1. Features • Low-voltage and Standard-voltage Operation – 1.8 (VCC = 1.8V to 5.5V) Internally Organized 2048 x 8 (16K) Two-wire Serial Interface Schmitt Trigger, Filtered Inputs for Noise Suppression Bidirectional Data Transfer Protocol 1 MHz (5V, 2.5V), 400 kHz (1.8V) Compatibility Write Protect Pin for Hardware Data Protection 16-byte Page (16K) Write Modes Partial Page Writes Allowed Self-timed Write Cycle (5 ms max) High-reliability – Endurance: 1 Million Write Cycles – Data Retention: 100 Years • 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra-Thin Mini-MAP (MLP 2x3), 5-lead SOT23, 8-lead Ultra Lead Frame Land Grid Array (ULA), 8-lead TSSOP and 8-ball dBGA2 Packages • Lead-free/Halogen-free • Die Sales: Wafer Form, Tape and Reel, and Bumped Wafers • • • • • • • • • • Two-wire Serial EEPROM 16K (2048 x 8) AT24C16B 2. Description The AT24C16B provides 16384 bits of serial electrically erasable and programmable read-only memory (EEPROM) organized as 2048 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT24C16B is available in space-saving 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Thin Mini-MAP (MLP 2x3), 5-lead SOT23, 8-lead Ultra Lead Frame Land Grid Array (ULA), 8-lead TSSOP, and 8-ball dBGA2 packages and is accessed via a Two-wire serial interface. In addition, the AT24C16B is available in 1.8V (1.8V to 5.5V) version. Table 2-1. Pin Configuration Pin Name Function NC No Connect SDA Serial Data SCL Serial Clock Input WP Write Protect GND Ground VCC Power Supply 8-lead Ultra Lead Frame Land Grid Array (ULA) VCC WP SCL SDA 8 7 6 5 1 2 3 4 NC NC NC GND Bottom View 8-lead Ultra Thin Mini-MAP (MLP 2x3) VCC WP SCL SDA 8 7 6 5 1 2 3 4 NC NC NC GND 8-ball dBGA2 VCC WP SCL SDA Bottom View 1 2 3 4 8 7 6 5 VCC WP SCL SDA 5-lead SOT23 SCL 1 GND 2 SDA 3 1 7 2 6 5 Bottom View 8-lead TSSOP NC NC NC GND NC NC 3 NC 4 GND 8 5 WP 4 VCC 8-lead SOIC NC NC NC GND 1 2 3 4 8 7 6 5 VCC WP SCL SDA 8-lead PDIP NC NC NC GND 1 2 3 4 8 7 6 5 VCC WP SCL SDA 5175E–SEEPR–3/09 Absolute Maximum Ratings Operating Temperature..................................–55°C to +125°C *NOTICE: Storage Temperature .....................................–65°C to +150°C Voltage on Any Pin with Respect to Ground .................................... –1.0V to +7.0V Maximum Operating Voltage .......................................... 6.25V DC Output Current........................................................ 5.0 mA Figure 2-1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Block Diagram VCC GND WP START STOP LOGIC SERIAL CONTROL LOGIC LOAD DEVICE ADDRESS COMPARATOR R/W EN H.V. PUMP/TIMING COMP LOAD DATA RECOVERY INC DATA WORD ADDR/COUNTER Y DEC X DEC SCL SDA EEPROM SERIAL MUX DOUT/ACK LOGIC DIN DOUT 2 AT24C16B 5175E–SEEPR–3/09 AT24C16B 3. Pin Description SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device. SERIAL DATA (SDA): The SDA pin is bidirectional for serial data transfer. This pin is opendrain driven and may be wire-ORed with any number of other open-drain or open-collector devices. DEVICE/PAGE ADDRESSES: The AT24C16B does not use the device address pins, which limits the number of devices on a single bus to one. WRITE PROTECT (WP): The AT24C16B has a write protect pin that provides hardware data protection. The write protect pin allows normal read/write operations when connected to ground (GND). When the write protect pin is connected to VCC, the write protection feature is enabled and operates as shown in Table 3-1. Table 3-1. Write Protect Part of the Array Protected WP Pin Status 24C16B At VCC Full (16K) Array At GND Normal Read/Write Operations 4. Memory Organization AT24C16B, 16K SERIAL EEPROM: Internally organized with 128 pages of 16 bytes each, the 16K requires an 11-bit data word address for random word addressing. 