF
3
0
tHD,SO
SOMI output data hold time (3)
CL = 20 pF
3
(1)
(2)
(3)
VCC
MIN
1.8 V
11
3.0 V
8
2.4 V
7
3.0 V
6
1.8 V
3
3.0 V
3
2.4 V
3
3.0 V
3
TYP
MAX
ns
ns
1.8 V
66
3.0 V
50
2.4 V
36
3.0 V
30
1.8 V
30
3.0 V
23
2.4 V
16
3.0 V
UNIT
ns
ns
13
1.8 V
5
3.0 V
5
2.4 V
2
3.0 V
2
1.8 V
5
3.0 V
5
2.4 V
5
3.0 V
5
ns
ns
1.8 V
76
3.0 V
60
2.4 V
44
3.0 V
ns
40
1.8 V
18
3.0 V
12
2.4 V
10
3.0 V
8
ns
fUCxCLK = 1/2tLO/HI with tLO/HI ≥ max(tVALID,MO(Master) + tSU,SI(USCI), tSU,MI(Master) + tVALID,SO(USCI)).
For the master's parameters tSU,MI(Master) and tVALID,MO(Master) see the SPI parameters of the attached master.
Specifies the time to drive the next valid data to the SOMI output after the output changing UCLK clock edge. See the timing diagrams
in Figure 17 and Figure 18.
Specifies how long data on the SOMI output is valid after the output changing UCLK clock edge. See the timing diagrams in Figure 17
and Figure 18.
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tSTE,LEAD
tSTE,LAG
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tSU,SI
tLO/HI
tHD,SI
SIMO
tHD,SO
tVALID,SO
tSTE,ACC
tSTE,DIS
SOMI
Figure 19. SPI Slave Mode, CKPH = 0
tSTE,LAG
tSTE,LEAD
STE
1/fUCxCLK
CKPL = 0
UCLK
CKPL = 1
tLO/HI
tLO/HI
tHD,SI
tSU,SI
SIMO
tSTE,ACC
tHD,MO
tVALID,SO
tSTE,DIS
SOMI
Figure 20. SPI Slave Mode, CKPH = 1
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USCI (I2C Mode)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 21)
PARAMETER
TEST CONDITIONS
fUSCI
USCI input clock frequency
fSCL
SCL clock frequency
VCC
MIN
Internal: SMCLK, ACLK,
External: UCLK,
Duty cycle = 50% ± 10%
2.2 V, 3 V
tHD,STA
Hold time (repeated) START
tSU,STA
Setup time for a repeated START
tHD,DAT
Data hold time
tSU,DAT
Data setup time
TYP
fSCL ≤ 100 kHz
fSCL > 100 kHz
fSCL ≤ 100 kHz
fSCL > 100 kHz
fSCL ≤ 100 kHz
tSU,STO
Setup time for STOP
tSP
Pulse duration of spikes suppressed by input
filter
fSCL > 100 kHz
tSU,STA
tHD,STA
2.2 V, 3 V
2.2 V, 3 V
0
MAX
UNIT
fSYSTEM
MHz
400
kHz
4.0
µs
0.6
4.7
µs
0.6
2.2 V, 3 V
0
ns
2.2 V, 3 V
250
ns
2.2 V, 3 V
4.0
µs
0.6
2.2 V
50
600
3V
50
600
tHD,STA
ns
tBUF
SDA
tLOW
tHIGH
tSP
SCL
tSU,DAT
tSU,STO
tHD,DAT
Figure 21. I2C Mode Timing
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LCD_B Recommended Operating Conditions
PARAMETER
CONDITIONS
MIN
NOM
MAX
UNIT
VCC,LCD_B,CPen,3.6
Supply voltage range, charge
pump enabled, VLCD ≤ 3.6 V
LCDCPEN = 1, 0000 < VLCDx ≤ 1111
(charge pump enabled, VLCD ≤ 3.6 V)
2.2
3.6
V
VCC,LCD_B,CPen,3.3
Supply voltage range, charge
pump enabled, VLCD ≤ 3.3 V
LCDCPEN = 1, 0000 < VLCDx ≤ 1100
(charge pump enabled, VLCD ≤ 3.3 V)
2.0
3.6
V
VCC,LCD_B,int. bias
Supply voltage range, internal
biasing, charge pump disabled
LCDCPEN = 0, VLCDEXT = 0
2.4
3.6
V
VCC,LCD_B,ext.
Supply voltage range, external
biasing, charge pump disabled
LCDCPEN = 0, VLCDEXT = 0
2.4
3.6
V
VCC,LCD_B,VLCDEXT
Supply voltage range, external
LCD voltage, internal or external
biasing, charge pump disabled
LCDCPEN = 0, VLCDEXT = 1
2.0
3.6
V
VLCDCAP/R33
External LCD voltage at
LCDCAP/R33, internal or external LCDCPEN = 0, VLCDEXT = 1
biasing, charge pump disabled
2.4
3.6
V
CLCDCAP
Capacitor on LCDCAP when
charge pump enabled
LCDCPEN = 1, VLCDx > 0000
(charge pump enabled)
10
µF
fFrame
LCD frame frequency range
fLCD = 2 × mux × fFRAME
with mux = 1 (static), 2, 3, 4
100
Hz
fACLK,in
ACLK input frequency range
CPanel
Panel capacitance
bias
4.7
0
40
kHz
100-Hz frame frequency
30
32
10000
pF
VCC +
0.2
V
VR33
Analog input voltage at R33
LCDCPEN = 0, VLCDEXT = 1
VR23,1/3bias
Analog input voltage at R23
LCDREXT = 1, LCDEXTBIAS = 1,
LCD2B = 0
VR13
VR03 + 2/3
* (VR33 VR03)
VR33
V
VR13,1/3bias
Analog input voltage at R13 with
1/3 biasing
LCDREXT = 1, LCDEXTBIAS = 1,
LCD2B = 0
VR03
VR03 + 1/3
* (VR33 VR03)
VR23
V
VR13,1/2bias
Analog input voltage at R13 with
1/2 biasing
LCDREXT = 1, LCDEXTBIAS = 1,
LCD2B = 1
VR03
VR03 + 1/2
* (VR33 VR03)
VR33
V
VR03
Analog input voltage at R03
R0EXT = 1
VSS
VLCD - VR03
Voltage difference between VLCD
and R03
LCDCPEN = 0, R0EXT = 1
2.4
VLCDREF/R13
External LCD reference voltage
applied at LCDREF/R13
VLCDREFx = 01
0.8
60
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V
1.2
VCC +
0.2
V
1.5
V
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LCD_B Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VLCD
LCD voltage, with internal
reference
TEST CONDITIONS
VCC
MIN
TYP
VLCDx = 0000, VLCDEXT = 0
2.4 V to 3.6 V
VCC
LCDCPEN = 1, VLCDx = 0001
2.0 V to 3.6 V
2.59
LCDCPEN = 1, VLCDx = 0010
2.65
LCDCPEN = 1, VLCDx = 0011
2.71
LCDCPEN = 1, VLCDx = 0100
2.78
LCDCPEN = 1, VLCDx = 0101
2.84
LCDCPEN = 1, VLCDx = 0110
2.91
LCDCPEN = 1, VLCDx = 0111
2.97
LCDCPEN = 1, VLCDx = 1000
3.03
LCDCPEN = 1, VLCDx = 1001
3.09
LCDCPEN = 1, VLCDx = 1010
3.15
LCDCPEN = 1, VLCDx = 1011
3.22
LCDCPEN = 1, VLCDx = 1100
LCDCPEN = 1, VLCDx = 1101
MAX
UNIT
V
3.28
2.2 V to 3.6 V
3.34
LCDCPEN = 1, VLCDx = 1110
3.40
LCDCPEN = 1, VLCDx = 1111
3.46
3.53
ICC,Peak,CP
Peak supply currents due to
charge pump activities
LCDCPEN = 1, VLCDx = 1111
2.2 V
200
tLCD,CP,on
Time to charge CLCD when
discharge
CLCDCAP = 4.7 µF,
LCDCPEN = 0→1, VLCDx = 1111
2.2 V
100
ICP,Load
Maximum charge pump load
current
LCDCPEN = 1, VLCDx = 1111
2.2 V
RLCD,Seg
LCD driver output impedance,
segment lines
LCDCPEN = 1, VLCDx = 1000,
ILOAD = ±10 µA
2.2 V
10
kΩ
RLCD,COM
LCD driver output impedance,
common lines
LCDCPEN = 1, VLCDx = 1000,
ILOAD = ±10 µA
2.2 V
10
kΩ
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µA
500
50
ms
µA
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10-Bit ADC, Power Supply and Input Range Conditions
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
AVCC
Analog supply voltage
AVCC and DVCC are connected together,
AVSS and DVSS are connected together,
V(AVSS) = V(DVSS) = 0 V
V(Ax)
Analog input voltage range (2)
All ADC10_A pins: P1.0 to P1.5, P3.6, P3.7
Operating supply current into
AVCC terminal. REF module
and reference buffer off.
fADC10CLK = 5 MHz, ADC10ON = 1, REFON = 0,
SHT0 = 0, SHT1 = 0, ADC10DIV = 0,
ADC10SREF = 00
Operating supply current into
AVCC terminal. REF module
on, reference buffer on.
VCC
MIN
TYP
1.8
MAX
UNIT
3.6
V
AVCC
V
2.2 V
70
105
3V
80
115
fADC10CLK = 5 MHz, ADC10ON = 1, REFON = 1,
SHT0 = 0, SHT1 = 0, ADC10DIV = 0,
ADC10SREF = 01
3V
130
185
µA
Operating supply current into
AVCC terminal. REF module
off, reference buffer on.
fADC10CLK = 5 MHz, ADC10ON = 1, REFON = 0,
SHT0 = 0, SHT1 = 0, ADC10DIV = 0,
ADC10SREF = 10, VEREF = 2.5 V
3V
120
170
µA
Operating supply current into
AVCC terminal. REF module
off, reference buffer off.
fADC10CLK = 5 MHz, ADC10ON = 1, REFON = 0,
SHT0 = 0, SHT1 = 0, ADC10DIV = 0,
ADC10SREF = 11, VEREF = 2.5 V
3V
85
120
µA
CI
Input capacitance
Only one terminal Ax can be selected at one time
from the pad to the ADC10_A capacitor array
including wiring and pad.
2.2 V
3.5
RI
Input MUX ON resistance
IADC10_A
(1)
(2)
µA
pF
AVCC > 2.0 V, 0 V ≤ VAx ≤ AVCC
36
1.8 V < AVCC < 2.0 V, 0 V ≤ VAx ≤ AVCC
96
kΩ
The leakage current is defined in the leakage current table with P2.x/Ax parameter.
The analog input voltage range must be within the selected reference voltage range VR+ to VR-for valid conversion results. The external
reference voltage requires decoupling capacitors. See ().
10-Bit ADC, Timing Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
fADC10CLK
fADC10OSC
Internal ADC10_A
oscillator (1)
tCONVERT
Conversion time
(2)
Turn on settling time of
the ADC
tADC10ON
tSample
(1)
(2)
(3)
(4)
62
Sampling time
VCC
MIN
TYP
MAX
UNIT
For specified performance of ADC10_A linearity
parameters
TEST CONDITIONS
2.2 V, 3 V
0.45
5
5.5
MHz
ADC10DIV = 0, fADC10CLK = fADC10OSC
2.2 V, 3 V
4.2
4.8
5.4
MHz
REFON = 0, Internal oscillator, 12 ADC10CLK cycles,
10-bit mode, fADC10OSC = 4 MHz to 5 MHz
2.2 V, 3 V
2.4
3.0
µs
External fADC10CLK from ACLK, MCLK or SMCLK,
ADC10SSEL ≠ 0
See
(3)
RS = 1000 Ω, RI = 96 kΩ, CI = 3.5 pF
100
(4)
RS = 1000 Ω, RI = 36 kΩ, CI = 3.5 pF (4)
ns
1.8 V
3
µs
3V
1
µs
The ADC10OSC is sourced directly from MODOSC inside the UCS.
