DS90CF583/DS90CF584 LVDS 24-Bit Color Flat Panel Display (FPD) Link— 65 MHz General Description Features The DS90CF583 transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. The DS90CF584 receiver converts the LVDS data streams back into 28 bits of CMOS/TTL data. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 4 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY, CONTROL) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughput is 227 Mbytes per second. These devices are offered with falling edge data strobes for convenient interface with a variety of graphics and LCD panel controllers. This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces. n n n n n n n n n n n n n 20 to 65 MHz shift clk support Up to 227 Mbytes/s bandwidth Cable size is reduced to save cost 290 mV swing LVDS devices for low EMI Low power CMOS design ( < 550 mW typ) Power-down mode saves power ( < 0.25 mW) PLL requires no external components Low profile 56-lead TSSOP package Falling edge data strobe Compatible with TIA/EIA-644 LVDS standard Single pixel per clock XGA (1024 x 768) Supports VGA, SVGA, XGA and higher 1.8 Gbps throughput Block Diagrams DS012616-24 Order Number DS90CF583MTD See NS Package Number MTD56 DS012616-1 Order Number DS90CF584MTD See NS Package Number MTD56 TRI-STATE ® is a registered trademark of National Semiconductor Corporation. © 1998 National Semiconductor Corporation DS012616 www.national.com DS90CF583/DS90CF584 LVDS 24-Bit Color Flat Panel Display (FPD) Link— 65 MHz November 1996 Block Diagrams (Continued) DS012616-2 www.national.com 2 Absolute Maximum Ratings (Note 1) DS90CF584 If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VCC) CMOS/TTL Input Voltage CMOS/TTL Output Voltage LVDS Receiver Input Voltage LVDS Driver Output Voltage LVDS Output Short Circuit Duration Junction Temperature Storage Temperature Lead Temperature (Soldering, 4 sec) Maximum Power Dissipation @ 25˚C MTD56 (TSSOP) Package: DS90CF583 −0.3V to +6V (VCC + 0.3V) (VCC + 0.3V) (VCC + 0.3V) (VCC + 0.3V) Continuous +150˚C −65˚C to +150˚C +260˚C −0.3V −0.3V −0.3V −0.3V 1.61W Package Derating: DS90CF583 12.5 mW/˚C above +25˚C DS90CF584 12.4 mW/˚C above +25˚C This device does not meet 2000V ESD rating (Note 4) . to to to to Recommended Operating Conditions Supply Voltage (VCC) Operating Free Air Temperature (TA) Receiver Input Range Supply Noise Voltage (VCC) Min 4.75 −10 Nom 5.0 +25 0 Max 5.25 +70 Units V ˚C 2.4 100 V mVP-P 1.63W Electrical Characteristics Over recommended operating supply and temperature ranges unless otherwise specified Symbol Parameter Conditions Min Typ Max Units V CMOS/TTL DC SPECIFICATIONS VIH High Level Input Voltage 2.0 VCC VIL Low Level Input Voltage GND 0.8 VOH High Level Output Voltage VOL Low Level Output Voltage VCL Input Clamp Voltage IIN Input Current IOS Output Short Circuit Current IOH = −0.4 mA IOL = 2 mA 3.8 ICL = −18 mA VIN = VCC, GND, 2.5V or 0.4V VOUT = 0V 4.9 V V 0.1 0.3 V −0.79 −1.5 V ± 5.1 ± 10 µA −120 mA LVDS DRIVER DC SPECIFICATIONS VOD Differential Output Voltage ∆VOD Change in VOD between RL = 100Ω 250 290 450 mV 35 mV Complementary Output States VCM Common Mode Voltage ∆VCM Change in VCM between 1.1 1.25 1.375 35 V mV Complementary Output States VOH High Level Output Voltage VOL Low Level Output Voltage IOS Output Short Circuit Current IOZ Output TRI-STATE ® Current 1.3 0.9 VOUT = 0V, RL = 100Ω Power Down = 0V, VOUT = 0V or VCC 1.6 1.01 V V −2.9 −5 mA ±1 ± 10 µA +100 mV LVDS RECEIVER DC SPECIFICATIONS VTH Differential Input High Threshold VTL Differential Input Low Threshold IIN Input Current VCM = +1.2V −100 VIN = +2.4V VIN = 0V VCC = 5.5V f = 32.5 MHz f = 37.5 MHz f = 65 MHz f = 32.5 MHz mV ± 10 ± 10 µA µA TRANSMITTER SUPPLY CURRENT ICCTW ICCTG Transmitter Supply Current, RL = 100Ω, CL = 5 pF, Worst Case Worst Case Pattern Transmitter Supply Current, (Figure 1, Figure 3) RL = 100Ω, CL = 5 pF, 16 Grayscale 16 Grayscale Pattern (Figure 2, Figure 3) 3 f = 37.5 MHz f = 65 MHz 49 63 mA 51 64 mA 70 84 mA 40 55 mA 41 55 mA 55 67 mA www.national.com Electrical Characteristics (Continued) Over recommended operating supply and temperature ranges unless otherwise specified