3 5175E–SEEPR–3/09 Table 4-1. Pin Capacitance(1) Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +1.8V Symbol Test Condition CI/O CIN Note: Max Units Conditions Input/Output Capacitance (SDA) 8 pF VI/O = 0V Input Capacitance (SCL) 6 pF VIN = 0V 1. This parameter is characterized and is not 100% tested. Table 4-2. DC Characteristics Applicable over recommended operating range from: TAI = −40°C to +85°C, VCC = +1.8V to +5.5V (unless otherwise noted) Symbol Parameter VCC1 Supply Voltage ICC1 Supply Current VCC = 5.0V READ at 400 kHz ICC2 Supply Current VCC = 5.0V WRITE at 400 kHz ISB1 Standby Current (1.8V option) VCC = 1.8V ILI Input Leakage Current VCC = 5.0V VIN = VCC or VSS 0.10 3.0 µA ILO Output Leakage Current VCC = 5.0V VOUT = VCC or VSS 0.05 3.0 µA VIL Input Low Level(1) −0.6 VCC x 0.3 V VIH (1) Input High Level VCC x 0.7 VCC + 0.5 V VOL1 Output Low Level VCC = 1.8V IOL = 0.15 mA 0.2 V Output Low Level VCC = 3.0V IOL = 2.1 mA 0.4 V VOL2 Notes: 4 Test Condition Min Typ Max Units 5.5 V 1.0 2.0 mA 2.0 3.0 mA 1.0 µA 1.8 VCC = 5.5V VIN = VCC or VSS 6.0 1. VIL min and VIH max are reference only and are not tested. AT24C16B 5175E–SEEPR–3/09 AT24C16B Table 4-3. AC Characteristics (Industrial Temperature) Applicable over recommended operating range from TAI = −40°C to +85°C, VCC = +1.8V to +5.5V, CL = 100 pF (unless otherwise noted). Test conditions are listed in Note 2. 1.8-volt Min 2.5, 5.0-volt Symbol Parameter fSCL Clock Frequency, SCL tLOW Clock Pulse Width Low 1.3 0.4 µs tHIGH Clock Pulse Width High 0.6 0.4 µs tAA Clock Low to Data Out Valid 0.05 tBUF Time the bus must be free before a new transmission can start(1) 1.3 0.5 µs tHD.STA Start Hold Time 0.6 0.25 µs tSU.STA Start Set-up Time 0.6 0.25 µs tHD.DAT Data In Hold Time 0 0 µs tSU.DAT Data In Set-up Time Min 100 100 ns 400 (1) tR Max Inputs Rise Time (1) 0.9 0.05 Max Units 1000 kHz 0.55 µs 0.3 0.3 µs 300 100 ns tF Inputs Fall Time tSU.STO Stop Set-up Time 0.6 0.25 µs tDH Data Out Hold Time 50 50 ns tWR Write Cycle Time Endurance(1) 25°C, Page Mode, 3.3V Notes: 5 5 1,000,000 ms Write Cycles 1. This parameter is characterized and is not 100% tested. 2. AC measurement conditions: RL (connects to VCC): 1.3 kΩ (2.5V, 5.0V), 10 kΩ (1.8V) Input pulse voltages: 0.3 VCC to 0.7 VCC Input rise and fall times: ≤ 50 ns Input and output timing reference voltages: 0.5 VCC 5 5175E–SEEPR–3/09 5. Device Operation CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on the SDA pin may change only during SCL low time periods (see Figure 7-2 on page 8). Data changes during SCL high periods will indicate a start or stop condition as defined below. START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must precede any other command (see Figure 7-3 on page 8). STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a read sequence, the stop command will place the EEPROM in a standby power mode (see Figure 7-3 on page 8). ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words. The EEPROM sends a zero to acknowledge that it has received each word. This happens during the ninth clock cycle. STANDBY MODE: The AT24C16B features a low-power standby mode which is enabled: (a) upon power-up and (b) after the receipt of the STOP bit and the completion of any internal operations. 2-WIRE SOFTWARE RESET: After an interruption in protocol, power loss or system reset, any 2-wire part can be protocol reset by following these steps: 1. Create a start bit condition. 2. Clock 9 cycles. 3. Create another start bit followed by stop bit condition as shown below. Dummy Clock Cycles Start bit SCL 1 2 3 Start bit 8 Stop bit 9 SDA 6 AT24C16B 5175E–SEEPR–3/09 AT24C16B 6. Bus Timing SCL: Serial Clock, SDA: Serial Data I/O® Figure 6-1. tHIGH tF tR tLOW SCL tSU.STA tLOW tHD.STA tHD.DAT tSU.DAT tSU.STO SDA IN tAA tDH tBUF SDA OUT 7. Write Cycle Timing Figure 7-1. SCL: Serial Clock, SDA: Serial Data I/O SCL SDA 8th BIT ACK WORDn (1) twr STOP CONDITION Note: START CONDITION 1. The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal clear/write cycle. 