TI1 BQ500211 5-v, qi compliant wireless power transmitter manager Datasheet

bq500211
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5-V, Qi Compliant Wireless Power Transmitter Manager
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FEATURES
DESCRIPTION
•
•
The bq500211 is a second generation digital wireless
power controller that integrates all functions required
to control wireless power transfer to a single WPC
compliant receiver. Designed for 5-V systems, the
bq500211 pings the surrounding environment for
WPC compliant devices to be powered, safely
engages the device, receives packet communication
from the powered device and manages the power
transfer. To maximize flexibility in wireless power
applications, Dynamic Power Limiting (DPL) is
featured on the BQ500211 wireless-power transmitter
manager. DPL enhances user experience by
seamlessly optimizing the usage of power available
from limited input supplies. The bq500211 can
operate as both a WPC type A5 transmitter with a
magnetic positioning guide or as a WPC type A11
transmitter without the magnetic guide. With
comprehensive status and fault monitoring, should
any abnormal condition develop during power
transfer, the bq500211 handles it and provides
indicator outputs.
1
•
•
•
Intelligent Control of Wireless Power Transfer
5-V Operation Conforms to Wireless Power
Consortium (WPC) Type A5 and Type A11
Transmitter Specifications
Dynamic Power Limiting for USB and Limited
Source Operation
Digital Demodulation Reduces Components
Comprehensive Charge Status Mode and Fault
Indication
APPLICATIONS
•
•
WPC 1.0.3 Compliant Wireless Chargers
– Mobile and Smart Phones
– Handheld Devices
– Hermetically Sealed Devices and Tools
– Cars and Other Vehicles
– Tabletop Charge Surfaces
See www.ti.com/wirelesspower for More
Information on TI's Wireless Charging
Solutions
The bq500211 is available in a 48-pin, 7 mm x 7 mm
QFN package and operates over a temperature range
from –40°C to 110°C.
Functional Diagram and Efficiency Versus System Output Power
Transmitter
80
Receiver
Power
70
Power
Stage
Rectification
Voltage
Conditioning
Communication
BQ500211
Controller
Feedback
bq51013
60
Load
Efficiency (%)
AC-DC
50
40
30
20
10
0
0.0
0.5
1.0
1.5
2.0 2.5 3.0 3.5
Output Power (W)
4.0
4.5
5.0
G000
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION (1)
OPERATING
TEMPERATURE
RANGE, TA
ORDERABLE PART NUMBER
PIN COUNT
SUPPLY
PACKAGE
TOP SIDE
MARKING
bq500211RGZR
48 pin
Reel of 2500
QFN
bq500211
bq500211RGZT
48 pin
Reel of 250
QFN
bq500211
-40°C to 110°C
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VALUE
MIN
MAX
Voltage applied at V33D to GND
–0.3
3.6
Voltage applied at V33A to GND
–0.3
3.6
–0.3
3.6
–40
150
Voltage applied to any pin
Storage temperature,TSTG
(1)
(2)
2
(2)
UNIT
V
°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to GND.
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RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
V
Supply voltage during operation, V33D, V33A
3.0
TA
Operating free-air temperature range
–40
TJ
Junction temperature
TYP MAX
3.3
UNIT
3.6
110
110
V
°C
THERMAL INFORMATION
bq500211
THERMAL METRIC (1)
RGZ
UNITS
48 PINS
θJA
Junction-to-ambient thermal resistance (2)
θJC(top)
Junction-to-case(top) thermal resistance
28.4
(3)
14.2
(4)
θJB
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter
ψJB
Junction-to-board characterization parameter
θJC(bottom)
Junction-to-case(bottom) thermal resistance
(1)
(2)
(3)
(4)
(5)
(6)
(7)
5.4
(5)
0.2
(6)
(7)
°C/W
5.3
1.4
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
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ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
V33A = 3.3 V
8
15
V33D = 3.3 V
44
55
V33D = V33A = 3.3 V
52
60
3.3
3.6
4
4.6
UNIT
SUPPLY CURRENT
IV33A
IV33D
Supply current
ITOTAL
mA
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS
V33
3.3-V linear regulator
V33FB
3.3-V linear regulator feedback
IV33FB
Series pass base drive
Beta
Series NPN pass device
Emitter of NPN transistor
3.25
VIN = 12 V; current into V33FB pin
10
V
mA
40