12 × ADC10DIV × 1/fADC10CLK
The condition is that the error in a conversion started after tADC10ON is less than ±0.5 LSB. The reference and input signal are already
settled.
Approximately eight Tau (τ) are needed to get an error of less than ±0.5 LSB
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10-Bit ADC, Linearity Parameters
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TYP
MAX
UNIT
-1.0
+1.0
-1.0
+1.0
Differential linearity error
(VEREF+ - VEREF-)min ≤ (VEREF+ - VEREF-),
CVEREF+ = 20 pF
-1.0
+1.0
LSB
Offset error
(VEREF+ - VEREF-)min ≤ (VEREF+ - VEREF-),
Internal impedance of source RS < 100 Ω,
CVEREF+ = 20 pF
-1.0
+1.0
LSB
-1.0
+1.0
LSB
-5
+5
LSB
ED
EO
Gain error, external reference
Gain error, external reference,
buffered
Gain error, internal reference
Total unadjusted error, external
reference
Total unadjusted error, external
reference, buffered
Total unadjusted error, internal
reference
(1)
MIN
1.6 V < (VEREF+ - VEREF-)min ≤ VAVCC
Integral linearity error
ET
VCC
1.4 V ≤ (VEREF+ - VEREF-)min ≤ 1.6 V
EI
EG
TEST CONDITIONS
(VEREF+ - VEREF-)min ≤ (VEREF+ - VEREF-),
CVEREF+ = 20 pF
See
(1)
-1.5
(VEREF+ - VEREF-)min ≤ (VEREF+ - VEREF-),
CVEREF+ = 20 pF
See
(1)
LSB
+1.5 %VREF
-2.0
±1.0
+2.0
LSB
-5
±1.0
+5
LSB
-1.5
±1.0
+1.5 %VREF
Dominated by the absolute voltage of the integrated reference voltage.
REF, External Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
MAX
UNIT
1.4
AVCC
V
VEREF+ > VEREF- (3)
0
1.2
V
Differential external
reference voltage input
VEREF+ > VEREF- (4)
1.4
AVCC
V
I(VEREF+)
I(VEREF-)
Static input current
1.4 V ≤ VEREF+ ≤ V(AVCC), VEREF- = 0 V
fADC10CLK = 5 MHz, ADC10SHTx = 0x0001,
Conversion rate 200 ksps
2.2 V, 3 V
±26
µA
I(VEREF+)
I(VEREF-)
Static input current
1.4 V ≤ VEREF+ ≤ V(AVCC), VEREF- = 0 V
fADC10CLK = 5 MHZ, ADC10SHTX = 0x1000,
Conversion rate 20 ksps
2.2 V, 3 V
±1
µA
C(VEREF+/-)
Capacitance at VEREF+
or VEREF- terminal
See
VEREF+
Positive external
reference voltage input
VEREF+ > VEREF-
(2)
VEREF-
Negative external
reference voltage input
VEREF+ VEREF-
(1)
(2)
(3)
(4)
(5)
(5)
VCC
MIN
TYP
±8.5
10
µF
The external reference is used during ADC conversion to charge and discharge the capacitance array. The input capacitance, CI, is also
the dynamic load for an external reference during conversion. The dynamic impedance of the reference supply should follow the
recommendations on analog-source impedance to allow the charge to settle for 12-bit accuracy.
The accuracy limits the minimum positive external reference voltage. Lower reference voltage levels may be applied with reduced
accuracy requirements.
The accuracy limits the maximum negative external reference voltage. Higher reference voltage levels may be applied with reduced
accuracy requirements.
The accuracy limits minimum external differential reference voltage. Lower differential reference voltage levels may be applied with
reduced accuracy requirements.
Two decoupling capacitors, 10 µF and 100 nF, should be connected to VEREF to decouple the dynamic current required for an external
reference source if it is used for the ADC10_A. See also the CC430 Family User's Guide (SLAU259).
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REF, Built-In Reference
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
VEREF+
Positive built-in reference voltage
REFVSEL = {2} for 2.5 V,
REFON = REFOUT = 1
3V
2.5
±1.5%
V
VEREF+
Positive built-in reference voltage
REFVSEL = {1} for 2.0 V,
REFON = REFOUT = 1
3V
2.01
±1.5%
V
VEREF+
Positive built-in reference voltage
REFVSEL = {0} for 1.5 V,
REFON = REFOUT = 1
2.2 V,
3V
1.505
±1.5%
V
AVCC(min)
AVCC minimum voltage, Positive
built-in reference active
REFVSEL = {0} for 1.5 V
1.8
V
AVCC(min)
AVCC minimum voltage, Positive
built-in reference active
REFVSEL = {1} for 2.0 V
2.3
V
AVCC(min)
AVCC minimum voltage, Positive
built-in reference active
REFVSEL = {2} for 2.5 V
2.8
V
fADC10CLK = 5 MHz,
REFON = 1, REFBURST = 0,
REFVSEL = {0} for 1.5 V
3V
15.5
19
µA
fADC10CLK = 5 MHz,
REFON = 1, REFBURST = 0,
REFVSEL = {1} for 2.0 V
3V
18
24
µA
fADC10CLK = 5 MHz,
REFON = 1, REFBURST = 0,
REFVSEL = {2} for 2.5 V
3V
21
30
µA
Operating supply current into
AVCC terminal with REF output
buffer enabled
REFON = 1, REFOUT = 1,
REFBURST = 0
3V
0.9
1.7
mA
IL(VREF+)
Load-current regulation, VREF+
terminal (3)
REFVSEL = {0, 1, 2},
ILoad,VREF+ = +10 µA or -1000 µA,
AVCC = AVCC (min) for each reference level,
REFON = REFOUT = 1
2500
µV/
mA
CVREF+
Capacitance at VREF+ terminals
REFON = REFOUT = 1
TCREF+
Temperature coefficient of built-in
REFVSEL = {0, 1, 2}, REFON = 1
reference (4)
ISENSOR
Operating supply current into
AVCC terminal (5)
VSENSOR
See
VMID
AVCC divider at channel 11
ADC10ON = 1, INCH = 0Bh,
VMID is approximately 0.5 × VAVCC
tSENSOR
Sample time required if
channel 10 is selected (7)
ADC10ON = 1, INCH = 0Ah,
Error of conversion result ≤ 1 LSB
30
µs
Sample time required if
channel 11 is selected (8)
ADC10ON = 1, INCH = 0Bh,
Error of conversion result ≤ 1 LSB
1
µs
Operating supply current into
AVCC terminal (2)
IREF+
IREF+,REFO
UT
(sample)
tVMID
(sample)
(6)
PSRR_DC Power supply rejection ratio (dc)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
64
REFON = 0, INCH = 0Ah,
ADC10ON = NA, TA = 30°C
ADC10ON = 1, INCH = 0Ah, TA = 30°C
AVCC = AVCC (min) - AVCC(max),
TA = 25°C,
REFVSEL = {0, 1, 2}, REFON = 1
20
100
pF
30
50
ppm/
°C
2.2 V
150
180
3V
150
190
2.2 V
765
3V
765
mV
2.2 V
1.06
1.1
1.14
3V
1.46
1.5
1.54
120
µA
300
V
µV/V
The leakage current is defined in the leakage current table with P2.x/Ax parameter.
The internal reference current is supplied via terminal AVCC. Consumption is independent of the ADC10ON control bit, unless a
conversion is active. The REFON bit enables to settle the built-in reference before starting an A/D conversion.
Contribution only due to the reference and buffer including package. This does not include resistance due to PCB trace and other
factors. Positive load currents are flowing into the device.
Calculated using the box method: (MAX(-40 to 85°C) - MIN(-40 to 85°C)) / MIN(-40 to 85°C)/(85°C - (-40°C)).
The sensor current ISENSOR is consumed if (ADC10ON = 1 and REFON = 1) or (ADC10ON = 1 and INCH = 0Ah and sample signal is
high). When REFON = 1, ISENSOR is already included in IREF+.
The temperature sensor offset can be as much as ±20°C. A single-point calibration is recommended to minimize the offset error of the
built-in temperature sensor.
The typical equivalent impedance of the sensor is 51 kΩ. The sample time required includes the sensor-on time tSENSOR(on).
The on-time tVMID(on) is included in the sampling time tVMID(sample); no additional on time is needed.
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REF, Built-In Reference (continued)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)(1)
PARAMETER
TEST CONDITIONS
PSRR_AC
Power supply rejection ratio (ac)
AVCC = AVCC (min) - AVCC(max),
TA = 25°C, f = 1 kHz, ΔVpp = 100 mV,
REFVSEL = (0, 1, 2}, REFON = 1
tSETTLE
Settling time of reference
voltage (9)
AVCC = AVCC (min) AVCC(max),
REFVSEL = {0, 1, 2},
REFON = 0 → 1
(9)
VCC
MIN
TYP
MAX
6.4
UNIT
mV/V
TA = -40°C to
85°C
23
125
TA = 25°C
23
50
TA = 85°C
16
25
µs
The condition is that the error in a conversion started after tREFON is less than ±0.5 LSB.
Typical Temperature Sensor Voltage - mV
1000
950
900
850
800
750
700
650
600
550
500
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Ambient Temperature - ˚C
Figure 22. Typical Temperature Sensor Voltage
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Comparator_B
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
VCC
TEST CONDITIONS
VCC
Supply voltage
MIN
TYP
1.8
3.6
1.8 V
UNIT
V
40
2.2 V
31
50
3V
32
65
CBPWRMD = 01, CBON = 1, CBRSx = 00
2.2 V,
3V
10
17
CBPWRMD = 10, CBON = 1, CBRSx = 00
2.2 V,
3V
0.2
0.85
Quiescent current of
resistor ladder into
AVCC. Includes REF
module current.
CBREFACC = 0, CBREFLx = 01, CBRSx = 10,
REFON = 0, CBON = 0
2.2 V,
3V
10
17
µA
CBREFACC = 1, CBREFLx = 01, CBRSx = 10,
REFON = 0, CBON = 0
2.2 V,
3V
33
40
µA
VREF
Reference voltage level
CBREFLx = 01, CBREFACC = 0
≥1.8 V
1.49
±1.5%
V
VREF
Reference voltage level
CBREFLx = 10, CBREFACC = 0
≥2.2 V
1.988
±1.5%
V
VREF
Reference voltage level
CBREFLx = 11, CBREFACC = 0
≥3.0 V
2.5
VIC
Common mode input
range
VOFFSET
Input offset voltage
CBPWRMD = 00
VOFFSET
Input offset voltage
CBPWRMD = 01, 10
CIN
Input capacitance
IAVCC_COMP
IAVCC_REF
RSIN
Comparator operating
supply current into
AVCC. Excludes
reference resistor
ladder.