7 5175E–SEEPR–3/09 Figure 7-2. Data Validity SDA SCL DATA STABLE DATA STABLE DATA CHANGE Figure 7-3. Start and Stop Definition SDA SCL START Figure 7-4. STOP Output Acknowledge 1 SCL 8 9 DATA IN DATA OUT START 8 ACKNOWLEDGE AT24C16B 5175E–SEEPR–3/09 AT24C16B 8. Device Addressing The 16K EEPROM device requires an 8-bit device address word following a start condition to enable the chip for a read or write operation (refer to Figure 10-1). The device address word consists of a mandatory one, zero sequence for the first four most significant bits as shown. This is common to all the EEPROM devices. The next 3 bits used for memory page addressing and are the most significant bits of the data word address which follows. The eighth bit of the device address is the read/write operation select bit. A read operation is initiated if this bit is high and a write operation is initiated if this bit is low. Upon a compare of the device address, the EEPROM will output a zero. If a compare is not made, the chip will return to a standby state. 9. Write Operations BYTE WRITE: A write operation requires an 8-bit data word address following the device address word and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a zero and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM will output a zero and the addressing device, such as a microcontroller, must terminate the write sequence with a stop condition. At this time the EEPROM enters an internally timed write cycle, tWR, to the nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will not respond until the write is complete (see Figure 10-2 on page 11). PAGE WRITE: The 16K EEPROM is capable of an 16-byte page write. A page write is initiated the same as a byte write, but the microcontroller does not send a stop condition after the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the microcontroller can transmit up to fifteen data words. The EEPROM will respond with a zero after each data word received. The microcontroller must terminate the page write sequence with a stop condition (see Figure 10-3 on page 11). The data word address lower three bits are internally incremented following the receipt of each data word. The higher data word address bits are not incremented, retaining the memory page row location. When the word address, internally generated, reaches the page boundary, the following byte is placed at the beginning of the same page. If more than sixteen data words are transmitted to the EEPROM, the data word address will “roll over” and previous data will be overwritten. ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the EEPROM inputs are disabled, acknowledge polling can be initiated. This involves sending a start condition followed by the device address word. The read/write bit is representative of the operation desired. Only if the internal write cycle has completed will the EEPROM respond with a zero allowing the read or write sequence to continue. 