EXTERNALLY SUPPLIED 3.3 V POWER
V33D
Digital 3.3-V power
TA = 25°C
3
3.6
V33A
Analog 3.3-V power
TA = 25°C
3
3.6
V33Slew
V33 slew rate
V33 slew rate between 2.3 V and 2.9 V,
V33A = V33D
0.25
V
V/ms
DIGITAL DEMODULATION INPUTS COMM_A+, COMM_A-, COMM_B+, COMM_BVCM
Common mode voltage each pin
COMM+,
COMM-
–0.15
Modulation voltage digital resolution
REA
Input impedance
Ground reference
0.5
IOFFSET
Input offset current
1-kΩ source impedance
–5
1.631
1
1.5
V
mV
3
MΩ
5
µA
0.36
V
ANALOG INPUTS V_SENSE, I_SENSE, T_SENSE, LED_MODE
VADDR_OPEN
Voltage indicating open pin
LED_MODE open
VADDR_SHORT
Voltage indicating pin shorted to GND
LED_MODE shorted to ground
VADC_RANGE
Measurement range for voltage monitoring
ALL ANALOG INPUTS
INL
ADC integral nonlinearity
Ilkg
Input leakage current
3 V applied to pin
RIN
Input impedance
Ground reference
CIN
Input capacitance
2.37
0
-2.5
2.5
2.5
100
8
mV
nA
MΩ
10
pF
DIGITAL INPUTS/OUTPUTS
DGND1
+ 0.25
VOL
Low-level output voltage
IOL = 6 mA , V33D = 3 V
VOH
High-level output voltage
IOH = -6 mA , V33D = 3 V
VIH
High-level input voltage
V33D = 3V
VIL
Low-level input voltage
V33D = 3.5 V
IOH(MAX)
Output high source current
4
IOL(MAX)
Output low sink current
4
V33D
- 0.6V
2.1
V
3.6
1.4
mA
SYSTEM PERFORMANCE
VRESET
Voltage where device comes out of reset
V33D Pin
tRESET
Pulse width needed for reset
RESET pin
fSW
Switching Frequency
tdetect
Time to detect presence of device requesting
power
tretention
Retention of configuration parameters
4
2.3
112
TJ = 25°C
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2.4
2
100
V
µs
205
kHz
0.5
s
Years
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DEVICE INFORMATION
Functional Block Diagram
bq500211
LED Control /
Low Power
Supervisor
Interface
COMM_A+ 37
COMM_A- 38
COMM_B+ 39
7
MSP430_RST/LED_A
8
MSP430_MISO/LED_B
9
MSP430_TEST
14 MSP430_SYNC
18 MSP430_CLK
Digital
Demodulation
25 MSP430_MOSI/LPWR_EN
26 MSP430_TDO/PROG
COMM_B- 40
12 DPWM-A
Controller
PWM
13 DPWM-B
V_Sense 46
I_Sense 42
T_Sense
2
LoPWR
4
12-bit
ADC
23 BUZ_AC
Buzzer
Control
24 BUZ_DC
Low
Power
Control
LED_MODE 44
11 PMB_DATA
I2C
10 PMB_CLK
TEMP_INT
6
5
SLEEP RESET
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COMM_A+
COMM_B-
I_SENSE
V_SENSE
AIN7
37
36
GND
48 47 46 45 44 43 42 41 40 39 38
REFIN
COMM_A-
COMM_B+
RESERVED
RESERVED
LED_MODE
RGZ Package
(Top View)
GND
AIN5
1
T_SENSE
2
35
BPCAP
AIN3
3
34
V33A
LoPWR
4
33
V33D
RESET
5
32
GND
SLEEP
6
31
RESERVED
bq500211
MSP_RST/LED_A
7
30
RESERVED
MSP_MISO/LED_B
8
29
RESERVED
MSP_TEST
9
28
RESERVED
PMB_CLK
10
27
RESERVED
PMB_DATA
11
26
MSP_TDO/PROG
6
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MSP_MOSI/LPWR_EN
BUZ_DC
BUZ_AC
DOUT_RX
DOUT_TX
PMB_CTRL
PMB_CTRL
MSP_CLK
DOUT_4B
DOUT_4A
DOUT_2B
MSP_SYNC
25
12
13 14 15 16 17 18 19 20 21 22 23 24
DPWM_B
DPWM_A
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PIN FUNCTIONS
PIN
NO.
3
1
45
NAME
I/O
DESCRIPTION
AIN3
I
This pin can be either connected to GND or left open. Connecting to GND can improve
layout grounding.
AIN5
I
This pin can be either connected to GND or left open. Connecting to GND can improve
layout grounding.
AIN7
I
This pin can be either connected to GND or left open. Connecting to GND can improve
layout grounding.
35
BPCAP
—
Bypass capacitor for internal 1.8-V core regulator. Connect bypass capacitor to GND.
23
BUZ_AC
O
AC Buzzer Output. Outputs a 400-ms, 4-kHz AC pulse when charging begins.
BUZ_DC
O
DC Buzzer Output. Outputs a 400-ms DC pulse when charging begins. This could also be
connected to an LED via 470-Ω resistor.
37
COMM_A+
I
Digital demodulation non-inverting input A, connect parallel to input B+.
38
COMM_A-
I
Digital demodulation inverting input A, connect parallel to input B-.
39
COMM_B+
I
Digital demodulation non-inverting input B, connect parallel to input A+.
40
COMM_B-
I
Digital demodulation inverting input B, connect parallel to input A-.
22
DOUT_RX
I
Leave this pin open.
21
DOUT_TX
I
Leave this pin open.
15
DOUT_2B
O
Optional Logic Output 2B. Leave this pin open.
16
DOUT_4A
O
Optional Logic Output 4A. Leave this pin open.