Series input resistance
Propagation delay,
response time
tPD
Propagation delay with
filter active
tPD,filter
tEN_CMP
Comparator enable time
tEN_REF
Resistor reference
enable time
TCREF
Temperature coefficient
reference
VCB_REF
Reference voltage for a
given tap
66
CBPWRMD = 00, CBON = 1, CBRSx = 00
MAX
µA
±1.5%
0
V
VCC-1
±20
mV
±10
mV
4
kΩ
5
ON - switch closed
OFF - switch opened
3
V
pF
50
MΩ
CBPWRMD = 00, CBF = 0
450
CBPWRMD = 01, CBF = 0
600
ns
ns
CBPWRMD = 10, CBF = 0
50
µs
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 00
0.35
0.6
1.5
µs
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 01
0.6
1.0
1.8
µs
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 10
1.0
1.8
3.4
µs
CBPWRMD = 00, CBON = 1, CBF = 1,
CBFDLY = 11
1.8
3.4
6.5
µs
CBON = 0 to CBON = 1, CBPWRMD = 00, 01
1
CBON = 0 to CBON = 1, CBPWRMD = 10
CBON = 0 to CBON = 1
VIN = reference into resistor ladder,
n = 0 to 31
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1.0
VIN ×
(n+0.5)
/ 32
VIN ×
(n+1)
/ 32
2
µs
1.5
µs
1.5
µs
50
ppm/
°C
VIN ×
(n+1.5)
/ 32
V
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Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
DVCC(PGM/ERASE) Program and erase supply voltage
MIN
TYP
1.8
MAX
3.6
UNIT
V
IPGM
Average supply current from DVCC during program
3
5
mA
IERASE
Average supply current from DVCC during erase
2
6.5
mA
IMERASE, IBANK
Average supply current from DVCC during mass erase or bank
erase
2.5
mA
16
ms
tCPT
Cumulative program time
(1)
4
Program AND erase endurance
10
10
cycles
tRetention
Data retention duration
tWord
Word or byte program time (2)
64
85
µs
tBlock,
Block program time for first byte or word (2)
49
65
µs
Block program time for each additional byte or word, except for last
byte or word (2)
37
49
µs
55
73
µs
23
32
ms
0
1
MHz
0
tBlock, 1-(N-1)
tBlock,
N
Block program time for last byte or word
TJ = 25°C
5
(2)
tErase
Erase time for segment erase, mass erase, and bank erase when
available (2)
fMCLK,MGR
MCLK frequency in marginal read mode
(FCTL4.MGR0 = 1 or FCTL4. MGR1 = 1)
(1)
(2)
100
years
The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming
methods: individual word/byte write and block write modes.
These values are hardwired into the flash controller's state machine.
JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST
CONDITIONS
MIN
TYP
MAX
UNIT
fSBW
Spy-Bi-Wire input frequency
2.2 V, 3 V
0
20
MHz
tSBW,Low
Spy-Bi-Wire low clock pulse length
2.2 V, 3 V
0.025
15
µs
tSBW,
Spy-Bi-Wire enable time (TEST high to acceptance of first clock
edge) (1)
2.2 V, 3 V
1
µs
En
tSBW,Rst
Spy-Bi-Wire return to normal operation time
fTCK
TCK input frequency - 4-wire JTAG (2)
Rinternal
Internal pull-down resistance on TEST
(1)
(2)
15
100
2.2 V
0
5
MHz
3V
0
10
MHz
2.2 V, 3 V
45
80
kΩ
60
µs
Tools accessing the Spy-Bi-Wire interface need to wait for the minimum tSBW,En time after pulling the TEST/SBWTCK pin high before
applying the first SBWTCK clock edge.
fTCK may be restricted to meet the timing requirements of the module selected.
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RF1A CC1101-Based Radio Parameters
RF1A Recommended Operating Conditions
PARAMETER
TEST CONDITIONS
MIN
VCC
Supply voltage range during radio operation
PMMCOREVx
Core voltage range, PMMCOREVx setting during radio operation
RF frequency range
Data rate
TYP
3.6
2
3
300 MHz range
300
348
400 MHz range
(1)
464
800/900 MHz range
779
928
2-FSK
0.6
500
2-GFSK, OOK, and ASK
0.6
250 kBaud
389
(Shaped) MSK (also known as differential offset QPSK)
(2)
26
Total tolerance including initial tolerance, crystal loading, aging and
temperature dependency. (3)
27
±40
10
V
MHz
500
26
RF crystal load capacitance
13
RF crystal effective series
resistance
(1)
(2)
(3)
UNIT
2.0
RF crystal frequency
RF crystal tolerance
MAX
MHz
ppm
20
pF
100
Ω
If using a 27-MHz crystal, the lower frequency limit for this band is 392 MHz.
If using optional Manchester encoding, the data rate in kbps is half the baud rate.
The acceptable crystal tolerance depends on frequency band, channel bandwidth, and spacing. Also see Design Note DN005 -- CC11xx
Sensitivity versus Frequency Offset and Crystal Accuracy (SWRA122).
RF Crystal Oscillator, XT2
TA = 25°C, VCC = 3 V (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
MIN
Start-up time (2)
Duty cycle
(1)
(2)
45
TYP
MAX
UNIT
150
810
µs
50
55
%
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
The start-up time depends to a very large degree on the used crystal.
Current Consumption, Reduced-Power Modes
TA = 25°C, VCC = 3 V (unless otherwise noted) (1)
PARAMETER
Current consumption
(1)
(2)
68
TYP
MAX UNIT
RF crystal oscillator only (for example, SLEEP state with
MCSM0.OSC_FORCE_ON = 1)
TEST CONDITIONS
MIN
100
µA
IDLE state (including RF crystal oscillator)
1.7
mA
FSTXON state (only the frequency synthesizer is running) (2)
9.5
mA
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
This current consumption is also representative of other intermediate states when going from IDLE to RX or TX, including the calibration
state.
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Current Consumption, Receive Mode
TA = 25°C, VCC = 3 V (unless otherwise noted) (1)
PARAMETER
FREQUENCY
(MHz)
DATA
RATE
(kBaud)
(2)
TEST CONDITIONS
1.2
315
38.4
Register settings optimized
for reduced current
250
433
38.4
Register settings optimized
for reduced current
1.2
868, 915
38.4
250
(1)
(2)
(3)
17
Input at -40 dBm (well
above sensitivity limit)
16
Input at -100 dBm (close
to sensitivity limit)
17
Input at -40 dBm (well
above sensitivity limit)
16
Input at -100 dBm (close
to sensitivity limit)
18
Register settings optimized
for reduced current (3)
MAX
UNIT
16.5
Input at -100 dBm (close
to sensitivity limit)
18
Input at -40 dBm (well
above sensitivity limit)
17
Input at -100 dBm (close
to sensitivity limit)
18
Input at -40 dBm (well
above sensitivity limit)
17
Input at -100 dBm (close
to sensitivity limit)
250
TYP
Input at -100 dBm (close
to sensitivity limit)
Input at -40 dBm (well
above sensitivity limit)
1.2
Current
consumption,
RX
MIN
mA
18.5
Input at -40 dBm (well
above sensitivity limit)
17
Input at -100 dBm (close
to sensitivity limit)
16
Input at -40 dBm (well
above sensitivity limit)
15
Input at -100 dBm (close
to sensitivity limit)
16
Input at -40 dBm (well
above sensitivity limit)
15
Input at -100 dBm (close
to sensitivity limit)
16
Input at -40 dBm (well
above sensitivity limit)
15
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
Reduced current setting (MDMCFG2.DEM_DCFILT_OFF = 1) gives a slightly lower current consumption at the cost of a reduction in
sensitivity. See tables "RF Receive" for additional details on current consumption and sensitivity.
For 868 or 915 MHz, see Figure 23 for current consumption with register settings optimized for sensitivity.
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19
19
TA = 85°C
TA = 25°C
TA = 25°C
TA = -40°C
TA = -40°C
Radio Current [mA]
Radio Current [mA]
TA = 85°C
18
17
16
-100
-80
-60
-40
18
17
16
-100
-20
-80
Input Pow er [dBm ]
-60
-20
Input Pow er [dBm ]
1.2 kBaud GFSK
38.4 kBaud GFSK
19
19
TA = 85°C
TA = 85°C
TA = 25°C
TA = 25°C
TA = -40°C
TA = -40°C
Radio Current [mA]
Radio Current [mA]
-40
18
17
16
-100
-80
-60
Input Pow er [dBm ]
250 kBaud GFSK
-40
-20
18
17
16
-100
-80
-60
-40
-20
Input Pow er [dBm ]
500 kBaud MSK
Figure 23. Typical RX Current Consumption Over Temperature and Input Power Level, 868 MHz,
Sensitivity-Optimized Setting
70
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Current Consumption, Transmit Mode
TA = 25°C, VCC = 3 V (unless otherwise noted) (1)
PARAMETER
(2)
FREQUENCY
[MHz}
315
433
Current consumption, TX
868
915
(1)
(2)
PATABLE
Setting
OUTPUT
POWER (dBm)
0xC0
max.
26
mA
0xC4
+10
25
mA
0x51
0
15
mA
MIN
TYP
MAX
UNIT
0x29
-6
15
mA
0xC0
max.
33
mA
0xC6
+10
29
mA
0x50
0
17
mA
0x2D
-6
17
mA
0xC0
max.
36
mA
0xC3
+10
33
mA
0x8D
0
18
mA
0x2D
-6
18
mA
0xC0
max.
35
mA
0xC3
+10
32
mA
0x8D
0
18
mA
0x2D
-6
18
mA
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
Reduced current setting (MDMCFG2.DEM_DCFILT_OFF = 1) gives a slightly lower current consumption at the cost of a reduction in
sensitivity. See tables "RF Receive" for additional details on current consumption and sensitivity.
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Typical TX Current Consumption, 315 MHz, 25°C
PARAMETER
Current
consumption,
TX
PATABLE
Setting
Output
Power
(dBm)
0xC0
VCC
2.0 V
3.0 V
3.6 V
max.
27.5
26.4
28.1
0xC4
+10
25.1
25.2
25.3
0x51
0
14.4
14.6
14.7
0x29
-6
14.2
14.7
15.0
2.0 V
3.0 V
3.6 V
UNIT
mA
Typical TX Current Consumption, 433 MHz, 25°C
PARAMETER
Current
consumption,
TX
PATABLE
Setting
Output
Power
(dBm)
0xC0
max.
33.1
33.4
33.8
0xC6
+10
28.6
28.8
28.8
0x50
0
16.6
16.8
16.9
0x2D
-6
16.8
17.5
17.8
3.0 V
3.6 V
VCC
UNIT
mA
Typical TX Current Consumption, 868 MHz
PARAMETER
Current
consumption,
TX
PATABLE
Setting
Output
Power
(dBm)
0xC0
0xC3
VCC
TA
2.0 V
-40°C
25°C
85°C
-40°C
25°C
85°C
-40°C
25°C
85°C
max.
36.7
35.2
34.2
38.5
35.5
34.9
37.1
35.7
34.7
+10
34.0
32.8
32.0
34.2
33.0
32.5
34.3
33.1
32.2
0x8D
0
18.0
17.6
17.5
18.3
17.8
18.1
18.4
18.0
17.7
0x2D
-6
17.1
17.0
17.2
17.8
17.8
18.3
18.2
18.1
18.1
UNIT
mA
Typical TX Current Consumption, 915 MHz
PARAMETER
Current
consumption,
TX
72
PATABLE
Setting
Output
Power
(dBm)
0xC0
VCC
TA
2.0 V
3.0 V
3.6 V
-40°C
25°C
85°C
-40°C
25°C
85°C
-40°C
25°C
85°C
max.