9 5175E–SEEPR–3/09 10. Read Operations Read operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one. There are three read operations: current address read, random address read and sequential read. CURRENT ADDRESS READ: The internal data word address counter maintains the last address accessed during the last read or write operation, incremented by one. This address stays valid between operations as long as the chip power is maintained. The address “roll over” during read is from the last byte of the last memory page to the first byte of the first page. The address “roll over” during write is from the last byte of the current page to the first byte of the same page. Once the device address with the read/write select bit set to one is clocked in and acknowledged by the EEPROM, the current address data word is serially clocked out. The microcontroller does not respond with an input zero but does generate a following stop condition (see Figure 10-4 on page 11). RANDOM READ: A random read requires a “dummy” byte write sequence to load in the data word address. Once the device address word and data word address are clocked in and acknowledged by the EEPROM, the microcontroller must generate another start condition. The microcontroller now initiates a current address read by sending a device address with the read/write select bit high. The EEPROM acknowledges the device address and serially clocks out the data word. The microcontroller does not respond with a zero but does generate a following stop condition (see Figure 10-5 on page 12). SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random address read. After the microcontroller receives a data word, it responds with an acknowledge. As long as the EEPROM receives an acknowledge, it will continue to increment the data word address and serially clock out sequential data words. When the memory address limit is reached, the data word address will “roll over” and the sequential read will continue. The sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see Figure 10-6 on page 12). Figure 10-1. Device Address P2 16 P1 P0 MSB 10 AT24C16B 5175E–SEEPR–3/09 AT24C16B Figure 10-2. Byte Write Figure 10-3. Page Write Figure 10-4. Current Address Read 11 5175E–SEEPR–3/09 Figure 10-5. Random Read Figure 10-6. Sequential Read 12 AT24C16B 5175E–SEEPR–3/09 AT24C16B AT24C16B Ordering Information Ordering Codes Voltage Package AT24C16B-PU (Bulk Form Only) 1.8 8P3 AT24C16BN-SH-B(1) (NiPdAu Lead Finish) 1.8 8S1 1.8 8S1 AT24C16BN-SH-T (NiPdAu Lead Finish) (1) (NiPdAu Lead Finish) 1.8 8A2 (2) (NiPdAu Lead Finish) 1.8 8A2 1.8 8Y6 1.8 8D3 1.8 5TS1 1.8 8U3-1 1.8 Die Sales AT24C16B-TH-B AT24C16B-TH-T (2) AT24C16BY6-YH-T(2) (NiPdAu Lead Finish) AT24C16BD3-DH-T AT24C16BTSU-T (2) (NiPdAu Lead Finish) (2) AT24C16BU3-UU-T (2) AT24C16B-W-11(3) Notes: Operating Range Lead-Free/Halogen-Free Industrial Temperature (-40°C to 85°C) Industrial Temperature (-40°C to 85°C) 1. “-B” denotes bulk. 2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini MAP, SOT23, dBGA2 = 5K per reel. 3. Available in tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please contact Serial Interface Marketing. Package Type 8P3 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) 8Y6 8-lead, 2.0 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm) 5TS1 5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23) 8U3-1 8-ball, die Ball Grid Array Package (dBGA2) 8D3 8-lead, 1.80 mm x 2.20 mm Body, Ultra Lead Frame Land Grid Array (ULA) Options –1.8 Low-voltage (1.8V to 5.5V) 13 5175E–SEEPR–3/09 11. Part Marking 11.1 8-PDIP Seal Year | Seal Week | | | |---|---|---|---|---|---|---|---| A T M L U Y W W |---|---|---|---|---|---|---|---| 1 6 B 1 |---|---|---|---|---|---|---|---| * Lot Number |---|---|---|---|---|---|---|---| | Pin 1 Indicator (Dot) TOP MARK Y = 6: 7: 8: 9: SEAL YEAR 2006 0: 2010 2007 1: 2011 2008 2: 2012 2009 3: 2013 WW = SEAL WEEK 02 = Week 2 04 = Week 4 :: : :::: : :: : :::: :: 50 = Week 50 52 = Week 52 Lot Number to Use ALL Characters in Marking BOTTOM MARK No Bottom Mark 14 AT24C16B 5175E–SEEPR–3/09 AT24C16B 11.2 8-SOIC Seal Year | Seal Week | | | |---|---|---|---|---|---|---|---| A T M L H Y W W |---|---|---|---|---|---|---|---| 1 6 B 1 |---|---|---|---|---|---|---|---| * Lot Number |---|---|---|---|---|---|---|---| | Pin 1 