17
DOUT_4B
O
Optional Logic Output 4B. Leave this pin open.
DPWM_A
O
PWM Output A, controls one half of the full bridge in a phase-shifted full bridge. Switching
deadtimes must be externally generated.
DPWM_B
O
PWM Output B, controls other half of the full bridge in a phase-shifted full bridge. Switching
deadtimes must be externally generated.
Flood with copper GND plane and stitch vias to PCB internal GND plane.
24
12
13
49
EPAD
-
32
GND
—
GND.
36
GND
—
GND.
47
GND
—
GND.
42
44
4
18
8
7
I
Transmitter input current, used for efficiency calculations. Use 20-mΩ sense resistor and
A=50 gain current sense amplifier.
LED_MODE
I
Input to select from 4 LED modes.
LoPWR
I
Dynamic Power Limiting (DPL) control pin. To set power mode to 500 mA, pull to GND. For
full-power operation pull to 3.3-V supply.
I/O
Used for boot loading the MSP430 low power supervisor. If MSP430 is not used, leave this
pin floating.
I_SENSE
MSP_CLK
MSP_MISO/LED_B
I
MSP – TMS, SPI-MISO, LED-B -- If external MSP430 is not used, connect to an LED via
470-Ω resistor for status indication.
MSP_RST/LED_A
I
MSP – Reset, LED-A -- If external MSP430 is not used, connect to an LED via 470-Ω
resistor for status indication.
14
MSP_SYNC
O
MSP SPI_SYNC, if external MSP430 is not used, leave this pin open.
26
MSP_TDO/PROG
I/O
MSP-TDO, MSP430 programmed indication.
9
MSP_TEST
25
MSP_MOSI/LPWR_EN
I
I/O
MSP – Test, If external MSP430 is not used, leave this pin open.
Low standby power supervisor enable. If low power is not needed, connect this to GND.
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PIN FUNCTIONS (continued)
PIN
NO.
NAME
I/O
DESCRIPTION
19
PMB_ALERT
O
Reserved, leave this pin open.
10
PMB_CLK
I/O
10-kΩ pull-up resistor to 3.3-V supply.
20
PMB_CTRL
I
11
PMB_DATA
I/O
48
REFIN
27
RESERVED
I/O
Reserved, leave this pin open.
28
RESERVED
I/O
Reserved, leave this pin open.
29
RESERVED
I/O
Reserved, leave this pin open.
30
RESERVED
I/O
Reserved, leave this pin open.
31
RESERVED
I/O
Reserved, connect 10-kΩ pull-down resistor to GND.
41
RESERVED
O
Reserved, leave this pin open.
43
RESERVED
I
Reserved, leave this pin open.
5
RESET
I
Device reset. Use a 10-kΩ to 100-kΩ pull-up resistor to the 3.3-V supply.
6
SLEEP
O
Low-power mode output. Starts low-power ping cycle.
T_SENSE
I
Sensor Input. Device shuts down when below 1 V. If not used, keep above 1 V by
connecting to the 3.3-V supply.
2
46
34
33
I
I
V_SENSE
V33A
V33D
Reserved, connect to GND.
10-kΩ pull-up resistor to 3.3-V supply.
External Reference Voltage Input. Connect this input to GND.
Transmitter input voltage, used for efficiency calculations. Use 76.8-kΩ to 10-kΩ divider to
minimize quiescent current.
—
Analog 3.3-V Supply. This pin can be derived from V33D supply, decouple with 10-Ω resistor
and additional bypass capacitors
—
Digital core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as
possible.
Typical Characteristics Curves
60
80
70
60
40
Efficiency (%)
Supply Current (mA)
50
30
20
40
30
20
10
0
1.7
CSD17308Q2
CSD16301Q2
10
1.9
2.1
2.3
2.5
2.7
Input Voltage (V)
2.9
3.1
3.3
0
0
G000
Figure 1. bq500211 Supply Current vs. VCC Voltage
8
50
0.1
0.2
0.3
0.4 0.5 0.6 0.7
Output Current (A)
0.8
0.9
1
G000
Figure 2. System Efficiency Using Alternate MOSFETs
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Principles of Operation
Fundamentals
The principle of wireless power transfer is simply an open cored transformer consisting of primary and secondary
coils and associated electronics. The primary coil and electronics are also referred to as the transmitter, and the
secondary side the receiver. The transmitter coil and electronics are typically built into a charger pad. The
receiver coil and electronics are typically built into a portable device, such as a cell-phone.
When the receiver coil is positioned on the transmitter coil, magnetic coupling occurs when the transmitter coil is
driven. The flux is coupled into the secondary coil which induces a voltage, current flows, it is rectified and power
can be transferred quite effectively to a load - wirelessly. Power transfer can be managed via any of various
familiar closed-loop control schemes.
Wireless Power Consortium (WPC)
The Wireless Power Consortium (WPC) is an international group of companies from diverse industries. The WPC
standard was developed to facilitate cross compatibility of compliant transmitters and receivers. The standard
defines the physical parameters and the communication protocol to be used in wireless power. For more
information, go to www.wirelesspowerconsortium.com.