35.5
33.8
33.2
36.2
34.8
33.6
36.3
35.0
33.8
0xC3
+10
33.2
32.0
31.0
33.4
32.1
31.2
33.5
32.3
31.3
0x8D
0
17.8
17.4
17.1
18.1
17.6
17.3
18.2
17.8
17.5
0x2D
-6
17.0
16.9
16.9
17.7
17.6
17.6
18.1
18.0
18.0
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UNIT
mA
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RF Receive, Overall
TA = 25°C, VCC = 3 V (unless otherwise noted) (1)
PARAMETER
TEST CONDITIONS
Digital channel filter bandwidth
Spurious emissions (3)
(4)
TYP
58
MAX
UNIT
812
kHz
25 MHz to 1 GHz
-68
-57
Above 1 GHz
-66
-47
Serial operation (5)
RX latency
(1)
(2)
(3)
(4)
(5)
MIN
(2)
9
dBm
bit
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
User programmable. The bandwidth limits are proportional to crystal frequency (given values assume a 26.0 MHz crystal)
Typical radiated spurious emission is -49 dBm measured at the VCO frequency
Maximum figure is the ETSI EN 300 220 limit
Time from start of reception until data is available on the receiver data output pin is equal to 9 bit.
RF Receive, 315 MHz
TA = 25°C, VCC = 3 V (unless otherwise noted) (1)
2-FSK, 1% packet error rate, 20-byte packet length, Sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF = 0 (unless
otherwise noted)
PARAMETER
Receiver sensitivity
(1)
(2)
(3)
(4)
DATA RATE
(kBaud)
TEST CONDITIONS
MIN
TYP
0.6
14.3-kHz deviation, 58-kHz digital channel filter bandwidth
-117
1.2
5.2-kHz deviation, 58-kHz digital channel filter bandwidth (2)
-111
38.4
20-kHz deviation, 100-kHz digital channel filter bandwidth (3)
250
127-kHz deviation, 540-kHz digital channel filter bandwidth
500
MSK, 812-kHz digital channel filter bandwidth (4)
MAX
-103
(4)
UNIT
dBm
-95
-86
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then
reduced by approximately 2 mA close to the sensitivity limit. The sensitivity is typically reduced to -109 dBm.
Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then
reduced by approximately 2 mA close to the sensitivity limit. The sensitivity is typically reduced to -102 dBm.
MDMCFG2.DEM_DCFILT_OFF=1 can not be used for data rates ≥ 250 kBaud.
RF Receive, 433 MHz
TA = 25°C, VCC = 3 V (unless otherwise noted) (1)
2-FSK, 1% packet error rate, 20-byte packet length, Sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF = 0 (unless
otherwise noted)
PARAMETER
DATA RATE
(kBaud)
0.6
Receiver sensitivity
(1)
(2)
(3)
(4)
TEST CONDITIONS
MIN
14.3-kHz deviation, 58-kHz digital channel filter bandwidth
TYP
MAX
UNIT
-114
(2)
1.2
5.2-kHz deviation, 58-kHz digital channel filter bandwidth
38.4
20-kHz deviation, 100-kHz digital channel filter bandwidth (3)
-111
250
127-kHz deviation, 540-kHz digital channel filter bandwidth
500
MSK, 812-kHz digital channel filter bandwidth (4)
(4)
-104
dBm
-93
-85
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then
reduced by approximately 2 mA close to the sensitivity limit. The sensitivity is typically reduced to -109 dBm.
Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then
reduced by approximately 2 mA close to the sensitivity limit. The sensitivity is typically reduced to -101 dBm.
MDMCFG2.DEM_DCFILT_OFF=1 can not be used for data rates ≥ 250 kBaud.
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RF Receive, 868 MHz and 915 MHz
TA = 25°C, VCC = 3 V (unless otherwise noted) (1)
1% packet error rate, 20-byte packet length, Sensitivity optimized, MDMCFG2.DEM_DCFILT_OFF = 0 (unless otherwise
noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
0.6-kBaud data rate, 2-FSK, 14.3-kHz deviation, 58-kHz digital channel filter bandwidth (unless otherwise noted)
Receiver sensitivity
-115
dBm
1.2-kBaud data rate, 2-FSK, 5.2-kHz deviation, 58-kHz digital channel filter bandwidth (unless otherwise noted)
-109
Receiver sensitivity (2)
2-GFSK modulation by setting MDMCFG2.MOD_FORMAT=2,
Gaussian filter with BT = 0.5
Saturation
FIFOTHR.CLOSE_IN_RX=0 (3)
Adjacent channel
rejection
Desired channel 3 dB above the sensitivity limit,
100 kHz channel spacing (4)
Image channel rejection
IF frequency 152 kHz, desired channel 3 dB above
the sensitivity limit
Blocking
Desired channel 3 dB above the sensitivity limit (5)
-109
-28
-100-kHz offset
39
+100-kHz offset
39
dBm
dBm
dB
29
dB
±2 MHz offset
-48
dBm
±10 MHz offset
-40
dBm
38.4-kBaud data rate, 2-FSK, 20-kHz deviation, 100-kHz digital channel filter bandwidth (unless otherwise noted)
-102
Receiver sensitivity (6)
2-GFSK modulation by setting MDMCFG2.MOD_FORMAT = 2,
Gaussian filter with BT = 0.5
Saturation
FIFOTHR.CLOSE_IN_RX=0 (3)
-101
-19
-200-kHz offset
20
+200-kHz offset
25
Adjacent channel
rejection
Desired channel 3 dB above the sensitivity limit,
200 kHz channel spacing (5)
Image channel rejection
IF frequency 152 kHz, Desired channel 3 dB above the sensitivity limit
Desired channel 3 dB above the sensitivity limit (5)
Blocking
dBm
dBm
dB
23
dB
±2-MHz offset
-48
dBm
±10-MHz offset
-40
dBm
250-kBaud data rate, 2-FSK, 127-kHz deviation, 540-kHz digital channel filter bandwidth (unless otherwise noted)
-90
Receiver sensitivity
(7)
Saturation
2-GFSK modulation by setting MDMCFG2.MOD_FORMAT = 2,
Gaussian filter with BT = 0.5
-90
FIFOTHR.CLOSE_IN_RX=0 (3)
-19
-750-kHz offset
24
+750-kHz offset
30
Adjacent channel
rejection
Desired channel 3 dB above the sensitivity limit,
750-kHz channel spacing (8)
Image channel rejection
IF frequency 304 kHz, Desired channel 3 dB above the sensitivity limit
Blocking
Desired channel 3 dB above the sensitivity limit (8)
dBm
dBm
dB
18
dB
±2-MHz offset
-53
dBm
±10-MHz offset
-39
dBm
-84
dBm
500-kBaud data rate, MSK, 812-kHz digital channel filter bandwidth (unless otherwise noted)
Receiver sensitivity (7)
Image channel rejection
Blocking
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
74
IF frequency 355 kHz, Desired channel 3 dB above the sensitivity limit
Desired channel 3 dB above the sensitivity limit (9)
-2
dB
±2-MHz offset
-53
dBm
±10-MHz offset
-38
dBm
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then
reduced by approximately 2 mA close to the sensitivity limit. The sensitivity is typically reduced to -107 dBm
See Design Note DN010 Close-in Reception with CC1101 (SWRA147).
See Figure 24 for blocking performance at other offset frequencies.
See Figure 25 for blocking performance at other offset frequencies.
Sensitivity can be traded for current consumption by setting MDMCFG2.DEM_DCFILT_OFF=1. The typical current consumption is then
reduced by approximately 2 mA close to the sensitivity limit. The sensitivity is typically reduced to -100dBm.
MDMCFG2.DEM_DCFILT_OFF = 1 cannot be used for data rates ≥ 250 kBaud.
See Figure 26 for blocking performance at other offset frequencies.
See Figure 27 for blocking performance at other offset frequencies.
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60
80
70
50
60
40
Selectivity [dB]
Blocking [dB]
50
40
30
20
10
30
20
10
0
0
-10
-20
-40
-10
-30
-20
-10
0
10
20
30
-1
40
Offset [MHz]
-0.8 -0.6 -0.4 -0.2
0
0.2 0.4 0.6 0.8
1
Offset [MHz]
NOTE: 868.3 MHz, 2-FSK, 5.2-kHz deviation, IF frequency is 152.3 kHz, digital channel filter bandwidth is 58 kHz
Figure 24. Typical Selectivity at 1.2-kBaud Data Rate
80
50
70
40
60
30
Selectivity [dB]
Blocking [dB]
50
40
30
20
10
20
10
0
0
-10
-10
-20
-40
-20
-30
-20
-10
0
10
Offset [MHz]
20
30
40
-1
-0.8 -0.6 -0.4 -0.2
0
0.2 0.4 0.6 0.8
1
Offset [MHz]
NOTE: 868 MHz, 2-FSK, 20 kHz deviation, IF frequency is 152.3 kHz, digital channel filter bandwidth is 100 kHz
Figure 25. Typical Selectivity at 38.4-kBaud Data Rate
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50
80
70
40
60
30
Selectivity [dB]
Blocking [dB]
50
40
30
20
10
20
10
0
0
-10
-10
-20
-40
-20
-30
-20
-10
0
10
20
30
-3
40
-2
-1
Offset [MHz]
0
1
2
3
1
2
3
Offset [MHz]
NOTE: 868 MHz, 2-FSK, IF frequency is 304 kHz, digital channel filter bandwidth is 540 kHz
Figure 26. Typical Selectivity at 250-kBaud Data Rate
80
50
70
40
60
30
Selectivity [dB]
Blocking [dB]
50
40
30
20
10
20
10
0
0
-10
-10
-20
-40
-20
-30
-20
-10
0
10
20
30
40
-3
-2
Offset [MHz]
-1
0
Offset [MHz]
NOTE: 868 MHz, 2-FSK, IF frequency is 355 kHz, digital channel filter bandwidth is 812 kHz
Figure 27. Typical Selectivity at 500-kBaud Data Rate
76
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Typical Sensitivity, 315 MHz, Sensitivity Optimized Setting
PARAMETER
Sensitivity,
315 MHz
DATA RATE (kBaud)
VCC
TA
2.0 V
3.0 V
3.6 V
-40°C
25°C
85°C
-40°C
25°C
85°C
-40°C
25°C
85°C
1.2
-112
-112
-110
-112
-111
-109
-112
-111
-108
38.4
-105
-105
-104
-105
-103
-102
-105
-104
-102
250
-95
-95
-92
-94
-95
-92
-95
-94
-91
UNIT
dBm
Typical Sensitivity, 433 MHz, Sensitivity Optimized Setting
PARAMETER
Sensitivity,
433 MHz
DATA RATE (kBaud)
VCC
TA
2.0 V
3.0 V
3.6 V
-40°C
25°C
85°C
-40°C
25°C
85°C
-40°C
25°C
85°C
1.2
-111
-110
-108
-111
-111
-108
-111
-110
-107
38.4
-104
-104
-101
-104
-104
-101
-104
-103
-101
250
-93
-94
-91
-93
-93
-90
-93
-93
-90
UNIT
dBm
Typical Sensitivity, 868 MHz, Sensitivity Optimized Setting
PARAMETER
Sensitivity,
868 MHz
DATA RATE (kBaud)
VCC
TA
2.0 V
3.0 V
3.6 V
-40°C
25°C
85°C
-40°C
25°C
85°C
-40°C
25°C
85°C
1.2
-109
-109
-107
-109
-109
-106
-109
-108
-106
38.4
-102
-102
-100
-102
-102
-99
-102
-101
-99
250
-90
-90
-88
-89
-90
-87
-89
-90
-87
500
-84
-84
-81
-84
-84
-80
-84
-84
-80
UNIT
dBm
Typical Sensitivity, 915 MHz, Sensitivity Optimized Setting
PARAMETER
Sensitivity,
915 MHz
DATA RATE (kBaud)
VCC
TA
2.0 V
3.0 V
3.6 V
-40°C
25°C
85°C
-40°C
25°C
85°C
-40°C
25°C
85°C
1.2
-109
-109
-107
-109
-109
-106
-109
-108
-105
38.4
-102
-102
-100
-102
-102
-99
-103
-102
-99
250
-92
-92
-89
-92
-92
-88
-92
-92
-88
500
-87
-86
-81
-86
-86
-81
-86
-85
-80
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UNIT
dBm
77
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RF Transmit
TA = 25°C, VCC = 3 V (unless otherwise noted) (1), PTX = +10 dBm (unless otherwise noted)
PARAMETER
FREQ
(MHz)
TEST CONDITIONS
MIN
315
Differential load
impedance (2)
116 + j41
868, 915
86.5 + j43
433
868
433
Harmonics,
radiated (4) (5) (6)
868
915
315
433
Harmonics, conducted
868
915
315
Spurious emissions,
conducted, harmonics
not included (8)
868
TX latency (9)
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
78
Ω
+11
dBm
+11
-30
Second harmonic
-56
Third harmonic
-57
Second harmonic
-50
Third harmonic
-52
Second harmonic
-50
Third harmonic
Frequencies below 960 MHz
Frequencies above 960 MHz
Frequencies below 1 GHz
Frequencies above 1 GHz
Second harmonic
Other harmonics
Second harmonic
Other harmonics
Frequencies below 960 MHz
Frequencies above 960 MHz
Frequencies above 1 GHz
+10 dBm CW
+10 dBm CW
+10 dBm CW
+11 dBm CW (7)
+10 dBm CW
< -48
-45
< -48
-59
-53
< -47
< -58
< -53
< -54
+10 dBm CW
< -54
Frequencies below 1 GHz
< -46
Frequencies above 960 MHz
Serial operation
dBm
< -71
< -63
Frequencies below 960 MHz
dBm
< -38
Frequencies within 47 to 74, 87.5 to 118,
174 to 230, 470 to 862 MHz
Frequencies above 1 GHz
dBm
-54
+10 dBm CW
Frequencies within 47 to 74, 87.5 to 118,
174 to 230, 470 to 862 MHz
915
+13
Delivered to a 50Ω single-ended load via CC430 reference
design's RF matching network
Frequencies below 1 GHz
433
UNIT
+12
Delivered to a 50Ω single-ended load via CC430 reference
design's RF matching network
915
Output power, lowest
setting (3)
MAX
122 + j31
433
315
Output power, highest
setting (3)
TYP
dBm
< -59
< -56
+11 dBm CW
< -49
< -63
8
bits
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
Differential impedance as seen from the RF-port (RF_P and RF_N) towards the antenna. Follow the CC430 reference designs available
from the TI website.