Indicator (Dot) TOP MARK Y = 6: 7: 8: 9: SEAL YEAR 2006 0: 2010 2007 1: 2011 2008 2: 2012 2009 3: 2013 WW = SEAL WEEK 02 = Week 2 04 = Week 4 :: : :::: : :: : :::: :: 50 = Week 50 52 = Week 52 Lot Number to Use ALL Characters in Marking BOTTOM MARK No Bottom Mark 15 5175E–SEEPR–3/09 11.3 8-TSSOP TOP MARK Pin 1 Indicator (Dot) | |---|---|---|---| * H Y W W |---|---|---|---|---| 1 6 B 1 |---|---|---|---|---| BOTTOM MARK |---|---|---|---|---|---|---| P H |---|---|---|---|---|---|---| A A A A A A A |---|---|---|---|---|---|---| <- Pin 1 Indicator Y = 6: 7: 8: 9: 16 SEAL YEAR 2006 0: 2010 2007 1: 2011 2008 2: 2012 2009 3: 2013 WW = SEAL WEEK 02 = Week 2 04 = Week 4 :: : :::: : :: : :::: :: 50 = Week 50 52 = Week 52 AT24C16B 5175E–SEEPR–3/09 AT24C16B 11.4 8-Ultra Thin Mini-Map TOP MARK |---|---|---| 1 6 B |---|---|---| H 1 |---|---|---| Y X X |---|---|---| * | Pin 1 Indicator (Dot) Y = YEAR OF ASSEMBLY XX = ATMEL LOT NUMBER TO COORESPOND WITH NSEB TRACE CODE LOG BOOK. (e.g. XX = AA, AB, AC,...AX, AY, AZ) Y = 6: 7: 8: 9: 11.5 SEAL YEAR 2006 0: 2010 2007 1: 2011 2008 2: 2012 2009 3: 2013 8-ULA TOP MARK |---|---|---| 1 6 B |---|---|---| Y X X |---|---|---| * | Pin 1 Indicator (Dot) Y = BUILD YEAR 2006 = 6 2008 = 8 2007 = 7 Etc. . . XX = ATMEL LOT NUMBER TO COORESPOND WITH NSEB TRACE CODE LOG BOOK. (e.g. XX = AA, AB, AC,...AX, AY, AZ) 17 5175E–SEEPR–3/09 11.6 dBGA2 TOP MARK LINE 1-------> 16BU LINE 2-------> PYMTC |<-- Pin 1 This Corner P = COUNTRY OF ORIGIN Y = ONE DIGIT YEAR CODE 4: 2004 7: 2007 5: 2005 8: 2008 6: 2006 9: 2009 M = SEAL MONTH (USE ALPHA DESIGNATOR A-L) A = JANUARY B = FEBRUARY " " """"""" J = OCTOBER K = NOVEMBER L = DECEMBER TC = TRACE CODE (ATMEL LOT NUMBERS TO CORRESPOND WITH ATK TRACE CODE LOG BOOK) 11.7 SOT23 TOP MARK |---|---|---|---|---| Line 1 -----------> 1 6 B 1 U |---|---|---|---|---| * | XXX = Device V = Voltage Indicator U = Material Set Pin 1 Indicator (Dot) BOTTOM MARK |---|---|---|---| Y M T C |---|---|---|---| Y = One Digit Year Code M = Seal Month (Use Alpha Designator A-L) TC = Trace Code 18 AT24C16B 5175E–SEEPR–3/09 AT24C16B 12. Packaging Information 12.1 8P3 – PDIP E 1 E1 N Top View c eA End View COMMON DIMENSIONS (Unit of Measure = inches) D e D1 A2 A b2 b3 b 4 PLCS Side View L SYMBOL NOM MAX NOTE 2 A – – 0.210 A2 0.115 0.130 0.195 b 0.014 0.018 0.022 5 b2 0.045 0.060 0.070 6 b3 0.030 0.039 0.045 6 c 0.008 0.010 0.014 D 0.355 0.365 0.400 3 D1 0.005 – – 3 E 0.300 0.310 0.325 4 E1 0.240 0.250 0.280 3 e 0.100 BSC eA 0.300 BSC L Notes: MIN 0.115 0.130 4 0.150 2 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA, for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 01/09/02 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 8P3, 8-lead, 0.300" Wide Body, Plastic Dual In-line Package (PDIP) DRAWING NO. REV. 8P3 B 19 5175E–SEEPR–3/09 12.2 8S1 – JEDEC SOIC C 1 E E1 L N ∅ Top View End View e B COMMON DIMENSIONS (Unit of Measure = mm) A SYMBOL A1 D Side View MIN NOM MAX A 1.35 – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.00 E1 3.81 – 3.99 E 5.79 – 6.20 e NOTE 1.27 BSC L 0.40 – 1.27 ∅ 0˚ – 8˚ Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 10/7/03 R 20 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) DRAWING NO. 8S1 REV. B AT24C16B 5175E–SEEPR–3/09 AT24C16B 12.3 8A2 – TSSOP 3 2 1 Pin 1 indicator this corner E1 E L1 N L Top View End View COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A b D MIN NOM MAX NOTE 2.90 3.00 3.10 2, 5 3, 5 E e D A2 6.40 BSC E1 4.30 4.40 4.50 A – – 1.20 A2 0.80 1.00 1.05 b 0.19 – 0.30 e Side View L 4 0.65 BSC 0.45 L1 0.60 0.75 1.00 REF Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. 