Power Transfer
Power transfer depends on coil coupling. Coupling is dependant on the distance between coils, alignment, coil
dimensions, coil materials, number of turns, magnetic shielding, impedance matching, frequency and duty cycle.
Most importantly, the receiver and transmitter coils must be aligned for best coupling and efficient power transfer.
The closer the space between the coils, the better the coupling, but the practical distance is set to be less than 5
mm (as defined within the WPC Specification) to account for housing and interface surfaces.
Shielding is added as a backing to both the transmitter and receiver coils to direct the magnetic field to the
coupled zone. Magnetic fields outside the coupled zone do not transfer power. Thus, shielding also serves to
contain the fields to avoid coupling to other adjacent system components.
Regulation can be achieved by controlling any one of the coil coupling parameters. For WPC compatibility, the
transmitter coils and capacitance are specified and the resonant frequency point is fixed at 100 kHz. Power
transfer is regulated by changing the operating frequency between 112 kHz to 205 kHz. The higher the
frequency, the further from resonance and the lower the power. Duty cycle remains constant at 50% throughout
the power band and is reduced only once 205 kHz is reached.
The WPC standard describes the dimension and materials of the coils. It also has information on tuning the coils
to resonance. The value of the inductor and resonant capacitor are critical to proper operation and system
efficiency.
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Communication
Communication within the WPC is from the receiver to the transmitter, where the receiver tells the transmitter to
send power and how much. In order to regulate, the receiver must communicate with the transmitter whether to
increase or decrease frequency. The receiver monitors the rectifier output and using Amplitude Modulation (AM),
sends packets of information to the transmitter. A packet is comprised of a preamble, a header, the actual
message and a checksum, as defined by the WPC standard.
The receiver sends a packet by modulating an impedance network. This AM signal reflects back as a change in
the voltage amplitude on the transmitter coil. The signal is demodulated and decoded by the transmitter side
electronics and the frequency of its coil drive output is adjusted to close the regulation loop. The bq500211
features internal digital demodulation circuitry.
The modulated impedance network on the receiver can either be resistive or capacitive. Figure 3 shows the
resistive modulation approach, where a resistor is periodically added to the load and also shows the resulting
change in resonant curve which causes the amplitude change in the transmitter voltage indicated by the two
operating points at the same frequency. Figure 4 shows the capacitive modulation approach, where a capacitor
is periodically added to the load and also shows the resulting amplitude change in the transmitter voltage.
Rectifier
Receiver Coil
Receiver
Capacitor
Amax
Modulation
Resitor
Operating state at logic “0”
A(0)
Operating state at logic “1”
A(1)
Comm
Fsw
a)
F, kHz
b)
Figure 3. Receiver Resistive Modulation Circuit
Rectifier
Receiver Coil
Receiver
Capacitor
Modulation
Capacitors
Amax
Comm
A(0)
Operating state at logic “ 0”
A(1)
Operating state at logic “ 1”
Fsw
F, kHz
Fo(1) < Fo(0)
a)
b)
Figure 4. Receiver Capacitive Modulation Circuit
10
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Application Information
Coils and Matching Capacitors
The coil and matching capacitor selection for the transmitter has been established by WPC standard. This is
fixed and cannot be changed on the transmitter side. The following is a list of available and compatible A5
transmitter coils:
Table 1. Summary of A5 Transmitter Coils
COIL MANUFACTURER
WPC A5 PART NUMBER (with magnet)
RESONANT TANK CAPACITANCE
Elytone
YT-56886
400 nF/50 V C0G
Mingstar
312-00004
400 nF/50 V C0G
TDK
TTX-52-TIS
400 nF/50 V C0G
Toko
X1415
400 nF/50 V C0G
Capacitor selection is critical to proper system operation. A total capacitance value of 400 nF is required in the
resonant tank. This is the WPC system compatibility requirement, not a guideline.
NOTE
A total capacitance value of 400 nF/50 V (C0G dielectric type or equivalent) is required in
the resonant tank to achieve a 100-kHz resonance frequency.
The capacitors chosen must be rated for at least 50 V and must be of quality C0G dielectric or equivalent. These
are typically available in a 5% tolerance. The use of X7R types or below is not recommended if WPC compliance
is required because critical WPC certification testing, such as the minimum modulation requirement, might fail.
A 400-nF capacitor is not a standard value and therefore several must be combined in parallel. The designer can
combine a (4 nF x 100 nF) or a (180 nF + 220 nF) along with other combinations depending on market
availability. All capacitors must be of high quality C0G type or equivalent and not mixed with lesser dielectric
types.
Dynamic Power Limiting
Dynamic Power Limiting (DPL) allows operation from a 5-V supply with limited current capability (such as a USB
port). There are two modes of operation selected via an input pin. In the dynamic mode, when the input voltage
is observed drooping, the output power is limited to reduce the load and provides margin relative to the supply’s
capability. The second mode, or constant current mode, is designed specifically for operation from a 500-mA
capable USB port, it restricts the output such that the input current remains below the 500-mA limit.
NOTE
Pin 4 must always be terminated, else erratic behavior may result.