Output power is programmable, and full range is available in all frequency bands. Output power may be restricted by regulatory limits.
See also application note AN050 Using the CC1101 in the European 868 MHz SRD Band (SWRA146) and design note DN013
Programming Output Power on CC1101 (SWRA151), which gives the output power and harmonics when using multi-layer inductors.
The output power is then typically +10 dBm when operating at 868 or 915 MHz.
The antennas used during the radiated measurements (SMAFF-433 from R.W.Badland and Nearson S331 868 or 915) play a part in
attenuating the harmonics.
Measured on EM430F6137RF900 with CW, maximum output power
All harmonics are below -41.2 dBm when operating in the 902 to 928 MHz band.
Requirement is -20 dBc under FCC 15.247
All radiated spurious emissions are within the limits of ETSI. Also see design note DN017 CC11xx 868/915 MHz RF Matching
(SWRA168).
Time from sampling the data on the transmitter data input pin until it is observed on the RF output ports
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Optimum PATABLE Settings for Various Output Power Levels and Frequency Bands
TA = 25°C, VCC = 3 V (unless otherwise noted) (1)
OUTPUT POWER (dBm)
(1)
PATABLE SETTING
315 MHz
433 MHz
868 MHz
915 MHz
-30
0x12
0x05
0x03
0x03
-12
0x33
0x26
0x25
0x25
-6
0x29
0x2D
0x2D
0x2D
0
0x51
0x50
0x8D
0x8D
10
0xC4
0xC4
0xC3
0xC3
max.
0xC0
0xC0
0xC0
0xC0
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
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Typical Output Power, 315 MHz (1)
PARAMETER
Output power,
315 MHz
(1)
PATABLE Setting
VCC
TA
2.0 V
-40°C
25°C
3.0 V
85°C
-40°C
25°C
3.6 V
85°C
-40°C
25°C
0xC0 (max)
11.9
11.8
11.8
0xC4 (10 dBm)
10.3
10.3
10.3
0xC6 (default)
85°C
9.3
UNIT
dBm
0x51 (0 dBm)
0.7
0.6
0.7
0x29 (-6 dBm)
-6.8
-5.6
-5.3
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
Typical Output Power, 433 MHz (1)
PARAMETER
Output power,
433 MHz
(1)
PATABLE Setting
VCC
TA
2.0 V
-40°C
25°C
3.0 V
85°C
-40°C
25°C
3.6 V
85°C
-40°C
25°C
0xC0 (max)
12.6
12.6
12.6
0xC4 (10 dBm)
10.3
10.2
10.2
0xC6 (default)
85°C
10.0
UNIT
dBm
0x50 (0 dBm)
0.3
0.3
0.3
0x2D (-6 dBm)
-6.4
-5.4
-5.1
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
Typical Output Power, 868 MHz (1)
PARAMETER
Output power,
868 MHz
(1)
PATABLE Setting
VCC
TA
2.0 V
3.0 V
3.6 V
-40°C
25°C
85°C
-40°C
25°C
85°C
-40°C
25°C
85°C
0xC0 (max)
11.9
11.2
10.5
11.9
11.2
10.5
11.9
11.2
10.5
0xC3 (10 Bm)
10.8
10.1
9.4
10.8
10.1
9.4
10.7
10.1
9.4
0xC6 (default)
8.8
UNIT
dBm
0x8D (0 dBm)
1.0
0.3
-0.3
1.1
0.3
-0.3
1.1
0.3
-0.3
0x2D (-6 dBm)
-6.5
-6.8
-7.3
-5.3
-5.8
-6.3
-4.9
-5.4
-6.0
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
Typical Output Power, 915 MHz (1)
PARAMETER
Output power,
915 MHz
(1)
80
PATABLE Setting
VCC
TA
2.0 V
3.0 V
3.6 V
-40°C
25°C
85°C
-40°C
25°C
85°C
-40°C
25°C
85°C
0xC0 (max)
12.2
11.4
10.6
12.1
11.4
10.7
12.1
11.4
10.7
0xC3 (10 dBm)
11.0
10.3
9.5
11.0
10.3
9.5
11.0
10.3
9.6
0xC6 (default)
8.8
UNIT
dBm
0x8D (0 dBm)
1.9
1.0
0.3
1.9
1.0
0.3
1.9
1.1
0.3
0x2D (-6 dBm)
-5.5
-6.0
-6.5
-4.3
-4.8
-5.5
-3.9
-4.4
-5.1
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
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Frequency Synthesizer Characteristics
TA = 25°C, VCC = 3 V (unless otherwise noted) (1)
MIN figures are given using a 27-MHz crystal. TYP and MAX figures are given using a 26-MHz crystal.
PARAMETER
Programmed frequency resolution
TEST CONDITIONS
(2)
26 to 27 MHz crystal
MIN
TYP
MAX
397
16
412
Synthesizer frequency tolerance (3)
PLL turn-on and hop time
±40
50 kHz offset from carrier
-95
100 kHz offset from carrier
-94
200 kHz offset from carrier
-94
500 kHz offset from carrier
RF carrier phase noise
(4)
fXOSC/2
-107
2 MHz offset from carrier
-112
5 MHz offset from carrier
-118
10 MHz offset from carrier
-129
dBc/Hz
85.1
88.4
µs
PLL RX to TX settling time (5)
9.3
9.6
µs
PLL TX to RX settling time (6)
20.7
21.5
µs
PLL calibration time (7)
694
721
µs
(1)
(2)
(3)
(4)
(5)
(6)
(7)
Crystal oscillator running
Hz
ppm
-98
1 MHz offset from carrier
UNIT
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
The resolution (in Hz) is equal for all frequency bands.
Depends on crystal used. Required accuracy (including temperature and aging) depends on frequency band and channel bandwidth /
spacing.
Time from leaving the IDLE state until arriving in the RX, FSTXON, or TX state when not performing calibration.
Settling time for the 1-IF frequency step from RX to TX
Settling time for the 1-IF frequency step from TX to RX
Calibration can be initiated manually or automatically before entering or after leaving RX/TX
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Typical RSSI_offset Values
TA = 25°C, VCC = 3 V (unless otherwise noted) (1)
RSSI_OFFSET (dB)
DATA RATE (kBaud)
(1)
433 MHz
868 MHz
1.2
74
74
38.4
74
74
250
74
74
500
74
74
All measurement results are obtained using the EM430F6137RF900 with BOM according to tested frequency range (see Table 49).
0
0
250kBaud
1.2kBaud
-20
RSSI Readout [dBm]
RSSI Readout [dBm]
-20
38.4kBaud
-40
-60
-80
-100
500kBaud
-40
-60
-80
-100
-120
-120
-100
-80
-60
-40
Input Pow er [dBm ]
-20
0
-120
-120
-100
-80
-60
-40
-20
0
Input Pow er [dBm ]
Figure 28. Typical RSSI Value vs Input Power Level for Different Data Rates at 868 MHz
82
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C19
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C11
C10
DVCC
VCORE
R2
TCK
TEST/SBWTCK
C20
CC430F61xx
34
35
36
37
38
39
40
41
42
43
44
45
46
47
C9
C8
VDD
16
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
15
14
13
12
11
10
9
8
7
6
5
4
3
2
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
48
1
DVCC
VDD
C14
AVCC
C12
AVSS
C15
DVCC
C13
VDD
nRST/NMI/SBWTDIO
AVDD
TMS
RF_XIN
RF_XOUT
AVCC_RF
AVCC_RF
RF_P
RF_N
AVCC_RF
AVCC_RF
R_BIAS
GUARD
TDO
TDI/TCLK
R1
C21
26MHz
AVDD
(JTAG / SBW signals)
C22
C4
C5
C1
C6
C2
C7
C3
(May be added close to the respective pins
to reduce emissions at 5GHz to levels
required by ETSI.)
C16
C17
C18
L1
L2
L4
C23
C24
C25
C26
L3
C27
L5
L6
C28
L7
C29
SMA STRAIGHT JACK, SMT
ECCN 5E002 TSPA - Technology / Software Publicly Available
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CC430F614x
CC430F514x
CC430F512x
SLAS555 – JUNE 2012
APPLICATION CIRCUIT
For a complete reference design including layout see the CC430 Wireless Development Tools and related
documentation.
Figure 29. Typical Application Circuit CC430F61xx
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83
C19
C11
VDD
C10
DVCC
VCORE
C12
C13
C14
C15
R2
C20
CC430F51xx
34
26
27
28
29
30
31
32
33
C9
C8
VDD
25
12
13 14 15 16 17 18 19 20 21 22 23 24
11
10
9
8
7
6
5
4
3
35
AVSS
2
TEST/SBWTCK
48 47 46 45 44 43 42 41 40 39 38 37
36
TCK
1
DVCC
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AVCC
VDD
nRST/NMI/SBWTDIO
AVDD
TMS
84
DVCC
RF_XIN
RF_XOUT
AVCC_RF
AVCC_RF
RF_P
RF_N
AVCC_RF
AVCC_RF
R_BIAS
GUARD
TDO
TDI/TCLK
C21
C16
C17
C18
R1
C22
C4
C5
C1
C6
C2
(May be added close to the respective pins
to reduce emissions at 5GHz to levels
required by ETSI.)