5. Dimension D and E1 to be determined at Datum Plane H. 5/30/02 R 2325 Orchard Parkway San Jose, CA 95131 TITLE 8A2, 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) DRAWING NO. 8A2 REV. B 21 5175E–SEEPR–3/09 12.4 8Y6 - Mini Map D2 A b (8X) E E2 Pin 1 Index Area Pin 1 ID L (8X) D A2 e (6X) A1 1.50 REF. COMMON DIMENSIONS (Unit of Measure = mm) A3 SYMBOL MIN 2.00 BSC E 3.00 BSC D2 1.40 1.50 1.60 - - 1.40 - - 0.60 A1 0.0 0.02 0.05 A2 - - 0.55 A3 L b 22 NOTE 0.20 REF 0.20 e R MAX E2 A Notes: NOM D 0.30 0.40 0.50 BSC 0.20 0.25 0.30 2 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions, tolerances, datums, etc. 2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the device through this pad, so if soldered it should be tied to ground 2325 Orchard Parkway San Jose, CA 95131 TITLE 8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map, Dual No Lead Package (DFN) ,(MLP 2x3) DRAWING NO. 8Y6 10/16/07 REV. D AT24C16B 5175E–SEEPR–3/09 AT24C16B 12.5 5TS1 – SOT23 e1 C 4 5 E1 C L E L1 1 3 2 End View Top View b A2 Seating Plane e A A1 D COMMON DIMENSIONS (Unit of Measure = mm) Side View NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-193, Variation AB, for additional information. 2. Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 mm per side. 3. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body. 4. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip. 5. Dimension "b" does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the "b" dimension at maximum material condition. The Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm. SYMBOL A MIN NOM MAX – – 1.10 A1 0.00 – 0.10 A2 0.70 0.90 1.00 c 0.08 – 0.20 D 2.90 BSC NOTE 4 2, 3 E 2.80 BSC 2, 3 E1 1.60 BSC 2, 3 L1 0.60 REF e 0.95 BSC e1 b 1.90 BSC 0.30 – 0.50 4, 5 6/25/03 R 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TITLE 5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SHRINK SOT) DRAWING NO. PO5TS1 REV. A 23 5175E–SEEPR–3/09 12.6 8U3-1 – dBGA2 E D 1. b A1 PIN 1 BALL PAD CORNER A2 Top View A Side View PIN 1 BALL PAD CORNER 1 2 3 4 8 7 6 5 (d1) d e COMMON DIMENSIONS (Unit of Measure = mm) (e1) Bottom View 8 SOLDER BALLS 1. Dimension “b” is measured at the maximum solder ball diameter. This drawing is for general information only. SYMBOL MIN NOM A 0.71 0.81 0.91 A1 0.10 0.15 0.20 A2 0.40 0.45 0.50 b 0.20 0.25 0.30 D MAX NOTE 1.50 BSC E 2.00 BSC e 0.50 BSC e1 0.25 REF d 1.00 BSC d1 0.25 REF 6/24/03 R 24 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TITLE 8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch, Small Die Ball Grid Array Package (dBGA2) DRAWING NO. REV. PO8U3-1 A AT24C16B 5175E–SEEPR–3/09 AT24C16B 12.7 8D3 - ULA D 8 7 e1 6 b 5 L E PIN #1 ID 0.10 PIN #1 ID 0.15 1 2 3 4 A1 A TOP VIEW b e BOTTOM VIEW SIDE VIEW COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX A – – 0.40 A1 0.00 – 0.05 D 1.70 1.80 1.90 E 2.10 2.20 2.30 b 0.15 0.20 0.25 e 0.40 TYP e1 L NOTE 1.20 REF 0.25 0.30 0.35 11/15/05 R 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TITLE 8D3, 8-lead (1.80 x 2.20 mm Body) Ultra Leadframe Land Grid Array (ULLGA) D3 DRAWING NO. REV. 8D3 0 25 5175E–SEEPR–3/09 13. Revision History 26 Lit No. Date Comment 5175E 3/2009 Changed the Vcc to 5.5V in the test condition for Isb1 5175D 6/2008 Deleted A0, A1, A2 pin-outs 5175C 11/2007 AT24C16B product with date code 742 or later supports 5Vcc operation Added ULA package information 5175B 4/2007 Removed reference to Waffle Pack Corrected Note 3 on Page 13 Added lines to Ordering Code table 5175A 3/2007 Initial document release AT24C16B 5175E–SEEPR–3/09 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Technical Support [email protected] Sales Contact www.atmel.com/contacts Product Contact Web Site www.atmel.com Literature Requests www.atmel.com/literature Disclaimer: The information in this document is provided in connection with Atmel products. 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