Anytime the DPL control loop is regulating the operating point of the transmitter, the LED will indicate that DPL is
active. The LED color and flashing pattern are determined by the LED Table. If the receiver sends a Control
Error Packet (CEP) with a negative value, (for example, to reduce power to the load), the WPTX in DPL mode
will respond to this CEP via the normal WPC control loop.
NOTE
Depending on LED_MODE selected, the power limit indication may be either solid amber
(green + red) or solid red.
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Option Select Pin
Pin 44 of the bq500211 is dedicated to programming the LED mode of the device. At power-up, an output bias
current is applied to this pin to develop a voltage across the programming resistor. The resulting voltage is read
by an internal ADC and the bin corresponding to that reading determines the operation mode and blink pattern
based on Table 2.
bq500211
LED_MODE
44
Resistor
to set
options
To 12-bit ADC
Figure 5. Option Select Pin Programming
LED Indication Modes
The bq500211 can directly drive two LED outputs (pin 7 and pin 8) through a simple current limit resistor
(typically 470 Ω), based on the mode selected. The two current limit resistors can be individually adjusted to tune
or match the brightness of the two LEDs. Do not exceed the maximum output current rating of the device.
The resistor in Figure 5 connected to pin 44 and GND selects the desired LED indication scheme in Table 2.
Table 2. LED Modes
Operational States
LED
CONTROL
OPTION
LED
SELECTION
RESISTOR
X
< 36.5 kΩ
DESCRIPTION
STANDBY
POWER
TRANSFER
CHARGE
COMPLETE
FAULT
DYNAMIC
POWER
LIMITING
-
-
-
-
-
LED1, green
Off
Blink slow
On
Off
Blink slow
LED2, red
Off
Off
Off
On
Blink slow
LED1, green
On
Blink slow
On
Off
Blink slow
LED2, red
On
Off
Off
On
Blink slow
LED1, green
Off
Off
On
Off
Off
LED2, red
Off
On
Off
Blink slow
On
LED1, green
Off
On
Off
Off
Off
LED2, red
Off
Off
Off
On
Blink slow
-
-
-
-
-
-
LED
LED1, green
Reserved, do not use
LED2, red
1
2
3
4
42.2 kΩ
48.7 kΩ
56.2 kΩ
64.9 kΩ
> 75 kΩ
12
Choice number 1
Choice number 2
Choice number 3
Choice number 4
Reserved, all LED off
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Shut Down via External Thermal Sensor or Trigger
Typical applications of the bq500211 will not require additional thermal protection. This shutdown feature is
provided for enhanced applications and is not only limited to thermal shutdown. The key parameter is the 1.0 V
threshold on pin 2. Voltage below 1.0 V on pin 2 causes the device to shutdown.
The application of thermal monitoring via a Negative Temperature Coefficient (NTC) sensor, for example, is
straightforward. The NTC forms the lower leg of a temperature dependant voltage divider. The NTC leads are
connected to the bq500211 device, pin 2 and GND. The threshold on pin 2 is set to 1.0 V, below which the
system shuts down and a fault is indicated (depending on LED mode chosen).
To implement this feature follow these steps:
1) Consult the NTC datasheet and find the resistence vs temperature curve.
2) Determine the actual temperature where the NTC will be placed by using a thermal probe.
3) Read the NTC resistance at that temperature in the NTC datasheet, that is R_NTC.
4) Use the following formula to determine the upper leg resistor (R_Setpoint):
R _ Setpoint = 2.3 ´ R _ NTC
(1)
The system will restore normal operation after approximately five minutes or if the receiver is removed. If the
feature is not used, this pin must be pulled high.
NOTE
Pin 2 must always be terminated, else erratic behavior may result.
3V3_VCC
Optional
Temperature
Sensor
R_Setpoint
T_SENSE
NTC
2
AGND
AGND
Figure 6. Negative Temperature Coefficient (NTC) Application
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bq500211
SLUSAO2 – JUNE 2012
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Power Transfer Start Signal
The bq500211 features two signal outputs to indicate that power transfer has begun. Pin 23 outputs a 400-ms
duration, 4-kHz square wave for driving low cost AC type ceramic buzzers. Pin 24 outputs logic high, also for 400
ms, which is suitable for DC type buzzers with built-in tone generators, or as a trigger for any type of customized
indication scheme. If not used, these pins can be left open.
Power-On Reset
The bq500211 has an integrated Power-On Reset (POR) circuit which monitors the supply voltage and handles
the correct device startup sequence. Additional supply voltage supervisor or reset circuits are not needed.
External Reset, RESET Pin
The bq500211 can be forced into a reset state by an external circuit connected to the RESET pin. A logic low
voltage on this pin holds the device in reset. For normal operation, this pin is pulled up to 3.3 VCC with a 10-kΩ
pull-up resistor.
Trickle Charge and CS100
The WPC specification provides an End-of-Power Transfer message (EPT–01) to indicate charge complete.
Upon receipt of the charge complete message, the bq500211 will change the LED indication to solid green LED
output and halt power transfer for 5 seconds.