Symbol Parameter Conditions Min Typ Max Units 1 25 µA TRANSMITTER SUPPLY CURRENT ICCTZ Power Down = Low Transmitter Supply Current, Power Down RECEIVER SUPPLY CURRENT ICCRW ICCRG ICCRZ Receiver Supply Current, CL = 8 pF, Worst Case Worst Case Pattern f = 32.5 MHz f = 37.5 MHz f = 65 MHz f = 32.5 MHz Receiver Supply Current, (Figure 1, Figure 4) CL = 8 pF, 16 Grayscale 16 Grayscale Pattern Receiver Supply Current, (Figure 2, Figure 4) Power Down = Low f = 37.5 MHz f = 65 MHz 64 77 mA 70 85 mA 110 140 mA 35 55 mA 37 55 mA 55 67 mA 1 10 µA Power Down Note 1: “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to imply that the device should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation. Note 2: Typical values are given for VCC = 5.0V and TA = +25˚C. Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground unless otherwise specified (except VOD and ∆VOD). Note 4: ESD Rating: HBM (1.5 kΩ, 100 pF) PLL VCC ≥ 1000V All other pins ≥ 2000V EIAJ (0Ω, 200 pF) ≥ 150V Transmitter Switching Characteristics Over recommended operating supply and temperature ranges unless otherwise specified Symbol Typ Max Units LLHT LVDS Low-to-High Transition Time (Figure 3) 0.75 1.5 ns LHLT LVDS High-to-Low Transition Time (Figure 3) 0.75 1.5 ns TCIT TxCLK IN Transition Time (Figure 5) TCCS TxOUT Channel-to-Channel Skew (Note 5) (Figure 6) TxCLK IN to TxCLK OUT Delay @ 25˚C, VCC = 5.0V TCCD Parameter Min 3.5 8 ns 350 ps 8.5 ns (Figure 9) TCIP TxCLK IN Period (Figure 7) TCIH TxCLK IN High Time (Figure 7) TCIL TxCLK IN Low Time (Figure 7) TSTC TxIN Setup to TxCLK IN (Figure 7 ) THTC TxIN Hold to TxCLK IN (Figure 7) f = 65 MHz 15 T 50 ns 0.35T 0.5T 0.65T ns 0.35T 0.5T 0.65T ns 5 3.5 ns 2.5 1.5 ns TPDD Transmitter Powerdown Delay (Figure 18) 100 ns TPLLS Transmitter Phase Lock Loop Set (Figure 11) 10 ms TPPos0 Transmitter Output Pulse Position 0 (Figure 13) −0.30 0 0.30 ns TPPos1 Transmitter Output Pulse Position 1 1.70 1/7 Tclk 2.50 ns TPPos2 Transmitter Output Pulse Position 2 3.60 2/7 Tclk 4.50 ns TPPos3 Transmitter Output Pulse Position 3 5.90 3/7 Tclk 6.75 ns TPPos4 Transmitter Output Pulse Position 4 8.30 4/7 Tclk 9.00 ns TPPos5 Transmitter Output Pulse Position 5 10.40 5/7 Tclk 11.10 ns TPPos6 Transmitter Output Pulse Position 6 12.70 6/7 Tclk 13.40 ns Note 5: This limit based on bench characterization. www.national.com 4 Receiver Switching Characteristics Over recommended operating supply and temperature ranges unless otherwise specified. Symbol Typ Max Units CLHT CMOS/TTL Low-to-High Transition Time (Figure 4) Parameter Min 2.5 4.0 ns CHLT CMOS/TTL High-to-Low Transition Time (Figure 4) 2.0 3.5 ns RCOP RxCLK OUT Period 15 T 50 ns RCOH RxCLK OUT High Time 9 ns RxCLK OUT Low Time 3.8 5 ns RSRC RxOUT Setup to RxCLK OUT f = 65 MHz f = 65 MHz f = 65 MHz 7.8 RCOL 2.5 4.2 ns RHRC RxOUT Hold to RxCLK OUT f = 65 MHz 4.0 5.2 RCCD RxCLK IN to RxCLK OUT Delay @ 25˚C, VCC = 5.0V 6.4 ns 10.7 ns 10 ms (Figure 10) RPLLS Receiver Phase Lock Loop Set (Figure 12) RSKM RxIN Skew Margin (Note 6) (Figure 14) RPDD Receiver Powerdown (Figure 17) VCC = 5V, TA = 25˚C 600 ps 1 µs Note 6: Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account transmitter output skew (TCCS) and the setup and hold time (internal data sampling window), allowing for LVDS cable skew dependent on type/length and source clock (TxCLK IN) jitter. RSKM ≥ cable skew (type, length) + source clock jitter (cycle to cycle) AC Timing Diagrams DS012616-3 FIGURE 1. “Worst Case” Test Pattern 5 www.national.com AC Timing Diagrams (Continued) DS012616-4 FIGURE 2. “16 Grayscale” Test Pattern Note 7: The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O. Note 8: The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern approximates signal switching needed to produce groups of 16 vertical stripes across the display. Note 9: Figure 1 and Figure 2 show a falling edge data strobe (TxCLK IN/RxCLK OUT). Note 10: Recommended pin to signal mapping. Customer may choose to define differently. DS012616-5 FIGURE 3. DS90CF583 (Transmitter) LVDS Output Load and Transition Times DS012616-6 FIGURE 4. DS90CF584 (Receiver) CMOS/TTL Output Load and Transition Times www.national.com 