26MHz
AVDD
(JTAG / SBW signals)
C7
C3
L1
L2
L4
C23
C24
C25
C26
L3
C27
L5
L6
C28
L7
C29
SMA STRAIGHT JACK, SMT
CC430F614x
CC430F514x
CC430F512x
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For a complete reference design including layout, see the CC430 Wireless Development Tools and related
documentation.
Figure 30. Typical Application Circuit CC430F51xx
Copyright © 2012, Texas Instruments Incorporated
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CC430F614x
CC430F514x
CC430F512x
SLAS555 – JUNE 2012
Table 49. Bill of Materials
COMPONENTS
(1)
(2)
FOR 315 MHz
FOR 433 MHz
FOR 868, 915 MHz
COMMENT
C1,3,4,5,7,9,11,13,15
100 nF
Decoupling capacitors
C8,10,12,14
10 µF
Decoupling capacitors
C2,6,16,17,18
2 pF
Decoupling capacitors
C19
470 nF
VCORE capacitor
C20
2.2 nF
RST decoupling cap
(optimized for SBW)
C21,22
27 pF
Load capacitors for
26 MHz crystal (1)
R1
56 kΩ
R_BIAS (±1% required)
R2
47kΩ
RST pullup
L1,2
Capacitors: 220 pF
0.016 µH
0.012 µH
L3,4
0.033 µH
0.027 µH
0.018 µH
L5
0.033 µH
0.047 µH
0.015 µH
L6
dnp (2)
dnp (2)
0.0022 µH
L7
0.033 µH
0.051 µH
0.015 µH
(2)
C23
dnp
2.7 pF
1 pF
C24
220 pF
220 pF
100 pF
C25
6.8 pF
3.9 pF
1.5 pF
C26
6.8 pF
3.9 pF
1.5 pF
C27
220 pF
220 pF
1.5 pF
C28
10 pF
4.7 pF
8.2 pF
C29
220 pF
220 pF
1.5 pF
The load capacitance CL seen by the crystal is CL = 1/((1/C21)+(1/C22)) + Cparasitic. The parasitic capacitance Cparasitic includes pin
capacitance and PCB stray capacitance. It can be typically estimated to be approximately 2.5 pF.
dnp = do not populate
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INPUT/OUTPUT SCHEMATICS
Port P1, P1.0 to P1.4, Input/Output With Schmitt Trigger
S18...S22
(n/a CC430F514x and CC430F512x)
LCDS18...LCDS22
Pad Logic
P1REN.x
P1MAP.x = PMAP_ANALOG
P1DIR.x
0
from Port Mapping
1
P1OUT.x
0
from Port Mapping
1
DVSS
0
DVCC
1
Direction
0: Input
1: Output
P1DS.x
0: Low drive
1: High drive
P1SEL.x
P1IN.x
P1.0/P1MAP0(/S18)
P1.1/P1MAP1(/S19)
P1.2/P1MAP2(/S20)
P1.3/P1MAP3(/S21)
P1.4/P1MAP4(/S22)
Bus
Keeper
EN
to Port Mapping
1
D
P1IE.x
EN
P1IRQ.x
Q
P1IFG.x
P1SEL.x
P1IES.x
Set
Interrupt
Edge
Select
NOTE: CC430F514x and CC430F512x devices do not provide LCD functionality.
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CC430F514x
CC430F512x
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SLAS555 – JUNE 2012
Table 50. Port P1 (P1.0 to P1.4) Pin Functions
CONTROL BITS/SIGNALS
PIN NAME (P1.x)
P1.0/P1MAP/S18
x
0
FUNCTION
P1.0 (I/O)
Mapped secondary digital function (see Table 10)
Output driver and input Schmitt trigger disabled
S18 (not available on CC430F514x and CC430F512x)
P1.1/P1MAP1/S19
1
P1.1 (I/O)
Mapped secondary digital function (see Table 10)
P1.2/P1MAP2/S20
2
3
4
X
0
1
≤ 30 (2)
0
X
1
= 31
0
0; 1 (2)
X
X
X
1
I: 0; O: 1
0
X
0
0; 1 (2)
1
≤ 30 (2)
0
X
1
= 31
0
X
X
X
1
I: 0; O: 1
0
X
0
0; 1 (2)
1
≤ 30 (2)
0
P1.2 (I/O)
Output driver and input Schmitt trigger disabled
X
1
= 31
0
S22 (not available on CC430F514x and CC430F512x)
X
X
X
1
I: 0; O: 1
0
X
P1.3 (I/O)
0; 1
(2)
1
≤ 30
0
(2)
0
Output driver and input Schmitt trigger disabled
X
1
= 31
0
S21 (not available on CC430F514x and CC430F512x)
X
X
X
1
I: 0; O: 1
0
X
0
0; 1 (2)
1
≤ 30 (2)
0
Output driver and input Schmitt trigger disabled
X
1
= 31
0
S22 (not available on CC430F514x and CC430F512x)
X
X
X
1
P1.4 (I/O)
Mapped secondary digital function (see Table 10)
(1)
(2)
0
I: 0; O: 1
S19 (not available on CC430F514x and CC430F512x)
Mapped secondary digital function (see Table 10)
P1.4/P1MAP4/S22
LCDS19 to
LCDS22 (1)
P1SEL.x
Output driver and input Schmitt trigger disabled
Mapped secondary digital function (see Table 10)
P1.3/P1MAP3/S21
P1MAPx
P1DIR.x
LCDSx not available in CC430F514x and CC430F512x.
According to mapped function (see Table 10)
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Port P1, P1.5 to P1.7, Input/Output With Schmitt Trigger
to LCD_B
(n/a CC430F514x
and CC430F512x)
Pad Logic
P1REN.x
P1MAP.x = PMAP_ANALOG
P1DIR.x
0
from Port Mapping
1
P1OUT.x
0
from Port Mapping
1
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
P1DS.x
0: Low drive
1: High drive
P1SEL.x
P1.5/P1MAP5(/R23)
P1.6/P1MAP6(/R13)
P1.7/P1MAP7(/R03)
P1IN.x
Bus
Keeper
EN
to Port Mapping
D
P1IE.x
EN
P1IRQ.x
Q
P1IFG.x
P1SEL.x
P1IES.x
Set
Interrupt
Edge
Select
NOTE: CC430F514x and CC430F512x devices do not provide LCD functionality.
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Table 51. Port P1 (P1.5 to P1.7) Pin Functions
PIN NAME (P1.x)
P1.5/P1MAP5/R23
x
5
FUNCTION
P1.5 (I/O)
Mapped secondary digital function (see Table 10)
R23 (2) (not available on CC430F514x and CC430F512x)
P1.6/P1MAP6/R13/
LCDREF
6
P1.6 (I/O)
Mapped secondary digital function (see Table 10)
(2)
R13/LCDREF
CC430F512x)
P1.7/P1MAP7/R03
7
(not available on CC430F514x and
P1.7 (I/O)
Mapped secondary digital function (see Table 10)
R03 (2) (not available on CC430F514x and CC430F512x)
(1)
(2)
CONTROL BITS/SIGNALS
P1DIR.x
P1SEL.x
I: 0; O: 1
0
X
0; 1 (1)
1
≤ 30 (1)
X
1
= 31
I: 0; O: 1
0
X
1
≤ 30 (1)
X
1
= 31
I: 0; O: 1
0
X
0; 1 (1)
1
≤ 30 (1)
X
1
= 31
0; 1
(1)
P1MAPx
According to mapped function (see Table 10)
Setting P1SEL.x bit together with P1MAPx = PM_ANALOG disables the output driver and the input Schmitt trigger.
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Port P2, P2.0 to P2.3, Input/Output With Schmitt Trigger
Pad Logic
To ADC10_A
(n/a CC430F512x)
INCHx = x
To Comparator_B
from Comparator_B
CBPD.x
P2REN.x
P2MAP.x = PMAP_ANALOG
P2DIR.x
0
from Port Mapping
1
P2OUT.x
0
from Port Mapping
1
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
P2DS.x
0: Low drive
1: High drive
P2SEL.x
P2IN.x
Bus
Keeper
EN
to Port Mapping
P2.0/P2MAP0/CB0(/A0)
P2.1/P2MAP2/CB1(/A1)
P2.2/P2MAP2/CB2(/A2)
P2.3/P2MAP3/CB3(/A3)
D
P2IE.x
EN
P2IRQ.x
Q
P2IFG.x
P2SEL.x
P2IES.x
90
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Set
Interrupt
Edge
Select
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CC430F514x
CC430F512x
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Port P2, P2.4, Input/Output With Schmitt Trigger
Pad Logic
ADC10_A ext. Reference Input VeREF(n/a CC430F512x)
to ADC10_A
(n/a CC430F512x)
INCHx = x
To Comparator_B
from Comparator_B
CBPD.x
P2REN.x
P2MAP.x = PMAP_ANALOG
P2DIR.x
0
from Port Mapping
1
P2OUT.x
0
from Port Mapping
1
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
P2DS.x
0: Low drive
1: High drive
P2SEL.x
P2.4/P2MAP4/CB4(/A4/VeREF-)
P2IN.x
Bus
Keeper
EN
to Port Mapping
D
P2IE.x
EN
P2IRQ.x
Q
P2IFG.x
P2SEL.x
P2IES.x
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Set
Interrupt
Edge
Select
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Port P2, P2.5, Input/Output With Schmitt Trigger
REFCTL0.REFOUT
Pad Logic
1.5V/2.0V/2.5V from shared REF
(n/a CC430F512x)
Buffer
ADC10_A ext. Reference Input VeREF+
(n/a CC430F512x)
to ADC10_A
(n/a CC430F512x)
INCHx = x
To Comparator_B
from Comparator_B
CBPD.x
P2REN.x
P2MAP.x = PMAP_ANALOG
P2DIR.x
0
from Port Mapping
1
P2OUT.x
0
from Port Mapping
1
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
P2DS.x
0: Low drive
1: High drive
P2SEL.x
P2.5/P2MAP5/CB5(/A5/VREF+/VeR
P2IN.x
Bus
Keeper
EN
to Port Mapping
D
P2IE.x
EN
P2IRQ.x
Q
P2IFG.x
P2SEL.x
P2IES.x
92
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Set
Interrupt
Edge
Select
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CC430F514x
CC430F512x
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SLAS555 – JUNE 2012
Port P2, P2.6 and P2.7, Input/Output With Schmitt Trigger
Pad Logic
To ADC10_A
(n/a CC430F514x and CC430F512x)
INCHx = x
To Comparator_B
(n/a CC430F514x and CC430F512x)
from Comparator_B
CBPD.x
(n/a CC430F514x and CC430F512x)
P2REN.x
P2MAP.x = PMAP_ANALOG
P2DIR.x
0
from Port Mapping
1
P2OUT.x
0
from Port Mapping
1
DVSS
0
DVCC
1
1
Direction
0: Input
1: Output
P2DS.x
0: Low drive
1: High drive
P2SEL.x
P2.6/P2MAP6(/CB6/A6)
P2.7/P2MAP7(/CB7/A7)
P2IN.x
Bus
Keeper
EN
to Port Mapping
D
P2IE.x
EN
P2IRQ.x
Q
P2IFG.x
P2SEL.x
P2IES.x
Set
Interrupt
Edge
Select
CC430F514x and CC430F512x devices do not provide analog functionality on port P2.6 and P2.7 pins.