In some battery charging applications there is a benefit to continue the charging process in trickle-charge mode
to top off the battery. There are several information packets in the WPC specification related to the levels of
battery charge (Charge Status). The bq500211 uses these commands to enable top-off charging. The bq500211
changes the LED indication to reflect charge complete when a Charge Status message is 100% received, but
unlike the response to an EPT, it will not halt power transfer while the LED is solid green. The mobile device can
use a CS100 packet to enable trickle charge mode.
If the reported charge status drops below 90% normal, charging indication will be resumed.
14
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MSP430G2001 Low Power Supervisor
This is an optional low-power feature. By adding the MSP430G2001, the entire bq500211 is periodically shut
down to conserve power, yet all relevant states are recalled and all running LED status indicators remain on.
MSP430 Low Power Supervisor Details
Since the bq500211 needs an external low-power mode to significantly reduce power consumption, one way of
positively achieving that goal is to remove its supply and completely shut it down. In doing so, however, the
bq500211 goes through a reset and any data in memory would be lost. Important information regarding charge
state, fault condition and operating mode would be cleared. The MSP430G2001 maintains the LED indication
and stores previous charge state during the bq500211 reset period.
The LEDs indicators are now driven by the MSP430G2001, do not exceed the pin output current drive limit.
Using the suggested circuitry, a standby power reduction from 300 mW to less than 90 mW can be expected
making it possible to achieve Energy Star rating.
The user does not need to program the MSP430G2001, an off-the-shelf part and any of the available packages
can be used as long as the connections are correct. The required MSP430G2001 firmware is embedded in the
bq500211 and is boot loaded at first power up, similar to a field update. The MSP430G2001 code cannot be
modified by the user.
NOTE
The user cannot program the MSP430G2001 in this system.
All Unused Pins
All unused pins can be left open unless otherwise indicated. Pins 1, 7, 45 can be tied to GND to improve ground
shielding. Please refer to the pin definition table for further explanations.
APPLICATION INFORMATION
Overview
The application schematic for the transmitter with reduced standby power is shown in Figure 7.
CAUTION
Please check the bq500211 product page for the most up-to-date application
schematic and list of materials package before starting a new design.
Input Regulator
The bq500211 requires 3.3 VDC to operate. A buck regulator or a linear regulator can be used to step down from
the 5-V system input. Either choice is fully WPC compatible, the decision lies in the user's requirements with
respect to cost or efficiency.
The application example circuit utilizes a low-cost buck regulator, TPS62237, which on account of a 3-MHz
switching frequency, can use a 0805 size chip inductor. This results in a very attractive combination, high
performance, small size, ease of use and low cost.
Power Train
The bq500211 drives a phase-shifted full bridge. This is essentially twin half bridges and the choice of driver
devices is quite simple, a pair of TPS28225 synchronous MOSFET drivers are used with four CSD17308Q2
NexFETs. Other combinations work and system performance with regards to efficiency and EMI emissions vary.
Any alternate MOSFETs chosen must be fully saturated at 5-V gate drive and be sure to pay attention whether or
not to use gate resistors; some tuning might be required.
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bq500211
SLUSAO2 – JUNE 2012
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Low Power Supervisor
Power reduction is achieved by periodically disabling the bq500211 while LED and housekeeping control
functions are continued by U4 – the low-cost, low quiescent current microcontroller MSP430G2001. When U4 is
present in the circuit (which is set by a pull-up resistor on bq500211 pin 25), the bq500211 at first power-up
boots the MSP430G2001 with the necessary firmware and the two chips operate in tandem. During standby
operation, the bq500211 periodically issues a SLEEP command, Q12 pulls the RESET pin low, therefore
reducing its power consumption. Meanwhile, the MSP430G2001 maintains the LED indication and stores
previous charge state during this bq500211 reset period. This bq500211 reset period is set by the RC time
constant network of R26, C22 (from Figure 7). WPC compliance mandates receive detection within 500 ms, the
power transmitter controller, bq500211, awakes every 400 ms to produce an analog ping and check if a valid
device is present. Increasing this time constant, therefore is not advised; shortening could result in faster
detection time with some decrease in efficiency.
Disabling Low Power Supervisor Mode
For lowest cost or if the low-power supervisor is not needed, please refer to Figure 8 for the application
schematic.
NOTE
Current sense shunt and amplifier circuitry are optional. The circuitry is needed to enable
Foreign Object Detection (FOD) and a forward migration path to WPC1.1 compliance.
16
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SLUSAO2 – JUNE 2012
PCB Layout
A good PCB layout is critical to proper system operation and due care should be taken. There are many
references on proper PCB layout techniques.
Generally speaking, the system layout will require a 4-layer PCB layout, although a 2-layer PCB layout can be
achieved. A proven and recommended approach to the layer stack-up has been:
• Layer 1, component placement and as much ground plane as possible.
• Layer 2, clean ground.
• Layer 3, finish routing.
• Layer 4, clean ground.
Thus, the circuitry is virtually sandwiched between grounds. This minimizes EMI noise emissions and also
provides a noise free voltage reference plane for device operation.
