MBRA130LT3 Surface Mount Schottky Power Rectifier SMA Power Surface Mount Package This device employs the Schottky Barrier principle in a metal−to−silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. Features • • • • • Compact Package with J−Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Over−Voltage Protection Low Forward Voltage Drop Pb−Free Package is Available http://onsemi.com SCHOTTKY BARRIER RECTIFIER 1.0 AMPERES, 30 VOLTS Mechanical Characteristics: • • • • • • • • • Case: Molded Epoxy Epoxy Meets UL 94 V−0 @ 0.125 in Weight: 70 mg (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Polarity: Cathode Lead Indicated by Either Notch in Plastic Body or Polarity Band Available in 12 mm Tape, 5000 Units per 13 inch Reel, Add “T3” Suffix to Part Number Device Meets MSL1 Requirements ESD Ratings: Machine Model, C (>400 V) Human Body Model, 3B (>8000 V) SMA CASE 403D PLASTIC MARKING DIAGRAM B1L3 ALYW B1L3 A L Y W MAXIMUM RATINGS Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating VRRM VRWM VR 30 V Average Rectified Forward Current (At Rated VR, TC = 105°C) IO 1.0 A Peak Repetitive Forward Current (At Rated VR, Square Wave, 100 kHz, TC = 105°C) IFRM 2.0 A Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 25 Storage Temperature Tstg −55 to +150 °C Operating Junction Temperature TJ −55 to +125 °C = Device Code = Assembly Location = Wafer Lot = Year = Work Week ORDERING INFORMATION Device MBRA130LT3 MBRA130LT3G Package Shipping† SMA 5000/Tape & Reel SMA (Pb−Free) 5000/Tape & Reel A †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Voltage Rate of Change, (Rated VR, TJ = 25°C) dv/dt 10,000 V/s Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Semiconductor Components Industries, LLC, 2005 February, 2005 − Rev. 7 1 Publication Order Number: MBRA130LT3/D MBRA130LT3 THERMAL CHARACTERISTICS Characteristic Symbol Value Unit RJL RJA 35 86 °C/W Thermal Resistance — Junction−to−Lead (Note 1) Thermal Resistance — Junction−to−Ambient (Note 1) ELECTRICAL CHARACTERISTICS VF Maximum Instantaneous Forward Voltage (Note 2) (IF = 1.0 A) (IF = 2.0 A) see Figure 2 IR Maximum Instantaneous Reverse Current (VR = 30 V) (VR = 15 V) see Figure 4 TJ = 25°C TJ = 100°C 0.41 0.47 0.35 0.43 TJ = 25°C TJ = 100°C 1.0 0.4 25 12 Volts mA I F, INSTANTANEOUS FORWARD CURRENT (AMPS) i F , INSTANTANEOUS FORWARD CURRENT (AMPS) 1. Mounted on 2″ Square PC Board with 1″ Square Total Pad Size, PC Board FR4. 2. Pulse Test: Pulse Width ≤ 250 s, Duty Cycle ≤ 2.0%. 10 TJ = 125°C 1.0 TJ = 85°C TJ = 25°C TJ = −40°C 0.1 0 0.2 0.4 0.6 0.8 1.0 TJ = 85°C TJ = 25°C 0.1 0 0.2 0.4 0.6 0.8 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 1.0 100E−3 I R , MAXIMUM REVERSE CURRENT (AMPS) I R , REVERSE CURRENT (AMPS) TJ = 125°C 1.0 vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) 100E−3 10E−3 TJ = 125°C 10E−3 1.0E−3 1.0E−3 TJ = 85°C 100E−6 TJ = 85°C TJ = 25°C 100E−6 10E−6 1.0E−6 10 TJ = 25°C 0 10 20 30 10E−6 1.0E−6 0 10 20 VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current http://onsemi.com 2 30 MBRA130LT3 PFO , AVERAGE POWER DISSIPATION (WATTS) FREQ = 20 kHz 1.8 dc 1.6 1.4 SQUARE WAVE 1.2 1.0 Ipk/Io = 0.8 Ipk/Io = 5 0.6 Ipk/Io = 10 0.4 Ipk/Io = 20 0.2 0 0 20 40 60 80 100 120 140 0.6 dc SQUARE WAVE 0.5 Ipk/Io = 0.4 Ipk/Io = 5 Ipk/Io = 10 0.3 Ipk/Io = 20 0.2 0.1 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 TL, LEAD TEMPERATURE (°C) IO, AVERAGE FORWARD CURRENT (AMPS) Figure 5. Current Derating Figure 6. Forward Power Dissipation 1.6 T, TIME (s) 1.0E+0 100E−3 10E−3 1.0E−3 100E−6 10E−6 1.0E−3 100E−6 10E−3 1.0E+0 100E−3 10E+0 T, TIME (s) Figure 7. Thermal Response 1000 C, CAPACITANCE (pF) R (T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED) IO , AVERAGE FORWARD CURRENT (AMPS) 2.0 TJ = 25°C 100 10 1.0 0 5.0 10 15 20 25 30 VR, REVERSE VOLTAGE (VOLTS) Figure 8. Capacitance http://onsemi.com 3 35 40 100E+0 1.0E+3 MBRA130LT3 PACKAGE DIMENSIONS SMA CASE 403D−02 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 403D−01 OBSOLETE, NEW STANDARD IS 403D−02. S A D DIM A B C D H J K S B POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) INCHES MIN MAX 0.160 0.180 0.090 0.115 0.075 0.095 0.050 0.064 0.002 0.006 0.006 0.016 0.030 0.060 0.190 0.220 MILLIMETERS MIN MAX 4.06 4.57 2.29 2.92 1.91 2.41 1.27 1.63 0.05 0.15 0.15 0.41 0.76 1.52 4.83 5.59 C J K H SOLDERING FOOTPRINT* 4.0 0.157 2.0 0.0787 2.0 0.0787 SCALE 8:1 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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