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Table 52. Port P2 (P2.0 to P2.7) Pin Functions
PIN NAME (P2.x)
P2.0/P2MAP0/CB0
(/A0)
P2.1/P2MAP1/CB1
(/A1)
x
0
CONTROL BITS/SIGNALS
FUNCTION
P2DIR.x
P2SEL.x
I: 0; O: 1
0; 1 (1)
A0 (not available on CC430F512x) (2)
CB0 (3)
P2.0 (I/O)
Mapped secondary digital function (see Table 10)
1
P2.1 (I/O)
Mapped secondary digital function (see Table 10)
A1 (not available on CC430F512x) (2)
CB1 (3)
P2.2/P2MAP2/CB2
(/A2)
2
P2.2 (I/O)
Mapped secondary digital function (see Table 10)
A2 (not available on CC430F512x)
(2)
CB2 (3)
P2.3/P2MAP3/CB3
(/A3)
3
P2.3 (I/O)
Mapped secondary digital function (see Table 10)
A3 (not available on CC430F512x)
(2)
CB3 (3)
P2.4/P2MAP4/CB4
(/A4/VeREF-)
P2.5/P2MAP5/CB5
(/A5/VREF+/VeREF+)
P2.6/P2MAP6(/CB6)
(/A6)
P2.7/P2MAP7(/CB7)
(/A7)
(1)
(2)
(3)
94
4
P2.4 (I/O)
Mapped secondary digital function (see Table 10)
5
0
X
0
1
≤ 30 (1)
0
X
1
= 31
X
X
X
X
1
I: 0; O: 1
0
X
0
0; 1 (1)
1
≤ 30 (1)
0
X
1
= 31
X
X
X
X
1
I: 0; O: 1
0
X
0
0; 1 (1)
1
≤ 30 (1)
0
X
1
= 31
X
X
X
X
1
I: 0; O: 1
0
X
0
0; 1 (1)
1
≤ 30 (1)
0
X
1
= 31
X
X
X
X
1
I: 0; O: 1
0
X
0; 1
(1)
1
≤ 30
0
(1)
0
X
1
= 31
X
CB4 (3)
X
X
X
1
I: 0; O: 1
0
X
0
0; 1 (1)
1
≤ 30 (1)
0
A5/VREF+VeREF+ (not available on CC430F512x) (2)
X
1
= 31
X
CB5 (3)
X
X
X
1
I: 0; O: 1
0
X
0
0; 1 (1)
1
≤ 30 (1)
0
A6 (not available on CC430F514x and
CC430F512x) (2)
X
1
= 31
X
CB6 (not available on CC430F514x and
CC430F512x) (3)
X
X
X
1
0
X
P2.5 (I/O)
P2.6 (I/O)
Mapped secondary digital function (see Table 10)
7
CBPD.x
A4/VeREF- (not available on CC430F512x) (2)
Mapped secondary digital function (see Table 10)
6
P2MAPx
P2.7 (I/O)
Mapped secondary digital function (see Table 10)
I: 0; O: 1
0; 1
(1)
1
≤ 30
0
(1)
0
A7 (not available on CC430F514x and
CC430F512x) (2)
X
1
= 31
X
CB7 (not available on CC430F514x and
CC430F512x) (3)
X
X
X
1
According to mapped function (see Table 10)
Setting P2SEL.x bit together with P2MAPx = PM_ANALOG disables the output driver and the input Schmitt trigger.
Setting the CBPD.x bit disables the output driver and the input Schmitt trigger to prevent parasitic cross currents when applying analog
signals. Selecting the CBx input pin to the comparator multiplexer with the CBx bits automatically disables output driver and input buffer
for that pin, regardless of the state of the associated CBPD.x bit.
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Port P3, P3.0 to P3.7, Input/Output With Schmitt Trigger
S10...S17
(n/a CC430F514x and CC430F512x)
LCDS10...LCDS17
Pad Logic
P3REN.x
P3MAP.x = PMAP_ANALOG
P3DIR.x
0
from Port Mapping
1
P3OUT.x
0
from Port Mapping
1
DVSS
0
DVCC
1
Direction
0: Input
1: Output
P3DS.x
0: Low drive
1: High drive
P3SEL.x
P3IN.x
EN
to Port Mapping
1
D
Bus
Keeper
P3.0/P3MAP0(/S10)
P3.1/P3MAP1(/S11)
P3.2/P3MAP2(/S12)
P3.3/P3MAP3(/S13)
P3.4/P3MAP4(/S14)
P3.5/P3MAP5(/S15)
P3.6/P3MAP6(/S16)
P3.7/P3MAP7(/S17)
CC430F514x and CC430F512x devices do not provide LCD functionality.
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Table 53. Port P3 (P3.0 to P3.7) Pin Functions
CONTROL BITS/SIGNALS
PIN NAME (P3.x)
P3.0/P3MAP0/S10
x
0
FUNCTION
P3.0 (I/O)
Mapped secondary digital function (see Table 10)
Output driver and input Schmitt trigger disabled
S10 (not available on CC430F514x and CC430F512x)
P3.1/P3MAP1/S11
1
P3.1 (I/O)
Mapped secondary digital function (see Table 10)
P3.2/P3MAP7/S12
2
3
4
5
96
0
X
X
X
1
I: 0; O: 1
0
X
0
0; 1 (2)
1
≤ 30 (2)
0
0
X
1
I: 0; O: 1
0
X
0
0; 1 (2)
1
≤ 30 (2)
0
P3.2 (I/O)
Output driver and input Schmitt trigger disabled
X
1
= 31
0
S12 (not available on CC430F514x and CC430F512x)
X
X
X
1
I: 0; O: 1
0
X
P3.3 (I/O)
0; 1
(2)
1
≤ 30
0
(2)
0
Output driver and input Schmitt trigger disabled
X
1
= 31
0
S13 (not available on CC430F514x and CC430F512x)
X
X
X
1
I: 0; O: 1
0
X
0
0; 1 (2)
1
≤ 30 (2)
0
Output driver and input Schmitt trigger disabled
X
1
= 31
0
S14 (not available on CC430F514x and CC430F512x)
X
X
X
1
I: 0; O: 1
0
X
0
0; 1 (2)
1
≤ 30 (2)
0
X
1
= 31
0
P3.4 (I/O)
P3.5 (I/O)
P3.6 (I/O)
X
X
X
1
I: 0; O: 1
0
X
0
0; 1 (2)
1
≤ 30 (2)
0
Output driver and input Schmitt trigger disabled
X
1
= 31
0
S16 (not available on CC430F514x and CC430F512x)
X
X
X
1
I: 0; O: 1
0
X
0
0; 1 (2)
1
≤ 30 (2)
0
P3.7 (I/O)
Mapped secondary digital function (see Table 10)
(1)
(2)
= 31
= 31
Mapped secondary digital function (see Table 10)
7
1
1
S15 (not available on CC430F514x and CC430F512x)
P3.7/P3MAP7/S17
0
X
X
Output driver and input Schmitt trigger disabled
6
0
≤ 30 (2)
X
Mapped secondary digital function (see Table 10)
P3.6/P3MAP6/S16
X
1
0; 1 (2)
X
Mapped secondary digital function (see Table 10)
P3.5/P3MAP5/S15
0
I: 0; O: 1
S11 (not available on CC430F514x and CC430F512x)
Mapped secondary digital function (see Table 10)
P3.4/P3MAP4/S14
LCDS10...
17 (1)
P3SEL.x
Output driver and input Schmitt trigger disabled
Mapped secondary digital function (see Table 10)
P3.3/P3MAP3/S13
P3MAPx
P3DIR.x
Output driver and input Schmitt trigger disabled
X
1
= 31
0
S17 (not available on CC430F514x and CC430F512x)
X
X
X
1
LCDSx not available in CC430F514x and CC430F512x.
According to mapped function (see Table 10)
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CC430F514x
CC430F512x
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SLAS555 – JUNE 2012
Port P4, P4.0 to P4.7, Input/Output With Schmitt Trigger (CC430F614x only)
S2...S9
LCDS2...LCDS9
Pad Logic
P4REN.x
P4DIR.x
0
0
DVSS
1
0
DVCC
1
P4DS.x
0: Low drive
1: High drive
P4SEL.x
P4IN.x
EN
Not Used
1
Direction
0: Input
1: Output
1
P4OUT.x
DVSS
D
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Bus
Keeper
P4.0/S2
P4.1/S3
P4.2/S4
P4.3/S5
P4.4/S6
P4.5/S7
P4.6/S8
P4.7/S9
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Table 54. Port P4 (P4.0 to P4.7) Pin Functions (CC430F614x only)
PIN NAME (P4.x)
P4.0/P4MAP0/S2
P4.1/P4MAP1/S3
x
0
1
FUNCTION
P4.0 (I/O)
2
3
0
0
0
1
0
DVSS
1
1
0
S2
X
X
1
P4.1 (I/O)
I: 0; O: 1
0
0
N/A
0
1
0
DVSS
1
1
0
P4.2 (I/O)
P4.5/P4MAP5/S7
P4.6/P4MAP6/S8
4
5
6
7
1
0
0
0
1
0
1
1
0
X
X
1
I: 0; O: 1
0
0
0
1
0
P4.3 (I/O)
DVSS
1
1
0
S5
X
X
1
I: 0; O: 1
0
0
N/A
0
1
0
DVSS
1
1
0
S6
X
X
1
P4.4 (I/O)
P4.5 (I/O)
I: 0; O: 1
0
0
N/A
0
1
0
DVSS
1
1
0
S7
X
X
1
P4.6 (I/O)
I: 0; O: 1
0
0
N/A
0
1
0
DVSS
1
1
0
P4.7 (I/O)
N/A
98
X
S4
S8
P4.7/P4MAP7/S9
X
I: 0; O: 1
DVSS
N/A
P4.4/P4MAP4/S6
LCDS2...7
I: 0; O: 1
N/A
P4.3/P4MAP3/S5
P4SEL.x
N/A
S3
P4.2/P4MAP7/S4
CONTROL BITS/SIGNALS
P4DIR.x
X
X
1
I: 0; O: 1
0
0
0
1
0
DVSS
1
1
0
S9
X
X
1
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CC430F512x
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SLAS555 – JUNE 2012
Port P5, P5.0, Input/Output With Schmitt Trigger
Pad Logic
to XT1
P5REN.0
P5DIR.0
DVSS
0
DVCC
1
1
0
1
P5OUT.0
0
Module X OUT
1
P5DS.x
0: Low drive
1: High drive
P5SEL.0
P5.0/XIN
P5IN.0
EN
Module X IN
Bus
Keeper
D
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Port P5, P5.1, Input/Output With Schmitt Trigger
Pad Logic
to XT1
P5REN.1
P5DIR.1
DVSS
0
DVCC
1
1
0
1
P5OUT.1
0
Module X OUT
1
P5.1/XOUT
P5DS.x
0: Low drive
1: High drive
P5SEL.0
XT1BYPASS
P5IN.1
Bus
Keeper
EN
Module X IN
D
Table 55. Port P5 (P5.0 and P5.1) Pin Functions
PIN NAME (P5.x)
P5.0/XIN
P5.1/XOUT
(1)
(2)
(3)
100
x
0
1
FUNCTION
P5.0 (I/O)
CONTROL BITS/SIGNALS (1)
P5DIR.x
P5SEL.0
P5SEL.1
XT1BYPASS
I: 0; O: 1
0
X
X
XIN crystal mode (2)
X
1
X
0
XIN bypass mode (2)
X
1
X
1
I: 0; O: 1
0
X
X
XOUT crystal mode (3)
X
1
X
0
P5.1 (I/O) (3)
X
1
X
1
P5.1 (I/O)
X = Don't care
Setting P5SEL.0 causes the general-purpose I/O to be disabled. Pending the setting of XT1BYPASS, P5.0 is configured for crystal
mode or bypass mode.