Keep as much copper as possible. Make sure the bq500211 GND pins and the power pad have a continuous
flood connection to the ground plane. The power pad should also be stitched to the ground plane, which also
acts as a heat sink for the bq500211. A good GND reference is necessary for proper bq500211 operation, such
as analog-digital conversion, clock stability and best overall EMI performance.
Separate the analog ground plane from the power ground plane and use only one tie point to connect grounds.
Having several tie points defeats the purpose of separating the grounds.
The COMM return signal from the resonant tank should be routed as a differential pair. This is intended to reduce
stray noise induction. The frequencies of concern warrant low-noise analog signaling techniques, such as
differential routing and shielding, but the COMM signal lines do not need to be impedance matched.
Typically a single chip controller solution with integrated power FET and synchronous rectifier will be used. To
create a tight loop, pull in the buck inductor and power loop as close as possible. Likewise, the power-train, fullbridge components should be pulled together as tight as possible. See the bq500211EVM-045, bqTESLA
Wireless Power TX EVM User's Guide (Texas Instruments Literature Number SLVU536) for layout examples.
References
Building a Wireless Power Transmitter, SLUA635
Technology, Wireless Power Consortium. http://www.wirelesspowerconsortium.com/
An Introduction to the Wireless Power Consortium Standard and TI’s Compliant Solutions, Johns, Bill.
BQ500210 Datasheet
BQ51013 Datasheet
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): bq500211
17
R11
10K
R10
76k8
VIN
AGND
C4
4.7nF
50V
AGND
C24
4.7nF
50V
IN
R37
10K0
3V3_VCC
5 Vin
D1
500mA
Full
COMM+
COMM-
MSP_CLK
MSP_RST
MSP_MISO
MSP_TEST
I_SENSE
DPL
3V3_VCC
R25
10K
3V3_VCC
AGND
R4
470R
BLUE_LED
AGND
C6
4.7uF
10V
R15
10.0k
R26
37
38
39
40
18
21
22
6
7
8
9
46
45
42
4
3
2
1
5
41
48
AGND
COMM_A+
COMM_ACOMM_B+
COMM_B-
MSP_CLK
DOUT_TX
DOUT_RX
SLEEP
MSP_RST/LED_A
MSP_MISO/LED_B
MSP_TEST
V_SENSE
AD_7
I_SENSE
LOPWR
AD_3
T_SENSE
AD_5
3V3_VCC
U1
U5
TPS62237
DPWM_A
DPWM_B
MSP_SYNC
DOUT_2B
DOUT_4A
DOUT_4B
PMB_CTRL
PMB_ALERT
PMB_DATA
PMB_CLK
LED_MODE
RESERVED
L1
R22
44
43
26
25
24
23
12
13
14
15
16
17
20
19
11
10
35
31
30
29
28
27
AGND
GND
VIN
4
UGATE 1
LGATE
R23
42K2
AGND
MSP_RDY
MSP_MOSI
R20
10K0
R35 10R
MSP_SYNC
5
AGND
3V3_ADC
R13
10R
AGND
AGND
R31
10K0
COMM-
COMM+
R34
0R
R3
10R
AGND
C28
4.7uF
10V
0.1uF
50V
DPWM-1B
R33
10K0
C29
AGND
C7
4.7uF
10V
R36
10K0
R32
10K0
3V3_VCC
TPS28225D
GND
R8
10K0
C20
1.0uF
16V
GND
VDD
R9
10R
PWM
BOOT 2
7 EN/PG U6
PH 8
3
6
AGND
C2
4.7uF
10V
3V3_VCC
AGND AGND
NoPop
C3
1.0uF
16V
C5
4.7uF
10V
BPCAP
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
3V3_ADC
C9
0.1uF
50V
AGND
MSP_TDO/PROG
MSP_MOSI/LPWR_EN
BUZ_DC
BUZ_AC
GND
DPWM-1A
GND-TIE
C1
1.0uF
16V
RESET
AGND
C22
4.7uF
C43
4.7uF
10V
AGND
RESERVED
REF_IN
AGND
Q6
BSS138
523K
GND
47
Optional Temp Sensor
NTC
VIN
SW
EN
FB
MODE GND
GND
36
DC Jack or USB
33
GND
32
VIN
34
V33A
V33D
EPAD
49
Product Folder Link(s): bq500211
BUZ
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R19
10R
R29
10R
DPWM-1A
GND
Q2
Q1
R7
20m
AGND
R5
10K
R6
100K
C18
4.7nF
50V
COIL
GND
AGND
C14
33pF
50V
23K2
R14
3V3_VCC
C11
100nF
C10
100nF