6 AC Timing Diagrams (Continued) DS012616-7 FIGURE 5. DS90CF583 (Transmitter) Input Clock Transition Time DS012616-8 Note:Measurements at Vdiff = 0V Note: TCSS measured between earliest and latest LVDS edges. Note: TxCLK Differential High→Low Edge FIGURE 6. DS90CF583 (Transmitter) Channel-to-Channel Skew and Pulse Width DS012616-9 FIGURE 7. DS90CF583 (Transmitter) Setup/Hold and High/Low Times DS012616-10 FIGURE 8. DS90CF584 (Receiver) Clock In to Clock Out Delay 7 www.national.com AC Timing Diagrams (Continued) DS012616-11 FIGURE 9. DS90CF583 (Transmitter) Clock In to Clock Out Delay DS012616-23 FIGURE 10. DS90CF584 (Receiver) Clock In to Clock Out Delay DS012616-13 FIGURE 11. DS90CF583 (Transmitter) Phase Lock Loop Set Time DS012616-14 FIGURE 12. DS90CF584 (Receiver) Phase Lock Loop Set Time www.national.com 8 AC Timing Diagrams (Continued) DS012616-19 FIGURE 13. Receiver LVDS Input Pulse Position Measurement DS012616-20 SW — Setup and Hold Time (Internal Data Sampling Window) TCCS — Transmitter Output Skew RSKM ≥ Cable Skew (type, length) + Source Clock Jitter (cycle to cycle) Cable Skew — typically 10 ps–40 ps per foot FIGURE 14. Receiver LVDS Input Skew Margin DS012616-17 FIGURE 15. Seven Bits of LVDS in One Clock Cycle 9 www.national.com AC Timing Diagrams (Continued) DS012616-18 FIGURE 16. Parallel TTL Data Inputs Mapped to LVDS Outputs (DS90CF583) DS012616-21 FIGURE 17. Receiver Powerdown Delay DS012616-22 FIGURE 18. Transmitter Powerdown Delay DS90CF583 Pin Descriptions — FPD Link Transmitter I/O No. TxIN Pin Name I 28 TxOUT+ O 4 Positive LVDS differential data output TxOUT− O 4 Negative LVDS differential data output FPSHIFT IN I 1 TTL level clock input. The falling edge acts as data strobe TxCLK OUT+ O 1 Positive LVDS differential clock output TxCLK OUT− O 1 Negative LVDS differential clock output PWR DOWN I 1 TTL level input. Assertion (low input) TRI-STATES the outputs, ensuring low current at power down VCC I 4 Power supply pins for TTL inputs www.national.com Description TTL level input. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines — FPLINE, FPFRAME, DRDY and CNTL (also referred to as HSYNC, VSYNC, Data Enable, CNTL) 10 DS90CF583 Pin Descriptions — FPD Link Transmitter I/O No. GND Pin Name I 5 Ground pins for TTL inputs Power supply pin for PLL (Continued) Description PLL VCC I 1 PLL GND I 2 Ground pins for PLL LVDS VCC I 1 Power supply pin for LVDS outputs LVDS GND I 3 Ground pins for LVDS outputs DS90CF584 Pin Descriptions — FPD Link Receiver Pin Name RxIN+ I/O No. I 4 Positive LVDS differential data inputs Description Negative LVDS differential data inputs RxIN− I 4 RxOUT O 28 RxCLK IN+ I 1 RxCLK IN− I 1 Negative LVDS differential clock input FPSHIFT OUT O 1 TTL level clock output. The falling edge acts as data strobe TTL level data outputs. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines — FPLINE, FPFRAME, DRDY and CNTL (also referred to as HSYNC, VSYNC, Data Enable, CNTL) Positive LVDS differential clock input PWR DOWN I 1 TTL level input. Assertion (low input) maintains the receiver outputs in the previous state VCC I 4 Power supply pins for TTL outputs GND I 5 Ground pins for TTL outputs PLL VCC I 1 Power supply for PLL PLL GND I 2 Ground pin for PLL LVDS VCC I 1 Power supply pin for LVDS inputs LVDS GND I 3 Ground pins for LVDS inputs Connection Diagrams DS012616-16 DS012616-15 11 www.national.com DS90CF583/DS90CF584 LVDS 24-Bit Color Flat Panel Display (FPD) Link— 65 MHz Physical Dimensions inches (millimeters) unless otherwise noted 56-Lead Molded Thin Shrink Small Outline Package, JEDEC Order Number DS90CF583MTD or DS90CF584MTD NS Package Number MTD56 LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support 1. Life support devices or systems are devices or sysdevice or system whose failure to perform can be reatems which, (a) are intended for surgical implant into sonably expected to cause the failure of the life support the body, or (b) support or sustain life, and whose faildevice or system, or to affect its safety or effectiveness. ure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 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