Setting P5SEL.0 causes the general-purpose I/O to be disabled in crystal mode. When using bypass mode, P5.1 can be used as
general-purpose I/O.
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CC430F512x
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Port P5, P5.2 to P5.4, Input/Output With Schmitt Trigger (CC430F614x only)
S0(P5.2)/S1(P5.3)/S23(P5.4)
LCDS0(P5.2)/LCDS1(P5.3)/LCDS23(P5.4)
Pad Logic
P5REN.x
P5DIR.x
DVSS
0
DVCC
1
1
0
1
P5OUT.x
0
DVSS
1
P5.2/S0
P5.3/S1
P5.4/S23
P5DS.x
0: Low drive
1: High drive
P5SEL.x
P5IN.x
Bus
Keeper
EN
Not Used
D
Table 56. Port P5 (P5.2 to P5.3) Pin Functions (CC430F614x only)
PIN NAME (P5.x)
P5.2/S0
x
2
FUNCTION
P5.2 (I/O)
N/A
P5.3/S1
3
CONTROL BITS/SIGNALS
P5DIR.x
P5SEL.x
LCDS0...1
I: 0; O: 1
0
0
0
1
0
DVSS
1
1
0
S0
X
X
1
I: 0; O: 1
0
0
N/A
0
1
0
DVSS
1
1
0
S1
X
X
1
P5.3 (I/O)
Table 57. Port P5 (P5.4) Pin Functions (CC430F614x only)
PIN NAME (P5.x)
P5.4/S23
x
4
FUNCTION
P5.4 (I/O)
N/A
CONTROL BITS/SIGNALS
P5DIR.x
P5SEL.x
LCDS23
I: 0; O: 1
0
0
0
1
0
DVSS
1
1
0
S23
X
X
1
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Port P5, P5.5 to P5.7, Input/Output With Schmitt Trigger (CC430F614x only)
S24(P5.5)/S25(P5.6)/S26(P5.7)
LCDS24(P5.5)/LCDS25(P5.6)/LCDS26(P5.7)
COM3(P5.5)/COM2(P5.6)/COM1(P5.7)
Pad Logic
P5REN.x
DVSS
0
DVCC
1
1
P5DIR.x
P5OUT.x
P5.5/COM3/S24
P5.6/COM2/S25
P5.7/COM1/S26
P5DS.x
0: Low drive
1: High drive
P5SEL.x
P5IN.x
Bus
Keeper
Table 58. Port P5 (P5.5 to P5.7) Pin Functions (CC430F614x only)
CONTROL BITS/SIGNALS
PIN NAME (P5.x)
P5.5/COM3/S24
x
5
FUNCTION
P5SEL.x
P5.5 (I/O)
I: 0; O: 1
0
0
COM3 (1)
X
1
X
1
S24 (1)
P5.6/COM2/S25
6
X
0
P5.6 (I/O)
I: 0; O: 1
0
0
COM2 (1)
X
1
X
1
S25 (1)
P5.7/COM1/S26
(1)
102
7
LCDS24 to
LCDS26
P5DIR.x
X
0
P5.7 (I/O)
I: 0; O: 1
0
0
COM1 (1)
X
1
X
S26 (1)
X
0
1
Setting P5SEL.x bit disables the output driver and the input Schmitt trigger.
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CC430F512x
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SLAS555 – JUNE 2012
Port J, J.0 JTAG pin TDO, Input/Output With Schmitt Trigger or Output
Pad Logic
PJREN.0
PJDIR.0
0
DVCC
1
PJOUT.0
0
From JTAG
1
DVSS
0
DVCC
1
1
PJ.0/TDO
PJDS.0
0: Low drive
1: High drive
From JTAG
PJIN.0
Port J, J.1 to J.3 JTAG pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
Pad Logic
PJREN.x
PJDIR.x
0
DVSS
1
PJOUT.x
0
From JTAG
1
DVSS
0
DVCC
1
1
PJDS.x
0: Low drive
1: High drive
From JTAG
PJ.1/TDI/TCLK
PJ.2/TMS
PJ.3/TCK
PJIN.x
EN
To JTAG
D
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CC430F614x
CC430F514x
CC430F512x
ECCN 5E002 TSPA - Technology / Software Publicly Available
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Table 59. Port PJ (PJ.0 to PJ.3) Pin Functions
PIN NAME (PJ.x)
x
CONTROL BITS/
SIGNALS (1)
FUNCTION
PJDIR.x
PJ.0/TDO
0
(2)
I: 0; O: 1
PJ.1 (I/O) (2)
I: 0; O: 1
PJ.0 (I/O)
TDO (3)
PJ.1/TDI/TCLK
1
X
TDI/TCLK (3)
PJ.2/TMS
2
PJ.2 (I/O)
TMS (3)
PJ.3/TCK
3
(1)
(2)
(3)
(4)
104
X
I: 0; O: 1
(4)
PJ.3 (I/O)
TCK (3)
(4)
(2)
X
(2)
I: 0; O: 1
(4)
X
X = Don't care
Default condition
The pin direction is controlled by the JTAG module.
In JTAG mode, pullups are activated automatically on TMS, TCK, and TDI/TCLK. PJREN.x are don't care.
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CC430F614x
CC430F514x
CC430F512x
SLAS555 – JUNE 2012
Device Descriptor Structures
Table 60 lists the content of the device descriptor tag-length-value (TLV) structure for CC430F614x and
CC430F514x device types.
Table 61 lists the content of the device descriptor tag-length-value (TLV) structure for CC430F512x device types.
Table 60. Device Descriptor Table CC430F614x and CC430F514x
Info Block
Die Record
ADC10
Calibration
REF
Calibration
Description
Address
Size
bytes
F6147
F6145
F6143
F5147
F5145
F5143
Value
Value
Value
Value
Value
Value
06h
Info length
01A00h
1
06h
06h
06h
06h
06h
CRC length
01A01h
1
06h
06h
06h
06h
06h
06h
CRC value
01A02h
2
per unit
per unit
per unit
per unit
per unit
per unit
Device ID
01A04h
1
035h
036h
037h
038h
039h
03Ah
Device ID
01A05h
1
081h
081h
081h
081h
081h
081h
Hardware revision
01A06h
1
per unit
per unit
per unit
per unit
per unit
per unit
Firmware revision
01A07h
1
per unit
per unit
per unit
per unit
per unit
per unit
Die Record Tag
01A08h
1
08h
08h
08h
08h
08h
08h
Die Record length
01A09h
1
0Ah
0Ah
0Ah
0Ah
0Ah
0Ah
Lot/Wafer ID
01A0Ah
4
per unit
per unit
per unit
per unit
per unit
per unit
Die X position
01A0Eh
2
per unit
per unit
per unit
per unit
per unit
per unit
Die Y position
01A10h
2
per unit
per unit
per unit
per unit
per unit
per unit
Test results
01A12h
2
per unit
per unit
per unit
per unit
per unit
per unit
ADC10
Calibration Tag
01A14h
1
13h
13h
13h
13h
13h
13h
ADC10
Calibration length
01A15h
1
10h
10h
10h
10h
10h
10h
ADC Gain Factor
01A16h
2
per unit
per unit
per unit
per unit
per unit
per unit
ADC Offset
01A18h
2
per unit
per unit
per unit
per unit
per unit
per unit
ADC 1.5V
Reference
Temp. Sensor
30°C
01A1Ah
2
per unit
per unit
per unit
per unit
per unit
per unit
ADC 1.5V
Reference
Temp. Sensor
85°C
01A1Ch
2
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.0V
Reference
Temp. Sensor
30°C
01A1Eh
2
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.0V
Reference
Temp. Sensor
85°C
01A20h
2
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.5V
Reference
Temp. Sensor
30°C
01A22h
2
per unit
per unit
per unit
per unit
per unit
per unit
ADC 2.5V
Reference
Temp. Sensor
85°C
01A24h
2
per unit
per unit
per unit
per unit
per unit
per unit
REF Calibration
Tag
01A26h
1
12h
12h
12h
12h
12h
12h
REF Calibration
length
01A27h
1
06h
06h
06h
06h
06h
06h
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Table 60. Device Descriptor Table CC430F614x and CC430F514x (continued)
Peripheral
Descriptor
(PD)
Description
Address
Size
bytes
F6147
F6145
F6143
F5147
F5145
F5143
Value
Value
Value
Value
Value
Value
1.5V Reference
Factor
01A28h
2
per unit
per unit
per unit
per unit
per unit
per unit
2.0V Reference
Factor
01A2Ah
2
per unit
per unit
per unit
per unit
per unit
per unit
2.5V Reference
Factor
01A2Ch
2
per unit
per unit
per unit
per unit
per unit
per unit
Peripheral
Descriptor Tag
01A2Eh
1
02h
02h
02h
02h
02h
02h
Peripheral
Descriptor Length
01A2Fh
1
5Dh
5Dh
5Dh
5Bh
5Bh
5Bh
Peripheral
Descriptors
01A30h
PD
Length
...
...
...
...
...
...
Table 61. Device Descriptor Table CC430F512x
Info Block
Die Record
Empty
Descriptor
REF
Calibration
Peripheral
Descriptor
(PD)
106
Description
Address
Size
bytes
F5125
F5123
Value
Value
06h
Info length
01A00h
1
06h
CRC length
01A01h
1
06h
06h
CRC value
01A02h
2
per unit
per unit
Device ID
01A04h
1
03Bh
03Ch
Device ID
01A05h
1
081h
081h
Hardware revision
01A06h
1
per unit
per unit
Firmware revision
01A07h
1
per unit
per unit
Die Record Tag
01A08h
1
08h
08h
Die Record length
01A09h
1
0Ah
0Ah
Lot/Wafer ID
01A0Ah
4
per unit
per unit
Die X position
01A0Eh
2
per unit
per unit
Die Y position
01A10h
2
per unit
per unit
Test results
01A12h
2
per unit
per unit
Empty Tag
01A14h
1
05h
05h
Empty Tag length
01A15h
1
10h
10h
01A16h
16
undefined
undefined
ADC Offset
01A18h
2
per unit
per unit
REF Calibration
Tag
01A26h
1
12h
12h
REF Calibration
length
01A27h
1
06h
06h
1.5V Reference
Factor
01A28h
2
per unit
per unit
2.0V Reference
Factor
01A2Ah
2
per unit
per unit
2.5V Reference
Factor
01A2Ch
2
per unit
per unit
Peripheral
Descriptor Tag
01A2Eh
1
02h
02h
Peripheral
Descriptor Length
01A2Fh
1
59h
59h
Peripheral
Descriptors
01A30h
PD
Length
...
...
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CC430F514x
CC430F512x
SLAS555 – JUNE 2012
REVISION HISTORY
REVISION
SLAS555
COMMENTS
Production Data release
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PACKAGE OPTION ADDENDUM
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11-Jul-2012
PACKAGING INFORMATION
Orderable Device
(1)
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
CC430F5123IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F5123IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F5125IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F5125IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F5143IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F5143IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F5145IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F5145IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F5147IRGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F5147IRGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F6143IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F6143IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F6145IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F6145IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F6147IRGCR
ACTIVE
VQFN
RGC
64
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
CC430F6147IRGCT
ACTIVE
VQFN
RGC
64
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
The marketing status values are defined as follows:
Addendum-Page 1
Samples
(Requires Login)
PACKAGE OPTION ADDENDUM
www.ti.com
11-Jul-2012
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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Addendum-Page 2
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