C19
100nF
C16
100nF
C27
22uF
25V
GND
C25
22uF
25V
GND
AGND
D3
BAT54SW
Q4
Q3
50V
C8
0.1uF
AGND
1
3
+
A=50
2
U7
R30
10K0
C26
0.01uF
50V
4
5 LMV931
I_SENSE
Q5
BC857CL
MSP_RDY
MSP_MOSI
MSP_CLK
MSP_MISO
MSP_TEST
MSP_SYNC
AGND
R24
R38
C15
AGND
50V
0.1uF
C23
0.1uF
50V
VIN
R2
0R
R1
10R
U3
U2
10K0
10K0
TLV70033
N/C
OUT
3
6
GND
D5
GND
VIN
C13
0.1uF
50V
DPWM-1B
AGND
R27
470R
1
2
3
4
5
6
7
U4
4.7uF
10V
14
P1.6
9
P1.7
8
GND
13
XIN
12
XOUT
11
TEST
10
RST
50V
0.01uF
MSP430G2001
P1.4
P1.5
VCC
P1.0
P1.1
P1.2
P1.3
C12
C17
AGND
R12
10K0
AGND
AGND
R16
47K0
Low Power Supervisor
GND
R28
470R
R18
10K0
4
EN/PG 7
PWM
VDD
TPS28225D
LGATE
GND
EN
IN
5
8 PH
2 BOOT
1 UGATE
See Note on the Bill of Materials
R17
200R
R21
200R
VIN
G
18
R
VIN
C21
1.0nF
16V
Q7
BSS138
MSP_RST
3V3_VCC
bq500211
SLUSAO2 – JUNE 2012
www.ti.com
Typical Application Diagram
Figure 7. bq500211 Typical Low-Standby Power Application Diagram
Copyright © 2012, Texas Instruments Incorporated
R11
10K
R10
76k8
VIN
AGND
C4
4.7nF
50V
D5
AGND
DPL
R28
470R
500mA
Full
3V3_VCC 3V3_VCC
R25
10K
R
IN
COMM+
COMM-
R27
470R
3V3_VCC
5 Vin
AGND
37
38
39
40
18
21
22
6
7
8
9
46
45
42
4
3
2
1
5
C1
1.0uF
16V
3V3_VCC
U1
AGND
COMM_A+
COMM_ACOMM_B+
COMM_B-
MSP_CLK
DOUT_TX
DOUT_RX
SLEEP
MSP_RST/LED_A
MSP_MISO/LED_B
MSP_TEST
V_SENSE
AD_7
I_SENSE
LOPWR
AD_3
T_SENSE
AD_5
RESET
RESERVED
REF_IN
AGND
41
48
C43
4.7uF
10V
AGND
GND-TIE
34
GND
U3
N/C
OUT
C3
1.0uF
16V
C5
4.7uF
10V
DPWM_A
DPWM_B
MSP_SYNC
DOUT_2B
DOUT_4A
DOUT_4B
PMB_CTRL
PMB_ALERT
PMB_DATA
PMB_CLK
BPCAP
RESERVED
RESERVED
RESERVED
RESERVED
RESERVED
3V3_ADC
TLV70033
GND
EN
IN
LED_MODE
RESERVED
MSP_TDO/PROG
MSP_MOSI/LPWR_EN
BUZ_DC
BUZ_AC
V33A
33
V33D
C6
4.7uF
10V
EPAD
DC Jack or USB
G
GND
47
GND
36
GND
Product Folder Link(s): bq500211
32
Copyright © 2012, Texas Instruments Incorporated
49
VIN
AGND
44
43
26
25
24
23
12
13
14
15
16
17
20
19
11
10
35
31
30
29
28
27
AGND
R23
42K2
R8
10K0
C20
1.0uF
16V
DPWM-1A
AGND
C2
4.7uF
10V
3V3_VCC
GND
AGND
10K0
R12
R35 10R
AGND
R36
10K0
R32
10K0
3V3_VCC
C9
0.1uF
50V
VIN
R9
10R
U6
8
LGATE 5
PH
BOOT 2
UGATE 1
AGND
R31
10K0
TPS28225D
R13
10R
DPWM-1B
R33
10K0
GND
EN/PG
PWM
VDD
4 GND
7
3
6
AGND
C7
4.7uF
10V
3V3_ADC
0.1uF
50V
DPWM-1A
C29
COMM-
COMM+
R34
0R
R3
10R
GND
VIN
R19
10R
R29
10R
Q2
Q1
GND
AGND
R5
10K
R6
100K
C18
4.7nF
50V
COIL
AGND
C14
33pF
50V
23K2
R14
3V3_VCC
C11
100nF
C10
100nF
C19
100nF
C16
100nF
C27
22uF
25V
GND
AGND
D3
BAT54SW
Q4
Q3
R2
0R
R1
10R
50V
0.1uF
C15
PH
U2
7
3
6
GND 4
EN/PG
PWM
VDD
TPS28225D
5 LGATE
8
2 BOOT
1 UGATE
GND
GND
VIN
C13
0.1uF
50V
DPWM-1B
bq500211
www.ti.com
SLUSAO2 – JUNE 2012
Figure 8. bq500211 Typical Low-Cost Application Diagram
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19
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jun-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
BQ500211RGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
BQ500211RGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-3-260C-168 HR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
BQ500211RGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
BQ500211RGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ500211RGZR
VQFN
RGZ
48
2500
367.0
367.0
38.0
BQ500211RGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
Pack Materials-Page 2
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